Display module and electronic device

Abstract

A display module (90) and an electronic device (01) are disclosed, relating to the field of terminal device technology. The present invention addresses the problem that when FPC boards of an electronic device (01) are stacked together along their thickness direction, the thickness of the electronic device (01) increases, affecting its thinness and lightness. The display module (90) includes a display component (100), a first FPC board (200), and a second FPC board (300). The first FPC board (200) is electrically connected to the display component (100). A first end (300a) of the second FPC board (300) is electrically connected to the first FPC board (200), and a second end (300b) of the second FPC board (300) is electrically connected to the circuit board of the electronic device (01). Along the plane of the display surface of the display component (100), the second FPC board (300) is bent and extended to form a bent section (310), with both the first end (300a) and the second end (300b) located on the side of the bent section closer to the first FPC board (200).

Description

A display module and an electronic device Technical Field

[0001] This application relates to the field of terminal device technology, and in particular to a display module and an electronic device. Background Technology

[0002] Multiple FPCs (Flexible Printed Circuits) are installed inside electronic devices (such as mobile phones or tablets) to connect different components. With the trend towards thinner and lighter electronic devices, the internal space is constantly being compressed. When different FPCs are stacked together in localized areas along the thickness direction of the electronic device, the overall thickness increases, hindering the achievement of a thinner and lighter design.

[0003] Summary of the Invention

[0004] This application provides a display module and an electronic device to solve the problem that when the FPC boards of the electronic device are stacked together along the thickness direction, the thickness of the electronic device increases, affecting the thinness and lightness of the device.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, a display module is provided, comprising a display component, a first FPC board, and a second FPC board. The first FPC board is electrically connected to the display component. A first end of the second FPC board is electrically connected to the first FPC board, and a second end of the second FPC board is used for electrical connection to a circuit board of an electronic device; along the plane where the display surface of the display component is located, the second FPC board is bent and extended to form a bent section, with both the first end and the second end located on the side of the bent section closer to the first FPC board.

[0007] The display module provided in the first aspect of this application achieves electrical connection with the circuit board of the electronic device through two FPC boards. The second FPC board helps to increase the extension length so that when the display module is installed on the middle frame of the electronic device, sufficient installation space can be left between the middle frame and the display component.

[0008] Furthermore, the second FPC board is bent and extended so that both ends are located on the side of the bent section closest to the first FPC board, meaning that both ends of the second FPC board are close to the same edge of the display screen. When the display module is mounted on the mid-frame, other flexible circuit boards can be disposed on the side of the mid-frame away from the first FPC board. Therefore, along a plane parallel to the display surface of the display assembly, it is beneficial to space the second FPC board and the flexible circuit boards on the side away from the first FPC board, thereby reducing the risk of mutual stacking between the second FPC board and these flexible circuit boards.

[0009] In one possible implementation of the first aspect of this application, at least one segment of the edge of the second FPC board is a curved segment. With this structure, when the second FPC board rotates and bends around its extension direction, the position of the curved segment provides deformation space, thereby reducing the risk of damage to the edge of the second FPC board due to stress concentration.

[0010] In one possible implementation of the first aspect of this application, the second FPC board includes a first region and a second region, the width of the first region being smaller than the width of the second region, and the edge lines of the first region and the second region being connected by a curved segment. With this structure, by increasing or decreasing the width of a portion of the region, the impedance of the second FPC board can be adjusted to improve the stability of the signal transmitted by the second FPC board.

[0011] In one possible implementation of the first aspect of this application, the second FPC board includes a third region, a bent region, and a fourth region. The fourth region, the bent region, and the third region are distributed sequentially along a direction away from the bent segment. The bent region connects the third region and the fourth region, and the extension direction of the bent region is curved, with the edge of the bent region forming a curved segment. In this structure, by locally setting the bent region, the second FPC board is bent and extended, which helps to avoid adjacent components, thereby reducing the risk of the second FPC board overlapping with other adjacent flexible circuit boards.

[0012] In one possible implementation of the first aspect of this application, the display module includes a connector, and the second FPC board is electrically connected to the first FPC board via the connector. For example, the connector can be a board-to-board connector.

[0013] In one possible implementation of the first aspect of this application, the connector includes a first insertion portion and a second insertion portion, one of which is disposed on a first FPC board, and the other of which is disposed on a second FPC board, with the first and second insertion portions interlocking with each other. This structure facilitates insertion and improves assembly efficiency.

[0014] In one possible implementation of the first aspect of this application, the display module includes a limiting bracket disposed at a first end of a second FPC board, and the limiting bracket is also disposed on the side of the second FPC board away from the connector. Both ends of the limiting bracket are fixedly connected to the first FPC board. This structure is beneficial for improving the connection strength between the first and second FPC boards, and for enhancing connection reliability.

[0015] In one possible implementation of the first aspect of this application, the display module includes a fixing part fixed to a first FPC board. The limiting bracket includes a limiting part and connecting parts. The limiting part abuts against the side of the second FPC board away from the connector. Connecting parts are fixedly connected to opposite edges of the limiting part, and each connecting part is connected to a corresponding fixing part. This fixes the connecting parts at both ends of the limiting bracket relative to the first FPC board, i.e., the limiting part is fixed relative to the first FPC board, thereby pressing the limiting part against the first FPC board at the first end of the second FPC board and the connector, thus improving the connection strength.

[0016] In one possible implementation of the first aspect of this application, a limiting hole is formed on the surface of the fixing part facing the connector, and the connecting part extends into the limiting hole. In this structure, the connecting part is inserted into the limiting hole, and the limiting hole can limit the connecting part in a direction perpendicular to the first FPC board, thereby preventing the connecting part from separating from the first FPC board in this direction, thus achieving the limiting effect.

[0017] In one possible implementation of the first aspect of this application, the fixing part includes a base plate and two opposing elastic plates. The two elastic plates are fixed to the base plate, the base plate is fixed to the first FPC plate, and the connecting part is snapped between the two elastic plates. In this structure, the elastic force generated by the two elastic plates clamps the connecting part, thereby forming a limiting effect on the limiting bracket.

[0018] In one possible implementation of the first aspect of this application, the display module includes a reinforcing plate disposed between the first FPC board and the display component. In this structure, the reinforcing plate can form a support between the display component and the first FPC board, reducing the risk of pressure being transmitted to the display component and causing mold marks on the display surface during the installation of the first and second FPC boards.

[0019] In one possible implementation of the first aspect of this application, the display module includes an adhesive layer disposed between the reinforcing plate and the display component. For example, the reinforcing plate and the display component can be fixed together by adhesive backing. Furthermore, the adhesive layer also serves as a buffer, thereby providing better protection for the display component.

[0020] In one possible implementation of the first aspect of this application, the second FPC board further includes a first extension segment and a second extension segment. The two ends of the bent segment are connected to the first extension segment and the second extension segment, respectively. The end of the first extension segment furthest from the bent segment is designated as the first end, and the end of the second extension segment furthest from the bent segment is designated as the second end. With this structure, the lengths of the first and second extension segments can be adjusted to adapt to different application scenarios, which helps to further reduce the risk of stacking between flexible circuit boards.

[0021] In one possible implementation of the first aspect of this application, the display component includes a display screen and an electrical connection portion. The electrical connection portion is disposed at the edge of the display screen and bends to extend to a side away from the display surface of the display screen. A first FPC board is fixed to and electrically connected to the electrical connection portion. Exemplarily, the electrical connection portion can be a flexible circuit board and fixed to the edge of the display screen. Alternatively, the display screen can be a flexible screen, with the electrical connection portion formed by bending the edge region.

