Method for hybrid surface treatment of gold plated fingers

Abstract

This invention provides a hybrid surface treatment processing method for electroplated gold fingers, relating to the field of circuit board manufacturing technology. The method includes: a base with a support frame on top; and an optimized processing flow where the gold finger conductors are designed as independent pre-processed lines. In the first stage of the process, acid etching is used to remove the substrate area surrounding the gold finger, ensuring a clear physical isolation between the gold finger and the conductor connection area before subsequent electroplating. During the final etching of the conductors, because the gold finger structure is already independently formed, edge defects or residual copper due to etching solution attacking the connection point are avoided, ensuring the integrity and cleanliness of the gold finger outline. This solves the problem of gold seepage on the sides of the electroplated conductors caused by the height difference between the gold finger and the substrate, the poor fluidity of the dry film during dry film coverage, and the gold wire residue on the electroplated conductors after etching due to the corrosion resistance of gold and nickel.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a hybrid surface treatment method for electroplated gold fingers. Background Technology

[0002] In the complex internal structure of electronic devices, the gold fingers on the circuit board are one of the core components ensuring stable operation. Located at the edge of the printed circuit board, the gold fingers are typically elongated strips with a series of regularly spaced, closely spaced gold contacts. These contacts, covered with a thin layer of gold plating, shimmer with a golden luster under light, hence the name "gold fingers." The shape design of the gold fingers is precise and standardized; the spacing, size, and arrangement of the contacts are strictly controlled according to different application scenarios and industry standards to ensure a tight and stable connection with the corresponding slots or interfaces. For example, application number CN202210752988.1 discloses a gold plating device and method for segmented gold fingers on circuit boards, including a main body shell and a dual-axis motor. A working cavity is opened on one side of the main body shell, and a connecting plate is arranged on one side of the working cavity. Multiple negative terminals are evenly arranged on the connecting plate. When the dual-axis motor is started, the movable clamping block is moved to clamp the circuit board by the linkage mechanism, and the connecting plate and the second connecting plate are moved at the same time. By starting the dual-axis motor and using the linkage mechanism to move the connecting plate, the negative terminals are moved to contact the circuit board. At the same time, the second connecting plate is moved, which moves the gold plating pen to contact the circuit board. The connecting plate moves, which in turn moves the movable clamping block to cooperate with the slot to clamp and fix the circuit board. This allows for quick and convenient fixing of the circuit board and quick and convenient entry of the device into the gold plating state, thereby improving the gold plating efficiency and thus improving production efficiency.

[0003] Currently, in the processing of electroplated gold fingers, due to the height difference between the gold fingers and the substrate, and the poor fluidity of the dry film during application, the copper layer of the gold fingers cannot be completely filled. This results in gold seepage on the sides of the electroplated wires. Furthermore, due to the corrosion resistance of gold and nickel, gold wire residue remains after etching. Moreover, the electroplating head generally uses bolt-fitting technology, which makes angle adjustment cumbersome and reduces operational flexibility. In addition, the vertical and horizontal positioning of the substrate are independent modules, requiring coordinated step-by-step positioning, making the operation cumbersome and resulting in poor equipment processing efficiency. Summary of the Invention

[0004] This invention relates to a hybrid surface treatment apparatus for electroplating gold fingers. In the optimized processing flow, the gold finger conductors are designed as independent pre-line circuits. In the line 1 stage, the substrate area around the gold finger is removed in advance by acid etching, so that the connection area between the gold finger and the conductor has a clear physical isolation before subsequent electroplating. When finally etching the conductor, since the gold finger structure has been independently formed, the edge defects or residual copper residue of the gold finger caused by the etching solution attacking the connection point are avoided, ensuring the integrity and cleanliness of the gold finger outline.

[0005] The present invention provides the purpose and effect of a mixed surface treatment processing method for electroplated gold fingers, specifically including: a support frame is provided on the top of the base, an X-axis adjustment frame is provided on the crossbar of the support frame, a Y-axis adjustment frame is provided on the X-axis adjustment frame, and a Z-axis adjustment frame is provided on the top of the base, with the Z-axis adjustment frame located below the X-axis adjustment frame; The Y-axis adjustment frame is equipped with a mounting base; the mounting base has a fixing column at the front; the fixing column has an electroplating controller at the bottom; the electroplating controller has an electroplating head; the electroplating controller has a positioning component at the front; the Z-axis adjustment frame is equipped with an operating table; the operating table has an adjusting clamp at the top; the Z-axis adjustment frame has two pressure plates above it, and the two pressure plates are distributed symmetrically from left to right.

