Board-to-board connector, connection method thereof, and electronic device

Abstract

This application relates to the field of electronic device technology, and provides a board-to-board connector and its connection method, as well as an electronic device. The board-to-board connector includes a first connector and a second connector. The first connector has a groove, and the second connector is inserted into the groove and electrically connected to the first connector. The first connector includes a first surface facing the second connector, and the second connector includes a second surface facing the first connector. The first surface includes a first part, a second part, and the wall of the groove, with the first part and the second part located on opposite sides of the groove. An adhesive layer is provided between the first surface and the second surface, and the adhesive layer at least covers the area between the first part and the second part. The first connector and the second connector are fixedly connected by the adhesive layer. This solution can improve the connection reliability of the board-to-board connector and better meet the miniaturization requirements of electronic devices.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a board-to-board connector and its connection method, and electronic equipment. Background Technology

[0002] Board-to-board connectors are among the most powerful connector types and are widely used in various electronic devices. To ensure reliable connection between the male and female terminals of the board-to-board connector, and thus reliable signal transmission, a dedicated fixing mechanism is used. After the male and female terminals are engaged, the fixing mechanism secures the board-to-board connector to the corresponding circuit board. While this approach improves the reliability of the connection between the male and female terminals, the additional size added by the fixing mechanism is also significant, hindering the miniaturization of electronic devices. Summary of the Invention

[0003] This application provides a board-to-board connector and its connection method, as well as an electronic device. This solution can improve the connection reliability of the board-to-board connector and better meet the needs of miniaturization of electronic devices.

[0004] In a first aspect, this application provides a board-to-board connector, which includes a first connector and a second connector. The first connector has a groove, and the second connector is inserted into the groove and electrically connected to the first connector. The first connector includes a first surface facing the second connector, and the second connector includes a second surface facing the first connector. The first surface includes a first part, a second part, and the wall of the groove. The first part and the second part are located on opposite sides of the groove. An adhesive layer is provided between the first surface and the second surface. The adhesive layer at least covers the area between the first part and the second part, and the first connector and the second connector are fixedly connected by the adhesive layer.

[0005] In this solution, the first and second connectors are connected by an adhesive layer after insertion. This increases the connection strength and reliability between the first and second connectors, while minimizing the increase in height and size of the electronic device caused by fixing the board-to-board connector, thus better meeting the miniaturization requirements of electronic devices. Furthermore, the connection process between the first and second connectors only adds two steps: gluing and curing. Compared to related technologies, this simplifies the connection process and improves the connection efficiency. In addition, this solution does not require modifications to the structure of the first and second connectors in the board-to-board connector, resulting in no increase in component design and manufacturing costs. Because there is no need to provide a receiving groove on the first or second connector, the increase in the board-to-board connector size is minimal. Excess adhesive can overflow along the first and second surfaces to the outside of the first and second connectors, eliminating the need for precise control of the amount of fluid adhesive. Compared to solutions with receiving grooves, this simplifies the connection process between the first and second connectors.

[0006] In one possible embodiment, the adhesive layer covers at least one of the first surface and the second surface. In this way, on the one hand, the connection area between the first connector and the second connector can be increased, thereby improving the connection reliability between the first connector and the second connector; on the other hand, the board-to-board connector can be sealed, thereby achieving dust and water resistance for the board-to-board connector.

[0007] In one possible embodiment, the first connector includes a first side surface connected to the first surface; a portion of the second connector is exposed in the groove, and an adhesive layer continuously covers the circumferential direction of the first side surface and the circumferential direction of the portion of the second connector exposed in the groove, thereby further increasing the connection area between the first connector and the second connector and improving the dustproof and waterproof performance of the board-to-board connector.

[0008] In one possible embodiment, the adhesive layer is formed of a self-curing adhesive, a thermosetting adhesive, or a UV-curing adhesive. When the adhesive layer is formed of a self-curing adhesive, the connection process between the first connector and the second connector can be simplified.

[0009] In one possible embodiment, the viscosity of the adhesive layer in its fluid state is less than or equal to 5000 cps, so as to improve the fluidity of the adhesive layer in its fluid state and facilitate continuous coating of the adhesive layer on the contact surface between the first connector and the second connector. It should be understood that viscosity is used to characterize the fluidity of the adhesive layer in its fluid state in this embodiment, and other parameters may be used to characterize the fluidity of the adhesive layer in its fluid state in other embodiments.

