Electronic device and method of manufacturing the same
By setting a reinforcement layer on the second surface of the redistribution layer and forming an opening in the encapsulation material, the problem of components that cannot be replaced after encapsulation in FO-MCM is solved, resulting in cost reduction and yield improvement, while also enhancing the mechanical strength and reliability of electronic devices.
CN122373868APending Publication Date: 2026-07-10ADVANCED SEMICON ENG INC
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ADVANCED SEMICON ENG INC
- Filing Date
- 2025-12-25
- Publication Date
- 2026-07-10
AI Technical Summary
Technical Problem
Traditional fan-out multi-chip modules (FO-MCMs) cannot replace damaged components after packaging, resulting in high costs and low yields.
Method used
A reinforcement layer is provided on the second surface of the redistribution layer, and an opening is formed in the encapsulation material to delay the placement step of the package, allowing for electrical testing and early defect detection after molding, while the reinforcement layer enhances the mechanical strength and structural integrity of the carrier.
Benefits of technology
It reduces manufacturing costs, improves production yield, enhances the durability and reliability of electronic devices, and reduces the risk of mechanical failure during transportation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122373868A_ABST
Abstract
An electronic device is provided. The electronic device includes a redistribution layer having a first surface and a second surface opposite the first surface; an electronic component disposed on the first surface of the redistribution layer; and a reinforcement layer disposed on the second surface of the redistribution layer. A method of manufacturing an electronic device is also provided.
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