Surface treatment method, circuit board processing method, system and apparatus therefor

Abstract

This application relates to a surface treatment method, a circuit board processing method, and a system and apparatus thereof. The surface treatment method, applied to a surface treatment apparatus, includes: obtaining a processing file for the circuit board to be processed, the processing file including target surface treatment area information; determining the initial processing position of the target surface treatment area based on the target surface treatment area information; adding protective material to the target surface treatment area from the initial processing position; and homogenizing the protective material in the target surface treatment area to form a surface protective film on the circuit board to be processed. The surface protective film provides stable protection for the circuit board to be processed and provides protective effect for subsequent processing of the circuit board.

Description

Technical Field

[0001] This application relates to the field of laser processing technology for printed circuit boards, and in particular to surface treatment methods, printed circuit board processing methods, systems and equipment thereof. Background Technology

[0002] With the development of laser processing technology for printed circuit boards (PCBs), the demand for precision and quality in laser processing is gradually increasing to adapt to the trend of PCB integration. Current laser processing operations are prone to causing carbonization damage on the PCB surface, and particles generated during laser processing can splatter and scratch the PCB surface, ultimately resulting in poor PCB production quality. Summary of the Invention

[0003] Therefore, it is necessary to provide a surface treatment method, a circuit board processing method, and a system and equipment to address the problems existing in the laser processing of circuit boards.

[0004] A surface treatment method, applied to a surface treatment device, the method comprising:

[0005] Obtain the processing file of the circuit board to be processed, which includes information on the target surface processing area;

[0006] The initial processing location of the target surface processing area is determined based on the target surface processing area information;

[0007] Add protective material to the target surface treatment area from the initial treatment location;

[0008] The protective material in the target surface treatment area is homogenized to form a surface protective film on the circuit board to be processed.

[0009] In one embodiment, determining the initial processing location based on the target surface processing region specifically includes:

[0010] Using an image sensor, the surface target points of the circuit board to be processed are acquired to locate the target surface processing area.

[0011] The initial processing location of the target surface processing area is determined based on the positioning and processing documents.

[0012] In one embodiment, the initial processing location is any location within the target surface processing region.

[0013] Adding protective material to the target surface treatment area from the initial treatment position, specifically including: adding protective material to the target surface treatment area from any position by spraying;

[0014] The protective material in the target surface treatment area is homogenized, specifically including:

[0015] Apply protective material to the target surface treatment area at a constant speed until the entire target surface treatment area is covered with protective material.

[0016] In one embodiment, when the target surface processing area is circular,

[0017] The initial processing location of the target surface processing region is determined based on the target surface processing region information, specifically including:

[0018] Determine the center of the circle as the initial processing position;

[0019] Add protective material to the target surface treatment area from the initial treatment location, specifically including:

[0020] Add protective material from the center of the circle;

[0021] The protective material in the target surface treatment area is homogenized, specifically including:

[0022] The circuit board to be processed is rotated at high speed around the center of the target surface treatment area until the entire target surface treatment area is covered with protective material.

[0023] In one embodiment, the protective material is a liquid.

[0024] In one embodiment, a surface protective film is formed on the circuit board to be processed, specifically including:

[0025] The protective material is dried to form a surface protective film.

[0026] In one embodiment, the thickness of the surface protective film is between 1µm and 300µm.

[0027] A circuit board processing method, applied to circuit board processing equipment, the method includes:

[0028] Obtain the circuit board to be processed. The circuit board to be processed is pre-treated according to any of the above surface treatment methods to form a processing area with a surface protective film.

[0029] Laser processing is performed on the areas of the circuit board to be processed.

[0030] A circuit board processing method is applied to a circuit board processing system, the circuit board processing system including surface treatment equipment and circuit board processing equipment, the method comprising:

[0031] Obtain the circuit board to be processed;

[0032] The surface treatment equipment is used to perform surface treatment on the circuit board to be processed according to the above surface treatment method to obtain the processing area with a surface protective film;

[0033] The circuit board processing equipment is used to perform laser processing on the area to be processed of the circuit board according to the above-mentioned circuit board processing method.

[0034] A surface treatment device includes: a control component, a circuit board fixing component, and a surface treatment actuator.

[0035] Circuit board fixing components are used to fix the circuit board to be processed;

[0036] The control component is used to acquire the processing file of the circuit board to be processed and determine the initial processing position based on the target surface processing area information of the processing file;

[0037] The surface treatment actuator is used to add protective material to the circuit board to be processed from the initial processing position and perform homogenization treatment to form a surface protective film on the circuit board to be processed.

[0038] In one embodiment, the surface processing apparatus further includes an image sensor for acquiring surface target points of the circuit board to be processed;

[0039] The control component is also used to locate the target surface treatment area based on the surface target points, and to determine the initial position of the target surface treatment area based on the positioning and processing documents.

[0040] In one embodiment, the initial processing location is any location within the target surface processing region.

[0041] The surface treatment actuator is specifically used to add protective material to the target surface treatment area from any position by spraying, and to add protective material to the target surface treatment area at a constant speed until the target surface treatment area is completely covered with protective material.

[0042] In one embodiment, when the target surface processing area is circular, the control component is used to determine the center of the circle as the initial processing position;

[0043] The surface treatment actuator is specifically used to add protective material from the center of the circle and make the circuit board to be processed rotate at high speed around the center of the target surface treatment area until the target surface treatment area is completely covered with protective material.

[0044] In one embodiment, when the protective material is liquid, the surface treatment apparatus further includes a drying mechanism for drying the protective material to form a surface protective film.

[0045] A circuit board processing device is used to perform laser processing on a circuit board to be processed, wherein the circuit board to be processed is pre-treated according to the above-mentioned surface treatment method.

[0046] A circuit board processing system includes the aforementioned surface treatment equipment and the aforementioned circuit board processing equipment.

[0047] The aforementioned surface treatment method, circuit board processing method, system, and equipment, wherein the surface treatment method includes: firstly, obtaining a processing file of the circuit board to be processed, the processing file including target surface treatment area information; then, determining the initial processing position of the target surface treatment area based on the target surface treatment area information; adding protective material to the target surface treatment area from the initial processing position; and homogenizing the protective material in the target surface treatment area to form a surface protective film on the circuit board to be processed. By determining the target surface treatment area and homogenizing the protective material in the target surface treatment area, a surface protective film is formed on the circuit board to be processed, thereby maintaining a uniform film thickness and providing stable protection for the circuit board to be processed, and providing a protective effect for subsequent processing of the circuit board. Attached Figure Description

[0048] Figure 1 This is a flowchart illustrating the surface processing method provided in an embodiment of this application.

[0049] Figure 2 This is a flowchart illustrating the circuit board fabrication method provided in an embodiment of this application. Detailed Implementation

[0050] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0051] See Figure 1 As shown, Figure 1 This is a flowchart illustrating a surface processing method provided in an embodiment of this application. The surface processing method shown is applied to a surface processing device and includes:

[0052] Step S1: Obtain the processing file of the circuit board to be processed. The processing file includes information on the target surface processing area.

[0053] Step S2: Determine the initial processing position of the target surface processing area based on the target surface processing area information.

[0054] Step S3: Add protective material to the target surface treatment area from the initial treatment location.

