A high-speed signal transmission electrical connector module

Abstract

This invention provides a high-speed signal transmission electrical connector module, including a pogo module, a signal wafer module, and an adapter module. The pogo module comprises multiple pogo sub-modules spliced ​​along the Y-axis. Each pogo sub-module includes a ground plane with pogo mounting holes. An inner conductor and an outer conductor are coaxially arranged within each pogo mounting hole. The signal wafer module is located at the rear end of the pogo module and includes multiple signal terminals. Each signal terminal is surrounded by an electromagnetic shielding channel, with the signal terminal located at the center of the electromagnetic shielding channel. The rear end of the inner conductor is electrically connected to the front end of the signal terminal, and the outer conductor is electrically connected to the electromagnetic shielding layer of the electromagnetic shielding channel. This structure ensures that during signal transmission, the electromagnetic field is confined between the inner conductor and the coaxial outer conductor, and between the signal terminal and the shielding channel, enabling high-speed signal transmission.

Description

Technical Field

[0001] This invention relates to the field of electrical connection technology, and in particular to an electrical connector module for high-speed signal transmission. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] With the development of 5G communications, data centers, and other fields, electrical connectors need to support increasingly higher signal transmission rates. In existing technologies, some electrical connectors employ shielding structures, such as placing a metal shielding layer around the signal pins to reduce electromagnetic interference. However, such shielding structures are often not completely enclosed or are not concentrically arranged, failing to form a complete coaxial transmission structure between the signal transmission path and the return path. This results in limited electromagnetic field confinement under high-frequency conditions, causing signal reflection and energy loss, thus affecting the transmission quality of high-speed signals.

[0004] Therefore, how to provide a high-speed signal transmission electrical connector module with better performance has become a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide an electrical connector module for high-speed signal transmission.

[0007] To address the aforementioned technical problems, this invention provides a high-speed signal transmission electrical connector module, comprising a pogo module (i.e., a flexible pin module), a signal wafer module (i.e., a cavity-like coaxial module), and an adapter module. The pogo module includes multiple pogo sub-modules spliced ​​along the Y-axis. Each pogo sub-module includes a ground plane with pogo mounting holes. An inner conductor and an outer conductor are coaxially arranged within each pogo mounting hole. The signal wafer module is located at the rear end of the pogo module and includes multiple signal terminals. Each signal terminal has an electromagnetic shielding channel surrounding it, with the signal terminal located at the center of the electromagnetic shielding channel. The rear end of the inner conductor is electrically connected to the front end of the signal terminal, and the outer conductor is electrically connected to the electromagnetic shielding layer of the electromagnetic shielding channel.

[0008] Preferably, the adapter module is located at the rear end of the signal wafer module. The adapter module includes an adapter board with multiple signal adapter mounting holes and multiple grounding mounting holes. A signal adapter button is disposed in each of the signal adapter mounting holes and is electrically connected to the signal terminal. A grounding button is disposed in each of the grounding mounting holes and is electrically connected to the electromagnetic shielding layer of the electromagnetic shielding channel.

[0009] Preferably, the signal wafer module includes multiple return ground wafers arranged and spliced ​​along the Y direction. A signal terminal module is disposed between two adjacent return ground wafers. The return ground wafer includes a sheet-shaped return ground terminal. Multiple rows of plastic parts extending along the X direction are injection molded on the return ground terminal, and the multiple rows of plastic parts are arranged along the Z direction. The surface of the plastic parts is plated with a metal material layer. In two adjacent return ground wafers, the plastic parts on opposite surfaces are matched and spliced ​​together. After splicing, the lower surface of the upper plastic part, the upper surface of the lower plastic part, and the opposite surfaces of the return ground terminals of the two adjacent return ground wafers together form the electromagnetic shielding channel. The cross-section of the electromagnetic shielding channel is rectangular. The signal terminal module includes the signal terminal and a bracket injection molded on the signal terminal. The bracket is sandwiched between two return ground wafers, and the signal terminal passes through the electromagnetic shielding channel.