[0010] Secondly, embodiments of this application provide an electronic device comprising a circuit board, at least one electronic component, and a board-to-board connector as provided in the first aspect. The at least one electronic component corresponds to at least one board-to-board connector. One of the first connector and the second connector is electrically connected to the electronic component corresponding to the board-to-board connector, and the other of the first connector and the second connector is electrically connected to the circuit board. This electronic device includes the aforementioned board-to-board connector, and therefore can at least achieve the technical effects achievable by the aforementioned board-to-board connector. Specific effects can be referred to the technical effects achievable in the first aspect.

[0011] In one possible embodiment, the electronic component and the circuit board are arranged opposite to each other in the insertion / removal direction of the first connector and the second connector. The first connector and the second connector are located between the electronic component and the circuit board, and an adhesive layer seals the first connector and the second connector between the electronic component and the circuit board. This not only further improves the connection reliability between the first connector and the second connector, but also enhances the sealing performance of the board-to-board connector.

[0012] Thirdly, embodiments of this application provide a board-to-board connector connection method. This connection method is used to connect a first connector and a second connector of the board-to-board connector provided in the first aspect. The connection method includes the following steps:

[0013] A fluid adhesive is applied to at least one of the surfaces of the first connector facing the second connector and the second connector facing the first connector. The surface of the first connector facing the second connector is a first surface, and the first connector has a groove. The first surface includes the wall of the groove, a first portion, and a second portion, located on opposite sides of the groove. The surface of the second connector facing the first connector is a second surface. The second connector is inserted into the groove, causing an interference fit between the metal terminals of the first and second connectors, discharging the fluid adhesive from the contact area between the metal terminals of the first and second connectors, and ensuring that the fluid adhesive at least covers the area between the first and second portions. The fluid adhesive is cured to form an adhesive layer, thereby fixing the first and second connectors together. The technical effects achievable by this connection method are similar to those achieved in the first aspect, and will not be repeated here.

[0014] In one possible embodiment, distributing the fluid adhesive at least over the area between the first and second portions includes distributing the fluid adhesive over at least one of the first and second surfaces. This increases the connection area between the first and second connectors, improving their connection reliability; it also enables a seal between the board-to-board connectors, thereby achieving dust and water resistance.

[0015] In one possible embodiment, the first connector includes a first side surface connected to a first surface, and a portion of the second connector is exposed in the groove; the fluid adhesive is applied to at least the area between the first and second portions, including: applying the fluid adhesive to the area between the first and second portions and overflowing to the first side surface and the portion of the second connector exposed in the groove, and continuously covering the circumference of the first side surface and the circumference of the portion of the second connector exposed in the groove, thereby further increasing the connection area between the first and second connectors and improving the dustproof and waterproof performance of the board-to-board connector.

[0016] In one possible embodiment, applying a fluid adhesive to at least one of the surfaces of the first connector facing the second connector and the second connector facing the first connector includes: applying the fluid adhesive in a groove of the first connector to facilitate the application of the fluid adhesive.

[0017] In one possible embodiment, the fluid adhesive is a self-curing adhesive, a thermosetting adhesive, or a UV-curing adhesive. When the adhesive layer is formed by a self-curing adhesive, the connection process between the first connector and the second connector can be simplified.

[0018] In one possible embodiment, the viscosity of the fluid adhesive is less than or equal to 5000 cps, so that the adhesive layer has better fluidity when in a fluid state, making it easier to continuously coat the contact surface between the first connector and the second connector when the adhesive layer is in a fluid state. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a partial structure of an electronic device in the related art;

[0020] Figure 2 A schematic diagram of the structure of an electronic device provided in this application;

[0021] Figure 3 An exploded view of a board-to-board connector provided in this application;

[0022] Figure 4 A cross-sectional view of a board-to-board connector provided in this application;

[0023] Figure 5 A schematic diagram of the structure of the first connector in a board-to-board connector provided in this application;

[0024] Figure 6 A schematic diagram of the structure of the second connector in a board-to-board connector provided in this application;

[0025] Figure 7 A cross-sectional view of a board-to-board connector provided in this application;

[0026] Figure 8 A cross-sectional view of a board-to-board connector provided in this application;

[0027] Figure 9 A cross-sectional view of a board-to-board connector provided in this application;

[0028] Figure 10 A cross-sectional view of a board-to-board connector provided in this application;

[0029] Figure 11 A cross-sectional view of a board-to-board connector provided in this application;

[0030] Figure 12 A cross-sectional view of a board-to-board connector provided in this application;

[0031] Figure 13 A cross-sectional view of a board-to-board connector provided in this application;

[0032] Figure 14 A schematic diagram illustrating the steps of a board-to-board connector connection method provided in this application;

