A manufacturing method, device, equipment and storage medium of a laser ranging module

Abstract

This invention discloses a manufacturing method, apparatus, equipment, and storage medium for a laser ranging module, applicable to the field of laser ranging module manufacturing. The method includes: integrating bare-chip electronic components of the laser ranging module onto a circuit board using SiP_COB technology to obtain a laser ranging circuit board; pre-assembling a collimating lens at the transmitting end and a focusing lens at the receiving end on a lens frame; fixing the pre-assembled lens frame onto the laser ranging circuit board using a sub-micron level optical alignment system to obtain the laser ranging module; and performing full-link optical efficiency verification on the laser ranging module to achieve optical coupling. This invention achieves high-precision optical-grade CPO packaging through SiP_COB technology and performs complete optical path coupling matching calibration, significantly improving product performance and meeting the needs of miniaturized applications.

Description

Technical Field

[0001] This invention relates to the field of laser ranging module manufacturing, and particularly to a method for manufacturing a laser ranging module, a manufacturing apparatus for a laser ranging module, an electronic device, and a computer-readable storage medium. Background Technology

[0002] Current laser ranging modules primarily employ a modular assembly process using surface mount technology (SMT). After packaging and testing, the RX and TX components are soldered onto a printed circuit board (PCB) substrate via SMT. During SMT soldering, errors in PCB pad etching precision and solder flatness are unavoidable. This modular assembly method results in lower assembly accuracy for the RX (receiver) and TX (transmitter), making it difficult to precisely control the pitch and horizontal angles, thus affecting overall performance. Furthermore, manually coupling RX to RX lenses and TX to TX lenses further increases assembly errors, ultimately leading to focal length shift and impacting product accuracy. The modular assembly also results in larger product size and increased weight, making it unsuitable for miniaturized applications (such as UAV altitude and distance measurement). Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing a laser ranging module, a device for manufacturing a laser ranging module, an electronic device, and a computer-readable storage medium, which are applied in the field of laser ranging module manufacturing. This method achieves high-precision optical-grade CPO packaging through SiP_COB process technology and performs complete optical path coupling matching calibration, which greatly improves product performance and meets the needs of miniaturized applications.

[0004] To solve the above-mentioned technical problems, the present invention provides a method for manufacturing a laser ranging module, comprising: The bare chip electronic components of the laser ranging module are integrated onto a circuit board using the SiP_COB process to obtain a laser ranging circuit board. Pre-assemble the transmitting collimating lens and the receiving focusing lens on the lens frame; The pre-assembled lens frame is fixed to the laser ranging circuit board using a submicron-level optical alignment system to obtain a laser ranging module. The laser ranging module is then subjected to full-link optical efficiency verification to achieve optical coupling.

[0005] Optionally, the bare-chip electronic components of the laser ranging module are integrated onto a circuit board using SiP_COB technology to obtain a laser ranging circuit board, including: The core functional bare chip of COB process and the auxiliary electronic components of WLCSP process are SiP packaged on the circuit board. The core functional bare chips include: a laser transmitter bare chip, a laser receiver bare chip, a driver bare chip, and a main control logic bare chip; the auxiliary electronic components include: resistors, capacitors, and ESD protection devices; The circuit board has built-in high-frequency transmission traces and a grounding shielding layer to achieve a signal transmission bandwidth of ≥10Gbps.

[0006] Optionally, the packaging process for the laser emitter bare chip and the laser receiver bare chip includes: The submicron-level optical alignment system employs six degrees of freedom and uses active light intensity feedback calibration technology to align the photosensitive receiving surfaces of the laser emitter bare chip and the laser receiver bare chip with the preset optical reference marks on the circuit board, thereby achieving optical coupling between the laser emitter bare chip and the laser receiver bare chip. The die bonding process uses low-temperature eutectic solder and completes the metallurgical bonding between the chip and the circuit substrate in a vacuum reflow oven to achieve a chip mounting flatness of ≤0.1μm.

[0007] Optionally, pre-assembly of the transmitting collimating lens and the receiving focusing lens on the lens frame includes: The collimating lens at the transmitting end and the focusing lens at the receiving end are fixed within the integrated metal frame of the lens frame by an interference fit; wherein, the lens and the lens frame are sealed with UV-curable optical adhesive, and after curing, the lens eccentricity is ≤0.3μm and the tilt angle is ≤10″.

