Information processing apparatus and method of generating model data

Abstract

An information processing apparatus generates model data based on captured data obtained by a two-dimensional camera capturing a plurality of elements of the same kind placed at a plurality of positions on a table, the two-dimensional camera being fixedly provided at a predetermined position at a predetermined height on the table.

Description

Technical Field

[0001] This invention relates to an information processing apparatus for generating model data for identifying components on a workbench, etc. Background Technology

[0002] The following patent document describes model data for identifying components on a workbench.

[0003] Existing technical documents

[0004] Patent Document 1: International Publication No. 2015 / 097904 Summary of the Invention

[0005] The problem that the invention aims to solve

[0006] The objective of this invention is to appropriately generate model data for identifying components on a workbench.

[0007] Methods for solving problems

[0008] To address the aforementioned issues, this specification discloses an information processing apparatus that generates model data based on image data obtained by a two-dimensional camera capturing images of multiple elements of the same type placed at multiple locations on a worktable. The two-dimensional camera is fixedly positioned at a predetermined height on the worktable.

[0009] Furthermore, this specification discloses a method for generating model data to identify multiple identical components scattered on a workbench. The method for generating the model data performs the following steps: a component placement step, in which the same type of component is placed one by one at multiple different positions on the workbench in the same posture; and a component imaging step, in which a two-dimensional camera fixedly mounted at a predetermined height and predetermined position on the workbench is used to take a picture of the same type of component placed at multiple different positions on the workbench in the same posture. The data for identifying the components whose number of identifiable components exceeds a predetermined number from the components of the same type and posture captured in the component imaging step is determined as model data for identifying multiple identical components scattered on the workbench.

[0010] Invention Effects

[0011] According to this disclosure, a two-dimensional camera is fixedly positioned at a predetermined height on a worktable to capture images of multiple components of the same type placed at multiple locations on the worktable, and model data is generated based on the captured data. Thus, model data for identifying components on the worktable can be appropriately generated. Attached Figure Description

[0012] Figure 1 It is a 3D view of a component mounting machine.

[0013] Figure 2 This is a three-dimensional view of the component mounting device of the component mounting machine.

[0014] Figure 3 It is a three-dimensional view of the bulk component supply device.

[0015] Figure 4 This is a 3D view of the component supply unit.

[0016] Figure 5 This is a perspective view of the component supply unit.

[0017] Figure 6 This is a perspective view of the component supply unit.

[0018] Figure 7 It is a three-dimensional diagram of the component dispersion device.

[0019] Figure 8 It is a three-dimensional diagram of the component dispersion device.

[0020] Figure 9 This is a 3D view of the component holding head.

[0021] Figure 10 This is a diagram of a component receiving part that houses electronic circuit components.

[0022] Figure 11 This is a block diagram of the control device for the component mounting machine.

[0023] Figure 12 It is a diagram showing lead elements of the same shape scattered on a workbench.

[0024] Figure 13 It is a graph representing the model data used for pattern matching.

[0025] Figure 14 This is a schematic diagram of a two-dimensional camera used to take pictures of multiple lead-wire components placed at different positions on a worktable.

[0026] Figure 15 This is a schematic diagram of a two-dimensional camera that takes pictures using a lead-wire element illuminated by LED lights located on the side.

[0027] Figure 16 This is a schematic diagram of a two-dimensional camera that takes pictures using a lead-wire element illuminated by LED lights located on the side.

[0028] Figure 17 It is a diagram showing leaded components mounted in the same orientation at five locations on a workbench.

[0029] Figure 18This refers to the five parts on the workbench in relation to... Figure 17 The diagram shows lead elements mounted in different orientations.

[0030] Figure 19 This refers to the five parts on the workbench in relation to... Figure 17 and Figure 18 The diagram shows lead elements mounted in different orientations.

[0031] Figure 20 This refers to the five parts on the workbench in relation to... Figures 17 to 19 The diagram shows lead elements mounted in different orientations.

[0032] Figure 21 This is a diagram showing the 20 types of lead elements used for pattern matching when generating candidate model data.

[0033] Figure 22 This graph represents the correlation values ​​of candidate model data for pattern matching using lead elements with an edge level of 50 and a center position of 270° on the worktable.

[0034] Figure 23 This plot represents the average of the correlation values ​​when pattern matching was performed using 16 candidate models.

[0035] Figure 24 This is a diagram showing the five lead elements used for pattern matching when generating candidate first model data during the generation of first model data.

[0036] Figure 25 This is a graph showing the correlation values ​​of candidate model data for pattern matching using a lead element with an edge level of 200 and a position of 180° to the lower right of the worktable.

[0037] Figure 26 It is a graph representing the average of the correlation values ​​when pattern matching was performed using 20 candidates from the first model data.

[0038] Figure 27 This is a diagram showing two types of lead elements used for pattern matching when generating candidates for the second model data.

[0039] Figure 28 This is a graph showing the correlation values ​​of candidate pattern matching for a second model data using a lead element with an edge level of 100 and a pose of 270° to the lower right of the worktable.

[0040] Figure 29 This plot represents the average of the correlation values ​​when pattern matching was performed using eight candidates from the second model data. Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as a means of carrying out the present invention.

[0042] Figure 1 This refers to a component mounting machine 10. The component mounting machine 10 is a device for performing the mounting operation of components relative to a circuit substrate 12. The component mounting machine 10 includes: a main body 20, a substrate conveying and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see reference). Figure 11 34. In addition, as a circuit substrate 12, examples include circuit boards and three-dimensional structure substrates, and as a circuit board, examples include printed wiring boards and printed circuit boards.