[0055] Step S4: Homogenize the protective material in the target surface treatment area to form a surface protective film on the circuit board to be processed.

[0056] Specifically, the aforementioned circuit board to be processed refers to a board used to carry electrical connections between electronic components. In actual selection, the circuit board to be processed can be configured as at least one of the following: flexible circuit board, rigid circuit board, rigid-flex board, irregular rigid circuit board, or irregular rigid-flex board.

[0057] The aforementioned processing documents refer to documents containing circuit board design data. These documents include information about the target surface processing area, and the surface processing equipment determines the initial processing position based on this information.

[0058] The target surface treatment area information includes: the initial treatment location, the corresponding coordinates of the surface treatment area, the shape of the surface treatment area (e.g., rectangular, circular, or irregular shape), the dimensions of the surface treatment area (length, width, radius, etc.), and the ideal location of the surface treatment area in the design drawings. Additionally, the target surface treatment area information also covers the relative positional relationship (e.g., distance, angle) of the target surface treatment area relative to the surface target point. When the surface treatment equipment is used, protective material will be added starting from the initial treatment location.

[0059] The target surface processing area is located on the circuit board to be processed. The surface processing area can be a part of the circuit board to be processed or the entire area of ​​the circuit board to be processed.

[0060] The surface treatment equipment begins by adding protective material from the initial treatment location. This can be done through methods such as spraying or coating. After the protective material is added, the equipment homogenizes it using a reciprocating linear process to form a protective film on the surface of the circuit board to be processed. The thickness of this protective film must be uniform to provide stable protection for the circuit board and to ensure effective protection during subsequent processing. For example, during subsequent laser processing of the circuit board, the laser beam passes over the protective film, which uniformly absorbs excess heat and encapsulates particles generated by the laser beam, preventing them from splashing onto the board surface and causing scratches or other physical damage.

[0061] In some embodiments of this application, the surface treatment device may be configured as an additive layer device. The additive layer device covers the area to be processed with protective material by spraying. The additive layer device can use the protective material as ink and, in conjunction with its own ink supply system, spray the protective material onto the area to be processed.

[0062] The layer-addition equipment incorporating the above-mentioned spraying method can be conventional equipment in the field of 3D printing, such as fused deposition modeling (FDM) equipment and stereolithography (SLA) equipment, or inkjet printer equipment. The above-mentioned layer-addition equipment refers to the configuration of conventional equipment in the prior art.

[0063] When using protective materials as ink in surface treatment equipment, it is necessary to ensure that the viscosity of the protective material is moderate. If the viscosity is too high, the protective material will not flow out of the output device such as the nozzle or printhead of the surface treatment equipment, resulting in failure to print normally, or the printed lines will be discontinuous and uneven.

[0064] If the viscosity of the protective material is too low, it will flow and spread, making it difficult to form a precise pattern and a uniform protective film. Generally speaking, protective materials with a viscosity of 30-50 mPa·s (millipascals per second) are more suitable. These materials can be applied by spraying, coating, or other methods and are also suitable for printing on surface treatment equipment.

[0065] Furthermore, the protective material should possess good thixotropic properties, meaning its viscosity decreases during stirring or printing to facilitate flow and printing, while its viscosity rapidly recovers after standing to maintain the shape and stability of the printed pattern. This ensures that the protective material liquid can flow smoothly in the ink supply system of the surface treatment equipment, and can quickly set after being printed onto the circuit board surface, forming a clear and stable surface protective film.

[0066] Using a surface treatment device to apply protective material by spraying allows for precise application of the material to the area to be processed, according to pre-set programs and parameters. In some embodiments, the surface treatment device can, like an inkjet printer, progressively and precisely lay the protective material onto the surface as needed. This precision ensures that the coverage area of ​​the protective material perfectly matches the area to be processed, avoiding waste of material in areas that do not require processing. It also ensures that the amount of protective material is within an appropriate range, which is beneficial for the subsequent formation of a surface protective film of uniform thickness.

[0067] Surface coating equipment typically has a relatively stable output mechanism. Applying the protective material to the circuit board surface at a uniform flow rate and speed is crucial for forming a surface protective film of uniform thickness. The printing process of surface coating equipment is relatively smooth, requiring less physical manipulation of the circuit board, such as smearing or dragging, unlike some other coating methods. This ensures that the circuit board remains firmly fixed during the protective material application process.

[0068] The aforementioned surface treatment equipment can operate efficiently at a set speed and mode, completing the protective material application task much faster compared to some manual operations or complex mechanical coating methods. Furthermore, its ability to ensure the precise distribution of the protective material and the uniformity of the surface protective film also helps improve the quality of subsequent laser processing.

[0069] In some embodiments of this application, step S2, determining the initial processing position of the target surface processing region based on the target surface processing region information, specifically includes:

[0070] Image sensors are used to acquire surface target points on the circuit board to be processed, thereby locating the target surface processing area.

[0071] The image sensor mentioned above needs to be selected with appropriate resolution and field of view based on factors such as the size and accuracy requirements of the circuit board to be processed. For example, if the circuit board is small but requires extremely high positioning accuracy, a high-resolution industrial-grade CCD (charge-coupled device) image sensor can be selected. Then, to ensure that the image sensor can capture a complete and clear image of the surface of the circuit board to be processed, it is generally fixed on an external robotic arm or a specific scanning bracket, and calibration work must be carried out to ensure the accuracy of its shooting angle and position.

[0072] The processing file contains information about the target surface processing area, including coordinates and shape. In practice, easily identifiable markers with distinct features are pre-set on the circuit board surface as target points. These target points can be specially designed reflective dots, small dots with colors significantly different from the circuit board background, or patterns of specific shapes. After the image sensor acquires an image of the circuit board surface, image processing algorithms, such as edge detection and feature matching algorithms, are used to identify these pre-defined surface target points. Then, based on the relative positional relationship between the target points and the target surface processing area, the specific location of the target surface processing area on the actual circuit board is determined, completing the localization. The aforementioned relative positional relationship is either specified in the processing file or determined through prior calibration.

[0073] The aforementioned image sensor has high resolution and accurate imaging capabilities. By identifying specific surface target points, it can more accurately determine the initial processing position of the target surface processing area compared to traditional manual positioning or rough mechanical alignment methods.

[0074] For example, when manufacturing high-precision circuit boards, positioning errors can be controlled within a very small range, ensuring that subsequent processes such as adding protective materials can accurately act on the target area, thereby improving the final processing quality of the circuit board.

[0075] The circuit board to be processed can be set as at least one of the following: flexible circuit board, rigid circuit board, rigid-flex board, irregular rigid circuit board, or irregular rigid-flex board. As long as the target points on its surface are set reasonably and the image sensor parameters are adapted, the target surface processing area can be accurately located.

[0076] Moreover, for circuit boards of different designs and sizes, positioning can be quickly achieved simply by adjusting the target points and area relationships in the processing file. This eliminates the need for large-scale modifications to the positioning structure of the entire surface processing equipment, thus improving the equipment's adaptability and flexibility for various circuit board processing tasks.

