Supporting piece, display module and electronic equipment

Abstract

This application provides a support member, a display module, and an electronic device. The support member includes a first straight portion, a bent portion, and a second straight portion connected along a first direction. The bent portion is located between the first straight portion and the second straight portion. The support member is capable of bending at the bent portion. The support member includes a non-metallic layer and a first metallic layer stacked along a second direction. The first metallic layer and the non-metallic layer are integrally formed. The first direction intersects with the second direction. The support member of this application is lightweight and thin.

Description

[0001] This application claims priority to Chinese Patent Application No. 202510143867.0, filed on February 8, 2025, entitled “Support Member, Display Module and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of foldable electronic product technology, and in particular to a support member, display module and electronic device. Background Technology

[0003] With the development of technology and the demands of the electronic device market, foldable electronic devices are becoming increasingly widely used. Traditional foldable electronic devices include a display module, a housing, and a folding mechanism. The display module can be fixed to the housing, and the folding mechanism can fold or unfold the housing and display module relative to each other. The display module generally includes a display panel and a support component, which supports the display panel. Existing support components are generally made of metal, but metal has a high density, making the support component heavy and hindering lightweight design. Summary of the Invention

[0004] This application provides a support member, a display module, and an electronic device, aiming to provide a lightweight and thin support member, a display module including the support member, and an electronic device including the display module.

[0005] In a first aspect, a support member is provided. The support member includes a first straight portion, a bent portion, and a second straight portion connected along a first direction. The bent portion is located between the first straight portion and the second straight portion. The support member is capable of bending at the bent portion. The support member includes a non-metallic layer and a first metallic layer stacked along a second direction. The first metallic layer and the non-metallic layer are integrally formed. The first direction intersects the second direction.

[0006] It is understandable that a typical display module includes a stacked bamboo book layer, a third adhesive layer, a back film, a first adhesive layer, a display body, a second adhesive layer, and a protective component to achieve the display and bending functions of the display panel. That is, typical display modules have a large number of layers and a relatively thick thickness, resulting in lower structural reliability. In contrast, the support component of the display module in this embodiment includes a stacked first metal layer and a non-metal layer. The support component can be a one-piece molded structure, meaning the first metal layer can be integrally molded with the non-metal layer. Therefore, compared to a typical display module, this embodiment reduces the number of layers and the adhesive layer between the back film and the bamboo book layer, effectively reducing the overall thickness of the display module and preventing peeling between different layers during folding, thus ensuring the structural reliability of the display module. In other words, the support component in this embodiment can replace the back film, bamboo book layer, and adhesive layer between the back film and the bamboo book layer in a typical display module, thereby supporting the display panel while also achieving a thinner display module design.

[0007] Secondly, compared to typical support components that consist only of metallic materials, which have higher density and elastic modulus, resulting in heavier components with poorer bending performance, conventional support components often only consist of non-metallic materials. Non-metallic materials have lower stiffness, requiring the support component to have a greater thickness to ensure its structural strength and support the display panel. In other words, conventional support components cannot simultaneously achieve lightweight and thin designs. However, the support component in this embodiment includes a first metallic layer and a non-metallic layer stacked together, using metallic and non-metallic materials respectively. This allows for several advantages: firstly, the metallic material in the first metallic layer has better stiffness, which helps ensure the structural strength of the support component; secondly, the non-metallic material in the non-metallic layer has lower density and elastic modulus, resulting in a lighter component that is easier to bend. In other words, the support component in this embodiment can simultaneously achieve lightweight and thin designs.

[0008] In one possible implementation, the first metal layer is used to fix the flexible substrate layer of the display panel.

[0009] It is understandable that, compared to typical support members, the non-metallic layer is used to fix the flexible substrate layer of the display panel to support it. However, the surface flatness of the non-metallic layer is relatively poor (for example, when the non-metal is made of fiber material or fiber composite material, the surface of the non-metallic layer is relatively rough). When the support member is fixedly connected to the display body (e.g., the flexible substrate layer) of the display panel, the non-metallic layer will reduce the light and shadow effect of the display module. In this embodiment, a first metal layer is provided to fix the flexible substrate layer of the display panel to the support member. The first metal layer is made of metal material, and the surface of metal material is relatively smooth. The surface flatness of the first metal layer is better, thereby reducing the impact of the support member on the display panel and ensuring the light and shadow effect of the display module.

[0010] In one possible implementation, the non-metallic layer is made of fibrous material or fibrous composite material.

[0011] It is understood that the non-metallic layer in this embodiment uses fiber materials and fiber composite materials, both of which have good structural strength and low weight. This improves the structural strength of the support while reducing its weight. In other words, the support in this embodiment balances structural strength and lightweight design.

[0012] In one possible implementation, the support further includes a second metal layer. The second metal layer is stacked on the side of the non-metal layer facing away from the first metal layer.

[0013] Understandably, compared to support components typically made of non-metallic materials, the lower stiffness of non-metallic materials necessitates a greater thickness to ensure structural strength. This means the support component cannot simultaneously achieve a thin profile and structural strength. However, the support component in this embodiment may further include a second metallic layer stacked on top of the non-metallic layer. Metallic materials have greater stiffness than non-metallic materials. Thus, under the same structural strength conditions, the support component in this embodiment is thinner. In other words, the support component in this embodiment can maintain structural strength while achieving a thin profile.

[0014] Secondly, in this embodiment, the first metal layer and the second metal layer are disposed on opposite sides of the non-metallic layer along the second direction. This facilitates the integral hot-pressing molding of the support component, helps ensure the connection stability between the various layers of the support component, and guarantees the structural stability of the support component.

[0015] In one possible implementation, the first metal layer, the non-metal layer, and the second metal layer are integrally formed. This eliminates the need for an adhesive layer between these layers, reducing the thickness of the support and facilitating a thinner design. Furthermore, it improves the connection stability between the three layers, enhancing the structural strength of the support. In other words, the support in this embodiment balances thinness with structural strength.

[0016] In one possible implementation, the non-metallic layer includes a first non-metallic layer, a second non-metallic layer, and a third non-metallic layer stacked along a second direction. The second non-metallic layer is fixedly connected between the first and third non-metallic layers. The fiber bundle direction of the first non-metallic layer intersects with the fiber bundle direction of the second non-metallic layer, and / or, the fiber bundle direction of the second non-metallic layer intersects with the fiber bundle direction of the third non-metallic layer. This improves the structural strength of the non-metallic layer of the support member, thereby enhancing the overall structural strength of the support member.

[0017] In one possible implementation, the elastic modulus of the bent portion is less than or equal to the elastic modulus of the first straight portion, and less than or equal to the elastic modulus of the second straight portion. This allows the support member to bend more effectively along a preset bending trajectory.

[0018] In one possible implementation, the bending portion includes a first outer bending portion, an inner bending portion, and a second outer bending portion connected along a first direction. The inner bending portion is located between the first and second outer bending portions. The first outer bending portion is fixedly connected to a first straight portion. The second outer bending portion is fixedly connected to a second straight portion. The elastic modulus of the inner bending portion is less than or equal to the elastic modulus of the first outer bending portion. The elastic modulus of the first outer bending portion is less than or equal to the elastic modulus of the first straight portion. This allows the support member to bend more effectively along a preset bending trajectory.

[0019] In one possible implementation, the first metal layer has a first surface. The first surface faces away from the non-metallic layer. The inner bend has a first hole. The first hole is spaced apart from the first surface.

[0020] Understandably, to reduce the elastic modulus of the bending portion of a typical display module and allow the display module to bend along a predetermined trajectory, the support component usually incorporates multiple through holes in the bending section. These through holes penetrate the support component along a secondary direction. However, this reduces the flatness of the support component's surface facing the display body. When the support component is connected to the display panel's main body, it affects the panel's lighting effects, resulting in poor lighting performance for the display module. In this case, typical display modules often require additional support structures such as a back film on the non-display side of the main body layer to prevent the support component from affecting the main body's lighting effects. Furthermore, typical display modules require an additional adhesive layer to secure the back film to the support component. In other words, typical display modules require a support component, a back film, and an adhesive layer between them to simultaneously support the display module and enable its bending function. However, this results in a larger number of layers, greater thickness, and a more complex structure for the display module. When the display module is folded, the different layers of the display module are prone to peeling off, resulting in poor structural reliability of the display module.

[0021] In this embodiment, the support member for the display module includes a non-metallic layer and a first metal layer stacked together. On one hand, the non-metallic layer uses a non-metallic material, which has a low density and low modulus of elasticity. The first metal layer uses a metallic material, which has a high density and good rigidity. This allows the support member to better support the display panel while also achieving a lightweight and thin design. On the other hand, the inner bend of the support member may also have a first hole. The first hole can be spaced apart from the surface of the first metal layer facing away from the non-metallic layer (i.e., the first surface in this embodiment). Thus, by providing the first hole in the inner bend, the modulus of elasticity of the inner bend is reduced, making the modulus of elasticity of the inner bend of the support member smaller than the modulus of elasticity of the first outer bend and smaller than the modulus of elasticity of elasticity of the second outer bend. The elastic modulus of the bent portion of the support member is less than that of the first straight portion and less than that of the second straight portion, allowing the support member to bend along a preset bending trajectory. Furthermore, the first hole is spaced apart from the first surface of the first metal layer, making the first surface of the first metal layer relatively flat, which helps ensure the surface flatness of the first surface and the light and shadow effect of the display panel. In other words, the support member in this embodiment can simultaneously support the display module and enable its bending function while also considering the light and shadow effect of the display panel. Moreover, compared to a typical display module, the display module in this embodiment reduces the number of back films and the adhesive layer between the back film and the support member, effectively reducing the number of layers and the overall thickness of the display module. This effectively avoids the problem of peeling between different layers when the display module is folded, thus ensuring the structural reliability of the display module. In other words, the support member in this embodiment can replace the back film, support member, and adhesive layer between the back film and the support member in a typical display module, thereby supporting the display panel while also achieving a thinner display module design.

[0022] In one possible implementation, the support further includes a first filler layer. The first filler layer fills at least a portion of the first hole. The elastic modulus of the first filler layer is less than that of the non-metallic layer. This allows the first filler layer to improve the structural strength of the non-metallic layer, thus preventing damage to the support and extending its service life. Furthermore, the lower elastic modulus of the first filler layer ensures that even after filling the first hole, the elastic modulus of the inner bend remains lower than that of the first and second outer bends, allowing the support to bend more effectively along a predetermined bending trajectory. In other words, this embodiment achieves a balance between structural strength and bending performance by filling the first hole with a first filler layer with a lower elastic modulus.

[0023] In one possible implementation, the inner bend has a plurality of first through holes. Each of the plurality of first through holes is spaced apart from a first surface of the first metal layer.

[0024] It is understood that in this embodiment, by providing multiple first through holes in the inner bending portion of the support member, the elastic modulus of the inner bending portion is reduced, so that the elastic modulus of the inner bending portion of the support member can be less than the elastic modulus of the first outer bending portion and less than the elastic modulus of the second outer bending portion. The elastic modulus of the bending portion of the support member can be less than the elastic modulus of the first straight portion and less than the elastic modulus of the second straight portion, allowing the support member to bend more effectively according to the preset bending trajectory.

[0025] In one possible implementation, the first outer bend has a second hole. The second hole is spaced apart from the first surface. The second hole communicates with the first hole of the inner bend.

[0026] It is understood that in this embodiment, by providing a second hole and a third hole respectively in the first and second outer bends of the support member, the elastic modulus of the first and second outer bends is reduced, so that the elastic modulus of the first outer bend of the support member can be less than the elastic modulus of the first straight portion, and the elastic modulus of the second outer bend can be less than the elastic modulus of the second straight portion, so that the support member can bend better according to the preset bending trajectory.

[0027] In one possible implementation, the first filler layer of the support fills at least part of the first hole of the inner bend, and / or the first filler layer fills at least part of the second hole.

[0028] It is understood that the support member in this embodiment may further include a first filler layer. The first filler layer fills the first hole and / or the second hole. The elastic modulus of the first filler layer is less than the elastic modulus of the non-metallic layer. In this way, on the one hand, the first filler layer can improve the structural strength of the non-metallic layer, thereby preventing damage to the support member and thus increasing its service life; on the other hand, the elastic modulus of the first filler layer is less than the elastic modulus of the non-metallic layer, so that after the first filler layer is filled into the first hole, the elastic modulus of the inner bending portion can still be less than or equal to the elastic modulus of the first outer bending portion, and the elastic modulus of the bending portion can still be less than the elastic modulus of the first straight portion and the second straight portion, so that the support member can bend better according to the preset bending trajectory. In other words, by filling the first hole and / or the second hole with a first filler layer with a smaller elastic modulus, this embodiment allows the support member to balance structural strength and bending performance.

[0029] In one possible implementation, the first outer bend has a plurality of second through holes. The plurality of second through holes are spaced apart from the first surface of the first metal layer.

[0030] It is understood that in this embodiment, by providing multiple second through holes in the first outer bend of the support member, the elastic modulus of the first outer bend is reduced, so that the elastic modulus of the first outer bend of the support member can be less than the elastic modulus of the first straight part, so that the support member 10 can bend better according to the preset bending trajectory.

[0031] In one possible implementation, the dimensions of the multiple first through holes in the inner bend are larger than the dimensions of the multiple second through holes, and / or the density of the multiple first through holes is greater than the density of the multiple second through holes. This further reduces the elastic modulus of the inner bend, allowing the support member to bend more effectively along a predetermined bending trajectory.

[0032] In one possible implementation, the support further includes a first intermediate layer. The first intermediate layer is stacked between the first metallic layer and the non-metallic layer. The elastic modulus of the first intermediate layer is less than that of the non-metallic layer.

[0033] Understandably, the non-metallic layer of typical support components usually uses fiber materials or fiber composites to improve the structural strength of the support component while reducing its weight. However, this results in a noticeable fiber texture on the surface of the non-metallic layer. When the first metal layer is stacked on top of the non-metallic layer, the fiber texture of the non-metallic layer will be visible on the surface of the first metal layer facing the display panel, thus affecting the surface flatness of the first metal layer and consequently the surface flatness of the support component. When the support component is connected to the display panel, it will affect the lighting and shadow effects of the display panel, resulting in poor lighting and shadow effects for the display module.

[0034] In this embodiment, a first intermediate layer is provided between the first metal layer and the non-metal layer. The elastic modulus of the first intermediate layer is less than that of the non-metal layer, which can better cover the fiber texture of the non-metal layer and prevent the fiber texture of the non-metal layer from appearing on the surface of the first metal layer facing the display panel. This ensures the surface flatness of the first metal layer and makes the surface flatness of the support member better. When the support member is connected to the display panel, the support member will not affect the light and shadow effect of the display panel.

[0035] Secondly, compared to conventional support components where the first metal layer and non-metal layer are bonded together with an adhesive layer to improve the reliability of the connection between them, the adhesive layer is typically thicker and has a higher elastic modulus to ensure the bonding stability between the first metal layer, non-metal layer, and adhesive layer. This is not conducive to the thinning of the support component and also reduces its bending performance, making it difficult for the support component to bend along a predetermined trajectory.

