Motor control module, vehicle-mounted compressor and vehicle
By integrating the shunt resistor into the lower bridge power unit in the motor control module, the problem of high design cost of traditional motor control modules is solved, resulting in lower design cost and a simpler layout process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ANHUI WELLING AUTO PARTS CO LTD
- Filing Date
- 2024-12-23
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional motor control modules are costly to design, requiring separate placement of shunt resistors or current sampling devices, resulting in complex designs and high costs.
In the motor control module, the shunt resistor is integrated into the lower bridge power unit. The phase current on the drive bridge arm is collected by the shunt resistor integrated into the lower bridge power unit, which avoids the need to arrange the shunt resistor or sampling current device separately.
This reduces the design cost of the motor control module, decreases the design steps related to arranging phase current acquisition devices, reduces the footprint, and simplifies the installation and disassembly process.
Smart Images
Figure CN122339338A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of motor control technology, and in particular to a motor control module, an on-board compressor, and a vehicle. Background Technology
[0002] As motor control technology is increasingly used in various fields, users are also placing higher demands on the design of motor control modules.
[0003] Traditional motor control module design involves designing the motor control circuit on a PCB (Printed Circuit Board) and then placing separate shunt resistors or current sampling devices on the external PCB to collect phase current. This design method has significant drawbacks, as it requires the separate placement of shunt resistors or current sampling devices. In other words, this design method results in high design costs for the motor control module because it necessitates the separate placement of shunt resistors or current sampling devices (meaning that after completing the motor control circuit design, a phase current sampling device still needs to be placed).
[0004] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention
[0005] The main purpose of this application is to provide a motor control module, an on-board compressor, and a vehicle, aiming to solve the technical problem of high design cost of motor control modules.
[0006] To achieve the above objectives, this application provides a motor control module, which includes a copper-clad ceramic substrate and a motor control circuit. The motor control circuit is disposed on the copper-clad ceramic substrate, which has a positive input port, a negative input port, an upper bridge signal port, and a lower bridge signal port. The motor control circuit includes three drive bridge arms. The first end of each drive bridge arm is connected to the positive input port, and the second end of each drive bridge arm is connected to the negative input port. Each drive bridge arm includes:
[0007] An upper-bridge power transistor, wherein the first end of the upper-bridge power transistor is connected to the positive input port, and the third end of the upper-bridge power transistor is connected to the upper-bridge signal port;
[0008] The lower bridge power unit has a first end connected to the second end of the upper bridge power transistor, a second end connected to the negative input port, and a third end connected to the lower bridge signal port. The lower bridge power unit integrates a shunt resistor and collects the phase current on the drive bridge arm based on the shunt resistor.
[0009] In one embodiment, the lower bridge power unit includes:
[0010] Copper-clad ceramic plates;
[0011] A power current subunit is disposed in the copper-clad area of the copper-clad ceramic plate;
[0012] A molding compound completely encapsulates the copper-clad ceramic plate and the power current subunit. The molding compound has signal leads and power leads. The signal leads are connected to a first end of the power current subunit, and the power leads are connected to a second end of the power current subunit.
[0013] In one embodiment, the power lead terminal is connected to the copper-clad ceramic plate by ultrasonic welding or by bonding aluminum wire, and the first terminal of the power current subunit is connected to the signal lead terminal by Kelvin connection.
[0014] In one embodiment, the power current subunit includes:
[0015] A shunt resistor, wherein the first end of the shunt resistor is connected to the signal lead end;
[0016] A first power transistor, wherein a first end of the first power transistor is connected to a second end of the upper bridge power transistor, the second end of the first power transistor is connected to a second end of the shunt resistor via an aluminum wire, or the second end of the first power transistor is connected to a second end of the shunt resistor via a first copper trace in the copper-clad area, and a third end of the first power transistor is connected to the power lead end, wherein the first power transistor includes a metal oxide semiconductor power transistor.
[0017] In one embodiment, the power current subunit includes:
[0018] A shunt resistor, wherein the first end of the shunt resistor is connected to the signal lead end;
[0019] A diode, wherein the first end of the diode is connected to the second end of the shunt resistor via an aluminum wire, or the first end of the diode is connected to the second end of the shunt resistor via a second copper trace in the copper-clad area;
[0020] The second power transistor has a first end connected to the second end of the upper bridge power transistor, a second end connected to the second end of the diode via an aluminum wire, and a third end connected to the power lead end. The second power transistor includes an insulated gate bipolar transistor.