[0022] In one possible implementation of the first aspect of this application, the first FPC board is fixedly connected to the edge of the electrical connection portion away from the display screen.

[0023] In one possible implementation of the first aspect of this application, the first FPC board and the electrical connection portion are stacked and fixedly connected.

[0024] In one possible implementation of the first aspect of this application, the number of metal layers in the second FPC board is less than the number of metal layers in the first FPC board. In this structure, since the second FPC board is stacked with the battery of the electronic device along the thickness direction, a smaller number of metal layers in the second FPC board is advantageous for reducing the thickness, thereby reducing the space between the battery and the display component.

[0025] Furthermore, having more metal layers in the first FPC board helps to reduce the width of the first FPC board. For example, if the first FPC board and the battery are distributed sequentially along the length of the display module, reducing the width of the first FPC board along this direction can reduce the space occupied by the first FPC board, thereby increasing the battery's storage space, increasing the battery's size, and thus increasing the battery's capacity.

[0026] For example, the first FPC board may have six metal layers. The second FPC board may have two metal layers.

[0027] In one possible implementation of the first aspect of this application, the first FPC board includes a plurality of stacked first metal layers, and the second FPC board includes a plurality of stacked second metal layers. A first metal layer in the first FPC board adjacent to the second FPC board is electrically connected to a first metal layer in the second FPC board adjacent to the first FPC board. For example, the first and second FPC boards can be connected via a BTB connector, whereby the first and second metal layers are respectively soldered and fixed to two insertion portions of the BTB connector, and the two insertion portions are interlocked to achieve electrical connection between the first and second FPC boards.

[0028] Secondly, an electronic device is provided, comprising a mid-frame, a circuit board, and a display module, wherein the circuit board is disposed within the mid-frame. The display module is as described in any of the above technical solutions, and the display module is fixedly connected to the mid-frame, and a second FPC board is electrically connected to the circuit board.

[0029] The electronic device provided in the second aspect of this application, since it includes the display module as described in any of the above technical solutions, is able to solve the same technical problem and achieve the same technical effect.

[0030] In one possible implementation of the second aspect of this application, the circuit board includes a first circuit board and a second circuit board, which are distributed along the length of the electronic device. The first FPC board and the second circuit board are stacked together, and a second end of the second FPC board is electrically connected to the second circuit board, while the second circuit board is electrically connected to the first circuit board. This reduces the risk of localized stacking between the flexible circuit board connected to the first circuit board and the second FPC board.

[0031] In one possible implementation of the second aspect of this application, the electronic device further includes a third FPC board, which is disposed in the middle frame; the third FPC board and the second FPC board are spaced apart in a plane parallel to the display surface of the display module. This prevents overlap between the third and second FPC boards, thus saving space in the thickness direction.

[0032] In one possible implementation of the second aspect of this application, the third FPC board is connected to the first circuit board, and the third FPC board and the second FPC board are spaced apart along the length of the middle frame.

[0033] In one possible implementation of the second aspect of this application, the third FPC board is connected to the second circuit board, and the third FPC board and the second FPC board are spaced apart along the width direction of the middle frame.

[0034] In one possible implementation of the second aspect of this application, the electronic device includes multiple mid-frames and at least one pivot mechanism, with adjacent mid-frames rotatably connected by the pivot mechanism; the circuit board and the display module are disposed on the same mid-frame. Attached Figure Description

[0035] Figure 1 is a structural diagram of an electronic device provided in an embodiment of this application;

[0036] Figure 2 is a front view of an electronic device provided in an embodiment of this application;

[0037] Figure 3 is a front view of an electronic device in a folded state according to an embodiment of this application;

[0038] Figure 4 is a front view of another electronic device in a folded state provided in an embodiment of this application;

[0039] Figure 5 is a structural diagram of another electronic device provided in the embodiment of this application in an unfolded state;

[0040] Figure 6 is a structural diagram of another electronic device in a folded state provided in an embodiment of this application;

[0041] Figure 7 is a front view of another electronic device in an unfolded state provided in an embodiment of this application;

[0042] Figure 8 is a structural diagram of an outer screen provided in an embodiment of this application;

[0043] Figure 9 is a schematic diagram of a distribution structure of a flexible circuit board inside an electronic device provided in an embodiment of this application;

[0044] Figure 10 is a schematic diagram of another distribution structure of the flexible circuit board inside the electronic device provided in the embodiment of this application;

[0045] Figure 11 is a schematic diagram of another distribution structure of the flexible circuit board inside the electronic device provided in the embodiment of this application;

[0046] Figure 12 is a structural diagram of another external screen provided in an embodiment of this application;

[0047] Figure 13 is a cross-sectional structural diagram of an electronic device (including the outer screen shown in Figure 12) provided in an embodiment of this application;

[0048] Figure 14 is a partial structural diagram of another type of outer screen provided in an embodiment of this application;

[0049] Figure 15 is a structural diagram of a display module provided in an embodiment of this application;

[0050] Figure 16 is an exploded view of the display module shown in Figure 15;

[0051] Figure 17 is a partial enlarged view of the structure of a display module provided in an embodiment of this application;

[0052] Figure 18 is a partial enlarged view of the structure of another display module provided in an embodiment of this application;

[0053] Figure 19 is a partial structural diagram of the first FPC board and the second FPC board located within the middle frame according to an embodiment of this application;

[0054] Figure 20 is a partial structural diagram of a display module provided in an embodiment of this application;

[0055] Figure 21 is a structural diagram of the first extension segment after bending when the display screen and the middle frame are misaligned according to an embodiment of this application.

[0056] Figure 22 is a schematic diagram of the connection structure between the first FPC board and the second FPC board provided in an embodiment of this application;

[0057] Figure 23 is an exploded view of the first FPC board and the second FPC board provided in the embodiments of this application;

[0058] Figure 24 is an exploded view of the first FPC board and the second FPC board provided in Figure 23 from another perspective;

[0059] Figure 25 is a partial structural diagram of another display module provided in an embodiment of this application;

[0060] Figure 26 is an exploded view of the first FPC board, the second FPC board, and the limiting bracket of the display module provided in Figure 25;

[0061] Figure 27 is an enlarged view of the structure of the limiting bracket provided in Figure 26;

[0062] Figure 28 is a cross-sectional view AA of Figure 25;

[0063] Figure 29 is a schematic diagram of the internal structure of the first FPC board and the second FPC board provided in the embodiments of this application when used in an electronic device 01;

[0064] Figure 30 is a schematic diagram of the internal structure of the first FPC board and the second FPC board provided in the embodiments of this application when used in another electronic device 01.