[0036] In this embodiment, a first intermediate layer is provided between the first metal layer and the non-metal layer in the support member. During the hot pressing process of the first intermediate layer, the first metal layer, and the non-metal layer, the first intermediate layer can serve as a transition material between the first metal layer and the non-metal layer. The connection reliability between the first intermediate layer and the first metal layer is good, and the connection reliability between the first intermediate layer and the non-metal layer is also good. This increases the connection reliability between the first metal layer and the non-metal layer, thereby enhancing the structural stability of the support member and making it less prone to delamination during bending, which helps to extend the service life of the support member. Thus, the thickness and elastic modulus of the first intermediate layer are both small, which allows for both increased structural stability and a thinner profile of the support member, making it less prone to delamination during bending and allowing the support member to bend along a preset trajectory. In other words, the support member in this embodiment can balance a thin profile and structural stability.

[0037] In one possible implementation, the first intermediate layer is made of a polymer material. This allows the first intermediate layer to have a low elastic modulus, enabling it to effectively cover the fiber texture of the non-metallic layer and prevent the fiber texture of the non-metallic layer from appearing on the surface of the first metal layer facing the display panel. This ensures the surface flatness of the first metal layer, resulting in a better surface flatness of the support component. When the support component is connected to the display panel, it will not affect the light and shadow effects of the display panel.

[0038] In one possible implementation, the elastic modulus of the first intermediate layer is between 10 MPa and 5 GPa. This results in a relatively low elastic modulus for the first intermediate layer, allowing it to effectively cover the fiber texture of the non-metallic layer and prevent it from appearing on the surface of the first metallic layer facing the display panel. This ensures the surface flatness of the first metallic layer, resulting in a smoother surface for the support member. Consequently, when the support member is connected to the display panel, it will not affect the light and shadow effects of the display panel.

[0039] In one possible implementation, the thickness of the first intermediate layer is less than or equal to 30 micrometers. This thinner first intermediate layer facilitates the design of a thinner support component.

[0040] In one possible implementation, the first metal layer, the first intermediate layer, and the non-metallic layer are integrally formed. This improves the connection reliability of the first metal layer, the first intermediate layer, and the non-metallic layer, thereby enhancing the structural stability of the support component.

[0041] In one possible implementation, the elastic modulus of the first intermediate layer is less than or equal to the elastic modulus of the first filling layer of the support member. This results in a lower elastic modulus for the first intermediate layer, allowing it to better cover the fiber texture of the non-metallic layer and prevent it from appearing on the surface of the first metallic layer facing the display panel. This ensures the surface flatness of the first metallic layer, resulting in a smoother surface for the support member. Consequently, when the support member is connected to the display panel, it will not affect the light and shadow effects of the display panel.

[0042] In one possible implementation, the material of the first intermediate layer is the same as the material of the first filler layer of the support. In this way, when the first metal layer, the first intermediate layer, the first filler layer, and the non-metallic layer are hot-pressed, the first intermediate layer and the first filler layer can be better bonded together, thereby improving the connection reliability of the first metal layer, the first intermediate layer, the first filler layer, and the non-metallic layer, and thus improving the structural stability of the support.

[0043] In one possible implementation, the support further includes a second intermediate layer. The second intermediate layer is laminated between the non-metallic layer and the second metallic layer of the support. The elastic modulus of the second intermediate layer is less than that of the non-metallic layer.

[0044] Understandably, the non-metallic layer of a typical support is usually made of fiber material or fiber composite material to improve the structural strength of the support while reducing its weight. However, this results in a more obvious fiber texture on the surface of the non-metallic layer. When the second metal layer is stacked on top of the non-metallic layer, the fiber texture of the non-metallic layer will appear on the surface of the second metal layer facing away from the non-metallic layer, thus affecting the surface flatness of the second metal layer.

[0045] In this embodiment, a second intermediate layer is provided between the non-metallic layer and the second metal layer. The elastic modulus of the second intermediate layer is less than that of the non-metallic layer, which can better cover the fiber texture of the non-metallic layer and prevent the fiber texture of the non-metallic layer from appearing on the surface of the second metal layer facing away from the non-metallic layer. This ensures the surface flatness of the second metal layer and makes the surface flatness of the support better.

[0046] Secondly, compared to the conventional method of bonding the non-metallic layer and the second metal layer of a support component using an adhesive layer to improve the reliability of the connection between the non-metallic layer and the second metal layer, the adhesive layer is usually thicker and has a larger elastic modulus in order to ensure the bonding stability between the non-metallic layer, the second metal layer, and the adhesive layer. This is not conducive to the thinning of the support component and also reduces the bending performance of the support component, making it difficult for the support component to bend along a preset trajectory.

[0047] In this embodiment, the support member has a second intermediate layer between the non-metallic layer and the second metal layer. During the hot pressing process of the second intermediate layer, the second metal layer, and the non-metallic layer, the second intermediate layer can serve as a transition material between the second metal layer and the non-metallic layer. The connection reliability between the second intermediate layer and the second metal layer is good, and the connection reliability between the second intermediate layer and the non-metallic layer is also good. This can increase the connection reliability between the second metal layer and the non-metallic layer, thereby enhancing the structural stability of the support member. This makes it less likely for the support member to delaminate during bending, which is beneficial to extending the service life of the support member.

[0048] In this way, the thickness and elastic modulus of the second intermediate layer are both relatively small, which increases the structural stability of the support while also ensuring its thinness. Furthermore, it prevents delamination during bending, allowing the support to bend along a predetermined trajectory. In other words, the support in this embodiment achieves a balance between thinness and structural stability.

[0049] Secondly, a display module is provided. The display module includes a display panel and the aforementioned support member. The support member is fixed to the non-display surface of the display panel. A first metal layer is disposed closer to the display panel than the non-metal layer. The display module in this embodiment is lightweight and thin.

[0050] In one possible implementation, the display module includes a first region, a second region, and a third region connected along a first direction. The second region is located between the first and third regions. A first straight portion, a bent portion, and a second straight portion are located in the first, second, and third regions, respectively. The display module can be bent in the second region. In this way, the support member can drive the display module to move, and the support member can drive the first and third regions of the display module to unfold or fold relative to each other.

[0051] In one possible implementation, the display panel includes a flexible substrate layer, which is fixedly connected to the surface of the first metal layer facing away from the non-metal layer.

[0052] It is understandable that, compared to typical support members, the non-metallic layer is used to fix the flexible substrate layer of the display panel to support it. However, the surface flatness of the non-metallic layer is relatively poor (for example, when the non-metal is made of fiber material or fiber composite material, the surface of the non-metallic layer is relatively rough). When the support member is fixedly connected to the display body (e.g., the flexible substrate layer) of the display panel, the non-metallic layer will reduce the light and shadow effect of the display module. In this embodiment, a first metal layer is provided to fix the flexible substrate layer of the display panel to the support member. The first metal layer is made of metal material, and the surface of metal material is relatively smooth. The surface flatness of the first metal layer is better, thereby reducing the impact of the support member on the display panel and ensuring the light and shadow effect of the display module.

[0053] Thirdly, an electronic device is provided. The electronic device includes a first housing, a second housing, a folding mechanism, and the aforementioned display module. The folding mechanism connects the first housing and the second housing. The first housing and the second housing are capable of being relatively flattened or folded relative to each other under the action of the folding mechanism. A support member of the display module is fixedly connected to the first housing and the second housing. The electronic device in this embodiment is lightweight and thin. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0055] Figure 1 This is a schematic diagram of one embodiment of the electronic device provided in this application when it is in the open state;

[0056] Figure 2 yes Figure 1 The diagram shows a structural schematic of one embodiment of the electronic device in a folded state.

[0057] Figure 3 yes Figure 1 The diagram shows an exploded view of the electronic device in some embodiments;

[0058] Figure 4 yes Figure 2 A schematic cross-sectional view of one embodiment of the electronic device shown, cut along point AA;

[0059] Figure 5a This is a schematic diagram of the cross-sectional structure of a typical display module in some implementations;

[0060] Figure 5b yes Figure 5a A schematic diagram of the bamboo book layer of the display module shown from another perspective;

[0061] Figure 6 yes Figure 3 The diagram shown is an exploded view of the display module in some embodiments.

[0062] Figure 7 yes Figure 3 The diagram shows a cross-sectional structure of the display module cut along BB in one embodiment.

[0063] Figure 8 yes Figure 3 The diagram shows a cross-sectional view of a portion of the display module cut along point BB in one embodiment.

[0064] Figure 9a yes Figure 3 The diagram shows a cross-sectional structure of the display module cut along BB in one embodiment.

[0065] Figure 9b yes Figure 9a The diagram shows a cross-sectional structure of the structure in a folded state.

[0066] Figure 10a yes Figure 9a A partial structural schematic diagram of the support member shown in one embodiment;

[0067] Figure 10b yes Figure 10a A partial structural schematic diagram of the support member shown in another embodiment;

[0068] Figure 11 yes Figure 10a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0069] Figure 12a yes Figure 11 A schematic diagram of the support component shown from another perspective;

[0070] Figure 12b yes Figure 12a The diagram shown is a structural schematic of the support member in another embodiment;

[0071] Figure 12c yes Figure 11 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0072] Figure 12d yes Figure 10b A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0073] Figure 13 yes Figure 11 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0074] Figure 14a yes Figure 13 A schematic diagram of the support component shown from another perspective;

[0075] Figure 14b yes Figure 14a The diagram shown is a structural schematic of the support member in another embodiment;

[0076] Figure 15a yes Figure 10a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0077] Figure 15b yes Figure 15aA schematic diagram of the support component shown from another perspective;

[0078] Figure 15c yes Figure 15b The diagram shown is a structural schematic of another embodiment of the structure.

[0079] Figure 16 yes Figure 11 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0080] Figure 17a yes Figure 10a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0081] Figure 17b yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0082] Figure 17c yes Figure 17b A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0083] Figure 18a yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0084] Figure 18b yes Figure 18a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0085] Figure 19a yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0086] Figure 19b yes Figure 19a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0087] Figure 20a yes Figure 19b A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0088] Figure 20b yes Figure 20a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0089] Figure 20c yes Figure 20b A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0090] Figure 20d yes Figure 17cA schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0091] Figure 21a yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0092] Figure 21b yes Figure 21a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0093] Figure 22 yes Figure 18a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0094] Figure 23a yes Figure 22 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0095] Figure 23b yes Figure 22 The diagram shown is a structural schematic of the support member in another embodiment;

[0096] Figure 24 yes Figure 19b A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0097] Figure 25 yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0098] Figure 26 yes Figure 17a A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0099] Figure 27 yes Figure 26 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0100] Figure 28 yes Figure 27 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0101] Figure 29 yes Figure 28 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0102] Figure 30 yes Figure 26 A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0103] Figure 31 yes Figure 26A schematic diagram of the cross-sectional structure of the support member shown in another embodiment;

[0104] Figure 32 yes Figure 31 The diagram shows a cross-sectional structure of the support member in another embodiment. Detailed Implementation

[0105] The embodiments of this application are described below with reference to the accompanying drawings.

[0106] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0107] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0108] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0109] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in another embodiment" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0110] It is understood that the specific embodiments described herein are merely for explaining the relevant invention and not for limiting the invention. It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0111] Figure 1 This is a schematic diagram of one embodiment of the electronic device 1000 provided in this application when it is in the open state. Figure 2 yes Figure 1 The diagram shows a structural schematic of one embodiment of the electronic device 1000 in a folded state. Figure 3 yes Figure 1 The diagram shows an exploded view of the electronic device 1000 in some embodiments.

[0112] like Figures 1 to 3 As shown, this application provides a foldable electronic device 1000. The electronic device 1000 can be a foldable device such as a mobile phone, tablet computer, personal computer, laptop computer, in-vehicle device, or wearable device. Figures 1 to 3 The electronic device 1000 of the illustrated embodiment is described using a mobile phone as an example. It should be noted that... Figures 1 to 3 The accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 As well as the limitations of the accompanying figures below.

[0113] For example, the length direction of the electronic device 1000 can be the X-axis direction, the thickness direction of the electronic device 1000 can be the Z-axis direction, and the extension direction of the rotation axis of the electronic device 1000 can be the Y-axis direction, that is, the width direction of the electronic device 1000 can be the Y-axis direction. It can be understood that the coordinate system of the electronic device 1000 can also be flexibly set according to specific needs.

[0114] Exemplarily, the electronic device 1000 may include a device housing 100, a display module 200, and a folding mechanism 300. The device housing 100 may include a first housing 110 and a second housing 120. The folding mechanism 300 may connect the first housing 110 and the second housing 120. The folding mechanism 300 may deform to allow the first housing 110 and the second housing 120 to be relatively unfolded to an open state or relatively folded to a closed state. Exemplarily, the folding mechanism 300 may be an inward folding mechanism. The folding mechanism 300 may fold at least a portion of the display module 200 to the inside of the first housing 110 and the second housing 120. In other embodiments, the folding mechanism 300 may also be an outward folding mechanism. The folding mechanism 300 may fold at least a portion of the display module 200 to the outside of the first housing 110 and the second housing 120. It should be noted that... Figure 1 The first housing 110, the folding mechanism 300, and the second housing 120 of the electronic device 1000 are schematically divided by dashed lines.

[0115] For example, the display module 200 may include a first region 200a, a second region 200b, and a third region 200c connected together. The first region 200a, the second region 200b, and the third region 200c may be arranged along a first direction X. The second region 200b may be fixedly connected between the first region 200a and the third region 200c. In other embodiments, the first region 200a, the second region 200b, and the third region 200c of the display module 200 may also have other arrangement methods. For example, the first region 200a, the second region 200b, and the third region 200c may also be arranged along the width direction (e.g., the Y-axis direction) of the electronic device 1000. For example, the first direction X may be parallel to the length direction of the electronic device 1000. In this embodiment, the first direction X may be the positive direction of the X-axis. It should be noted that... Figure 1 In the accompanying drawings and subsequent sections, the first region 200a, the second region 200b, and the third region 200c of the display module 200 are schematically divided by dashed lines.

[0116] Figure 4 yes Figure 2 The diagram shows a cross-sectional view of one embodiment of the electronic device 1000 cut along point AA.

[0117] like Figure 1 and Figure 4As shown, the first region 200a and the third region 200c of the display module 200 can be fixedly connected to the first housing 110 and the second housing 120, respectively. The second region 200b of the display module 200 can be disposed opposite to the folding mechanism 300. When the folding mechanism 300 drives the first housing 110 and the second housing 120 to unfold or fold relative to each other, the first housing 110 can drive the first region 200a of the display module 200 to move, and the second housing 120 can drive the third region 200c of the display module 200 to move, so that the first region 200a and the third region 200c of the display module 200 can be relatively flattened or relatively folded.

[0118] For example, when the electronic device 1000 is in the on state (e.g. Figure 1 As shown, the first housing 110 and the second housing 120 can be relatively flattened. At this time, the first region 200a, the second region 200b, and the third region 200c of the display module 200 can be at a 180° angle. At least a portion of the folding mechanism 300 can be used to support the second region 200b. The display module 200 has a continuous large-area display area, meaning it can achieve large-screen display, resulting in a better user experience. In other embodiments, the first region 200a, the second region 200b, and the third region 200c may also deviate slightly from 180°, for example, by 165°, 177°, or 185°.

[0119] For example, when the electronic device 1000 is in a closed state (e.g. Figure 4 As shown, the first housing 110 and the second housing 120 can be folded relative to each other. The folding mechanism 300 can enclose an accommodating space 300a. At this time, the first region 200a and the third region 200c of the display module 200 can be located between the first housing 110 and the second housing 120. The first region 200a and the third region 200c can be folded relative to each other. The first region 200a and the third region 200c can be stacked along the thickness direction of the electronic device 1000 (e.g., the Z-axis direction). The display surface of the first region 200a can be disposed facing the third region 200c. The display surface of the third region 200c can be disposed facing the first region 200a. The second region 200b can be bent and disposed between the first region 200a and the third region 200c. The second region 200b can be located within the accommodating space 300a of the folding mechanism 300. Exemplarily, the accommodating space 300a can be approximately teardrop-shaped. In other embodiments, the accommodating space 300a can also be other shapes.

