Transmission line structure and antenna module

Abstract

The shape of the ground pads (13A, 13B) of the transmission line structure (10) of the present disclosure is a rectangular shape having a long side along a second direction substantially perpendicular to a first direction in which the transmission line (141) extends and a short side along the first direction. The length of the first direction of the ground pads (13A, 13B) is shorter than the size of the first direction of the connectors (12A, 12B).

Description

Technical Field

[0001] This disclosure relates to a transmission line structure and an antenna module having a transmission line structure and an antenna substrate. Background Technology

[0002] International Publication No. 2022 / 038879 (Patent Document 1) discloses an antenna module having a transmission line structure including a transmission line for transmitting high-frequency signals and a ground electrode.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2022 / 038879 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] When connecting a transmission line structure, including a transmission line and a ground electrode, to other substrates, connectors are sometimes used. In cases where a transmission line structure with a connector is used, it is sometimes bent for use depending on the application. However, in International Publication No. 2022 / 038879 (Patent Document 1), the transmission line structure including the transmission line and ground electrode does not have a specially designed connector connection portion, and the transmission line structure is also relatively thick, making it unsuitable for bending the transmission line structure.

[0008] The purpose of this disclosure is to provide a transmission line structure suitable for use in situations involving bending.

[0009] Solution for solving the problem

[0010] One aspect of this disclosure relates to a transmission line structure comprising: a flat dielectric substrate having a first main surface and a second main surface opposite to the first main surface; a ground electrode disposed between the first and second main surfaces; a first transmission line disposed at a position closer to the ground electrode on the first main surface and extending in a first direction; a ground pad disposed on the first main surface; a first signal pad connected to the end of the first transmission line on the first main surface; at least one interlayer connector disposed within the dielectric substrate and connected to the ground electrode and the ground pad; and a connector connected to the ground pad and the first signal pad on the first main surface side. The ground pad is rectangular in shape, having a long side along a second direction substantially perpendicular to the first direction and a short side along the first direction. The length of the ground pad in the first direction is shorter than the dimension of the connector in the first direction.

[0011] The effects of the invention

[0012] According to one aspect of this disclosure, the grounding pad is rectangular in shape, having a long side along a second direction substantially perpendicular to a first direction extending from the first transmission line and a short side along the first direction. The length of the grounding pad in the first direction is shorter than the dimension of the connector in the first direction. That is, in the transmission line structure, the length of the grounding pad is shorter than the dimension of the connector in the first direction extending from the first transmission line, resulting in a smaller contact area between the grounding pad and the connector. This reduces the force applied to the connection between the grounding pad and the connector when the transmission line structure is bent, making it easier to bend the transmission line structure. Attached Figure Description

[0013] Figure 1 This is a diagram showing a modified example of the antenna module according to Embodiment 1.

[0014] Figure 2 This is a perspective view of the transmission line structure according to Embodiment 1.

[0015] Figure 3 This is a top view of the transmission line structure according to Embodiment 1.

[0016] Figure 4 This is a cross-sectional view of the transmission line structure according to Embodiment 1.

[0017] Figure 5 This is a diagram showing the connector involved in Embodiment 1.

[0018] Figure 6 This is a top view of the transmission line structure according to Embodiment 2.

[0019] Figure 7 This is a cross-sectional view of the transmission line structure according to Embodiment 2.

[0020] Figure 8 This is a top view of the transmission line structure according to Embodiment 3.

[0021] Figure 9 This is a top view of the transmission line structure according to Embodiment 4. Detailed Implementation

[0022] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0023] [Implementation Method 1]

[0024] Figure 1This diagram illustrates the antenna module 100 according to Embodiment 1. The antenna module 100 is used, for example, in portable terminals such as mobile phones, smartphones, or tablets, and in personal computers with communication capabilities. An example of the frequency band of the radio waves used by the antenna module 100 according to Embodiment 1 is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but it can also be applied to radio waves in other frequency bands.

[0025] Antenna module 100 includes RFIC 110, antenna device 190A with radiating electrodes 191A1-191A4, antenna device 190B with radiating electrodes 191B1-191B4, transmission line structure 10, and connectors 12A and 12B. RFIC 110 supplies high-frequency signals. Antenna device 190A is connected to transmission line structure 10 via connector 12A. Antenna device 190B is connected to transmission line structure 10 via connector 12B. For RFIC 110, a SiP structure integrating peripheral components such as PMIC (Power Management IC) can also be used.

