Bipv products and methods for their production

Abstract

This invention discloses a BIPV product and its manufacturing method. The BIPV product includes a first encapsulation board, a photoelectric conversion module, a first connecting layer, and a second encapsulation board stacked and connected along a first direction. The first encapsulation board includes a first substrate and a first pattern layer. The first substrate includes a printed area and a non-printed area, and the first pattern layer covers the printed area. The first connecting layer includes a second pattern layer, and the orthographic projection of the second pattern layer along the first direction onto the printed area of ​​the first encapsulation board is located. Light from the outside of the first encapsulation board can pass through the first pattern layer and the photoelectric conversion module to illuminate the second pattern layer. This invention presents a specific pattern by superimposing the colors of the first pattern layer, the photoelectric conversion module, and the second pattern layer, overcoming the problem that traditional full-page printing cannot adapt to complex / irregular patterns. Compared with digital printing, it avoids the problem of uneven printing due to thin ink thickness affecting the pattern display effect.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and in particular to a BIPV product and its preparation method. Background Technology

[0002] BIPV, or Building Integrated Photovoltaics, is a technology that integrates solar power generation products into buildings. Currently, due to user needs, some BIPV products require specific shapes and patterns to match the architectural design. Traditional BIPV products typically use full-page printing to display color patterns, but full-page printing cannot effectively print complex or irregularly shaped patterns. Digital printing technology has emerged as a solution, as it can handle complex and irregularly shaped patterns well. However, current ink technology is not yet mature. To meet the light transmission requirements of the pattern (e.g., a semi-transparent effect), the ink thickness is generally reduced. However, excessively thin ink can lead to uneven printing, resulting in inconsistent color depth and a poor aesthetic appearance. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a BIPV product.

[0004] This invention also proposes a method for preparing BIPV products.

[0005] According to a first aspect of the present invention, a BIPV product includes a first encapsulation board, a photoelectric conversion module, a first connecting layer, and a second encapsulation board stacked and connected along a first direction; the first encapsulation board includes a first substrate and a first pattern layer, the first substrate including a printed area and a non-printed area, and the first pattern layer covering the printed area; the first connecting layer includes a second pattern layer, the orthographic projection of the second pattern layer along the first direction onto the first encapsulation board being located in the printed area; wherein light from the outer side of the first encapsulation board can pass through the first pattern layer and the photoelectric conversion module to irradiate the second pattern layer.

[0006] The BIPV product according to the first aspect of the present invention has at least the following beneficial effects: In this embodiment, a first pattern layer is formed by printing in the printing area of ​​the first substrate, and a second pattern layer is formed in the second connecting layer. The second pattern layer corresponds to the printing area along the first direction. A specific pattern is presented on the BIPV product by superimposing the colors of the first pattern layer, the photoelectric conversion module, and the second pattern layer. That is, by setting the first pattern layer and the second pattern layer for color superposition, this application only needs to print locally on the first substrate, which overcomes the problem that traditional full-page printing cannot adapt to complex / irregular patterns. Compared with digital printing, it avoids the problem that uneven printing due to thin ink thickness affects the pattern display effect.

[0007] According to some embodiments of the present invention, the first bonding layer includes a first adhesive film and a second adhesive film, the first adhesive film being a reflective film, the orthographic projection of the first adhesive film along the first direction onto the first substrate being located in the printing area to form the second pattern layer, and the second adhesive film being a light-transmitting film, the orthographic projection of the second adhesive film along the first direction onto the first substrate covering the non-printing area.

[0008] According to some embodiments of the present invention, the first adhesive film has a first splicing edge that is spliced ​​with the second adhesive film, the second adhesive film has a second splicing edge that is spliced ​​with the first adhesive film, and the first splicing edge and the second splicing edge overlap along the first direction.

[0009] According to some embodiments of the present invention, a boundary is formed between the printed area and the non-printed area, and the first adhesive film is spaced apart from the boundary along a second direction, the second direction being perpendicular to the first direction.

[0010] According to some embodiments of the present invention, the first encapsulation plate includes a first side edge that coincides with the contour of the printed area, and the first adhesive film extends out of the first side edge; And / or, the first encapsulation plate includes a second side edge that coincides with the contour of the non-printed area, and the second adhesive film extends out of the second side edge.