[0021] In one embodiment, the lower bridge signal port includes a lower bridge power port, a positive current acquisition port, and a negative current acquisition port. The motor control module further includes a lower bridge bonding wire unit, which includes:
[0022] A lower bridge power bonding wire, wherein the first end of the lower bridge power bonding wire is connected to the signal lead end in the lower bridge power unit, and the second end of the lower bridge power bonding wire is connected to the lower bridge power port;
[0023] A positive current bonding wire, the first end of which is connected to the second end of the shunt resistor in the lower bridge power unit, and the second end of which is connected to the positive current acquisition port;
[0024] A negative current bonding wire is provided, with its first end connected to the first end of the shunt resistor in the lower bridge power unit, and its second end connected to the negative current acquisition port. The power lead in the lower bridge power unit is connected to the negative input port.
[0025] In one embodiment, the upper bridge signal port includes an upper bridge power port and three bridge arm output ports, and the motor control module further includes an upper bridge bonding wire unit, the upper bridge bonding wire unit comprising:
[0026] An upper bridge power bonding wire, wherein the first end of the upper bridge power bonding wire is connected to the third end of the upper bridge power transistor, and the second end of the upper bridge power bonding wire is connected to the upper bridge power port;
[0027] Three bridge arm output bonding wires, the first end of each bridge arm output bonding wire is connected to the midpoint of the bridge arm of the driving bridge arm, and the second end of each bridge arm output bonding wire is connected to the bridge arm output port.
[0028] In one embodiment, the motor control module includes a temperature resistor disposed on the copper-clad ceramic substrate. The copper-clad ceramic substrate also has a first temperature port and a second temperature port. The motor control module further includes:
[0029] A first temperature bonding wire, wherein a first end of the first temperature bonding wire is connected to a first end of the temperature resistor, and a second end of the first temperature bonding wire is connected to the first temperature port;
[0030] The second temperature bonding wire has a first end connected to the second end of the temperature resistor and a second end connected to the second temperature port.
[0031] In addition, to achieve the above objectives, a vehicle-mounted compressor is also provided, which includes a compressor controller, a motor, and a compression unit;
[0032] The compressor controller is connected to the motor, and the motor is connected to the compression unit. The compressor controller is equipped with the aforementioned motor control module.
[0033] In addition, to achieve the above objectives, a vehicle is also provided, the vehicle including the aforementioned on-board compressor.
[0034] This application provides a motor control module, including a copper-clad ceramic substrate and a motor control circuit. The motor control circuit is disposed on the copper-clad ceramic substrate, which has a positive input port, a negative input port, an upper bridge signal port, and a lower bridge signal port. The motor control circuit includes three drive bridge arms. The first end of each drive bridge arm is connected to the positive input port, and the second end of each drive bridge arm is connected to the negative input port. Each drive bridge arm includes: an upper bridge power transistor, the first end of which is connected to the positive input port, and the third end of which is connected to the upper bridge signal port; and a lower bridge power unit, the first end of which is connected to the second end of the upper bridge power transistor, and the second end of which is connected to the negative input port. The third terminal is connected to the lower bridge signal port. The lower bridge power unit integrates a shunt resistor, and the phase current on the drive bridge arm is acquired based on the shunt resistor. This motor control module integrates the shunt resistor for acquiring the phase current into the lower bridge power unit, thereby avoiding the need for separately arranged shunt resistors or sampling devices. On the one hand, this motor control module integrates the shunt resistor into the lower bridge power unit, thereby reducing the overall area occupied by the power module. On the other hand, integrating the shunt resistor into the lower bridge power unit to directly acquire the phase current can reduce the design steps related to arranging phase current acquisition devices, thereby reducing the design cost of the motor control module. Attached Figure Description
[0035] Figure 1 This is a schematic diagram of the framework of the first embodiment of the motor control module of this application;
[0036] Figure 2 This is a physical schematic diagram of a copper-clad ceramic substrate in the motor control module of this application;
[0037] Figure 3This is a schematic diagram of the lower bridge power unit in the motor control module of this application;
[0038] Figure 4 This is another structural schematic diagram of the lower bridge power unit in the motor control module of this application;
[0039] Figure 5 This is a schematic diagram of the connection of the motor control circuit in the motor control module of this application;
[0040] Figure 6 This is a schematic diagram of a planar structure of the motor control module of this application;
[0041] Figure 7 This is another planar structural schematic diagram of the motor control module of this application.