[0026] Hereinafter, antenna devices 190A and 190B will be collectively referred to as "antenna device 190". Radiation electrodes 191A1 to 191A4 will be collectively referred to as "radiation electrode 191A". Radiation electrodes 191B1 to 191B4 will be collectively referred to as "radiation electrode 191B". Radiation electrodes 191A and 191B will be collectively referred to as "radiation electrode 191".

[0027] Antenna device 190A is connected to BBIC 200 via connecting member 180. Antenna device 190B is connected to antenna device 190A via transmission line structure 10. BBIC 200 is mounted on motherboard 250 and forms a baseband signal processing circuit. BBIC 200 is electrically connected to RFIC 110.

[0028] The signal transmitted from BBIC200 to antenna module 100 is radiated from antenna devices 190A and 190B. The signals received by antenna devices 190A and 190B are processed by BIC200.

[0029] Motherboard 250 is a flat printed circuit board on which multiple components, including BBIC 200, are mounted. Motherboard 250 is formed, for example, from MLB (Multilayer Board). A ground electrode 251 is disposed on the surface of the mounting surface of motherboard 250. Ground electrode 251 is configured to be attached to the entire mounting surface of motherboard 250 over a large area. Ground electrode 251 may also be disposed only in a portion of the mounting surface of motherboard 250. Ground electrode 251 may also be disposed internally instead of on the surface of the mounting surface of motherboard 250.

[0030] The dielectric substrate constituting the antenna device 190 may be, for example, a low-temperature co-fired ceramic (LTCC) multilayer substrate, a multilayer resin substrate formed by stacking multiple resin layers composed of resins such as epoxy and polyimide, a multilayer resin substrate formed by stacking multiple resin layers composed of liquid crystal polymers (LCP) with lower dielectric constants, a multilayer resin substrate formed by stacking multiple resin layers composed of fluorine-based resins and PET (Polyethylene Terephthalate) materials, or a ceramic multilayer substrate other than LTCC. Furthermore, the dielectric substrate constituting the antenna device 190 does not necessarily have to be a multilayer structure; it may also be a single-layer substrate.

[0031] The radiating electrode 191 is formed of a flat conductive material such as copper or aluminum. The shape of the radiating electrode 191 is not limited to rectangle, but can also be polygonal, circular, elliptical, or cross-shaped. The radiating electrode 191 is formed on the surface or in a layer inside the dielectric substrate.

[0032] exist Figure 1 The image shows an array antenna with four radiating electrodes 191 arranged in one direction, but it can also be formed by a single radiating electrode 191, or by a structure in which multiple radiating electrodes are arranged in one or two dimensions.

[0033] Ground electrode 170A and radiating electrode 191A are disposed opposite each other inside the dielectric substrate of antenna device 190A. Ground electrode 170B and radiating electrode 191B are disposed opposite each other inside the dielectric substrate of antenna device 190B.

[0034] A high-frequency signal from RFIC 110 is supplied to the radiating electrode 191A of antenna device 190A. A high-frequency signal from RFIC 110 is supplied to the radiating electrode 191B of antenna device 190B via transmission line structure 10. When a high-frequency signal is supplied to antenna device 190A, radio waves are radiated from radiating electrode 191A, but not from radiating electrode 191B. Conversely, when a high-frequency signal is supplied to antenna device 190B, radio waves are radiated from radiating electrode 191B, but not from radiating electrode 191A. Antenna devices 190A and 190B radiate radio waves in directions opposite to each other.

[0035] The connecting member 180 is a flat cable in the shape of a plate. The connecting member 180 is configured such that its back surface contacts the mounting surface of the motherboard 250. The connecting member 180 has a ground electrode 181 internally. The connecting member 180 has multiple feed lines internally. The connecting member 180 has a dielectric substrate formed of ceramic or resin such as LTCC. The connecting member 180 can be formed of a flexible material or a rigid material that does not deform. The conductive components, such as the feed lines and ground electrode 181, included in the connecting member 180 are connected to the antenna device 190 and the motherboard 250 via connectors or solder configured for removability.