[0120] Figure 5a This is a cross-sectional structural diagram of a typical display module 400 in some embodiments. Figure 5b yes Figure 5aThe diagram shows the structure of the bamboo book layer 410 of the display module 400 from another perspective.

[0121] like Figure 5a and Figure 5b As shown, the display module 400 may include a bamboo book layer 410, a display panel 420, and a protective member 430 stacked along the second direction Z. The display panel 420 may be fixedly connected between the bamboo book layer 410 and the protective member 430. The display panel 420 may be used to display images, etc. The protective member 430 may be fixedly connected to the display surface of the display panel 420. The protective member 430 may be used to protect the display panel 420. The bamboo book layer 410 may be fixedly connected to the non-display surface of the display panel 420. The bamboo book layer 410 may be used to support the display panel 420. The display panel 420 may have a back film 421, a first adhesive layer 422, and a display body 423 stacked along the second direction Z. The back film 421 may be fixedly connected to the non-display side of the display body 423 via the first adhesive layer 422; for example, the back film 421 may be fixedly connected to the flexible substrate layer (not shown) of the display body 423. The back film 421 may be used to support the display body 423 of the display panel 420. Display body 423 can be used to display images.

[0122] Exemplarily, the protective member 430 may be located on the side of the display body 423 of the display panel 420 facing away from the back film 421. A second adhesive layer 440 may be present between the protective member 430 and the display panel 420. The protective member 430 may be fixedly connected to the display side of the display body 423 of the display panel 420 via the second adhesive layer 440. The bamboo book layer 410 may be located on the side of the back film 421 facing away from the first adhesive layer 422. A third adhesive layer 450 may be present between the bamboo book layer 410 and the display panel 420. The bamboo book layer 410 may be fixedly connected to the back film 421 of the display panel 420 via the third adhesive layer 450.

[0123] The display panel 420 may have a first display area 420a, a second display area 420b, and a third display area 420c connected along a first direction X. The second display area 420b may be located between the first display area 420a and the third display area 420c. The first display area 420a, the second display area 420b, and the third display area 420c may be located in the first region 200a, the second region 200b, and the third region 200c of the display module 400, respectively (please refer to...). Figure 3 (As shown). The bamboo book layer 410 may have multiple through holes 410a. The multiple through holes 410a may penetrate the upper and lower surfaces of the bamboo book layer 410 along the second direction Z. The multiple through holes 410a may be positioned directly opposite the second display area 420b of the display panel 420, so that the display module 400 can be bent according to a preset bending trajectory. For ease of understanding, Figure 5aThe first display area 420a, the second display area 420b, and the third display area 420c are schematically divided by dotted lines. Figure 5b The through hole 410a is schematically marked by a dashed line.

[0124] It is understandable that a typical display module 400 includes a stacked bamboo book layer 410, a third adhesive layer 450, a back film 421, a first adhesive layer 422, a display body 423, a second adhesive layer 440, and a protective component 430 to achieve the display function and bending function of the display module 400. However, this results in a large number of layers in the display module 400, making its structure more complex and its thickness thicker. When the display module 400 is folded, the different layers are prone to peeling off from each other, leading to poor structural reliability.

[0125] In this embodiment, the structure of the display module is improved so that the display module can balance thinness and structural reliability.

[0126] The following section will describe a display module 200 in detail with reference to the accompanying drawings.

[0127] Figure 6 yes Figure 3 The diagram shown is an exploded view of the display module 200 in some embodiments. Figure 7 yes Figure 3 The diagram shows a cross-sectional structure of one embodiment of the display module 200 cut along BB.

[0128] like Figure 6 and Figure 7 As shown, the display module 200 may include a support member 10, a first adhesive layer 41, a display panel 20, a second adhesive layer 42, and a protective member 30, all stacked along the second direction Z. The display panel 20 may be fixedly connected between the support member 10 and the protective member 30. The support member 10 may be located on the non-display side of the display panel 20. The protective member 30 may be located on the display side of the display panel 20. The first adhesive layer 41 may be located between the support member 10 and the display panel 20. The support member 10 may be fixedly connected to the non-display surface of the display panel 20 via the first adhesive layer 41. The support member 10 may be used to support the display module 200. Exemplarily, the second direction Z may intersect with the first direction X. The second direction Z may be parallel to the thickness direction of the electronic device 1000. In this embodiment, the second direction Z may be the positive Z-axis direction.

[0129] Exemplarily, the second adhesive layer 42 may be located between the protective member 30 and the display panel 20. The protective member 30 can be fixedly connected to the display surface of the display panel 20 through the second adhesive layer 42. The protective member 30 can be used to protect the display surface of the display panel 20. When the display module 200 is dropped, the protective member 30 can protect the display panel 20, thereby preventing damage to the display panel 20. Exemplarily, the second adhesive layer 42 may be an adhesive with high light transmittance, such as optically clear adhesive (OCA).

[0130] Exemplarily, the protective element 30 may include a reinforcing layer, a covering layer, and a protective film (not shown). The protective film may be a replaceable protective layer. The protective film may be used to protect the display module 200. Both the reinforcing layer and the covering layer may be used to improve the structural strength of the display module 200. The reinforcing layer may be made of materials such as ultra-thin glass (UTG) or polyethylene terephthalate (PET). The covering layer may be made of transparent film layers such as polyethylene terephthalate (PET) or polyimide (PI).

[0131] In some embodiments, the protective element 30 may also include a polarizer layer. The polarizer layer may use a polarizer (POL) or similar material. The polarizer layer can be used to reduce screen reflections, which helps to improve the light source effect of the display module 200.

[0132] In other embodiments, the protective element 30 may include more or fewer layers, and this application does not limit this.

[0133] Figure 8 yes Figure 3 The diagram shows a cross-sectional view of one embodiment of the display module 200, cut along point BB.

[0134] like Figure 7 and Figure 8As shown, the display panel 20 can be a flexible display panel. For example, the display panel 20 can be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a mini organic light-emitting diode (MOLED) display panel, a micro organic light-emitting diode (MOLED) display panel, or a quantum dot light-emitting diode (QLED) display panel, etc. The display panel 20 can be used to display images, etc.

[0135] For example, the display panel 20 may include a flexible substrate layer 211, a barrier layer 212, a via layer 213, a planarization layer 214, and a pixel definition layer 215 stacked along the second direction Z. The flexible substrate layer 211 may be disposed closer to the support member 10 relative to the pixel definition layer 215. In this case, the support member 10 can be fixedly connected to the surface of the flexible substrate layer 211 facing away from the barrier layer 212 by the first adhesive layer 41. The flexible substrate layer 211 may include multiple flexible substrates 211a. The material of the multiple flexible substrates 211a may be polyimide (PI) or the like. The multiple flexible substrates 211a may provide support for the display module 200. For example, a buffer layer 211b may be provided between two adjacent flexible substrates 211a. The material of the buffer layer 211b may be silicon oxide or silicon nitride. The buffer layer 211b can improve the interface characteristics between two adjacent flexible substrate layers 211a, thereby improving the structural stability and performance of the flexible substrate layer 211. In other embodiments, the flexible substrate layer 211 may not include the buffer layer 211b.

[0136] For example, both the barrier layer 212 and the via layer 213 can be made of silicon oxide. Both the barrier layer 212 and the via layer 213 can prevent the flow of electrons and holes between different layers of the display panel 20, thereby preventing short circuits in the display panel 20. The display panel 20 may also include a light-shielding layer 216. The light-shielding layer 216 can be embedded in the via layer 213. The light-shielding layer 216 can be made of molybdenum. The light-shielding layer 216 can be used to prevent light leakage from the sides of the display panel 20.

[0137] Exemplarily, the display panel 20 may further include thin-film transistors 217 and electrical connectors 218. Both the thin-film transistors 217 and the electrical connectors 218 may be located between the via layer 213 and the planarization layer 214. The number of thin-film transistors 217 may be one or more. In this embodiment, the number of thin-film transistors 217 may be two. The two thin-film transistors 217 may be arranged along the length direction of the display panel 20 (e.g., the X-axis direction). The electrical connectors 218 may electrically connect the thin-film transistors 217 to the motherboard of the electronic device 1000 (not shown). The motherboard of the electronic device 1000 can transmit signals to the thin-film transistors 217 through the electrical connectors 218, thereby controlling the display effect of the display panel 20.

[0138] For example, both the planarization layer 214 and the pixel definition layer 215 can be made of organic materials. The planarization layer 214 can improve the flatness of the display panel 20, thereby improving the light and shadow effects of the display panel 20. The pixel definition layer 215 can be used to divide pixel areas and isolate pixels, thereby avoiding optical and electrical crosstalk between pixels. For example, the anode 219 of the display panel 20 can be located between the planarization layer 214 and the pixel definition layer 215.

[0139] Figure 9a yes Figure 3 The diagram shows a cross-sectional structure of one embodiment of the display module 200 cut along BB. Figure 9b yes Figure 9a The diagram shows a cross-sectional view of the structure when it is in a folded state. Figure 10a yes Figure 9a The diagram shows a partial structural schematic of the support member 10 in one embodiment.

[0140] like Figures 9a to 10a As shown, the display panel 20 may include a first display area 20a, a second display area 20b, and a third display area 20c connected along a first direction X. Figure 6 The diagram also illustrates the specific structures of the first display area 20a, the second display area 20b, and the third display area 20c. The second display area 20b can be located between the first display area 20a and the third display area 20c. The first display area 20a, the second display area 20b, and the third display area 20c can be located in the first region 200a, the second region 200b, and the third region 200c of the display module 200, respectively. That is, the first display area 20a, the second display area 20b, and the third display area 20c can each constitute a part of the first region 200a, the second region 200b, and the third region 200c, respectively. It should be noted that... Figure 6The first display area 20a, the second display area 20b, and the third display area 20c of the display panel 20 are schematically divided by dashed lines in the accompanying drawings.

[0141] For example, the support member 10 may include a first straight portion 11, a bent portion 12, and a second straight portion 13 connected along a first direction X. The bent portion 12 may be located between the first straight portion 11 and the second straight portion 13. The first straight portion 11, the bent portion 12, and the second straight portion 13 may be located in the first region 200a, the second region 200b, and the third region 200c of the display module 200, respectively (see also...). Figure 6 (As shown). That is, the first straight portion 11, the bent portion 12, and the second straight portion 13 can respectively constitute a part of the first region 200a, the second region 200b, and the third region 200c. At this time, the first straight portion 11, the bent portion 12, and the second straight portion 13 of the support member 10 can be respectively positioned facing the first display area 20a, the second display area 20b, and the third display area 20c of the display panel 20.

[0142] For example, the first straight portion 11 of the support member 10 can be fixedly connected between the first housing 110 and the first display area 20a of the display panel 20. The bent portion 12 of the support member 10 can be located between the folding mechanism 300 and the second display area 20b of the display panel 20, and can be fixedly connected to the second display area 20b of the display panel 20. The second straight portion 13 of the support member 10 can be fixedly connected between the second housing 120 and the third display area 20c of the display panel 20 (see also...). Figure 6 (As shown). The first straight portion 11, the bent portion 12, and the second straight portion 13 can all be fixedly connected to the first display area 20a, the second display area 20b, and the third display area 20c of the display panel 20 via the first adhesive layer 41. The first straight portion 11, the bent portion 12, and the second straight portion 13 of the support member 10 can provide support for the first display area 20a, the second display area 20b, and the third display area 20c of the display panel 20, respectively. It should be noted that... Figure 6 In the accompanying drawings and subsequent sections, the first straight portion 11, the bent portion 12, and the second straight portion 13 of the support member 10 are schematically divided by dashed lines.

[0143] For example, the bending portion 12 may include a first outer bending portion 121, an inner bending portion 122, and a second outer bending portion 123 connected along the first direction X. Figure 6The diagram also illustrates the specific structures of the first outer bend 121, the inner bend 122, and the second outer bend 123. The inner bend 122 can be located between the first outer bend 121 and the second outer bend 123. The first outer bend 121 can be fixedly connected to the first straight portion 11. The second outer bend 123 can be fixedly connected to the second straight portion 13. It should be noted that... Figure 6 In the accompanying drawings and subsequent parts, the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10 are schematically divided by dashed lines.

[0144] For example, the folding mechanism 300 may also include a first support plate 310 and a second support plate 320. Figure 4 The diagram also illustrates the specific structures of the first support plate 310 and the second support plate 320. The first support plate 310 can be positioned closer to the first housing 110 than the second support plate 320.

[0145] Exemplarily, the support member 10 may also have a first fixing portion 124 between the first outer bend 121 and the inner bend 122. The first fixing portion 124 can be used to bond the first support plate 310 together with an adhesive layer. The support member 10 may also have a second fixing portion 125 between the second outer bend 123 and the inner bend 122. The second fixing portion 125 can be used to bond the second support plate 320 together with an adhesive layer. It should be noted that the widths of the first fixing portion 124 and the second fixing portion 125 are relatively narrow. Figure 9a The first fixing part 124 and the second fixing part 125 are omitted in the accompanying drawings and subsequent figures. In other embodiments, the support member 10 may also exclude the first fixing part 124 and / or the second fixing part 125. The bent part 12 of the support member 10 may also overlap the first support plate 310 and the second support plate 320.

[0146] For example, when the electronic device 1000 is in the open state, the support member 10 can be in the corresponding open state (e.g., Figure 9a (As shown). At this time, the first support plate 310 and the second support plate 320 can be relatively flattened. The first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10 can be relatively flattened. The first outer bend 121, the inner bend 122, and the second outer bend 123 can be at 180°. The first outer bend 121 and the second outer bend 123 can be located on opposite sides of the inner bend 122 along the first direction X.

[0147] For example, when the electronic device 1000 is in a folded state, the support member 10 can be in a corresponding folded state (e.g., Figure 9b(As shown). At this time, the first support plate 310 can be disposed opposite to the second support plate 320. The first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10 can be located inside the first support plate 310 and the second support plate 320. The inner bend 122 can be located on the same side as the first outer bend 121 and the second outer bend 123. At this time, the bend 12 of the support member 10 can be approximately teardrop-shaped. The bending radius of the inner bend 122 can be larger than the bending radius of the first outer bend 121 and can be larger than the bending radius of the second outer bend 123.

[0148] like Figure 9a As shown, the support member 10 may include a non-metallic layer 14 and a first metal layer 15 stacked together. The first metal layer 15 may be disposed closer to the display panel 20 relative to the non-metallic layer 14. The first metal layer 15 may be fixedly connected to the surface of the display panel 20 facing away from the protective member 30 by a first adhesive layer 41. The first metal layer 15 may have a first surface 15a. The first surface 15a may be the surface of the first metal layer 15 facing away from the non-metallic layer 14. The first surface 15a of the first metal layer 15 may be fixedly connected to the flexible substrate layer 211 of the display panel 20 by the first adhesive layer 41 (please refer to...). Figure 8 (As shown). The first metal layer 15 can be made of metallic materials, such as stainless steel, copper alloy, titanium alloy, aluminum alloy, etc. The non-metallic layer 14 can be made of fiber materials or fiber composite materials, such as carbon fiber T300, carbon fiber T700, carbon fiber T800, carbon fiber T1000, glass fiber, poly-p-phenylene benzobisoxazole (PBO) fiber, polyimide (PI), and polyethylene terephthalate (PET), etc.