[0008] Optionally, a laser ranging module is obtained by fixing the pre-assembled lens frame to the laser ranging circuit board using the submicron-level optical alignment system, including: The pre-assembled lens frame is placed on the operating platform of the submicron-level optical alignment system; The laser beam divergence angle of the laser emitted from the bare chip at the laser emitter end after passing through the collimating lens of the emitter end, and the light intensity distribution on the receiving surface of the bare chip at the laser receiver end after passing through the focusing lens of the receiver end are detected in real time using a laser interferometer. Based on the beam divergence angle and the light intensity distribution, the X / Y / Z axis positions and rotation angles of the emitting collimating lens and the receiving focusing lens are adjusted by a closed-loop control algorithm so that the central optical axis of the emitted laser beam coincides with the photosensitive center of the receiving surface by ≥99.5%.

[0009] Optionally, the lens frame divides the optical window of the laser receiving bare chip into a main receiving optical window located in the receiving cavity and an auxiliary optical window located in the transmitting cavity, for the purpose of realizing optical path feedback.

[0010] Optionally, the laser ranging circuit includes a temperature compensation circuit; the lens frame is manufactured based on a low CTE material.

[0011] To solve the above-mentioned technical problems, the present invention provides a manufacturing apparatus for a laser ranging module, comprising: The first module is used to integrate the bare chip electronic components of the laser ranging module onto the circuit board using SiP_COB technology to obtain a laser ranging circuit board. The second module is used for the pre-assembly of the transmitting collimating lens and the receiving focusing lens on the lens frame; The third module is used to fix the pre-assembled lens frame to the laser ranging circuit board through a submicron-level optical alignment system to obtain a laser ranging module, and to perform full-link optical efficiency verification on the laser ranging module to achieve optical coupling.

[0012] To solve the above-mentioned technical problems, the present invention provides an electronic device, comprising: Memory, used to store computer programs; A processor is used to implement the manufacturing method of the laser ranging module described above when executing the computer program.

[0013] To solve the above-mentioned technical problems, the present invention provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the manufacturing method of the laser ranging module described above.

[0014] As can be seen, this invention uses SiP_COB technology to integrate the bare-chip electronic components of the laser ranging module onto a circuit board to obtain a laser ranging circuit board. The transmitting collimating lens and the receiving focusing lens are pre-assembled on a lens frame. The pre-assembled lens frame is then fixed to the laser ranging circuit board using a sub-micron level optical alignment system to obtain the laser ranging module. The laser ranging module undergoes end-to-end optical efficiency verification to achieve optical coupling. This invention achieves high-precision optical-grade CPO packaging through SiP_COB technology and performs complete optical path coupling matching calibration, significantly improving product performance and meeting the requirements of miniaturized applications. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0016] Figure 1A flowchart illustrating a method for manufacturing a laser ranging module according to an embodiment of the present invention; Figure 2 This is a system block diagram of a laser ranging module provided in an embodiment of the present invention; Figure 3 This is an example diagram of an electronic component layout provided in an embodiment of the present invention; Figure 4 This is an example diagram of a lens frame structure provided in an embodiment of the present invention; Figure 5 This is an overall architecture diagram of a laser ranging module provided in an embodiment of the present invention; Figure 6 This is a structural block diagram of a manufacturing apparatus for a laser ranging module provided in an embodiment of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The current product process mainly uses discrete components assembled via SMT. The optoelectronic conversion device, i.e., the RX (receiver), typically uses PD (Photodiode), APD (Avalanche Photon Diode), and SPAD (Single-Photon Avalanche Diode). The electro-optical conversion device, i.e., the TX (transmitter), mostly uses LD (Laser Diode) and VCSEL (Vertical-Cavity Surface-Emitting Laser).

[0019] The RX and TX devices are packaged into finished products using semiconductor packaging and testing processes. After packaging and testing, the RX and TX devices are soldered onto the PCB substrate using surface mount technology. However, this separate assembly method results in low assembly accuracy of the RX and TX, making it difficult to accurately control the pitch and horizontal angles of the product, thus affecting the overall performance.

[0020] During SMT soldering, errors in PCB pad etching accuracy and soldering flatness are unavoidable, which prevents the lens from achieving coaxial alignment with the RX / TX chip.