[0065] Reference numerals: 01-Electronic device; 10-Folding screen; 11-First part; 12-Second part; 20-Support assembly; 21-Middle frame; 21a-First middle frame; 21b-Second middle frame; 22-Hinge mechanism; 30-Outer screen; 40-FPC board; 41-Outer screen FPC board; 42-Through-shaft FPC board; 43-Antenna FPC board; 44-Third FPC board; 50-First circuit board; 60-Second circuit board; 70-Third circuit board; 80-Battery; 90-Display module; 100-Display assembly; 110-Display screen; 120-Electrical connection part; 130-Light-transmitting cover; 200-First FPC board; 210-First metal layer; 220-First insulating layer; 230-First via; 300-Second FPC board; 300a-First end; 300b-Second end; 310-Bending section; 320-First extension section; 321-Third region; 322-Bending region; 323-Fourth region; 330-Second extension section; 331-First region; 332-Second region; 340-Curved section; 350-Second metal layer; 360-Second insulating layer; 370-Second via; 400-Connector; 410-First insertion part; 420-Second insertion part; 500-Limiting bracket; 510-Limiting part; 520-Connecting part; 530-Pad; 600-Fixing part; 610-Limiting hole; 620-Base plate; 630-Elastic sheet; 700-Reinforcing plate; 800-Adhesive layer. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0067] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0068] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0069] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0070] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, a tablet personal computer, etc. Alternatively, the electronic device can also be an electronic device with a foldable screen. This application uses a foldable screen mobile phone as an example for illustration.

[0071] Specifically, please refer to Figures 1 and 2. Figure 1 is a structural diagram of an electronic device 01 provided in an embodiment of this application, and Figure 2 is a front view of an electronic device 01 provided in an embodiment of this application. The electronic device 01 may include a folding screen 10 and a support assembly 20. The folding screen 10 is supported and attached to the support assembly 20, and the support assembly 20 can drive the folding screen 10 to rotate between an unfolded state and a folded state. It is understood that Figures 1 and 2 only schematically show some components of the electronic device 01, and the actual shape, size, position, and structure of these components are not limited by the structures shown in Figures 1 and 2.

[0072] For ease of description in the following embodiments, an XYZ coordinate system is established. When the electronic device 01 is in an unfolded or folded state, the width direction of the electronic device 01 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It should be noted that this XYZ coordinate system can be flexibly transformed according to actual needs. The embodiments in this application only provide one possible example and should not be considered as a special limitation of this application.

[0073] The aforementioned foldable screen 10 is used to display images, videos, etc. The foldable screen 10 may include at least two first portions 11 and at least one second portion 12, with the second portion 12 disposed between two adjacent first portions 11. When the electronic device 01 is in a folded state, the second portion 12 of the foldable screen 10 is bent, and the first portions 11 are stacked. At least the second portion 12 of the foldable screen 10 is a flexible screen. The first portion 11 of the foldable screen 10 may be a flexible screen, a non-flexible screen, or a combination of both. Therefore, this application does not impose specific limitations in this regard.

[0074] Among them, the aforementioned foldable screen 10 can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, a quantum dot light-emitting diode (QLED) display, a liquid crystal display (LCD), etc.

[0075] The aforementioned support assembly 20 is used to support the foldable screen 10. The support assembly 20 may include at least two mid-frames 21 and at least one pivot mechanism 22, with the pivot mechanism 22 connected to two adjacent mid-frames 21. A first portion 11 of the foldable screen 10 is attached to the mid-frame 21, and a second portion 12 of the foldable screen 10 is attached to the pivot mechanism 22. The mid-frames 21 are rotatably connected via the pivot mechanism 22, thereby enabling the electronic device 01 to rotate between the unfolded and folded states.

[0076] In some embodiments, please continue referring to Figures 1 and 2. The electronic device 01 shown in Figures 1 and 2 is a bi-fold terminal in an unfolded state. That is, the electronic device 01 includes two mid-frames 21 and a hinge mechanism 22. When the electronic device 01 is in the folded state, the aforementioned folding screen 10 is fully unfolded, meaning that the two first parts 11 and the second part 12 of the folding screen 10 are on the same plane, ensuring the flatness of the folding screen 10. In this state, a large-screen display of the electronic device 01 can be achieved, providing a better user experience. For example, when a user watches a movie, they can use a large screen to watch it, which is beneficial to improving the viewing experience.

[0077] When the aforementioned electronic device 01 is in a folded state, please refer to Figure 3, which is a front view of an electronic device 01 in a folded state according to an embodiment of this application. At this time, the two first parts 11 of the electronic device 01 are opposite each other, the second part 12 is bent, and the two middle frames 21 of the support component 20 are protected outside the folded screen 10, that is, the folded screen 10 is located between the two middle frames 21 of the support component 20. In this state, the folded screen 10 is not visible to the user, to prevent the folded screen 10 from being scratched or damaged, thereby effectively protecting the folded screen 10. For example, when the mobile phone is not needed, the electronic device 01 can be folded to avoid damage to the screen.

[0078] Furthermore, please refer to Figure 4, which is a front view of another electronic device 01 in a folded state according to an embodiment of this application. The electronic device 01 may also include an outer screen 30 (also referred to as a secondary screen), which is disposed on the side of any of the middle frames 21 away from the folded screen 10. When the electronic device 01 is in a folded state, the outer screen 30 can be used to display images, allowing users to operate with one hand, thereby making the usage scenarios of the electronic device 01 more diverse. For example, when a user is riding public transportation, one hand needs to hold the handrail; at this time, the outer screen 30 can be used to display images for one-handed operation, further improving the user experience.

[0079] In other embodiments, please refer to Figures 5 and 6. Figure 5 is a structural diagram of another electronic device 01 provided in this application embodiment in an unfolded state, and Figure 6 is a structural diagram of another electronic device 01 provided in this application embodiment in a folded state. The electronic device 01 can also be a tri-fold terminal, that is, the electronic device 01 includes three middle frames 21 and two hinge mechanisms 22. When the electronic device 01 is in the unfolded state, the folding screen 10 is fully unfolded, providing a larger screen and further enhancing the user's viewing experience. When the electronic device 01 is in the folded state, the three middle frames 21 are stacked. For example, the two middle frames 21 located on both sides can rotate in opposite directions and are stacked on the same side of the middle frame 21.

[0080] Furthermore, please refer to Figure 7, which is a front view of another electronic device 01 provided in the embodiment of this application in an unfolded state. This electronic device 01 may also include the aforementioned outer screen 30, which is disposed on one of the three middle frames 21. For example, when the rotation directions of the middle frames 21 on both sides are opposite, the outer screen 30 may be disposed on the side of the middle middle frame 21 away from the folding screen 10, so that the electronic device 01 can display on a small screen.

[0081] In another possible example, the two middle frames 21 located on both sides can also rotate in the same direction and be stacked on both sides of the middle frame 21 located in the middle. Therefore, this application does not impose any special limitations on this.

[0082] Based on this, in order to power the external screen 30 and enable it to display images, the external screen 30 can be electrically connected to the circuit board inside the electronic device 01 via a flexible circuit board. Please refer to Figures 8 and 9. Figure 8 is a structural diagram of an external screen 30 provided in an embodiment of this application, and Figure 9 is a schematic diagram of the distribution structure of a flexible circuit board inside the electronic device provided in an embodiment of this application. The external screen 30 is not shown in Figure 9.

[0083] Specifically, an outer screen FPC board 41 is disposed on the outer screen 30. The outer screen FPC board can be disposed on one side edge of the outer screen, for example, it can be disposed at the lower edge distributed along the Y-axis direction as shown in Figure 8. Multiple middle frames 21 may include a first middle frame 21a and at least one second middle frame 21b, with the outer screen 30 fixed to the first middle frame 21a. The electronic device 01 also includes a first circuit board 50, which is disposed within the first middle frame 21a. One end of the outer screen FPC board 41 is connected to the outer screen 30, and the other end of the outer screen FPC board 41 is connected to the first circuit board 50, so that the outer screen 30 is electrically connected to the first circuit board 50 and can transmit signals to the outer screen through the outer screen FPC board 41, enabling the outer screen 30 to display images.