[0006] Furthermore, the mounting base is equipped with a liquid injection controller at the front, and the liquid injection controller is located on the right side of the fixed column. The top of the liquid injection controller is equipped with a gold solution storage tank, and the bottom of the liquid injection controller is equipped with a liquid injection pipe, with the bottom end of the liquid injection pipe corresponding to the electroplating head.

[0007] Furthermore, the bottom end of the fixed column is provided with connecting ears, and the connecting ears are provided with pins. The electroplating controller is rotatably connected to the connecting ears through the pins. The front end of the pin is provided with a positioning groove, and the positioning grooves are distributed in a ring array.

[0008] Furthermore, the electroplating controller has a limiting sleeve at the bottom, two first through slots on the electroplating controller, and the two first through slots are distributed symmetrically in front and behind. Fixing blocks are provided on the front and rear sides of the electroplating controller, and a limiting slide rod is provided at the bottom of the fixing block. A first compression spring is fitted on the limiting slide rod.

[0009] Furthermore, the electroplating head is provided with a connector at the top, and the connector slides through the limiting sleeve. The connector is provided with two support plates, and the support plates are slidably connected to the electroplating controller through the first through groove. The limiting slide rod slides through the support plate, and the first compression spring is supported between the fixed block and the support plate. The connector is provided with a connecting line at the top.

[0010] Furthermore, the positioning component includes a fixed sleeve, a sliding plate, a locking block, a toggle post, a limiting rod, a tension spring, and a second through slot. The fixed sleeve is provided with a sliding plate, which has an "L" shaped structure. A locking block is provided at the top of the sliding plate, and the locking block engages with the positioning slot. A toggle post is provided on the front side of the sliding plate, and a limiting rod is provided on the horizontal plate of the sliding plate. A tension spring is fitted on the limiting rod. A second through slot is provided on the front side of the fixed sleeve. The toggle post is slidably connected to the fixed sleeve through the second through slot, and the limiting rod is slidably inserted into the fixed sleeve. Both ends of the tension spring are respectively connected to the horizontal plate of the sliding plate and the fixed sleeve.

[0011] Furthermore, the top of the operating table is provided with a fixed clamping plate, and the fixed clamping plate and the adjusting clamping plate are distributed in a parallel manner. The top of the operating table is provided with four limiting posts, and the four limiting posts are distributed in a rectangular array. The limiting posts slide through the lower pressure plate. The rear of the operating table is provided with a limiting baffle. The left and right sides of the operating table are provided with connecting frames.

[0012] Furthermore, the rear part of the adjusting clamp is provided with two limiting round rods, which are symmetrically distributed. A circular baffle is provided at the rear end of the limiting round rod, and a second compression spring is fitted on the limiting round rod. The limiting round rod slides through the limiting baffle, and the second compression spring is supported between the circular baffle and the limiting baffle. Connecting blocks are provided at the left and right ends of the adjusting clamp, which are symmetrically distributed. A toggle groove is provided on the outer side of the two connecting blocks.

[0013] Furthermore, a fixing frame is provided at the top center of the lower pressure plate, a cylinder is provided at the bottom of the fixing frame, and the cylinder is fixedly connected to the connecting frame. An adjusting column is provided at the top of the lower pressure plate, and the adjusting column is correspondingly slidably engaged with the toggle groove. A limiting frame is provided at the top of the lower pressure plate. A sliding block is provided on one side of the adjusting column, a limiting block is provided on one side of the sliding block, and a threaded sleeve is provided at the end of the limiting block; The limiting frame has a third through groove, a lead screw is rotatably mounted on the limiting frame, a sliding block is set inside the limiting frame, and the limiting block is slidably connected to the limiting frame through the third through groove, and the threaded sleeve is slidably fitted onto the lead screw by means of threads.

