Heat dissipation electric control box and heat dissipation control method thereof

Abstract

The application relates to a heat dissipation electric control box and a heat dissipation control method thereof, and relates to the technical field of electric control box heat dissipation, and aims to solve the problem that an electric control box cannot be efficiently cooled. The heat dissipation electric control box comprises a box body, a power device, a heat pipe component, a heat dissipation component, a fan and a semiconductor refrigeration component. The power device is arranged in the box body. One end of the heat pipe component is in contact with the power device, and the other end of the heat pipe component is arranged outside the box body. On the outer side of the box body, at least one side of the box body is in contact with the heat dissipation component. The fan is arranged in the box body. The fan can also be arranged on the outer side of the box body and face the heat dissipation component or the heat pipe component. At least one of the one end of the heat pipe component outside the box body and the power device is in contact with the refrigeration side of the semiconductor refrigeration component.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electrical control boxes, and in particular to a heat dissipation electrical control box and its heat dissipation control method. Background Technology

[0002] A variable frequency control box is a special electrical control device that integrates a frequency converter. Its core function is to adjust the motor speed by changing the power supply frequency of the motor, thereby achieving precise control of the motor speed and realizing low power consumption operation of the whole machine.

[0003] Because the input current and output current need to be continuously switched and frequency-converted, the power devices inside the frequency converter control box will continuously generate heat. Therefore, it is necessary to continuously and efficiently dissipate heat from the power devices to keep them within a suitable operating temperature range. Summary of the Invention

[0004] This application provides a heat dissipation electrical control box and its heat dissipation control method, aiming to solve the problem of the electrical control box's inefficient heat dissipation.

[0005] In a first aspect, embodiments of this application provide a heat dissipation electrical control box, including a box body, power devices, heat pipes, heat sinks, a fan, and a thermoelectric cooler. The power devices are disposed within the box body. One end of the heat pipe is in contact with the power device, and the other end of the heat pipe is disposed outside the box body. At least one side of the box body is in contact with the heat sink on its outer side. The fan is disposed within the box body. Alternatively, the fan can be disposed outside the box body and directed towards the heat sink or the heat pipe. The end of the heat pipe located outside the box body is in contact with the cooling side of the thermoelectric cooler and at least one of the power devices.

[0006] In some embodiments, along a first direction, the housing has heat dissipation components on the outer sides of two opposing sidewalls. The number of heat pipes is at least two, and each heat dissipation component is in contact with at least one heat pipe component on the outer side of the housing.

[0007] In some embodiments, the heat sink has a honeycomb structure. Along the first direction, one end of the heat sink is in contact with the side wall of the housing, and the other end of the heat sink has multiple heat dissipation holes, which are hexagonal in structure.

[0008] In some embodiments, the semiconductor cooling element is at least disposed on the outside of the housing, and the cooling side of the semiconductor cooling element, the heat pipe and the heat sink are sequentially connected in contact.

[0009] In some embodiments, the heat pipe is disposed on one side of the heat sink along a second direction, and the second direction forms an angle with the first direction. Along the second direction, the heat sink is provided with multiple air duct through-holes.

[0010] In some embodiments, the fan is located at least on the outside of the housing, and the outlet side of the fan is oriented toward the air duct opening.

[0011] In some embodiments, the heat dissipation control box further includes a heat storage layer filled with a phase change heat-conducting medium, and the heat storage layer is at least in contact with the power device.

[0012] In some embodiments, the phase change thermally conductive medium includes a composite material of paraffin and expanded graphite.

[0013] In some implementations, the heat pipe is positioned between the power device and the heat storage layer.

[0014] In some embodiments, the enclosure is a sealed structure, and the heat dissipation control box includes a sealing ring and an encapsulation component. The enclosure has a connector hole into which the heat pipe is inserted, and the sealing ring is pressed between the heat pipe and the side wall of the connector hole. The encapsulation component is disposed inside the enclosure to fill the gaps between the connector hole, the sealing ring, and the heat pipe.

[0015] In some embodiments, the thermal control box includes a first temperature sensor, a second temperature sensor, and a temperature control module. The first temperature sensor is located at the power device and is used to detect the heat generated by the power device. The second temperature sensor is located inside the box and is used to detect the ambient temperature inside the box. The temperature control module is electrically connected to the first temperature sensor, the second temperature sensor, the fan, and the thermoelectric cooler.

[0016] Secondly, this application provides a heat dissipation control method for a heat dissipation control box, applied to the heat dissipation control box in the first aspect. The heat dissipation control method includes the following steps: The first temperature parameters of the power devices are obtained and compared.

[0017] If the first temperature parameter is less than the first threshold, the control fan and semiconductor cooling device are shut down.

[0018] If the first temperature parameter is between the first threshold and the second threshold, the fan is controlled to start.

[0019] If the first temperature parameter is greater than or equal to the second threshold, the control fan and semiconductor cooling device will start.

[0020] After running for the first preset time, the first temperature parameters of the power device are reacquired and compared.

[0021] The second threshold is greater than the first threshold.

[0022] In some implementations, the heat dissipation control method includes the following steps: Obtain the second temperature parameter inside the chamber.

[0023] Comparative analysis of the second temperature parameter.

[0024] If the predicted temperature rise rate of the second temperature parameter is greater than the third threshold, the heat dissipation level of the heat dissipation control box is increased and the first preset time is run.

[0025] In some implementations, the first threshold is 50°C, the second threshold is 65°C, and the third threshold is 2°C / min.

[0026] In some implementations, improving the heat dissipation level of the heat dissipation control box includes: Start the fan or activate the semiconductor cooling device.

[0027] And / or, increase the fan speed.

[0028] And / or, increase the cooling power of the semiconductor cooling device.

[0029] Thirdly, this application provides a heat dissipation control method for a heat dissipation control box, including at least one communication interface, at least one bus connected to the at least one communication interface, at least one processor connected to the at least one bus, and at least one memory connected to the at least one bus. The processor is configured to execute the operation steps of the heat dissipation control method for the heat dissipation control box described in the second aspect.

