Semiconductor raw material pulverizing device

Abstract

This invention relates to the field of semiconductor raw material pulverization technology, specifically to a semiconductor raw material pulverization device. The device includes a semiconductor raw material pulverizing chamber, a horizontally sliding feed plate installed inside the chamber, a rotatable first pulverizing roller, and a rotatable second pulverizing roller. This semiconductor raw material pulverizing device allows for adjustment of the position of the second pulverizing roller, enabling adjustment of the gap between the first and second pulverizing rollers according to the pulverization requirements of the semiconductor raw material. This facilitates operation, has a wide range of applications, and allows for belt tension adjustment during gap adjustment, preventing slack or tightness and improving operational stability. Furthermore, it allows for intermittent feeding of the semiconductor raw material, preventing excessive feeding and accumulation that could negatively impact pulverization efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor raw material pulverization technology, specifically to a semiconductor raw material pulverization device. Background Technology

[0002] Semiconductors are materials whose electrical conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors.

[0003] Common semiconductor materials include silicon dioxide, germanium, and gallium arsenide. Silicon dioxide is the most influential semiconductor material in various applications. Semiconductor raw material crushing equipment is an auxiliary device used in the semiconductor production process to crush raw materials for subsequent processing. It has been widely used in the field of semiconductor processing.

[0004] Currently, most semiconductor raw material crushing processes involve pouring the raw material into a hopper and crushing it using crushing rollers. However, most crushing rollers in these crushing devices are fixed, making it impossible to adjust the spacing between them according to the required size of the raw material. This increases the limitations of the device. Furthermore, pouring a large amount of raw material into the hopper can cause accumulation, resulting in the raw material crowding into the crushing rollers and uneven contact, leading to poor crushing results. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor raw material pulverizing device to solve the problems mentioned in the background art, such as the inability to adjust the spacing of the pulverizing rollers for existing semiconductor raw materials, and the impact of material accumulation on the pulverizing effect. To achieve the above objective, this invention provides the following technical solution: a semiconductor raw material pulverizing device, comprising a semiconductor raw material pulverizing chamber, a horizontally sliding feed plate installed inside the semiconductor raw material pulverizing chamber, a rotatable first pulverizing roller installed inside the semiconductor raw material pulverizing chamber, and a rotatable second pulverizing roller installed inside the semiconductor raw material pulverizing chamber.

[0006] Preferably, the inner wall of the semiconductor raw material crushing chamber is provided with a groove, a fixing rod is fixed inside the groove, a slider is slidably sleeved on the outside of the fixing rod, the slider is fixedly connected to the feeding plate, and a handle is installed on the end side of the feeding plate.

[0007] Preferably, the side wall of the semiconductor raw material crushing chamber is provided with a slot to facilitate the sliding of the feeding plate.

[0008] Preferably, a mounting plate is fixed to the side wall of the semiconductor raw material crushing chamber, a motor is fixed to the top of the mounting plate, a transmission rod is fixedly connected to the output end of the motor, and the transmission rod is fixedly connected to the first crushing roller.

[0009] Preferably, a first pulley is fixedly sleeved on the outside of the transmission rod.

[0010] Preferably, a fixing plate is fixed to the end side of the semiconductor raw material crushing chamber, a connecting rod is fixed to the bottom of the fixing plate, a spring is sleeved on the outside of the connecting rod, a sliding rod is fixed to the bottom of the spring, the sliding rod is slidably sleeved with the connecting rod, and a tensioning wheel is rotatably sleeved on the outside of the connecting rod.

[0011] Preferably, a second pulley is fixedly sleeved on the outside of the end of the second crushing roller, and a belt is wound around the outside of the second pulley, the first pulley, and the second pulley.

[0012] Preferably, a fixing block is fixed to the side wall of the semiconductor raw material crushing chamber, a screw is rotatably connected to the end of the fixing block, a rocker arm is fixed to the end of the screw, a sliding rod is threaded onto the external thread of the screw, and a sleeve is fixed to the end of the sliding rod.

[0013] Preferably, the second crushing roller is placed inside the sleeve and rotates.

[0014] Preferably, the side wall of the semiconductor raw material crushing chamber is provided with a movable groove to facilitate the horizontal sliding of the sleeve.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: In this invention, the position of the second crushing roller can be adjusted, so that the gap between the first crushing roller and the second crushing roller can be adjusted according to the crushing requirements of semiconductor raw materials, which is convenient to operate and has a wide range of applications.