[0042] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0043] Explanation of icon numbers:
[0044] 110. Copper-clad ceramic substrate; 120. Motor control circuit; 111. Positive input port; 112. Negative input port; 113. Upper bridge signal port; 114. Lower bridge signal port; 10. Lower bridge power unit; 121. Drive bridge arm; Q1 (Q2n-1), upper bridge power transistor; 11. Copper-clad ceramic plate; 111. Copper-clad area; 12. Shunt resistor; 13. First power transistor; 14. Molded enclosure; 15. Power lead terminal; 16. Signal lead terminal; 17. Aluminum wire; 18. Diode; 19. Second power transistor; R1 (R2, R3), shunt resistors; HV+, positive input port; (U, V, W)Hg, first upper-bridge power port of (U, V, W) phase; (U, V, W)Hs, second upper-bridge power port of (U, V, W) phase; (U, V, W)Lg, first lower-bridge power port of (U, V, W) phase; (U, V, W)Ls, second lower-bridge power port of (U, V, W) phase; I(U, V, W)+, positive current acquisition port of (U, V, W) phase; I(U, V, W)-, (U, V, W) phase... 20. Negative current acquisition port; N(U, V, W), (U, V, W) phase bridge arm output ports; 21. Temperature resistor; NTC1, first temperature port; NTC2, second temperature port; 311. Upper bridge power bonding wire of U phase; 312. Upper bridge power bonding wire of V phase; 313. Upper bridge power bonding wire of W phase; 321. Bridge arm output bonding wire of U phase; 322. Bridge arm output bonding wire of V phase; 323. Bridge arm output bonding wire of W phase; 331. Lower bridge power bonding wire of U phase; 332. Lower bridge power bonding wire of V phase Power bonding lines; lower bridge power bonding lines for phases 333 and W; negative current bonding lines for phases 341- and U; negative current bonding lines for phases 342- and V; negative current bonding lines for phases 343- and W; positive current bonding lines for phases 341+ and U; positive current bonding lines for phases 342+ and V; positive current bonding lines for phases 343+ and W; negative output bonding lines for phases 351 and U; negative output bonding lines for phases 352 and V; negative output bonding lines for phases 353 and W; bridge arm output ports for phases (U, V, W) and (U, V, W). Detailed Implementation
[0045] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0046] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.
[0047] In three-phase motor control circuits, power transistors are combined to form a three-phase full-bridge circuit. However, it is often necessary to obtain the phase current value of the motor output in three-phase motor control circuits. Traditional three-phase motor control circuits do not inherently possess phase current measurement capabilities. Therefore, when phase current measurement is required, a shunt resistor or current sampling device must be installed on the external PCB of the three-phase motor control circuit to collect the phase current. This involves reconnecting a shunt resistor or current sampling device to the existing three-phase motor control circuit. However, this method of acquiring phase current has at least the following drawbacks: placing a current sensor on the external PCB of the three-phase motor control circuit occupies a large space; when current measurement is not needed, the wiring needs to be cumbersomely removed. This method is not only detrimental to system miniaturization but also cumbersome to install, costly, and has a slow response speed. Most importantly, typical three-phase motor control circuits are designed with pre-built soldered boards, such as... Adding components complicates the entire design process. One approach is to redesign the soldering board to ensure it can accommodate the current sensor (but this requires the current sensor interface already on the board; if not used, the interface must be short-circuited, and if used, it must be connected to the current sensor). Another approach is to connect the new component externally. However, this method requires the soldering board to have the interface pre-designed to ensure proper connection. In other words, the interface needs to be pre-designed at the current sensor connection point in the three-phase motor control circuit to ensure successful connection later. Therefore, both approaches are not only costly but also involve complex design processes and time-consuming modifications.
[0048] Therefore, based on the shortcomings of the above-mentioned motor control module design, this application proposes a motor control module: by integrating the shunt resistor for acquiring phase current into the lower bridge power unit, the phase current on the drive bridge arm is acquired based on the shunt resistor integrated in the lower bridge power unit, thereby avoiding the need for separately arranged shunt resistors or sampling devices. This motor control module integrates the shunt resistor into the lower bridge power unit, thereby reducing the overall area occupied by the power module. On the other hand, integrating the shunt resistor into the lower bridge power unit to directly acquire phase current can reduce the design steps related to arranging phase current acquisition devices, thereby reducing the design cost of the motor control module.
[0049] Based on this, the embodiments of this application provide a motor control module, referring to... Figure 1 , Figure 1 This is a schematic diagram of the framework of the first embodiment of the motor control module of this application.
[0050] Reference Figure 1This application provides a motor control module. The motor control module 100 (not shown in the figure) includes a copper-clad ceramic substrate 110 and a motor control circuit 120. The motor control circuit 120 is disposed on the copper-clad ceramic substrate 110. The copper-clad ceramic substrate 110 is provided with a positive input port 111, a negative input port 112, an upper bridge signal port 113, and a lower bridge signal port 114. The motor control circuit 120 includes three drive bridge arms 121. The first end of each drive bridge arm 121 is connected to the positive input port 111, and the second end of each drive bridge arm 121 is connected to the negative input port 112. The drive bridge arm 121 includes:
[0051] The upper bridge power transistor Q1 has its first terminal connected to the positive input port 111 and its third terminal connected to the upper bridge signal port 113.
[0052] The lower bridge power unit 10 has its first end connected to the second end of the upper bridge power transistor Q1, its second end connected to the negative input port 112, and its third end connected to the lower bridge signal port 114. The lower bridge power unit 10 integrates a shunt resistor R1 and collects the phase current on the drive bridge arm 121 based on the shunt resistor R1.