[0030] Fourthly, this application also provides a computer storage medium storing computer-executable instructions for executing the operation steps of the heat dissipation control method of the heat dissipation control box in the third aspect.

[0031] The technical solutions provided in this application have the following advantages compared with the prior art: The heat dissipation control box provided in this application embodiment can meet the heat dissipation requirements of power devices through passive heat dissipation via the box body, heat pipes, and heat sinks during low-power (low-speed) operation, without requiring additional energy consumption. During medium-speed operation, the fan can be activated to increase airflow speed, thereby improving the heat dissipation effect at the heat sinks and heat pipes, enabling the power devices to stably output higher power. During high-speed operation, the semiconductor cooling device can be activated in addition to the fan, further enhancing the heat dissipation and cooling effect of the power devices, enabling them to meet the high-speed power output requirements.

[0032] This means that when the power devices operate at low speeds, the cooling process requires no energy. When the power devices operate at medium speeds, the cooling process only requires the energy consumed by the fan. Therefore, the low-to-medium speed cooling of this heat dissipation control box provides good heat dissipation and energy efficiency. Furthermore, even when the power devices operate at high speeds, rapid cooling can be achieved through the cooperation of semiconductor cooling components to meet the high power output requirements, without the need for any power components other than the fan. This simplifies the structural design and improves the overall stability of the device. Attached Figure Description

[0033] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0036] Figure 1 A three-dimensional structural diagram of a heat dissipation electrical control box provided in an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of a structure along the second direction at the heat sink shown in the figure; Figure 3 for Figure 1 A partially enlarged schematic diagram of the heat sink and heat pipe components shown in the figure; Figure 4 for Figure 1 A schematic diagram of a connection structure for the power device, heat pipe, and semiconductor refrigeration device shown in the figure; Figure 5 for Figure 1 A cross-sectional view of the power device shown; Figure 6 This is a schematic diagram of an insertion seal between the heat pipe component and the side wall of the housing in an embodiment of this application; Figure 7 This application provides an electrical connection diagram of a heat dissipation control box according to an embodiment of the present application. Figure 8 A flowchart illustrating a heat dissipation control method for a first type of heat dissipation electrical control box provided in this application embodiment; Figure 9 A flowchart illustrating the heat dissipation control method for a second type of heat dissipation electrical control box provided in this application embodiment; Figure 10 This is a schematic diagram of the structure of a control device for a heat dissipation electrical control box provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures: 100. Heat dissipation electrical control box; 10. Housing; 11. Socket; 20. Power device; 30. Heat pipe; 40. Heat sink; 41. Heat dissipation hole; 42. Air duct hole; 50. Fan; 60. Semiconductor cooling device; 70. Heat storage layer; 81. Sealing ring; 82. Package; 91. Temperature control module; 911. Processor; 912. Communication interface; 913. Memory; 914. Communication bus; 92. First temperature sensor; 93. Second temperature sensor; 94. Third temperature sensor. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0040] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0041] Based on this, please refer to Figures 1 to 10 This application provides a heat dissipation electrical control box and its heat dissipation control method, aiming to solve the problem of the electrical control box's inefficient heat dissipation.

[0042] Firstly, such as Figure 1 and Figure 2 As shown in the figure, this application provides a heat dissipation electrical control box 100, including a box body 10, a power device 20, a heat pipe 30, a heat sink 40, a fan 50, and a semiconductor cooling device 60.

[0043] Power devices 20 are housed within the enclosure 10. Power devices 20 include at least an IGBT (Insulated Gate Bipolar Transistor) module. As the main structure of the inverter, the IGBT module can use high-frequency switching control to invert rectified DC power into AC power with controllable frequency and voltage, thereby precisely driving and regulating the motor speed. In addition, power devices 20 may also include at least one of the following components: a rectifier bridge, a freewheeling diode, and a power resistor. The rectifier bridge typically consists of multiple diodes and is used to convert the input AC power into DC power, providing a stable power supply for the subsequent inversion process of the IGBT module. The freewheeling diode is usually connected in parallel with the IGBT module or an inductor to provide a path for the energy released by the motor (inductive load) during sudden changes in circuit current, preventing the device from being damaged by high voltage. Power resistors include two types: braking resistors and pre-charging resistors. Braking resistors are used to dissipate excess energy during motor deceleration and prevent excessive DC bus voltage. Pre-charging resistors limit the capacitor charging current during equipment startup, protecting the rectifier bridge and capacitors.

[0044] During the process of controlling the motor operation via the power device 20, components such as the IGBT module, rectifier bridge, freewheeling diode, and power resistor continuously generate heat. Therefore, a heat pipe 30 is installed, with one end connected to the power device 20 and the other end outside the housing 10. This allows the power device 20, located inside the housing, to be isolated and protected by the housing 10 while simultaneously dissipating heat quickly and efficiently through the heat pipe 30, preventing localized or overall overheating of the power device 20 and thus avoiding disruption to the stable operation of the motor.

[0045] It should be noted that the power device 20 may include only an IGBT module or multiple heat-generating components. If the power device 20 includes only an IGBT module, the heat pipe 30 can directly contact and connect to the IGBT module to reduce the heat transfer path and improve heat conduction and dissipation efficiency. If the power device 20 includes multiple heat-generating components, multiple heat-generating components can be contacted and connected through a heat spreader, and the heat pipe 30 can indirectly contact one or more heat-generating components of the power device 20 through the heat spreader. Alternatively, each heat pipe 30 can be configured to contact and connect to one or more heat-generating components; this is not limited.

[0046] For example, the heat pipe 30 includes a shell, a wick, and a refrigerant. The shell is typically made of a metal with good thermal conductivity, such as copper or aluminum, and serves a sealing and supporting function. The shell is filled with a low-boiling-point refrigerant and has a porous wick. At the end of the shell that contacts the power device 20 (i.e., the evaporation end), the refrigerant can quickly absorb heat from the power device 20 through evaporation. The vaporized refrigerant will quickly dissipate heat and liquefy when it comes into contact with the air inside and outside the housing 10 through the shell. The liquefied refrigerant (i.e., the condensation end) can flow inside the shell through the capillary action of the wick to continue the evaporation and heat absorption cycle with the power device 20, thereby achieving rapid heat dissipation from the power device 20.