[0011] According to some embodiments of the present invention, a first embossed structure is provided on the side of the first substrate facing the photoelectric conversion module, so that the light reflected by the photoelectric conversion module toward the first packaging board is reflected back to the photoelectric conversion module through the first embossed structure; And / or, the first substrate has a second embossed structure on the side opposite to the photoelectric conversion module, so that diffuse reflection occurs when light shines on the second embossed structure.

[0012] According to some embodiments of the present invention, the first pattern layer is printed on the side of the first substrate facing the photoelectric conversion module, and the first pattern layer covers a portion of the first embossed structure.

[0013] According to some embodiments of the present invention, the BIPV product further includes a second connecting layer, which is connected between the first encapsulation board and the photoelectric conversion module, and the second connecting layer includes a POE film.

[0014] According to a second aspect of the present invention, a method for manufacturing a BIPV product includes a first encapsulation plate, a second connecting layer, a photoelectric conversion module, and a second encapsulation plate stacked and connected along a first direction. The first encapsulation plate includes a first substrate and a first pattern layer. The first substrate includes a printed area and a non-printed area. The first pattern layer covers the printed area. The first connecting layer includes a first adhesive film and a second adhesive film. The orthographic projection of the first adhesive film along the first direction onto the first substrate is located on the printed area to form the second pattern layer. The orthographic projection of the second adhesive film along the first direction onto the first substrate covers the non-printed area. The manufacturing method includes: The first pattern layer is printed in a localized area of ​​the first substrate to prepare the first packaging board; The first encapsulation board is connected to the photoelectric conversion module using the second connection layer; The first adhesive film and the second adhesive film are laid on the side of the photoelectric conversion module away from the first packaging plate; The second encapsulation plate is laid on the side of the second connecting layer that is opposite to the first encapsulation plate.

[0015] According to some embodiments of the present invention, before partially printing the first pattern layer on the first substrate to prepare the first package board, the preparation method further includes: The first substrate is subjected to double-sided rolling to form a first embossed structure and a second embossed structure on opposite sides of the first substrate, respectively.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a cross-sectional schematic diagram of a BIPV product along a first direction according to an embodiment of the present invention; Figure 2 This is a cross-sectional schematic diagram of the first packaging board along the first direction according to an embodiment of the present invention; Figure 3 This is a schematic diagram showing the distribution of the printed and non-printed areas of a first substrate according to an embodiment of the present invention. Figure 4 This is a schematic diagram showing the arrangement of the first adhesive film and the second adhesive film of the first connecting layer according to an embodiment of the present invention. Figure 5 for Figure 4 A magnified view of a section at point A in the middle; Figure 6 This is a schematic diagram showing the arrangement of the first adhesive film of the first connecting layer relative to the boundary in one embodiment of the present invention; Figure 7 for Figure 6 A magnified view of a section at point B in the middle; Figure 8 This is a schematic diagram showing the arrangement of the second adhesive film of the first connecting layer relative to the boundary in one embodiment of the present invention; Figure 9 for Figure 8 A magnified view of a section at point C; Figure 10 This is a first flowchart of the method for preparing BIPV products according to an embodiment of the present invention; Figure 11 This is a second flowchart of the method for preparing BIPV products according to an embodiment of the present invention.

[0018] Icon labels: 10. BIPV products; 100, First encapsulation board; 110, First substrate; 111, First embossed structure; 112, Second embossed structure; 1101, Printed area; 1102, Non-printed area; 1103, Boundary; 120, First pattern layer; 200, Second connecting layer; 300, Photoelectric conversion module; 400, First connecting layer; 410, First adhesive film; 411, First splicing edge; 420, Second adhesive film; 421, Second splicing edge; 500, Second encapsulation board. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0021] In the description of this invention, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features or their sequential relationship.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] This application provides a BIPV product. The BIPV product is integrated into the building structure / product. By designing a specific shaped pattern on the BIPV product, the pattern blends with the building pattern / shape, resulting in an aesthetically pleasing architectural appearance.

[0024] Please refer to Figure 1 The BIPV product 10 provided in this application embodiment includes a first encapsulation plate 100, a photoelectric conversion module 300, a first connection layer 400, and a second encapsulation plate 500 stacked and connected along a first direction. The first direction is the thickness direction of the BIPV product 10.