[0077] By utilizing image sensors to automatically acquire and identify target points for localization, the entire process requires minimal human intervention and can be seamlessly integrated into automated circuit board surface processing workflows. This improves overall production efficiency and facilitates high-efficiency mass production of circuit boards.

[0078] The location information of the target surface processing area acquired by the image sensor is processed. This location information includes the coordinates of the target point on the actual circuit board and the relative position of the target surface processing area with respect to the target point (e.g., distance, angle). Simultaneously, detailed design information of the target surface processing area is extracted from the processing file. The processing file contains circuit board design data, including the shape (e.g., rectangular, circular, or irregular shape), dimensions (length, width, radius, etc.), and ideal location of the target surface processing area in the design drawings.

[0079] In some embodiments of this application, if the target surface treatment area is rectangular, the initial treatment position can be a vertex of the rectangle. The process of obtaining the initial treatment position needs to take into account the process requirements for adding protective materials to the equipment. For example, for some processes that require adding protective materials from the edge, the initial treatment position should be a suitable point on the edge of the target surface treatment area.

[0080] By integrating positioning and processing file information to determine the initial processing location, the starting position for adding protective material to the target surface treatment area can be more accurately determined. For example, in the production of high-density rigid circuit boards, a precise initial processing location ensures that the protective material evenly covers the circuit areas that need protection, preventing the material from covering areas that do not require treatment or omitting parts that need treatment, thereby improving the quality of the circuit board surface treatment.

[0081] Different circuit board surface treatment processes have different requirements for the initial treatment position. The above method can determine the most suitable initial treatment position based on the specific processing documents and actual positioning conditions.

[0082] For some special rigid-soft composite boards, the material properties of different areas vary greatly. This step can determine the initial treatment location that meets the specific process requirements. For example, protective material can be added starting from the junction of the soft and hard areas to achieve better protection and enhance process adaptability.

[0083] By combining data from processing documents with actual location data, more comprehensive data support is provided for the production process, which is beneficial for subsequent analysis and optimization. For example, if a deviation in the addition of protective materials is found during production, the process of determining the initial processing position can be traced back to analyze whether the problem lies with the location data or the interpretation of the processing documents, thereby enabling targeted improvements to the production process and equipment parameters.

[0084] In some embodiments of this application, the initial treatment location is any location within the target surface treatment area. Specifically, step S3, adding protective material to the target surface treatment area from the initial treatment location, includes:

[0085] Protective material is applied to the target surface treatment area from any location by spraying.

[0086] In some embodiments of this application, the surface treatment equipment is configured as an add-on layer device, which utilizes a spraying process to add protective material at any location within the target surface treatment area. The control system, through motor drive and a precision mechanical transmission structure, can accurately control the position of the printhead on the circuit board to be processed. For target surface treatment areas of different sizes and thicknesses, the amount of ink ejected from the printhead can be precisely controlled by adjusting the pressure and flow regulating valves in the ink supply system. For example, when a larger target surface treatment area needs to be sprayed, the ink flow rate is increased; while for a smaller target surface treatment area, the ink flow rate is decreased.

[0087] Regarding the implementation of adding protective material at any location: the control system of the layering equipment, with the help of motor drive and precision mechanical transmission structure, can accurately control the position of the nozzle on the circuit board to be processed. This means that the protective material can be accurately applied to any designated location in the target surface treatment area, avoiding waste of protective material in areas that do not need processing. At the same time, it can also ensure that the amount of protective material is within an appropriate range, which is conducive to the subsequent formation of a surface protective film of uniform thickness, thus improving the accuracy and effectiveness of the addition of protective material.

[0088] Because protective material can be added at any location, it can be effectively applied to circuit boards of different designs and materials. By selecting the appropriate starting position and adjusting the parameters according to their characteristics, effective surface protection can be achieved, helping to improve the stability of the quality of different types of circuit board products. For different circuit board processing tasks, there is no need to make large-scale modifications to the positioning structure of the entire surface treatment equipment to adapt to different starting position requirements; protective material can be added from any position by flexibly controlling the nozzle position.

[0089] Uniformly applied protective material is a prerequisite for forming a surface protective film of uniform thickness. Spraying the protective material from any point on the target surface treatment area offers great flexibility. This method is particularly suitable for irregularly shaped circuit board surface treatment areas, allowing for better adaptation to their shape characteristics.

[0090] For example, for rigid-flex circuit boards with protruding or recessed areas, it is easy to start spraying from the appropriate position to ensure that the protective material covers these special areas.

[0091] For step S4, homogenizing the protective material in the target surface treatment area specifically includes:

[0092] Apply protective material to the target surface treatment area at a constant speed until the entire target surface treatment area is covered with protective material.

[0093] Based on the shape and size of the target surface processing area, plan the travel path during homogenization processing.

[0094] If the target surface treatment area is rectangular, a linear back-and-forth scanning method can be used, starting from the initial treatment position and moving at a constant speed along the long or short side of the rectangle to ensure uniform distribution of the protective material. For circular or irregularly shaped target surface treatment areas, a complex travel path such as a spiral or zigzag pattern may be required to ensure complete coverage.

[0095] The motion control system of the surface treatment equipment precisely controls its travel speed. Through pre-programming or sensor feedback adjustment, the equipment travels at a predetermined constant speed over the target surface treatment area.

[0096] For example, sensors such as encoders can be used to monitor the moving speed of the surface treatment equipment in real time, and adjustments can be made promptly when speed deviations occur to ensure uniform movement.

[0097] During mass production, the uniformity of product quality is ensured because the target surface treatment area of ​​each circuit board is covered with protective material.

[0098] In some embodiments of this application, when the target surface processing area is circular, the initial processing position of the target surface processing area is determined based on the target surface processing area information, specifically including:

[0099] The center of the circle is determined as the initial processing position.

[0100] For step S3, adding protective material to the target surface treatment area from the initial treatment location specifically includes:

[0101] Add protective material from the center of the circle.

[0102] For step S4, homogenizing the protective material in the target surface treatment area specifically includes:

[0103] The circuit board to be processed is rotated at high speed around the center of the target surface treatment area until the entire target surface treatment area is covered with protective material.

[0104] First, appropriate surface treatment equipment is required, such as high-precision nozzles or drip devices, which must be precisely positioned at the center of the circular target surface treatment area. This can be achieved through the mechanical motion system of the surface treatment equipment, using the coordinate information obtained when determining the center, and employing methods such as motor drive or lead screw transmission to accurately move and fix the surface treatment equipment at the center.

[0105] Based on the characteristics of the protective material (such as viscosity and flowability) and the required thickness of the protective layer, the parameters of the surface treatment equipment are finely adjusted. For example, if it is a spraying method, the spraying pressure, flow rate, and atomization degree must be adjusted to ensure that the protective material can be stably and evenly sprayed or dripped outward from the center.

[0106] During the process of adding protective material, the surface treatment equipment's control system operates according to preset parameters such as the amount and time of addition. For example, for a specific amount of protective material required, the total amount added can be precisely controlled based on the material's flow rate and the set addition time, ensuring that sufficient and appropriate protective material diffuses outwards from the center.

[0107] At the same time, it is necessary to combine sensors for real-time monitoring, such as setting a flow sensor near the center to detect the actual outflow of protective material and feed it back to the control system so that the addition parameters can be fine-tuned in a timely manner to maintain a stable addition state.