[0043] The main body 20 of the device consists of a frame 40 and beams 42 mounted on the frame 40. A substrate conveying and holding device 22 is disposed at the center of the frame 40 in the front-rear direction, and includes a conveying device 50 and a clamping device 52. The conveying device 50 is used to convey the circuit substrate 12, and the clamping device 52 is used to hold the circuit substrate 12. Thus, the substrate conveying and holding device 22 conveys the circuit substrate 12 and holds it fixedly at a predetermined position. Furthermore, in the following description, the conveying direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to this direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

[0044] The component mounting device 24 is mounted on the beam 42 and includes two working heads 60 and 62 and a working head moving device 64. Each working head 60 and 62 has a suction nozzle (see reference). Figure 2 )66, the component is held by the suction nozzle 66. Additionally, the working head moving device 64 includes: an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Furthermore, via the X-direction moving device 68 and the Y-direction moving device 70, the two working heads 60 and 62 can be moved integrally to any position on the frame 40. Furthermore, as Figure 2 As shown, each working head 60, 62 is detachably mounted on the sliding members 74, 76, and the Z-direction moving device 72 allows the sliding members 74, 76 to move independently in the vertical direction. That is, the working heads 60, 62 can move independently in the vertical direction via the Z-direction moving device 72.

[0045] The imaging device 26 is mounted downwards on the slider 74 and moves together with the working head 60 in the X, Y, and Z directions. Thus, the imaging device 26 can capture images of any position on the frame 40. Figure 1As shown, the imaging device 28 is positioned between the substrate conveying and holding device 22 and the component supply device 30 on the frame 40, facing upwards. Thus, the imaging device 28 captures images of the components held in the suction nozzle 66 of the working heads 60 and 62.

[0046] The component supply device 30 is disposed at one end of the frame 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device for supplying components placed on a tray. The feeder-type component supply device is a device for supplying components by means of a belt feeder (not shown) or a rod feeder (not shown).

[0047] The bulk component supply device 32 is disposed at the end of the other side in the front-rear direction of the frame 40. The bulk component supply device 32 is a device that arranges multiple components in a disordered state into a neat and orderly arrangement and supplies components in this arrangement. That is, it is a device that arranges multiple components in an arbitrary orientation into a predetermined orientation and supplies components in that predetermined orientation. The structure of the component supply device 32 will be described in detail below. Furthermore, examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0048] like Figure 3 As shown, the bulk component supply device 32 includes: a main body 80, a component supply unit 82, a shooting device 84, and a component transfer device 86.

[0049] The component supply unit 82 includes: a component feeder 88 and a component dispensing device (see reference). Figure 4 )90 and component return device (refer to Figure 4 )92, these component suppliers 88, component distribution devices 90 and component return devices 92 are integrally formed. The component supply unit 82 is assembled in a detachable manner on the base 96 of the main body 80. In the bulk component supply device 32, five component supply units 82 are arranged in a row in the X direction.

[0050] The component feeder 88 is roughly in the shape of a rectangular box, such as... Figure 4 and Figure 5 As shown, it is arranged in a manner that extends along the Y direction. In addition, the Y direction is described as the front-back direction of the component feeder 88. In the component supply unit 82, the direction to the side where the component return device 92 is provided is described as front, and the direction to the side where the component feeder 88 is provided is described as rear.

[0051] The component feeder 88 has openings on its upper and front surfaces. The opening on the upper surface serves as a component inlet 97, and the opening on the front surface serves as a component outlet 98. An inclined plate 104 is disposed below the inlet 97 in the component feeder 88. The inclined plate 104 is arranged to tilt downwards as it approaches the center from the rear end face of the component feeder 88.

[0052] In addition, such as Figure 5 As shown, a conveyor device 106 is disposed on the front side of the inclined plate 104. The conveyor device 106 is disposed such that it tilts upward as it approaches the front of the component feeder 88 from the front end of the inclined plate 104. Furthermore, the conveyor belt 112 of the conveyor device 106... Figure 5 The conveyor rotates counterclockwise. That is, the conveying direction of the conveyor device 106 is from the front end of the inclined plate 104 forward and diagonally upward.

[0053] Additionally, an inclined plate 126 is provided below the front end of the conveyor device 106. The inclined plate 126 is positioned from the front end face of the component feeder 88 toward the lower part of the conveyor device 106, with its rear end inclined downwards. Furthermore, an inclined plate 128 is also provided below the inclined plate 126. The inclined plate 128 is inclined from the lower part of the center of the conveyor device 106 toward the outlet 98 of the component feeder 88 with its front end positioned below.

[0054] In addition, such as Figure 4 As shown, a pair of side frames 130 are assembled on the base 96. The pair of side frames 130 are parallel to each other and are erected in a facing state, extending along the Y direction. Furthermore, the distance between the pair of side frames 130 is slightly larger than the width dimension of the component feeder 88, and the component feeder 88 is detachably mounted between the pair of side frames 130.

[0055] The component dispensing device 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 consists of a worktable 156 and a pair of sidewall portions 158. The worktable 156 is generally elongated and plate-shaped, arranged to extend forward from below the component feeder 88 mounted between a pair of side frames 130. Furthermore, the upper surface of the worktable 156 is generally horizontal. Figure 5 As shown, it is arranged with a slight gap at the front end of the inclined plate 128 of the component feeder 88. Additionally, as... Figure 4 As shown, a pair of sidewall portions 158 are fixed to both sides of the worktable 156 in a vertical position along its length, and the upper end of each sidewall portion 158 extends upward beyond the upper surface of the worktable 156.

[0056] Additionally, the component support moving device 152 is connected via a cylinder (see reference). Figure 11 The operation of 166 causes the component support member 150 to slide along the Y direction. At this time, the component support member 150 is in a stored state below the component feeder 88 (see reference). Figure 6 ) and the exposed state from below the component feeder 88 (refer to Figure 5 Move between ).

[0057] like Figure 7 As shown, the component return device 92 includes a component receiving container 180 and a container swinging device 181. The component receiving container 180 is generally box-shaped with a rounded bottom surface. The component receiving container 180 is held at the front end of the worktable 156 of the component support member 150 in a swingable manner, and is swinged by the operation of the container swinging device 181. At this time, the component receiving container 180 is in a receiving posture with the opening facing upward (see reference). Figure 7 The return posture of the worktable 156 with the opening facing the upper surface of the component support member 150 (see reference). Figure 8 It swings between ).