[0053] In this embodiment, a motor control module 100 is designed, comprising a copper-clad ceramic substrate 110 and a motor control circuit 120. The motor control circuit 120 is disposed on the copper-clad ceramic substrate 110. A positive input port 111, a negative input port 112, an upper bridge signal port 113, and a lower bridge signal port 114 are directly disposed on the copper-clad ceramic substrate 110, respectively, to connect the motor control circuit 120 to these ports for signal and power transmission. The copper-clad ceramic substrate 110 can be a DBC (Direct Bonded Copper Ceramic Substrate) substrate, thereby ensuring the heat dissipation and insulation of the entire motor control circuit 120. (See reference...) Figure 2 , Figure 2This is a schematic diagram of a copper-clad ceramic substrate in the motor control module of this application. The diagram shows the wiring on the copper-clad ceramic substrate 110 when the motor control circuit 120 is not designed. The motor control circuit 120 includes three drive bridge arms 121. The first end of each drive bridge arm 121 is connected to the positive input port 111, and the second end of each drive bridge arm 121 is connected to the negative input port 112 (the connection method of the three drive bridge arms 121 of the motor control circuit 120 is the same as that of the existing circuit, and will not be described in detail here. Only the composition of one drive bridge arm 121 is used as an example). The drive bridge arm 121 includes an upper bridge power transistor Q1 and a lower bridge power unit 10. However, the lower bridge power unit 10 integrates a shunt resistor R1 and collects the phase current on the drive bridge arm 121 based on the shunt resistor R1 to reduce the design cost of the motor control module (mainly when the design requires the collection of phase current). At this time, the motor control circuit 120 can be directly placed on the copper-clad ceramic substrate 110. The signal and power are transmitted directly through the positive input port 111, negative input port 112, upper bridge signal port 113, and lower bridge signal port 114, without the need for additional interfaces to achieve phase current acquisition (the main reason is that the lower bridge power unit 10 integrates a shunt resistor R1, and the phase current on the drive bridge arm 121 is acquired based on the shunt resistor R1). When current sampling is required, it is only necessary to measure the voltage across the shunt resistor, which eliminates the step of installing a current sensor outside the power semiconductor module in the prior art. This is more conducive to the integration of the controller and the protection of the power semiconductor module. When current sampling is not required, the power semiconductor module can be used normally without affecting the appearance. This not only expands the functionality of the motor control module, but also reduces the design cost of the motor control module.
[0054] In this embodiment, a motor control module is provided, including a copper-clad ceramic substrate and a motor control circuit. The motor control circuit is disposed on the copper-clad ceramic substrate, which has a positive input port, a negative input port, an upper bridge signal port, and a lower bridge signal port. The motor control circuit includes three drive bridge arms. The first end of each drive bridge arm is connected to the positive input port, and the second end of each drive bridge arm is connected to the negative input port. Each drive bridge arm includes: an upper bridge power transistor, the first end of which is connected to the positive input port, and the third end of which is connected to the upper bridge signal port; and a lower bridge power unit, the first end of which is connected to the second end of the upper bridge power transistor, and the second end of which is connected to the negative input port. The third terminal is connected to the lower bridge signal port. The lower bridge power unit integrates a shunt resistor, and the phase current on the drive bridge arm is acquired based on the shunt resistor. This motor control module integrates the shunt resistor for acquiring the phase current into the lower bridge power unit, thereby avoiding the need for separately arranged shunt resistors or sampling devices. On the one hand, this motor control module integrates the shunt resistor into the lower bridge power unit, thereby reducing the overall area occupied by the power module. On the other hand, integrating the shunt resistor into the lower bridge power unit to directly acquire the phase current can reduce the design steps related to arranging phase current acquisition devices, thereby reducing the design cost of the motor control module.
[0055] Furthermore, based on the first embodiment of the motor control module of this application described above, a second embodiment of the motor control module of this application is proposed, with reference to... Figure 3 , Figure 3 This is a schematic diagram of the lower bridge power unit in the motor control module of this application. The lower bridge power unit 10 includes:
[0056] 11. Copper-clad ceramic plate;
[0057] A power current subunit is disposed in the copper-clad area 111 on the copper-clad ceramic plate 11.
[0058] The molding compound 14 completely encapsulates the copper-clad ceramic plate 11 and the power current subunit. The molding compound 14 is provided with signal lead terminal 16 and power lead terminal 15. The signal lead terminal 16 is connected to the first end of the power current subunit, and the power lead terminal 15 is connected to the second end of the power current subunit.
[0059] Specifically, the power lead terminal 15 is connected to the copper-clad ceramic plate 11 by ultrasonic welding or by bonding aluminum wire, and the first end of the power current sub-unit is connected to the signal lead terminal 16 by Kelvin connection.