[0021] Existing methods involve manually coupling RX and RX lenses, and TX and TX lenses, which further increases assembly errors and ultimately leads to focal length shift, affecting product accuracy.

[0022] Separate assembly results in larger product size and increased weight, making it unsuitable for miniaturized applications (such as drone altitude and distance measurement).

[0023] The following combination Figure 1 , Figure 1 A flowchart illustrating a method for manufacturing a laser ranging module according to an embodiment of the present invention is provided. This method may include: S101: The bare chip electronic components of the laser ranging module are integrated onto the circuit board using the SiP_COB process to obtain the laser ranging circuit board.

[0024] A laser ranging module is a sensor component that measures the distance to a target non-contactly by emitting a laser and analyzing its reflected signal. A high-precision ranging scheme is based on Direct Time-of-Flight (dTOF) measurement technology, specifically optical time-of-flight ranging. Its core principle is to calculate the target distance by emitting pulsed light and measuring its round-trip time difference. The laser ranging module in this embodiment has picosecond-level time resolution and sub-millimeter-level ranging accuracy.

[0025] A laser ranging module is essentially a complete miniature ranging system, and its structure can be as follows: Figure 2 As shown, this embodiment does not limit the specific chip types of the receiver RX bare chip and the transmitter TX bare chip. They can be set according to the actual application. The following is one example. In this embodiment, the RX bare chip can be a single-photon avalanche diode, that is, a SPAD bare chip, and the TX bare chip can be a vertical cavity surface-emitting laser, that is, a VCSEL bare chip.

[0026] The VCSEL bare die is used to emit short-pulse laser signals with pulse widths in the range of 0.1-0.5ns; the SPAD bare die + TDC form an ultra-high sensitivity photon detector, capable of detecting single photons and recording precise arrival times, and achieving picosecond-level timestamp recording through the built-in TDC (Time-to-Digital Converter); the MCU (Microcontroller Unit) bare die is used to process photon pulse width time-of-flight data, perform noise processing through filtering algorithms, and calculate distance information based on the processed signal; GIPO (General Purpose Input / Output) refers to the general-purpose pins on the integrated circuit.

[0027] System-in-Package (SiP) is a semiconductor packaging technology that integrates multiple components such as sensors, analog-to-digital converters, logic chips, and memory chips into a single package to achieve system functions.

[0028] Chip-on-Board (COB) is an electronic assembly process in which bare semiconductor chips are directly glued and bonded onto a printed circuit board and then covered and protected with resin.

[0029] SiP (System in Package) is a technology that integrates multiple chips with different functions (such as processors, memory, and sensors) and passive components (resistors and capacitors) into a single package, making it a fully functional system or subsystem.

[0030] Wafer-Level Chip Scale Package (WLCSP) is an advanced packaging technology. Its core feature is that all packaging processes are completed on the entire wafer before it is finally diced into individual chips.

[0031] This embodiment can perform SiP packaging on a circuit board for the core functional bare chips of COB process and the auxiliary electronic components of WLCSP process; the core functional bare chips may include: laser emitter bare chips, laser receiver bare chips, driver bare chips, main control logic bare chips, etc.; the auxiliary electronic components may include: resistors, capacitors and ESD (Electrostatic Discharge Protection) protection devices, etc.; the circuit board has built-in high-frequency transmission traces and grounding shielding layer to achieve a signal transmission bandwidth of ≥10Gbps.

[0032] Specifically, this embodiment uses a customized high-density interconnect substrate as the core carrier, integrating core functional dies such as the laser transmitter (TX) die, laser receiver (RX) die, dedicated driver chip die, and main control logic die, along with auxiliary electronic components such as matching resistors, high-precision capacitors, and ESD protection devices, through WLCSP technology. The substrate incorporates high-frequency transmission traces and a grounding shielding layer, effectively suppressing electromagnetic interference (EMI) between the TX transmitter and RX receiver links, ensuring a signal transmission bandwidth ≥10Gbps to meet the high-speed data processing requirements of the laser ranging system.