[0058] like Figure 3 As shown, the imaging device 84 includes: a two-dimensional camera 290, a camera moving device 292, and an LED light (see reference). Figure 11 )294. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the component feeder 88, extending along the width direction (X direction) of the bulk component feeder 32. The slider 298 is slidably mounted on the guide rail 296 and is powered by an electromagnetic motor (see reference 294). Figure 11 The 290 slides to any position as it operates. The 2D camera 290 is mounted on the slider 298 with its orientation downwards. Furthermore, the 2D camera 290 is not a 3D camera capable of detecting height and depth information of a three-dimensional object, nor is it a camera equipped with a 3D image processing device; rather, it is a camera that captures 2D images of objects whose height and depth information cannot be detected. In other words, the 2D camera 290 captures 2D images of three-dimensional components projected onto the XY plane. Additionally, the 2D camera 290 uses a standard lens—a lens with a field of view that is not 0 degrees—instead of a telecentric lens with the aperture stop located at the focal point. The LED light 294 serves as the light source for the 2D camera 290 and is located on the side of the component junction device 86 beside the 2D camera 290. That is, the 2D camera 290 captures 2D images of objects illuminated from the side by the LED light 294.

[0059] like Figure 3As shown, the component transfer device 86 includes: a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

[0060] The component holding head moving device 300 includes: an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 disposed above the component supply unit 82 extending along the X-direction. The Y-slider 316 is driven by an electromagnetic motor (see reference...). Figure 11 Driven by an electromagnetic motor (see reference 319), the X-direction moving device 310 moves to any position in the Y direction. The X-direction moving device 310 has an X-slider 320 disposed on the side of the Y-slider 316, and the X-slider 320 is driven by an electromagnetic motor (see reference 319). Figure 11 Driven by an electromagnetic motor (see reference 321), the Z-direction moving device 314 moves to any position in the X direction. The Z-direction moving device 314 has a Z-slider 322 disposed on the side of the X-slider 320, and the Z-slider 322 is driven by an electromagnetic motor (see reference 321). Figure 11 Driven by )323, it moves to any position in the Z direction.

[0061] like Figure 9 As shown, the component holding head 302 includes: a head body 330, a nozzle 332, a nozzle rotating device 334, and a nozzle rotating device 335. The head body 330 is integrally formed with the Z-slider 322. The nozzle 332 is a holding element, detachably mounted on the lower end of the holding member 340. The holding member 340 is bendable at the support shaft 344, and bends 90 degrees upward by the operation of the nozzle rotating device 334. Thus, the nozzle 332, mounted on the lower end of the holding member 340, rotates 90 degrees to a rotating position. That is, the nozzle 332 rotates between a non-rotating position and a rotating position by the operation of the nozzle rotating device 334. Alternatively, it can be stopped at the angle between the non-rotating position and the rotating position. Furthermore, the nozzle rotating device 335 rotates the nozzle 332 about its axis.

[0062] In addition, such as Figure 3 As shown, the two shuttle devices 304 each include a component carrier 388 and a component carrier moving device 390, which are fixed side by side to the main body 80 in the lateral direction on the front side of the component supply unit 82. On the component carrier 388, five component receiving parts 392 are installed in a row in the lateral direction, and components are placed on each component receiving part 392.

[0063] Furthermore, the bulk component supply device 32 can supply various components, and the component receiving part 392 is prepared with various structures according to the shape of the component. Here, as an electronic circuit component supplied by the bulk component supply device 32, such as... Figure 10As shown, a component receiving component 392 corresponding to the lead element 410 with leads is illustrated. The lead element 410 is composed of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.

[0064] Furthermore, the component receiving member 392 has a component receiving recess 416 with a shape corresponding to the lead element 410. The component receiving recess 416 is a stepped recess, consisting of a main body receiving recess 418 that opens on the upper surface of the component receiving member 392 and a lead receiving recess 420 that opens on the bottom surface of the main body receiving recess 418. The lead element 410 is inserted into the component receiving recess 416 with the lead 414 facing downward. Thus, with the lead 414 inserted into the lead receiving recess 420 and the component body 412 inserted into the main body receiving recess 418, the lead element 410 is placed inside the component receiving recess 416.

[0065] In addition, such as Figure 3 As shown, the component carrier moving device 390 is a plate-shaped elongated component, disposed on the front side of the component supply unit 82 in a manner extending in the front-rear direction. On the upper surface of the component carrier moving device 390, the component carrier 388 is disposed in a manner that allows it to slide in the front-rear direction, via an electromagnetic motor (see reference). Figure 11 Driven by component carrier 388, it slides to any position in the front-to-back direction. Additionally, when component carrier 388 slides towards component supply unit 82, it slides to a component receiving position within the movement range of component holding head 302 of component holding head moving device 300. Conversely, when component carrier 388 slides away from component supply unit 82, it slides to a component supply position within the movement range of working heads 60, 62 of working head moving device 64.

[0066] In addition, such as Figure 11As shown, the control device 34 includes: a general control device 450, multiple individual control devices (only one is shown in the figure) 452, and an image processing device 454. The general control device 450 is primarily composed of a computer and is connected to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. Thus, the general control device 450 provides overall control of the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. The multiple individual control devices 452 are primarily composed of computers and are correspondingly arranged to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure).

[0067] The individual control unit 452 of the bulk component supply device 32 is connected to the imaging device 84, the component dispersing device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. Thus, the individual control unit 452 of the bulk component supply device 32 controls the imaging device 84, the component dispersing device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. Furthermore, the image processing device 454 is connected to the two-dimensional camera 290 and processes the image data captured by the two-dimensional camera 290. This image processing device 454 is connected to the individual control unit 452 of the bulk component supply device 32. Thus, the individual control unit 452 of the bulk component supply device 32 acquires the image data captured by the two-dimensional camera 290.

[0068] In addition, the bulk component supply device 32 has a storage device 458. This storage device 458 is connected to a separate control device 452 and stores various information according to instructions from the separate control device 452.