[0036] Next, use Figures 2-4 The transmission line structure 10 will be described. Figure 2 This is a perspective view of the transmission line structure 10 according to Embodiment 1. Figure 2 The transmission line structure 10 is shown in a bent state. Figure 2 (A) is a diagram showing the state in which connectors 12A and 12B are installed in the transmission line structure 10. Figure 2 (B) is a diagram showing the state in which connectors 12A and 12B have been removed from the transmission line structure 10.

[0037] Figure 3 This is a top view of the transmission line structure 10 according to Embodiment 1. Figure 3 The transmission line structure 10 is shown in a straightened state. Figure 4 This is a cross-sectional view of the transmission line structure 10 according to Embodiment 1. Figure 4 yes Figure 3 Sectional view IV-IV. Furthermore, in Figure 4 The cross-sectional view is schematically illustrated in a way that the thickness in the layer direction is increased compared to the actual object.

[0038] The transmission line structure 10 includes a dielectric substrate 11, connectors 12A and 12B, transmission lines 141 and 151, grounding pads 13A and 13B, signal pad components 14A1 to 14A4, 14B1 to 14B4, 15A1 to 15A4, 15B1 to 15B4, grounding electrode 161, grounding via 165, signal via 155, and protection component 20.

[0039] like Figure 2 As shown, the dielectric substrate 11 has a flexible structure. The dielectric substrate 11 can be made of any flexible structure, or it can be made of the same material as the dielectric substrate constituting the antenna device 190 described above. Figure 3As shown, when the side with the connectors 12A and 12B is designated as the first main surface, the dielectric substrate 11 is a flat substrate having a second main surface facing the first main surface.

[0040] A ground electrode 161 is disposed between the first main surface and the second main surface of the dielectric substrate 11. The ground electrode 161 is electrically connected to the ground pad disposed on the first main surface through a plurality of grounding vias 165, which serve as interlayer interconnects.

[0041] The transmission line 141 is positioned closer to the first main surface than the ground electrode 161, and is configured to extend in a first direction, which is the long side direction of the dielectric substrate 11. Furthermore, in Figure 3 , Figure 4 In the diagram, transmission line 141 is shown on the first main surface. Figure 3 , Figure 4 In the middle, the following was omitted. Figure 2 The description shows the anti-corrosion layer as a protective component 20.

[0042] Transmission line 141 is a line used to transmit high-frequency signals, such as... Figure 2 , Figure 3 As shown, it includes 4 lines. Figures 2-4 As shown, one end of the transmission line 141 functions as signal pad components 14A1 to 14A4 for electrical connection with connector 12A. The other end of the transmission line 141 functions as signal pad components 14B1 to 14B4 for electrical connection with connector 12B. Signal pad components 14A1 to 14A4 and signal pad components 14B1 to 14B4 are also collectively referred to as the first signal pad.

[0043] The transmission line 151 is positioned closer to the second main surface than the ground electrode 161, and is configured to extend in a first direction, which is the long side direction of the dielectric substrate 11. Like the transmission line 141, the transmission line 151 is a line for transmitting high-frequency signals, comprising four lines, but with the exception of… Figure 4 Except for the sectional view shown, no other illustrations are included.

[0044] One end of the transmission line 151 is connected to signal pad members 15A1-15A4 for electrical connection with connector 12A via a signal via 155 extending along the thickness direction of the dielectric substrate 11. The other end of the transmission line 151 is connected to signal pad members 15B1-15B4 for electrical connection with connector 12B via a signal via 155 extending along the thickness direction of the dielectric substrate 11. Signal pad members 15A1-15A4 and signal pad members 15B1-15B4 are also collectively referred to as the second signal pad.

[0045] The bandwidth of the signal transmitted in transmission line 141 is higher than that of the signal transmitted in transmission line 151. This is because signals with higher bandwidths experience greater loss due to distance compared to signals with lower bandwidths. Therefore, transmission line 141, with its higher bandwidth than transmission line 151, is positioned closer to connectors 12A and 12B to shorten the transmission distance. This reduces signal loss in transmission line 141.

[0046] The transmission line 141 is disposed on the first main surface of the dielectric substrate 11, which serves as the mounting surface of connectors 12A and 12B. Thus, unlike the transmission line 151, the transmission line 141 is connected to the connectors 12A and 12B without passing through the signal via 155, thereby enabling easy impedance matching between the transmission line 141 and the components connected to it.