[0149] In this embodiment, the first metal layer 15 can be made of stainless steel. The non-metallic layer 14 can be made of M40 carbon fiber. It should be understood that M40 carbon fiber refers to a specific grade or type of carbon fiber. M40 carbon fiber can approximately include 99.12% carbon and 0.074% nitrogen. It is understood that M is a designation for a carbon fiber product series, and 99.12% and 0.074% refer to mass percentages. The same symbols with the same meaning will not be repeated hereafter.

[0150] For example, the thickness of the first metal layer 15 may be less than or equal to 50 micrometers. In this embodiment, the thickness of the first metal layer 15 may be 20 micrometers. The thickness of the non-metallic layer 14 may be less than or equal to 150 micrometers. In this embodiment, the thickness of the non-metallic layer 14 may be 60 micrometers. In other embodiments, the thickness of the non-metallic layer 14 may also be 80 micrometers.

[0151] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15 and the non-metal layer 14 can be integrally molded. For example, the first metal layer 15 and the non-metal layer 14 can be integrally molded by hot pressing or other methods. In this way, on the one hand, no adhesive layer is needed between the first metal layer 15 and the non-metal layer 14, thereby reducing the thickness of the support member 10 and facilitating a thinner design of the support member 10; on the other hand, it can also improve the connection stability between the first metal layer 15 and the non-metal layer 14, which is beneficial to improving the structural strength of the support member 10. In other words, the support member 10 in this embodiment can balance thinness and structural strength.

[0152] Understandably, a typical display module includes a stacked layer of adhesive, a third adhesive layer, a back film, a first adhesive layer, a display body, a second adhesive layer, and protective components (such as...). Figure 5a As shown, the display module 200 is designed to achieve both display and bending functions. In other words, typical display modules have many layers and are quite thick, resulting in lower structural reliability. However, the support member 10 of the display module 200 in this embodiment includes a first metal layer 15 and a non-metal layer 14 stacked together. The support member 10 can be a one-piece molded structure, meaning the first metal layer 15 can be integrally molded with the non-metal layer 14 (in this embodiment, this is achieved through hot pressing). The first metal layer 15 is fixedly connected to the flexible base layer 211 of the display panel 20. Therefore, compared to typical display modules, the display module 200 in this embodiment reduces the number of layers and the adhesive layer between the back film and the bamboo layer, effectively reducing the overall thickness of the display module 200 and preventing peeling between different layers when the display module 200 is folded, thus ensuring the structural reliability of the display module 200. In other words, the support member 10 in this embodiment can replace the back film, bamboo book layer and adhesive layer between the back film and bamboo book layer in a general display module, thereby supporting the display panel 20 while also achieving a thinner display module 200.

[0153] Secondly, compared to conventional support components that consist only of metallic materials, which have higher density and elastic modulus, resulting in heavier support components with poorer bending performance, conventional support components may only consist of non-metallic materials. Non-metallic materials have lower stiffness, requiring the support component to have a greater thickness to ensure its structural strength and support the display panel. In other words, conventional support components cannot simultaneously achieve lightweight and thin design. However, the support component 10 in this embodiment includes a first metal layer 15 and a non-metallic layer 14 stacked together, using metallic and non-metallic materials respectively. Thus, on the one hand, the metallic material of the first metal layer 15 has better stiffness, which helps ensure the structural strength of the support component 10; on the other hand, the non-metallic material of the non-metallic layer 14 has lower density and elastic modulus, making the support component 10 lighter and easier to bend. In other words, the support component 10 in this embodiment is lighter and thinner, achieving both lightweight and thin design simultaneously.

[0154] Furthermore, compared to conventional support members, the non-metallic layer is fixedly connected to the flexible substrate layer of the display panel to support the display panel. However, the surface flatness of the non-metallic layer is relatively poor (for example, when the non-metal is made of fiber material or fiber composite material, the surface of the non-metallic layer is relatively rough). When the support member is fixedly connected to the display body (e.g., the flexible substrate layer) of the display panel, the non-metallic layer will reduce the light and shadow effect of the display module. In this embodiment, the first metal layer 15 of the support member 10 is fixedly connected to the flexible substrate layer 211 of the display panel 20. The first metal layer 15 is made of metal material, and the surface of the metal material is relatively smooth. The surface flatness of the first metal layer 15 is better, thereby reducing the impact of the support member 10 on the display panel 20 and ensuring the light and shadow effect of the display module 200.

[0155] Furthermore, the non-metallic layer 14 in this embodiment uses fiber materials and fiber composite materials, both of which have good structural strength and low weight. This improves the structural strength of the support member 10 while reducing its weight. In other words, the support member 10 in this embodiment achieves a balance between structural strength and lightweight design.

[0156] Furthermore, the non-metallic layer 14 in this embodiment can be made of M40 carbon fiber. M40 carbon fiber has a less pronounced core-skin structure, higher structural uniformity, and a higher degree of graphite microcrystal orientation. M40 carbon fiber exhibits reduced deformation under external force and has a higher modulus. This results in higher rigidity of the support member 10, allowing it to better support the display panel 20, thereby improving the flatness of the display panel 20 and ultimately enhancing its light and shadow effects.

[0157] The structure of the display module 200 has been described in detail above. The structure of several support members 10 will be described below with reference to the relevant attached figures.

[0158] Figure 10b yes Figure 10a The diagram shows a partial structural schematic of the support member 10 in another embodiment.

[0159] like Figure 10b As shown, in this embodiment, the support member 10 and Figure 10a The structure of the support member 10 is largely the same as that of the other two, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may further include a first intermediate layer 18. The first intermediate layer 18 may be stacked between the non-metallic layer 14 and the first metallic layer 15. The thickness of the first intermediate layer 18 may be less than the thickness of the first metallic layer 15. For example, the thickness of the first intermediate layer 18 may be less than or equal to 30 micrometers. For instance, the thickness of the first intermediate layer 18 may be 10 micrometers, 12 micrometers, 15 micrometers, 18 micrometers, 25 micrometers, or 30 micrometers. In this embodiment, the thickness of the first intermediate layer 18 may be equal to 10 micrometers.

[0160] For example, the first intermediate layer 18 can be made of a material with a low elastic modulus. The first intermediate layer 18 can be made of a polymer material, such as epoxy resin, thermoplastic polyurethane (TPU), silicone, etc. The elastic modulus of the first intermediate layer 18 can be less than the elastic modulus of the non-metallic layer 14. For example, the elastic modulus of the first intermediate layer 18 can be in the range of 10 MPa to 5 GPa. It should be noted that an elastic modulus in the range of 10 MPa to 5 GPa can mean an elastic modulus greater than or equal to 10 MPa and less than or equal to 5 GPa. Unless otherwise specified below, the range n1 to n2 includes both n1 and n2 values.

[0161] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, and the non-metallic layer 14 can be integrally molded. For example, the first metal layer 15, the first intermediate layer 18, and the non-metallic layer 14 can be integrally molded by hot pressing or other methods. In this way, the connection reliability of the first metal layer 15, the first intermediate layer 18, and the non-metallic layer 14 can be improved, which is beneficial to improving the structural stability of the support member 10.

[0162] Understandably, the non-metallic layer of typical support components usually uses fiber materials or fiber composites to improve the structural strength of the support component while reducing its weight. However, this results in a noticeable fiber texture on the surface of the non-metallic layer. When the first metal layer is stacked on top of the non-metallic layer, the fiber texture of the non-metallic layer will be visible on the surface of the first metal layer facing the display panel, thus affecting the surface flatness of the first metal layer and consequently the surface flatness of the support component. When the support component is connected to the display panel, it will affect the lighting and shadow effects of the display panel, resulting in poor lighting and shadow effects for the display module.

[0163] In this embodiment, a first intermediate layer 18 is provided between the first metal layer 15 and the non-metal layer 14. The elastic modulus of the first intermediate layer 18 is less than that of the non-metal layer 14, which can better cover the fiber texture of the non-metal layer 14 and prevent the fiber texture of the non-metal layer 14 from appearing on the surface of the first metal layer 15 facing the display panel 20 (i.e., the first surface 15a in this embodiment). This ensures the surface flatness of the first metal layer 15, resulting in a better surface flatness of the support member 10. When the support member 10 is connected to the display panel 20, the support member 10 will not affect the light and shadow effect of the display panel 20.

[0164] Secondly, compared to conventional support components where the first metal layer and non-metal layer are bonded together with an adhesive layer to improve the reliability of the connection between them, the adhesive layer is typically thicker and has a higher elastic modulus to ensure the bonding stability between the first metal layer, non-metal layer, and adhesive layer. This is not conducive to the thinning of the support component and also reduces its bending performance, making it difficult for the support component to bend along a predetermined trajectory.

[0165] In this embodiment, the support member 10 has a first intermediate layer 18 between the first metal layer 15 and the non-metal layer 14. During the hot pressing process of the first intermediate layer 18, the first metal layer 15, and the non-metal layer 14, the first intermediate layer 18 can serve as a transition material between the first metal layer 15 and the non-metal layer 14. The connection reliability between the first intermediate layer 18 and the first metal layer 15 is good, and the connection reliability between the first intermediate layer 18 and the non-metal layer 14 is also good. This increases the connection reliability between the first metal layer 15 and the non-metal layer 14, thereby enhancing the structural stability of the support member 10. This makes it less prone to delamination during bending, which helps extend the service life of the support member 10. Thus, the thickness and elastic modulus of the first intermediate layer 18 are both small, which allows for both increased structural stability and a thinner profile of the support member 10, making it less prone to delamination during bending and allowing the support member 10 to bend along a preset trajectory. In other words, the support member 10 in this embodiment can balance a thin profile and structural stability.

[0166] Figure 11 yes Figure 10a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated. Figure 12a yes Figure 11 The structural schematic diagram of the support member 10 shown from another perspective.

[0167] like Figure 11 and Figure 12a As shown, in this embodiment, the support member 10 and Figure 10a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the non-metallic layer 14 along the second direction Z. In this case, the first metal layer 15 may cover the first hole 122a.

[0168] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), the first hole 122a can penetrate the support member 10 (e.g., ...). Figure 12a (As shown). It should be understood that... Figure 12a The first hole 122a, which is covered by the first surface 15a of the first metal layer 15, is shown by the dashed line.

[0169] It should be noted that, in this embodiment, any hole penetrating the non-metallic layer 14 along the second direction Z can mean that the hole penetrates the surface of the non-metallic layer 14 facing the first metal layer 15 and also penetrates the surface of the non-metallic layer 14 facing away from the first metal layer 15. In other words, the hole can connect the surfaces of the non-metallic layer 14 facing the first metal layer 15 and also connect the surfaces of the non-metallic layer 14 facing away from the first metal layer 15. Unless otherwise specified below, any hole penetrating the non-metallic layer 14 can be understood in the same way. In other embodiments, the first hole 122a may not penetrate the non-metallic layer 14 in the width direction of the electronic device 1000.

[0170] Exemplarily, the support member 10 may further include a first filler layer 16. The first filler layer 16 may fill at least a portion of the first hole 122a. In this embodiment, the first filler layer 16 may completely fill the first hole 122a. The first metal layer 15 may connect to the first filler layer 16. The first filler layer 16 may be made of a material with a low elastic modulus, such as thermoplastic polyurethanes (TPU), thermoplastic elastomers (TPE), UV adhesives, epoxy resins, and rubber. The elastic modulus of the first filler layer 16 may be less than the elastic modulus of the non-metallic layer 14. The elastic modulus of the first filler layer 16 may be in the range of 1 MPa to 5 GPa. It should be noted that an elastic modulus in the range of 1 MPa to 5 GPa may refer to an elastic modulus greater than or equal to 1 MPa and less than or equal to 5 GPa. Unless otherwise specified below, the range n1 to n2 includes both n1 and n2 values.

[0171] For example, the support member 10 can be a one-piece molded structure, that is, the first metal layer 15, the non-metal layer 14, and the first filler layer 16 can be integrally molded. For example, the first metal layer 15, the non-metal layer 14, and the first filler layer 16 can be integrally molded by hot pressing or other methods. In this way, on the one hand, no adhesive layer is needed between the first metal layer 15, the non-metal layer 14, and the first filler layer 16, thereby reducing the thickness of the support member 10 and facilitating a thinner design of the support member 10; on the other hand, it can also improve the connection stability between the first metal layer 15, the non-metal layer 14, and the first filler layer 16, which is beneficial to improving the structural strength of the support member 10. In other words, the support member 10 in this embodiment can balance thinness and structural strength.

[0172] Understandably, to reduce the elastic modulus of the bending portion of a typical display module and allow the display module to bend along a predetermined trajectory, the support component usually incorporates multiple through holes (such as...). Figure 5a and Figure 5b(As shown). Multiple through holes penetrate the support member along the second direction Z. However, this reduces the flatness of the support member's surface facing the display body. When the support member is connected to the display body of the display panel, it affects the light and shadow effect of the display panel, resulting in poor light and shadow effects of the display module. In this case, the display panel of a typical display module usually needs to have an additional back film or other support structure on the non-display side of the display body layer to avoid the support member affecting the light and shadow effect of the display body layer. At the same time, a typical display module also needs to have an additional adhesive layer so that the back film can be fixedly connected to the support member. That is, a typical display module needs to set a support member, a back film, and an adhesive layer between the support member and the back film to simultaneously achieve the support of the display module and the bending function of the display module. However, this results in a larger number of display module layers, greater thickness, and a more complex structure. When the display module is folded, the different layers of the display module are prone to peeling, resulting in poor structural reliability of the display module.

[0173] In this embodiment, the support member 10 of the display module 200 includes a non-metallic layer 14 and a first metal layer 15 stacked together. On one hand, the non-metallic layer 14 uses a non-metallic material, which has a low density and low modulus of elasticity. The first metal layer 15 uses a metallic material, which has a high density and good rigidity. Thus, the support member 10 can better support the display panel 20 while also achieving a lightweight and thin design. On the other hand, the inner bending portion 122 of the support member 10 may also have a first hole 122a. The first hole 122a may be spaced apart from the surface of the first metal layer 15 facing away from the non-metallic layer 14 (i.e., the first surface 15a in this embodiment). Thus, by providing the first hole 122a in the inner bending portion 122, the modulus of elasticity of the inner bending portion 122 is reduced, making the modulus of elasticity of the inner bending portion 122 of the support member 10 less than the modulus of elasticity ... The elastic modulus of the bent portion 12 of the support member 10 is less than that of the first straight portion 11 and less than that of the second straight portion 13, thus allowing the support member 10 to bend according to a preset bending trajectory. On the other hand, the first hole 122a and the first surface 15a of the first metal layer 15 are spaced apart, making the first surface 15a of the first metal layer 15 relatively flat, which helps ensure the surface flatness of the first surface 15a and the light and shadow effect of the display panel 20. That is, the support member 10 in this embodiment can simultaneously support the display module 200 and enable the bending function of the display module 200 while also ensuring the light and shadow effect of the display panel 20. Furthermore, compared to a typical display module, the display module 200 in this embodiment reduces the amount of back film and the adhesive layer between the back film and the support member, thereby effectively reducing the number of layers in the display module 200, thinning the overall thickness of the display module 200, and effectively avoiding the problem of peeling between different layers when the display module 200 is folded, which helps ensure the structural reliability of the display module 200. In other words, the support member 10 in this embodiment can replace the back film, support member, and adhesive layer between the back film and support member in a general display module, thereby supporting the display panel 20 while also achieving a thinner display module 200.