[0069] The component mounting machine 10, using the structure described above, performs component mounting operations on the circuit substrate 12 held by the substrate conveying and holding device 22. Specifically, the circuit substrate 12 is conveyed to the working position, where it is fixedly held by the clamping device 52. Next, the imaging device 26 moves above the circuit substrate 12 and images it. This obtains information related to the error in the holding position of the circuit substrate 12. Additionally, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. The component supply performed by the bulk component supply device 32 will be described in detail later. Furthermore, either the working head 60 or 62 moves above the component supply position and holds the component via the suction nozzle 66. Then, the working head 60 or 62 holding the component moves above the imaging device 28, which images the component held at the suction nozzle 66. This obtains information related to the error in the holding position of the component. Furthermore, the working heads 60 and 62 holding the components move above the circuit substrate 12 to correct errors in the holding position of the circuit substrate 12 and the holding position of the components, and then install the held components onto the circuit substrate 12.

[0070] Next, the supply of components by the bulk component supply device 32 will be described. In the bulk component supply device 32, lead wire components 410 are fed in by the operator from the input port 97 of the component feeder 88. The fed lead wire components 410 are supplied in the state of the component receiving component 392 placed on the component carrier 388 by the operation of the component supply unit 82 and the component transfer device 86.

[0071] In detail, the operator inserts multiple lead elements 410 of the same type, i.e., multiple lead elements 410 of the same shape, into the input port 97 on the upper surface of the component feeder 88. At this time, the component support member 150 moves downward toward the component feeder 88 through the action of the component support member moving device 152, and is in a stored state (see reference). Figure 6 In addition, when the component support member 150 is stored, the component receiving container 180 disposed at the front end of the component support member 150 is located in front of the component feeder 88, and the opening of the component receiving container 180 is facing upward (receiving posture).

[0072] Lead components 410 fed from the inlet 97 of the component feeder 88 fall onto the inclined plate 104 of the component feeder 88, rolling down to the lower end of the front side of the inclined plate 104. At this time, the lead components 410 that have rolled down to the lower end of the front side of the inclined plate 104 accumulate between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyor device 106. Furthermore, the conveyor belt 112 of the conveyor device 106... Figure 6The lead elements 410, which are stacked between the inclined plate 104 and the conveyor belt 112, are thus conveyed obliquely upward by the conveyor belt 112.

[0073] Furthermore, the lead element 410, conveyed by the conveyor belt 112, falls from the upper end of the front side of the conveyor device 106 onto the inclined plate 126. The lead element 410, falling onto the inclined plate 126, rolls backward onto the inclined plate 128. The lead element 410, falling onto the inclined plate 128, rolls forward and is discharged from the discharge port 98 on the front side of the element feeder 88.

[0074] Thus, the lead element 410 discharged from the outlet 98 of the component feeder 88 is housed inside the component housing container 180. Furthermore, when a predetermined amount of lead element 410 has been discharged from the component feeder 88, that is, when the conveyor device 106 has operated for a certain period, the conveyor device 106 stops. Next, the component support member 150 moves forward from its stored state via the operation of the component support member moving device 152.

[0075] Furthermore, at the predetermined point in time when the component support member 150 has moved forward from the stored state, the container swinging device 181 of the component return device 92 operates, and the component receiving container 180 swings. As a result, the posture of the component receiving container 180 changes abruptly from a posture with the opening facing upwards (receiving posture) to a posture with the opening facing the worktable 156 (returning posture). At this time, the lead element 410 housed in the component receiving container 180 is violently released towards the worktable 156. Thus, as... Figure 12 As shown, lead elements 410 of the same shape are distributed from the element receiving container 180 on the worktable 156.

[0076] Furthermore, lead elements 410 of the same shape are distributed on the worktable 156, but the lead elements 410 are distributed on the worktable 156 in approximately four postures. Specifically, as a first posture, the lead elements 410 are distributed with the extended surfaces of the leads 414 facing to the side and the two leads 414 being side by side in a generally horizontal direction. As a second posture, the lead elements 410 are distributed with the extended surfaces of the leads 414 facing to the side and the two leads 414 being side by side in a generally vertical direction. As a third posture, the lead elements 410 are distributed with the extended surfaces of the leads 414 facing upwards. As a fourth posture, the lead elements 410 are distributed with two or more lead elements 410 overlapping. In addition, the four positions in which the lead element 410 is dispersed are described as the first position of lead element 410a, the second position of lead element 410b, the third position of lead element 410c, and the fourth position of lead element 410d.

[0077] When the lead elements 410 are distributed on the worktable 156 as described above, the two-dimensional camera 290 of the imaging device 84 moves upward toward the element support member 150 by the operation of the camera moving device 292. Furthermore, the two-dimensional camera 290 captures images of the lead elements 410 of the same shape distributed on the worktable 156. In addition, the field of view, i.e., the shooting range, of the two-dimensional camera 290 is wider than that of the worktable 156, so the two-dimensional camera 290 captures the entire worktable 156, i.e., all the lead elements 410 distributed on the worktable 156, at once. That is, the two-dimensional camera 290 captures images at once while all the lead elements 410 distributed on the worktable 156 are included in the shooting range. Furthermore, while the two-dimensional camera 290 is capturing images of the lead elements 410 on the worktable 156, the LED light 294 illuminates the upper surface of the worktable 156. Based on the shooting data captured by the two-dimensional camera 290, the individual control device 452 determines the lead element to be picked up using a pattern matching method.

[0078] Specifically, the independent control device 452 determines the outline (contour) of the lead element 410 based on the image data captured by the two-dimensional camera 290, and calculates the shape of the upper surface of the lead element 410, that is, the shape of the lead element 410 from a top viewpoint. On the other hand, as Figure 13 As shown, the storage device 458 stores model data corresponding to the outline of the lead element 410a in the first posture.

[0079] Furthermore, the individual control device 452 calculates the shape of the upper surface of the lead element 410 based on the image data captured by the two-dimensional camera 290, and determines whether the calculated shape of the upper surface of the lead element 410 is consistent with the model data stored in the storage device 458. If the calculated shape of the upper surface of the lead element 410 is consistent with the model data, the individual control device 452 sets the lead element 410 with the shape of its upper surface as the element to be picked up.