[0033] Figure 15 A schematic diagram illustrating the steps of a board-to-board connector connection method provided in this application;

[0034] Figure 16 A schematic diagram illustrating the steps of a board-to-board connector connection method provided in this application;

[0035] Reference numerals: 1-Male end; 2-Female end; 3-Pressure steel sheet; 4-Nut post; 5-Screw; 6-Main board; 7-Foam layer; 100-Board to board connector; 10-First connector; 11-Groove; 12-First part; 13-Second part; 14-Boss; 15-First metal terminal; 101-First surface; 102-First side; 20-Second connector; 201-Second surface; 202-Second side; 21-Second metal terminal; 22-Recess; 30-Adhesive layer; 200-Circuit board; 300-Electronic component. Detailed Implementation

[0036] In electronic devices such as smartphones, smartwatches, laptops, tablets, and personal computers (PCs), electronic components are typically connected via board-to-board connectors to achieve electrical connections between them. Examples include the connection between the screen assembly, camera assembly, and battery assembly and the motherboard. Figure 1 This is a schematic diagram of a partial structure of an electronic device in the related art. For example... Figure 1 As shown, in related technologies, electronic devices are equipped with a fixing mechanism. After the male end 1 and female end 2 of the board-to-board connector are engaged, this fixing mechanism strengthens the connection between the male end 1 and female end 2, thereby preventing the board-to-board connector from loosening during use and improving its reliability. Specifically, the fixing mechanism includes a pressing steel plate 3, a nut post 4, and a screw 5. The nut post 4 is fixed to the motherboard 6, and the pressing steel plate 3 is located on the side of the board-to-board connector opposite to the motherboard 6. One end of the pressing steel plate 3 is fixed to the top of the nut post 4 by the screw 5, and the other end of the pressing steel plate 3 is fixed to other structural components on the motherboard 6, thereby improving the connection strength between the male end 1 and female end 2 of the board-to-board connector. In some embodiments, a foam layer 7 can also be provided between the pressing steel plate 3 and the board-to-board connector to absorb the tolerances of the components.

[0037] While this solution can improve the reliability of board-to-board connector connections, the setting of the fixing mechanism not only increases the size of the electronic device significantly, which is inconsistent with the trend of miniaturization of electronic devices, but also adds processes such as attaching foam, installing and pressing steel sheets 3, and screwing in screws 5, making the process of connecting the male and female terminals more cumbersome.

[0038] In some embodiments, a receiving groove is provided on the male end 1 or female end 2 of the board-to-board connector, and an adhesive is placed in the receiving groove. The adhesive in the receiving groove is used to bond the male end 1 and female end 2 together by insertion. This solution can improve the increased size of electronic devices caused by fixing the male end 1 and female end 2, and simplifies the process of connecting the male and female ends to a certain extent. However, the disadvantages of this solution are also obvious. For example, on the one hand, this solution requires modification of the structure of the male end 1 and female end 2 in the board-to-board connector, which will increase the cost from both the component design and manufacturing aspects, and the setting of the receiving groove will also increase the size of the board-to-board connector; on the other hand, this solution requires precise control of the amount of adhesive to prevent poor contact between the male end 1 and female end 2 due to the adhesive, which undoubtedly increases the difficulty of connecting the male end 1 and female end 2.

[0039] Based on this, embodiments of this application provide a board-to-board connector and its connection method, as well as an electronic device, to improve the problem that increasing the connection reliability between the male and female terminals of the board-to-board connector through a fixing mechanism results in a significant increase in the size of the electronic device. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings.

[0040] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0041] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0042] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2As shown, the electronic device includes a circuit board 200, a board-to-board connector 100, and at least one electronic component 300, wherein at least one electronic component 300 corresponds to at least one board-to-board connector 100. That is, when the electronic device includes one electronic component 300, that electronic component 300 corresponds to at least one board-to-board connector 100, and the electronic component 300 is electrically connected to the circuit board 200 through the aforementioned at least one board-to-board connector 100; when the electronic device includes multiple electronic components 300, one or more of the multiple electronic components 300 respectively correspond to at least one board-to-board connector 100, and the electronic component 300 corresponding to at least one board-to-board connector 100 is electrically connected to the circuit board 200 through the board-to-board connector 100 corresponding to that electronic component 300. It is easy to understand that in this case, an electronic component 300 that does not correspond to a board-to-board connector 100 can be electrically connected to the circuit board 200 through other types of connectors, for example: an electronic component 300 that does not correspond to a board-to-board connector 100 can be electrically connected to the circuit board 200 through a flexible board connector. When an electronic device includes multiple electronic components 300, each of the multiple electronic components 300 may correspond to at least one board-to-board connector 100, so that each electronic component 300 is electrically connected to the circuit board 200 through the board-to-board connector 100 corresponding to that electronic component 300.