[0084] In some examples, the first circuit board 50 can be disposed at the top of the first middle frame 21a along the Y-axis direction, and the outer screen FPC board 41 can be connected to the lower edge of the outer screen 30 along the Y-axis direction. The outer screen FPC board 41 is bent and extends to the top to connect with the first circuit board 50.

[0085] Furthermore, the outer screen FPC board 41 and the first circuit board 50 can be connected via a connector 400. Alternatively, the outer screen FPC board 41 can also be connected to the first circuit board 50 by soldering or other methods. Therefore, this application does not impose any special limitations on this.

[0086] In this case, to facilitate the installation of the outer screen 30, the length of the outer screen FPC board 41 is set to be relatively large. For example, along the Y-axis direction, the distance between the lower edge of the outer screen 30 and the first circuit board 50 is less than the length of the outer screen FPC board 41. Therefore, the outer screen FPC board 41 is relatively long, which may cause redundancy and increase costs.

[0087] In addition, the aforementioned electronic device 01 may also include a second circuit board 60, which is disposed within the first middle frame 21a. The first circuit board 50 and the second circuit board 60 are distributed along the Y-axis direction, with the first circuit board 50 disposed on the upper side of the first middle frame 21a and the second circuit board 60 disposed on the lower side. The second circuit board 60 and the first circuit board 50 are electrically connected through an FPC board 40. The outer screen FPC board 41 can be bent and connected to the second circuit board 60.

[0088] For example, the FPC board 40 can be used to transmit signals between the first circuit board 50 and the second circuit board 60, enabling communication between electronic devices on the first circuit board 50 and electronic devices on the second circuit board 60. For instance, speakers (not shown in the figure) can be provided on both the upper and lower sides along the Y-axis direction within the first middle frame 21a. One of the two speakers is electrically connected to the first circuit board 50, and the other of the two speakers is electrically connected to the second circuit board 60. Signals can be transmitted between the first circuit board 50 and the second circuit board 60 through the FPC board 40, so that the two speakers can emit sound simultaneously.

[0089] Furthermore, other circuit boards may also be provided in the second frame 21b of the aforementioned electronic device 01, such as a third circuit board 70, on which a SOC chip (System on Chip) and other devices may be provided.

[0090] Therefore, it is necessary to connect the through-axis FPC board 42 to the circuit board inside the first middle frame 21a. That is, one end of the through-axis FPC board 42 extends into the second middle frame 21b and is connected to the third circuit board 70 inside the second middle frame 21b, and the other end of the through-axis FPC board 42 extends into the first middle frame 21a and is electrically connected to the first circuit board 50 inside the first middle frame 21a.

[0091] For example, the through-axis FPC board 42 can transmit signals between the first circuit board 50 and the third circuit board 70, enabling communication between electronic devices on the first circuit board 50 and electronic devices on the third circuit board 70. For instance, a SOC chip disposed on the third circuit board 70 can send control signals to electronic devices (e.g., camera module, flash module, etc.) on the first circuit board 50 via the through-axis FPC board 42.

[0092] In the above example, the ends of the outer screen FPC board 41, the FPC board 40, and the through-shaft FPC board 42 are all connected to the first circuit board 50, and the connection positions of the outer screen FPC board 41, FPC board 40, and through-shaft FPC board 42 on the first circuit board 50 can be distributed at intervals along the X-axis direction.

[0093] As the thickness of the electronic device 01 continues to decrease, while maintaining the capacity of the battery 80, the thickness of the battery 80 within the first middle frame 21a along the Z-axis can be reduced, while the length of the battery 80 along the Y-axis can be increased. This allows for both thinning of the electronic device 01 and maintaining the capacity of the battery 80. Please refer to Figure 10, which is a schematic diagram of another distribution structure of the flexible circuit board inside the electronic device 01 provided in this embodiment.

[0094] However, increasing the size of the battery 80 along the Y-axis will compress the space used to accommodate the first circuit board 50. For example, it will reduce the size of the first circuit board 50 along the X-axis, so that the connection positions of the FPC board 40, the outer screen FPC board 41, and the through-axis FPC board 42 on the first circuit board 50 cannot be spaced along the X-axis, but need to be spaced along the Y-axis. That is, the distribution distance of the FPC board 40, the outer screen FPC board 41, and the through-axis FPC board 42 along the X-axis will continuously decrease, thereby increasing the risk that there may be local areas of the FPC board 40, the outer screen FPC board 41, and the through-axis FPC board 42 being stacked along the Z-axis.

[0095] Furthermore, other types of flexible circuit boards may also be connected to the first circuit board 50, such as an antenna FPC board 43. One end of the antenna FPC board is connected to the first circuit board 50, and the other end can be connected to the metal part of the first middle frame 21a that serves as a radiator, thereby enabling the transmission of antenna signals. Therefore, the more flexible circuit boards connected to the first circuit board 50, the greater the risk of localized stacking along the Z-axis.

[0096] In the case of a three-fold terminal electronic device 01, please refer to Figure 11, which is a schematic diagram of the distribution structure of the flexible circuit board inside another electronic device 01 provided in this application embodiment. Since a third circuit board 70 can be provided in the second middle frame 21b on both sides of the first middle frame 21a, the aforementioned through-axis FPC board 42 is provided on both sides of the first middle frame 21a along the X-axis direction. If the aforementioned outer screen FPC board 41 extends from the bottom to the top of the first middle frame 21a along the Y-axis direction and is connected to the first circuit board 50, the risk of the outer screen FPC board 41 and the two through-axis FPC boards 42 being stacked in a local area along the Z-axis direction will be further increased.

[0097] Therefore, when there are many flexible circuit boards stacked together in the electronic device 01, the space occupied along the Z-axis increases, which may compress the outer screen 30 and cause mold marks on the outer screen 30. Providing more internal space for the flexible circuit boards will increase the thickness of the electronic device 01. Reducing the thickness of the battery 80 will reduce the capacity of the battery 80.

[0098] In some other examples, please refer to Figure 12, which is a structural diagram of another outer screen 30 provided in the embodiment of this application. The aforementioned outer screen FPC board 41 can also extend along the X-axis direction and be connected to the second circuit board 60 shown in Figures 9 and 10 after being bent.

[0099] However, please refer to Figure 13, which is a cross-sectional view of the electronic device 01 (including the outer screen 30 shown in Figure 12) provided in an embodiment of this application. Since the outer screen FPC board 41 extends along the X-axis, it may conflict with the adjacent pivot mechanism 22, as shown by the dotted line in Figure 13. That is, the space for accommodating the outer screen FPC board 41 is small. If the outer screen FPC board 41 is excessively squeezed, it may be damaged, thus affecting the rationality of the layout.

[0100] Furthermore, please refer to Figure 14, which is a partial structural diagram of another outer screen 30 provided in an embodiment of this application. The aforementioned outer screen FPC board 41 can extend along the Y-axis direction and connect with the second circuit board 60 shown in Figures 9 and 10. In this case, the outer screen FPC board does not need to extend too far along the Y-axis direction, which is beneficial to reducing the length of the outer screen FPC board 41.

[0101] However, since the folding terminal is assembled by first installing the folding screen 10 and then the outer screen 30, a certain gap needs to be maintained between the outer screen 30 and the first middle frame 21a during the installation process to facilitate the connection between the outer screen FPC board and the second circuit board 60 inside the first middle frame 21a.

