Inverted flexible pressure sensor based on negative poisson's ratio structure

By employing a negative Poisson's ratio structure and a composite material layering design, the problems of high sensitivity, wide operating range, and stability of flexible resistive pressure sensors have been solved, achieving high stability and durability during repeated deformation processes. This makes the sensors suitable for wearable electronics and industrial robots.

CN122360745APending Publication Date: 2026-07-10HEFEI UNIV OF TECH +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HEFEI UNIV OF TECH
Filing Date
2026-04-20
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing flexible resistive pressure sensors based on crack structures struggle to simultaneously achieve high sensitivity, wide operating range, and high stability. Furthermore, the sensors are prone to interface peeling, detachment, or displacement during repeated deformation, resulting in poor stability and durability.

Method used

The layered design employs a negative Poisson's ratio structure, including an upper encapsulation layer, a low conductivity layer, and a high conductivity layer. The high conductivity layer contains through cracks, and the encapsulation layer contains a concave hexagonal hole structure. Combined with a composite material of silicone rubber, polylactic acid, hydroxylated graphene, and nano-carbon black particles, the sensor's sensitivity and stability are improved through laser etching of directional cracks and flip-chip arrangement of signal electrodes.

Benefits of technology

It achieves high sensitivity and stability of the sensor over a wide range, avoids interface peeling, improves the sensor's durability and electrical connection reliability, and is suitable for wearable electronics and industrial robots.

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Abstract

This invention discloses a flip-chip ultrasensitive resistive flexible pressure sensor based on a negative Poisson's ratio structure, comprising, from top to bottom, an upper encapsulation layer, a low-conductivity layer, a high-conductivity layer, and a lower encapsulation layer. The upper, low-conductivity, and lower encapsulation layers all employ a pore structure composed of concave hexagonal holes, giving them a negative Poisson's ratio characteristic. Under pressure, they undergo lateral contraction, significantly increasing the opening and closing degree of cracks in the high-conductivity layer and effectively improving the sensor's sensitivity. The high-conductivity layer contains linear, regular cracks penetrating its thickness. The lower encapsulation layer contains two through-holes, each containing a signal electrode, the upper end of which is connected to the high-conductivity layer. The flexible pressure sensor provided by this invention possesses characteristics such as high sensitivity, high stability, and a wide operating range, making it well-suited for applications in wearable devices, industrial robots, and other fields.
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Citation Information

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