[0174] Secondly, the support member 10 in this embodiment may further include a first filling layer 16. The first filling layer 16 fills the first hole 122a. The elastic modulus of the first filling layer 16 is less than the elastic modulus of the non-metallic layer 14. In this way, on the one hand, the first filling layer 16 can improve the structural strength of the non-metallic layer 14, thereby preventing damage to the support member 10 and thus increasing the service life of the support member 10; on the other hand, the elastic modulus of the first filling layer 16 is less than the elastic modulus of the non-metallic layer 14, so that after the first filling layer 16 is filled into the first hole 122a, the elastic modulus of the inner bending portion 122 can still be less than the elastic modulus of the first outer bending portion 121 and the second outer bending portion 123, so that the support member 10 can bend better according to the preset bending trajectory. In other words, by filling the first hole 122a with a first filling layer 16 with a smaller elastic modulus, the support member 10 can balance structural strength and bending performance.

[0175] In some embodiments, the first hole 122a may not penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. Figure 12b As shown, Figure 12b yes Figure 12a The diagram shows a structural schematic of the support member 10 in another embodiment. In this case, the first hole 122a can be isolated from the external space of the support member 10 in the width direction of the electronic device 1000.

[0176] In some embodiments, the first hole 122a may not penetrate the non-metallic layer 14 along the second direction Z. For example, the first hole 122a may not penetrate the surface of the non-metallic layer 14 facing the first metallic layer 15 along the second direction Z.

[0177] In some embodiments, the first hole 122a may also partially penetrate the first metal layer 15 along the second direction Z. For example, the first hole 122a may also penetrate the surface of the first metal layer 15 toward the non-metal layer 14 along the second direction Z.

[0178] In some embodiments, the support 10 may not include the first filler layer 16.

[0179] Figure 12c yes Figure 11 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0180] like Figure 12c As shown, in this embodiment, the support member 10 and Figure 11The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may further include a first intermediate layer 18. The first intermediate layer 18 may be stacked between the non-metallic layer 14 and the first metallic layer 15. In this case, the first intermediate layer 18 may cover the first hole 122a. The projection of the first metallic layer 15 along the second direction Z onto the plane containing the non-metallic layer 14 may cover the first hole 122a.

[0181] For example, the thickness of the first intermediate layer 18 can be less than the thickness of the first metal layer 15. The thickness of the first intermediate layer 18 can be less than or equal to 30 micrometers. In this embodiment, the thickness of the first intermediate layer 18 can be equal to 10 micrometers.

[0182] Exemplarily, the first intermediate layer 18 may be connected to the first filler layer 16. The elastic modulus of the first intermediate layer 18 may be less than or equal to the elastic modulus of the first filler layer 16. The first intermediate layer 18 may be made of a material with a low elastic modulus. The first intermediate layer 18 may be made of a polymer material, such as epoxy resin, thermoplastic polyurethane (TPU), silicone, etc. Exemplarily, the elastic modulus of the first intermediate layer 18 may be in the range of 10 MPa to 5 GPa.

[0183] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, and the non-metallic layer 14 can be integrally molded. For instance, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, and the non-metallic layer 14 can be integrally molded by hot pressing or other methods. This can improve the connection reliability of the first metal layer 15, the first intermediate layer 18, and the non-metallic layer 14, thereby improving the structural stability of the support member 10.

[0184] For example, the material of the first intermediate layer 18 can be the same as the material of the first filler layer 16. For instance, both the first intermediate layer 18 and the first filler layer 16 can be made of epoxy resin. In this way, when the first metal layer 15, the first intermediate layer 18, the first filler layer 16, and the non-metallic layer 14 are hot-pressed, the first intermediate layer 18 and the first filler layer 16 can be better connected together, thereby improving the connection reliability of the first metal layer 15, the first intermediate layer 18, the first filler layer 16, and the non-metallic layer 14, and thus improving the structural stability of the support member 10.

[0185] In other embodiments, the first intermediate layer 18 may not be connected to the first filler layer 16.

[0186] Figure 12d yes Figure 10bThe diagram shows a cross-sectional structure of the support member in another embodiment.

[0187] like Figure 12d As shown, in this embodiment, the support member 10 and Figure 10b The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the non-metallic layer 14 and the first intermediate layer 18 along the second direction Z. In this case, the first metal layer 15 may cover the first hole 122a.

[0188] For example, the first hole 122a may penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. In some embodiments, the first hole 122a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0189] It is understood that in this embodiment, the support member 10 may have a first hole 122a. The first hole 122a may penetrate the non-metallic layer 14 along the second direction Z. The first hole 122a may be located in the inner bend portion 122. In this way, the elastic modulus of the inner bend portion 122 of the support member 10 may be less than the elastic modulus of the first outer bend portion 121 and less than the elastic modulus of the second outer bend portion 123. The elastic modulus of the bend portion 12 of the support member 10 may be less than the elastic modulus of the first straight portion 11 and less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0190] Figure 13 yes Figure 11 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated. Figure 14a yes Figure 13 The structural schematic diagram of the support member 10 shown from another perspective.

[0191] like Figure 13 and Figure 14a As shown, in this embodiment, the support member 10 and Figure 11The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121 and the second outer bend 123 of the support member 10 may each have a second hole 121a and a third hole 123a. Both the second hole 121a and the third hole 123a may be spaced apart from the first surface 15a of the first metal layer 15. Both the second hole 121a and the third hole 123a may connect to the first hole 122a. Exemplarily, both the second hole 121a and the third hole 123a may penetrate the non-metallic layer 14 along the second direction Z. In this case, the first metal layer 15 may cover the second hole 121a and the third hole 123a.

[0192] For example, in the width direction (e.g., the Y-axis direction) of the electronic device 1000, both the second hole 121a and the third hole 123a can penetrate the support member 10 (e.g., ...). Figure 14a (As shown). It should be understood that... Figure 14a The second hole 121a and the third hole 123a, which are obscured by the first surface 15a of the first metal layer 15, are illustrated by dashed lines. Exemplarily, the first filling layer 16 may also fill at least a portion of the second hole 121a and at least a portion of the third hole 123a. In this embodiment, the first filling layer 16 may completely fill the second hole 121a and the third hole 123a.

[0193] It is understood that in this embodiment, by providing a second hole 121a and a third hole 123a in the first outer bend portion 121 and the second outer bend portion 123 of the support member 10 respectively, the elastic modulus of the first outer bend portion 121 and the second outer bend portion 123 is reduced, so that the elastic modulus of the first outer bend portion 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11, and the elastic modulus of the second outer bend portion 123 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0194] Secondly, the support member 10 in this embodiment may further include a first filling layer 16. The first filling layer 16 fills the first hole 122a, the second hole 121a, and the third hole 123a. The elastic modulus of the first filling layer 16 is less than the elastic modulus of the non-metallic layer 14. In this way, on the one hand, the first filling layer 16 can improve the structural strength of the non-metallic layer 14, thereby preventing damage to the support member 10 and thus increasing the service life of the support member 10; on the other hand, the elastic modulus of the first filling layer 16 is less than the elastic modulus of the non-metallic layer 14, so that after the first filling layer 16 is filled into the first hole 122a, the elastic modulus of the inner bending portion 122 can still be less than or equal to the elastic modulus of the first outer bending portion 121 and the second outer bending portion 123, and the elastic modulus of the bending portion 12 can still be less than the elastic modulus of the first straight portion 11 and the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory. In other words, in this embodiment, by filling the first hole 122a, the second hole 121a and the third hole 123a with a first filling layer 16 with a small elastic modulus, the support member 10 can take into account both structural strength and bending performance.

[0195] In some embodiments, the first filling layer 16 in the first hole 122a and the second hole 121a may also be filled with fillers of different elastic moduli, so that the elastic modulus of the inner bending portion 122 can be less than the elastic modulus of the first outer bending portion 121, so that the support member 10 can be bent better according to the preset bending trajectory.

[0196] In some embodiments, the second hole 121a may not penetrate the non-metallic layer 14 along the second direction Z. For example, the second hole 121a may not penetrate the surface of the non-metallic layer 14 facing the first metallic layer 15 along the second direction Z.

[0197] In some embodiments, the second hole 121a may also partially penetrate the first metal layer 15 along the second direction Z. For example, the second hole 121a may penetrate the surface of the first metal layer 15 toward the non-metal layer 14 along the second direction Z.

[0198] In other embodiments, the second hole 121a may not penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. Figure 14b As shown, Figure 14b yes Figure 14a The diagram shows a structural schematic of the support member 10 in another embodiment. In this case, the second hole 121a can be isolated from the external space of the support member 10 in the width direction of the electronic device 1000.

[0199] In some embodiments, the support member 10 may not have a third hole 123a. In this case, the first filling layer 16 may only fill the second hole 121a. The elastic modulus of the inner bend 122 may be less than or equal to the elastic modulus of the first outer bend 121, and may be less than the elastic modulus of the second outer bend 123.

[0200] In some embodiments, the support 10 may not include the first filler layer 16.

[0201] Figure 15a yes Figure 10a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated. Figure 15b yes Figure 15a The structural schematic diagram of the support member 10 shown from another perspective.

[0202] like Figure 15a and Figure 15b As shown, in this embodiment, the support member 10 and Figure 10a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the inner bend 122 of the support member 10 may have a plurality of arrayed first through holes 122b. The plurality of first through holes 122b may be arrayed along the length direction (e.g., the X-axis direction) and width direction (e.g., the Y-axis direction) of the support member 10. Each of the plurality of first through holes 122b may be spaced apart from the first surface 15a of the first metal layer 15. For example, each of the plurality of first through holes 122b may penetrate the non-metallic layer 14 along the second direction Z. In this case, the first metal layer 15 may cover the plurality of first through holes 122b. For ease of understanding, Figure 15b The first through hole 122b is schematically marked with dashed lines in the accompanying drawings and subsequent parts.

[0203] Understandably, in this embodiment, by providing multiple first through holes 122b in the inner bending portion 122 of the support member 10, the elastic modulus of the inner bending portion 122 is reduced, so that the elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first outer bending portion 121, and can be less than the elastic modulus of the second outer bending portion 123. The elastic modulus of the bending portion 12 of the support member 10 can be less than the elastic modulus of the first straight portion 11, and can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0204] In some embodiments, the support member 10 may further include a second filler layer (not shown). The second filler layer may fill the plurality of first through holes 122b. The elastic modulus of the second filler layer may be less than the elastic modulus of the non-metallic layer 14. In this way, on the one hand, the second filler layer can improve the structural strength of the non-metallic layer 14, thereby preventing damage to the support member 10 and thus improving the service life of the support member 10; on the other hand, the elastic modulus of the second filler layer is less than the elastic modulus of the non-metallic layer 14, so that after the second filler layer is filled into the plurality of first through holes 122b, the elastic modulus of the inner bending portion 122 can still be less than the elastic modulus of the first outer bending portion 121 and the second outer bending portion 123, so that the support member 10 can bend better according to the preset bending trajectory. In other words, in this embodiment, by filling the plurality of first through holes 122b with a second filler layer with a smaller elastic modulus, the support member 10 can balance structural strength and bending performance.

[0205] In some embodiments, multiple first through holes 122b can also penetrate the support member 10 along its width direction (e.g., the Y-axis direction). Figure 15c As shown, Figure 15c yes Figure 15b The diagram shows a structural schematic of another embodiment. In this embodiment, each of the multiple first through holes 122b can be an elongated groove. The multiple first through holes 122b can be arranged in an array along the first direction X.

[0206] In some embodiments, the plurality of first through holes 122b along the second direction Z may not penetrate the non-metallic layer 14. For example, the plurality of first through holes 122b along the second direction Z may not penetrate the surface of the non-metallic layer 14 toward the first metallic layer 15.

[0207] In some embodiments, the plurality of first through holes 122b may also partially penetrate the first metal layer 15 along the second direction Z. For example, the plurality of first through holes 122b may all penetrate the surface of the first metal layer 15 toward the non-metal layer 14 along the second direction Z.

[0208] Figure 16 yes Figure 11 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0209] like Figure 16 As shown, in this embodiment, the support member 10 and Figure 11The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121 and the second outer bend 123 of the support member 10 may each have a plurality of arrayed second through holes 121b and a plurality of arrayed third through holes 123b. Both the plurality of second through holes 121b and the plurality of third through holes 123b can be arrayed along the length direction (e.g., the X-axis direction) and width direction (e.g., the Y-axis direction) of the support member 10. Both the plurality of second through holes 121b and the plurality of third through holes 123b can penetrate the non-metallic layer 14 along the second direction Z. The first metal layer 15 can cover the plurality of second through holes 121b and the plurality of third through holes 123b. The size and density of the plurality of second through holes 121b and the plurality of third through holes 123b can be the same.

[0210] It is understood that in this embodiment, by providing multiple second through holes 121b and multiple third through holes 123b in the first outer bend 121 and the second outer bend 123 of the support member 10, the elastic modulus of the first outer bend 121 and the second outer bend 123 is reduced, so that the elastic modulus of the inner bend 122 of the support member 10 can be less than or equal to the elastic modulus of the first outer bend 121, and can be less than or equal to the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0211] In some embodiments, the support member 10 may further include a second filler layer (not shown). The second filler layer may fill the plurality of second through holes 121b and / or the plurality of third through holes 123b. This can improve the structural strength of the support member 10.

[0212] In some embodiments, the size and density of the plurality of second through holes 121b and the plurality of third through holes 123b of the support member 10 may also be different. In this case, the elastic modulus of the first outer bend 121 of the support member 10 may be different from the elastic modulus of the second outer bend 123.

[0213] In some embodiments, the plurality of second through holes 121b and the plurality of third through holes 123b can also penetrate the support member 10 along the width direction (e.g., the Y-axis direction). In this case, the plurality of second through holes 121b and the plurality of third through holes 123b can all be elongated grooves. The plurality of second through holes 121b and the plurality of third through holes 123b can be arranged in an array along the first direction X.

[0214] In some embodiments, the second via 121b may not penetrate the non-metallic layer 14 along the second direction Z. For example, the second via 121b may not penetrate the surface of the non-metallic layer 14 facing the metallic layer along the second direction Z.

[0215] In some embodiments, the plurality of second through holes 121b of the support member 10 may also penetrate a portion of the first metal layer 15. For example, the plurality of second through holes 121b of the support member 10 may penetrate the surface of the first metal layer 15 toward the non-metal layer 14.

[0216] In some embodiments, the support member 10 may not include the third through hole 123b. In this case, the elastic modulus of the inner bend 122 of the support member 10 may be less than or equal to the elastic modulus of the first outer bend 121, and may be less than the elastic modulus of the second outer bend 123.

[0217] Figure 17a yes Figure 10a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0218] like Figure 17a As shown, in this embodiment, the support member 10 and Figure 10a The structure of the support member 10 shown is largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may also have a second metal layer 17. The second metal layer 17 can be stacked on the side of the non-metallic layer 14 facing away from the first metal layer 15. In this case, the first metal layer 15 and the second metal layer 17 can be located on opposite sides of the non-metallic layer 14 along the second direction Z. The second metal layer 17 can be made of a metallic material, such as stainless steel or copper. The thickness of the second metal layer 17 can be less than or equal to 50 micrometers. For example, the thickness of the second metal layer 17 can be 15 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, or 50 micrometers. In this embodiment, the thickness of the second metal layer 17 can be equal to 20 micrometers.