[0080] That is, the lead element 410a in the first posture is set as the element to be picked up, while the lead elements 410b in the second posture, 410c in the third posture, and 410d in the fourth posture are not set as elements to be picked up. This is because, in the lead element 410b in the second posture, the area of ​​the upper surface is small, so the lead element 410b cannot be properly held by the suction nozzle 332. In addition, in the lead element 410c in the third posture, the lead 414 is provided on the upper surface, and the lead 414 becomes an obstacle, so the lead element 410c cannot be properly held by the suction nozzle 332. In addition, in the lead element 410d in the fourth posture, due to reasons such as the upper surface of the lead element 410d not being horizontal, the lead element 410d cannot be properly held by the suction nozzle 332.

[0081] Furthermore, the individual control device 452 calculates the position information of the lead element 410, which is set as the object to be picked up, based on the captured data. Then, based on the calculated position information of the object to be picked up, the element holding head 302 moves above the object to be picked up by the operation of the element holding head moving device 300, and the suction nozzle 332 adsorbs and holds the object to be picked up. Additionally, when the object to be picked up is adsorbed and held by the suction nozzle 332, the suction nozzle 332 is in a non-rotating position.

[0082] Next, after the suction nozzle 332 holds the component to be picked up, namely the lead element 410, the component holding head 302 moves upward toward the component carrier 388. At this time, the component carrier 388 moves to the component receiving position by the operation of the component carrier moving device 390. In addition, as the component holding head 302 moves upward toward the component carrier 388, the suction nozzle 332 rotates to a rotating position. Furthermore, the suction nozzle 332 rotates by the operation of the suction nozzle rotating device 335, so that the lead 414 of the lead element 410 held in the rotating position of the suction nozzle 332 is oriented downward in the vertical direction.

[0083] When the component holding head 302 moves above the component carrier 388, the component holding head 302 descends, inserting the lead element 410, with the lead 414 facing downwards in the vertical direction, into the component receiving recess 416 of the component receiving member 392. Thus, as... Figure 10 As shown, lead element 410 is placed on element receiving member 392 with lead 414 facing downward in the vertical direction.

[0084] Furthermore, when the lead element 410 is placed on the component receiving member 392, the component carrier 388 moves to the component supply position by the operation of the component carrier moving device 390. The component supply position is located within the movement range of the working heads 60, 62, so in the bulk component supply device 32, the lead element 410 is supplied to the component mounting machine 10 at this position. Thus, in the bulk component supply device 32, the individual control device 452 determines the component to be picked up from the multiple lead elements 410 dispersed on the worktable 156 based on a model data, and the component holding head 302 holds the lead element 410 determined to be the component to be picked up and places it on the component receiving member 392, thereby supplying the lead element 410.

[0085] Therefore, it is necessary to properly determine the components to be picked up from the multiple leaded components 410 scattered on the worktable 156 based on model data. However, in the bulk component supply device 32, the components to be picked up are determined based on the image data captured by the two-dimensional camera 290, and therefore, the components to be picked up may not be properly determined due to the parallax of the two-dimensional camera 290.

[0086] In detail, such as Figure 14 As shown, the 2D camera 290 is fixedly positioned at a predetermined height on the worktable 156, for example, above the center of the worktable 156. Furthermore, the 2D camera 290 can be moved to any position in the X direction from the predetermined height by the camera moving device 292, but when photographing multiple lead elements dispersed on the worktable, it stops above the center of the worktable 156, thus being fixedly positioned at the predetermined height above the center of the worktable 156. The 2D camera 290 photographs multiple lead elements 410 dispersed at multiple positions on the worktable 156 at a time. For example, when the 2D camera 290 photographs lead elements 410A and 410B at a time, the image obtained from photographing lead element 410A shows the surface 460 from which the lead 414 extends, but the image obtained from photographing lead element 410B shows the surface 462 on the opposite side to the surface 460 from which the lead 414 extends. Therefore, the image obtained by photographing lead element 410A and the image obtained by photographing lead element 410B have different shapes. Thus, when a two-dimensional camera 290 positioned at a fixed location photographs multiple objects at different locations, the images of the objects become different shapes. However, the differences in the images of the objects at different locations are not large, but rather relatively small. However, even with such small differences, it may be impossible to properly identify the element to be picked up from the multiple lead elements 410 scattered at different locations on the worktable 156.

[0087] Additionally, the LED light 294, which illuminates the object being photographed by the 2D camera 290, shines light from the side of the 2D camera 290 onto the worktable 156. The light reflected from the LED light 294 varies depending on the orientation of the lead element 410. Specifically, for example, as... Figure 15 As shown, when the 2D camera 290 photographs the lead elements 410C, which are distributed on the worktable 156 with the lead wires 414 facing the opposite side to the LED light 294, the 2D camera 290 captures the reflected light 470 obtained by the lead elements 410C reflecting the light irradiated by the LED light 294. On the other hand, for example, as... Figure 16 As shown, when the 2D camera 290 photographs lead elements 410D dispersed on the worktable 156 with their leads 414 facing the LED lamp 294, the 2D camera 290 photographs the reflected light 480 obtained by the lead elements 410D reflecting the light irradiated by the LED lamp 294. Thus, the reflected light 470 reflected by the lead elements 410C is different from the reflected light 480 reflected by the lead elements 410D. Therefore, the image obtained by photographing the reflected light 470 reflected by the lead elements 410C is different from the image obtained by photographing the reflected light 480 reflected by the lead elements 410D. Thus, when photographing objects with different postures using side-illuminated light as the light source, the images obtained from photographing the objects are different in shape. However, the difference in the images obtained from photographing objects with different postures is not a large difference, but a relatively small one. However, even a relatively small difference may make it difficult to properly identify the element to be picked up from the multiple lead elements 410 dispersed on the worktable 156 with different postures.