[0060] In this embodiment, the lower bridge power unit 10 consists of a copper-clad ceramic plate 11, a power current subunit, and a molding compound 14. Signal lead terminals 16 and power lead terminals 15 (which can be designed as a DBC substrate parallel to the base plate direction) are provided on the molding compound 14. The signal lead terminal 16 is connected to the first end of the power current subunit, and the power lead terminal 15 is connected to the second end of the power current subunit. The molding compound 14 can be made of insulating resin or similar materials to completely encapsulate the copper-clad ceramic plate 11 and the power current subunit internally. The copper-clad ceramic plate 11 can be a small DBC substrate designed within the molding compound 14, primarily serving as insulation and heat dissipation. In other words, the power current subunit is integrated through the copper-clad ceramic plate 11 and the molding compound 14 to reduce the subsequent design cost of the motor control module (mainly the cost of installation and disassembly when the motor control module needs to collect phase current or not). Furthermore, in the lower bridge power unit 10, the power lead terminal 15 is connected to the copper-clad ceramic plate 11 via ultrasonic welding or aluminum wire bonding (other feasible connection methods can also be used, which are not limited here) to ensure the stability of the internal design of the lower bridge power unit 10. At the same time, the first end of the power current subunit is connected to the signal lead terminal 16 via Kelvin connection, which can reduce the influence of wire resistance on the measurement results by separating the current path and the voltage measurement path. Specifically, it uses four wires: two for transmitting current (excitation source current loop) and the other two for measuring the voltage across the resistor. Since the voltmeter is usually in a high-resistance state, the voltage drop caused by the lead resistance and contact impedance in the voltage loop can be ignored, thereby enabling more accurate measurement of the voltage across the resistor and improving the accuracy of phase current measurement in the entire lower bridge power unit 10.
[0061] Furthermore, based on the first and / or second embodiments of the motor control module described above, a third embodiment of the motor control module of this application is proposed, wherein the power current subunit includes:
[0062] Shunt resistor 12, the first end of shunt resistor 12 is connected to signal lead 16;
[0063] The first power transistor 13 has its first end connected to the second end of the upper bridge power transistor Q1. The second end of the first power transistor 13 is connected to the second end of the shunt resistor 12 via an aluminum wire 17, or the second end of the first power transistor 13 is connected to the second end of the shunt resistor 12 via a first copper trace in the copper-clad region 111. The third end of the first power transistor 13 is connected to the power lead terminal 15. The first power transistor 12 includes a metal oxide semiconductor power transistor.
[0064] In this embodiment, the power current subunit can be composed of a shunt resistor 12 and a first power transistor 13. The first end of the shunt resistor 12 can be connected to the signal lead terminal 16 via aluminum wire 17 or ultrasonic welding (its output method can be Kelvin connection) to transmit the signal collected by the shunt resistor 12 to the location connected to the signal lead terminal 16. The first end of the first power transistor 13 is connected to the second end of the upper bridge power transistor Q1. This connection can be made directly through a bonding wire, or through a combination of traces and bonding wires on the copper-clad ceramic plate 11, or directly through the traces on the copper-clad ceramic plate 11. The connection method is not limited here. Simultaneously, the second end of the first power transistor 13 is connected to the second end of the shunt resistor 12 via aluminum wire 17, or the second end of the first power transistor 13 is connected to the second end of the shunt resistor 12 via the first copper trace in the copper-clad region 111. The terminals are connected, that is, the second terminal of the first power transistor 13 and the second terminal of the shunt resistor 12 can be connected by aluminum wire 17, or by the first copper trace formed by the copper-plated area 111 on the copper-clad ceramic substrate 11. That is, the copper wire is directly connected to the second terminal of the first power transistor 13 and the second terminal of the shunt resistor 12 (the copper trace is selected to be connected to other locations according to the actual situation). The third terminal of the first power transistor 13 is connected to the power lead terminal 15 by aluminum wire 17 or ultrasonic welding, thereby completing the power current sub-unit of the first power transistor 12 as a metal oxide semiconductor power transistor, so that the power transistor and the shunt resistor 12 are integrated and mounted on the copper-clad ceramic substrate 110, so that the phase current on the drive bridge arm 121 can be directly collected by the shunt resistor 12 integrated in the lower bridge power unit 10, thereby reducing the design cost of the motor control module and the subsequent installation and disassembly costs.
[0065] In one embodiment, reference is made to Figure 4 , Figure 4 This is another structural diagram of the lower bridge power unit in the motor control module of this application. The power current subunit includes:
[0066] Shunt resistor 12, the first end of shunt resistor 12 is connected to signal lead 16;
[0067] Diode 18, the first end of diode 18 is connected to the second end of shunt resistor 12 through an aluminum wire, or the first end of diode 18 is connected to the second end of shunt resistor 12 through a second copper trace in copper-clad region 111.