[0025] The first encapsulation plate 100 is the layer of the BIPV product 10 that faces the sunlight, i.e., the first layer structure that receives direct sunlight. The first encapsulation plate 100 is configured to have high light transmittance so that external light can fully penetrate the first encapsulation plate 100 and enter the photoelectric conversion module 300. The first encapsulation plate 100 includes a first substrate 110, which can be ultra-white glass.

[0026] The photoelectric conversion module 300 is used to convert incoming light energy into electrical energy. In some embodiments of this application, the photoelectric conversion module 300 includes multiple solar cells, which are connected in series with each other by solder ribbons. The type of solar cells can be crystalline silicon solar cells or thin-film solar cells; this application does not limit this type.

[0027] The second encapsulation plate 500 serves as the backplate of the BIPV product 10, supporting the aforementioned film layer. The second encapsulation plate 500 may also have a connection structure for connecting to an external device, allowing the BIPV product 10 to be connected to the external device. In some embodiments of this application, the second encapsulation plate 500 includes a second substrate and a third pattern printed on the second substrate. The third pattern is printed on the side of the second substrate facing away from the first encapsulation plate 100. The third pattern may be a white enamel layer used to reflect light irradiating the second encapsulation plate 500, thereby improving the power generation of the BIPV product 10.

[0028] Due to user requirements, some BIPV products 10 need to present specific appearance patterns. Traditional BIPV products usually use full-page printing to present color patterns. However, full-page printing cannot well realize the printing of complex and irregular patterns. Digital printing technology has emerged in related technologies. Digital printing can well support the preparation of complex / irregular patterns. However, the current ink technology is not yet mature. In order to meet the light transmission requirements of the pattern (such as semi-transparent effect), the printing thickness of the ink is generally reduced. However, if the ink is too thin, it will easily lead to uneven printing of the pattern, resulting in inconsistent color depth and making it difficult to produce a good appearance effect.

[0029] To address the aforementioned issues, please refer to the embodiments described in this application. Figure 2 and Figure 3 The first encapsulation board 100 includes a first substrate 110 and a first pattern layer 120. The first substrate 110 includes a printed area 1101 and a non-printed area 1102, and the first pattern layer 120 covers the printed area 1101. The first connection layer 400 includes a second pattern layer, and the second pattern layer is located in the printed area 1101 along a first direction in the orthographic projection of the first encapsulation board 100. Light from the outer side of the first encapsulation board 100 can pass through the first pattern layer 120 and the photoelectric conversion module 300 to illuminate the second pattern layer.

[0030] Understandably, the first pattern layer 120 can be printed on the printing area 1101 using a printing process. In some embodiments of this application, the first pattern layer 120 is a colored enamel layer printed on the first substrate 110 using a screen printing process.

[0031] Specifically, the first pattern layer 120 is printed and covers the printing area 1101, and the second pattern layer corresponds to the printing area 1101 in the first direction. When viewed from the outside, the part of the BIPV product 10 corresponding to the printing area 1101 forms the corresponding color by superimposing the colors of the first pattern layer 120, the photoelectric conversion module 300 and the second pattern layer, while the part of the BIPV product 10 corresponding to the non-printing area 1102 displays the original color of the BIPV product 10. Thus, the corresponding pattern is displayed by the contrast between the non-printing area 1102 and the printing area 1101.

[0032] In this embodiment, a first pattern layer 120 is formed by printing on the printing area 1101 of the first substrate 110, and a second pattern layer is provided on the first connecting layer 400. The second pattern layer corresponds to the printing area 1101 along the first direction. A specific pattern is presented on the BIPV product 10 by superimposing the colors of the first pattern layer 120, the photoelectric conversion module 300, and the second pattern layer. That is, by setting the first pattern layer 120 and the second pattern layer for color superposition, only partial printing is required on the first substrate 110, which overcomes the problem that traditional full-page printing cannot adapt to complex / irregular patterns. Compared with digital printing, it avoids the problem that uneven printing due to thin ink thickness affects the pattern display effect.