[0088] As a countermeasure, it is conceivable to lower the judgment criterion when identifying the element to be picked from multiple lead elements 410 scattered on the worktable 156 using pattern matching. Specifically, in pattern matching, a separate control device 452 determines the outline (contour) of the lead element 410 based on the image data of the lead element 410 captured by the two-dimensional camera 290, and calculates the correlation value between the outline of the lead element 410 and the outline of the model data. The correlation value is the similarity rate between the outline of the lead element 410 and the outline of the model data. The correlation value is 100 when the outline of the lead element 410 is completely consistent with the outline of the model data, and 0 when the outline of the lead element 410 is completely inconsistent with the outline of the model data. That is, the higher the correlation value, the more similar the outline of the lead element 410 is to the outline of the model data, and the lower the correlation value, the less similar the outline of the lead element 410 is to the outline of the model data. Therefore, for example, if the correlation value between the outline of the lead element 410, which is determined to be a pickup object, and the outline of the model data is 90 or higher, they are very similar to each other, and the individual control device 452 determines the lead element 410 as a pickup object. However, as mentioned above, the difference between the images of multiple photographed objects at different positions is relatively small, and the difference between the images of multiple photographed objects at different poses is also relatively small. Therefore, for example, if the threshold of the correlation value is lowered, it is possible to determine the element as a pickup object while allowing for relatively small differences. Specifically, for example, the individual control device 452 can also determine the lead element 410, which has a correlation value of 70 or higher, as a pickup object. However, when pattern matching is performed by lowering the threshold of the correlation value, it is possible to determine the lead element 410, which is a holding object, as a pickup object if it is slightly tilted and cannot be held by the nozzle 332. Therefore, it is not ideal to perform pattern matching of elements by lowering the threshold of the correlation value.

[0089] As a countermeasure, in the component mounting machine 10, model data is generated based on imaging data of multiple leaded components 410 placed at multiple positions on the worktable 156 in the same first posture and imaging data of multiple leaded components 410 placed at multiple positions on the worktable 156 in postures different from the first posture. Specifically, as Figure 17 As shown, the operator places five lead-wire components 410 in the same orientation at five locations on the workbench 156 (center, lower right, lower left, upper right, and upper left). At this time, the operator places the five lead-wire components 410 on the workbench in the same orientation, with the extended faces of the lead wires 414 of the lead-wire components 410 facing the same direction. In other words, the operator places the five lead-wire components 410 on the workbench in the same orientation, with the lead wires 414 of the lead-wire components 410 extending in the same direction. Furthermore, in... Figure 17In this process, the direction in which the lead wire 414 of the lead element 410 extends is set to 0°. Furthermore, the two-dimensional camera 290 takes a single image of the five lead elements 410 mounted on the worktable with the lead wire 414 extending at 0°.

[0090] In addition, such as Figure 18 As shown, the operator places five lead wire elements 410 at five locations on the worktable 156 (center, lower right, lower left, upper right, and upper left) in a position where the direction of the lead wire 414 extends from 0° to a counterclockwise rotation of 90°. Furthermore, the direction of the lead wire 414 extending from 0° to a counterclockwise rotation of 90° is set to 90°. The 2D camera 290 then captures a single image of the five lead wire elements 410 mounted on the worktable 156 in a 90° direction with the lead wire 414 extending.

[0091] In addition, such as Figure 19 As shown, the operator places five lead wire elements 410 at five locations on the worktable 156 (center, lower right, lower left, upper right, and upper left) in a position where the direction of the lead wire 414 extends from 0° to a counterclockwise rotation of 180°. Furthermore, the direction of the lead wire 414 extending from 0° to a counterclockwise rotation of 180° is set to 180°. The 2D camera 290 then captures a single image of the five lead wire elements 410 mounted on the worktable 156 in a position where the lead wire 414 extends 180°.

[0092] In addition, such as Figure 20 As shown, the operator places five lead wire elements 410 at five locations on the worktable 156 (center, lower right, lower left, upper right, and upper left) in a position where the direction of the lead wire 414 extends from 0° to a counterclockwise rotation of 270°. Furthermore, the direction of the lead wire 414 extending from 0° to a counterclockwise rotation of 270° is set to 270°. The 2D camera 290 then captures a single image of the five lead wire elements 410 mounted on the worktable 156 in a position where the lead wire 414 extends at a 270° angle.

[0093] In addition, the following will be Figure 17 The lead element 410, which is placed on the worktable 156 at a 0° angle with the direction of the lead 414 extending from it, is described as a lead element with a 0° angle at the center of the worktable. Additionally, [the text abruptly ends here]. Figure 18 The lead element 410, which is placed on the worktable 156 at a 90° angle to the lower right of the worktable 156 in the direction of the lead 414, is described as a lead element positioned at a 90° angle to the lower right of the worktable. Additionally, for example, in... Figure 19The lead element 410, which is placed on the worktable 156 at a position extending 180° in the direction of the lead wire 414 extending from the lower left, is described as a lead element positioned at 180° in the lower left of the worktable. Additionally, [the text abruptly ends here]. Figure 20 The lead element 410, which is placed on the upper right of the worktable 156 in a position extending 270° in the direction of the lead 414, is described as a lead element with a position of 270° on the upper right of the worktable.

[0094] Thus, when the 290 pairs of two-dimensional cameras are placed on Figures 17-20 When photographing multiple lead-wire elements in the same orientation on the worktable 156 shown, such as... Figure 21 As shown, imaging data for 20 types of lead elements 410 are generated. These 20 types of imaging data for lead elements 410 are imaging data for lead elements 410 with at least one different orientation or placement position.