[0068] The second power transistor 19 has its first end connected to the second end of the upper bridge power transistor Q1, its second end connected to the second end of the diode 18 via aluminum wire 17, and its third end connected to the power lead terminal 15. The second power transistor 19 includes an insulated gate bipolar transistor.
[0069] In this embodiment, the power current subunit can be composed of a shunt resistor 12, a diode 18, and a second power transistor 19. The first end of the shunt resistor 12 can be connected to the signal lead end 16 via aluminum wire 17 or ultrasonic welding (its outgoing wiring can be Kelvin-type outgoing wiring connection) to transmit the signal collected by the shunt resistor 12 to the location connected to the signal lead end 16. The first end of the diode 18 is connected to the second end of the shunt resistor 12 via aluminum wire 17, or the first end of the diode 18 is connected to the second end of the shunt resistor 12 via the second copper trace of the copper-clad area 111. That is, the first end of the diode 18 and the second end of the shunt resistor 12 can be connected via aluminum wire 17, or via the second copper trace formed by the copper-clad area 111 on the copper-clad ceramic plate 11, i.e., the copper wire is directly connected to the first end of the diode 18 and the second end of the shunt resistor 12 (whether to connect this copper trace depends on the actual situation). (To other locations) The first end of the second power transistor 19 is connected to the second end of the upper bridge power transistor Q1. This connection can be made directly through a bonding wire, or through a combination of traces and bonding wires on the copper-clad ceramic substrate 11, or directly through traces on the copper-clad ceramic substrate 11. No limitation is made here. Simultaneously, the third end of the second power transistor 19 is connected to the power lead end 15 via aluminum wire 17 or ultrasonic welding. The second end of the second power transistor 19 is connected to the second end of the diode 18 via aluminum wire 17. This completes the second power transistor 19 as a power current sub-unit of an insulated-gate bipolar transistor, integrating the power transistor and shunt resistor 12 and mounting them on the copper-clad ceramic substrate 110. This allows direct use of the shunt resistor 12 integrated in the lower bridge power unit 10 to collect the phase current on the drive bridge arm 121, thereby reducing the design cost of the motor control module and the cost of subsequent installation and disassembly. Further, refer to... Figure 5 , Figure 5 This is a connection diagram of the motor control circuit in the motor control module of this application. The composition of the entire motor control circuit 120 is shown in the figure. The figure shows the connection port of each interface in the circuit diagram on the copper-clad ceramic substrate 110. Based on the connection port, the circuit on the copper-clad ceramic substrate 110 is designed to reduce the design cost of the entire motor control module.
[0070] Furthermore, based on the first, second, and / or third embodiments of the motor control module described above, a fourth embodiment of the motor control module of this application is proposed, with reference to... Figure 6 , Figure 6This is a schematic diagram of a planar structure of the motor control module of this application. The lower bridge signal port 114 includes (this application describes the circuit and connection of the U phase, the connection and composition of the V and W phases are the same as those of the U phase) lower bridge power ports ULg and ULs, a positive current acquisition port IU+ and a negative current acquisition port IU-. The motor control module 100 also includes a lower bridge bonding wire unit, which includes:
[0071] The lower bridge power bonding wire 331 has its first end connected to the signal lead terminal 16 in the lower bridge power unit, and its second end connected to the lower bridge power ports ULg and ULs.
[0072] Positive current bonding wire 341+, the first end of the positive current bonding wire 341+ is connected to the second end of the shunt resistor R1 in the lower bridge power unit 10, and the second end of the positive current bonding wire 341+ is connected to the positive current acquisition port IU+.
[0073] The negative current bonding wire 341- has its first end connected to the first end of the shunt resistor R1 in the lower bridge power unit 10, and its second end connected to the negative current acquisition port IU-. The power lead terminal 15 in the lower bridge power unit 10 is connected to the negative input port 112.
[0074] In one embodiment, the upper bridge signal port 113 includes upper bridge power ports ULg and ULs and three bridge arm output ports U. The motor control module 100 also includes an upper bridge bonding wire unit, which includes:
[0075] The upper bridge power bonding wire 311 has its first end connected to the third end of the upper bridge power transistor Q1, and its second end connected to the upper bridge power ports ULg and ULs.
[0076] Three bridge arm output bonding wires 321 are provided. The first end of each bridge arm output bonding wire 321 is connected to the midpoint of a driving bridge arm 121, and the second end of each bridge arm output bonding wire 321 is connected to a bridge arm output port U.