[0010] Preferably, the inner conductor is an elastic needle structure, including a needle tube, a spring installed inside the needle tube, and a front needle shaft and a rear needle shaft respectively installed at both ends of the spring. The front needle shaft extends from the front end of the needle tube, and the rear needle shaft extends from the rear end of the needle tube. The front and rear needle shafts can extend and retract axially to compress the spring. The front end of the signal terminal is bent to form a contact portion. The signal terminal is elastically electrically connected to the inner conductor of the pogo submodule through its contact portion. The outer conductor has an axially elastic tubular structure, coaxially sleeved on the outside of the inner conductor, and part of the outer conductor tube extends from the front end of the pogo mounting hole. The front needle shaft of the inner conductor is flush with or extends from the front end of the outer conductor. When the pogo module is compressed axially, the inner conductor and the outer conductor are compressed synchronously.

[0011] Preferably, the signal adapter mounting hole extends through the adapter plate along the Z direction, the rear end of the signal terminal is bent downward to form a signal support at the bottom, and a signal probe electrically connected to the signal adapter button is also installed in the signal adapter mounting hole. The signal adapter button and the signal probe are coaxially arranged, the signal adapter button extends from the upper end of the signal adapter mounting hole, and the signal support is inserted into the signal adapter mounting hole and makes elastic electrical contact with the signal adapter button.

[0012] Preferably, the return ground terminal has multiple downward-facing return ground feet at its rear end. The grounding mounting hole penetrates the adapter plate along the Z direction. A grounding probe electrically connected to the return ground terminal is also installed in the grounding mounting hole. The grounding button extends from the upper end of the grounding mounting hole. The grounding button and the grounding probe are coaxially arranged. The return ground feet of the return ground terminal of the signal wafer module are inserted into the corresponding mounting holes and are elastically electrically connected to the corresponding grounding button.

[0013] Preferably, the upper and lower sides of the ground plane of the pogo submodule extend backward to form connecting arms. When the pogo module is connected to the signal wafer module, the upper and lower connecting arms of the ground plane are fixed to the upper and lower sides of the signal wafer module by connecting screws or connecting pins, respectively.

[0014] Preferably, the grounding plate is further provided with a first button, which extends from the rear end of the grounding plate. The rear end of the first button of the pogo module abuts against the front end of the plastic part of the signal wafer module to achieve grounding connection. At the same time, the position where the grounding plate contacts the surface of the plastic part of the signal wafer module is also grounded.

[0015] Preferably, the pogo submodule has two mounting holes arranged vertically, each mounting hole containing an inner conductor and an outer conductor. Each return ground terminal has three rows of plastic parts extending in the X direction, arranged vertically as an upper plastic part, a middle plastic part, and a lower plastic part. Two adjacent signal wafers are spliced ​​together. The lower surfaces of the two spliced ​​upper plastic parts, the upper surfaces of the two spliced ​​middle plastic parts, and the opposing surfaces of the two return ground terminals form a rectangular upper electromagnetic shielding channel. The lower surfaces of the two spliced ​​middle plastic parts, the upper surfaces of the two spliced ​​lower plastic parts, and the opposing surfaces of the two return ground terminals form a rectangular lower electromagnetic shielding channel. The signal terminal module includes two signal terminals that pass through the upper electromagnetic shielding channel and the lower electromagnetic shielding channel, respectively.

[0016] By employing the above technical solutions, the beneficial effects of the present invention are as follows: The high-speed signal transmission electrical connector module of this invention features a pogo module with an inner and outer conductor arranged coaxially, forming a coaxial structure. The signal wafer module has an electromagnetic shielding channel outside the signal terminals, with the signal terminals positioned at the center of the channel, forming a quasi-coaxial structure. This structure ensures that during signal transmission, the electromagnetic field is confined between the inner conductor and the coaxial outer conductor, and between the signal terminals and the shielding channel. Simultaneously, the coaxial and quasi-coaxial structures maintain continuous and stable characteristic impedance, avoiding signal reflection caused by impedance abrupt changes, thus enabling high-speed signal transmission. The electromagnetic shielding channel of this invention is formed by assembling plastic parts; the main body is made of plastic material, with only a metal layer plated on the surface. The overall structure is simple, and the material and manufacturing costs are low. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the electrical connector module of this application.