[0033] Please refer to some embodiments of this application. Figure 4 The first connecting layer 400 includes a first adhesive film 410 and a second adhesive film 420. The first adhesive film 410, projected along a first direction onto the printing area 1101 of the first substrate 110, forms the aforementioned second pattern layer. The second adhesive film 420, projected along the first direction onto the non-printing area 1102 of the first substrate 110. It is understood that the first adhesive film 410 fills the space corresponding to the printing area 1101 between the photoelectric conversion module 300 and the second encapsulation board 500, and the second adhesive film 420 fills the space corresponding to the non-printing area 1102 between the photoelectric conversion module 300 and the second encapsulation board 500.

[0034] The first adhesive film 410 is a reflective film. In some embodiments of this application, the first adhesive film 410 is a black EVA adhesive film. The black EVA adhesive film is made by adding carbon black, black pigment or other functional fillers (such as infrared reflective pigments) to conventional transparent EVA resin, and then performing processes such as melt blending, foaming or calendering. The first adhesive film 410 is black. Under the reflective contrast of the first adhesive film 410, the color of the first pattern layer 120 in the printing area 1101 is superimposed with the black color of the first adhesive film 410 and presents a corresponding color, which is different from the color of the non-printing area 1102. Thus, the pattern that the BIPV product 10 wants to present can be clearly distinguished from the outside.

[0035] The second adhesive film 420 is a light-transmitting film, allowing light illuminating the second bonding layer 200 to pass through and illuminate the second encapsulation plate 500. The second encapsulation plate 500 then reflects the light back to the solar cells for further photoelectric conversion, improving light utilization and increasing the power generation of the BIPV product 10. In some embodiments of this application, the second adhesive film 420 is a transparent EVA film. Transparent EVA (ethylene-vinyl acetate copolymer) is a commonly used film material in the photovoltaic field and will not be described in detail here.

[0036] Understandably, the above embodiment sets the second connecting layer 200 to include a first adhesive film 410 and a second adhesive film 420. The first adhesive film 410 corresponds to the printing area 1101 in the first direction, and the second adhesive film 420 corresponds to the non-printing area 1102 in the first direction. By utilizing the outline framework of the printing area 1101 and the non-printing area 1102, it is convenient to cut and lay the first adhesive film 410 and the second adhesive film 420, thereby improving the arrangement efficiency of the second connecting layer 200 and improving the overall production efficiency of the BIPV product 10.

[0037] To ensure the stability of the connection of the second connecting layer 200, the adjacent edges of the first adhesive film 410 and the second adhesive film 420 are spliced ​​together. For some embodiments of this application, please refer to... Figure 4 and Figure 5 The first adhesive film 410 has a first splicing edge 411 for splicing with the second adhesive film 420, and the second adhesive film 420 has a second splicing edge 421 for splicing with the first adhesive film 410. The first splicing edge 411 and the second splicing edge 421 overlap along a first direction.

[0038] In the above embodiment, the first splicing edge 411 and the second splicing edge 421 are overlapped along the first direction. That is, the first adhesive film 410 and the second adhesive film 420 are spliced ​​by overlapping each other instead of simply butting together. After subsequent pressing by a laminator, the first adhesive film 410 and the second adhesive film 420 are firmly bonded together, which helps to prevent the first adhesive film 410 and the second adhesive film 420 from shifting and enhances the stability of the connection between the second connecting layer 200 and the photoelectric conversion module 300 and the second encapsulation board 500.

[0039] In some embodiments of this application, the width of the first splicing edge 411 and the second splicing edge 421 is 4-5mm, that is, the width of the overlapping portion of the first adhesive film 410 and the second adhesive film 420 is 4-5mm.

[0040] In some embodiments of this application, please refer to Figure 3 And refer to Figure 6 and Figure 7A boundary 1103 is formed between the printed area 1101 and the non-printed area 1102. The first adhesive film 410 is spaced apart from the boundary 1103 along a second direction, which is perpendicular to the first direction. It should be understood that the first adhesive film 410, when projected onto the first substrate 110 along the first direction, is located in the printed area 1101. The boundary 1103 between the first adhesive film 410 and the printed area 1101 and the non-printed area 1102 is spaced apart along the second direction. That is, the edge of the first adhesive film 410 is spaced a certain distance from the boundary 1103. When laying the first adhesive film 410, the cut size of the first adhesive film 410 is slightly smaller than the size of the printed area 1101. This way, the first pattern layer 120 will not be completely covered by the first adhesive film 410. When the BIPV product 10 is subjected to subsequent lamination operations, the deformation of the first adhesive film 410 under pressure and its extension into the non-printed area 1102 is effectively prevented. In one embodiment of this application, the distance between the first adhesive film 410 and the aforementioned boundary 1103 is 2-3 mm.