[0095] Additionally, the individual control device 452 generates candidate model data based on image data of lead elements with a center orientation of 0°, 90°, 180°, and 270° on the worktable. At this time, the individual control device 452 generates candidate model data with four edge levels: 50, 100, 200, and 300. Specifically, the model data of the lead element corresponds to the outline of the lead element; therefore, when generating model data, the individual control device 452 determines the outline of the lead element based on the image data of the lead element. At this time, the individual control device 452 defines the boundary line between the worktable 156 and the lead element as the outline of the lead element. Furthermore, the individual control device 452 defines the portion in the image data of the lead element where the brightness difference between adjacent pixels is greater than or equal to the edge level as the boundary line between the worktable 156 and the lead element, thus defining it as the outline of the lead element. For example, when the edge level is 50, the individual control device 452 determines the portion of the image data of the lead element where the brightness difference between adjacent pixels is 50 or more as the outline of the lead element. Similarly, when the edge level is 100, the individual control device 452 determines the portion of the image data of the lead element where the brightness difference between adjacent pixels is 100 or more as the outline of the lead element. Furthermore, when the edge level is 200, the individual control device 452 determines the portion of the image data of the lead element where the brightness difference between adjacent pixels is 200 or more as the outline of the lead element. Finally, when the edge level is 300, the individual control device 452 determines the portion of the image data of the lead element where the brightness difference between adjacent pixels is 300 or more as the outline of the lead element. The individual control device 452 then generates the determined outline of the lead element as candidates for model data.

[0096] Thus, based on the captured data of lead elements with a central orientation of 0°, 90°, 180°, and 270° on the worktable, the individual control device 452 generates candidate model data with edge levels of 50, 100, 200, and 300 for each of the four types of lead elements' orientations. That is, the individual control device 452 generates 16 (=4×4) candidate model data. These 16 candidate model data are used for element recognition during pattern matching. The individual control device 452, based on the candidate model data, and... Figure 21 The 20 lead elements 410 shown are respectively pattern matched.

[0097] Specifically, for example, a separate control device 452 performs candidate matching of model data for lead elements with an edge level of 50 and a central orientation of 270° on the worktable. Figure 21 The patterns of the 20 lead elements 410 shown are matched. The result is, as... Figure 22 As shown, the correlation value between candidate model data of a lead element with an edge level of 50 and a center orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data of a lead element with a center orientation of 0° on the worktable is 96.8837. Furthermore, the correlation value between candidate model data of a lead element with an edge level of 50 and a center orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data of a lead element with a center orientation of 90° on the worktable is 61.969. Additionally, the correlation value between candidate model data of a lead element with an edge level of 50 and a center orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data of a lead element with a center orientation of 90° on the worktable is... Figure 21 The pattern matching of the 20 lead elements 410 shown is performed, and the correlation values ​​between the candidate data of the computational model and these 20 lead elements 410 are averaged. The result is as follows: Figure 22 As shown, the average of the calculated correlation values ​​is 90.99298.

[0098] Additionally, the individual control device 452 performs candidate model data for lead elements with an edge level of 50 or higher and a center orientation of 270° on the worktable, respectively. Figure 21 The pattern matching of each of the 20 lead elements 410 shown is performed, and the correlation values ​​between each candidate model data and each of the 20 lead elements 410 are averaged. Additionally, a separate control device 452 performs model data matching between each candidate lead element with an edge level and a central orientation of 270° on the worktable and... Figure 21 The patterns of the 20 lead elements 410 shown are matched, and the average of the correlation values ​​of the 20 lead elements 410 is calculated.

[0099] Figure 23 This represents the average correlation value when matching the candidate data of each of the 16 model data types with the patterns of the 20 lead elements 410. As shown in the figure, the correlation value is 90.99298 when matching the candidate data of the lead element with an edge level of 50 and a center orientation of 270° on the worktable with the patterns of each of the 20 lead elements 410, which is the highest among all correlation values. That is, when matching the pattern of the candidate data of the lead element with an edge level of 50 and a center orientation of 270° on the worktable, it is possible to identify… Figure 21 The outline of the 20 lead elements 410 shown has the highest probability. Therefore, the candidate model data of the lead element with an edge level of 50 and a center orientation of 270° on the worktable is determined as model data and stored in the storage device 458.

[0100] However, as Figure 22 As shown, the correlation value of the candidate model data of the lead element with an edge level of 50 and a center orientation of 270° on the worktable, when pattern matching is performed with the lead elements of the 20 lead elements 410 with a center orientation of 90° on the worktable, a lower right orientation of 180° on the worktable, a lower right orientation of 270° on the worktable, a lower left orientation of 90° on the worktable, and a higher left orientation of 90° on the worktable, is less than 90. On the other hand, the correlation value with the remaining 15 lead elements is 90 or more. Therefore, when pattern matching is performed using the candidate model data of the lead element with an edge level of 50 and a center orientation of 270° on the worktable, although the outlines of the aforementioned 15 lead elements of the 20 lead elements 410 can be appropriately identified, the outlines of the aforementioned 5 lead elements may not be appropriately identified. Therefore, the separate control device 452 additionally generates candidate first model data that can appropriately identify the outline of the above five lead elements.

[0101] Specifically, based on the image data of each of the five types of lead elements that may be unrecognizable, the individual control device 452 additionally generates candidate first model data with edge levels of 50, 100, 200, and 300. That is, the individual control device 452 additionally generates 20 (=5×4) candidate first model data types. These 20 additional candidate first model data types are candidate model data used for pattern matching and are data used for element identification. Therefore, each of the 20 candidate first model data types additionally generated by the individual control device 452 is related to... Figure 24 The patterns of the five lead elements 410 shown above are matched.

[0102] Specifically, for example, the separate control device 452 performs additional generation of candidate model data for a lead element with an edge level of 200 and a lower right orientation of 180° on the worktable. Figure 24 The patterns of the five lead elements 410 shown are matched. The result is, as... Figure 25 As shown, the correlation value between the candidate first model data of the lead element with an edge level of 200 and a lower right orientation of 180° on the worktable, calculated by the individual control device 452, and the captured data of the lead element with a center orientation of 90° on the worktable is 90. Furthermore, the correlation value between the candidate first model data of the lead element with an edge level of 200 and a center right orientation of 180° on the worktable, calculated by the individual control device 452, and the captured data of the lead element with a center orientation of 90° on the worktable is 100. Thus, the correlation value between the candidate first model data of the lead element with an edge level of 200 and a center right orientation of 180° on the worktable, calculated by the individual control device 452, and the captured data of the lead element with a center orientation of 90° on the worktable is 100. Figure 24 The patterns of the five lead elements 410 shown above, which may not be recognizable, are matched, and the average of their correlation values ​​is calculated. For example... Figure 25 As shown, the result calculated by the individual control device 452 is that the average value of the correlation is 80.