[0018] Figure 2 This is a schematic diagram of the electrical connector module of this application.

[0019] Figure 3 This is a cross-sectional structural diagram of the electrical connector module of this application.

[0020] Figure 4 yes Figure 3 A magnified view of part A in the middle.

[0021] Figure 5 This is a schematic diagram of the structure of the pogo module in this application.

[0022] Figure 6 This is a cross-sectional structural diagram of the pogo module in this application.

[0023] Figure 7 This is a schematic diagram of the elastic needle of this application.

[0024] Figure 8 This is a schematic diagram of the structure of the outer conductor of the pogo module in this application.

[0025] Figure 9 This is a schematic diagram of the structure of the outer conductor of the pogo module in this application.

[0026] Figure 10 This is a cross-sectional structural diagram of the electrical connector module of this application.

[0027] Figure 11 yes Figure 10 A magnified view of part B in the middle section.

[0028] Figure 12 This is a schematic diagram of the signal wafer module of this application.

[0029] Figure 13 This is a partial structural diagram of the signal wafer module of this application.

[0030] Figure 14 This is a schematic diagram of the signal terminal structure of this application.

[0031] Figure 15 yes Figure 13 A magnified view of part C in the middle.

[0032] Figure 16 yes Figure 14 A magnified view of part D in the middle.

[0033] Figure 17 This is a partial structural schematic diagram of the electrical connector module of this application.

[0034] Figure 18 This is a schematic diagram of the adapter module of this application.

[0035] Figure 19 yes Figure 18 A magnified view of part E in the middle.

[0036] Figure 20 This is a partial enlarged view of the signal wafer module of this application.

[0037] The components are as follows: 1. Pogo module; 2. Signal wafer module; 3. Adapter module; 10. Pogo sub-module; 11. Inner conductor; 12. Dielectric body; 13. Outer conductor; 14. Ground plane; 15. First button; 16. Connecting part; 114. Rear pin shaft; 111. Front pin shaft; 112. Needle tube; 113. Spring; 131. Front end of outer conductor; 132. Rear end of outer conductor; 133. Spring area; 134. Protrusion; 135. Gap; 136. Raised area; 21. Bracket; 22. Signal terminal; 23. Plastic part; 24. Return ground terminal; 25. Electromagnetic shielding channel; 221. Signal foot; 222. Contact part of signal terminal; 241. Return ground foot; 31. Adapter board; 32. Signal adapter button; 33. Signal probe; 34. Ground probe. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that in the description of this invention, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0040] like Figure 1 and 2 As shown, a high-speed signal transmission electrical connector module includes a pogo module 1, a signal wafer module 2, and an adapter module 3.

[0041] The pogo module 1 comprises multiple pogo sub-modules 10 arranged and assembled along the Y-axis. For example... Figure 5-9 As shown, the pogo submodule 10 includes a ground plane 14 with at least one through-hole; an inner conductor 11, which is a flexible pin structure and is installed in the mounting hole; and an outer conductor 13, which is an axially elastic tubular structure and is installed in the pogo mounting hole, coaxially sleeved on the outside of the inner conductor 11, with a portion of the outer conductor 13 extending from the front end of the pogo mounting hole. The front end of the inner conductor 11 is flush with or extends from the front end of the outer conductor 13. When the pogo module 1 is compressed axially, the inner conductor 11 and the outer conductor 13 are compressed synchronously. Figure 6 As shown, a first button 15 is also provided on the ground plane 14. The first button 15 extends from the rear end of the ground plane 14 and is used for flexible electrical connection with the signal wafer module 2.

[0042] The axial direction of the mounting holes of the ground plane 14 is parallel to the compression direction of the pogo module 1. For example... Figure 7 As shown, the inner conductor 11 includes a needle tube 112, a spring 113 installed inside the needle tube 112, and a front needle shaft 111 and a rear needle shaft 114 respectively installed at both ends of the spring 113. The front needle shaft 111 extends from the front end of the needle tube 112, and the rear needle shaft 114 extends from the rear end of the needle tube 112. The front needle shaft 111 and the rear needle shaft 114 are axially extendable to compress the spring 113. The rear needle shaft 114 is used for elastic electrical connection with the signal wafer module 2.