[0016] In this invention, a horizontally sliding feeding plate is provided to intermittently feed semiconductor raw materials, avoiding excessive feeding and accumulation of raw materials, which would affect the pulverization effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is an overall isometric view of the present invention; Figure 3 For the present invention Figure 2 Schematic diagram of the sliding structure of the middle and lower material plates; Figure 4 For the present invention Figure 2 A top-down view of the internal structure of the semiconductor raw material crushing chamber; Figure 5For the present invention Figure 2 Schematic diagram of the connection structure between the first and second crushing rollers; Figure 6 For the present invention Figure 5 Schematic diagram of the adjustable tension wheel structure; Figure 7 For the present invention Figure 5 Schematic diagram of the adjustable structure of the second crushing roller.

[0018] In the diagram: 1. Semiconductor raw material crushing chamber; 2. Feeding plate; 21. Groove; 22. Fixing rod; 23. Slider; 24. Handle; 3. First crushing roller; 31. Mounting plate; 32. Motor; 33. Transmission rod; 4. Second crushing roller; 41. First pulley; 42. Fixing plate; 43. Connecting rod; 44. Spring; 45. Slide rod; 46. Tensioning wheel; 47. Second pulley; 48. Belt; 49. Fixing block; 410. Screw; 411. Rocker arm; 412. Sliding rod; 413. Sleeve. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 7 The present invention provides a technical solution: a semiconductor raw material crushing device, including a semiconductor raw material crushing chamber 1, a horizontally sliding feed plate 2 installed inside the semiconductor raw material crushing chamber 1, a rotatable first crushing roller 3 installed inside the semiconductor raw material crushing chamber 1, and a rotatable second crushing roller 4 installed inside the semiconductor raw material crushing chamber 1.

[0021] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the inner wall of the semiconductor raw material crushing chamber 1 is provided with a groove 21, a fixing rod 22 is fixed inside the groove 21, a slider 23 is slidably sleeved on the outside of the fixing rod 22, the slider 23 is fixedly connected to the feeding plate 2, and a handle 24 is installed on the end side of the feeding plate 2.

[0022] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the side wall of the semiconductor raw material crushing chamber 1 is provided with a slot to facilitate the sliding of the feeding plate 2.

[0023] It should be noted that the surface of the feeding plate 2 has multiple holes, through which the raw materials can be discharged, allowing the material to descend slowly and avoid clogging that could affect the performance.

[0024] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, a mounting plate 31 is fixed to the side wall of the semiconductor raw material crushing chamber 1, and a motor 32 is fixed to the top of the mounting plate 31. A transmission rod 33 is fixedly connected to the output end of the motor 32, and the transmission rod 33 is fixedly connected to the first crushing roller 3.

[0025] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, the transmission rod 33 is externally fixedly sleeved with a first pulley 41.

[0026] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, a fixing plate 42 is fixed to the end side of the semiconductor raw material crushing chamber 1, a connecting rod 43 is fixed to the bottom of the fixing plate 42, a spring 44 is sleeved on the outside of the connecting rod 43, a sliding rod 45 is fixed to the bottom of the spring 44, the sliding rod 45 is slidably sleeved with the connecting rod 43, and a tensioning wheel 46 is rotatably sleeved on the outside of the connecting rod 43.

[0027] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, a second pulley 47 is fixedly sleeved on the outside of the end of the second crushing roller 4, and a belt 48 is wound around the outside of the second pulley 47, the first pulley 41, and the second pulley 47.

[0028] It should be noted that the belt 48 wound around the first pulley 41, the second pulley 47 and the tensioning pulley 46 can be tensioned when the position of the second crushing roller 4 is adjusted, so that the belt 48 can always be in contact with the outside of the first pulley 41 and the second pulley 47 for stable transmission, and avoid loosening that would affect the stability of use.

[0029] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7As shown, a fixing block 49 is fixed to the side wall of the semiconductor raw material crushing chamber 1. A screw 410 is rotatably connected to the end of the fixing block 49. A rocker arm 411 is fixed to the end of the screw 410. A sliding rod 412 is threaded onto the outside of the screw 410. A sleeve 413 is fixed to the end of the sliding rod 412.

[0030] In this embodiment, as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, the second crushing roller 4 is placed inside the sleeve 413 and rotates.

[0031] In this embodiment, as Figure 1 , Figure 2 and Figure 7 As shown, the side wall of the semiconductor raw material crushing chamber 1 is provided with a movable groove to facilitate the horizontal sliding of the sleeve 413.

[0032] It should be noted that the specific model and specifications of the motor 32 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated here.