[0033] In this embodiment, the packaging process for the laser transmitter bare chip and the laser receiver bare chip can be as follows: using a six-degree-of-freedom submicron-level optical alignment system, and through active light intensity feedback calibration technology, the photosensitive receiving surfaces of the laser transmitter bare chip and the laser receiver bare chip are respectively aligned with the preset optical reference marks on the circuit board to achieve optical coupling between the laser transmitter bare chip and the laser receiver bare chip; wherein, the die bonding process uses low-temperature eutectic solder, and the metallurgical bonding between the chip and the circuit board is completed in a vacuum reflow oven to achieve a chip mounting flatness ≤0.1μm.

[0034] like Figure 3 As shown, the electronic components of the laser ranging module in this embodiment may include, for example: RX bare core (such as SPAD bare core), TX bare core (such as VCSEL bare core), MCU bare core, temperature sensor (temp sensor), boost circuit, storage circuit (flsah), and drive circuit (drive), etc. The SPAD bare core can be divided into a main receiving optical window and an auxiliary optical window. The main receiving optical window is used to receive the optical signal emitted and returned by the TX bare core, and the auxiliary optical window is used to receive ambient light and the optical signal emitted by the TX bare core. The optical signal received through the auxiliary optical window can realize optical path feedback to adjust the power of the TX bare core laser emitter. For example, when the ambient light detected through the auxiliary optical window is relatively strong, it will affect the laser ranging result, leading to inaccurate measurement results. At this time, the MCU bare core can adjust and enhance the power of the TX transmitting laser emitter to avoid the influence of ambient light.

[0035] The specific workflow of the laser ranging module can be as follows: the boost circuit provides a stable driving voltage for the TX bare core; the MCU bare core controls the SPAD bare core to send a driving pulse to trigger the VCSEL bare core to emit an infrared signal; the main receiving optical window receives time-of-flight photons, the auxiliary optical window calibrates ambient light interference, the RX bare core converts the optical signal into an electrical signal and transmits it to the MCU bare core; the MCU bare core converts the electrical signal into a digital signal through the built-in analog-to-digital conversion detection module, processes the optical signal data and performs compensation, and then outputs digital information through the UART (Universal Asynchronous Receiver / Transmitter) interface.

[0036] In this embodiment, nanosecond-level time resolution is achieved by combining the SPAD single-photon detection sensitivity with the main optical window time-of-flight measurement.

[0037] This embodiment can incorporate a temperature sensor to integrate a temperature compensation circuit into the laser ranging circuit. By combining the temperature sensor with the analog-to-digital conversion module, the effects of temperature on the TX wavelength, SPAD detection efficiency, and circuit parameters can be compensated, enhancing the product's reliability under complex environmental conditions.

[0038] This embodiment can set an auxiliary light window to monitor the light signal emitted by the TX bare chip in real time and compare it with the ambient light, and perform dynamic power compensation of the TX bare chip through the MCU bare chip.

[0039] This embodiment can be configured with a boost circuit to provide a stable drive voltage for the TX bare core, ensuring stable performance under different temperatures and loads.

[0040] In this embodiment, a high-precision laser ranging module can be built based on SPAD and VCSEL, integrating temperature compensation and optical path matching calibration functions, which is suitable for short-distance high-precision ranging and ambient light interference suppression scenarios.

[0041] S102: Pre-assemble the transmitting collimating lens and the receiving focusing lens on the lens frame.

[0042] In this embodiment, the collimating lens at the transmitting end and the focusing lens at the receiving end can be pre-assembled on the lens frame holder.

[0043] This embodiment does not limit the manufacturing material of the lens frame. Generally, the lens frame can be made based on a low CTE (Coefficient of Thermal Expansion) material. Low CTE materials can suppress deformation caused by temperature changes, ensure long-term stability, and avoid the problem of inaccurate ranging results of the laser ranging module due to material deformation caused by temperature changes, which in turn leads to optical path mismatch.

[0044] In this embodiment, the specific coefficient of thermal expansion of the low CTE material can be selected based on the actual application, taking into account both cost and engineering applications. In this embodiment, the glass lens is assembled onto the holder and fixed by mechanical processing and optical positioning. This embodiment does not limit the specific fixing method; generally, UV (Ultraviolet Curable Adhesive) adhesive can be used for fixing.