[0219] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the non-metal layer 14, and the second metal layer 17 can be integrally molded. For example, the first metal layer 15, the non-metal layer 14, and the second metal layer 17 can be integrally molded by hot pressing or other methods. In this way, on the one hand, no adhesive layer is needed between the first metal layer 15, the non-metal layer 14, and the second metal layer 17, thereby reducing the thickness of the support member 10 and facilitating a thinner design of the support member 10; on the other hand, it can also improve the connection stability between the first metal layer 15, the non-metal layer 14, and the second metal layer 17, which is beneficial to improving the structural strength of the support member 10. In other words, the support member 10 in this embodiment can balance thinness and structural strength.

[0220] It is understandable that, compared to support members made of non-metallic materials, the lower stiffness of non-metallic materials necessitates a greater thickness to ensure structural strength. In other words, this type of support member cannot simultaneously achieve a thin profile and structural strength. However, the support member 10 in this embodiment may further include a second metallic layer 17 stacked on top of the non-metallic layer 14. Metallic materials have greater stiffness than non-metallic materials. Thus, under the same structural strength conditions, the support member 10 in this embodiment is thinner. That is, the support member 10 in this embodiment can maintain its structural strength while achieving a thin profile.

[0221] Secondly, the first metal layer 15 and the second metal layer 17 are disposed on opposite sides of the non-metallic layer 14 along the second direction Z. This facilitates the hot-pressing integral molding of the support member 10, helps ensure the connection stability between the layers of the support member 10, and ensures the structural stability of the support member 10.

[0222] Figure 17b yes Figure 17a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0223] like Figure 17b As shown, in this embodiment, the support member 10 and Figure 17a The structure of the support member 10 shown is largely the same, and the similarities will not be repeated. The main differences between the two are described below. In this embodiment, the support member 10 may further include a first intermediate layer 18. The first intermediate layer 18 may be stacked between the non-metallic layer 14 and the first metallic layer 15. The thickness of the first intermediate layer 18 may be less than the thickness of the first metallic layer 15. The thickness of the first intermediate layer 18 may be less than or equal to 30 micrometers. The first intermediate layer 18 may be made of a material with a low elastic modulus. The elastic modulus of the first intermediate layer 18 may be less than the elastic modulus of the non-metallic layer 14. The elastic modulus of the first intermediate layer 18 may be in the range of 10 MPa to 5 GPa.

[0224] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, and the second metal layer 17 can be integrally molded. For example, the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, and the second metal layer 17 can be integrally molded by hot pressing or other methods. In this way, the connection reliability of the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, and the second metal layer 17 can be improved, which is beneficial to improving the structural stability of the support member 10.

[0225] Figure 17c yes Figure 17b The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0226] like Figure 17b As shown, in this embodiment, the support member 10 and Figure 17b The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may further include a second intermediate layer 19. The second intermediate layer 19 may be stacked between the non-metallic layer 14 and the second metallic layer 17. The thickness of the second intermediate layer 19 may be less than the thickness of the second metallic layer 17. For example, the thickness of the second intermediate layer 19 may be less than or equal to 30 micrometers. For instance, the thickness of the second intermediate layer 19 may be 10 micrometers, 12 micrometers, 15 micrometers, 18 micrometers, 25 micrometers, or 30 micrometers. In this embodiment, the thickness of the second intermediate layer 19 may be equal to 10 micrometers.

[0227] For example, the second intermediate layer 19 can be made of a material with a low elastic modulus. The second intermediate layer 19 can be made of a polymer material, such as epoxy resin, thermoplastic polyurethane (TPU), silicone, etc. The elastic modulus of the second intermediate layer 19 can be lower than that of the non-metallic layer 14. The elastic modulus of the second intermediate layer 19 can be in the range of 10 MPa to 5 GPa.

[0228] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded. For instance, the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded by hot pressing or other methods. This can improve the connection reliability of the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17, which is beneficial to improving the structural stability of the support member 10.

[0229] Understandably, the non-metallic layer of a typical support is usually made of fiber material or fiber composite material to improve the structural strength of the support while reducing its weight. However, this results in a more obvious fiber texture on the surface of the non-metallic layer. When the second metal layer is stacked on top of the non-metallic layer, the fiber texture of the non-metallic layer will appear on the surface of the second metal layer facing away from the non-metallic layer, thus affecting the surface flatness of the second metal layer.

[0230] In this embodiment, a second intermediate layer 19 is provided between the non-metallic layer 14 and the second metal layer 17. The elastic modulus of the second intermediate layer 19 is less than that of the non-metallic layer 14, which can better cover the fiber texture of the non-metallic layer 14 and prevent the fiber texture of the non-metallic layer 14 from appearing on the surface of the second metal layer 17 facing away from the non-metallic layer 14. This ensures the surface flatness of the second metal layer 17 and makes the surface flatness of the support member 10 better.

[0231] Secondly, compared to the conventional method of bonding the non-metallic layer and the second metal layer of a support component using an adhesive layer to improve the reliability of the connection between the non-metallic layer and the second metal layer, the adhesive layer is usually thicker and has a larger elastic modulus in order to ensure the bonding stability between the non-metallic layer, the second metal layer, and the adhesive layer. This is not conducive to the thinning of the support component and also reduces the bending performance of the support component, making it difficult for the support component to bend along a preset trajectory.

[0232] In this embodiment, the support member 10 has a second intermediate layer 19 between the non-metallic layer 14 and the second metal layer 17. During the hot pressing process of the second intermediate layer 19, the second metal layer 17, the non-metallic layer 14, the first intermediate layer 18, and the first metal layer 15, the second intermediate layer 19 can serve as a transition material between the second metal layer 17 and the non-metallic layer 14. The connection reliability between the second intermediate layer 19 and the second metal layer 17 is good, and the connection reliability between the second intermediate layer 19 and the non-metallic layer 14 is also good. This can increase the connection reliability between the second metal layer 17 and the non-metallic layer 14, thereby enhancing the structural stability of the support member 10. This makes it less likely for the support member 10 to delaminate during bending, which is beneficial to extending the service life of the support member 10.

[0233] In this way, the thickness and elastic modulus of the second intermediate layer 19 are both relatively small, thereby increasing the structural stability of the support member 10 while also ensuring its thinness. This also prevents the support member 10 from delaminating during bending, allowing it to bend along a predetermined trajectory. In other words, the support member 10 in this embodiment achieves both a thin profile and structural stability.

[0234] Figure 18a yes Figure 17a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0235] like Figure 18a As shown, in this embodiment, the support member 10 and Figure 17aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the non-metallic layer 14 along the second direction Z. In this case, both the first metal layer 15 and the second metal layer 17 may cover the first hole 122a.

[0236] For example, the first hole 122a may penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. In some embodiments, the first hole 122a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0237] Exemplarily, the support member 10 may further include a first filler layer 16. The first filler layer 16 may fill at least a portion of the first hole 122a. In this embodiment, the first filler layer 16 may completely fill the first hole 122a. The elastic modulus of the first filler layer 16 may be less than the elastic modulus of the non-metallic layer 14. In this case, both the first metallic layer 15 and the second metallic layer 17 may be connected to the first filler layer 16.

[0238] Understandably, in this embodiment, the support member 10 may have a first hole 122a. The first hole 122a may penetrate the non-metallic layer 14 along the second direction Z. The first hole 122a may be located in the inner bend portion 122. The first filling layer 16 may fill the first hole 122a. In this way, the elastic modulus of the inner bend portion 122 of the support member 10 may be less than the elastic modulus of the first outer bend portion 121 and less than the elastic modulus of the second outer bend portion 123. The elastic modulus of the bend portion 12 of the support member 10 may be less than the elastic modulus of the first straight portion 11 and less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0239] Secondly, the support member 10 in this embodiment may further include a second metal layer 17. The first metal layer 15 and the second metal layer 17 may be located on opposite sides of the non-metallic layer 14 along the second direction Z. This facilitates the hot-pressing integral molding of the support member 10, helps ensure the connection stability between the layers of the support member 10, and ensures the structural stability of the support member 10.

[0240] Figure 18b yes Figure 18a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0241] like Figure 18b As shown, in this embodiment, the support member 10 and Figure 18aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the support member 10 may further include a first intermediate layer 18 and a second intermediate layer 19. The first intermediate layer 18 may be stacked between the non-metallic layer 14 and the first metallic layer 15. The second intermediate layer 19 may be stacked between the non-metallic layer 14 and the second metallic layer 17. In this case, the first intermediate layer 18 and the second intermediate layer 19 may be located on different sides of the first hole 122a, and both may cover the first hole 122a. The first metallic layer 15 and the second metallic layer 17 may also be located on different sides of the first hole 122a. The projections of the first metallic layer 15 and the second metallic layer 17 along the second direction Z onto the plane containing the non-metallic layer 14 may both cover the first hole 122a.

[0242] For example, the thickness of the first intermediate layer 18 may be less than the thickness of the first metal layer 15. The thickness of the first intermediate layer 18 may be less than or equal to 30 micrometers. The thickness of the second intermediate layer 19 may be less than the thickness of the second metal layer 17. The thickness of the second intermediate layer 19 may also be less than or equal to 30 micrometers.

[0243] Exemplarily, both the first intermediate layer 18 and the second intermediate layer 19 can be connected to the first filler layer 16. The elastic modulus of both the first intermediate layer 18 and the second intermediate layer 19 can be less than or equal to the elastic modulus of the first filler layer 16. Both the first intermediate layer 18 and the second intermediate layer 19 can be made of materials with low elastic modulus. Both the first intermediate layer 18 and the second intermediate layer 19 can be made of polymer materials, such as epoxy resin, thermoplastic polyurethane (TPU), silicone, etc. Exemplarily, the elastic modulus of both the first intermediate layer 18 and the second intermediate layer 19 can be in the range of 10 MPa to 5 GPa.

[0244] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded. For example, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded by hot pressing or other methods. In this way, the connection reliability of the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be improved, thereby improving the structural stability of the support member 10.

[0245] For example, the first intermediate layer 18, the first filler layer 16, and the second intermediate layer 19 can be made of the same material. For instance, the first intermediate layer 18, the first filler layer 16, and the second intermediate layer 19 can all be made of epoxy resin. In this way, when the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, the first filler layer 16, the second intermediate layer 19, and the second metal layer 17 are hot-pressed, the first intermediate layer 18, the first filler layer 16, and the second intermediate layer 19 can be better connected together, thereby improving the connection reliability between the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, the first filler layer 16, the second intermediate layer 19, and the second metal layer 17, and thus improving the structural stability of the support member 10.

[0246] In some implementations, the first filler layer 16 may not be connected to the first intermediate layer 18 and / or the second intermediate layer 19.

[0247] Figure 19a yes Figure 17a The cross-sectional structure of the support member 10 shown is illustrated in another embodiment.

[0248] like Figure 19a As shown, in this embodiment, the support member 10 and Figure 17a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the second metal layer 17 and the non-metal layer 14 along the second direction Z. In this case, the first metal layer 15 may cover the first hole 122a.

[0249] For example, the first hole 122a may penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. In some embodiments, the first hole 122a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0250] It is understood that in this embodiment, the support member 10 may have a first hole 122a. The first hole 122a may penetrate the second metal layer 17 and the non-metal layer 14 along the second direction Z. The first hole 122a may be located in the inner bend portion 122. In this way, the elastic modulus of the inner bend portion 122 of the support member 10 may be less than the elastic modulus of the first outer bend portion 121 and less than the elastic modulus of the second outer bend portion 123. The elastic modulus of the bend portion 12 of the support member 10 may be less than the elastic modulus of the first straight portion 11 and less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0251] Figure 19b yes Figure 19a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0252] like Figure 19b As shown, in this embodiment, the support member 10 and Figure 19a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the support member 10 may further include a first filling layer 16. The first filling layer 16 can fill the portion of the first hole 122a located in the non-metallic layer 14, and / or, the first filling layer 16 can fill the portion of the first hole 122a located in the second metallic layer 17. In this embodiment, the first filling layer 16 can completely fill the portion of the first hole 122a located in the non-metallic layer 14. The first filling layer 16 can be spaced apart from the second metallic layer 17. Thus, the elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first outer bending portion 121, and less than the elastic modulus of the second outer bending portion 123. The elastic modulus of the bending portion 12 of the support member 10 can be less than the elastic modulus of the first straight portion 11, and less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend better according to a preset bending trajectory.

[0253] In some embodiments, the size of the opening of the portion of the first hole 122a located in the second metal layer 17 may be different from the size of the opening of the portion of the first hole 122a located in the non-metallic layer 14. For example, the size of the opening of the portion of the first hole 122a located in the second metal layer 17 may be larger than the size of the opening of the first hole 122a located in the non-metallic layer 14.

[0254] Figure 20a yes Figure 19b The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0255] like Figure 20a As shown, in this embodiment, the support member 10 and Figure 19bThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121 and the second outer bend 123 of the support member 10 may each have a second hole 121a and a third hole 123a. Both the second hole 121a and the third hole 123a may be spaced apart from the first surface 15a of the first metal layer 15. Both the second hole 121a and the third hole 123a may connect to the first hole 122a. Exemplarily, both the second hole 121a and the third hole 123a may penetrate the second metal layer 17 along the second direction Z. In this case, the first metal layer 15 may cover the first hole 122a. The non-metallic layer 14 may cover the second hole 121a and the third hole 123a. The projection of the first metal layer 15 along the second direction Z onto the plane of the non-metallic layer 14 may cover the second hole 121a and the third hole 123a.

[0256] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), both the second hole 121a and the third hole 123a can penetrate the support member 10. In some embodiments, the second hole 121a and / or the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0257] It is understood that, in this embodiment, by providing a second hole 121a, a first hole 122a, and a third hole 123a in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10, respectively, the elastic modulus of the inner bend 122 of the support member 10 can be less than the elastic modulus of the first outer bend 121, and can be less than the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend more effectively according to the preset bending trajectory.

[0258] Figure 20b yes Figure 20a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0259] like Figure 20b As shown, in this embodiment, the support member 10 and Figure 20aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the support member 10 may further include a first intermediate layer 18 and a second intermediate layer 19. The first intermediate layer 18 may be stacked between the non-metallic layer 14 and the first metallic layer 15. The second intermediate layer 19 may be stacked between the non-metallic layer 14 and the second metallic layer 17. In this case, the first intermediate layer 18 and the second intermediate layer 19 may be located on different sides of the first hole 122a, and both may cover the first hole 122a. The projection of the first metallic layer 15 along the second direction Z onto the plane where the non-metallic layer 14 is located may cover the first hole 122a.

[0260] For example, the thickness of the first intermediate layer 18 may be less than the thickness of the first metal layer 15. The thickness of the first intermediate layer 18 may be less than or equal to 30 micrometers. The thickness of the second intermediate layer 19 may be less than the thickness of the second metal layer 17. The thickness of the second intermediate layer 19 may also be less than or equal to 30 micrometers.

[0261] Exemplarily, both the first intermediate layer 18 and the second intermediate layer 19 can be connected to the first filler layer 16. The elastic modulus of both the first intermediate layer 18 and the second intermediate layer 19 can be less than or equal to the elastic modulus of the first filler layer 16. Both the first intermediate layer 18 and the second intermediate layer 19 can be made of materials with low elastic modulus. Both the first intermediate layer 18 and the second intermediate layer 19 can be made of polymer materials, such as epoxy resin, thermoplastic polyurethane (TPU), silicone, etc. Exemplarily, the elastic modulus of both the first intermediate layer 18 and the second intermediate layer 19 can be in the range of 10 MPa to 5 GPa.