[0047] On the outside of the enclosure 10, at least one side of the enclosure 10 is in contact with the heat sink 40. This contact with the enclosure 10 not only supports and positions the heat sink 40, but also increases the contact area between the enclosure 10 and the external side, thus improving the heat dissipation effect of the enclosure 10 itself. The fan 50 can be located inside or outside the enclosure 10, or both inside and outside the enclosure 10 can be simultaneously installed, driving rapid airflow. Inside the enclosure 10, the fan 50 can circulate air between the power device 20 and the inner wall of the enclosure 10, improving the heat dissipation effect on the power device 20. On the outside of the enclosure 10, the fan 50 can be positioned towards the heat sink 40 or the heat pipe 30, similarly improving heat dissipation through rapid airflow.

[0048] Based on this, the power device 20 can be configured to directly contact the cooling side of the thermoelectric cooler 60, so that the power device 20 can be cooled by the cooling side of the thermoelectric cooler 60. Alternatively, one end of the heat pipe 30 located outside the housing 10 can be connected to the cooling side of the thermoelectric cooler 60, so that the outer end of the heat pipe 30 can be rapidly cooled by the thermoelectric cooler 60, allowing heat to be quickly transferred from the power device 20 to the outside of the housing 10 through the heat pipe 30.

[0049] Based on this, the heat dissipation control box 100 provided in this application has multiple heat dissipation operating states. Through the arrangement of heat pipes 30 and heat sinks 40, passive heat dissipation can be achieved for the power device 20 and the box 10, continuously cooling the internal environment of the power device 20 and the box 10. Furthermore, by activating the fan 50 to circulate air within the box 10 or rapidly flow through the heat sinks 40 and heat pipes 30, the contact between the heat dissipation components and the air is increased, thereby improving the heat dissipation effect of the heat sinks 40 and heat pipes 30, which is beneficial for further reducing the temperature of the power device 20. In addition, the semiconductor cooling device 60 can be activated to rapidly cool the condenser end of the heat pipe 40 and / or the power device 20 through the cooling side of the semiconductor cooling device 60, further improving the heat dissipation and cooling effect of the power device 20.

[0050] In actual operation, when the power device 20 operates at a lower power level, it generates less heat. Cooling can be achieved passively through the heat pipe 30 and the heat sink 40, keeping the power device 20 and the interior of the housing 10 within a lower temperature range. During this process, the power device 20 cools through the refrigerant phase change within the heat pipe 30 and through heat transfer between the power device 20 and the air—a passive cooling method requiring no additional energy consumption.

[0051] Based on this, if the operating power of the power device 20 increases, resulting in greater heat generation, the fan 50 can be activated to drive rapid air circulation, thereby improving the heat dissipation and cooling effect. If the fan 50 is located inside the housing 10, activating the fan causes rapid air circulation between the power device 20 and the side walls of the housing 10, improving the heat exchange efficiency between the power device 20 and the side walls of the housing 10 (including the heat sink 40), thus enhancing the heat dissipation and cooling effect of the power device 20. If the fan 50 is located outside the housing 10, activating the fan allows air to flow rapidly through at least one of the heat sink 40 and the heat pipe 30, resulting in a lower temperature at the heat sink 40 or the heat pipe 30. This facilitates rapid heat dissipation and cooling of the power device 20 through a higher temperature difference, thereby quickly dissipating the heat generated at the power device 20. In this process, only the fan needs to be driven to rotate; there are no other additional moving parts, resulting in good energy-saving effects and energy efficiency ratio.

[0052] If the operating power of power device 20 increases further, meaning the heat generated by power device 20 increases further, then the thermoelectric cooler 60 can be activated to rapidly cool the power device 20 or the condenser end of heat pipe 30 via its cooling side. Taking the thermoelectric cooler 60 installed in contact with the power device 20 as an example, the cooling side of the activated thermoelectric cooler 60 can rapidly cool the power device 20 in contact. If the thermoelectric cooler 60 is installed in contact with the end of heat pipe 30 located outside the housing 10 (i.e., the condenser end), the cooling side of the thermoelectric cooler 60 can rapidly absorb the heat released during condensation, increasing the circulation speed of the refrigerant within heat pipe 30, thereby rapidly transferring the heat from power device 20 to the outside of housing 10, thus achieving rapid cooling of power device 20. In other words, both installation methods of the thermoelectric cooler 60 can achieve rapid heat dissipation of power device 20, enabling stable operation and higher power output, thus avoiding overheating protection.

[0053] In summary, the heat dissipation control box 100 provided in this embodiment can meet the heat dissipation requirements of the power device 20 through passive heat dissipation via the box 10, heat pipe 30, and heat sink 40 during low-power (low-speed) operation, without requiring additional energy consumption. During medium-speed operation, the fan 50 can be activated to increase airflow speed, thereby improving the heat dissipation effect at the heat sink 40 and heat pipe 30, enabling the power device 20 to stably output higher power. During high-speed operation, the semiconductor cooling device 60 can be activated in addition to the fan 50 to further enhance the heat dissipation and cooling effect of the power device 20, enabling the power device 20 to meet the high-speed power output requirements.

[0054] That is, when the power device 20 operates at a low speed, the heat dissipation and cooling process requires no energy. When the power device 20 operates at a medium speed, the heat dissipation and cooling process only requires the energy consumed by the fan. In other words, the low and medium speeds of the heat dissipation control box 100 have good heat dissipation effect and energy efficiency ratio. Furthermore, even when the power device 20 operates at a high speed, it can still quickly dissipate heat and cool down in conjunction with the semiconductor cooling component 60 to meet the power output requirements at the high speed, without requiring any power components other than the fan 50. This simplifies the structural design and improves the overall stability of the machine.

[0055] In some embodiments, such as Figure 1 As shown, along the first direction X, the enclosure 10 has heat sinks 40 on the outer sides of two oppositely arranged side walls. That is, by arranging heat sinks 40 on opposite sides of the enclosure 10, the heat dissipation and cooling effect on the side walls of the enclosure 10 can be improved, so that the air temperature inside the enclosure 10 is kept in a lower range, which is beneficial to improving the heat dissipation and cooling effect of the power device 20.