[0077] In this embodiment, the motor control module also includes bonding wires that connect to various locations and ports in the motor control circuit 120. For example, the lower bridge power bonding wire 331 is used to connect the signal lead terminal 16 in the lower bridge power unit and the lower bridge power ports ULg and ULs (the connection relationships between other ports and various locations in the motor control circuit 120 are shown in the figure). Figure 6In this context, the lower bridge power ports ULg and ULs can be used to control the power transistor's input high and low levels, respectively, or to collect the current flowing through the power transistor. The type of port is not limited here. Through the design of the bonding wires and the ports on the copper-clad ceramic substrate 110, the need for phase current acquisition can be directly selected at the corresponding output port in the lower bridge power unit 10, avoiding the costs associated with installation and disassembly. This also reduces design requirements and lowers the design cost of the motor control module. Further details can be found in... Figure 7 , Figure 7 This is another planar structural schematic diagram of the motor control module of this application. The figure shows a planar connection schematic diagram of the metal-oxide-semiconductor power transistor and the integrated lower bridge power unit 10 of the shunt resistor 12, which is roughly the same as... Figure 6 The composition is the same, except that diode 18 and second power transistor 19 are replaced with first power transistor 13, and a new power transistor is used to integrate the lower bridge power unit 10.
[0078] Furthermore, based on the first, second, third, and / or fourth embodiments of the motor control module of this application described above, a fifth embodiment of the motor control module of this application is proposed. The motor control module includes a temperature resistor 20 disposed on the copper-clad ceramic substrate 110. The copper-clad ceramic substrate 110 also has a first temperature port NTC1 and a second temperature port NTC2. The motor control module further includes:
[0079] First temperature bonding wire 361, the first end of first temperature bonding wire 360 is connected to the first end of temperature resistor 20, and the second end of first temperature bonding wire 361 is connected to first temperature port NTC1.
[0080] The second temperature bonding wire 362 has its first end connected to the second end of the temperature resistor 20, and its second end connected to the second temperature port NTC2.
[0081] In this embodiment, the entire motor control module also includes a temperature resistor 20, which can realize functions such as temperature heating. The temperature resistor 20 can also be connected using a first temperature bonding wire 361 and a second temperature bonding wire 362. It is worth noting that the advantage of using bonding wires here is that the design of the copper-clad ceramic substrate 110 can be directly determined without the need for more jumpers or restrictions on the number of copper layers on the copper-clad ceramic substrate 110, thereby reducing the design cost of the motor control module.
[0082] Based on the first, second, third, fourth and / or fifth embodiments of the motor control module of this application, this application proposes an on-board compressor, which includes a compressor controller, a motor and a compression unit. The compressor controller is connected to the motor, and the motor is connected to the compression unit. The motor control module as described above is provided in the compressor controller.
[0083] It is worth noting that, according to the vehicle compressor of the present invention, the phase current acquisition shunt resistor can be integrated into the lower bridge power unit to acquire the phase current on the drive bridge arm based on the shunt resistor integrated into the lower bridge power unit. This avoids the need for separately arranged shunt resistors or sampling devices. On the one hand, this motor control module integrates the shunt resistor into the lower bridge power unit, thereby reducing the area occupied by the entire power module. On the other hand, integrating the shunt resistor into the lower bridge power unit to directly realize phase current acquisition can reduce the design steps related to arranging phase current acquisition devices, thereby reducing the design cost of the motor control module.
[0084] The vehicle-mounted compressor provided in this application can solve the technical problem of high design cost of motor control modules. Compared with the prior art, the beneficial effects of the vehicle-mounted compressor provided in this application are the same as those of the motor control module provided in the above embodiments, and will not be repeated here.
[0085] This application also provides a vehicle that includes the aforementioned on-board compressor.
[0086] It is worth noting that the on-board compressor can be installed in the vehicle to control the motor based on the compressor controller. The on-board compressor has a motor control module inside, which controls the motor. Furthermore, by integrating the shunt resistor for collecting phase current into the lower bridge power unit, the phase current on the drive bridge arm is collected based on the shunt resistor integrated in the lower bridge power unit. This avoids the need for separately arranged shunt resistors or current sampling devices. This motor control module integrates the shunt resistor into the lower bridge power unit, thereby reducing the overall area occupied by the power module. On the other hand, by directly collecting phase current through the integration of the shunt resistor into the lower bridge power unit, the design steps related to placing phase current collection devices can be reduced, thereby reducing the design cost of the motor control module.
[0087] It is worth noting that the vehicle may also include other hardware, which will not be described in detail here. The entire vehicle compressor can be installed on the vehicle or on other products, and there are no restrictions on this.
[0088] The device provided in this application can solve the technical problem of high design cost of motor control modules. Compared with the prior art, the beneficial effects of the vehicle provided in this application are the same as those of the motor control module provided in the above embodiments, and will not be repeated here.
[0089] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.