[0108] A reliable rotary drive device is equipped on the work platform where the circuit board is located. This typically uses a high-precision motor as the power source, connected to the support structure of the circuit board being processed via belt drive, gear drive, or direct drive. This ensures that the circuit board can rotate stably and at high speed around the center of the target surface treatment area. It is important to note that the rotary device must be precisely installed and adjusted to ensure that the rotation axis of the circuit board is completely aligned with the center of the circular target surface treatment area, avoiding uneven distribution of the protective material due to eccentric rotation. This may require repeated calibration and adjustment using high-precision calibration tools and instruments, such as laser calibrators.

[0109] The rotation speed and rotation time of the circuit board are set appropriately based on the size of the circular area, the properties of the protective material, and the desired homogenization effect. In some embodiments, larger circular areas or protective materials with higher viscosity may require higher rotation speeds and longer rotation times to ensure that the protective material can be fully and uniformly distributed in the circumferential direction.

[0110] During rotation, sensors (such as speed sensors and vision sensors) are used to monitor the rotation status in real time. The speed sensor monitors the actual rotation speed and compares it with the preset speed. If there is a deviation, it is corrected in time through the motor speed control system. The vision sensor can observe the distribution of the protective material during rotation from the side to determine whether the requirement of full and uniform coverage is met. If local unevenness or other problems are found, the rotation time can be extended or other relevant parameters can be adjusted.

[0111] Adding protective material at the center and achieving uniformity through high-speed rotation fully utilizes the geometric characteristics of a circle. During rotation, the protective material, under the influence of centrifugal force, spreads evenly outward from the center, ensuring a highly consistent distribution of thickness and density across the entire circular surface treatment area. This uniform protective material coverage is crucial for protecting the performance of circuit boards, effectively preventing external moisture and dust from corroding the surface circuitry, thus improving the reliability and lifespan of the circuit board.

[0112] Compared to other methods of uniformly applying protective materials, the rotation method is more efficient. It eliminates the need for cumbersome control of the application device's movement in different positions and directions; simply apply material stably from the center and rotate the circuit board. This greatly simplifies the homogenization process, reduces processing time, and significantly improves production efficiency and lowers production costs, especially in mass production of circuit boards.

[0113] In some embodiments of this application, the protective material is a liquid. Liquid protective materials are well adaptable to the surface treatment areas of circuit boards of different shapes and materials. Due to the fluidity of liquids, liquid protective materials can adhere well to the surface of irregularly shaped rigid circuit boards, flexible circuit boards, or rigid-flex boards with a certain curvature.

[0114] For example, when handling flexible circuit boards with curved sections, the liquid protective material can flow along the curved surface, providing comprehensive protection. By precisely controlling parameters such as the flow rate and addition time of the liquid protective material, the thickness of the protective material on the surface can be controlled relatively accurately. In applications where the thickness of the protective material for circuit boards is critical, such as circuit boards in high-precision electronic devices, precise thickness control ensures effective protection without compromising the circuit board's performance, such as signal transmission, due to excessive thickness of the protective material.

[0115] Liquid protective materials can fill tiny pores and depressions on the surface of circuit boards. During the manufacturing process, circuit board surfaces may have minor imperfections, such as pinholes or scratches. Liquid protective materials can flow into these areas, filling and protecting them, thereby improving the overall quality and protective performance of the circuit board.

[0116] In some embodiments of this application, the protective material can be ejected from the printhead of the layer-adding device. A protective material suitable for inkjet printing is selected, whose viscosity, surface tension, drying characteristics, etc., must meet the requirements of the printhead and the needs of the printing process. The ejection speed of the protective material must be matched with the travel speed of the printhead. When the printhead moves over the target surface treatment area, it must be ensured that the protective material can uniformly cover the surface.

[0117] Specific protective materials can include photoresist, silicone protective liquid, and polyimide protective liquid.

[0118] In some embodiments of this application, step S4, forming a surface protective film on the circuit board to be processed, specifically includes:

[0119] The protective material is dried to form a surface protective film.

[0120] Drying processes allow protective materials to cure evenly, forming a smooth protective film. Drying methods can include natural drying, heat drying, infrared drying, and vacuum drying.

[0121] The drying process can be carried out using the built-in drying equipment of the layering device, or it can be carried out using an external independent drying device. After drying, the protective material will be uniformly cured to form a surface protective film.

[0122] In some embodiments of this application, the thickness of the surface protective film is between 1µm and 300µm (micrometers). This range of surface protective film provides optimal protection for the circuit board in certain situations. For example, in the case of laser processing of the circuit board, the aforementioned thickness range of the surface protective film can provide stable protection to ensure the consistency of the laser processing linewidth. If the surface protective film is too thin, it may not guarantee a sufficiently uniform protective effect, thus affecting the laser processing linewidth; while if the surface protective film is too thick, it may interfere with the effective transfer of laser energy. Within the aforementioned range, uniformity can be maintained well, ensuring the stability of the laser processing linewidth.

[0123] In some embodiments of this application, a circuit board processing method is applied to circuit board processing equipment, and the method includes:

[0124] Obtain the circuit board to be processed. The circuit board to be processed is pre-treated according to any of the above surface treatment methods to form a processing area with a surface protective film.

[0125] Laser processing is performed on the areas of the circuit board to be processed.

[0126] During laser processing, any area on the surface of the circuit board to be processed can be selected as the processing area. After the processing area is selected, a protective material is applied to its surface, forming a protective film. The protective film has a uniform thickness. Once the protective film is formed, laser processing is performed on the area covered by the protective film. The uniformity of the protective film ensures the consistency of the laser processing linewidth. Particles generated by the laser beam on the circuit board are encapsulated by the protective film, preventing particle deposition on the circuit board surface and thus avoiding scratches. Furthermore, the encapsulated particles will not splatter, preventing them from obstructing or affecting the laser beam, thereby improving the quality of the laser processing operation.

[0127] Meanwhile, excess heat generated during laser processing is absorbed by the protective film, and the circuit board being processed cools down rapidly, reducing the heat-affected zone and lowering the maximum temperature, thereby minimizing the impact of deformation and overheating on the protective film. When processing circuit boards covered with a protective film, circuit board processing equipment with higher laser power and faster cutting speeds can be used to improve cutting efficiency.

[0128] See the attached instruction manual. Figure 2 , Figure 2 This is a flowchart illustrating a circuit board fabrication method provided in an embodiment of this application. The circuit board fabrication method shown is applied to a circuit board fabrication system, which includes surface treatment equipment and circuit board fabrication equipment. The method includes:

[0129] Step S101: Obtain the circuit board to be processed.

[0130] Step S102: Apply a surface treatment device to perform surface treatment on the circuit board to be processed according to any of the above surface treatment methods to obtain the area to be processed with a surface protective film.

[0131] Step S103: Apply the circuit board processing equipment to perform laser processing on the area to be processed of the circuit board according to the above-described circuit board processing method.