[0047] The transmission line structure 10 has a structure in which a ground electrode 161 is disposed between transmission lines 141 and 151 in the thickness direction of the dielectric substrate 11. The transmission line structure 10 forms a stripline by sandwiching the ground electrode 161 between transmission lines 141 and 151. In this way, since the ground electrode 161 is a single layer in the transmission line structure 10, the height in the thickness direction can be reduced compared to a structure with multiple layers of ground electrodes.

[0048] Connector 12A is electrically connected to ground pad 13A, first signal pads (signal pad components 14A1~14A4), and second signal pads (signal pad components 15A1~15A4) on the first main surface side of dielectric substrate 11. Figure 3 The configuration position of connector 12A shown in the figure is omitted; it is on the line shown on the outer edge 120A.

[0049] Connector 12B is electrically connected to ground pad 13B, second signal pads (signal pad components 14B1~14B4), and second signal pads (signal pad components 15B1~15B4) on the first main surface side of dielectric substrate 11. Figure 3 The configuration position of connector 12B shown in the figure is omitted; it is on the line shown on the outer edge 120B.

[0050] Grounding pads 13A and 13B are rectangular in shape, having a long side along a second direction that is substantially perpendicular to the first direction, which serves as the long side of the dielectric substrate 11, and a short side along the first direction. The length of the grounding pads 13A and 13B in the first direction is shorter than the dimension of the connectors 12A and 12B in the first direction. That is, in the transmission line structure 10, in the first direction in which the transmission lines 141 and 151 extend, the length of the grounding pads 13A and 13B is shorter than the dimension of the connectors 12A and 12B, and the contact area between the grounding pads 13A and 13B and the connectors 12A and 12B is smaller. As a result, the force applied to the connection between the grounding pads 13A and 13B and the connectors 12A and 12B when the transmission line structure 10 is bent can be reduced, and the transmission line structure 10 can be bent more easily.

[0051] Grounding pad 13A is disposed between the first signal pad (signal pad components 14A1~14A4) and the second signal pad (signal pad components 15A1~15A4). Grounding pad 13B is disposed between the first signal pad (signal pad components 14B1~14B4) and the second signal pad (signal pad components 15B1~15B4). Thus, grounding pads 13A and 13B function as shielding components between the first and second signal pads, preventing electromagnetic field coupling between the signal pads and thereby improving isolation characteristics.

[0052] In a top view toward the center of the dielectric substrate 11, an extension 131 is provided, extending from the long side of the ground pad 13A to between the signal pad members 14A1 to 14A4 in the first signal pad. Similarly, in a top view toward the center of the dielectric substrate 11, an extension 131 is provided, extending from the long side of the ground pad 13B to between the signal pad members 14B1 to 14B4 in the first signal pad.

[0053] In a direction away from the center of the dielectric substrate 11 in a top view, an extension 132 is provided, extending from the long side of the ground pad 13A to between the signal pad members 15A1 to 15A4 in the second signal pad. Similarly, in a direction away from the center of the dielectric substrate 11 in a top view, an extension 132 is provided, extending from the long side of the ground pad 13B to between the signal pad members 15B1 to 15B4 in the second signal pad.

[0054] Grounding pad 13A is integrally formed with extensions 131 and 132, but it can also be electrically connected as a separate component. Grounding pad 13B is integrally formed with extensions 131 and 132, but it can also be electrically connected as a separate component.

[0055] The extensions 131 and 132 extending from the grounding pads 13A and 13B can prevent impedance mismatch between the transmission lines 141 and 151 at the mounting portion of connector 12A.

[0056] By extending 131 from the ground pads 13A and 13B, electrical separation can be achieved between each signal pad component 14A1 to 14A4 and between each signal pad component 14B1 to 14B4, thereby improving isolation characteristics.

[0057] By extending the extension 132 from the ground pads 13A and 13B, coupling between each signal pad component 15A1 to 15A4 and between each signal pad component 15B1 to 15B4 can be suppressed, thereby improving isolation characteristics.

[0058] Furthermore, the length of the extensions 131 and 132 in the first direction is preferably less than or equal to the lengths of the first and second signal pads. This helps to suppress unwanted resonance between the extensions 131 and 132 and the signal pads.