[0041] Understandably, in the above embodiments, when the first adhesive film 410 is spaced apart from the boundary 1103, in order to simultaneously achieve overlap of the splicing edges of the first adhesive film 410 and the second adhesive film 420 in the first direction, the second adhesive film 420 must also be spaced apart from the boundary 1103, and the splicing edge of the second adhesive film 420 must be located within the printing area 1101 of the first substrate 110 along the first direction. (Refer to...) Figure 8 and Figure 9 As shown, the edge of the second adhesive film 420 needs to pass through the boundary 1103 and extend into the printing area 1101. In other words, the cutting size of the second adhesive film 420 is slightly larger than the size of the non-printing area 1102.

[0042] In some embodiments of this application, the first encapsulation plate 100 includes a first side edge (not shown) that coincides with the outline of the printing area 1101. The first side edge refers to a portion of the edges of the four sides of the first encapsulation plate 100 that coincide with the outline of the printing area 1101. The first adhesive film 410 extends out of the first side edge to facilitate splicing of adjacent BIPV products 10.

[0043] Similarly, in other embodiments of this application, the first encapsulation plate 100 includes a second side edge (not shown) that coincides with the outline of the non-printed area 1102. The second side edge refers to the remaining edge of the four sides of the first encapsulation plate 100 that coincides with the outline of the non-printed area 1102. The second adhesive film 420 extends out of the second side edge to facilitate the splicing of adjacent BIPV products 10.

[0044] Please refer to some embodiments of this application. Figure 2A first embossed structure 111 is provided on the side of the first substrate 110 facing the photoelectric conversion module 300. It should be understood that, in this embodiment, by providing the first embossed structure 111 on the side of the first substrate 110 facing the photoelectric conversion module 300, not only does externally incident light pass through the first embossed structure 111 to the photoelectric conversion module 300, but the first substrate 110 also forms multiple reflective surfaces facing the photoelectric conversion module 300 through the first embossed structure 111. Thus, light reflected from the crystalline silicon solar cell to the first substrate 110 is reflected again to the photoelectric conversion module 300 after passing through the first embossed structure 111, allowing more light to enter the photoelectric conversion module 300, improving light utilization and light absorption efficiency, thereby increasing the power generation of the BIPV product 10.

[0045] It should also be understood that, in the above embodiment, by providing a first embossed structure 111 on the side of the first substrate 110 facing the photoelectric conversion module 300, the side of the first substrate 110 facing the photoelectric conversion module 300 is not a smooth plane. This allows the adhesive film to be embedded in the concave and convex structure of the first embossed structure 111 when the first encapsulation plate 100 is connected to the photoelectric conversion module 300 through the adhesive film, thereby improving the connection strength between the adhesive film and the first encapsulation plate 100 and thus improving the connection strength between the first encapsulation plate 100 and the photoelectric conversion module 300.

[0046] In some possible embodiments of this application, the first embossed structure 111 is configured as a pyramidal structure with multiple inclined surfaces. This facilitates multiple reflections of light reflected from the crystalline silicon solar cell to the first substrate 110 through these inclined surfaces, enabling it to be reflected again to the photoelectric conversion module 300. In one embodiment of this application, the first embossed structure 111 is a pyramidal embossed pattern.

[0047] Please refer to some embodiments of this application. Figure 2 A second embossed structure 112 is provided on the side of the first substrate 110 facing away from the photoelectric conversion module 300, so that diffuse reflection occurs when external light shines on the second embossed structure 112. In this embodiment, by providing the second embossed structure 112 on the side of the first substrate 110 facing away from the photoelectric conversion module 300, that is, the side of the first substrate 110 receiving direct sunlight has the second embossed structure 112. The second embossed structure 112 is a diffuse reflection structure. Under the premise that most of the light passes through and shines on the photoelectric conversion module 300, the reflected light is scattered in multiple directions and at multiple angles to avoid specular reflection, thereby achieving the front anti-glare effect of the BIPV product 10 and effectively preventing light pollution problems.