[0056] The heat sink 40 can be supported by a metal or alloy material with high thermal conductivity, such as aluminum, copper, or an alloy. The heat sink 40 can be a finned structure or other structures, as long as it can improve the heat dissipation effect by increasing the heat conduction area of ​​the side wall of the housing 10.

[0057] Based on this, such as Figure 1 and Figure 4 As shown, there are at least two heat pipes 30 located on the outside of the housing 10, with each heat sink 40 in contact with at least one heat pipe 30. Taking the first direction X as a left-right direction as an example, the left half of the power device 20 is in contact with one or more heat pipes 30 (i.e., the evaporation end), and the condensation end of the left heat pipe 30 is located outside the housing 10 and in contact with the left heat sink 40. The right half of the power device 20 is in contact with one or more heat pipes 30, and the condensation end of the right heat pipe 30 is located outside the housing 10 and in contact with the right heat sink 40. This design improves the heat dissipation effect of the heat pipes 30 at the condensation end by utilizing the larger area of ​​the heat sink 40, thereby improving the heat absorption effect of the heat pipes 30 on the evaporation side of the power device 20, i.e., improving the heat dissipation and cooling effect and speed of the power device 20.

[0058] For example, such as Figure 1 and Figure 4As shown, there are two heat pipe components 30, which are spaced apart along a first direction. The heat pipe components 30 are interconnected circulation pipes. Each heat pipe component 30 with bends includes multiple condensing ends and multiple evaporating ends. Multiple pipes connected between the condensing ends and the evaporating ends increase the flow rate of the refrigerant between the condensing ends and the evaporating ends, thereby increasing the heat dissipation and cooling rate of the power device 20.

[0059] Thus, by making the heat pipe component 30 on one side an integral structure, it is beneficial to reduce the number of parts and simplify the assembly process. For example, each heat pipe component 30 includes six refrigerant lines, so that the evaporated gaseous refrigerant moves rapidly towards the condensation end, and the condensed liquid refrigerant flows rapidly towards the evaporation end, thereby improving the heat dissipation and cooling speed of the power device 20.

[0060] like Figure 1 and Figure 3 As shown, the heat sink 40 has a honeycomb structure. Along the first direction X, one end of the heat sink 40 is in contact with the side wall of the housing 10, and the other end of the heat sink 40 is provided with multiple heat dissipation holes 41, which have a hexagonal structure. By setting the honeycomb structure heat sink 40 on opposite sides of the housing 10, the heat dissipation contact area is increased, while the heat sink 40 itself has high structural strength and light weight.

[0061] For example, the width of the heat dissipation hole 41 is 30mm. Taking a regular hexagonal cross-section of the heat dissipation hole 41 as an example, the distance between its two opposite edges is its width, i.e., 30mm. The porosity of the heat sink 40 is 70-80%. A higher air ratio will reduce the structural strength of the heat sink 40, while a lower air ratio will increase the structural weight of the heat sink 40. By setting the porosity of the heat sink 40 to 70%, 81%, 82%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, or 80%, the heat sink 40 can achieve both the advantages of being lightweight and having high structural strength.

[0062] In some embodiments, such as Figure 1 and Figure 2 As shown, the heat pipe 30 is disposed on one side of the heat sink 40 along the second direction Y, and there is an angle between the second direction Y and the first direction X.

[0063] Taking the first direction X as the left-right direction as an example, the second direction Y can be the front-back direction. Inside the housing 10, the heat pipe 30 can contact and connect with the power device 20 along the front-back direction. Outside the housing 10, the heat pipe 30 can contact and connect with the heat sink 40 along the front-back direction. That is, the heat pipe 30 is located on the front side of the power device 20 inside the housing 10, and the heat pipe 30 is located on the rear side of the heat sink 40 outside the housing 10.

[0064] At this time, as Figure 2 As shown, the heat sink 40 is provided with a plurality of air duct holes 42 along the second direction Y. This allows air to flow through the heat sink 40 along the air duct holes 42, so as to quickly remove the heat from the heat sink 40 and thereby achieve cooling of the air inside the housing 10.

[0065] Based on this, such as Figure 2 As shown, the fan 50 is at least located on the outside of the housing 10, and the air outlet side of the fan 50 faces the air duct through-hole 42. This allows external air to flow rapidly through the air duct through-hole 42 and across the heat sink 40, thereby increasing the heat dissipation and cooling rate at the heat sink 40.

[0066] For example, the heat pipe 30 is located on one side of the heat sink 40 along the second direction. On the outside of the housing 10, the outlet side of the fan 50 is simultaneously positioned towards the condenser end of the heat pipe 30. Thus, the rapidly flowing air can quickly carry away the heat released by the refrigerant during condensation at the condenser end, thereby preventing excessively high temperatures at the condenser end. This improves the condensation conversion rate of the refrigerant at the condenser end, and consequently increases the evaporation conversion rate of the refrigerant at the evaporation end, allowing more heat to be absorbed at the power device 20.

[0067] For example, on the left or right side of the housing 10, the condenser end of the heat pipe 30 is located behind the heat sink 40. Therefore, the fan 50 is configured to blow air from back to front, so that some air can flow directly through the condenser end of the heat pipe 30 to cool it, and the other part of the air can pass through the air duct through hole 42 to quickly exchange heat with the heat sink 40.

[0068] In some other embodiments, a fan 50 may be installed inside the housing 10, such that the outlet side of the fan 50 is directed toward the power device 20 to improve the heat dissipation efficiency of the power device 20 in contact with the air. Alternatively, the outlet side of the fan 50 may be positioned along the first direction X toward the side wall of the housing 10 to improve the heat exchange efficiency between the side wall with the heat sink 40 and the air inside the housing 10, so that the air inside the housing 10 can circulate and contact the side wall with the heat sink 40 to effectively dissipate heat and cool the air inside the housing 10, which is beneficial for reducing the temperature of the power device 20.