[0043] The outer conductor 13 includes a front end and a rear end, with a spring 113 region between the front and rear ends. At least a portion of the front end of the outer conductor 13 extends from the front end of the mounting hole. The outer wall of the spring 113 region of the outer conductor 13 protrudes outward to form a protrusion 134, which makes electrical contact with the inner wall of the mounting hole to conduct current on the outer conductor 13 through the ground plane 14. The outer conductor 13 has an axially oriented gap 135 for releasing internal stress when the outer conductor 13 is axially compressed. A dielectric body 12 is provided on the inner wall of the front end of the outer conductor 13 for insulating the inner conductor 11 from the outer conductor 13.

[0044] The outer conductor 13 is formed by stamping and rolling a metal sheet. The stamping of the metal sheet forms the structure of the spring 113 area, and the gap 135 is formed at the mating of the opposite edges of the rolled metal sheet. The rear end of the outer conductor 13 is also provided with a protrusion 136. The inner wall of the mounting hole is provided with a limiting hole that mates with the protrusion 136. The protrusion 136 is inserted into the limiting hole to fix the outer conductor 13 in the mounting hole. The metal sheet is stamped in the spring 113 area to form multiple strip-shaped hollow grooves extending along its width direction. The hollow grooves are arranged sequentially along the length direction of the metal sheet, and the opening directions of two adjacent hollow grooves are alternately arranged. The opening of one hollow groove is located at the first side edge of the metal sheet, and the opening of the other hollow groove is located at the second side edge of the metal sheet. When the metal sheet is rolled into the outer conductor 13, the hollow grooves are bent along the metal sheet to form arc-shaped grooves along the circumference of the outer conductor 13. The first side edge and the second side edge of the metal sheet are connected to each other, and the gap 135 is formed at the connection.

[0045] In the pogo module 1 of this application, the outer conductor 13 and the inner conductor 11 can be compressed synchronously. During the compression process, the outer conductor 13 maintains a state of surrounding the inner conductor 11. The outer conductor 13 acts as a shielding layer, effectively confining the electromagnetic field between the inner and outer conductors, suppressing electromagnetic leakage, improving anti-interference capabilities, and making it more suitable for high-density, high-speed signal transmission scenarios. Because the outer conductor 13 and the inner conductor 11 are compressed synchronously, the characteristic impedance remains stable, avoiding impedance abrupt changes and reducing signal reflection, thereby enabling lower transmission energy consumption at high frequencies. Furthermore, the outer wall of the spring 113 region of the outer conductor 13 has a protrusion 134 (rivet point), which makes electrical contact with the inner wall of the mounting hole of the ground plane 14. Through this contact structure, the induced current on the spring 113 region of the outer conductor 13 is directly conducted to the ground plane 14, disrupting the conditions for electromagnetic resonance and thus eliminating the resonance spike on the attenuation curve.

[0046] like Figure 3-4 As shown in Figure 8-15, the signal wafer module 2 includes multiple return ground wafers arranged and spliced ​​along the Y direction, and a signal terminal module is provided between two adjacent return ground wafers.

[0047] The aforementioned return ground wafer includes a sheet-shaped return ground terminal 24, on which multiple rows of plastic portions 23 extending along the X direction are injection molded and arranged along the Z direction. The return ground terminal 24 is stamped, and the surface of the plastic portions 23 is electroplated with a metal material.

[0048] like Figure 20 As shown, in two adjacent return floor wafers, the plastic parts 23 on two opposite sides are matched and can be joined together.

[0049] After being assembled, the lower surface of the upper plastic part 23, the upper surface of the lower plastic part 23, and the return ground terminals 24 of the two adjacent return ground wafers enclose each other to form an electromagnetic shielding channel 25. Preferably, the cross-section of the electromagnetic shielding channel 25 is rectangular. The signal terminal 22 is located at the center of the electromagnetic shielding channel 25, forming a coaxial electromagnetic field constraint.