[0033] The method of use and advantages of the present invention: The semiconductor raw material pulverizing device operates as follows: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, when using the semiconductor material crushing chamber 1 to crush semiconductor materials, the crushing gap between the first crushing roller 3 and the second crushing roller 4 is first adjusted according to the required crushing size of the semiconductor material. The rocker arm 411 is manually rotated to drive the screw 410 to rotate within the fixed block 49. When the screw 410 rotates, its external slide bar 45 slides and drives the slide frame to slide horizontally along the movable groove of the semiconductor material crushing chamber 1, thereby adjusting the position of the second crushing roller 4. This allows for adjustment according to the crushing requirements of the semiconductor material, making it convenient to operate and applicable to a wide range of applications. At the same time, when the second crushing roller 4 is adjusted, the second pulley 47 outside it also moves, and the belt 48 loosens or tightens accordingly. The spring 44 elastically deforms with the change of the belt 48, thereby driving the slide bar 45 to slide horizontally along the outside of the connecting rod 43, so that the belt 48 is always in contact with the outside of the tensioning wheel 46, the first pulley 41 and the second pulley 47, avoiding loosening or tightening during the adjustment of the gap, and improving the stability of use. The semiconductor raw materials are then crushed. The semiconductor raw materials to be crushed are fed into the feeding plate 2 through the inlet on the semiconductor raw material crushing chamber 1. Some of the raw materials are leaked into the semiconductor raw material crushing chamber 1 through the leakage hole. The motor 32 is started to drive the transmission rod 33 to drive the first crushing roller 3 to rotate. The first pulley 41 outside the transmission rod 33 also rotates at the same time and is driven by the rocker arm 411 and belt 48 to drive the second pulley 47 to rotate. This causes the second crushing roller 4 to mesh with the first crushing roller 3 and rotate, thereby crushing the semiconductor raw materials. To prevent material blockage during the crushing process, the handle 24 is manually pulled back and forth to move the feeding plate 2. The feeding plate 2 is subjected to force, which causes the sliders 23 on both sides to slide horizontally along the outside of the fixed rod 22. This allows the feeding plate 2 to slide back and forth, thereby intermittently feeding semiconductor materials to avoid excessive feeding, which would cause excessive accumulation of materials and affect the crushing effect.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor raw material crushing device comprising a semiconductor raw material crushing bin (1), characterized in that: The semiconductor raw material crushing chamber (1) is equipped with a horizontally sliding feed plate (2), a rotatable first crushing roller (3), and a rotatable second crushing roller (4).

2. The semiconductor raw material pulverizing device according to claim 1, characterized by: The inner wall of the semiconductor raw material crushing chamber (1) is provided with a groove (21), a fixing rod (22) is fixed inside the groove (21), a slider (23) is slidably sleeved on the outside of the fixing rod (22), the slider (23) is fixedly connected to the feeding plate (2), and a handle (24) is installed on the end side of the feeding plate (2).

3. The semiconductor raw material pulverizing device according to claim 2, characterized by: The side wall of the semiconductor raw material crushing chamber (1) is provided with an empty groove to facilitate the sliding of the feeding plate (2).

4. The semiconductor raw material pulverizing device according to claim 1, characterized by: The semiconductor raw material crushing chamber (1) has a mounting plate (31) fixed on its side wall. A motor (32) is fixed on the top of the mounting plate (31). A transmission rod (33) is fixedly connected to the output end of the motor (32). The transmission rod (33) is fixedly connected to the first crushing roller (3).

5. The semiconductor raw material pulverizing device according to claim 4, characterized by: The transmission rod (33) is externally fixedly sleeved with a first pulley (41).

6. The semiconductor raw material pulverizing device according to claim 1, characterized by: A fixing plate (42) is fixed to the end side of the semiconductor raw material crushing chamber (1). A connecting rod (43) is fixed to the bottom of the fixing plate (42). A spring (44) is sleeved on the outside of the connecting rod (43). A sliding rod (45) is fixed to the bottom of the spring (44). The sliding rod (45) is slidably sleeved with the connecting rod (43). A tensioning wheel (46) is rotatably sleeved on the outside of the connecting rod (43).

7. A semiconductor raw material pulverizing device according to claim 1, characterized in that: The second crushing roller (4) is fixedly sleeved with a second pulley (47) at its end. The second pulley (47), the first pulley (41), and the second pulley (47) are connected by a belt (48) wrapped around their exteriors.

8. A semiconductor raw material pulverizing device according to claim 1, characterized in that: The semiconductor raw material crushing chamber (1) has a fixed block (49) fixed on its side wall. A screw (410) is rotatably connected to the end of the fixed block (49). A rocker arm (411) is fixed to the end of the screw (410). A sliding rod (412) is threaded onto the outside of the screw (410). A sleeve (413) is fixed to the end of the sliding rod (412).

9. A semiconductor raw material pulverizing device according to claim 1, characterized in that: The second crushing roller (4) is placed inside the sleeve (413) and rotates.

10. A semiconductor raw material pulverizing device according to claim 1, characterized in that: The side wall of the semiconductor raw material crushing chamber (1) is provided with a movable groove to facilitate the horizontal sliding of the frame (413).

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