[0014] This invention discloses a processing method for a hybrid surface treatment apparatus for electroplating gold fingers, comprising the following steps: Line 1: An isolation trench is etched in the substrate area between the gold finger and the internal connection line to physically separate the gold finger from the wire area that will be etched away in the future. A short wire pattern of about 0.5mm-1mm in length is made. Based on the line width of the original design, the width on one side is increased by 0.6mil to 1mil. Then acid etching is performed, and the exposed copper layer of the substrate area is etched away to form a depression. Line 2, after coating the photosensitive film again and exposing and developing it, precisely expose the gold finger area that needs to be electroplated with hard gold. At the same time, the lead connecting the gold finger also needs to be partially exposed as a current channel for electroplating. This exposed pattern needs to be expanded outward by at least 3mil on each side based on the final solder mask window pattern, and then nickel-gold electroplating is performed. Finally, the film is removed and washed away. Line 3 uses a negative film process, where the mask pattern is the opposite of the actual line. A photosensitive film is coated on the board that has been electroplated with gold. After exposure and development by negative film, the copper lines that need to be retained are covered and protected by the photosensitive film, while the blank areas that need to be etched away (i.e. the substrate between the lines) are exposed. Then, solder resist is applied and characters are silkscreened. Line 4 involves applying a final photosensitive film to the board that has already been solder resisted. After exposure and development, a dry film is used to tightly cover the gold fingers and their surrounding area, leaving only the areas requiring electroless nickel-gold deposition exposed. Electroless nickel-gold deposition is then performed, followed by film removal to obtain the final circuit board.

[0015] This invention provides a hybrid surface treatment apparatus for electroplating gold fingers, which has the following beneficial effects: In this invention, the gold finger conductor is designed as an independent pre-line in the optimized processing flow. In the first stage of the circuit, the substrate area around the gold finger is removed in advance by acid etching, so that the connection area between the gold finger and the conductor has a clear physical isolation before subsequent electroplating. When etching the conductor in the final stage, since the gold finger structure has been formed independently, the edge defects or residual copper residue of the gold finger caused by the etching solution attacking the connection point are avoided, thus ensuring the integrity and cleanliness of the gold finger outline.

[0016] Furthermore, the electroplating controller in this invention uses a pin shaft as its axis, which can drive the electroplating head to adjust its angle. The positioning groove and the locking block work together, and the tension spring pulls back to position the angle of the electroplating head. After manually adjusting the electroplating head to the target angle, the tension spring automatically pulls the locking block to reset and lock it. No tools are required, which greatly shortens the debugging time. Its adjustment operation is convenient, and the electroplating head can be quickly switched to the angle required by different processes to adapt to the electroplating needs of diverse product structures.

[0017] Furthermore, in this invention, the cylinder provides power to drive the lower pressure plate downward to press and position the substrate. At the same time, the adjusting column slides into the sliding groove, allowing the connecting block to drive the adjusting clamping plate forward. The adjusting clamping plate and the fixed clamping plate work together to clamp and fix the substrate in the front and back directions. With only a single power source, the cylinder can simultaneously drive the positioning actions in both vertical pressing and horizontal clamping dimensions, simplifying the complexity of the mechanism and the control logic, significantly shortening the positioning and clamping time, and improving the production cycle. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0019] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0020] In the attached diagram: Figure 1 This is a schematic diagram of the overall axial view structure of an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the mounting base, fixing column, electroplating controller, electroplating head, and positioning component according to an embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram of the partial fixed column, electroplating controller, and electroplating head disassembled in an embodiment of the present invention.

[0023] Figure 4 This is a schematic diagram of the split state structure of the positioning component according to an embodiment of the present invention.

[0024] Figure 5 This is a schematic diagram of the operating table, adjusting clamp, and lower pressure plate of an embodiment of the present invention.

[0025] Figure 6 This is a schematic diagram of the operating console structure according to an embodiment of the present invention.

[0026] Figure 7 This is a schematic diagram of the adjusting clamp structure according to an embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram of the lower pressure plate structure according to an embodiment of the present invention.

[0028] Figure 9 This is a schematic diagram of the partial split-state structure of the lower pressure plate according to an embodiment of the present invention.

