A manufacturing method for vertical throughflow process on PCB board

Abstract

The application provides a manufacturing method for a vertical through-flow process on a PCB, comprising the following steps: S1: inner layer plate manufacturing: cutting a copper-clad plate into a required size, and making a pattern on the copper-clad plate by using an exposure, development and etching method according to a pattern design; S2: sub-plate manufacturing: pressing the inner layer plate with a pattern made by using a resin sheet by a hot pressing method to form P; S3: sub-plate pattern: making o on P by using a pattern transfer method; and S4: sub-plate drawing: drawing P modules down by using a high-precision drawing machine. The application provides a manufacturing method for a vertical through-flow process on a PCB, which uses a vertical buried wire as a means and uses a copper wire instead of a via hole, can significantly increase the cross-sectional area, thereby reducing the resistance and voltage drop, increases the through-flow area to bear large current, increases the power integrity, effectively increases the heat dissipation surface area, and optimizes the current distribution and heat management.

Description

Technical Field

[0001] This invention relates to the field of PCB boards, and more particularly to a method for manufacturing a vertical flow process on a PCB board. Background Technology

[0002] In the era of rapid digital development, computing power has become the core driving force for the progress of various industries. As the hardware foundation of computing power, the performance improvement of computing chips is crucial for fields such as data processing, artificial intelligence, and cloud computing. As a core component of data centers, the stable operation of computing chips depends on an efficient power supply system. The printed circuit board (PCB) is the basic platform for the integration of computing chips, while the power distribution network (PDN) is the key to ensuring chip performance. As the power consumption problem of data centers, servers, and consumer electronic devices becomes increasingly prominent.

[0003] PCBs need to carry greater current. The conventional process is to increase the copper thickness of vias to achieve this. However, excessive copper thickness can affect the uniformity of the via copper. Poor uniformity can affect current transmission, leading to overheating and reduced heat dissipation.

[0004] Therefore, it is necessary to provide a method for fabricating vertical flow processes on PCBs to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a method for manufacturing a vertical flow process on a PCB board, which solves the problem of overheating and poor heat dissipation caused by current PCB boards using via copper holes to achieve flow.

[0006] To solve the above-mentioned technical problems, the present invention provides a method for manufacturing a vertical current flow process on a PCB board, comprising the following steps: S1: Inner layer board fabrication: Cut the copper-clad board to the required size, and create the pattern on the copper-clad board using exposure, development and etching methods according to the graphic design; S2: Sub-board fabrication: The inner layer boards with completed graphics are pressed together with resin sheets to form P by hot pressing. S3: Sub-board graphic: Use graphic transfer to create o on P; S4: Sub-board retrieval: Use a high-precision retrieval machine to retrieve the P module; S5: Motherboard fabrication: Following method P, the copper-clad laminates are pressed together using a hot press to form i; S6: Motherboard groove: Use a high-precision retrieval machine to retrieve a groove on i that is the same size as P; S7: Embedded sub-board: The circuit layer on P is vertically embedded into the u retrieved from i; S8: Laser copper burning: Using a UV laser machine to burn out the connection pad on the P side wall; S9: Pressing: After laser burning copper, cover the top and bottom with a PP sheet and copper foil, and then press them together using a hot press. S10: Laser hole fabrication: Use a laser drill to burn a 5-7mil Y hole on the outer copper foil, and connect it to the connecting pad; S11: Filling with copper paste: Use a screen printing machine to fill the laser hole with t.

[0007] Preferably, in step S11, the screen printing machine includes an operating table, a lifting device is fixedly installed on the top of the operating table, a storage frame is fixedly installed on one side of the lifting device, a moving device is fixedly installed on the top of the storage frame, and a printing device is provided at the output end of the moving device.

[0008] Preferably, the printing device includes a lifting component, a lifting frame, and a scraper. The lifting component is fixedly installed at the output end of the mobile device, the lifting frame is fixedly installed at the output end of the lifting component, and the scraper is fixedly installed at the bottom of the lifting frame.