[0048] Understandably, to improve the ability to diffusely reflect light, the second embossed structure 112 can be configured as an irregular embossed pattern. In one embodiment of this application, the second embossed structure 112 is a diamond-shaped embossed pattern.

[0049] In some embodiments of this application, the first pattern layer 120 is printed on the side of the first substrate 110 facing the photoelectric conversion module 300, and the first pattern layer 120 covers a portion of the first embossed structure 111. In this embodiment, by printing the first pattern layer 120 on the side of the first substrate 110 facing the photoelectric conversion module 300 and covering the first embossed structure 111, the pyramid-shaped embossed pattern on the back of the first substrate 110, combined with the colored enamel pattern layer, can further optimize the reflected light path, improve the overall light absorption efficiency of the BIPV product 10, and thus improve the photoelectric conversion efficiency.

[0050] Please refer to Figure 1 The BIPV product 10 also includes a second connection layer 200, which is connected between the first encapsulation board 100 and the photoelectric conversion module 300. The second connection layer 200 is used to securely connect the first encapsulation board 100 and the photoelectric conversion module 300 together.

[0051] In some embodiments of this application, the second bonding layer 200 includes a POE film. This embodiment uses a POE film, which, compared to traditional EPE films, has better adhesive properties, requires no additional crosslinking agents, and is particularly suitable for bonding with enamel layers, effectively ensuring the connection strength and stability between the first encapsulation board 100 and the photoelectric conversion module 300. Simultaneously, the POE film has high moisture barrier properties, significantly enhancing the PID resistance of the BIPV product 10 in humid and hot environments, thereby effectively reducing the delamination rate of the BIPV product 10 during its service life.

[0052] This application also provides a method for preparing a BIPV product 10. This BIPV product 10 employs a BIPV product 10 based on any of the above embodiments. Please refer to... Figure 10 The preparation method of BIPV product 10 includes: 101: A first pattern layer 120 is partially printed on the first substrate 110 to prepare a first package board 100.

[0053] In some embodiments of this application, a screen printing process can be used to print the first pattern layer 120 on the first substrate 110. The specific printing process includes the following steps: First, according to the specifications of the first substrate 110, a blank screen of the same size as the first substrate 110 is prepared using polyester mesh (at this time, there is no pattern); then, according to the outline shape of the pattern to be printed, a film of the corresponding shape is made; the film is pasted on the bottom of the screen, and the pasting position of the film corresponds to the area on the first substrate 110 that does not need to be printed (i.e., the non-printing area 1102), so as to achieve masking treatment of the area and prevent subsequent ink from leaking from the area; colored ink is printed onto the first substrate 110 through the screen, so that the ink passes through the mesh on the screen that is not blocked by the film and is printed onto the first substrate 110; after the colored ink dries, the first substrate 110 is tempered, thus forming the first pattern layer 120 on the first substrate 110.

[0054] 102: The first encapsulation board 100 is connected to the photoelectric conversion module 300 using the second connection layer 200.

[0055] Before connecting the first encapsulation board 100 to the photoelectric conversion module 300, the second connecting layer 200 and the photoelectric conversion module 300 are prepared. In some embodiments of this application, the second connecting layer 200 is a POE film. When preparing the second connecting layer 200, the POE film of the appropriate size is cut according to the specifications of the first substrate 110. The cut size of the POE film is slightly larger than the length / width of the first substrate 110 (e.g., 3-4 mm larger). When preparing the photoelectric conversion module 300, multiple crystalline silicon solar cells are connected in series using round wire bonding and an automatic stringing machine, so that the spacing between adjacent cell strings is 1.6-2 mm and the spacing between adjacent solar cells is 0.7-1 mm. When connecting the POE film to the first encapsulation board 100, the POE film is laid parallel to the four sides of the first substrate 110.

[0056] 103: A first adhesive film 410 and a second adhesive film 420 are laid on the side of the photoelectric conversion module 300 away from the first encapsulation plate 100.