[0069] In some embodiments, such as Figure 1 and Figure 3 As shown, the semiconductor cooling element 60 can be disposed on the outside of the housing 10, that is, the cooling side of the semiconductor cooling element 60, the heat pipe 30, and the heat sink 40 are sequentially connected in contact. For example, the cooling side of the semiconductor cooling element 60 is disposed facing forward and is connected in contact with the heat pipe 30.

[0070] Thus, in the second direction Y, the front side of the heat pipe 30 can be connected to the heat sink 40 to increase the contact area with air, thereby improving the heat dissipation effect at the condenser end. Furthermore, the rear side of the heat pipe 30 is connected to the cooling side of the semiconductor cooler 60 via contact, allowing the conductive semiconductor cooler 60 to rapidly cool the condenser end of the heat pipe 30, improving the circulation of the refrigerant inside the heat pipe 30, and thus enhancing the evaporative heat absorption effect at the evaporator end. In other words, the configuration of the semiconductor cooler 60 significantly improves the overall effective heat dissipation power, enabling the power device 20 to operate stably at high-end operating conditions.

[0071] It should be noted that since the fan on the outside of the housing 10 is usually set from back to front, some air is blocked by the heating side of the semiconductor cooling element 60 when it blows towards the heat pipe 30. This allows the rapidly flowing air to quickly remove the heat from the heating side of the semiconductor cooling element 60, so that the hot and cold sides of the semiconductor cooling element 60 are relatively balanced, thus maintaining the efficient heat dissipation effect of the whole system stably and continuously.

[0072] First, in this embodiment, the heat dissipation mechanism has no other operating components besides the fan 50, resulting in a simple structure and high stability. Second, placing the semiconductor cooling component 60 and the fan 50 on the outside of the housing 10 facilitates the maintenance and replacement of the two main energy-consuming components.

[0073] Furthermore, the fan 50 can continuously drive external air through the semiconductor cooling element 60, ensuring that the semiconductor cooling element 60, especially the heating side, remains relatively clean, which is beneficial for maintaining a high heat dissipation and cooling effect. Moreover, the moving structure of the fan 50, combined with the non-moving structure of the semiconductor cooling element 60, can adapt to complex and changing external environments and maintain good stability.

[0074] In some embodiments, such as Figure 5 As shown, the heat dissipation control box 100 also includes a heat storage layer 70, which is filled with a phase change heat-conducting medium and is at least in contact with the power device 20.

[0075] By contacting and connecting the heat storage layer 70 at the power device 20, and filling the heat storage layer 70 with a phase change thermally conductive medium, the heat storage layer 70 can quickly absorb heat and slow down the temperature rise rate of the power device 20 when the output power and heat generation of the power device 20 increase.

[0076] The heat pipe 30 can transfer heat from the power device 20 to the outside of the housing 10 through the phase change process of the internal refrigerant, and the power device 20 can also slowly radiate heat into the air inside the housing 10. However, the response speed of these two heat dissipation methods is relatively slow, while the heating response speed of the power device 20 is in the millisecond or even nanosecond range. By setting up a heat storage layer 70, the internal phase change heat transfer medium can absorb heat through phase change at a suitable temperature, resulting in a high latent heat value. When the power device 20 enters a high-power state and generates a large amount of heat, a large amount of heat can be quickly stored through the phase change heat transfer medium to prevent the power device 20 from rapidly heating up. Subsequently, the heat from the power device 20 and the heat storage layer 70 is dissipated through the heat conduction of the heat pipe 30 and air radiation to prevent the power device 20 from rapidly heating up and thus avoid overheating-induced shutdown protection.

[0077] For example, the phase change heat transfer medium includes a composite material of paraffin wax and expanded graphite. Since paraffin wax is an amorphous material, its composition is adjusted so that the temperature range from solid to molten liquid is between 50-55°C. When the temperature of the power device 20 exceeds 50°C, the phase change heat transfer medium can fully absorb the heat dissipated by the power device 20 and convert to a molten state, thereby slowing down the temperature rise rate of the power device 20. Its latent heat of phase change can reach over 180 J / g, exhibiting a high specific heat value. By filling the paraffin wax medium with expanded graphite, the thermal conductivity of the paraffin wax is improved through the porous and loose graphite material. The composite material including paraffin wax and expanded graphite has the characteristics of high latent heat, high specific heat value, and high thermal conductivity, enabling it to fully and quickly absorb the heat generated by the power device 20, avoiding rapid temperature rise and reducing the temperature fluctuation range of the power device 20.

[0078] Compared to other liquid phase change heat transfer media, the composite material of paraffin and expanded graphite is solid at room temperature, which makes it easy to store and transport and does not cause volatile pollution, making it economical and environmentally friendly.

[0079] In some embodiments, such as Figure 5 As shown, the heat pipe 30 is positioned between the power device 20 and the heat storage layer 70. That is, the power device 20, heat pipe 30, and heat storage layer 70 are arranged sequentially from back to front. Because there are gaps between the multiple pipes of the heat pipe 30, the heat storage layer 70 can also fill the gap between two adjacent heat pipes 30, which helps to increase the contact area between the heat storage layer 70 and the heat pipe 30, thereby improving the heat dissipation effect.

[0080] For example, the heat storage layer 70 can be set to a thickness of 4.5-5.5 mm along the front-to-back direction, which can absorb a large amount of heat without reducing the heat dissipation and cooling effect between the power device 20, the heat pipe 30, and the air.

[0081] For example, the heat storage layer 70 can be a flexible material. After the heat pipe 30 is fixedly connected to the front side of the power device 20, the heat storage layer 70 can be connected to the heat pipe 30 by adhesive or van der Waals force, which has a good contact connection effect.

[0082] Alternatively, the heat storage layer 70 can also be a rigid plate. In this case, the front side of the power device 20, both ends of the heat pipe 30, the rear side of the heat storage layer 70, the cooling side of the semiconductor cooling component 60, and the connection position between the heat sink 40 and the heat pipe 30 can be polished smooth. Then, thermal grease can be applied, thermal adhesive can be used, and low-temperature welding (such as brazing) can be used to make both ends of the heat pipe 30 contact and connect with the above structure.