[0009] Preferably, both ends of the lifting frame are provided with a collecting device. The collecting device includes a rotating rod, a resetting component, a collecting plate, a connecting component, a guide plate, and a limiting plate. The rotating rod is rotatably connected to the inside of the lifting frame. The resetting component is disposed on the surface of the rotating rod. One end of the collecting plate is fixedly installed on the surface of the rotating rod. The connecting component is fixedly installed on one side of the collecting plate. The guide plate is fixedly installed inside the storage frame. The limiting plate is fixedly installed inside the scraper.

[0010] Preferably, the collecting device further includes a rotating roller, which is rotatably connected to the inside of the collecting plate.

[0011] Preferably, the reset element is a torsion spring, which is sleeved on the surface of the rotating rod.

[0012] Preferably, the connector is a rubber pad, and the two ends of the rubber pad are respectively fixedly installed on one side of the scraper and the collecting plate.

[0013] Preferably, the storage frame is provided with a cleaning device inside. The cleaning device includes a telescopic component and a cleaning plate. The telescopic component is fixedly installed at one end of the storage frame, and the cleaning plate is fixedly installed at the output end of the telescopic component.

[0014] Preferably, the cleaning device further includes multiple guide sleeves and multiple guide rods, wherein the multiple guide sleeves are fixedly installed inside the storage frame, and the multiple guide rods are slidably connected to the inside of the multiple guide sleeves.

[0015] Preferably, one end of each of the plurality of guide rods is fixedly installed on one side of the cleaning plate.

[0016] Compared with related technologies, the manufacturing method of vertical flow process on PCB board provided by the present invention has the following beneficial effects: This invention provides a method for fabricating a vertical current-carrying process on a PCB board. By using vertical embedded traces and replacing vias with copper wires, the cross-sectional area can be significantly increased, thereby reducing resistance and voltage drop. While increasing the current-carrying area to carry large currents, it also increases power integrity, effectively increases the heat dissipation surface area, and optimizes current distribution and thermal management. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of a first embodiment of a method for manufacturing a vertical flow process on a PCB board provided by the present invention; Figure 2 This is a process flow diagram of the motherboard process; Figure 3 A schematic diagram of a vertically embedded wire; Figure 4 This is a schematic diagram of a printed circuit board. Figure 4 (a) shows the circuitry for the daughterboard. Figure 4 (b) shows the motherboard retrieval groove. Figure 4 (c) represents the sub-board embedding. Figure 4 In the middle (d), the pressing is performed. Figure 4 (e) represents laser-treated copper. Figure 4 (f) represents copper paste; Figure 5 This is a schematic diagram of the structure of a second embodiment of a method for manufacturing a vertical flow process on a PCB board provided by the present invention; Figure 6 for Figure 5 The diagram shows the structure of the scraping device. Figure 7 for Figure 6 The enlarged schematic diagram of part A shown below; Figure 8 A schematic diagram of the structure of a third embodiment of a method for manufacturing a vertical flow process on a PCB board provided by the present invention; Figure 9 for Figure 8 The diagram shows the structure of the cleaning plate.

[0018] The following are the labels in the diagram: 1. Operating table, 2. Lifting device, 3. Storage frame, 4. Moving device, 5. Printing device, 51. Lifting component, 52. Lifting frame, 53. Scraper, 6. Collection device, 61. Rotating rod, 62. Reset component, 63. Collection plate, 64. Rotating roller, 65. Connecting component, 66. Guide plate, 67. Limiting plate, 7. Cleaning device, 71. Telescopic component, 72. Cleaning plate, 73. Guide sleeve, 74. Guide rod. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] First Embodiment Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in, Figure 1 A schematic diagram of the structure of a first embodiment of a method for manufacturing a vertical flow process on a PCB board provided by the present invention; Figure 2 This is a process flow diagram of the motherboard process; Figure 3 A schematic diagram of a vertically embedded wire; Figure 4 This is a schematic diagram of a printed circuit board. Figure 4 (a) shows the circuitry for the daughterboard. Figure 4 (b) shows the motherboard retrieval groove. Figure 4 (c) represents the sub-board embedding. Figure 4 In the middle (d), the pressing is performed. Figure 4 (e) represents laser-treated copper. Figure 4 (f) represents copper paste. A method for fabricating a vertical flow process on a PCB board includes the following steps: S1: Inner layer board fabrication: Cut the copper-clad board to the required size, and create the pattern on the copper-clad board using exposure, development and etching methods according to the graphic design; S2: Sub-board (embedded wire layer) fabrication: The inner layer boards with completed patterns are pressed together with resin sheets to form P by hot pressing. S3: Sub-board graphic: Use graphic transfer to create o on P; S4: Sub-board retrieval: Use a high-precision retrieval machine to retrieve the P module; S5: Motherboard fabrication: Following method P, the copper-clad laminates are pressed together using a hot press to form i; S6: Motherboard groove: Use a high-precision retrieval machine to retrieve a groove on i that is the same size as P; S7: Embedded sub-board: The circuit layer on P is vertically embedded into the u retrieved from i; S8: Laser copper burning: Using a UV laser machine to burn out the connection pad on the P side wall; S9: Pressing: After laser burning copper, cover the top and bottom with a PP sheet and copper foil, and then press them together using a hot press. S10: Laser hole fabrication: Use a laser drill to burn a 5-7mil Y hole on the outer copper foil, and connect it to the connecting pad; S11: Copper paste filling: Using a screen printing machine, t is filled into y, which can achieve the conduction effect of laser hole-pad-vertical buried line.