[0050] The signal terminal 22 module includes a signal terminal 22 and a bracket 21 injection molded on the signal terminal 22. The bracket 21 is sandwiched between two return ground wafers, and the signal terminal 22 passes through the electromagnetic shielding channel 25.

[0051] The front end of the signal terminal 22 is bent to form a contact portion 222 of the signal terminal 22, which is used to make an elastic electrical connection with the rear end pin shaft 114 of the inner conductor 11 of the front end of the pogo module 1.

[0052] The rear end of the signal terminal 22 is provided with a signal pin 221 for plugging into the adapter module 3.

[0053] The return ground terminal 24 has multiple return ground feet 241 at its rear end for plugging into the adapter module 3.

[0054] In the signal wafer module, the return ground terminal 24 is a metal frame, and the upper and lower walls of the shielding channel are made of plastic parts with an electroplated metal layer. The plastic is lightweight, which can reduce the weight of the module and the overall weight of the electrical connector module while ensuring the shielding effect.

[0055] In a preferred embodiment, the rear end of the signal terminal 22 is bent downward to form a signal support 221 at the bottom. The return ground support 241 is located at the bottom of the rear end of the return ground terminal 24.

[0056] like Figure 18-19As shown, the adapter module 3 of this application includes an adapter plate 31, on which a plurality of mounting holes are provided along the Z direction through the adapter plate 31, some of which are signal adapter mounting holes and others are grounding mounting holes.

[0057] A signal adapter button 32 and a signal probe 33 electrically connected to the signal adapter button 32 are installed in the signal adapter mounting hole. The signal adapter button 32 and the signal probe 33 are coaxially arranged. The signal adapter button 32 extends from the upper end of the mounting hole. The signal pins 221 of the signal terminals 22 of the signal wafer module 2 are inserted into the corresponding signal adapter mounting holes and are elastically electrically connected to the corresponding signal adapter button 32.

[0058] A grounding button and a grounding probe 34 electrically connected to the grounding button are installed in the grounding mounting hole. The grounding button and the grounding probe 34 are coaxially arranged. The return ground pin 241 of the return ground terminal 24 of the signal wafer module 2 is inserted into the corresponding mounting hole and is elastically electrically connected to the corresponding grounding button. The signal probe 33 and the grounding probe 34 are used for electrical connection to the pad on the PCB.

[0059] like Figure 3 As shown, the upper and lower sides of the ground plane 14 of the pogo submodule 10 extend backward to form connecting arms. When the pogo module 1 is connected to the signal wafer module 2, the upper and lower connecting arms of the ground plane 14 are fixed to the upper and lower sides of the signal wafer module 2 by connecting screws or connecting pins. At this time, the rear end pin shaft 114 of the inner conductor 11 of the pogo module 1 abuts against the contact part at the front end of the signal terminal 22 of the signal wafer module 2 to realize signal connection. The rear end of the first button 15 of the pogo module 1 abuts against the front end of the plastic part 23 of the signal wafer module 2 to realize grounding. At the same time, the contact point between the ground plane 14 and the plastic part 23 of the signal wafer module 2 can also realize grounding connection.

[0060] In a preferred embodiment, the pogo submodule 10 has two mounting holes arranged vertically, and each mounting hole is provided with an inner conductor 11 and an outer conductor 13.

[0061] Each return terminal 24 has three rows of plastic parts 23 extending in the X direction. The three rows of plastic parts 23 are arranged in the vertical direction and are respectively the upper plastic part 23, the middle plastic part 23 and the lower plastic part 23.

[0062] Two adjacent signal wafers are spliced ​​together. The lower surfaces of the two spliced ​​upper plastic parts 23, the upper surfaces of the two spliced ​​middle plastic parts 23, and the opposing surfaces of the two return ground terminals 24 form a rectangular upper electromagnetic shielding channel 25. The lower surfaces of the two spliced ​​middle plastic parts 23, the upper surfaces of the two spliced ​​lower plastic parts 23, and the opposing surfaces of the two return ground terminals 24 form a rectangular lower electromagnetic shielding channel 25. The signal terminal 22 module includes two signal terminals 22, which pass through the upper electromagnetic shielding channel 25 and the lower electromagnetic shielding channel 25 respectively.