Claims
1. A motor control module, characterized in that, The motor control module includes a copper-clad ceramic substrate and a motor control circuit. The motor control circuit is disposed on the copper-clad ceramic substrate, which has a positive input port, a negative input port, an upper bridge signal port, and a lower bridge signal port. The motor control circuit includes three drive bridge arms. The first end of each drive bridge arm is connected to the positive input port, and the second end of each drive bridge arm is connected to the negative input port. The drive bridge arms include: An upper-bridge power transistor, wherein the first end of the upper-bridge power transistor is connected to the positive input port, and the third end of the upper-bridge power transistor is connected to the upper-bridge signal port; The lower bridge power unit has a first end connected to the second end of the upper bridge power transistor, a second end connected to the negative input port, and a third end connected to the lower bridge signal port. The lower bridge power unit integrates a shunt resistor and collects the phase current on the drive bridge arm based on the shunt resistor.
2. The motor control module as described in claim 1, characterized in that, The lower bridge power unit includes: Copper-clad ceramic plates; A power current subunit is disposed in the copper-clad area of the copper-clad ceramic plate; A molding compound completely encapsulates the copper-clad ceramic plate and the power current subunit. The molding compound has signal leads and power leads. The signal leads are connected to a first end of the power current subunit, and the power leads are connected to a second end of the power current subunit.
3. The motor control module as described in claim 2, characterized in that, The power lead terminal is connected to the copper-clad ceramic plate by ultrasonic welding or by bonding aluminum wire, and the first end of the power current subunit is connected to the signal lead terminal by Kelvin connection.
4. The motor control module as described in claim 2, characterized in that, The power current subunit includes: A shunt resistor, wherein the first end of the shunt resistor is connected to the signal lead end; A first power transistor, wherein a first end of the first power transistor is connected to a second end of the upper bridge power transistor, the second end of the first power transistor is connected to a second end of the shunt resistor via an aluminum wire, or the second end of the first power transistor is connected to a second end of the shunt resistor via a first copper trace in the copper-clad area, and a third end of the first power transistor is connected to the power lead end, wherein the first power transistor includes a metal oxide semiconductor power transistor.
5. The motor control module as described in claim 2, characterized in that, The power current subunit includes: A shunt resistor, wherein the first end of the shunt resistor is connected to the signal lead end; A diode, wherein the first end of the diode is connected to the second end of the shunt resistor via an aluminum wire, or the first end of the diode is connected to the second end of the shunt resistor via a second copper trace in the copper-clad area; The second power transistor has a first end connected to the second end of the upper bridge power transistor, a second end connected to the second end of the diode via an aluminum wire, and a third end connected to the power lead end. The second power transistor includes an insulated gate bipolar transistor.
6. The motor control module as described in claim 1, characterized in that, The lower bridge signal port includes a lower bridge power port, a positive current acquisition port, and a negative current acquisition port. The motor control module also includes a lower bridge bonding wire unit, which includes: A lower bridge power bonding wire, wherein the first end of the lower bridge power bonding wire is connected to the signal lead end in the lower bridge power unit, and the second end of the lower bridge power bonding wire is connected to the lower bridge power port; A positive current bonding wire, the first end of which is connected to the second end of the shunt resistor in the lower bridge power unit, and the second end of which is connected to the positive current acquisition port; A negative current bonding wire is provided, with its first end connected to the first end of the shunt resistor in the lower bridge power unit, and its second end connected to the negative current acquisition port. The power lead in the lower bridge power unit is connected to the negative input port.
7. The motor control module as described in claim 1, characterized in that, The upper bridge signal port includes an upper bridge power port and three bridge arm output ports. The motor control module also includes an upper bridge bonding wire unit, which includes: An upper bridge power bonding wire, wherein the first end of the upper bridge power bonding wire is connected to the third end of the upper bridge power transistor, and the second end of the upper bridge power bonding wire is connected to the upper bridge power port; Three bridge arm output bonding wires, the first end of each bridge arm output bonding wire is connected to the midpoint of the bridge arm of the driving bridge arm, and the second end of each bridge arm output bonding wire is connected to the bridge arm output port.
8. The motor control module as described in any one of claims 1 to 7, characterized in that, The motor control module includes a temperature resistor disposed on the copper-clad ceramic substrate. The copper-clad ceramic substrate also has a first temperature port and a second temperature port. The motor control module further includes: A first temperature bonding wire, wherein a first end of the first temperature bonding wire is connected to a first end of the temperature resistor, and a second end of the first temperature bonding wire is connected to the first temperature port; The second temperature bonding wire has a first end connected to the second end of the temperature resistor and a second end connected to the second temperature port.
9. A vehicle-mounted compressor, characterized in that, The vehicle-mounted compressor includes a compressor controller, a motor, and a compressor unit; The compressor controller is connected to the motor, and the motor is connected to the compression unit, wherein the compressor controller is provided with a motor control module as described in any one of claims 1 to 8.
10. A vehicle, characterized in that, The vehicle includes the on-board compressor as described in claim 9.