[0029] List of reference numerals 1. Base; 101. Support frame; 102. X-axis adjustment frame; 103. Y-axis adjustment frame; 104. Z-axis adjustment frame; 2. Mounting base; 201. Liquid injection controller; 202. Gold solution storage tank; 203. Liquid injection pipe; 3. Fixing column; 301. Connecting double ears; 302. Pin shaft; 303. Positioning groove; 4. Electroplating controller; 401. Limiting sleeve; 402. First through groove; 403. Fixing block; 404. Limiting slide rod; 405. First compression spring; 5. Electroplating head; 501. Connector; 502. Support plate; 503. Connecting wire; 6. Positioning assembly; 601. Fixing sleeve; 602. Sliding plate; 603. Locking block; 604. Actuating post; 605. Limiting rod; 606. Tension spring; 607. Second through slot; 7. Operating table; 701. Fixed clamping plate; 702. Limiting post; 703. Limiting baffle; 704. Connecting frame; 8. Adjusting clamping plate; 801. Limiting round rod; 802. Round baffle; 803. Second compression spring; 804. Connecting block; 805. Actuating slot; 9. Lower pressure plate; 901. Fixed frame; 902. Cylinder; 903. Adjusting post; 9031. Sliding block; 9032. Limiting block; 9033. Threaded sleeve; 904. Limiting frame; 9041. Third through slot; 9042. Lead screw. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1: Please refer to Figures 1 to 9 As shown: The present invention provides a mixed surface treatment processing method for electroplated gold fingers, comprising: a base 1, a support frame 101 on the top of the base 1, an X-axis adjustment frame 102 on the crossbar of the support frame 101, a Y-axis adjustment frame 103 on the X-axis adjustment frame 102, and a Z-axis adjustment frame 104 on the top of the base 1, wherein the Z-axis adjustment frame 104 is located below the X-axis adjustment frame 102. The Y-axis adjustment frame 103 is provided with a mounting base 2; the mounting base 2 is provided with a fixing column 3 at the front; the fixing column 3 is provided with an electroplating controller 4 at the bottom; the electroplating controller 4 is provided with an electroplating head 5; the electroplating controller 4 is provided with a positioning component 6 at the front; the Z-axis adjustment frame 104 is provided with an operating table 7; the operating table 7 is provided with an adjusting clamp 8 at the top; the Z-axis adjustment frame 104 is provided with two lower pressure plates 9 above it, and the two lower pressure plates 9 are distributed symmetrically from left to right. The mounting base 2 is equipped with a liquid injection controller 201 at the front, and the liquid injection controller 201 is located on the right side of the fixed column 3. The top of the liquid injection controller 201 is equipped with a gold solution storage tank 202, and the bottom of the liquid injection controller 201 is equipped with a liquid injection pipe 203, and the bottom end of the liquid injection pipe 203 corresponds to the electroplating head 5.

[0032] In this embodiment of the disclosure, such as Figures 2 to 4 As shown, the bottom end of the fixed column 3 is provided with connecting ears 301, and the connecting ears 301 is provided with pins 302. The electroplating controller 4 is rotatably connected to the connecting ears 301 through the pins 302. The front end of the pins 302 is provided with positioning grooves 303, and the positioning grooves 303 are distributed in a ring array. The electroplating controller 4 has a limiting sleeve 401 at the bottom and two first through slots 402 on the electroplating controller 4. The two first through slots 402 are distributed symmetrically in front and behind. The electroplating controller 4 has fixing blocks 403 on the front and rear sides. The fixing blocks 403 have a limiting slide rod 404 at the bottom. A first compression spring 405 is fitted on the limiting slide rod 404. The electroplating head 5 is provided with a connector 501 at the top, and the connector 501 slides through the limiting sleeve 401. The connector 501 is provided with two support plates 502, and the support plates 502 are slidably connected to the electroplating controller 4 through the first through groove 402. The limiting slide rod 404 slides through the support plate 502, and the first compression spring 405 is supported between the fixing block 403 and the support plate 502. The connector 501 is provided with a connecting line 503 at the top. The positioning component 6 includes a fixed sleeve 601, a sliding plate 602, a locking block 603, a toggle post 604, a limiting rod 605, a tension spring 606, and a second through slot 607. The fixed sleeve 601 is provided with a sliding plate 602, which has an "L"-shaped structure. The top of the sliding plate 602 is provided with a locking block 603, which engages with the positioning slot 303. The toggle post 604 is provided on the front side of the sliding plate 602. The limiting rod 605 is provided on the horizontal plate of the sliding plate 602, and a tension spring 606 is fitted on the limiting rod 605. The fixed sleeve 601 has a second through slot 607 on the front side, through which the toggle post 604 passes. 607 is slidably connected to the fixed sleeve 601, and the limiting rod 605 is slidably inserted into the fixed sleeve 601. The two ends of the tension spring 606 are respectively connected to the horizontal plate of the sliding plate 602 and the fixed sleeve 601. In this invention, the electroplating controller 4 takes the pin 302 as the axis and can drive the electroplating head 5 to perform angle deflection adjustment. Through the cooperation of the positioning groove 303 and the locking block 603, and by utilizing the rebound pulling action of the tension spring 606, the angle of the electroplating head 5 is positioned. After manually adjusting the electroplating head 5 to the target angle, the tension spring 606 automatically pulls the locking block 603 to reset and lock. No tools are required, which greatly shortens the debugging time.