[0063] The electrical connector assembly of this application features a pogo module 1 with a coaxial structure where the outer conductor fully surrounds the inner conductor. The signal wafer module forms a four-sided enclosed rectangular electromagnetic shielding channel through the assembly of adjacent return ground wafers. The adapter module also employs a coaxial adapter structure. Throughout the signal transmission path, the electromagnetic field is confined within the inner and outer conductors or the electromagnetic shielding channel, resulting in low radiation loss. The plastic portion of the signal wafer module is electroplated to create a large-area return current, increasing the return current area for high-frequency signals and reducing the equivalent AC resistance and loop inductance. Furthermore, the entire signal link of the electrical connector assembly is within a continuous, enclosed metallic shielding environment, preventing external electromagnetic interference from entering the signal path and preventing internal signals from leaking outwards. Crosstalk between adjacent channels is also minimal.

[0064] For ease of description, the coordinate system indicated in the accompanying drawings is used to define directions in this application: the X-axis direction is defined as the front-back direction, and the Z-axis direction is defined as the up-down direction.

[0065] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A high-speed signal transmission electrical connector module, characterized in that, It includes a pogo module (1), a signal wafer module (2), and an adapter module (3). The pogo module (1) includes multiple pogo sub-modules (10) spliced ​​along the Y direction. The pogo sub-module (10) includes a ground plane (14). The ground plane (14) has a pogo mounting hole. An inner conductor (11) and an outer conductor (13) are coaxially arranged in the pogo mounting hole. The signal wafer module (2) is located at the rear end of the pogo module (1). The signal wafer module (2) includes multiple signal terminals (22). The signal terminals (22) are provided with an electromagnetic shielding channel (25). The rear end of the inner conductor (11) is electrically connected to the front end of the signal terminals (22). The outer conductor (13) is electrically connected to the electromagnetic shielding layer of the electromagnetic shielding channel (25).

2. The electrical connector module according to claim 1, characterized in that, The adapter module (3) is located at the rear end of the signal wafer module (2). The adapter module (3) includes an adapter plate (31). The adapter plate (31) is provided with multiple signal adapter mounting holes and multiple ground mounting holes. A signal adapter button (32) is provided in the signal adapter mounting hole. The signal adapter button (32) is electrically connected to the signal terminal (22). A grounding button is provided in the ground mounting hole. The grounding button is electrically connected to the electromagnetic shielding layer of the electromagnetic shielding channel (25). The signal terminal (22) is located at the center of the electromagnetic shielding channel (25).

3. The electrical connector module according to claim 2, characterized in that, The signal wafer module (2) includes multiple return ground wafers arranged and spliced ​​along the Y direction, and a signal terminal module is provided between two adjacent return ground wafers. The return ground wafer includes a sheet-shaped return ground terminal (24), on which multiple rows of plastic portions (23) extending in the X direction are injection molded, and the multiple rows of plastic portions (23) are arranged in the Z direction. The surface of the plastic portions (23) is plated with a metal material layer, which is the electromagnetic shielding layer of the electromagnetic shielding channel (25). In two adjacent return ground wafers, the plastic parts (23) on opposite surfaces are matched and spliced ​​together. After splicing, the lower surface of the upper plastic part (23), the upper surface of the lower plastic part (23), and the opposite surfaces of the return ground terminals (24) of the two adjacent return ground wafers together form the electromagnetic shielding channel (25). The signal terminal module includes the signal terminal (22) and the bracket (21) injection molded on the signal terminal (22). The bracket (21) is sandwiched between the two return ground wafers, and the signal terminal (22) passes through the electromagnetic shielding channel (25).