[0262] For example, the support member 10 can be a one-piece molded structure. That is, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded. For example, the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be integrally molded by hot pressing or other methods. In this way, the connection reliability of the first metal layer 15, the first intermediate layer 18, the first filler layer 16, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17 can be improved, thereby improving the structural stability of the support member 10.

[0263] In some implementations, the first filler layer 16 may not be connected to the first intermediate layer 18 and / or the second intermediate layer 19.

[0264] Figure 20c yes Figure 20b The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0265] like Figure 20c As shown, in this embodiment, the support member 10 and Figure 20b The structure of the support member 10 shown is largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first hole 122a can penetrate the second metal layer 17, the second intermediate layer 19, and the non-metallic layer 14 along the second direction Z. At this time, the first intermediate layer 18 can cover the first hole 122a. The projection of the first metal layer 15 along the second direction Z onto the plane of the non-metallic layer 14 can cover the first hole 122a. The first filling layer 16 can be spaced apart from the first metal layer 15, the non-metallic layer 14, the second intermediate layer 19, and the second metal layer 17. Exemplarily, the portion of the first hole 122a located in the second metal layer 17 and the second intermediate layer 19 can be formed by etching.

[0266] It is understood that, in this embodiment, by providing a second hole 121a, a first hole 122a, and a third hole 123a in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10, respectively, the elastic modulus of the inner bend 122 of the support member 10 can be less than the elastic modulus of the first outer bend 121, and can be less than the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend more effectively according to the preset bending trajectory.

[0267] Figure 20d yes Figure 17c The diagram shows a cross-sectional structure of the support member in another embodiment.

[0268] like Figure 20d As shown, in this embodiment, the support member 10 and Figure 17c The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the second metal layer 17, the second intermediate layer 19, the non-metallic layer 14, and the first intermediate layer 18 along the second direction Z. In this case, the first metal layer 15 may cover the first hole 122a.

[0269] Exemplarily, the first outward bend 121 and the second outward bend 123 of the support member 10 may each have a second hole 121a and a third hole 123a. Both the second hole 121a and the third hole 123a may be spaced apart from the first surface 15a of the first metal layer 15. Both the second hole 121a and the third hole 123a may communicate with the first hole 122a. Exemplarily, both the second hole 121a and the third hole 123a may penetrate the second metal layer 17 along the second direction Z. In this case, the second intermediate layer 19 may cover the second hole 121a and the third hole 123a. The projections of the first metal layer 15, the first intermediate layer 18, the non-metallic layer 14, and the second intermediate layer 19 along the second direction Z onto the plane of the second metal layer 17 may cover the second hole 121a and the third hole 123a.

[0270] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), both the second hole 121a and the third hole 123a can penetrate the support member 10. In some embodiments, the second hole 121a and / or the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0271] It is understood that, in this embodiment, by providing a second hole 121a, a first hole 122a, and a third hole 123a in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10, respectively, the elastic modulus of the inner bend 122 of the support member 10 can be less than the elastic modulus of the first outer bend 121, and can be less than the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend more effectively according to the preset bending trajectory.

[0272] Figure 21a yes Figure 17a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0273] like Figure 21a As shown, in this embodiment, the support member 10 and Figure 17aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the inner bend 122, the first outer bend 121, and the second outer bend 123 of the support member 10 may each have a first hole 122a, a second hole 121a, and a third hole 123a, respectively. Both the second hole 121a and the third hole 123a can connect to the first hole 122a. The first hole 122a, the second hole 121a, and the third hole 123a can all be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a, the second hole 121a, and the third hole 123a can all penetrate the second metal layer 17 and the non-metal layer 14 along the second direction Z. In this case, the first metal layer 15 can cover the first hole 122a, the second hole 121a, and the third hole 123a.

[0274] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), the first hole 122a, the second hole 121a, and the third hole 123a can all penetrate the support member 10. In some embodiments, one or more of the first hole 122a, the second hole 121a, and the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0275] It is understood that, in this embodiment, by providing a second hole 121a, a first hole 122a, and a third hole 123a in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10, respectively, the elastic modulus of the inner bend 122 of the support member 10 can be less than or equal to the elastic modulus of the first outer bend 121, and can be less than or equal to the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend more effectively according to the preset bending trajectory.

[0276] Figure 21b yes Figure 21a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0277] like Figure 21b As shown, in this embodiment, the support member 10 and Figure 21aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may further include a first filling layer 16. The first filling layer 16 can fill at least a portion of the first hole 122a, the second hole 121a, and the third hole 123a. In this embodiment, the first filling layer 16 can completely fill the portions of the first hole 122a, the second hole 121a, and the third hole 123a located in the non-metallic layer 14. The first filling layer 16 may be spaced apart from the second metallic layer 17.

[0278] In this way, the elastic modulus of the inner bending portion 122 of the support member 10 can be less than or equal to the elastic modulus of the first outer bending portion 121, and can be less than or equal to the elastic modulus of the second outer bending portion 123. The elastic modulus of the first outer bending portion 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bending portion 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0279] Figure 22 yes Figure 18a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0280] like Figure 22 As shown, in this embodiment, the support member 10 and Figure 18aThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10 may each have a plurality of arrayed second through holes 121b, a plurality of arrayed first through holes 122b, and a plurality of arrayed third through holes 123b. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be arrayed along the length direction (e.g., the X-axis direction) and the width direction (e.g., the Y-axis direction) of the support member 10. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be spaced apart from the first surface 15a of the first metal layer 15. The plurality of first through holes 122b can connect to the first hole 122a of the support member 10. For example, a plurality of second through holes 121b, a plurality of first through holes 122b, and a plurality of third through holes 123b can all penetrate the second metal layer 17 along the second direction Z. In this case, the projection of the first metal layer 15 along the second direction Z onto the plane of the non-metallic layer 14 can cover the plurality of first through holes 122b, the plurality of second through holes 121b, and the plurality of third through holes 123b. The non-metallic layer can cover the plurality of second through holes 121b and the plurality of third through holes 123b. The first filling layer 16 can cover the plurality of first through holes 122b.

[0281] It is understood that in this embodiment, by providing multiple second through holes 121b, multiple first through holes 122b, and multiple third through holes 123b in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10, the elastic modulus of the first outer bend 121, the inner bend 122, and the second outer bend 123 is reduced, so that the elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0282] For example, the dimensions and densities of the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be equal. In this case, the elastic modulus of the inner bend 122 can be less than the elastic modulus of the first outer bend 121, and can be less than the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 can be equal to the elastic modulus of the second outer bend 123.

[0283] In some embodiments, the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all penetrate the support member 10 along its width direction (e.g., the Y-axis direction). In this case, the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be elongated grooves. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can be arranged in an array along the first direction X.

[0284] In some embodiments, the support member 10 may further include a second filler layer (not shown). The second filler layer may fill a plurality of first through holes and / or a plurality of second through holes 121b and / or a plurality of third through holes 123b. This can improve the structural strength of the support member 10.

[0285] Figure 23a yes Figure 22 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated. Figure 23b yes Figure 22 The diagram shows a structural schematic of the support member 10 in another embodiment. For ease of understanding, Figure 23b The diagram uses dashed lines to schematically delineate multiple second through holes 121b, multiple first through holes 122b, and multiple third through holes 123b.

[0286] like Figure 23a and Figure 23b As shown, in this embodiment, the support member 10 and Figure 22 The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the opening size of the first through hole 122b can be larger than the opening size of the second through hole 121b, and / or, the density of the first through hole 122b can be greater than the density of the second through hole 121b. This further reduces the elastic modulus of the inner bending portion 122, allowing the support member 10 to bend better according to the preset bending trajectory.

[0287] Figure 24 yes Figure 19b The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0288] like Figure 24 As shown, in this embodiment, the support member 10 and Figure 19bThe structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121 and the second outer bend 123 of the support member 10 may each have a plurality of arrayed second through holes 121b and a plurality of arrayed third through holes 123b. Both the plurality of second through holes 121b and the plurality of third through holes 123b can be arrayed along the length direction (e.g., the X-axis direction) and width direction (e.g., the Y-axis direction) of the support member 10. Both the plurality of second through holes 121b and the plurality of third through holes 123b can be spaced apart from the first surface 15a of the first metal layer 15. For example, both the plurality of second through holes 121b and the plurality of third through holes 123b can penetrate the second metal layer 17 along the second direction Z. In this case, the non-metallic layer 14 can cover the plurality of second through holes 121b and the plurality of third through holes 123b. The projection of the first metal layer 15 along the second direction Z onto the plane containing the non-metal layer 14 can cover multiple second through holes 121b and multiple third through holes 123b. The dimensions and densities of the multiple second through holes 121b and the multiple third through holes 123b can all be the same.

[0289] It is understood that in this embodiment, by providing multiple second through holes 121b and multiple third through holes 123b in the first outer bend portion 121 and the second outer bend portion 123 of the support member 10, the elastic modulus of the first outer bend portion 121 and the second outer bend portion 123 is reduced, so that the elastic modulus of the first outer bend portion 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend portion 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0290] In some embodiments, the plurality of second through holes 121b and the plurality of third through holes 123b can also penetrate the support member 10 along the width direction (e.g., the Y-axis direction). In this case, the plurality of second through holes 121b and the plurality of third through holes 123b can all be elongated grooves. The plurality of second through holes 121b and the plurality of third through holes 123b can be arranged in an array along the first direction X.

[0291] In some embodiments, the support member 10 may further include a second filler layer (not shown). The second filler layer may fill a plurality of second through holes 121b and / or a plurality of third through holes 123b. The elastic modulus of the second filler layer may be less than the elastic modulus of the non-metallic layer 14. In this way, the structural strength of the support member 10 can be improved.

[0292] Figure 25 yes Figure 17a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0293] like Figure 25 As shown, in this embodiment, the support member 10 and Figure 17a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the inner bend 122 of the support member 10 may have a plurality of arrayed first through holes 122b. The plurality of first through holes 122b may be arrayed along the length direction (e.g., the X-axis direction) and width direction (e.g., the Y-axis direction) of the support member 10. The plurality of first through holes 122b may be spaced apart from the first surface 15a of the first metal layer 15. For example, the plurality of first through holes 122b may penetrate the non-metallic layer 14 along the second direction Z. In this case, the first metal layer 15 may cover the plurality of first through holes 122b.

[0294] Exemplarily, the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member may also have a second hole 121a, a first hole 122a, and a third hole 123a, respectively. The second hole 121a, the first hole 122a, and the third hole 123a may all be spaced apart from the first surface 15a of the first metal layer 15. The first hole 122a may connect to a plurality of first through holes 122b. Exemplarily, the second hole 121a, the first hole 122a, and the third hole 123a may all penetrate the second metal layer 17 along the second direction Z. In this case, the projection of the first metal layer 15 along the second direction Z onto the plane of the non-metallic layer 14 may cover the first hole 122a. The non-metallic layer 14 may cover the second hole 121a and the third hole 123a.

[0295] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), the second hole 121a, the first hole 122a, and the third hole 123a can all penetrate the support member 10. In some embodiments, one or more of the second hole 121a, the first hole 122a, and the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0296] It is understood that in this embodiment, by providing a first hole 122a and multiple first through holes 122b in the inner bending portion 122 of the support member 10, and providing a second hole 121a and a third hole 123a in the first outer bending portion 121 and the second outer bending portion 123 respectively, the elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first outer bending portion 121 and less than the elastic modulus of the second outer bending portion 123. The elastic modulus of the first outer bending portion 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bending portion 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend better according to the preset bending trajectory.

[0297] In some embodiments, the plurality of first through holes 122b can also penetrate the support member 10 along the width direction (e.g., the Y-axis direction). In this case, the plurality of first through holes 122b can all be elongated grooves. The plurality of first through holes 122b can be arranged in an array along the first direction X.

[0298] Figure 26 yes Figure 17a The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0299] like Figure 26 As shown, in this embodiment, the support member 10 and Figure 17a The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the non-metallic layer 14 may include multiple layers of fiber stacked together. The fiber bundles of adjacent fiber layers in the multiple fiber layers may be arranged at an angle. For example, the angle between the fiber bundles of adjacent fiber layers in the multiple fiber layers may be 90°, that is, the fiber bundles of adjacent fiber layers in the multiple fiber layers may be perpendicular to each other. This can improve the structural strength of the non-metallic layer 14 of the support member 10, and thus improve the structural strength of the support member 10.

[0300] For example, the non-metallic layer 14 may include three stacked fiber layers. For instance, the non-metallic layer 14 may include a first non-metallic layer 141, a second non-metallic layer 142, and a third non-metallic layer 143 stacked along the second direction Z. The second non-metallic layer 142 may be fixedly connected between the first non-metallic layer 141 and the third non-metallic layer 143. The thickness of both the first non-metallic layer 141 and the third non-metallic layer 143 may be less than or equal to 50 micrometers. The thickness of the second non-metallic layer 142 may be less than or equal to 150 micrometers. In this embodiment, the thickness of both the first non-metallic layer 141 and the third non-metallic layer 143 may be 15 micrometers. In this embodiment, the thickness of the third non-metallic layer 143 may be equal to 50 micrometers.

[0301] For example, the fiber bundles of the first non-metallic layer 141 and the third non-metallic layer 143 can be parallel in direction. The fiber bundles of the first non-metallic layer 141 and the second non-metallic layer 142 can be perpendicular in direction. In this embodiment, the fiber bundles of both the first non-metallic layer 141 and the third non-metallic layer 143 can be parallel to the length direction (e.g., the X-axis direction) of the support member 10. The fiber bundles of the second non-metallic layer 142 can be parallel to the width direction (e.g., the Y-axis direction) of the support member 10.

[0302] For example, both the first non-metallic layer 141 and the third non-metallic layer 143 can be made of T700 carbon fiber. The second non-metallic layer 142 can be made of M40 carbon fiber. T700 carbon fiber refers to a specific grade or type of carbon fiber. T700 carbon fiber can generally include 95.58% carbon and 4.24% nitrogen. It is understood that T is a code for a carbon fiber product series. This meaning will not be repeated hereafter.

[0303] It is understood that the non-metallic layer 14 in this embodiment may include a first non-metallic layer 141, a second non-metallic layer 142, and a third non-metallic layer 143 stacked along the second direction Z. The second non-metallic layer 142 is fixedly connected between the first non-metallic layer 141 and the third non-metallic layer 143. The first non-metallic layer 141 and the third non-metallic layer 143 may be made of T700 carbon fiber material. The second non-metallic layer 142 may be made of M40 carbon fiber material. In this way, the first non-metallic layer 141 can improve the interface characteristics between the second non-metallic layer 142 and the second metal layer 17, and the third non-metallic layer 143 can improve the interface characteristics between the second non-metallic layer 142 and the first metal layer 15. In other words, by providing the first non-metallic layer 141 and the third non-metallic layer 143, the support member 10 in this embodiment can improve the interface characteristics between the second non-metallic layer 142 and the first metal layer 15 and the second metal layer 17, thereby improving the structural stability and performance of the support member 10.

[0304] In other embodiments, the materials of the first non-metallic layer 141, the second non-metallic layer 142, and the third non-metallic layer 143 may also be carbon fiber T300, carbon fiber T700, carbon fiber T800, carbon fiber T1000, glass fiber, poly-p-phenylene benzobisoxazole (PBO), polyimide (PI), and polyethylene terephthalate (PET), etc.

[0305] In other embodiments, the fiber bundles of adjacent fiber layers in a multilayer fiber layer may also be parallel to each other.