[0045] Specifically, in this embodiment, the collimating lens at the transmitting end and the focusing lens at the receiving end can be fixed in the integrated metal frame of the lens frame by interference fit (fit tolerance H7 / g6); wherein, the lens and the lens frame are sealed with UV-curable optical adhesive, and after curing, the lens eccentricity is ≤0.3μm and the tilt angle is ≤10″.

[0046] In this embodiment, the structure of the lens frame can be exemplified as follows: Figure 4 As shown. This embodiment does not limit the specific structure of the lens frame, and can be set according to the actual application, as long as it can divide the optical window of the receiver RX bare core into the main receiving optical window located in the receiving cavity and the auxiliary optical window located in the transmitting cavity.

[0047] S103: The pre-assembled lens frame is fixed on the laser ranging circuit board through a submicron-level optical alignment system to obtain the laser ranging module, and the laser ranging module is subjected to full-link optical efficiency verification to achieve optical coupling.

[0048] In this embodiment, the submicron optical alignment system of the laser ranging module aims to calibrate the transmitting and receiving optical axes to a parallel state, thereby avoiding inaccurate ranging results caused by optical path deviations. This embodiment achieves submicron-level alignment between the RX bare-core optical window and the TX bare-core emission aperture by introducing a high-precision optical alignment system, ensuring precise optical path matching.

[0049] Specifically, in this embodiment, the pre-assembled lens frame can be placed on the operating platform of the submicron-level optical alignment system; the divergence angle of the laser beam emitted by the bare chip at the laser emitter after passing through the collimating lens at the emitter end, and the light intensity distribution on the receiving surface of the laser receiving bare chip after passing through the focusing lens at the receiver end are detected in real time by a laser interferometer; based on the beam divergence angle and light intensity distribution, the X (horizontal) / Y (vertical) / Z (optical axis) axis positions and rotation angles of the collimating lens at the emitter end and the focusing lens at the receiver end are adjusted by a closed-loop control algorithm, so that the central optical axis of the emitted laser beam coincides with the photosensitive center of the receiving surface by ≥99.5%, and the optical coupling efficiency is improved by more than 30% compared with the traditional process.

[0050] Further verification of the entire optical path efficiency was conducted: a 980nm test laser could be injected, the coupling efficiency could be detected by a power meter, and the final optical path alignment accuracy could be controlled within ±1μm, meeting the requirements of industrial-grade ranging.

[0051] In this embodiment, the overall architecture of the laser ranging module can be as follows: Figure 5 As shown, it includes a laser ranging circuit that integrates various electronic components, also known as a PCBA. A PCBA (Printed Circuit Board Assembly) is a finished circuit board with electrical properties formed by assembling electronic components on a PCB through integrated packaging technology.

[0052] In this embodiment, a lens frame is provided on the laser ranging circuit, and the transmitting cavity and receiving cavity are separated by the lens frame; the optical window of the receiver RX bare core is divided by the lens frame into the main receiving optical window (such as SPAD optical window 1) located in the receiving cavity and the auxiliary optical window (such as SPAD optical window 2) located in the transmitting cavity, so as to realize optical path feedback.

[0053] This embodiment does not limit the division method of the main receiving optical window and the auxiliary optical window. Generally, they can be divided on the same optical window of the RX bare core. This embodiment does not limit the division size of the main receiving optical window and the auxiliary optical window. The specific size can be set based on the actual application.

[0054] This embodiment proposes a complete semiconductor process solution, with specific improvements as follows: This embodiment employs SiP_COB technology to integrate electronic components such as RX bare chips, TX bare chips, MCU bare chips, drives, flash memory, resistors, and capacitors onto the same circuit board, eliminating sources of error in separate assembly. A high-precision optical alignment system is introduced to achieve micron-level alignment between the RX bare chip's optical window and the TX bare chip's emission aperture, ensuring precise optical path matching. An optical calibration system enables automatic coupling between RX bare chips and RX bare chip lenses, and between TX bare chips and TX bare chip lenses, eliminating human error. Lenses are fixed using materials with a low coefficient of thermal expansion to suppress deformation caused by temperature changes and ensure long-term stability. Integrated temperature compensation circuitry and other designs enhance the product's reliability under complex environmental conditions. Through the above technical solutions, this invention achieves high-precision heterogeneous integration of optoelectronic devices, significantly improving product performance and long-term stability, meeting the stringent requirements of high-end applications such as lidar and optical communication, and satisfying the needs of miniaturized applications.