[0043] Specifically, please continue to refer to Figure 2 The board-to-board connector 100 includes a first connector 10 and a second connector 20. One of the first connector 10 and the second connector 20 is electrically connected to an electronic component 300 corresponding to the board-to-board connector 100, and the other of the first connector 10 and the second connector 20 is electrically connected to a circuit board 200. Exemplarily, the first connector 10 and the second connector 20 can be soldered to the electronic component 300 or the circuit board 200 connected to the connector, respectively. In a specific implementation, the electronic device includes two electronic components 300 and two board-to-board connectors 100. One of the two electronic components 300 is a battery component, and the other is a screen component. The first connector 10 of both board-to-board connectors 100 is disposed on the circuit board 200, the second connector 20 of one board-to-board connector 100 is disposed on the battery component, and the second connector 20 of the other board-to-board connector 100 is disposed on the screen component. The first connector 10 and the second connector 20 of each board-to-board connector 100 are connected, thereby realizing the electrical connection between the battery component and the screen component and the circuit board 200. Of course, electronic component 300 can also be other functional components, such as a camera component or a microphone component. The scenarios where electronic component 300 is a different functional component will not be listed here.

[0044] Figure 3 An exploded view of a board-to-board connector provided in an embodiment of this application is shown. Figure 4 This is a cross-sectional view of a board-to-board connector provided as an embodiment of this application. Figure 3 and Figure 4 As shown, the first connector 10 has a groove 11, and the second connector 20 is inserted into the groove 11 and electrically connected to the first connector 10. The first connector 10 includes a first surface 101 facing the second connector 20, and the second connector 20 includes a second surface 201 facing the first connector 10. The first surface 101 includes a first part 12, a second part 13, and the wall of the groove 11. The first part 12 and the second part 13 are located on opposite sides of the groove 11. An adhesive layer 30 is provided between the first surface 101 and the second surface 201. Figure 2 and Figure 3 (Not shown in the image), the adhesive layer 30 covers at least the area between the first part 12 and the second part 13, that is, the wall of the groove 11, so that the first connector 10 and the second connector 20 are fixedly connected by the adhesive layer 30.

[0045] In this solution, based on the insertion of the first connector 10 and the second connector 20, the first connector 10 and the second connector 20 are further fixedly connected by an adhesive layer 30. This increases the connection strength and reliability between the first connector 10 and the second connector 20, while minimizing the increase in height and size of the electronic device caused by fixing the board-to-board connector 100, thus better meeting the miniaturization requirements of electronic devices. Furthermore, the connection process between the first connector 10 and the second connector 20 only adds two steps: applying adhesive and curing. Compared to related technologies, this simplifies the connection process and improves the connection efficiency.

[0046] Furthermore, this solution does not require any changes to the structure of the first connector 10 and the second connector 20 in the board-to-board connector 100, and there is no increase in cost at the component design and processing level. Because there is no need to set a receiving groove on the first connector 10 or the second connector 20, the volume of the board-to-board connector 100 will hardly increase. In this solution, excess adhesive can overflow along the first surface 101 and the second surface 201 to the outside of the first connector 10 and the second connector 20. Therefore, there is no need to precisely control the amount of fluid adhesive. Compared with the solution of setting a receiving groove, the connection process of the first connector 10 and the second connector 20 can be simplified.

[0047] For example, the circuit board 200 can be the motherboard 6 of an electronic device. Furthermore, it should be understood that the adhesive layer 30 is made of an insulating material to avoid interfering with the electrical performance of the board-to-board connector 100.

[0048] Figure 5 This is a schematic diagram of the structure of the first connector in a board-to-board connector provided in an embodiment of this application. Figure 6 This is a schematic diagram of the structure of the second connector in a board-to-board connector provided in an embodiment of this application. Figure 7 This is a cross-sectional view of a board-to-board connector provided in an embodiment of this application. Please refer to... Figures 5-7 In some embodiments, a boss 14 is formed in the middle of the first connector 10, and a groove 11 is an annular structure surrounding the boss 14, with a plurality of first metal terminals 15 exposed on the surface of the groove 11. The second connector 20 has a recess 22, with a plurality of second metal terminals 21 exposed on the surface of the recess 22. When the second connector 20 is inserted into the groove 11 of the first connector 10, the recess 22 of the second connector 20 covers the outer periphery of the boss 14 of the first connector 10, and the first metal terminals 15 abut against the second metal terminals 21, thereby realizing the electrical connection between the first connector 10 and the second connector 20.