[0059] The length of the second direction (long side direction) of the grounding pad 13A (13B) is longer than the length of the second direction (long side direction) of the connector 12A (12B). This improves the mounting strength and accuracy of the connectors 12A and 12B. Solder is applied to the symmetrically shaped grounding pad 13A (13B) during the mounting of the connectors 12A and 12B. The mounting accuracy of the connectors 12A and 12B is improved by the self-alignment effect, which returns the molten solder to the design center under the surface tension.

[0060] Next, connectors 12A and 12B will be described. Figure 5 This is a diagram showing the connectors 12A and 12B according to Embodiment 1. Figure 5 (A) is a front view of connectors 12A and 12B. Figure 5 (B) is a top view of connectors 12A and 12B.

[0061] Connectors 12A and 12B are connectors used to transmit high-frequency signals from one substrate to another. Connectors 12A and 12B include a body portion 121, a first conductor portion 122, and a second conductor portion 123. The body portion 121 is composed of an insulating member. The first conductor portion 122 and the second conductor portion 123 are composed of conductor members.

[0062] The first conductor portion 122 is electrically connected to the ground pads 13A and 13B. The second conductor portion 123 is electrically connected to the first signal pad and the second signal pad.

[0063] Thus, in the transmission line structure 10 of Embodiment 1, in the first direction in which the transmission lines 141 and 151 extend, the lengths of the grounding pads 13A and 13B are shorter than the dimensions of the connectors 12A and 12B, and the contact area between the grounding pads 13A and 13B and the connectors 12A and 12B is smaller. This reduces the force applied to the connection between the grounding pads 13A and 13B and the connectors 12A and 12B when the transmission line structure 10 is bent, making it easier to bend the transmission line structure 10.

[0064] [Implementation Method 2]

[0065] Next, use Figure 6 , Figure 7 The transmission line structure 10A according to Embodiment 2 will be described. Figure 6 This is a top view of the transmission line structure 10A according to Embodiment 2. Figure 6 (A) represents the entire transmission line structure 10A. Figure 6 (B) represents an enlarged portion of the transmission line structure 10A.

[0066] Compared to the transmission line structure 10 according to Embodiment 1, a portion of the structure of the transmission line structure 10A according to Embodiment 2 is different. Specifically, the transmission line structure 10A differs from the transmission line structure 10 in the following aspects: the shape of the extensions extending from the ground pads 13A and 13B; the position of the transmission line 141 in the thickness direction of the dielectric substrate 11; the position of the grounding via 165; and the presence of a signal via 145 connected to the transmission line 141.

[0067] In the transmission line structure 10A, the extension 134 is configured to extend from the long side of the ground pads 13A and 13B in a manner that surrounds the entire outer periphery of the first signal pad. In the transmission line structure 10A, the extension 135 is configured to extend from the long side of the ground pads 13A and 13B in a manner that surrounds the entire outer periphery of the second signal pad.

[0068] In this way, by surrounding the entire outer periphery of each signal pad with extensions 134 and 135, electromagnetic interference from the outside can be prevented, improving electromagnetic compatibility (EMC). Extension 134 can suppress the generation of unwanted waves from transmission line 141, and extension 135 can also suppress the generation of unwanted waves from transmission line 151.

[0069] In the transmission line structure 10A, the transmission line 141 is positioned in the thickness direction of the dielectric substrate 11 closer to the ground electrode 161 than its position in the transmission line structure 10. This protects the transmission line 141 from external influences.

[0070] like Figure 6 (B) Figure 7 As shown, the grounding via 165 of the transmission line structure 10A is electrically connected to the extension 135 at multiple locations. Similarly, the grounding via 165 is electrically connected to the extension 134 at multiple locations on the extension 134 side.

[0071] like Figure 6 (B) Figure 7 As shown, the signal vias 155 disposed at the ends of the plurality of signal pad members 15A1~15A4 (15B1~15B4) of the second signal pad are positioned to overlap with the extension 135 when viewed from the normal direction of the ground pad 13A (13B). Similarly, the signal vias 145 disposed at the ends of the plurality of signal pad members 14A1~14A4 (14B1~14B4) of the first signal pad are also positioned to overlap with the extension 134 when viewed from the normal direction of the ground pad 13A (13B).