[0132] The main control unit (such as an industrial computer) in the PCB processing system acquires relevant data about the PCB to be processed, including its model, dimensions, and required processing parameters. This data is transmitted to the surface treatment equipment to determine the target surface treatment area (e.g., identifying specific areas requiring protection based on the PCB design data), and then the PCB is processed according to the previous surface treatment methods (e.g., determining the initial treatment location, adding protective materials, and homogenizing to form a protective film). Simultaneously, this data is also transmitted to the PCB processing equipment to plan subsequent processing paths and parameter settings.

[0133] After the surface treatment equipment completes the surface treatment of the circuit board to be processed, the circuit board with the protective film is accurately transferred to the processing area of ​​the circuit board processing equipment through an automated transfer device. This ensures that the circuit board does not shift or deviate during the transfer between the two devices, thus guaranteeing the accuracy of the processing position.

[0134] The circuit board processing equipment can be configured as laser processing equipment, as well as other conventional circuit board processing equipment.

[0135] In some embodiments of this application, the laser processing equipment sets parameters such as laser wavelength, power, pulse frequency, and scanning speed based on circuit board data obtained from the main control unit and pre-set processing rules. For example, appropriate combinations of laser parameters are selected for circuit boards of different materials (such as rigid circuit boards, flexible circuit boards, or rigid-flex boards) and different processing requirements (such as cutting, drilling, etching, etc.).

[0136] Once the area of ​​the circuit board to be processed enters the processing range of the laser processing equipment, the laser emitter head processes the circuit board according to the preset processing path. During processing, the laser processing equipment monitors the interaction between the laser and the circuit board in real time through optical sensors. For example, it determines whether the processing depth and accuracy meet the requirements by detecting changes in the intensity and wavelength of the reflected light. This monitoring data is fed back to the equipment's control system so that the laser parameters can be adjusted in real time to ensure the stability of processing quality.

[0137] The pre-formed protective film plays a crucial protective role during laser processing. When the laser irradiates the area of ​​the circuit board to be processed, the protective film absorbs a portion of the laser energy, reducing the direct impact and thermal damage to the underlying material of the circuit board. For example, for some temperature-sensitive flexible circuit board materials, the protective film can effectively reduce the temperature rise during laser processing, preventing problems such as deformation and burning, thereby ensuring that the electrical and mechanical properties of the circuit board are not compromised.

[0138] The protective film also prevents debris and slag generated during laser processing from splashing back onto the circuit board surface, thus avoiding these impurities from embedding into the circuit board material and affecting its quality and reliability. For example, when laser-cutting circuit boards, the protective film can prevent tiny metal particles generated during cutting from adhering to the cutting edge, ensuring the flatness and smoothness of the cut surface.

[0139] After laser processing, the protective film can be easily removed from the circuit board surface, facilitating subsequent processing steps such as cleaning and assembly. For example, some protective film materials soluble in specific solvents can be quickly removed after laser processing by immersing in the corresponding solvent without causing any residue or damage to the circuit board surface, thus improving the overall efficiency and quality of circuit board processing.

[0140] Because surface treatment equipment and laser processing equipment can work precisely together, and the protective film on the surface effectively protects the circuit board during laser processing, reducing problems such as thermal deformation and material damage, the processing accuracy of the circuit board is significantly improved. For example, when micro-machining high-precision multilayer circuit boards, the processing depth and width of the laser can be precisely controlled, ensuring the reliability of the connections between each layer of circuits and the stability of electrical performance, thus improving the quality of the finished circuit board.

[0141] This method, which combines surface treatment and laser processing, is applicable to various types of circuit boards and diverse processing needs. By flexibly adjusting the parameters of surface treatment and laser processing, different processing effects can be achieved. For example, for some specially designed circuit boards, such as those with irregular shapes or high-precision microstructures, the combination of precise surface treatment and laser processing can achieve the processing of complex shapes and meet high-precision manufacturing requirements, providing technical support for circuit board design innovation.

[0142] A surface treatment device includes: a control component, a circuit board fixing component, and a surface treatment actuator.

[0143] The circuit board fixing assembly is used to fix the circuit board to be processed; the control assembly is used to acquire the processing file of the circuit board to be processed and determine the initial processing position according to the target surface processing area information of the processing file. The surface processing actuator is used to add protective material to the circuit board to be processed from the initial processing position and perform homogenization treatment to form a surface protective film of the circuit board to be processed.

[0144] The control component can use an industrial computer or a programmable logic controller (PLC) as the core control unit. Dedicated control software is installed, which should have file parsing capabilities to read information about the target surface treatment area from the processing file, including the area's shape, size, and initial processing position. First, the processing file of the circuit board to be processed is imported into the control component's storage unit via a data interface. Then, the control software is started, automatically parsing the processing file, extracting the target surface treatment area information, and performing internal data processing, such as converting coordinate data into control parameters for actual equipment operation. Based on these parameters, the control component sends instructions to the surface treatment actuator, including activating the protective material adding device, setting the initial position, and planning the motion path.

[0145] The circuit board fixing assembly can be implemented using mechanical clamps or a vacuum adsorption platform. Mechanical clamps are suitable for rigid circuit boards, while vacuum adsorption platforms are suitable for flexible circuit boards.

[0146] The surface treatment actuator can consist of a nozzle, a liquid supply system, and related drive devices. Upon receiving a start signal, the equipment's control system sends instructions to these components, activating the liquid supply pump to deliver the protective liquid to the nozzle, and simultaneously driving the nozzle to its initial position or ready state. For example, the liquid supply pump starts working, drawing the protective liquid from the storage container and delivering it to the nozzle through a pipeline. The nozzle's valve opens, preparing to spray the protective liquid, and the nozzle's positioning device moves the nozzle to the starting spray point above the circuit board.

[0147] In actual use, the control component receives the spraying start signal and the processing document; starts the processing document according to the spraying start signal; determines the initial processing position according to the processing document; and adjusts the surface processing actuator according to the initial processing position.

[0148] The processing file of the circuit board to be processed is imported into the control component via a suitable data transmission method (such as USB interface, Ethernet connection, etc.). The surface treatment equipment is initialized, including powering on the circuit board fixing assembly and the control system to ensure it is operational. Based on the type of circuit board to be processed, a suitable fixing method is selected to mount the circuit board onto the circuit board fixing assembly. The software in the control component parses the imported processing file, extracting information about the target surface treatment area, especially relevant data such as coordinate values ​​for the initial treatment position. The determined initial treatment position data is transmitted to the surface treatment actuator, preparing it to begin adding protective material from that position. According to the instructions sent by the control component, the surface treatment actuator moves the nozzle to the initial treatment position and then activates the protective material adding device, beginning the addition of protective material from the initial treatment position to the target surface treatment area. Homogenization is performed during the addition of the protective material. After the addition and homogenization are completed, depending on the characteristics of the protective material, drying or other curing operations may be required to form a stable surface protective film.

[0149] In actual processing, a suitable fixing method must be adopted according to the type and size of the circuit board to be processed. For rigid circuit boards, mechanical clamps can be used to fix them by clamping the edges of the circuit board. The clamping force of the clamps should be moderate, ensuring that the circuit board does not shift during processing without damaging it. For flexible circuit boards, vacuum adsorption may be required. Multiple tiny vacuum adsorption holes are set on the fixing platform. When the circuit board is placed on the platform, a vacuum is drawn to make the circuit board fit tightly against the platform surface, preventing it from curling or moving during processing.