[0083] Brazing connects two components by molten metal or metal alloy, which allows for a high thermal conductivity between the two components. It can also connect the two components by low-temperature welding, which can maintain a high thermal conductivity while connecting the two components, thus improving the heat dissipation and cooling effect of the power device 20.

[0084] For example, the heat pipe 30 has a planar structure on one side of the evaporation end for contacting and bonding with the surface of the power device 20, and the gap between the two is filled with solder flux to fix them. The heat pipe 30 has a curved structure on the other side of the evaporation end, and the heat storage layer 70 has a corresponding bonding groove, which increases the contact area between the two and can also fill the gap between them with solder flux to fix the connection.

[0085] In some embodiments, the enclosure 10 is a sealed structure to provide the heat dissipation electrical control box 100 with a high level of protection, such as achieving IP56 or even IP67 protection standards. This is to prevent external high temperature and high humidity environments from affecting the stable operation of the power devices 20.

[0086] Based on this, such as Figure 6 As shown, the heat dissipation control box 100 also includes a sealing ring 81 and an encapsulation component 82. The box 10 has a insertion hole 11, into which the heat pipe 30 is inserted, and the sealing ring 81 is pressed between the heat pipe 30 and the side wall of the insertion hole 11. The encapsulation component 82 is disposed inside the box 10 to fill the gap between the insertion hole 11, the sealing ring 81, and the heat pipe 30. Thus, at the through-hole of the box 10 for the heat pipe 30, the double-layer sealing structure improves the sealing effect, enabling the box 10 to achieve an IP67 protection standard, such as being water-resistant and preventing water immersion, allowing the power device 20 to operate stably and continuously in the low-temperature, water-proof, and dust-proof environment of the box 10.

[0087] For example, the sealing ring 81 can be a fluororubber sealing ring with a Shore hardness between 65 and 75. The encapsulation component 82 can be a sealant or a structural component. After the sealing ring 81 and the heat pipe component 30 are installed in place, the encapsulation adhesive is applied to the inside of the housing 10. After it solidifies, it can provide a better fixing effect and further improve the sealing performance at the insertion hole 11.

[0088] The heat dissipation control box 100 provided in this embodiment can directly switch between three heat dissipation methods. For example... Figure 1 and Figure 7 As shown, the heat dissipation control box 100 includes a temperature control module 91, which is electrically connected to the fan 50 and the semiconductor cooling component 60. The connection method can be wireless communication or wired communication.

[0089] The temperature control module 91 allows for monitoring of the temperature inside the enclosure 10 and at the power device 20. When the temperature is below the first threshold, there's no need to activate the fan 50 and the thermoelectric cooler 60; passive cooling is sufficient. When the temperature is greater than or equal to the first threshold but less than the second threshold (where the second threshold is greater than the first), the fan 50 can be activated to improve the heat dissipation at the heat sink 40, thereby increasing the cooling efficiency of the power device 20 and preventing it from overheating. Furthermore, operating solely with the fan 50 results in extremely low energy consumption and high energy efficiency. When the temperature is greater than or equal to the second threshold, both the fan 50 and the thermoelectric cooler 60 can be activated simultaneously to ensure the power device 20 operates stably at a high output power level, providing excellent heat dissipation.

[0090] Alternatively, the temperature control module 91 can also be linked to the output power of the power device 20. That is, through preset tests, a preset curve is generated to show the relationship between the output power of the power device 20 and the temperature, so as to know the heat generated by the power device 20 at the current output power.

[0091] Thus, when the output power of power device 20 is low and its maximum heat generation is sufficient to meet the minimum heat dissipation requirement of passive cooling, there is no need to start fan 50 and thermoelectric cooler 60. When the output power of power device 20 is high, passive cooling cannot meet the requirements, so fan 50 can be turned on to improve the heat dissipation effect, keeping the power device within a suitable temperature range and achieving a high energy efficiency ratio. When the output power of power device 20 continues to increase, and the started fan 50 is still insufficient to meet the heat dissipation requirements, thermoelectric cooler 60 can be activated to further increase the heat dissipation power, enabling power device 20 to operate stably and continuously at high output levels.

[0092] In some embodiments, such as Figure 7As shown, the heat dissipation control box 100 also includes a first temperature sensor 92 and a second temperature sensor 93. The first temperature sensor 92 is located at the power device 20 and is used to detect the heating temperature of the power device 20. The second temperature sensor 93 is located inside the box 10 and is used to detect the ambient temperature inside the box 10.

[0093] For example, the first temperature sensor 92 can be used to detect the temperature of the power device 20, the heat storage layer 70 and the evaporation end of the heat pipe 30, which is equivalent to detecting the temperature at the power device 20, and there is no limitation thereto.

[0094] The number of second temperature sensors 93 can be one, two, or more. If there is only one second temperature sensor 93, it can be positioned in the enclosure 10 between the power device 20 and the heat sink 40 to detect the average temperature between the two. If there are two second temperature sensors 93, they can be distributed along the diagonal of the enclosure 10. If there are multiple second temperature sensors 93, they can be sequentially positioned at the included angles on the inner side of the enclosure 10. This is used to reflect the overall temperature index inside the enclosure 10.

[0095] In addition, such as Figure 7 As shown, the heat dissipation control box 100 also includes a third temperature sensor 94. The third temperature sensor 94 is located at the heat sink 40 and is used to detect the external ambient temperature of the box 10.

[0096] The temperature control module 91 is communicatively connected to the first temperature sensor 92, the second temperature sensor 93 and the third temperature sensor 94 to collect the corresponding temperature parameters through the above temperature sensors as control indicators for the fan 50 and the semiconductor cooling component 60.

[0097] It should be noted that the temperature control module 91 is preferably connected to the connected sensor, fan 50, and semiconductor cooling component 60 via wireless communication. If the two components need to be connected by wiring on the inner and outer sides of the housing 10, a good sealing structure is required for the wiring holes or wiring locations to meet IP56 or IP67 protection standards.