[0049] It is easy to understand that before curing, the adhesive layer 30 is a fluid adhesive. After the second connector 20 is inserted into the first connector 10, the fluid adhesive is cured to obtain a solid adhesive layer 30. Because the first metal terminal 15 and the second metal terminal 21 are interference fit, during the process of the second connector 20 being inserted into the groove 11 of the first connector 10, the adhesive at the contact point between the first metal terminal 15 and the second metal terminal 21 will be expelled from the contact point between the first metal terminal 15 and the second metal terminal 21 during the mutual compression of the first metal terminal 15 and the second metal terminal 21. Therefore, it will not affect the electrical connection between the first connector 10 and the second connector 20.

[0050] In some embodiments, the adhesive layer 30 covers at least one of the first surface 101 of the first connector 10 and the second surface 201 of the second connector 20. Please refer to the following... Figure 8The cross-sectional view of the board-to-board connector shown illustrates that the groove 11 includes grooves 11a and 11b located on opposite sides of the boss 14. Each groove 11a and groove 11b has a surface that is the same as one side of the boss 14. The first connector 10 includes a first side surface 102 connected to the first surface 101. The first side surface 102 includes side surface 102a and side surface 102b, wherein side surface 102a is located on the side of groove 11a facing away from groove 11b, and side surface 102b is located on the side of groove 11b facing away from groove 11a. The second surface 201 includes a surface 201a opposite to the first part 12, a surface 201b opposite to the second part 13, two protrusions 201c protruding from surface 201a, and a surface 201d connecting the two protrusions 201c. A portion of the second connector 20 is exposed in the groove 11, as shown below. Figure 8 As shown, the side of the second connector 20 is exposed in the groove 11. The side of the second connector 20 is referred to as the second side 202. The second side 202 includes side 202a and side 202b. Side 202a is located on the side of one protrusion 201c that is away from the other protrusion 201c. Side 202b is opposite to side 202a.

[0051] For example, when the orthographic projections of the first surface 101 and the second surface 201 coincide in the insertion / removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 covers the first surface 101 and the second surface 201. That is, the adhesive layer 30 covers the first part 12, the groove 11a, the boss 14, the groove 11b and the second part 13 of the first connector 10, and the adhesive layer 30 covers the surface 201a, the two protrusions 201c, the surface 201b and the surface 201d connected between the two protrusions 201c of the second connector 20. The adhesive layer 30 does not cover the side surfaces 102a and 102b of the first connector 10 and the side surfaces 202a and 202b of the second connector 20. When the orthographic projection range of the first surface 101 exceeds the orthographic projection range of the second surface 201 in the insertion / removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 at least covers the second surface 201. In other words, the adhesive layer 30 covers the portion of the first part 12 of the first connector 10 opposite to the surface 201a, the groove 11a, the boss 14, the groove 11b, and the portion of the second part 13 opposite to the surface 201b. The adhesive layer 30 also covers the surface 201a, the two protrusions 201c, the surface 201b, and the surface 201d connecting the two protrusions 201c of the second connector 20. The adhesive layer 30 does not cover the side surface 102a, the side surface 102b, the portion of the first part 12 extending beyond the surface 201a, the portion of the second part 13 extending beyond the surface 201b, or the side surface 202a and the side surface 202b of the second connector 20. When the range of the orthographic projection of the second surface 201 exceeds the range of the orthographic projection of the first surface 101 in the insertion and removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 at least covers the first surface 101. In other words, the adhesive layer 30 covers the first part 12, groove 11a, boss 14, groove 11b, and second part 13 of the first connector 10. The adhesive layer 30 also covers the portion of the surface 201a of the second connector 20 opposite to the first part 12, the two protrusions 201c, the portion of the surface 201b opposite to the second part 13, and the surface 201d connecting the two protrusions 201c. The adhesive layer 30 does not cover the sides 102a and 102b of the first connector 10, nor the portion of the surface 201a of the second connector 20 extending beyond the first part 12, nor the portion of the surface 201b extending beyond the second part 13. In this solution, on the one hand, based on the insertion of the first connector 10 and the second connector 20, the area of ​​the adhesive layer 30 can be increased, thereby further increasing the connection strength between the first connector 10 and the second connector 20. On the other hand, the adhesive layer 30 seals the joint between the first connector 10 and the second connector 20, which enables the board-to-board connector 100 to be dustproof and waterproof, which also helps to improve the reliability of the board-to-board connector 100.