[0072] Furthermore, each signal pad component 14A1~14A4 (14B1~14B4) is electrically connected to the signal via 145 (155) via signal line 157. The signal via 145 (155) is disposed at a position that does not overlap with the extension 134 (135) in the thickness direction of the dielectric substrate 11.

[0073] like Figure 6 (B) Figure 7 As shown, on the second signal pad side, at the position where adjacent signal vias 155 are connected respectively ( Figure 6 At least a portion of a plurality of grounding vias 165 are configured at the location indicated by the double-dotted line in (B). Similarly, at least a portion of a plurality of grounding vias 165 are configured at the location where adjacent signal vias 145 are connected.

[0074] Thus, the grounding via 165 is positioned in a grid pattern surrounding the signal vias 145 and 155. This suppresses coupling between signal pad components 14A1-14A4 and between signal pad components 14B1-14B4, thereby improving isolation characteristics. The grid pattern of the grounding via 165 also suppresses the generation of unwanted waves from transmission line 141 and 151.

[0075] [Implementation Method 3]

[0076] Next, use Figure 8 The transmission line structure 10B according to Embodiment 3 will be described. Figure 8 This is a top view of the transmission line structure 10B according to Embodiment 3. Figure 8 This represents an enlarged portion of the transmission line structure 10B.

[0077] The transmission line structure 10B according to Embodiment 3 differs from the transmission line structure 10 according to Embodiment 1 in the following aspects: it does not have extensions 131 and 132; and it has added signal pad components 14A5 and 15A5.

[0078] like Figure 8 As shown, the extensions 131 and 132 may not be provided, and the number of each signal pad component 14A1~14A5 (15A1~15A5) may be appropriately changed. That is, the number of transmission lines 141 (151) connected to each signal pad component 14A1~14A5 (15A1~15A5) may also be appropriately changed.

[0079] [Implementation Method 4]

[0080] Next, use Figure 9 The transmission line structure 10C according to Embodiment 4 will be described. Figure 9 This is a top view of the transmission line structure 10C according to Embodiment 4. Figure 9 This represents an enlarged portion of the transmission line structure 10C.

[0081] The transmission line structure 10C according to Embodiment 4 differs from the transmission line structure 10B according to Embodiment 3 in the shape of the extension portion extending from the grounding pads 13A and 13B.

[0082] like Figure 9 As shown, the transmission line structure 10C includes protrusions 136 and 137, which are disposed at both ends of the grounding pad 13A (13B) in the second direction (long side direction) and protrude in the first direction (short side direction). When viewed from the normal direction of the grounding pad 13A (13B), the shape including the grounding pad 13A (13B) and the protrusions 136 and 137 is approximately H-shaped.

[0083] Therefore, within the outer edge 120A of the connector 12A, the proportion of the grounding pad 13A and the protrusions 136 and 137 increases, thus improving the mounting strength of the connector 12A. The grounding pad 13A and the protrusions 136 and 137 are symmetrical with respect to the first and second directions, thus improving self-alignment. In the transmission line structure 10C, mounting strength and self-alignment are also improved on the connector 12B side.

[0084] Furthermore, the shapes of the protrusions 136 and 137 can be any shape other than roughly the letter H, as long as they are symmetrical with respect to the first and second directions.

[0085] [Variation Example]

[0086] In the above embodiments, the grounding pad 13A (13B) can be rectangular or divided into multiple parts. The grounding pad 13A (13B) can also be a rectangular shape with rounded corners, approximating an ellipse shape.

[0087] In the above embodiments, the substrate connected to the connectors 12A and 12B of the transmission line structure 10 may also be a substrate other than the substrate used by the antenna device 190A and 190B.

[0088] In the above embodiment, it was described that connector 12A is configured at ground pad 13A and connector 12B is configured at ground pad 1B at both ends of the transmission line structure 10. However, the transmission line structure 10 may also have a connector configured at one end and other components configured at the other end. For example, it may be configured with a connector configured at one end and a patch antenna configured at the other end. Signals may also be transmitted to the patch antenna to radiate radio waves.