[0057] Specifically, the first adhesive film 410 is cut according to the outline of the first pattern layer 120 of the first substrate 110. The cut size of the first adhesive film 410 is slightly smaller than the size of the printing area 1101. In some embodiments of this application, it is ensured that after the first adhesive film 410 is laid, there is a 2-3 mm gap between it and the boundary 1103 of the printing area 1101 and the non-printing area 1102. The second adhesive film 420 is laid according to the non-printing area 1102 of the first substrate 110. The cut size of the second adhesive film 420 is slightly larger than the size of the non-printing area 1102 of the first substrate 110, so that the splicing edges of the first adhesive film 410 and the second adhesive film 420 overlap in the first direction. In some embodiments of this application, the cut size of the second adhesive film 420 is 5-6 mm larger than the size of the non-printing area 1102 of the first substrate 110, so that the splicing edges of the first adhesive film 410 and the second adhesive film 420 overlap in the first direction by 4-5 mm.

[0058] 104: A second encapsulation plate 500 is laid on the side of the second connecting layer 200 away from the first encapsulation plate 100.

[0059] During the installation process, the four sides of the first encapsulation plate 100 and the second encapsulation plate 500 are aligned, and the four corners are sealed with seam tape to prevent misalignment of the first encapsulation plate 100 and the second encapsulation plate 500. Then, the BIPV product 10 is laminated as a whole using a laminator to ensure a stable and reliable connection between the internal film layers of the entire BIPV product 10.

[0060] In the method for manufacturing the BIPV product 10 provided in this application, a first pattern layer 120 is partially printed on the first substrate 110, and a second connecting layer 200 composed of a first adhesive film 410 and a second adhesive film 420 is laid on the side of the photoelectric conversion module 300 away from the first packaging plate 100. The first adhesive film 410 is aligned with the printing area 1101 in the first direction to form the second pattern layer. In this way, the colors of the first pattern layer 120, the photoelectric conversion module 300 and the second pattern layer are superimposed to achieve a specific pattern on the BIPV product 10. By setting the first pattern layer 120 and the second pattern layer for color superposition, this application only requires partial printing on the first substrate 110, which overcomes the problem that traditional full-page printing cannot adapt to complex / irregular patterns. Compared with digital printing, it avoids the problem that uneven printing due to thin ink thickness affects the pattern display effect.

[0061] In some embodiments of this application, another method for preparing the BIPV product 10 is also provided; please refer to [reference needed]. Figure 11 The difference between the preparation method in this embodiment and the preparation method in the above embodiment is that, in the preparation method of this embodiment, step 201 is added before step 101, as follows: 201: Perform double-sided rolling on the first substrate 110 to form a first embossed structure 111 and a second embossed structure 112 on opposite sides of the first substrate 110, respectively.

[0062] 202: A first pattern layer 120 is partially printed on the first substrate 110 to prepare a first package board 100. For specific operation steps, please refer to the above embodiment.

[0063] 203: Use the second connection layer 200 to connect the first encapsulation board 100 to the photoelectric conversion module 300. For detailed operation steps, please refer to the above embodiment.

[0064] 204: A first adhesive film 410 and a second adhesive film 420 are laid on the side of the photoelectric conversion module 300 opposite to the first encapsulation plate 100. For specific operating steps, please refer to the above embodiment.

[0065] 205: A second encapsulation plate 500 is laid on the side of the second connecting layer 200 opposite to the first encapsulation plate 100. For detailed operation steps, please refer to the above embodiment.

[0066] In step 201, a rolling process is specifically employed to roll the first and second embossed structures 111 and 112 on opposite sides of the first substrate 110, respectively. In some embodiments of this application, the first embossed structure 111 is a pyramid-shaped embossed pattern. The first embossed structure 111 is disposed on the side of the first substrate 110 facing the photoelectric conversion module 300, so that the first substrate 110 forms multiple reflective surfaces facing the photoelectric conversion module 300 through the first embossed structure 111. In this way, the light reflected from the crystalline silicon solar cell to the first substrate 110 will be reflected again to the photoelectric conversion module 300 after passing through the first embossed structure 111, allowing more light to enter the photoelectric conversion module 300, improving light utilization and light absorption efficiency of the photoelectric conversion module 300, thereby increasing the power generation of the BIPV product 10. In some embodiments of this application, the second embossed structure 112 is a diamond-shaped embossed pattern. The second embossed structure 112 is disposed on the side of the first substrate 110 away from the photoelectric conversion module 300. The second embossed structure 112 is a diffuse reflection structure, which can scatter the reflected light in multiple directions and at multiple angles to avoid specular reflection and achieve the front anti-glare effect of the BIPV product 10, effectively preventing light pollution problems.