[0098] Secondly, such as Figure 8 and Figure 9 As shown in the figure, this application embodiment also provides a heat dissipation control method for a heat dissipation control box, applied to the heat dissipation control box in the first aspect. The heat dissipation control method includes the following steps: The first temperature parameters of the power devices are obtained and compared.

[0099] If the first temperature parameter is less than the first threshold, the control fan and semiconductor cooling device are shut down.

[0100] If the first temperature parameter is between the first threshold and the second threshold, the fan is controlled to start.

[0101] If the first temperature parameter is greater than or equal to the second threshold, the control fan and semiconductor cooling device will start.

[0102] After running for the first preset time, the first temperature parameters of the power device are reacquired and compared.

[0103] The second threshold is greater than the first threshold.

[0104] The first temperature parameter is acquired by the first temperature sensor 92 at the power device 20. By comparing the first temperature parameter with a system-preset threshold, when the first temperature parameter is less than the first threshold, the power device 20 has relatively low output power and heat generation. The fan 50 and the semiconductor cooling component 60 do not need to be started; passive cooling through the heat pipe 30 and the heat sink 40 is sufficient to meet the heat dissipation requirements of the power device 20. This heat dissipation process consumes no energy.

[0105] If the first temperature parameter is between the first and second thresholds (i.e., the second temperature parameter is greater than or equal to the first threshold), and the low-temperature parameter is less than the second threshold, then the power device 20 has a relatively high (medium-range) output power and heat generation. At this time, the fan 50 can be started to drive airflow, thereby increasing the airflow speed at the heat pipe 30 and heat sink 40, thus improving their heat dissipation efficiency. This balances the increased heat generation at the power device 20, allowing it to operate stably within a suitable temperature range. Furthermore, the fan 50 has low energy consumption and a high heat dissipation efficiency ratio.

[0106] If the first temperature parameter is greater than or equal to the second threshold, meaning the power device 20 is operating at a high level with greater output power and heat generation, then the fan 50 and the semiconductor cooling device 60 need to be started simultaneously to balance the large heat generation at the power device 20, so that the power device 20 can maintain a stable high-power output operation.

[0107] Based on this, by comparing the first temperature parameter with the first threshold and the second threshold, the heat dissipation control box 100 is made to operate stably in the corresponding heat dissipation state according to the actual temperature of the power device 20. While enabling the power device 20 to continuously and stably output current and voltage, the power consumption during the heat dissipation process can be minimized, resulting in extremely high energy efficiency. In addition, after operating at the corresponding heat dissipation level for a first preset time, the first temperature parameter is repeatedly collected to determine whether the current heat dissipation level meets the requirements.

[0108] The first preset time can be 10-120 seconds. Setting the first preset time to 15 seconds can help improve the system's heat dissipation response speed.

[0109] For example, the first threshold is typically 48-52℃, such as 48℃, 49℃, 50℃, 51℃, or 52℃. The second threshold is typically 63-67℃, such as 63℃, 64℃, 65℃, 66℃, or 67℃. For instance, the first threshold can be set to 50℃ and the second threshold to 65℃ to prevent the temperature inside the enclosure 10 from being too high or too low, so that the power device 20 can operate stably within a suitable temperature range.

[0110] In some embodiments, such as Figure 9 As shown, the heat dissipation control method also includes the following steps: Obtain the second temperature parameter inside the chamber.

[0111] Comparative analysis of the second temperature parameter.

[0112] If the predicted temperature rise rate of the second temperature parameter is greater than the third threshold, the heat dissipation level of the heat dissipation control box is increased and the first preset time is run.

[0113] The second temperature parameter is the internal ambient temperature of the enclosure 10, collected by the second temperature sensor 93. If the value of the second temperature parameter shows a continuous rise in temperature during previous data collection steps, and the rate of temperature rise exceeds a third threshold, it indicates that the heat dissipated from the power device 20 into the enclosure 10 cannot be effectively cooled. This means the current heat dissipation level is insufficient to meet the heat dissipation requirements of the power device 20 and the enclosure 10. Therefore, the heat dissipation level of the heat dissipation control box 100 needs to be increased to improve the efficiency and speed of heat dissipation from the power device 20 and the interior of the enclosure 10, thereby preventing the power device 20 from continuously rising to a high temperature range and affecting its output power.

[0114] Improving the heat dissipation level of the heat dissipation control box 100 includes several methods: For example, increasing the speed of the fan 50 can improve the airflow inside the housing 10 or at the heat sink 40, thereby increasing the cooling rate of the power device 20 and preventing its continuous temperature rise. This helps to reduce and maintain the power device 20 within a suitable temperature range.

[0115] Alternatively, the cooling power of the thermoelectric cooler 60 can be increased to give the cooling side of the thermoelectric cooler 60 a greater cooling capacity, thereby further increasing the cooling rate of the condenser end of the heat pipe 30, so that the refrigerant in the heat pipe 30 has a faster circulation speed, so as to quickly transfer the heat at the power device 20 to the outside of the housing 10.

[0116] It should be noted that the former solution can be applied to the intermediate cooling state where only the fan 50 is activated, as well as the advanced cooling state where both the fan 50 and the thermoelectric cooler 60 are activated simultaneously. The latter solution is only applicable to the advanced cooling state where both the fan 50 and the thermoelectric cooler 60 are activated simultaneously.

[0117] In addition, start the fan 50 or start the semiconductor cooling unit 60.

[0118] For example, if the current heat dissipation control box 100 is in a low-level passive heat dissipation state, the fan 50 can be started through the temperature control module 91 to enter a medium-level heat dissipation state. If the current heat dissipation control box 100 is in a medium-level heat dissipation state, the thermoelectric cooler 60 can be started through the temperature control module 91, so that the fan and the thermoelectric cooler 60 start simultaneously, that is, enter a high-level heat dissipation state to prevent the power device 20 from continuously increasing in temperature.

[0119] Subsequently, after increasing the heat dissipation level of the heat dissipation control box 100 and running it continuously for the first preset time, the first temperature parameter acquisition step is repeated to determine whether the current heat dissipation level meets the requirements.