[0021] Figure 4 In the diagram, P represents the daughterboard, o represents the circuit, i represents the motherboard, u represents the slot, y represents the laser hole, and t represents the copper paste.

[0022] In step S11, the screen printing machine includes an operating table 1. A lifting device 2 is fixedly installed on the top of the operating table 1. A storage frame 3 is fixedly installed on one side of the lifting device 2. A moving device 4 is fixedly installed on the top of the storage frame 3. A printing device 5 is provided at the output end of the moving device 4.

[0023] The screen printing machine consists of an operating table 1, a lifting device 2, a storage frame 3, a moving device 4, and a printing device 5. All of these are conventional technologies used in the prior art for printing on PCB boards.

[0024] The printing device 5 includes a lifting component 51, a lifting frame 52, and a scraper 53. The lifting component 51 is fixedly installed at the output end of the moving device 4, the lifting frame 52 is fixedly installed at the output end of the lifting component 51, and the scraper 53 is fixedly installed at the bottom of the lifting frame 52.

[0025] The lifting component 51 is a hydraulic rod, a cylinder, or an electric push rod, used to push the lifting frame 52 connected to the scraper 53 downward to a suitable position, and then move it to one side through the moving device 4 to print on the PCB board.

[0026] Compared with related technologies, the manufacturing method of vertical flow process on PCB board provided by the present invention has the following beneficial effects: This invention provides a method for fabricating a vertical current-carrying process on a PCB board. By using vertical embedded traces and replacing vias with copper wires, the cross-sectional area can be significantly increased, thereby reducing resistance and voltage drop. While increasing the current-carrying area to carry large currents, it also increases power integrity, effectively increases the heat dissipation surface area, and optimizes current distribution and thermal management.

[0027] Second Embodiment Please refer to the following: Figure 5 , Figure 6 and Figure 7Based on the first embodiment of this application, which provides a method for fabricating a vertical flow process on a PCB board, the second embodiment of this application proposes another method for fabricating a vertical flow process on a PCB board. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0028] Specifically, the second embodiment of this application provides a method for manufacturing a vertical flow process on a PCB board, which differs in that it further includes two collecting devices 6. The two collecting devices 6 are respectively disposed at both ends of the lifting frame 52. Each collecting device 6 includes a rotating rod 61, a reset member 62, a collecting plate 63, a connecting member 65, a guide plate 66, and a limiting plate 67. The rotating rod 61 is rotatably connected to the inside of the lifting frame 52. The reset member 62 is disposed on the surface of the rotating rod 61. One end of the collecting plate 63 is fixedly installed on the surface of the rotating rod 61. The connecting member 65 is fixedly installed on one side of the collecting plate 63. The guide plate 66 is fixedly installed inside the storage frame 3. The limiting plate 67 is fixedly installed inside the scraper 53.

[0029] The storage frame 3 is equipped with two guide plates 66. After one end of the collection plate 63 contacts the inclined surface of the guide plate 66, one end of the collection plate 63 moves along the inclined surface to one side, thereby guiding the pigment leaking from both sides of the scraper 53 to the middle, reducing waste and preventing the accumulated pigment from drying inside the storage frame 3.