[0055] Based on the above embodiments, the present invention achieves high-precision packaging of optical-grade CPO (Co-packaged optics) through SiP_COB process technology and performs complete optical path coupling matching calibration, which greatly improves product performance and meets the needs of miniaturized applications.

[0056] The following combination Figure 6 , Figure 6 This is a structural block diagram of a manufacturing apparatus for a laser ranging module provided in an embodiment of the present invention. The apparatus may include: The first module 100 is used to integrate the bare chip electronic components of the laser ranging module onto the circuit board using SiP_COB technology to obtain a laser ranging circuit board. The second module 200 is used for the pre-assembly of the transmitting collimating lens and the receiving focusing lens on the lens frame; The third module 300 is used to fix the pre-assembled lens frame onto the laser ranging circuit board through a submicron-level optical alignment system to obtain a laser ranging module, and to perform full-link optical efficiency verification on the laser ranging module to achieve optical coupling.

[0057] Based on the above embodiments, the present invention achieves high-precision optical-grade CPO packaging through SiP_COB process technology and performs complete optical path coupling matching calibration, which greatly improves product performance and meets the needs of miniaturized applications.

[0058] Based on the above embodiments, the first module 100 may include: The first unit is used to perform SiP packaging on the circuit board for the core functional bare chip of COB process and the auxiliary electronic components of WLCSP process. The core functional bare chips include: laser transmitter bare chip, laser receiver bare chip, driver bare chip, and main control logic bare chip; auxiliary electronic components include: resistors, capacitors, and ESD protection devices; The circuit board incorporates high-frequency transmission traces and a grounding shield to achieve a signal transmission bandwidth of ≥10Gbps.

[0059] Based on the above embodiments, the first unit includes: The first subunit is used to employ a six-degree-of-freedom submicron-level optical alignment system to align the photosensitive receiving surfaces of the laser transmitter bare chip and the laser receiver bare chip with the preset optical reference marks on the circuit board through active light intensity feedback calibration technology, so as to achieve optical coupling between the laser transmitter bare chip and the laser receiver bare chip. The die bonding process uses low-temperature eutectic solder and completes the metallurgical bonding between the chip and the circuit board in a vacuum reflow oven to achieve a chip mounting flatness of ≤0.1μm.

[0060] Based on the above embodiments, the second module 200 may include: The second unit is used to fix the collimating lens of the transmitting end and the focusing lens of the receiving end in an integrated metal frame of the lens frame by interference fit; wherein, the lens and the lens frame are sealed with UV-curable optical adhesive, and after curing, the lens eccentricity is ≤0.3μm and the tilt angle is ≤10″.

[0061] Based on the above embodiments, the third module 300 may include: The third unit is used to place the pre-assembled lens frame onto the operating platform of the submicron-level optical alignment system; The fourth unit is used to detect in real time the beam divergence angle of the laser emitted by the bare chip at the laser emitter after passing through the collimating lens at the emitter end, and the light intensity distribution on the receiving surface of the laser receiving bare chip after passing through the focusing lens at the receiver end; The fifth unit is used to adjust the X / Y / Z axis positions and rotation angles of the collimating lens at the transmitting end and the focusing lens at the receiving end based on the beam divergence angle and light intensity distribution through a closed-loop control algorithm, so that the central optical axis of the emitted laser beam coincides with the photosensitive center of the receiving surface by ≥99.5%.

[0062] Based on the above embodiments, the lens frame divides the optical window of the laser receiving bare chip into a main receiving optical window located in the receiving cavity and an auxiliary optical window located in the transmitting cavity, in order to realize optical path feedback.

[0063] Based on the above embodiments, the laser ranging circuit includes a temperature compensation circuit; the lens frame is manufactured based on a low CTE material.

[0064] Based on the above embodiments, the present invention also provides an electronic device, which may include a memory and a processor. The memory stores a computer program, and when the processor calls the computer program in the memory, it can implement the steps provided in the above embodiments. Of course, the device may also include various necessary network interfaces, a power supply, and other components.