[0102] Therefore, the short length of the outer screen FPC board 41 will result in a small gap between the outer screen 30 and the first middle frame 21a during installation, causing insufficient installation space and making it difficult to connect the outer screen FPC board 41 and the second circuit board 60, thus affecting the normal assembly of the outer screen 30 of the electronic device 01.

[0103] Based on this, to solve the above problems, please refer to Figures 15 and 16. Figure 15 is a structural diagram of a display module 90 provided in an embodiment of this application, and Figure 16 is an exploded view of the display module 90 provided in Figure 15. The display module 90 can be applied to the above-mentioned electronic device 01. The display module 90 may include a display component 100 and a first FPC board 200.

[0104] In some examples, the display assembly 100 may include a display screen 110 and an electrical connection portion 120, wherein the display screen 110 may serve as the outer screen 30 of the aforementioned electronic device 01. The display screen 110 and the electrical connection portion 120 may be independent components. For example, the electrical connection portion 120 may be a flexible circuit board, fixed to the edge of the display screen 110 and electrically connected to it, with the electrical connection portion 120 bent to the side opposite to the display surface of the display screen 110. Alternatively, the display screen 110 and the electrical connection portion 120 may be an integrated structure, i.e., the display screen 110 may be a flexible screen, with its edge bent to the side opposite to the display surface to form the electrical connection portion 120.

[0105] The first FPC board 200 is fixed and electrically connected to the electrical connection portion 120. For example, please refer to FIG17, which is a partial enlarged view of a display module 90 provided in an embodiment of this application. The first FPC board 200 can be fixed to the edge of the electrical connection portion 120 away from the display screen 110. The two can be bonded and electrically connected to form a bonding area (also called a binding area). In this case, the first FPC board 200 and the display screen 110 can be bonded and fixed, thereby improving structural reliability. Furthermore, the circuit traces of the display component 100 extend from the display screen 110 to the electrical connection portion 120, and from the electrical connection portion 120 along the Y-axis direction from bottom to top (from bottom to top in FIG15) to the first FPC board 200, and continue to extend along the first FPC board 200.

[0106] Alternatively, please refer to Figure 18, which is a partial enlarged view of another display module 90 provided in an embodiment of this application. The first FPC board 200 can be stacked with the electrical connection portion 120 along the Z-axis direction, and the first FPC board 200 and the electrical connection portion 120 are bonded and fixed to the edge away from the display screen 110 to form the aforementioned bonding area. In this case, the circuit traces of the display component 100 first extend from the display screen 110 to the electrical connection portion 120, then extend from the electrical connection portion 120 along the Y-axis direction from bottom to top (from bottom to top in Figure 17) to the edge, and then extend to the first FPC board 200, and continue to extend along the Y-axis direction from top to bottom.

[0107] Therefore, by adopting the above-described connection method between the first FPC board and the electrical connection part 120, space along the Y-axis can be saved. Thus, after being installed in the first middle frame 21a, space within the first middle frame 21a can be saved, which is beneficial to increasing the length of the battery 80 along the Y-axis and thereby increasing the capacity of the battery 80.

[0108] Furthermore, please refer back to Figures 15 and 16. The display component 100 also includes a display driver integrated circuit (DDIC), which can be packaged using different packaging processes to drive the display screen 110 to display images. For example, the packaging process may include COG (Chip On Glass) packaging, COF (Chip On Film) packaging, or COP (Chip On Plastic) packaging.

[0109] In other examples, the display component 100 may also include a light-transmitting cover 130, the material of which includes, but is not limited to, glass. For example, the light-transmitting cover 130 may be a common light-transmitting cover 130, used to protect the display screen from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 130 may be a touch-enabled light-transmitting cover 130, enabling the electronic device 01 to have touch functionality, thereby making it more convenient for the user. Therefore, the specific material of the light-transmitting cover 130 in this application is not specifically limited.

[0110] Based on this, please continue referring to Figures 15 and 16. The aforementioned display module 90 also includes a second FPC board 300. The first end 300a of the second FPC board 300 is electrically connected to the first FPC board 200, and the second end 300b of the second FPC board 300 is used for electrical connection to the circuit board of the electronic device 01 (e.g., the second circuit board 60 shown in Figure 10). Furthermore, along the plane containing the display surface of the display assembly 100, i.e., the XY plane, the second FPC board 300 is bent and extended to form a bent section 310. Both the first end 300a and the second end 300b of the second FPC board 300 are located on the side of the bent section 310 closer to the first FPC board 200.

[0111] Specifically, the bending extension of the second FPC board 300 along the plane (i.e., the XY plane) containing the display surface of the display assembly 100 to form the bent segment 310 means that the plane containing the second FPC board 300 can be parallel to the XY plane, or the plane containing the second FPC board 300 can form a certain angle with the XY plane, for example, an angle less than 10°. That is, the vertical projection of the second FPC board 300 on the XY plane will not result in local areas of overlap, thus helping to reduce the space occupied by the second FPC board along the Z-axis.

[0112] In this way, the above-mentioned display module 90 realizes the electrical connection between the display screen 110 and the circuit board of the electronic device 01 through the first FPC board 200 and the second FPC board 300. When installing the display module 90, the second FPC board 300 can ensure the necessary installation space between the display screen 110 and the middle frame 21 so as to connect the second FPC board 300 with the circuit board of the electronic device 01.

[0113] Furthermore, the second FPC board 300 is bent and extended in the XY plane, so that the second end 300b of the second FPC board 300 extends to the side close to the first FPC board 200, so that both ends of the second FPC board 300 are located close to the first FPC board 200. That is, the first end 300a and the second end 300b of the second FPC board 300 are both close to the same edge of the display screen 110. For example, along the Y-axis direction, the first end 300a and the second end 300b of the second FPC board 300 are both close to the lower edge of the display screen 110, so that the second FPC board 300 does not occupy the space on the side close to the upper edge of the display screen 110, thereby reducing the risk of local stacking between the second FPC board 300 and the flexible circuit board on the side close to the upper edge of the display screen 110.

[0114] In some embodiments, the two ends of the bent section 310 of the second FPC board 300 can be the first end 300a and the second end 300b of the second FPC board 300, that is, the second FPC board 300 forms a bent extension structure. Alternatively, referring to Figures 15 and 16, the second FPC board 300 may also include a first extension section 320 and a second extension section 330. The two ends of the bent section 310 are respectively connected to the first extension section 320 and the second extension section 330. The end of the first extension section 320 away from the bent section 310 is the first end 300a of the second FPC board 300, that is, connected to the first FPC board 200. The end of the second extension section 330 away from the bent section 310 is the second end 300b of the second FPC board 300, that is, connected to the circuit board.

[0115] Therefore, the second FPC board 300 is composed of a first extension section 320, a second extension section 330 and a bending section 310 forming an approximately U-shaped structure. The total length of the second FPC board 300 can be controlled by adjusting the lengths of the first extension section 320 and the second extension section 330 so that the second FPC board 300 can adapt to installation requirements.

[0116] Based on this, please refer to Figures 19 and 20. Figure 19 is a partial structural diagram of the first FPC board 200 and the second FPC board 300 provided in this embodiment of the application, located within the middle frame 21. Figure 20 is a partial structural diagram of the display module 90 provided in this embodiment of the application. The width dimension of the second FPC board 300 can continuously change along its extension direction.

[0117] Specifically, the electronic device 01 provided in this application embodiment may include a third FPC board 44, which may be the FPC board 40, the through-axis FPC board 42, or the antenna FPC board 43 shown in FIG10. This application does not make any special limitation in this regard. In this example, the third FPC board 44 is described as the through-axis FPC board 42.