[0067] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A BIPV product, characterized in that, The device includes a first encapsulation board, a photoelectric conversion module, a first connecting layer, and a second encapsulation board stacked together along a first direction. The first encapsulation board includes a first substrate and a first pattern layer. The first substrate includes a printed area and a non-printed area, and the first pattern layer covers the printed area. The first connecting layer includes a second pattern layer, and the orthographic projection of the second pattern layer along the first direction onto the first encapsulation board is located in the printed area. Light from the outside of the first encapsulation board can pass through the first pattern layer and the photoelectric conversion module to illuminate the second pattern layer.

2. The BIPV product according to claim 1, characterized in that, The first bonding layer includes a first adhesive film and a second adhesive film. The first adhesive film is a reflective film, and the orthographic projection of the first adhesive film along the first direction onto the first substrate is located in the printing area to form the second pattern layer. The second adhesive film is a light-transmitting film, and the orthographic projection of the second adhesive film along the first direction onto the first substrate covers the non-printing area.

3. The BIPV product according to claim 2, characterized in that, The first adhesive film has a first splicing edge that is spliced ​​with the second adhesive film, and the second adhesive film has a second splicing edge that is spliced ​​with the first adhesive film. The first splicing edge and the second splicing edge overlap along the first direction.

4. The BIPV product according to claim 2, characterized in that, A boundary is formed between the printed area and the non-printed area, and the first adhesive film is spaced apart from the boundary along a second direction, which is perpendicular to the first direction.

5. The BIPV product according to claim 2, characterized in that, The first encapsulation board includes a first side edge that coincides with the outline of the printed area, and the first adhesive film extends out of the first side edge; And / or, the first encapsulation plate includes a second side edge that coincides with the contour of the non-printed area, and the second adhesive film extends out of the second side edge.

6. The BIPV product according to any one of claims 1 to 5, characterized in that, The first substrate has a first embossed structure on the side facing the photoelectric conversion module, so that the light reflected from the photoelectric conversion module to the first packaging board is reflected back to the photoelectric conversion module through the first embossed structure; And / or, the first substrate is provided with a second embossed structure on the side opposite to the photoelectric conversion module, so that diffuse reflection occurs when external light shines on the second embossed structure.

7. The BIPV product according to claim 6, characterized in that, The first pattern layer is printed on the side of the first substrate facing the photoelectric conversion module, and the first pattern layer covers part of the first embossed structure.

8. The BIPV product according to any one of claims 1 to 5, characterized in that, The BIPV product further includes a second connecting layer, which connects the first encapsulation board and the photoelectric conversion module. The second connecting layer includes a POE film.

9. A method for preparing BIPV products, characterized in that, The BIPV product includes a first encapsulation board, a second connecting layer, a photoelectric conversion module, and a second encapsulation board stacked and connected along a first direction. The first encapsulation board includes a first substrate and a first pattern layer. The first substrate includes a printed area and a non-printed area. The first pattern layer covers the printed area. The first connecting layer includes a first adhesive film and a second adhesive film. The first adhesive film's orthographic projection along the first direction onto the first substrate is located in the printed area to form the second pattern layer. The second adhesive film's orthographic projection along the first direction onto the first substrate covers the non-printed area. The preparation method includes: The first pattern layer is printed in a localized area of ​​the first substrate to prepare the first packaging board; The first encapsulation board is connected to the photoelectric conversion module using the second connection layer; The first adhesive film and the second adhesive film are laid on the side of the photoelectric conversion module away from the first packaging plate; The second encapsulation plate is laid on the side of the second connecting layer that is opposite to the first encapsulation plate.

10. The method for preparing a BIPV product according to claim 9, characterized in that, Before partially printing the first pattern layer on the first substrate to prepare the first package board, the preparation method further includes: The first substrate is subjected to double-sided rolling to form a first embossed structure and a second embossed structure on opposite sides of the first substrate, respectively.

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