[0089] <Method>

[0090] (1) The transmission line structure of this disclosure comprises: a flat dielectric substrate having a first main surface and a second main surface facing the first main surface; a ground electrode disposed between the first main surface and the second main surface; a first transmission line disposed at a position closer to the first main surface than the ground electrode and extending in a first direction; a ground pad disposed on the first main surface; a first signal pad connected to the end of the first transmission line on the first main surface; at least one interlayer connector disposed within the dielectric substrate and connected to the ground electrode and the ground pad; and a connector connected to the ground pad and the first signal pad on the first main surface side. The ground pad is rectangular in shape having a long side along a second direction substantially perpendicular to the first direction and a short side along the first direction. The length of the ground pad in the first direction is shorter than the dimension of the connector in the first direction.

[0091] According to the transmission line structure disclosed herein, the force applied to the connection between the grounding pad and the connector when the transmission line structure is bent can be reduced, making it easier to bend the transmission line structure.

[0092] (2) The transmission line structure according to (1), wherein the transmission line structure further comprises a second transmission line disposed at a position closer to the second main surface than the ground electrode. The frequency band of the signal transmitted in the first transmission line is higher than the frequency band of the signal transmitted in the second transmission line.

[0093] According to the transmission line configuration disclosed herein, signals with higher frequency bands suffer greater losses due to distance compared to signals with lower frequency bands. Therefore, the first transmission line, whose signal frequency band is higher than that of the second transmission line, can be positioned closer to the connector. This reduces signal loss.

[0094] (3) The transmission line structure according to (2), wherein the transmission line structure further comprises a second signal pad, the second signal pad being connected to the end of the second transmission line on the first main surface. A grounding pad is disposed between the first signal pad and the second signal pad.

[0095] According to the transmission line structure disclosed herein, the grounding pad functions as a shield between the first signal pad and the second signal pad to prevent electromagnetic field coupling between the signal pads, thereby improving isolation characteristics.

[0096] (4) The transmission line structure according to any one of (1) to (3), wherein the first transmission line is disposed on the first main surface.

[0097] According to the transmission line construction disclosed herein, impedance matching can be easily achieved between the first transmission line and the components connected to the first transmission line by directly engaging the first transmission line with the connector.

[0098] (5) The transmission line structure according to any one of (1) to (4), wherein the length of the grounding pad in the second direction is longer than the dimension of the connector in the second direction.

[0099] According to the transmission line structure disclosed herein, the installation strength when installing connectors can be improved, and the mounting accuracy can be improved.

[0100] (6) The transmission line structure according to any one of (3) to (5), wherein the first signal pad and the second signal pad each include a plurality of signal pad components. The transmission line structure further includes a first extension that extends from the long side of the ground pad to between the signal pad components in each signal pad.

[0101] According to the transmission line structure disclosed herein, the first extension portion can prevent impedance mismatch between the first transmission line and the second transmission line at the mounting portion of the connector, and can improve isolation characteristics.

[0102] (7) The transmission line structure according to any one of (3) to (5), wherein the transmission line structure further comprises a second extension connected to a ground pad and configured to surround the entire periphery of each signal pad.

[0103] The transmission line structure disclosed herein can prevent electromagnetic interference from external sources and improve electromagnetic compatibility (EMC).

[0104] (8) The transmission line structure according to (7), wherein at least one interlayer connector comprises multiple interlayer connectors. The first signal pad and the second signal pad each comprise multiple signal pad components. The multiple interlayer connectors are connected to the second extension at multiple locations on the first main surface. Signal vias disposed at the ends of the multiple signal pad components of each signal pad are disposed at locations overlapping the second extension when viewed from the normal direction of the ground pad. At least a portion of the multiple interlayer connectors are disposed at locations that connect adjacent signal vias.

[0105] According to the transmission line structure disclosed herein, electrical separation between signal pad components is possible, thereby improving isolation characteristics. By configuring the interlayer interconnects in a lattice pattern, the generation of unwanted waves from the first transmission line can be suppressed, and the generation of unwanted waves from the second transmission line can also be suppressed.

[0106] (9) The transmission line structure according to any one of (1) to (8), wherein the transmission line structure further comprises a protrusion disposed at both ends of the grounding pad in a second direction and protruding in a first direction.

[0107] According to the transmission line construction disclosed herein, the mounting strength of the connector can be improved, and self-alignment can be enhanced.

[0108] (10) The transmission line structure according to (9) wherein, when viewed from the normal direction of the ground pad, the shape including the ground pad and the protrusion is approximately H-shaped.

[0109] The transmission line structure disclosed herein can improve the mounting strength of the connector and enhance self-alignment.