[0118] One end of the third FPC board 44 is connected to the second circuit board 60, and the other end of the third FPC board extends into the adjacent middle frame 21. The third FPC board and the second FPC board are spaced apart along the X-axis.

[0119] To avoid localized overlap between the second and third FPC boards along the Z-axis, the ends of the third FPC board 44, the first end 300a of the second FPC board, and the second end 300b of the second FPC board can be spaced apart along the X-axis. Because the width of the middle frame 21 along the X-axis is limited, this results in a smaller area along the X-axis on the second FPC board, for example, at the second end 300b of the second FPC board.

[0120] Since the impedance of a conductor is related to its length and cross-sectional area, the longer the conductor and the smaller the cross-sectional area, the greater the impedance. Therefore, the smaller the local width of the second FPC board 300, i.e., the smaller the cross-sectional area at that location, the greater the impedance of the second FPC board 300.

[0121] Based on this, in order to adjust the impedance of the second FPC board 300, the width dimension of the FPC board 300 can be locally increased, which is beneficial to reducing the impedance of the second FPC board 300. For example, the second extension segment 330 extends along the Y-axis direction, and the second extension segment 330 may include a first region 331 and a second region 332 distributed along the Y-axis direction. The width L1 of the first region 331 along the X-axis direction is smaller than the width L2 of the second region 332 along the X-axis direction. The first region 331 is the region near the second end 300b of the second FPC board 300.

[0122] In this way, by locally increasing the width of the second FPC board 300, the cross-sectional area of ​​the second FPC board 300 at that location can be increased. Therefore, by adjusting the size of the cross-sectional area of ​​the second FPC board 300, the impedance of the second FPC board 300 can be adjusted, thereby reducing the impact of impedance on signal transmission stability and improving the stability of signal transmission by the second FPC board 300.

[0123] It is understandable that the first extension 320, the second extension 330, or the bent section 310 of the second FPC board 300 may have areas with increased local width. That is, areas on the second FPC board that are far from adjacent flexible circuit boards or other devices can have their width increased to adjust the impedance of the second FPC board 300.

[0124] Furthermore, the second FPC board 300 may have multiple regions with different widths, or the width of the second FPC board 300 may gradually increase or decrease along its length. Therefore, this application does not impose any special limitations in this regard.

[0125] Furthermore, due to the width variation of the second FPC board 300, at least one curved segment 340 is formed along the edge of the second FPC board 300. For example, the widths of the first region 331 and the second region 332 are different, so the edge of the first region 331 and the edge of the second region 332 cannot be on the same straight line. Therefore, the portion between the edge of the first region 331 and the edge of the second region 332 needs to be bent and extended to form a curved segment 340. That is, the edge of the first region 331 and the edge of the second region 332 are connected by a curved segment 340 so that the curved segment 340 can be formed between two adjacent regions with different widths on the second FPC board.

[0126] It is understood that one side edge of the first region 331 and the second region 332 may be on the same straight line, while the other side edge may not be on the same straight line, meaning that only one curved segment 340 is formed between the first region 331 and the second region 332. Alternatively, both sides edge of the first region 331 and the second region 332 may not be on the same straight line, so that curved segments 340 can be formed on both sides edge of the second extension segment 330. Therefore, this application does not impose any special limitations on this.

[0127] In other examples, the second FPC board 300 may also be bent and extended in a plane parallel to the display surface of the display screen 110, so that the aforementioned curved segment 340 is formed on the edge line of the second FPC board 300. For example, the first extension segment 320 may include a third region 321, a bent region 322, and a fourth region 323 distributed sequentially along the direction close to the bent segment 310. The third region 321 and the fourth region 323 are connected by the bent region 322, and the extension direction of the bent region 322 is curved, so that the edge lines on both sides of the bent region 322 can form the aforementioned curved segment 340.

[0128] Furthermore, the bending area 322 of the second FPC board 300 allows the second FPC board 300 to bend and extend in the XY plane, which helps to avoid adjacent devices (e.g., the third FPC board 44), thereby further reducing the risk of local overlapping between the second FPC board 300 and other flexible circuit boards.

[0129] In this structure, while the first extension segment 320 bends along its own extension direction, the curved segment 340 also allows the first extension segment 320 to rotate at a certain angle around its own extension direction. In this way, when the display module 90 is installed, the second FPC board 300 will be stretched and deformed. The curved segment 340 can increase the deformation range of the second FPC board 300, thereby reducing the risk of damage to the second FPC board 300 due to deformation.

[0130] For example, please refer to Figure 21, which is a structural diagram of the first extension segment 320 after bending when the display screen 110 and the middle frame 21 are misaligned according to an embodiment of this application. Taking the first extension segment 320 extending along the Y-axis as an example, when the display module 90 is installed, the second end 300b of the second extension segment 330 is used to connect with the circuit board inside the middle frame 21. Therefore, the second FPC board 300 will move away from the display screen 110, that is, the second FPC board 300 will be stretched along the Z-axis.

[0131] During this process, the display screen 110 and the middle frame 21 are opposite each other and distributed along the Z-axis. When the two are offset or tilted relative to the Z-axis, causing a certain misalignment between the display screen 110 and the middle frame 21 (for example, misalignment along the X-axis), the second FPC board 300 is stretched along the Z-axis and also rotates and bends around the Y-axis. That is, the fourth region 323 of the first extension segment 320 rotates and bends relative to the third region 321 around the Y-axis. At this time, the curved segment 340 can provide deformation space for the first extension segment 320 to reduce the risk of excessive local stress on the edge of the first extension segment 320, which could lead to damage.

[0132] It is understood that the number and position of the aforementioned curved segments 340 can be flexibly varied based on actual needs. That is, curved segments 340 can be provided on the edges of the first extension segment 320, the second extension segment 330, and the bending segment 310. Therefore, this application does not impose any special limitations on this.

[0133] Based on the above, please refer back to Figures 19 and 20. The second FPC board 300 provided in this embodiment includes fewer metal layers than the first FPC board 200. For example, the first FPC board 200 may include six metal layers, i.e., the first FPC board 200 is a six-layer board; the second FPC board 300 may include two metal layers, i.e., the second FPC board 300 is a two-layer board.

[0134] Based on this, on the one hand, the cost of the second FPC board 300 can be reduced, which helps to reduce the overall cost of the display module 90. Furthermore, the second FPC board 300 has fewer layers, meaning its thickness is smaller. Therefore, the space occupied by the second FPC board 300 along the Z-axis between the battery 80 and the display screen 110 is reduced, which helps to increase the thickness of the battery 80 and thus improve its capacity.

[0135] For example, the second FPC board 300 and the third FPC board 44 are both located between the battery 80 and the display screen 110, and are spaced apart. Therefore, the thickness of the second FPC board 300 can be adapted to the thickness of the third FPC board 44. For example, the thickness of the second FPC board 300 can be less than or equal to the thickness of the third FPC board 44, thereby avoiding the situation where the third FPC board 44 has insufficient installation space due to the smaller thickness of the second FPC board 200.

[0136] On the other hand, the first FPC board 200 adopts a multi-layer board structure with more layers, which is beneficial to reduce the width of the first FPC board 200 along the Y-axis. Since the battery 80 and the first FPC board 200 are distributed along the Y-axis within the middle frame 21, the width of the first FPC board 200 is reduced, which can provide more space for the battery 80, that is, increase the size of the battery 80 along the Y-axis, which is beneficial to improve the capacity of the battery 80.