[0150] The control components quickly and accurately acquire and process processing file information. After determining the initial processing position, the surface processing actuator can respond rapidly and add and homogenize protective material, reducing manual operation and adjustment time. In mass production of circuit boards, this significantly shortens the surface processing time for each board, increasing the overall production line capacity.

[0151] In some embodiments of this application, the surface treatment device is configured as an add-on device. The surface treatment actuator of the add-on device mainly includes a nozzle, a liquid supply system, and related drive devices. Upon receiving a start signal from the control component, the control system of the add-on device sends an instruction to the surface treatment actuator. The protective liquid is drawn from the storage container and transported to the nozzle through a pipeline. Subsequently, the valve of the nozzle is opened to prepare for spraying the protective liquid.

[0152] For the aforementioned printheads, a suitable printhead must be selected based on the properties of the protective material and the required film thickness. For the aforementioned liquid supply system, this includes the protective material storage tank, piping, and pump. The storage tank material must be chemically compatible with the protective material and have good sealing properties to prevent liquid leakage and evaporation. The aforementioned drive unit must be able to precisely move the printhead, ensuring that the protective material accurately covers the area to be processed.

[0153] The aforementioned circuit board fixing components and control components are specifically designed with reference to existing equipment settings in the prior art.

[0154] In some embodiments of this application, the surface processing apparatus further includes an image sensor for acquiring surface target points of the circuit board to be processed.

[0155] The control component is also used to locate the target surface treatment area based on the surface target points, and to determine the initial position of the target surface treatment area based on the positioning and processing documents.

[0156] The image sensor is mounted in a position that clearly captures the entire circuit board to be processed, typically above the surface processing equipment and at an angle to the board surface to avoid light reflection interfering with target identification. Based on the pixel coordinates of the target point in the image, and combined with a pre-established transformation relationship between the image coordinate system and the equipment coordinate system, the actual position coordinates of the target point in the equipment coordinate system are calculated. This transformation relationship is determined through the equipment calibration process, usually using a standard calibration board for multiple measurements and calculations to obtain an accurate transformation matrix. Using triangulation principles or feature point matching methods, the positional relationship between the target surface processing area and the target point is further determined, thus completing the localization of the target surface processing area.

[0157] In some embodiments of this application, the initial processing location is any location within the target surface processing region.

[0158] The surface treatment actuator is specifically used to add protective material to the target surface treatment area from any position via spraying. It applies the protective material along the target surface treatment area at a constant speed until the entire area is covered. Based on the initial treatment position coordinates resolved by the control component, the surface treatment actuator uses its high-precision motion platform to precisely move the nozzle to the initial position within the target surface treatment area. Once the nozzle reaches the initial position, the control component sends a start signal to the protective material application device, activating the pump to spray the protective material from the nozzle at a set initial flow rate. Simultaneously, the motion platform is activated, moving at a constant speed in a preset direction, thus officially commencing the spraying of the protective material onto the target surface treatment area from the initial position. During the spraying process, the surface treatment actuator's motion platform moves along the target surface treatment area at a constant speed, achieved through a closed-loop control system. The closed-loop control system uses position sensors (such as linear encoders) mounted on the motion platform to monitor the platform's position and speed in real time, transmitting feedback signals to the control component. If the protective material requires curing to form a stable surface protective film, after stopping spraying, start the corresponding curing equipment according to the curing characteristics of the protective material.

[0159] In some embodiments of this application, when the target surface treatment area is circular, the control component is used to determine the center of the circle as the initial processing position. Specifically, the surface treatment actuator is used to add protective material from the center of the circle and to rotate the circuit board to be processed at high speed around the center of the target surface treatment area until the entire target surface treatment area is covered with protective material.

[0160] Using the center coordinate information transmitted from the control components, the position adjustment mechanism precisely positions the protective material adding device to the center of the circle.

[0161] The surface treatment actuator is equipped with a rotary drive to rotate the circuit board to be processed at high speed around a center. This rotary drive can be a combination of a motor and a reducer, with the motor connected to the circuit board mounting assembly via a coupling. The motor speed is adjusted by a control unit, determining the appropriate speed based on the size of the circular area and the characteristics of the protective material. For example, a higher speed may be needed for a larger circular area to ensure the protective material can quickly and evenly cover the entire area; while for a smaller radius area, the speed can be appropriately reduced to prevent the protective material from splashing due to excessive centrifugal force. The speed can be precisely controlled using devices such as frequency converters, typically ranging from hundreds to thousands of revolutions per minute.

[0162] The flow control of the protective material adding equipment and the rotation speed of the circuit board need to be coordinated. The flow rate of the protective material can be determined based on the rotation speed and the area of ​​the circular region.

[0163] The addition and rotation of protective materials are synchronized through control software. When the protective material is added from the center, the rotation drive starts to run at the set speed. Throughout the process, the software continuously monitors and adjusts the state of both to ensure that the protective material is evenly distributed on the rotating circular area.

[0164] An optical inspection system is used to determine whether the protective material completely covers the circular area. The optical inspection system includes a light source and a camera; the light source provides uniform illumination, and the camera captures an image of the circular area.

[0165] Image processing software analyzes the captured image, comparing the boundaries and grayscale features of the covered area and the target circular area to determine if complete coverage is achieved. Once complete coverage is detected, the control software issues a command to stop the addition of protective material and the rotation of the circuit board.

[0166] By adding protective material at the center and rotating the circuit board at high speed, the protective material spreads evenly circumferentially under centrifugal force. Compared to the traditional linear addition method, this method allows for a more uniform distribution of the protective material within the circular area, avoiding excessive local thickness differences.

[0167] In some embodiments of this application, when the protective material is a liquid, the surface treatment equipment further includes a drying mechanism for drying the protective material to form a surface protective film.

[0168] A circuit board processing device is used to perform laser processing on a circuit board to be processed, wherein the circuit board to be processed is pre-treated according to any of the above-mentioned surface treatment methods.

[0169] In some embodiments of this application, the circuit board processing equipment is configured to include a laser generator, a beam transmission and focusing system, a processing platform, a fixture, a cooling system, and a monitoring and feedback system.

[0170] Upon receiving the laser processing start signal, the circuit board processing equipment first initializes and performs self-checks on its various components, including power calibration of the laser generator, optical path adjustment of the beam transmission and focusing system, zeroing of the processing platform position, and sensitivity detection of the motion system.

[0171] Based on the processing specifications, the equipment's control system uses built-in processing algorithms to plan the optimal laser processing path, determining the laser's starting and ending points, as well as its trajectory and speed during processing. For example, complex circuit patterns are broken down into multiple simple processing line segments or graphic units, which are then processed sequentially in a specific order.

[0172] During processing, the laser generator produces a high-energy laser beam according to set power parameters. The beam is then focused onto the surface of the protective film layer in the area to be processed via a beam transmission system. Due to the presence of the protective film, the laser beam interacts with both the protective film and the circuit board material, removing material from the circuit board in a pre-defined manner, such as through melting, vaporization, or chemical decomposition, gradually forming the desired lines or patterns. Simultaneously, the equipment's monitoring system monitors various parameters in real time during processing, such as laser power, processing temperature, and processing depth, and adjusts them according to preset thresholds to ensure the stability of the processing and the reliability of the processing quality.