[0052] Next, please refer to Figure 9 The diagram shows a cross-sectional view of the board-to-board connector. Figure 9 The board-to-board connector shown is Figure 8 The difference between the board-to-board connectors shown is that the adhesive layer 30 sequentially covers the groove 11a, boss 14, groove 11b, and the middle of the second part 13, starting from the middle of the first part 12. Furthermore, the adhesive layer 30 continuously covers the two protrusions 201c, surface 201d, and the middle of surface 201b, starting from the middle of surface 201a. The adhesive layer 30 does not cover the sides 102a and 102b of the first connector 10, the remaining portion of the first part 12, the remaining portion of the second part 13, or the sides 202a and 202b, the remaining portion of surface 201a, and the remaining portion of surface 201b of the second connector 20. Figure 10 As shown, in other embodiments, the adhesive layer 30 may also sequentially cover the groove 11a, the boss 14, the groove 11b, and the second part 13 from the middle of the first part 12, and the adhesive layer 30 may continuously cover the two protrusions 201c, the surface 201d, and the surface 201b from the middle of the surface 201a. That is to say, with Figure 10 Taking the shown viewpoint as an example, on the left side of the boss 14 and surface 201d, it is according to Figure 9 As shown, on the right side of boss 14 and surface 201d, it is according to Figure 8 As shown. Of course, in specific implementation, it can also be done on the left side of the boss 14 and surface 201d according to... Figure 8 As shown, on the right side of boss 14 and surface 201d, it is according to Figure 9 As shown. It is worth noting that the middle part of the first part 12 here refers to the area within the first part 12 that is distanced from both sides of the first part 12 in the direction from the first part 12 to the second part 13, and not the center of the first part 12 in a narrow sense. Similarly, the middle part of the second part 13 refers to the area within the second part 13 that is distanced from both sides of the second part 13 in the direction from the first part 12 to the second part 13, and not the center of the second part 13 in a narrow sense.

[0053] In some embodiments, the adhesive layer 30 continuously covers the circumferential direction of the first side surface 102 of the first connector 10 and the circumferential direction of the portion of the second connector 20 exposed in the groove 11. This further increases the area of ​​the adhesive layer 30, which not only further improves the connection strength between the first connector 10 and the second connector 20, but also provides a better sealing effect between them. For example, Figure 11 This is a cross-sectional view of a board-to-board connector provided in an embodiment of this application. Figure 11 The board-to-board connector shown is Figure 10The difference between the board-to-board connectors shown is that adhesive layer 30 covers the entire first part 12 and extends to side 102a, adhesive layer 30 extends from the second part 13 to side 102b, and adhesive layer 30 covers the entire side 201a and extends to side 202a, while adhesive layer 30 extends from surface 201b to side 202b. Figure 12 As shown, in another specific implementation, the electronic component 300 and the circuit board 200 are arranged opposite to each other in the insertion / removal direction of the first connector 10 and the second connector 20. The first connector 10 and the second connector 20 are located between the electronic component 300 and the circuit board 200. The adhesive layer 30 seals the first connector 10 and the second connector 20 between the electronic component 300 and the circuit board 200. That is to say, Figure 12 The board-to-board connector shown is Figure 11 The difference in the board-to-board connector shown is that the adhesive layer 30 completely covers sides 102a, 102b, 202a, and 202b. In this case, the connection strength between the first connector 10 and the second connector 20, as well as the sealing effect between them, is better.

[0054] It should be understood that the structure of the board-to-board connector 100 is not limited to the above-described cases. For example, such as Figure 13 As shown, the groove 11 of the first connector 10 does not have a boss 14, and the second connector 20 has a T-shaped structure.

[0055] In specific implementations, in some embodiments, the adhesive layer 30 can be formed by a self-curing (e.g., moisture-curing) adhesive to further simplify the connection process between the first connector and the second connector. Of course, in other embodiments, the adhesive layer 30 can also be formed by an adhesive with other curing methods, such as a thermosetting adhesive or a UV-curing adhesive.

[0056] The viscosity of the adhesive layer 30 in a fluid state can be less than or equal to 5000 cps. In this case, the adhesive layer 30 has better fluidity and is easier to continuously coat on the contact surface between the first connector 10 and the second connector 20 when in a fluid state. For example, the viscosity of the adhesive layer 30 in a fluid state can be 3500 cps, 4000 cps, or 5000 cps, etc. It should be understood that viscosity is used to characterize the fluidity of the adhesive layer 30 in a fluid state in this embodiment; in other embodiments, other parameters can also be used to characterize the fluidity of the adhesive layer 30 in a fluid state.