[0137] For example, in related technologies, the distance between the battery 80 and the lower edge of the middle frame 21 is 19mm-30mm. However, after the width of the first FPC board 200 along the Y-axis direction is reduced in the embodiment of this application, the distance D between the battery 80 and the lower edge of the middle frame 21 can be reduced to 15mm-18mm. This provides more space for the battery 80, which is beneficial for increasing the capacity of the battery 80.

[0138] It is understood that the aforementioned metal layer refers to the metal pattern layer in the flexible circuit board. A substrate (i.e., an insulating layer) is provided between two adjacent metal pattern layers, and the metal pattern layers are electrically connected through vias so that different circuits can be formed on the flexible circuit board.

[0139] For example, please refer to Figure 22, which is a schematic diagram of the connection structure between the first FPC board 200 and the second FPC board 300 provided in an embodiment of this application. The first FPC board 200 includes a first metal layer 210, and a first insulating layer 220 is provided between two adjacent first metal layers 210. Two adjacent first metal layers 210 can be interconnected through a first via 230 to realize signal transmission between multiple first metal layers 210.

[0140] The second FPC board 300 includes a second metal layer 350, and a second insulating layer 360 is provided between two adjacent second metal layers 350. Two adjacent second metal layers 350 can be interconnected through a second via 370 to realize signal transmission between multiple second metal layers.

[0141] Furthermore, the multiple first metal layers 210 and the multiple second metal layers 350 are stacked along the Z-axis direction. One of the multiple first metal layers 210 that is closer to the second FPC board 300 is electrically connected to one of the multiple second metal layers 350 that is closer to the first FPC board 20, thereby enabling the electrical connection between the first FPC board and the second FPC board.

[0142] Based on this, please continue to refer to Figure 22, and in conjunction with Figures 23 and 24. Figure 23 is an exploded view of the first FPC board 200 and the second FPC board 300 provided in the embodiment of this application, and Figure 24 is an exploded view of the first FPC board 200 and the second FPC board 300 provided in Figure 23 from another perspective. In Figures 23 and 24, the dashed boxes indicate that the component is on the other side surface that is not visible in the illustrated view.

[0143] To achieve electrical connection between the second FPC board 300 and the circuit board of the electronic device 01, and between the second FPC board 300 and the first FPC board 200, the electrical connection can be achieved through the aforementioned connector 400 or by soldering. For example, taking the electrical connection between the second FPC board 300 and the first FPC board 200 via connector 400 as an example, this connector 400 can be a board-to-board connector (BTB connector).

[0144] The connector 400 may include a first insertion portion 410 and a second insertion portion 420, also referred to as a male and a female connector. One of the first insertion portion 410 and the second insertion portion 420 is fixed to the first FPC board 200 and connected (e.g., soldered) to a first metal layer 210 near the second FPC board 300. The other of the first insertion portion 410 and the second insertion portion 420 is fixed to a first end 300a of the second FPC board 300 and connected (e.g., soldered) to a second metal layer 350 near the first FPC board 200. The first insertion portion 410 and the second insertion portion 420 are interlocked to achieve an electrical connection between the first FPC board 200 and the second FPC board 300.

[0145] Furthermore, the second end 300b of the second FPC board 300 may also be provided with another second plug-in portion 420, which is used to plug into the first plug-in portion 410 on the circuit board inside the middle frame 21, so as to realize the electrical connection between the second FPC board and the circuit board.

[0146] It is understood that the connection method between the first FPC board 200 and the second FPC board 300 can be the same as or different from the connection method between the second FPC board and the circuit board. For example, the first ends 300a of the first FPC board 200 and the second FPC board 300 can be connected by the aforementioned connector 400, and the second end 300b of the second FPC board 300 can be fixed and electrically connected to the circuit board of the electronic device 01 by soldering or other methods. Therefore, this application does not impose any special limitations on this.

[0147] To further enhance the connection strength between the first plug-in portion 410 and the second plug-in portion 420, please refer to Figures 25, 26 and 27. Figure 25 is a partial structural diagram of another display module provided in the embodiment of this application. Figure 26 is an exploded view of the first FPC board 200, the second FPC board 300 and the limiting bracket 500 of the display module 90 provided in Figure 25. Figure 27 is an enlarged structural view of the limiting bracket 500 provided in Figure 26.

[0148] The display module 90 may further include a limiting bracket 500, which is disposed at the first end 300a of the second FPC board 300 and located on the side of the second FPC board 300 away from the connector 400. The two ends of the limiting bracket 500 are fixedly connected to the first FPC board 200. In this way, the first end 300a of the second FPC board 300 and the connector 400 are both disposed between the limiting bracket 500 and the first FPC board 200, and the two ends of the limiting bracket 500 are fixedly connected to the first FPC board 200. This can limit the connector 400 and the first FPC board 200 along the Z-axis, thereby reducing the risk of the first insertion portion 410 and the second insertion portion 420 of the connector 400 separating from each other, and thus improving the connection strength between the first FPC board 200 and the second FPC board 300.

[0149] In addition, the display module 90 may also include a fixing part 600, which is fixed to the first FPC board 200. The aforementioned limiting bracket 500 may include a limiting part 510 and a connecting part 520. The limiting part 510 abuts against the side of the second FPC board 300 away from the connector 400. The two opposite edges of the limiting part 510 are fixedly connected to the connecting parts 520, and the two connecting parts 520 are connected to the corresponding fixing parts 600.

[0150] The fixing part 600 can be a structural component fixed to the surface of the first FPC board 200, and a limiting hole 610 can be formed on the surface of the fixing part 600 facing the connector 400. The connecting part 520 extends into the limiting hole 610, thereby restricting the limiting bracket 500 from moving away from the first FPC board 200 along the Z-axis direction.

[0151] Alternatively, the fixing part 600 may include a base plate 620 and two opposing elastic pieces 630. The elastic pieces 630 are fixed to the base plate 620, and the base plate 620 is fixed to the first FPC plate 200. The fixing part 600 is engaged between the two elastic pieces 630. That is, the two elastic pieces 630 clamp the fixing part 600, thereby limiting the position of the fixing part 600.

[0152] It is understood that the two fixing parts 600 located at both ends of the first insertion part 410 can adopt different structures as shown in FIG27, or they can adopt the same structure. Furthermore, the aforementioned limiting bracket 500 can also be fixedly connected to the first FPC board 200 by adhesive, welding or other means. Therefore, this embodiment of the application does not impose any special limitations on this.

[0153] In addition, a pad 530 can be provided on the side of the limiting bracket 500 facing the first FPC board 200. The pad 530 abuts against the second FPC board. The pad 530 can be made of a flexible material, such as rubber or memory foam. This forms a support between the limiting bracket 500 and the second FPC board 300 to buffer pressure and help protect the second FPC board 300.

[0154] In other embodiments, please refer to FIG28, which is a cross-sectional view AA of FIG25. The display module 90 provided in this application embodiment may further include a reinforcing plate 700, which is disposed between the first FPC board 200 and the display screen 110, thereby providing support for the first FPC board 200. During the mutual insertion of the first insertion part 410 and the second insertion part 420, the two need to be subjected to mutual force, that is, to compress the first FPC board 200. The reinforcing plate 700 provides support and can withstand this pressure, thereby reducing the risk of mold marks on the display screen 110 caused by the pressure and improving the reliability of the overall structure.