[0173] The protective film layer can uniformly absorb excess heat generated by laser processing, allowing the circuit board to cool down rapidly, effectively reducing the heat-affected zone and lowering the maximum temperature. This reduces circuit board deformation and damage to the protective film layer itself due to overheating. When processing high-density circuit boards, the protective film layer can prevent heat from accumulating locally, and its heat dissipation function can prevent problems such as warping and circuit breakage.

[0174] The protective film layer encapsulates particles generated by the laser beam, preventing them from splashing onto the circuit board surface during processing and causing scratches or other physical damage, thus ensuring the flatness and smoothness of the circuit board surface. Simultaneously, because laser processing is performed precisely according to a processing document, and with the assistance of the protective film layer, the consistency of laser processing linewidth is guaranteed, improving the processing accuracy of the circuit board and meeting the high-precision, high-quality requirements of modern electronic devices. This helps improve the electrical performance and reliability of the circuit board, reduces signal transmission loss and failure rate, thereby improving the overall performance and lifespan of the electronic product.

[0175] The appropriate type and power of laser generator need to be selected based on the material and processing requirements of the circuit board. For example, fiber lasers are commonly used for processing copper circuit boards, and their wavelength and power can be optimized according to the absorption characteristics of copper and the required processing precision. The laser generator should have stable power output and good beam quality to ensure consistent processing.

[0176] The aforementioned beam transmission and focusing system, composed of optical components such as mirrors and lenses, accurately transmits the laser beam generated by the laser generator to the area to be processed and focuses it to a suitable spot size. The quality of the optical components directly affects the precision of laser processing, and it is essential to ensure uniform energy distribution of the laser beam.

[0177] The aforementioned processing platform needs to have high flatness and stability to provide solid support for the circuit board. Fixtures are used to hold the circuit board in place and prevent displacement during laser processing. The fixture design must be customized according to the shape and size of the circuit board to ensure a tight fit without damaging it.

[0178] Since laser processing generates heat, a cooling system is used to maintain the equipment's normal operating temperature. Water cooling or air cooling can be used to cool critical components such as the laser generator and optical elements. The cooling system should have temperature monitoring and automatic adjustment functions to ensure the equipment operates within a suitable temperature range.

[0179] The aforementioned monitoring and feedback system uses sensors and cameras to monitor parameters during the laser processing in real time, such as laser power, spot position, processing depth, and temperature. This monitoring data is fed back to the control system to adjust processing parameters promptly, ensuring the stability of processing quality.

[0180] A circuit board processing system includes the aforementioned surface treatment equipment and circuit board processing equipment.

[0181] Specifically, the circuit board processing equipment and the surface treatment equipment work together. In some embodiments of this application, the surface treatment equipment forms a uniform protective film by precisely printing a protective liquid, providing a stable processing environment for laser processing. The protective film ensures the consistency of the laser processing linewidth and reduces processing errors caused by uneven material surfaces or uneven heat distribution. Simultaneously, the high-precision configuration of the circuit board processing equipment itself enables fine processing, such as processing tiny lines and vias, meeting the high-precision processing requirements of circuit boards. The protective film effectively prevents particle splashing and deposition during laser processing, avoiding scratches on the circuit board surface. It also absorbs excess heat, reducing the heat-affected zone and deformation of the circuit board, thereby improving its quality and reliability. The precise processing capabilities and stable processing of the circuit board processing equipment also help reduce the defect rate and improve the overall product quality. The printing method of the surface treatment equipment allows for rapid and uniform coverage of the protective liquid, working closely with the circuit board processing equipment to reduce intermediate steps and waiting time during processing. Moreover, due to the presence of the protective film, laser processing can utilize higher power and speed, thereby improving overall production efficiency. This type of PCB processing system is suitable for various types of PCBs. By adjusting the parameters of the surface treatment equipment and the PCB processing equipment, the processing requirements of different PCBs can be met, improving the equipment's versatility and economy.

[0182] In some embodiments of this application, the surface treatment device is configured as a layer-adding device, and the circuit board processing device is configured as a laser processing device, and the two work together.

[0183] When the system begins processing, it first sends a spraying start signal and processing file to the layer-adding equipment. Upon receiving the signal, the layer-adding equipment starts working, completes the spraying of the protective liquid, and then sends a completion signal back to the system. Upon receiving this signal, the system determines that the surface protective film has formed and then sends a laser processing start signal and processing file to the laser processing equipment. Based on these signals and information, the laser processing equipment begins processing the area where the surface protective film has formed. This ensures that the layer-adding equipment and the laser processing equipment work in the correct sequence and according to requirements, achieving a close connection in the processing flow. Depending on the specific processing requirements of the circuit board, the parameters of the layer-adding equipment and the laser processing equipment can be adjusted in coordination. For example, when the surface protective film sprayed by the layer-adding equipment is thick, the laser processing equipment can appropriately adjust the laser power and processing speed to ensure effective penetration of the surface protective film while maintaining processing quality. Alternatively, when high precision is required for laser processing, the layer-adding equipment can adjust the spraying parameters to make the surface protective film more uniform and refined, providing better conditions for laser processing.

[0184] Both the layer-adding equipment and the laser processing equipment are equipped with monitoring systems. During processing, the layer-adding equipment monitors the application of the protective liquid, such as the amount applied and the film thickness, and feeds this information back to the system. The laser processing equipment monitors parameters during laser processing, such as laser power and processing temperature. If any abnormalities occur during processing, such as insufficient protective film thickness or fluctuations in laser power, the two devices can exchange information through the system to adjust their respective parameters in a timely manner or pause processing to ensure processing quality and equipment safety.

[0185] Furthermore, the aforementioned protective material is cured using a curing device to form the aforementioned surface protective film. When the protective material is non-liquid, the corresponding equipment can be replaced to form the surface protective film, which will not be elaborated upon here. When the protective material is liquid, the aforementioned curing device uses a drying process to cure the protective material to form the aforementioned surface protective film.

[0186] In some embodiments of this application, provided that the thickness of the above-mentioned film layer is in the range of 1 micrometer to 300 micrometers, a surface protective film with a thickness of less than or equal to 80 micrometers is considered a thinner surface protective film.

[0187] When the thickness of the aforementioned surface protective film is less than or equal to 80 micrometers, the protective material is cured using the curing equipment provided with the aforementioned layering equipment to form the aforementioned surface protective film, and the aforementioned surface protective film on the surface of the workpiece is removed using the film removal mechanism provided with the aforementioned layering equipment.

[0188] In the above situations, using the curing equipment integrated into the layering equipment allows for immediate curing after the protective material is sprayed, reducing time wastage and potential contamination risks associated with intermediate steps. Because curing occurs inside the layering equipment, the environment surrounding the protective material is relatively stable, allowing for better control of the curing process and resulting in a more stable and uniform surface protective film.

[0189] For example, in the processing of some small circuit boards, because the surface protective film is thin, the built-in curing equipment can quickly transform the protective material into a uniform surface protective film in a short time through precise temperature or light control (if it is light curing or heat curing), thus ensuring a balance between production efficiency and film quality.