[0065] The present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by an execution terminal or processor, can implement the method provided in the embodiments of the present invention; the storage medium may include various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0066] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0067] The manufacturing method, apparatus, device, and storage medium of a laser ranging module provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for manufacturing a laser ranging module, characterized in that, include: The bare chip electronic components of the laser ranging module are integrated onto a circuit board using the SiP_COB process to obtain a laser ranging circuit board. Pre-assemble the transmitting collimating lens and the receiving focusing lens on the lens frame; The pre-assembled lens frame is fixed to the laser ranging circuit board using a submicron-level optical alignment system to obtain a laser ranging module. The laser ranging module is then subjected to full-link optical efficiency verification to achieve optical coupling.

2. A method for manufacturing a laser ranging module according to claim 1, characterized in that, The laser ranging circuit board is obtained by integrating the bare-chip electronic components of the laser ranging module onto a circuit board using the SiP_COB process, including: The core functional bare chip of COB process and the auxiliary electronic components of WLCSP process are SiP packaged on the circuit board. The core functional bare chips include: a laser transmitter bare chip, a laser receiver bare chip, a driver bare chip, and a main control logic bare chip; the auxiliary electronic components include: resistors, capacitors, and ESD protection devices; The circuit board has built-in high-frequency transmission traces and a grounding shielding layer to achieve a signal transmission bandwidth of ≥10Gbps.

3. The manufacturing method of the laser ranging module according to claim 2, characterized in that, The packaging process for the laser transmitter bare chip and the laser receiver bare chip includes: The submicron-level optical alignment system employs six degrees of freedom and uses active light intensity feedback calibration technology to align the photosensitive receiving surfaces of the laser emitter bare chip and the laser receiver bare chip with the preset optical reference marks on the circuit board, thereby achieving optical coupling between the laser emitter bare chip and the laser receiver bare chip. The die bonding process uses low-temperature eutectic solder and completes the metallurgical bonding between the chip and the circuit substrate in a vacuum reflow oven to achieve a chip mounting flatness of ≤0.1μm.

4. A method for manufacturing a laser ranging module according to claim 1, characterized in that, Pre-assembly of the transmitting collimating lens and the receiving focusing lens on the lens frame includes: The collimating lens at the transmitting end and the focusing lens at the receiving end are fixed within the integrated metal frame of the lens frame by an interference fit; wherein, the lens and the lens frame are sealed with UV-curable optical adhesive, and after curing, the lens eccentricity is ≤0.3μm and the tilt angle is ≤10″.

5. A method for manufacturing a laser ranging module according to claim 1, characterized in that, The pre-assembled lens frame is fixed to the laser ranging circuit board using the submicron-level optical alignment system to obtain a laser ranging module, including: The pre-assembled lens frame is placed on the operating platform of the submicron-level optical alignment system; The laser beam divergence angle of the laser emitted from the bare chip at the laser emitter end after passing through the collimating lens of the emitter end, and the light intensity distribution on the receiving surface of the bare chip at the laser receiver end after passing through the focusing lens of the receiver end are detected in real time using a laser interferometer. Based on the beam divergence angle and the light intensity distribution, the X / Y / Z axis positions and rotation angles of the emitting collimating lens and the receiving focusing lens are adjusted by a closed-loop control algorithm so that the central optical axis of the emitted laser beam coincides with the photosensitive center of the receiving surface by ≥99.5%.

6. The method for manufacturing the laser ranging module according to claim 1, characterized in that, The lens frame divides the optical window of the laser receiving bare chip into a main receiving optical window located in the receiving cavity and an auxiliary optical window located in the transmitting cavity, which is used to realize optical path feedback.

7. The method for manufacturing the laser ranging module according to claim 1, characterized in that, The laser ranging circuit includes a temperature compensation circuit; the lens frame is made of a low CTE material.

8. A manufacturing apparatus for a laser ranging module, characterized in that, include: The first module is used to integrate the bare chip electronic components of the laser ranging module onto the circuit board using SiP_COB technology to obtain a laser ranging circuit board. The second module is used for the pre-assembly of the transmitting collimating lens and the receiving focusing lens on the lens frame; The third module is used to fix the pre-assembled lens frame to the laser ranging circuit board through a submicron-level optical alignment system to obtain a laser ranging module, and to perform full-link optical efficiency verification on the laser ranging module to achieve optical coupling.

9. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the method of manufacturing the laser ranging module as described in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, implement the manufacturing method of the laser ranging module as described in any one of claims 1 to 7.

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