[0110] (11) The antenna module of this disclosure includes: the transmission line structure described in (1) to (10); and an antenna substrate connected to the transmission line structure via a connector provided in the transmission line structure, the antenna substrate having radiating electrodes.

[0111] According to the antenna module disclosed herein, it is possible to make an antenna module that can be easily bent into the transmission line structure.

[0112] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The scope of this disclosure is set forth in the claims rather than in the foregoing description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0113] Explanation of reference numerals in the attached figures

[0114] 10, 10A, 10B, 10C: Transmission line structure; 11: Dielectric substrate; 12A, 12B: Connectors; 13A, 13B: Grounding pads; 14A1~14A4, 14B1~14B5, 15A1~15A4, 15B1~15B4: Signal pad components; 20: Protective component; 100: Antenna module; 120A, 120B: Outer edge; 121: Main body; 122: First conductor section; 123: Second conductor section; 131: 132, 134, 135, Extension; 136, 137, Protrusion; 141, 151, Transmission line; 145, 155, Signal through hole; 157, Signal line; 161, 170A, 170B, 181, 251, Grounding electrode; 165, Grounding through hole; 180, Connecting member; 190, 190A, 190B, Antenna device; 191, 191A1~191A4, 191B~191B4, Radiation electrode; 250, Mother plate.

Claims

1. A transmission line structure, wherein, The transmission line structure includes: A flat dielectric substrate having a first main surface and a second main surface opposite to the first main surface; A grounding electrode is disposed between the first main surface and the second main surface; The first transmission line is positioned closer to the first main surface than the ground electrode and extends in the first direction; A grounding pad is disposed on the first main surface; The first signal pad is connected to the end of the first main surface and the first transmission line; At least one interlayer connector is disposed within the dielectric substrate and connected to the ground electrode and the ground pad; as well as A connector, which connects to the ground pad and the first signal pad on the first main surface side, The grounding pad is rectangular in shape, having a long side along a second direction that is substantially perpendicular to the first direction and a short side along the first direction. The length of the grounding pad in the first direction is shorter than the dimension of the connector in the first direction.

2. The transmission line structure according to claim 1, wherein, The transmission line structure also includes a second transmission line, which is positioned closer to the second main surface than the ground electrode. The frequency band of the signal transmitted in the first transmission line is higher than that of the signal transmitted in the second transmission line.

3. The transmission line structure according to claim 2, wherein, The transmission line structure also includes a second signal pad, which is connected to the end of the first main surface and the second transmission line. The grounding pad is positioned between the first signal pad and the second signal pad.

4. The transmission line structure according to any one of claims 1 to 3, wherein, The first transmission line is configured on the first main surface.

5. The transmission line structure according to any one of claims 1 to 4, wherein, The length of the grounding pad in the second direction is longer than the dimension of the connector in the second direction.

6. The transmission line structure according to claim 3, characterized in that, The first signal pad and the second signal pad each include multiple signal pad components. The transmission line structure also includes a first extension that extends from the long side of the ground pad to between the signal pad components in each signal pad.

7. The transmission line structure according to claim 3, wherein, The transmission line structure also includes a second extension that is connected to the ground pad and is configured to surround the entire outer periphery of each signal pad.

8. The transmission line structure according to claim 7, wherein, The at least one interlayer connector includes multiple interlayer connectors. The first signal pad and the second signal pad each include multiple signal pad components. The plurality of interlayer connectors are respectively connected to the second extension at multiple positions on the first main surface side. The signal vias disposed at the ends of the plurality of signal pad components of each signal pad are positioned overlapping the second extension when viewed from the normal direction of the ground pad. At least a portion of the plurality of interlayer connectors are disposed at positions that connect adjacent signal vias.

9. The transmission line structure according to any one of claims 1 to 8, wherein, The transmission line structure also includes protrusions disposed at both ends of the grounding pad in the second direction and protruding in the first direction.

10. The transmission line structure according to claim 9, wherein, When viewed from the normal direction of the ground pad, the shape of the ground pad and the protrusion is approximately the letter H.

11. An antenna module, wherein, This antenna module has the following features: The transmission line structure according to any one of claims 1 to 10; as well as An antenna substrate, which is connected to the transmission line structure via a connector provided on the transmission line structure, has radiating electrodes.

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