[0057] This application embodiment also provides a board-to-board connector connection method, which is used to connect the first connector and the second connector in the board-to-board connector 100 described above. Specifically, the connection method includes the following steps:

[0058] Step 1: Apply a fluid adhesive to at least one of the surfaces of the first connector 10 facing the second connector 20 and the second connector 20 facing the first connector 10, such as... Figure 14 As shown. The first connector 10 has a groove 11, and the surface of the first connector 10 facing the second connector 20 is a first surface 101. The first surface 101 includes the wall of the groove 11, a first part 12, and a second part 13, located on opposite sides of the groove 11. The surface of the second connector 20 facing the first connector 10 is a second surface 201.

[0059] Step 2: Insert the second connector 20 into the groove 11, ensuring an interference fit between the metal terminals of the first connector 10 and the metal terminals of the second connector 20. Discharge the fluid adhesive from the contact area between the metal terminals of the first connector 10 and the second connector 20, ensuring the fluid adhesive at least covers the area between the first part 12 and the second part 13. Figure 15 and Figure 16 As shown.

[0060] Step 3: The curing fluid adhesive forms an adhesive layer 30, which fixes the first connector 10 and the second connector 20 together.

[0061] In this solution, based on the insertion of the first connector 10 and the second connector 20, the first connector 10 and the second connector 20 are further fixedly connected by an adhesive layer 30. This increases the connection strength and reliability between the first connector 10 and the second connector 20, while minimizing the increase in electronic device size caused by fixing the board-to-board connector 100, thus better meeting the miniaturization requirements of electronic devices. Furthermore, the connection process between the first connector 10 and the second connector 20 only adds two steps: applying adhesive and curing. Compared to related technologies, this simplifies the connection process and improves the connection efficiency.

[0062] Furthermore, this solution does not require any changes to the structure of the first connector 10 and the second connector 20 in the board-to-board connector 100, and there is no increase in cost at the component design and processing level. Because there is no need to set a receiving groove on the first connector 10 or the second connector 20, the volume of the board-to-board connector 100 will hardly increase. In this solution, excess adhesive can overflow along the first surface 101 and the second surface 201 to the outside of the first connector 10 and the second connector 20. Therefore, there is no need to precisely control the amount of fluid adhesive. Compared with the solution of setting a receiving groove, the connection process of the first connector 10 and the second connector 20 can be simplified.

[0063] In some embodiments, step two, which involves distributing the fluid adhesive at least in the area between the first part 12 and the second part 13, specifically includes distributing the fluid adhesive in at least one of the first surface 101 and the second surface 201, thereby further increasing the connection area between the first connector 10 and the second connector 20, thereby improving the connection strength between the first connector 10 and the second connector 20, and achieving a sealed connection between the first connector 10 and the second connector 20.

[0064] For example, when the orthographic projections of the first surface 101 and the second surface 201 coincide in the insertion / removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 covers the first surface 101 and the second surface 201; when the range of the orthographic projection of the first surface 101 exceeds the range of the orthographic projection of the second surface 201 in the insertion / removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 covers at least the second surface 201; when the range of the orthographic projection of the second surface 201 exceeds the range of the orthographic projection of the first surface 101 in the insertion / removal direction of the first connector 10 and the second connector 20, the adhesive layer 30 covers at least the first surface 101.

[0065] Please continue to refer to Figure 16 The first connector 10 includes a first side surface 102 connected to a first surface 101, and a portion of the second connector 20 is exposed in the groove 11. In some embodiments, step two, "distributing the fluid adhesive at least to the area between the first portion 12 and the second portion 13," includes distributing the fluid adhesive to the area between the first portion 12 and the second portion 13 and overflowing it onto the first side surface 102 of the first connector 10 and the portion of the second connector 20 exposed in the groove 11, such that the fluid adhesive continuously covers the circumference of the first side surface 102 of the first connector 10 and the circumference of the portion of the second connector 20 exposed in the groove 11. In this case, the connection strength between the first connector 10 and the second connector 20, as well as the sealing effect between them, are both better.

[0066] In some embodiments, step one, applying a fluid adhesive to at least one of the surfaces of the first connector 10 facing the second connector 20 and the second connector 20 facing the first connector 10, comprises applying the fluid adhesive in the groove 11 of the first connector 10. This facilitates the application of the fluid adhesive.