4. The electrical connector module according to claim 3, characterized in that, The inner conductor (11) is an elastic needle structure, including a needle tube (112), a spring (113) installed inside the needle tube (112), and a front needle shaft (111) and a rear needle shaft (114) respectively installed at both ends of the spring (113). The front needle shaft (111) extends from the front end of the needle tube (112), and the rear needle shaft (114) extends from the rear end of the needle tube (112). The front needle shaft (111) and the rear needle shaft (114) can extend and retract axially to compress the spring (113). The front end of the signal terminal (22) is bent to form a contact portion 222. The signal terminal (22) is elastically electrically connected to the inner conductor (11) of the pogo submodule (10) through its contact portion. The outer conductor (13) has an axially elastic tubular structure and is coaxially sleeved on the outside of the inner conductor (11). Part of the outer conductor (13) extends out from the front end of the pogo mounting hole. The front end pin shaft (111) of the inner conductor (11) is flush with or extends out from the front end of the outer conductor (13). When the pogo module (1) is compressed axially, the inner conductor (11) and the outer conductor (13) are compressed synchronously.

5. The electrical connector module according to claim 4, characterized in that, The signal adapter mounting hole extends through the adapter plate (31) along the Z direction. The rear end of the signal terminal (22) is bent downward to form a signal support foot (221) at the bottom. A signal probe (33) electrically connected to the signal adapter button (32) is also installed in the signal adapter mounting hole. The signal adapter button (32) and the signal probe (33) are coaxially arranged. The signal adapter button (32) extends out from the upper end of the signal adapter mounting hole. The signal support foot (221) is inserted into the signal adapter mounting hole and makes elastic electrical contact with the signal adapter button (32).

6. The electrical connector module according to claim 5, characterized in that, The return ground terminal (24) has multiple downward-facing return ground supports (241) at its rear end, and the grounding mounting hole penetrates the adapter plate (31) along the Z direction. The grounding mounting hole is also equipped with a grounding probe (34) that is electrically connected to the return ground terminal (24). The grounding button extends from the upper end of the grounding mounting hole. The grounding button and the grounding probe (34) are coaxially arranged. The return ground support (241) of the return ground terminal (24) of the signal wafer module (2) is inserted into the corresponding mounting hole and is elastically electrically connected to the corresponding grounding button.

7. The electrical connector module according to claim 1, characterized in that, The ground plane (14) of the pogo submodule (10) extends backward on both sides to form connecting arms. When the pogo module (1) is connected to the signal wafer module (2), the upper and lower connecting arms of the ground plane (14) are fixed to the upper and lower sides of the signal wafer module (2) by connecting screws or connecting pins.

8. The electrical connector module according to claim 7, characterized in that, The grounding plate (14) is also provided with a first button (15), which extends from the rear end of the grounding plate (14). The rear end of the first button (15) of the pogo module (1) abuts against the front end of the plastic part (23) of the signal wafer module (2) to achieve grounding connection. At the same time, the grounding plate (14) and the plastic part (23) of the signal wafer module (2) are also grounded at the contact point.

9. The electrical connector module according to claim 8, characterized in that, The pogo submodule (10) has two mounting holes arranged vertically. Each mounting hole contains an inner conductor (11) and an outer conductor (13). Each return ground terminal (24) has three rows of plastic parts (23) extending in the X direction. The three rows of plastic parts (23) are arranged vertically and are respectively an upper plastic part (23), a middle plastic part (23), and a lower plastic part (23). Two adjacent signal wafers are spliced ​​together. The lower surfaces of the two spliced ​​upper plastic parts (23) and the spliced... The upper surfaces of the two middle plastic parts (23) and the opposing surfaces of the two return ground terminals (24) enclose to form a rectangular upper electromagnetic shielding channel (25). The lower surfaces of the two middle plastic parts (23) after being spliced ​​together, the upper surfaces of the two lower plastic parts (23) after being spliced ​​together, and the opposing surfaces of the two return ground terminals (24) enclose to form a rectangular lower electromagnetic shielding channel (25). The signal terminal module includes two signal terminals (22), which pass through the upper electromagnetic shielding channel (25) and the lower electromagnetic shielding channel (25) respectively.

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