[0033] In this embodiment of the disclosure, such as Figures 5 to 8 As shown, the top of the operating table 7 is provided with a fixed clamping plate 701, and the fixed clamping plate 701 and the adjusting clamping plate 8 are distributed in a parallel manner. The top of the operating table 7 is provided with four limiting posts 702, and the four limiting posts 702 are distributed in a rectangular array. The limiting posts 702 slide through the lower pressure plate 9. The rear of the operating table 7 is provided with a limiting baffle 703. The left and right sides of the operating table 7 are provided with connecting frames 704. The adjusting clamp 8 has two limiting round rods 801 at the rear, and the two limiting round rods 801 are symmetrically distributed. The rear end of the limiting round rod 801 is provided with a circular baffle 802. A second compression spring 803 is fitted on the limiting round rod 801. The limiting round rod 801 slides through the limiting baffle 703, and the second compression spring 803 is supported between the circular baffle 802 and the limiting baffle 703. The left and right ends of the adjusting clamp 8 are provided with connecting blocks 804, and the two connecting blocks 804 are symmetrically distributed. The two connecting blocks 804 are provided with a toggle groove 805 on their opposite outer sides. A fixing frame 901 is provided at the top center of the lower pressure plate 9, and a cylinder 902 is provided at the bottom of the fixing frame 901. The cylinder 902 is fixedly connected to the connecting frame 704. An adjusting column 903 is provided at the top of the lower pressure plate 9, and the adjusting column 903 is corresponding to the sliding engagement of the actuating groove 805. A limiting frame 904 is provided at the top of the lower pressure plate 9. In this invention, the cylinder 902 provides power to drive the lower pressure plate 9 to adjust downward to press and position the substrate. At the same time, the adjusting column 903 is corresponding to the sliding engagement of the actuating groove 805, which allows the connecting block 804 to drive the adjusting clamping plate 8 to slide forward and adjust. The adjusting clamping plate 8 and the fixing clamping plate 701 cooperate with each other to clamp and fix the substrate in the front and back directions. Only one power source, the cylinder 902, can simultaneously drive the positioning actions in two dimensions: vertical pressing and horizontal clamping.

[0034] Example 2, based on Example 1, such as Figures 6 to 8 As shown, a sliding block 9031 is provided on one side of the adjusting column 903, a limiting block 9032 is provided on one side of the sliding block 9031, and a threaded sleeve 9033 is provided at the end of the limiting block 9032. The limiting frame 904 has a third through groove 9041. A lead screw 9042 is rotatably mounted on the limiting frame 904. A sliding block 9031 is disposed inside the limiting frame 904, and the limiting block 9032 is slidably connected to the limiting frame 904 through the third through groove 9041. A threaded sleeve 9033 is slidably fitted onto the lead screw 9042 by means of threads. In this invention, by manually rotating the lead screw 9042, the lead screw 9042 and the threaded sleeve 9033 can be driven to adjust the sliding block 9031 along the third through groove 9041 back and forth. This allows the clamping distance to be adjusted according to the front and back width of the substrate, effectively adapting to substrate sizes with different tolerance ranges, ensuring that the clamping is both firm and secure without loosening, and that the substrate is not deformed or damaged due to excessive tightness.