[0190] The built-in curing equipment may include a small thermosetting device and a low-power UV curing lamp.

[0191] Small thermosetting devices have a built-in small hot air blower, which can blow hot air evenly onto the surface of the circuit board coated with protective material, so that the protective material can be cured quickly. Small thermosetting devices are suitable for some protective materials that do not have particularly high temperature requirements and have a fast curing speed.

[0192] Similarly, using the built-in film removal mechanism of the overlay equipment, for thinner surface protective films, the built-in removal module may be more suitable for removing them, precisely controlling the removal force and method to reduce damage to the circuit board itself. Furthermore, the removal module inside the overlay equipment can perform targeted operations based on the previous curing status, ensuring effective removal. For example, for some precision circuit boards with thin surface protective films, the built-in film removal mechanism can use mild chemical reagents or fine physical wiping methods to ensure complete removal of the surface protective film while avoiding scratching the circuitry and components on the circuit board surface.

[0193] In some embodiments of this application, provided that the thickness of the above-mentioned film layer is in the range of 1 micrometer to 300 micrometers, a surface protective film with a thickness greater than 80 micrometers is considered a relatively thick surface protective film.

[0194] When the thickness of the aforementioned protective film is greater than 80 micrometers, the protective material is cured using an external curing device to form the aforementioned protective film, and the aforementioned protective film on the surface of the workpiece is removed using an external film removal mechanism.

[0195] When the protective film is thick, using an external curing unit can provide stronger curing capabilities. External curing units may have higher power and more space to process thicker layers of protective material, ensuring complete curing of the protective film. This helps form a high-quality protective film, enabling it to better perform its protective functions in subsequent laser processing, such as more effectively absorbing heat and preventing particle spatter.

[0196] When processing large or thick circuit boards, thicker protective films may require higher temperatures or longer curing times. External curing equipment, such as large ovens or high-energy-density photopolymerizers, can meet these specific curing requirements, ensuring uniform curing of both the interior and surface of the protective film.

[0197] Similarly, external membrane removal mechanisms typically have wider applicability and stronger removal capabilities. For thicker protective films, stronger chemical reagents, higher rinsing pressures, or more complex mechanical removal methods may be required. External modules can employ these specialized removal methods without affecting the normal operation of the layer-addition equipment and can be flexibly adjusted according to the specific characteristics of the protective film.

[0198] For example, using a high-pressure water gun or strong organic solvents to remove a thick protective film may damage the equipment if performed inside the layering device. However, an external film removal mechanism can achieve the same effect while avoiding excessive damage to the circuit board.

[0199] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0200] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A surface treatment method, characterized in that, Applied to a surface treatment device, the method includes: Obtain the processing file of the circuit board to be processed, wherein the processing file includes information on the target surface processing area; The initial processing position of the target surface processing region is determined based on the target surface processing region information; Add protective material to the target surface treatment area from the initial treatment location; The protective material in the target surface treatment area is homogenized to form a surface protective film on the circuit board to be processed.

2. The surface treatment method according to claim 1, characterized in that, Determining the initial processing position based on the target surface processing area specifically includes: The target points on the surface of the circuit board to be processed are acquired using an image sensor to complete the localization of the target surface processing area; The initial processing position of the target surface processing area is determined based on the positioning and the processing file.

3. The surface treatment method according to claim 1, characterized in that, The initial processing position can be any position within the target surface processing area. The step of adding protective material to the target surface treatment area from the initial treatment position specifically includes: adding protective material to the target surface treatment area from any position by spraying; The homogenization treatment of the protective material in the target surface treatment area specifically includes: Apply protective material to the target surface treatment area at a constant speed until the entire target surface treatment area is covered with protective material.

4. The surface treatment method according to claim 1, characterized in that, When the target surface processing area is circular in shape Determining the initial processing position of the target surface processing region based on the target surface processing region information specifically includes: Determine the center of the circle as the initial processing position; The step of adding protective material to the target surface treatment area from the initial treatment position specifically includes: Add protective material from the center of the circle; The homogenization treatment of the protective material in the target surface treatment area specifically includes: The circuit board to be processed is rotated at high speed around the center of the target surface treatment area until the entire target surface treatment area is covered with protective material.

5. The method according to any one of claims 1-4, characterized in that, The protective material is a liquid.

6. The method according to claim 5, characterized in that, The protective film forming the surface layer of the circuit board to be processed specifically includes: The protective material is dried to form the surface protective film.

7. The method according to claim 6, characterized in that, The thickness of the surface protective film is between 1µm and 300µm.

8. A method for processing a circuit board, characterized in that, Applied to circuit board processing equipment, the method includes: Obtain a circuit board to be processed, wherein the circuit board to be processed is pre-treated with a surface layer according to any one of claims 1-7 to form a processing area with a surface protective film; Laser processing is performed on the area to be processed of the circuit board.

9. A method for processing a circuit board, characterized in that, Applied to a circuit board processing system, the circuit board processing system including surface treatment equipment and circuit board processing equipment, the method includes: Obtain the circuit board to be processed; The surface treatment equipment is used to perform surface treatment on the circuit board to be processed according to the method described in claims 1-7 to obtain a processing area with a surface protective film; The circuit board processing equipment described herein is used to perform laser processing on the processing area of ​​the circuit board to be processed according to the method described in claim 8.

10. A surface treatment apparatus, characterized in that, The surface treatment device includes: a control component, a circuit board fixing component, and a surface treatment execution mechanism; The circuit board fixing assembly is used to fix the circuit board to be processed. The control component is used to acquire the processing file of the circuit board to be processed, and determine the initial processing position based on the target surface processing area information of the processing file; The surface treatment actuator is used to add protective material to the circuit board to be processed from the initial processing position and perform homogenization treatment to form a surface protective film on the circuit board to be processed.

11. The surface treatment apparatus according to claim 10, characterized in that, The surface processing device also includes an image sensor, which is used to acquire surface target points of the circuit board to be processed. The control component is also used to locate the target surface treatment area based on the surface target points, and to determine the initial position of the target surface treatment area based on the location and the processing file.

12. The surface treatment apparatus according to claim 10, characterized in that, The initial processing position can be any position within the target surface processing area. The surface treatment actuator is specifically used to add protective material to the target surface treatment area from any position by spraying, and to add protective material to the target surface treatment area at a constant speed until the target surface treatment area is completely covered with protective material.

13. The surface treatment apparatus according to claim 10, characterized in that, When the target surface processing area is circular, the control component is used to determine the center of the circle as the initial processing position; The surface treatment actuator is specifically used to add protective material from the center of the circle and to make the circuit board to be processed rotate at high speed around the center of the target surface treatment area until the target surface treatment area is completely covered with protective material.

14. The surface treatment apparatus according to any one of claims 10-13, characterized in that, When the protective material is a liquid, the surface treatment equipment further includes a drying mechanism for drying the protective material to form the surface protective film.

15. A circuit board processing equipment, characterized in that, The circuit board processing equipment is used to perform laser processing on the circuit board to be processed, and the circuit board to be processed is pre-treated with a surface layer according to the method described in claims 1-7.

16. A circuit board processing system, characterized in that, This includes the surface treatment equipment as described in claims 10-14 and the circuit board processing equipment as described in claim 15.

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