[0030] The collecting device 6 also includes a rotating roller 64, which is rotatably connected to the inside of the collecting plate 63.

[0031] The rotating roller 64 is used to reduce the friction between the collecting plate 63 and the guide plate 66, so that one end of the collecting plate 63 can move better.

[0032] The reset element 62 is a torsion spring, which is sleeved on the surface of the rotating rod 61.

[0033] The two ends of the torsion spring are fixedly installed inside the collecting plate 63 and the lifting frame 52, respectively.

[0034] The reset component 62 can also be a coil spring, and its two ends are respectively fixedly installed inside the collecting plate 63 and the lifting frame 52, for automatically resetting one end of the collecting plate 63 after it is separated from the guide plate 66.

[0035] The connector 65 is a rubber pad, and the two ends of the rubber pad are respectively fixedly installed on one side of the scraper 53 and the collecting plate 63.

[0036] The rubber pad is used to connect the scraper 53 and the collecting plate 63, thereby preventing the raw material from flowing out from the gap at the connection.

[0037] The connector 65 can also be a flexible thin sheet made of metal or plastic.

[0038] The working principle of the manufacturing method for vertical flow process on PCB board provided by this invention is as follows: In use, when the moving device 4 drives the lifting component 51 connected to the lifting frame 52 to move to one side, the scraper 53 moves to one side to perform printing.

[0039] At the same time, after the scraper 53 moves to one side and contacts the surface of the rotating roller 64 and the guide plate 66, the collecting plate 63, connected to the rotating rod 61, rotates to one side while the reset member 62 tightens, thereby gathering the pigment leaking from both sides of the scraper 53 towards the middle and reducing waste.

[0040] After printing is completed, the lifting component 51 drives the lifting frame 52 connected to the scraper 53 to move upward and reset. When the moving device 4 resets to one side, the reset component 62 resets and drives the collecting plate 63 connected to the rotating rod 61 to rotate to one side and reset, contacting the limiting plate 67 and releasing the limiting of the collecting plate 63.

[0041] Compared with related technologies, the manufacturing method of vertical flow process on PCB board provided by the present invention has the following beneficial effects: This invention provides a method for manufacturing a vertical flow process on a PCB board. By using a collection device 6 to move the printing device 5 to one side, the ink leaking from both sides of the squeegee 53 of the printing device 5 is guided to the middle, reducing waste and preventing the accumulated ink from drying inside the storage frame 3.

[0042] Third Embodiment Please refer to the following: Figure 8 and Figure 9 Based on the first embodiment of this application, which provides a method for fabricating a vertical flow process on a PCB board, the third embodiment of this application proposes another method for fabricating a vertical flow process on a PCB board. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the separate implementation of the first embodiment.

[0043] Specifically, the third embodiment of this application provides a different method for manufacturing a vertical flow process on a PCB board, which further includes a cleaning device 7. The cleaning device 7 is disposed inside the storage frame 3. The cleaning device 7 includes a telescopic member 71 and a cleaning plate 72. The telescopic member 71 is fixedly installed at one end of the storage frame 3, and the cleaning plate 72 is fixedly installed at the output end of the telescopic member 71.

[0044] The telescopic component 71 is a hydraulic rod, a cylinder, or an electric push rod, which is used to push the cleaning plate 72 to one side after starting, so as to move the pigment in the storage frame 3 between the two scrapers 53, thereby reducing the waste of raw materials and preventing the accumulated pigment from drying inside the storage frame 3.

[0045] The cleaning device 7 also includes multiple guide sleeves 73 and multiple guide rods 74. The multiple guide sleeves 73 are fixedly installed inside the storage frame 3, and the multiple guide rods 74 are slidably connected to the inside of the multiple guide sleeves 73.

[0046] One end of each of the guide rods 74 is fixedly installed on one side of the cleaning plate 72.

[0047] Multiple guide rods 74, in conjunction with multiple guide sleeves 73, increase the stability of the cleaning plate 72 during movement and limit its movement.