[0155] Furthermore, the reinforcing plate 700 can be bonded and fixed to the display screen 110 via an adhesive layer 800, for example, the adhesive layer 800 can be an adhesive backing. This adhesive layer 800 can also distribute pressure, further reducing the risk of pressure being transmitted to the display screen 110. For example, the thickness of both the reinforcing plate 700 and the adhesive layer 800 can be 0.1 mm.

[0156] In some examples, the reinforcing plate 700 can also be bonded and fixed to the first FPC board 200 by another adhesive layer 800, thereby further reducing the risk of mold marks on the display screen 110. Furthermore, when the first FPC board 200 and the electrical connection portion 120 are stacked, the reinforcing plate 700 can be disposed between the electrical connection portion 120 and the display screen 110, thereby forming a support between the first FPC board 200 and the display screen 110.

[0157] Based on the above embodiments, the display module 90 is applied to the above-mentioned electronic device 01. Please refer to FIG29, which is a schematic diagram of the internal structure of the first FPC board 200 and the second FPC board 300 provided in the embodiments of this application when used in an electronic device 01. In FIG25, the display module 90 (the display screen 110 and other components are not shown in FIG29) is fixed on the first middle frame 21a of the electronic device 01. The first circuit board 50, the second circuit board 60 and the third FPC board 44 are disposed in the first middle frame 21a. The first circuit board 50 and the second circuit board 60 are disposed in the first middle frame 21a and are distributed along the Y-axis direction. The second end 300b of the second FPC board 300 is fixed and electrically connected to the second circuit board 60.

[0158] The third FPC board 44 extends at least partially into the first middle frame 21a. In the XY plane, the third FPC board 44 and the second FPC board 300 are distributed at intervals to avoid the third FPC board 44 and the second FPC board 300 being stacked along the Z-axis, which helps to save space.

[0159] The third FPC board 44 can be either the through-axis FPC board 42 or the antenna FPC board 43 shown in Figure 10. When the third FPC board 44 is the through-axis FPC board, the other end of the third FPC board 44 extends into the adjacent second middle frame 21b. Therefore, the specific form of the third FPC board 44 is not limited in this embodiment.

[0160] For example, the third FPC board 44 can be connected to the first circuit board 50, and the third FPC board 44 and the second FPC board 300 are spaced apart along the Y-axis direction, thereby avoiding local stacking between the third FPC board 44 and the second FPC board 300. In this structure, along the Y-axis direction, the second FPC board 300 is close to the second circuit board 60, and the third FPC board 44 is close to the first circuit board 50. The two do not affect each other, thereby avoiding stacking between the second FPC board 300 and the third FPC board 44.

[0161] Alternatively, please refer to Figure 30, which is a schematic diagram of the internal structure of the first FPC board 200 and the second FPC board 300 provided in this application embodiment when used in another electronic device 01. The aforementioned third FPC board 44 can also be connected to the aforementioned second circuit board 60, and the third FPC board 44 and the second FPC board 300 can be spaced apart along the X-axis direction. On the one hand, this helps to avoid the second FPC board 300 and the third FPC board 44 from stacking on each other. On the other hand, it can save space on the first circuit board 50, thereby reducing the risk of other FPC boards 40 connected to the first circuit board 50 stacking.

[0162] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0163] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include Display components; The first FPC board is electrically connected to the display component; A second FPC board, the first end of which is electrically connected to the first FPC board, and the second end of which is used for electrical connection to the circuit board of the electronic device; along the plane where the display surface of the display component is located, the second FPC board is bent and extended to form a bent section, and both the first end and the second end are located on the side of the bent section closer to the first FPC board.

2. The display module according to claim 1, characterized in that, At least one section of the edge of the second FPC board is a curved segment.

3. The display module according to claim 2, characterized in that, The second FPC board includes a first region and a second region. The width of the first region is smaller than the width of the second region. The edge line of the first region is connected to the edge line of the second region by the curved segment.

4. The display module according to claim 2, characterized in that, The second FPC board includes a third region, a bending region, and a fourth region. The fourth region, the bending region, and the third region are distributed sequentially in a direction away from the bending segment. The bending region connects the third region and the fourth region. The extension direction of the bending region is curved, and the edge line of the bending region forms the curved segment.

5. The display module according to any one of claims 1-4, characterized in that, The display module includes a connector, and the second FPC board is electrically connected to the first FPC board through the connector; The display module includes a limiting bracket, which is disposed at the first end of the second FPC board and on the side of the second FPC board away from the connector. Both ends of the limiting bracket are fixedly connected to the first FPC board.

6. The display module according to claim 5, characterized in that, The display module includes a fixing part, which is fixed to the first FPC board. The limiting bracket includes a limiting part and a connecting part. The limiting part abuts against the side of the second FPC board away from the connector. The connecting parts are fixedly connected to the opposite two edges of the limiting part. The two connecting parts are respectively connected to the corresponding fixing parts.

7. The display module according to claim 6, characterized in that, The fixing part has a limiting hole on its surface facing the connector, and the connecting part extends into the limiting hole so that the connecting part is connected to the fixing part.

8. The display module according to claim 6, characterized in that, The fixing part includes a base plate and two oppositely arranged elastic pieces. The two elastic pieces are fixed to the base plate, the base plate is fixed to the first FPC plate, and the connecting part is snapped between the two elastic pieces.

9. The display module according to any one of claims 1-8, characterized in that, The display module includes a reinforcing plate, which is disposed between the first FPC board and the display component.

10. The display module according to claim 9, characterized in that, The display module includes an adhesive layer disposed between the reinforcing plate and the display component.

11. The display module according to any one of claims 1-10, characterized in that, The display component includes a display screen and an electrical connection part. The electrical connection part is disposed at the edge of the display screen and bends and extends to the side away from the display surface of the display screen. The first FPC board is fixed and electrically connected to the electrical connection part.

12. The display module according to claim 11, characterized in that, The first FPC board is fixedly connected to the edge of the electrical connection portion away from the display screen.

13. The display module according to claim 12, characterized in that, The first FPC board is stacked and fixedly connected to the electrical connection part.

14. The display module according to any one of claims 1-13, characterized in that, The number of metal layers in the second FPC board is less than the number of metal layers in the first FPC board.

15. An electronic device, characterized in that, include: Mid-frame; The circuit board is disposed within the middle frame; The display module is the display module according to any one of claims 1-15, wherein the display module is fixedly connected to the middle frame, and the second FPC board is electrically connected to the circuit board.

16. The electronic device according to claim 15, characterized in that, The circuit board includes a first circuit board and a second circuit board, which are distributed along the length of the electronic device. The first FPC board and the second circuit board are stacked together. The second end of the second FPC board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the first circuit board.

17. The electronic device according to claim 16, characterized in that, The electronic device further includes a third FPC board, which is disposed on the middle frame; the third FPC board and the second FPC board are distributed at intervals in a plane parallel to the display surface of the display module.

18. The electronic device according to claim 17, characterized in that, The third FPC board is connected to the first circuit board, and the third FPC board and the second FPC board are spaced apart along the length of the middle frame.

19. The electronic device according to claim 17, characterized in that, The third FPC board is connected to the second circuit board, and the third FPC board and the second FPC board are spaced apart along the width direction of the middle frame.

20. The electronic device according to any one of claims 15-19, characterized in that, The electronic device includes at least two mid-frames and at least one pivot mechanism, with adjacent mid-frames rotatably connected by the pivot mechanism; the circuit board and the display module are disposed on the same mid-frame.

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