[0067] In practice, fluid adhesives can be self-curing adhesives, thermosetting adhesives, or UV-curing adhesives, etc. The viscosity of the fluid adhesive is less than or equal to 5000 cps.

[0068] It is worth noting that the adhesive can be in a fluid state or a solid state at room temperature. When the adhesive is solid at room temperature, the solid adhesive can be placed on the first surface 101 or the second surface 201. After the adhesive is transformed into a fluid state under the corresponding process conditions (e.g., heating conditions), the fluid adhesive can be applied.

[0069] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A board-to-board connector, characterized in that, The device includes a first connector and a second connector. The first connector has a groove, and the second connector is inserted into the groove and electrically connected to the first connector. The first connector includes a first surface facing the second connector, and the second connector includes a second surface facing the first connector. The first surface includes a first portion, a second portion, and a wall surface of the groove, with the first portion and the second portion located on opposite sides of the groove. An adhesive layer is provided between the first surface and the second surface, and the adhesive layer at least covers the area between the first part and the second part. The first connector and the second connector are fixedly connected through the adhesive layer.

2. The board-to-board connector as described in claim 1, characterized in that, The adhesive layer covers at least one of the first surface and the second surface.

3. The board-to-board connector as described in claim 1, characterized in that, The first connector includes a first side surface connected to the first surface; a portion of the second connector is exposed in the groove, and the adhesive layer continuously covers the circumferential direction of the first side surface and the circumferential direction of the portion of the second connector exposed in the groove.

4. The board-to-board connector as described in any one of claims 1 to 3, characterized in that, The adhesive layer is formed by a self-curing adhesive, a thermosetting adhesive, or a UV-curing adhesive.

5. The board-to-board connector as described in any one of claims 1 to 4, characterized in that, The viscosity of the adhesive layer in a fluid state is less than or equal to 5000 cps.

6. An electronic device, characterized in that, The device includes a circuit board, at least one electronic component, and a board-to-board connector as described in any one of claims 1 to 5, wherein at least one of the electronic components corresponds to at least one of the board-to-board connectors, one of the first connector and the second connector is electrically connected to the electronic component corresponding to the board-to-board connector, and the other of the first connector and the second connector is electrically connected to the circuit board.

7. The electronic device as claimed in claim 6, characterized in that, The electronic component and the circuit board are disposed opposite each other in the insertion and removal directions of the first connector and the second connector. The first connector and the second connector are located between the electronic component and the circuit board. The adhesive layer seals the first connector and the second connector between the electronic component and the circuit board.

8. A method for connecting a board-to-board connector, used to connect a first connector and a second connector of the board-to-board connector according to any one of claims 1 to 5, characterized in that, Includes the following steps: A fluid adhesive is applied to at least one of the surfaces of the first connector facing the second connector and the second connector facing the first connector; wherein the surface of the first connector facing the second connector is a first surface, the first connector has a groove, and the first surface includes the wall of the groove, a first part, and a second part, the first part and the second part being located on opposite sides of the groove; the surface of the second connector facing the first connector is a second surface. The second connector is inserted into the groove, so that the metal terminal of the first connector and the metal terminal of the second connector are interference-fitted, the fluid adhesive at the contact point between the metal terminal of the first connector and the metal terminal of the second connector is discharged, and the fluid adhesive is at least distributed in the area between the first part and the second part. The fluid adhesive is cured to form the adhesive layer, thereby fixing the first connector and the second connector together through the adhesive layer.

9. The connection method as described in claim 8, characterized in that, Making the fluid adhesive at least cover the area between the first part and the second part includes: making the fluid adhesive cover at least one of the first surface and the second surface.

10. The connection method as described in claim 8, characterized in that, The first connector includes a first side surface connected to the first surface, and a portion of the second connector is exposed in the groove; The process of making the fluid adhesive at least cover the area between the first part and the second part includes: making the fluid adhesive cover the area between the first part and the second part and overflow to the first side surface and the portion of the second connector exposed in the groove, and making the fluid adhesive continuously cover the circumferential direction of the first side surface and the circumferential direction of the portion of the second connector exposed in the groove.

11. The connection method as described in claim 8, characterized in that, Applying a fluid adhesive to at least one of the surfaces of the first connector facing the second connector and the second connector facing the first connector includes: applying the fluid adhesive in the groove.

12. The connection method according to any one of claims 8 to 11, characterized in that, The fluid adhesive is a self-curing adhesive, a thermosetting adhesive, or a UV-curing adhesive.

13. The connection method according to any one of claims 8 to 11, characterized in that, The viscosity of the fluid adhesive is less than or equal to 5000 cps.

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