[0048] The working principle of the manufacturing method for vertical flow process on PCB board provided by this invention is as follows: In use, when the moving device 4 moves the scraper 53 to one side and resets it, the telescopic component 17 is activated to push the cleaning plate 72, which is connected to multiple guide rods 74, to move inside multiple guide sleeves 73 respectively, thereby moving the cleaning plate 72 to one side and pushing the pigment between the two cleaning plates 72.

[0049] Compared with related technologies, the manufacturing method of vertical flow process on PCB board provided by the present invention has the following beneficial effects: This invention provides a manufacturing method for a vertical flow process on a PCB board. By using a cleaning device 7 to move the pigment in the storage frame 3 between two scrapers 53, the waste of raw materials is reduced while preventing the accumulated pigment from drying inside the storage frame 3.

[0050] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A manufacturing method for a vertical through flow process on a PCB board, characterized in that, Including: the following step: S1: Inner layer board fabrication: Cut the copper-clad board to the required size, and create the pattern on the copper-clad board using exposure, development and etching methods according to the graphic design; S2: Sub-board fabrication: The inner layer boards with completed graphics are pressed together with resin sheets to form P by hot pressing. S3: Sub-board graphic: Use graphic transfer to create o on P; S4: Sub-board retrieval: Use a high-precision retrieval machine to retrieve the P module; S5: Motherboard fabrication: Following method P, the copper-clad laminates are pressed together using a hot press to form i; S6: Motherboard groove: Use a high-precision retrieval machine to retrieve a groove on i that is the same size as P; S7: Embedded sub-board: The circuit layer on P is vertically embedded into the u retrieved from i; S8: Laser copper burning: Using a UV laser machine to burn out the connection pad on the P side wall; S9: Pressing: After laser burning copper, cover the top and bottom with a PP sheet and copper foil, and then press them together using a hot press. S10: Laser hole fabrication: Use a laser drill to burn a 5-7mil Y hole on the outer copper foil, and connect it to the connecting pad; S11: Filling with copper paste: Use a screen printing machine to fill the laser hole with t.

2. The method of claim 1, wherein the method further comprises: In step S11, the screen printing machine includes an operating table. A lifting device is fixedly installed on the top of the operating table. A storage frame is fixedly installed on one side of the lifting device. A moving device is fixedly installed on the top of the storage frame. A printing device is provided at the output end of the moving device.

3. The method of claim 2, wherein the method further comprises: The printing device includes a lifting component, a lifting frame, and a scraper. The lifting component is fixedly installed at the output end of the mobile device, the lifting frame is fixedly installed at the output end of the lifting component, and the scraper is fixedly installed at the bottom of the lifting frame.

4. The method of claim 3, wherein the method further comprises: Both ends of the lifting frame are equipped with a collection device. The collection device includes a rotating rod, a reset component, a collection plate, a connecting component, a guide plate, and a limiting plate. The rotating rod is rotatably connected to the inside of the lifting frame. The reset component is disposed on the surface of the rotating rod. One end of the collection plate is fixedly installed on the surface of the rotating rod. The connecting component is fixedly installed on one side of the collection plate. The guide plate is fixedly installed inside the storage frame. The limiting plate is fixedly installed inside the scraper.

5. The method of claim 4, wherein the method further comprises: The collecting device also includes a rotating roller, which is rotatably connected to the inside of the collecting plate.

6. The method of claim 4, wherein the method further comprises: The reset element is a torsion spring, which is sleeved on the surface of the rotating rod.

7. The method of claim 4, wherein the method further comprises: The connector is a rubber pad, and the two ends of the rubber pad are respectively fixedly installed on one side of the scraper and the collecting plate.

8. The method of claim 2, wherein the method further comprises: The storage frame is equipped with a cleaning device, which includes a telescopic component and a cleaning plate. The telescopic component is fixedly installed at one end of the storage frame, and the cleaning plate is fixedly installed at the output end of the telescopic component.

9. The method of claim 8, wherein the method further comprises: The cleaning device also includes multiple guide sleeves and multiple guide rods. The multiple guide sleeves are fixedly installed inside the storage frame, and the multiple guide rods are slidably connected to the inside of the multiple guide sleeves.

10. The method of claim 9, wherein the method further comprises: One end of each of the guide rods is fixedly installed on one side of the cleaning plate.

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