[0306] Figure 27 yes Figure 26 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0307] like Figure 27 As shown, in this embodiment, the support member 10 and Figure 26The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The differences between the two will be mainly described below. In this embodiment, the inner bend 122 of the support member 10 may have a first hole 122a. The first hole 122a may be spaced apart from the first surface 15a of the first metal layer 15. For example, the first hole 122a may penetrate the second non-metallic layer 142 along the second direction Z. In this case, both the first non-metallic layer 141 and the second metal layer 17 may cover the first hole 122a. The projections of the first metal layer 15 and the second metal layer 17 along the second direction Z onto the plane where the non-metallic layer 14 is located may both cover the first hole 122a.

[0308] For example, the first hole 122a may penetrate the support member 10 in the width direction (e.g., the Y-axis direction) of the electronic device 1000. In some embodiments, the first hole 122a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0309] Exemplarily, the support member 10 may further include a first filling layer 16. The first filling layer 16 may fill at least a portion of the first hole 122a. In this embodiment, the first filling layer 16 may completely fill the first hole 122a. Both the first non-metallic layer 141 and the third non-metallic layer 143 may be connected to the first filling layer 16. Both the first metallic layer 15 and the second metallic layer 17 may be spaced apart from the first filling layer 16.

[0310] It is understood that, in this embodiment, by providing a first hole 122a in the inner bending portion 122 of the support member 10, the elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first outer bending portion 121 and less than the elastic modulus of the second outer bending portion 123. The elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first straight portion 11 and less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend according to a preset bending trajectory.

[0311] Figure 28 yes Figure 27 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0312] like Figure 28 As shown, in this embodiment, the support member 10 and Figure 27The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the first hole 122a of the support member 10 can penetrate the second metal layer 17, the first non-metal layer 141, and the second non-metal layer 142 along the second direction Z. The first filling layer 16 can fill the portion of the first hole 122a located in the second non-metal layer 142. The first filling layer 16 can be spaced apart from the first non-metal layer 141 and the second metal layer 17.

[0313] Exemplarily, the first outward bend 121 and the second outward bend 123 of the support member 10 may also have a second hole 121a and a third hole 123a, respectively. Both the second hole 121a and the third hole 123a may be spaced apart from the first surface 15a of the first metal layer 15. Both the second hole 121a and the third hole 123a may communicate with the first hole 122a. Exemplarily, both the second hole 121a and the third hole 123a may penetrate the second metal layer 17 and the first non-metallic layer 141 along the second direction Z. In this case, the second non-metallic layer 142 may cover the second hole 121a and the third hole 123a. The projections of the first metal layer 15 and the third non-metallic layer 143 along the second direction Z onto the plane where the non-metallic layer 14 is located may cover the first hole 122a.

[0314] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), both the second hole 121a and the third hole 123a can penetrate the support member 10. In some embodiments, the second hole 121a and / or the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0315] It is understood that, in this embodiment, by providing a second hole 121a, a first hole 122a, and a third hole 123a in the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member, respectively, the elastic modulus of the inner bend 122 of the support member 10 can be less than the elastic modulus of the first outer bend 121, and can be less than the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, allowing the support member 10 to bend more effectively according to the preset bending trajectory.

[0316] In some embodiments, the first hole 122a may not penetrate the second metal layer 17 and / or the first non-metal layer 14 and / or the second non-metal layer 14 along the second direction Z. For example, the first hole 122a may not penetrate the surface of the second non-metal layer 14 facing away from the first non-metal layer 14.

[0317] Figure 29yes Figure 28 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0318] like Figure 29 As shown, in this embodiment, the support member 10 and Figure 28 The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may not include the second metal layer 17. Thus, on the one hand, the non-metallic layer 14 in this embodiment may include three stacked fiber layers, thereby improving the structural strength of the support member 10; on the other hand, the support member 10 in this embodiment may not include the second metal layer 17, in which case the thickness of the support member 10 is smaller. In other words, the support member 10 in this embodiment can balance structural strength and a thinner profile.

[0319] Figure 30 yes Figure 26 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0320] like Figure 30 As shown, in this embodiment, the support member 10 and Figure 26 The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the first outer bend 121, the inner bend 122, and the second outer bend 123 of the support member 10 may each have a plurality of arrayed second through holes 121b, a plurality of arrayed first through holes 122b, and a plurality of arrayed third through holes 123b. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be arrayed along the length direction (e.g., the X-axis direction) and the width direction (e.g., the Y-axis direction) of the support member 10. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be spaced apart from the first surface 15a of the first metal layer 15. For example, a plurality of second through holes 121b, a plurality of first through holes 122b, and a plurality of third through holes 123b can all penetrate the second metal layer 17, the first non-metal layer 141, and the second non-metal layer 142 along the second direction Z. In this case, the third non-metal layer 143 can cover the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b. The projection of the first metal layer 15 along the second direction Z onto the plane containing the non-metal layer 14 can cover the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b.

[0321] It is understood that in this embodiment, by providing multiple second through holes 121b, multiple first through holes 122b, and multiple third through holes 123b in the first outer bend 121, inner bend 122, and second outer bend 123 of the support member 10, the elastic modulus of the inner bend 122 of the support member 10 can be less than or equal to the elastic modulus of the first outer bend 121, and can be less than or equal to the elastic modulus of the second outer bend 123. The elastic modulus of the first outer bend 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bend 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0322] In some embodiments, the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all penetrate the support member 10 along its width direction (e.g., the Y-axis direction). In this case, the plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can all be elongated grooves. The plurality of second through holes 121b, the plurality of first through holes 122b, and the plurality of third through holes 123b can be arranged in an array along the first direction X.

[0323] Figure 31 yes Figure 26 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0324] like Figure 31 As shown, in this embodiment, the support member 10 and Figure 26 The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences are described below. In this embodiment, the inner bend 122 of the support member 10 may have a plurality of arrayed first through holes 122b. The plurality of first through holes 122b may be arrayed along the length direction (e.g., the X-axis direction) and width direction (e.g., the Y-axis direction) of the support member 10. Each of the plurality of first through holes 122b may be spaced apart from the first surface 15a of the first metal layer 15. For example, each of the plurality of first through holes 122b may penetrate the second metal layer 17, the first non-metal layer 141, and the second non-metal layer 142 along the second direction Z. In this case, the third non-metal layer 143 may cover the plurality of first through holes 122b. The projection of the first metal layer 15 along the second direction Z onto the plane of the non-metal layer 14 may cover the plurality of first through holes 122b.

[0325] Exemplarily, the first outward bend 121 and the second outward bend 123 of the support member 10 may also have a second hole 121a and a third hole 123a, respectively. Both the second hole 121a and the third hole 123a may be spaced apart from the first surface 15a of the first metal layer 15. Exemplarily, both the second hole 121a and the third hole 123a may penetrate the second metal layer 17 and the first non-metal layer 141 along the second direction Z. In this case, the second non-metal layer 142 may cover the second hole 121a and the third hole 123a. The projections of the first metal layer 15 and the third non-metal layer 143 along the second direction Z onto the plane where the non-metal layer 14 is located may cover the second hole 121a and the third hole 123a.

[0326] For example, in the width direction of the electronic device 1000 (e.g., the Y-axis direction), both the second hole 121a and the third hole 123a can penetrate the support member 10. In some embodiments, the second hole 121a and / or the third hole 123a may not penetrate the support member 10 in the width direction of the electronic device 1000.

[0327] In this way, the elastic modulus of the inner bending portion 122 of the support member 10 can be less than the elastic modulus of the first outer bending portion 121, and can be less than the elastic modulus of the second outer bending portion 123. The elastic modulus of the first outer bending portion 121 of the support member 10 can be less than the elastic modulus of the first straight portion 11. The elastic modulus of the second outer bending portion 123 of the support member 10 can be less than the elastic modulus of the second straight portion 13, so that the support member 10 can bend better according to the preset bending trajectory.

[0328] In some embodiments, multiple first through holes 122b can also penetrate the support member 10 along its width direction (e.g., the Y-axis direction). Figure 15c As shown, Figure 15c yes Figure 15b The diagram shows a structural schematic of another embodiment. In this embodiment, each of the multiple first through holes 122b can be an elongated groove. The multiple first through holes 122b can be arranged in an array along the first direction X.

[0329] Figure 32 yes Figure 31 The cross-sectional structure diagram of the support member 10 shown in another embodiment is illustrated.

[0330] like Figure 32 As shown, in this embodiment, the support member 10 and Figure 31The structures of the support members 10 shown are largely the same, and the similarities will not be repeated. The main differences will be described below. In this embodiment, the support member 10 may not include the second metal layer 17. The second hole 121a and the third hole 123a may only penetrate the first non-metallic layer 141. Thus, on the one hand, the non-metallic layer 14 in this embodiment may include three stacked fiber layers, thereby improving the structural strength of the support member 10; on the other hand, the support member 10 in this embodiment may not include the second metal layer 17, in which case the thickness of the support member 10 is smaller. In other words, the support member 10 in this embodiment can balance structural strength and a thinner profile.

[0331] It should be noted that, in the absence of conflict, the features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0332] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0333] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A support (10) characterised in that, The support member (10) includes a first straight portion (11), a bent portion (12) and a second straight portion (13) connected along a first direction. The bent portion (12) is located between the first straight portion (11) and the second straight portion (13). The support member (10) is capable of bending at the bent portion (12). The support member (10) includes a non-metallic layer (14) and a first metal layer (15) stacked along the second direction, wherein the first metal layer (15) and the non-metallic layer (14) are integrally formed; Wherein, the first direction intersects with the second direction.

2. Support (10) according to claim 1, characterized in that The first metal layer (15) is used to fix the flexible substrate layer (211) of the display panel (20).

3. Support (10) according to claim 2, characterized in that The non-metallic layer (14) is made of fiber material or fiber composite material.

4. Support (10) according to any one of claims 1 to 3, characterized in that The support (10) further includes a second metal layer (17), which is stacked on the side of the non-metallic layer (14) facing away from the first metal layer (15).

5. Support (10) according to claim 4, characterized in that The first metal layer (15), the non-metallic layer (14), and the second metal layer (17) are integrally formed.

6. Support (10) according to any one of claims 1 to 5, characterized in that The non-metallic layer (14) includes a first non-metallic layer (141), a second non-metallic layer (142), and a third non-metallic layer (143) stacked along the second direction. The second non-metallic layer (142) is fixedly connected between the first non-metallic layer (141) and the third non-metallic layer (143). The fiber bundle direction of the first non-metallic layer (141) intersects with the fiber bundle direction of the second non-metallic layer (142), and / or, the fiber bundle direction of the second non-metallic layer (142) intersects with the fiber bundle direction of the third non-metallic layer (143).

7. Support (10) according to any one of claims 1 to 6, characterized in that The elastic modulus of the bent portion (12) is less than or equal to the elastic modulus of the first straight portion (11), and less than or equal to the elastic modulus of the second straight portion (13).

8. The support member (10) according to any one of claims 1 to 7, characterized in that, The bending portion (12) includes a first outer bending portion (121), an inner bending portion (122), and a second outer bending portion (123) connected along the first direction. The inner bending portion (122) is located between the first outer bending portion (121) and the second outer bending portion (123). The first outer bending portion (121) is fixedly connected to the first straight portion (11), and the second outer bending portion (123) is fixedly connected to the second straight portion (13). The elastic modulus of the inner bending portion (122) is less than or equal to the elastic modulus of the first outer bending portion (121), and the elastic modulus of the first outer bending portion (121) is less than or equal to the elastic modulus of the first straight portion (11).

9. The support member (10) according to claim 8, characterized in that, The first metal layer (15) has a first surface (15a) facing away from the non-metallic layer (14), and the inner bend (122) has a first hole (122a) spaced apart from the first surface (15a).

10. The support member (10) according to claim 9, characterized in that, The support (10) further includes a first filling layer (16) that fills at least a portion of the first hole (122a) and the elastic modulus of the first filling layer (16) is less than the elastic modulus of the non-metallic layer (14).

11. The support member (10) according to claim 8, characterized in that, The inner bending portion (122) has a plurality of first through holes (122b), and the plurality of first through holes (122b) are spaced apart from the first surface (15a) of the first metal layer (15).

12. The support member (10) according to any one of claims 9 to 11, characterized in that, The first outer bend (121) has a second hole (121a), which is spaced apart from the first surface (15a), and the second hole (121a) communicates with the first hole (122a) of the inner bend (122).

13. The support member (10) according to claim 12, characterized in that, The first filling layer (16) of the support member (10) fills at least part of the first hole (122a) of the inner bend (122), and / or the first filling layer (16) fills at least part of the second hole (121a).

14. The support member (10) according to any one of claims 9 to 11, characterized in that, The first outer bend (121) has a plurality of second through holes (121b), which are spaced apart from the first surface (15a) of the first metal layer (15).

15. The support member (10) according to any one of claims 1 to 14, characterized in that, The support member (10) further includes a first intermediate layer (18), which is stacked between the first metal layer (15) and the non-metal layer (14), and the elastic modulus of the first intermediate layer (18) is less than the elastic modulus of the non-metal layer (14).

16. The support member (10) according to claim 15, characterized in that, The first intermediate layer (18) is made of polymer material.

17. The support member (10) according to claim 15 or 16, characterized in that, The elastic modulus of the first intermediate layer (18) is in the range of 10 MPa to 5 GPa.

18. The support member (10) according to any one of claims 15 to 17, characterized in that, The thickness of the first intermediate layer (18) is less than or equal to 30 micrometers.

19. The support member (10) according to any one of claims 15 to 18, characterized in that, The first metal layer (15), the first intermediate layer (18), and the non-metallic layer (14) are integrally formed.

20. The support member (10) according to any one of claims 15 to 19, characterized in that, The elastic modulus of the first intermediate layer (18) is less than or equal to the elastic modulus of the first filling layer (16) of the support member (10).

21. The support member (10) according to any one of claims 15 to 20, characterized in that, The material of the first intermediate layer (18) is the same as the material of the first filling layer (16) of the support (10).

22. The support member (10) according to any one of claims 15 to 21, characterized in that, The support member (10) further includes a second intermediate layer (19), which is stacked between the non-metallic layer (14) and the second metallic layer (17) of the support member (10). The elastic modulus of the second intermediate layer (19) is less than that of the non-metallic layer (14).

23. A display module (200), characterized in that, The device includes a display panel (20) and a support member (10) according to any one of claims 1 to 22, the support member (10) being fixed to the non-display surface of the display panel (20), and the first metal layer (15) being disposed closer to the display panel (20) than the non-metal layer (14).

24. The display module (200) according to claim 23, characterized in that, The display module (200) includes a first region (200a), a second region (200b), and a third region (200c) connected along the first direction. The second region (200b) is located between the first region (200a) and the third region (200c). The first straight portion (11), the bent portion (12), and the second straight portion (13) are located in the first region (200a), the second region (200b), and the third region (200c), respectively. The display module (200) is capable of bending in the second region (200b).

25. The display module (200) according to claim 23 or 24, characterized in that, The display panel (20) includes a flexible substrate layer (211) which is fixedly connected to the surface of the first metal layer (15) facing away from the non-metal layer (14).

26. An electronic device (1000), characterized in that, The display module (200) includes a first housing (110), a second housing (120), a folding mechanism (300), and any one of claims 23 to 25. The folding mechanism (300) connects the first housing (110) and the second housing (120). The first housing (110) and the second housing (120) can be relatively flattened or relatively folded under the action of the folding mechanism (300). The support member (10) of the display module (200) is fixedly connected to the first housing (110) and the second housing (120).

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