[0120] For example, during the heat dissipation control process executed by the temperature control module 91, the PID (Proportional-Integral-Derivative) control parameters can be optimized to further improve the system's response speed and stability, employing a PID algorithm for temperature regulation. Specifically, the parameters can be set as follows: proportional coefficient Kp is 2.5, integral coefficient Ki is 0.3, and derivative coefficient Kd is 0.8. After experimental debugging, the system response time is less than 15 seconds, and there is no significant overshoot or oscillation during temperature fluctuations, ensuring the stability and accuracy of temperature control. The temperature control module 91 has a built-in data acquisition module that can filter and correct temperature data from various sensors and calculate the temperature change rate in real time.

[0121] In addition, a display can be configured to allow data to be displayed through a graphical interface. The temperature and operating status of each node can be remotely viewed on an industrial monitoring platform. The built-in software system of the temperature control module 91 can realize automatic mode switching and control through logical judgment.

[0122] Thirdly, such as Figure 10 As shown in the figure, this application embodiment provides a control device for a heat dissipation electrical control box, namely a temperature control module 91. This control module includes a processor 911, a communication interface 912, a memory 913, and a communication bus 914. The processor 911, communication interface 912, and memory 913 communicate with each other via the communication bus 914. The memory 913 is used to store computer programs.

[0123] In one embodiment of this application, when the processor 911 executes the computer program stored in the memory 913, it implements the execution steps of the heat dissipation control method for the heat dissipation control box in the second aspect.

[0124] This application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the execution steps of the heat dissipation control method for the heat dissipation control box as described in the second aspect.

[0125] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also mean including the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0126] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a general-purpose hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the related technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM (Read-Only Memory) / RAM (Random Access Memory), magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or certain parts of embodiments. Although the terms first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or section from another region, layer, or section. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used in this document do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0127] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A heat dissipation electrical control box, characterized in that, include: Box; Power devices are housed within the enclosure; A heat pipe, one end of which is in contact with the power device, and the other end of which is located outside the housing; A heat sink is located on the outside of the housing, and at least one side of the housing is in contact with the heat sink. A fan is disposed inside the housing; and / or the fan is disposed outside the housing and facing the heat sink or the heat pipe. And a semiconductor cooling device, wherein one end of the heat pipe located outside the housing is in contact with at least one of the power devices and connected to the cooling side of the semiconductor cooling device.

2. The heat dissipation electrical control box according to claim 1, characterized in that, Along the first direction, the heat dissipation component is provided on the outer side of the two oppositely arranged side walls of the housing; The number of heat pipes is at least two, and on the outside of the housing, each heat sink is in contact with at least one heat pipe.

3. The heat dissipation electrical control box according to claim 2, characterized in that, The heat sink has a honeycomb structure; along the first direction, one end of the heat sink is in contact with the side wall of the housing, and the other end of the heat sink has a plurality of heat dissipation holes, which are hexagonal in shape.

4. The heat dissipation electrical control box according to claim 2, characterized in that, The semiconductor cooling element is disposed at least on the outside of the housing, and the cooling side of the semiconductor cooling element, the heat pipe and the heat sink are sequentially connected in contact.

5. The heat dissipation electrical control box according to claim 2, characterized in that, The heat pipe is disposed on one side of the heat sink along a second direction, and the second direction has an angle with the first direction; Along the second direction, the heat sink is provided with multiple air duct through holes.

6. The heat dissipation electrical control box according to claim 5, characterized in that, The fan is located at least on the outside of the housing, and the air outlet side of the fan faces the air duct through hole.

7. The heat dissipation electrical control box according to any one of claims 1-6, characterized in that, The heat dissipation electrical control box also includes: A heat storage layer, the heat storage layer being filled with a phase change thermally conductive medium, the heat storage layer being in contact with at least the power device.

8. The heat dissipation electrical control box according to claim 7, characterized in that, The phase change thermally conductive medium includes a composite material of paraffin and expanded graphite; and / or, The heat pipe is disposed between the power device and the heat storage layer.

9. The heat dissipation electrical control box according to any one of claims 1-6, characterized in that, The enclosure is a sealed structure, and the heat dissipation electrical control box includes: A sealing ring is provided in the housing, the heat pipe is inserted into the insertion hole, and the sealing ring is squeezed between the heat pipe and the side wall of the insertion hole. And a packaging component disposed inside the housing to fill the gap between the insertion hole, the sealing ring and the heat pipe.

10. The heat dissipation electrical control box according to any one of claims 1-6, characterized in that, The heat dissipation electrical control box includes: A first temperature sensor is disposed at the power device and is used to detect the heating temperature of the power device; A second temperature sensor is installed inside the enclosure to detect the ambient temperature inside the enclosure. And a temperature control module, which is electrically connected to the first temperature sensor, the second temperature sensor, the fan and the semiconductor refrigeration device.

11. A heat dissipation control method for a heat dissipation electrical control box, applied to the heat dissipation electrical control box as described in any one of claims 1-10, characterized in that, The heat dissipation control method includes: The first temperature parameters of the power devices are obtained and compared. If the first temperature parameter is less than the first threshold, control the fan and the semiconductor cooling device to shut down; If the first temperature parameter is between the first threshold and the second threshold, control the fan to start; If the first temperature parameter is greater than or equal to the second threshold, control the fan and the semiconductor cooling device to start; After running for a first preset time, the first temperature parameter of the power device is reacquired and compared. Wherein, the second threshold is greater than the first threshold.

12. The heat dissipation control method for the heat dissipation electrical control box according to claim 11, characterized in that, The heat dissipation control method includes: Obtain the second temperature parameter inside the chamber; Compare and analyze the second temperature parameter; If the predicted temperature rise rate of the second temperature parameter is greater than the third threshold, the heat dissipation level of the heat dissipation control box is increased and the first preset time is run.

13. The heat dissipation control method for the heat dissipation electrical control box according to claim 12, characterized in that, The first threshold is 50°C, the second threshold is 65°C, and the third threshold is 2°C / min; and / or, Improving the heat dissipation level of the aforementioned heat dissipation control box includes: Start the fan or start the thermoelectric cooler; and / or, Increase the speed of the fan; and / or, Increase the cooling power of the semiconductor cooling device.

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