[0035] The specific usage and function of this embodiment are as follows: In use, the electroplating controller 4, with the pin 302 as the axis, can drive the electroplating head 5 to adjust its angle. The positioning groove 303 and the locking block 603 cooperate with each other, and the tension spring 606 pulls back to position the angle of the electroplating head 5. After manually adjusting the electroplating head 5 to the target angle, the tension spring 606 automatically pulls the locking block 603 to reset and lock, eliminating the need for tools and significantly shortening the debugging time. The cylinder 902 provides power to drive the lower pressure plate 9 downward to press and position the substrate. Simultaneously, the adjusting column 903 corresponds to the toggle groove 805. The sliding engagement allows the connecting block 804 to slide the adjusting clamp 8 forward for adjustment. The adjusting clamp 8 and the fixed clamp 701 work together to clamp and fix the substrate in the front-to-back direction. The positioning actions in both vertical downward pressure and horizontal clamping can be driven simultaneously by a single power source, the cylinder 902. By manually rotating the lead screw 9042, the lead screw 9042 and the threaded sleeve 9033 can drive the sliding block 9031 to adjust the adjusting column 903 along the third through groove 9041. This allows the clamping distance to be adjusted according to the front-to-back width of the substrate, effectively adapting to substrate sizes with different tolerance ranges.

[0036] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A mixed surface treatment apparatus for electroplating gold fingers, characterized in that, include: The base (1) is provided with a support frame (101) on the top, and an X-axis adjustment frame (102) is provided on the crossbar of the support frame (101). A Y-axis adjustment frame (103) is provided on the X-axis adjustment frame (102). A Z-axis adjustment frame (104) is provided on the top of the base (1), and the Z-axis adjustment frame (104) is located below the X-axis adjustment frame (102). The Y-axis adjustment frame (103) is provided with a mounting base (2); the mounting base (2) is provided with a fixing column (3) at the front; the fixing column (3) is provided with an electroplating controller (4) at the bottom; the electroplating controller (4) is provided with an electroplating head (5); the electroplating controller (4) is provided with a positioning component (6) at the front; the Z-axis adjustment frame (104) is provided with an operating table (7); the operating table (7) is provided with an adjusting clamp (8) at the top; the Z-axis adjustment frame (104) is provided with two pressure plates (9) above it, and the two pressure plates (9) are distributed symmetrically on the left and right.

2. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 1, characterized in that... The mounting base (2) is provided with a liquid injection controller (201) at the front, and the liquid injection controller (201) is located on the right side of the fixed column (3). The top of the liquid injection controller (201) is provided with a gold solution storage tank (202), and the bottom of the liquid injection controller (201) is provided with a liquid injection pipe (203), and the bottom end of the liquid injection pipe (203) corresponds to the electroplating head (5).

3. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 2, characterized in that... The bottom end of the fixed column (3) is provided with connecting ears (301), and the connecting ears (301) is provided with pins (302). The electroplating controller (4) is rotatably connected to the connecting ears (301) through the pins (302). The front end of the pins (302) is provided with positioning grooves (303), and the positioning grooves (303) are distributed in a ring array.

4. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 3, characterized in that, The electroplating controller (4) has a limiting sleeve (401) at the bottom and two first through slots (402) on the electroplating controller (4), which are distributed symmetrically in front and behind. The electroplating controller (4) has fixing blocks (403) on the front and back sides, and a limiting slide rod (404) is provided at the bottom of the fixing block (403). A first compression spring (405) is fitted on the limiting slide rod (404).

5. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 4, characterized in that, The electroplating head (5) is provided with a connector (501) at the top, and the connector (501) slides through the limiting sleeve (401). The connector (501) is provided with two support plates (502), and the support plate (502) is slidably connected to the electroplating controller (4) through the first through groove (402). The limiting slide rod (404) slides through the support plate (502), and the first compression spring (405) is supported between the fixing block (403) and the support plate (502). The connector (501) is provided with a connecting line (503) at the top.

6. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 5, characterized in that, The positioning component (6) includes a fixed sleeve (601), a sliding plate (602), a locking block (603), a toggle post (604), a limiting rod (605), a tension spring (606), and a second through groove (607). The fixed sleeve (601) is provided with a sliding plate (602), and the sliding plate (602) has an "L" shaped structure. The top of the sliding plate (602) is provided with a locking block (603), and the locking block (603) is engaged with the positioning groove (303). The front side of the sliding plate (602) is provided with a toggle post (604). 04), a limiting rod (605) is provided on the horizontal plate of the sliding plate (602), and a tension spring (606) is fitted on the limiting rod (605). A second through groove (607) is provided on the front side of the fixed sleeve (601). The actuating column (604) is slidably connected to the fixed sleeve (601) through the second through groove (607), and the limiting rod (605) is slidably inserted into the fixed sleeve (601). The two ends of the tension spring (606) are respectively connected to the horizontal plate of the sliding plate (602) and the fixed sleeve (601).

7. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 6, characterized in that, The top of the operating table (7) is provided with a fixed clamp (701), and the fixed clamp (701) and the adjusting clamp (8) are distributed in a parallel manner. The top of the operating table (7) is provided with four limiting posts (702), and the four limiting posts (702) are distributed in a rectangular array. The limiting posts (702) slide through the lower pressure plate (9). The rear of the operating table (7) is provided with a limiting baffle (703), and the left and right sides of the operating table (7) are provided with connecting frames (704).

8. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 7, characterized in that, The adjusting clamp (8) has two limiting rods (801) at the rear, and the two limiting rods (801) are symmetrically distributed. The limiting rods (801) have a circular baffle (802) at the rear end. A second compression spring (803) is fitted on the limiting rods (801). The limiting rods (801) slide through the limiting baffle (703), and the second compression spring (803) is supported between the circular baffle (802) and the limiting baffle (703). The adjusting clamp (8) has connecting blocks (804) at both ends, and the two connecting blocks (804) are symmetrically distributed. The two connecting blocks (804) have a toggle groove (805) on their outer sides.

9. The hybrid surface treatment apparatus for electroplating gold fingers as described in claim 8, characterized in that, The lower pressure plate (9) is provided with a fixed frame (901) at the top middle position, and a cylinder (902) is provided at the bottom of the fixed frame (901). The cylinder (902) is fixedly connected to the connecting frame (704). The lower pressure plate (9) is provided with an adjusting column (903) at the top, and the adjusting column (903) is slidably engaged with the actuating groove (805). The lower pressure plate (9) is provided with a limiting frame (904) at the top. A sliding block (9031) is provided on one side of the adjusting column (903), a limiting block (9032) is provided on one side of the sliding block (9031), and a threaded sleeve (9033) is provided at the end of the limiting block (9032). The limiting frame (904) has a third through groove (9041), a lead screw (9042) is rotatably mounted on the limiting frame (904), a sliding block (9031) is set inside the limiting frame (904), and the limiting block (9032) is slidably connected to the limiting frame (904) through the third through groove (9041), and a threaded sleeve (9033) is slidably fitted onto the lead screw (9042) by means of threads.

10. The processing method of the hybrid surface treatment apparatus for electroplating gold fingers as described in claim 9, characterized in that, Includes the following steps: Line 1: An isolation trench is etched in the substrate area between the gold finger and the internal connection line to physically separate the gold finger from the wire area that will be etched away in the future. A short wire pattern of about 0.5mm-1mm in length is made. Based on the line width of the original design, the width on one side is increased by 0.6mil to 1mil. Then acid etching is performed, and the exposed copper layer of the substrate area is etched away to form a depression. Line 2, after coating the photosensitive film again and exposing and developing it, precisely expose the gold finger area that needs to be electroplated with hard gold. At the same time, the lead connecting the gold finger also needs to be partially exposed as a current channel for electroplating. This exposed pattern needs to be expanded outward by at least 3mil on each side based on the final solder mask window pattern, and then nickel-gold electroplating is performed. Finally, the film is removed and washed away. Line 3 uses a negative film process, where the mask pattern is the opposite of the actual circuit. A photosensitive film is coated on the board that has been electroplated with gold. After exposure and development by negative film, the copper circuit parts that need to be retained are covered and protected by the photosensitive film, while the blank areas that need to be etched are exposed. Then, solder resist is applied and characters are silkscreened. Line 4 involves applying a final photosensitive film to the board that has already been solder resisted. After exposure and development, a dry film is used to tightly cover the gold fingers and their surrounding area, leaving only the areas requiring electroless nickel-gold deposition exposed. Electroless nickel-gold deposition is then performed, followed by film removal to obtain the final circuit board.

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