[0103] Thus, the individual control device 452 generates 20 additional candidate first model data sets as candidates for model data, each with... Figure 24 The patterns of the five lead elements 410 shown above, which may not be recognizable, are matched, and the average of the relevant values ​​is calculated. Figure 26 This represents the average result of the individual control device 452 calculating each correlation value. As shown in the figure, when pattern matching is performed using the candidate of the first model data with an edge level of 200 and a lower right orientation of 180° on the worktable from the candidates of the 20 additionally generated model data, the correlation value is the highest among all correlation values, such as 80. That is, when using the candidate of the first model data with an edge level of 200 and a lower right orientation of 180° on the worktable from the candidates of the 20 additionally generated first model data, the most recognizable... Figure 24 The outlines of the five types of lead elements 410 are shown. Therefore, the candidate lead element with an edge level of 200 and a position of 180° to the lower right of the worktable from the 20 additional candidate first model data are stored in the storage device 458 as model data to be used when performing pattern matching.

[0104] However, as Figure 25As shown, when the candidate of the first model data of the lead element with an edge level of 200 and a position of 180° to the lower right of the worktable among the 20 additional candidate model data matches the pattern of the aforementioned 5 lead elements 410, the correlation values ​​of the lead element with a position of 270° to the lower right of the worktable and the lead element with a position of 90° to the lower left of the worktable among the aforementioned 5 lead elements 410 are less than 90. Therefore, when the candidate of the first model data of the lead element with an edge level of 200 and a position of 180° to the lower right of the worktable among the 20 additional candidate first model data matches the pattern of the aforementioned 5 lead elements 410, although the outline of the aforementioned 3 lead elements can be identified, the outline of the aforementioned 2 lead elements may not be identified. Therefore, the separate control device 452 additionally generates a candidate of second model data that can appropriately identify the outline of the aforementioned 2 lead elements that may not be identified.

[0105] Specifically, based on the imaging data of the two types of lead elements that may be unrecognizable, the individual control device 452 additionally generates candidate second model data with edge levels of 50, 100, 200, and 300. That is, the individual control device 452 additionally generates 8 (=2×4) candidate second model data types. These 8 additionally generated candidate model data are used for element identification during pattern matching. Therefore, the candidate second model data additionally generated by the individual control device 452 are each related to... Figure 27 The patterns of the two types of lead elements 410 shown above are matched.

[0106] Specifically, for example, the individual control device 452 performs candidate matching of second model data for lead elements with an edge level of 100 and a lower right orientation of 270° on the worktable. Figure 27 The patterns of the two lead elements 410 shown are matched. The result is, as... Figure 28 As shown, the correlation value between the candidate second model data of the lead element with an edge level of 100 and a lower right orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data obtained by photographing the lead element with a lower right orientation of 270° on the worktable is 100. Furthermore, the correlation value between the candidate second model data of the lead element with an edge level of 100 and a lower right orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data obtained by photographing the lead element with a lower left orientation of 90° on the worktable is 90. Thus, the correlation value between the candidate second model data of the lead element with an edge level of 100 and a lower right orientation of 270° on the worktable, calculated by the individual control device 452, and the captured data is 90. Figure 27The patterns of the two types of lead elements 410 shown above, which may not be recognizable, are matched to calculate the average of their correlation values. For example... Figure 28 As shown, the average value of the correlation is 95, which is the result of the calculation.

[0107] Thus, the individual control device 452 generates eight additional candidate second model data sets as candidates for model data, each with its own... Figure 27 The pattern matching of the two types of lead elements 410 shown above, which may not be recognizable, is used to calculate the average of the relevant values. Figure 29 This represents the average result of the individual control device 452 calculating each correlation value. As shown in the figure, when pattern matching is performed using the lead element with an edge level of 100 and a lower-right orientation of 270° on the worktable from the eight additionally generated second model data candidates, the correlation value is the highest at 95. That is, when using the model data of the lead element with an edge level of 100 and a lower-right orientation of 270° on the worktable from the eight additionally generated second model data candidates, the most recognizable model is the one with the highest edge level of 100 and a lower-right orientation of 270° on the worktable. Figure 27 The outlines of the two types of lead elements 410 are shown. Additionally, as... Figure 28 As shown, when the candidate second model data of the lead element with an edge level of 100 and a lower right orientation of 270° on the worktable from the eight additional candidate second model data is matched with the patterns of the two lead elements 410, the correlation value between the candidate and the two lead elements is 90 or higher. Therefore, the candidate second model data of the lead element with an edge level of 100 and a lower right orientation of 270° on the worktable from the eight additional candidate second model data is stored in the storage device 458 as the model data used for pattern matching.

[0108] Thus, storage device 458 stores candidate model data for lead elements with an edge level of 50 and a center orientation of 270° on the worktable, candidate first model data for lead elements with an edge level of 200 and a lower right orientation of 180° on the worktable, and candidate second model data, as model data for pattern matching. Pattern matching is then performed using the candidate model data, the candidate first model data, and the candidate second model data stored in storage device 458. Figures 17-20 As shown, it can identify lead elements mounted in four different postures at five different positions on the worktable 156, i.e. Figure 21 The diagram shows the complete outlines of the 20 lead elements. Specifically, by using candidate patterns from the model data for pattern matching, it is possible to identify the lead elements among these 20 types. Figure 24The outlines of 15 lead elements other than the 5 lead elements shown are displayed. Furthermore, by using candidate patterns from the first model data for pattern matching, it is possible to identify the remaining 5 lead elements. Figure 27 The outlines of the three lead elements other than the two types shown are displayed. Furthermore, by using candidate data from the second model for pattern matching, the outlines of the remaining two lead elements can be identified.

[0109] In this way, by using the candidate model data, the candidate first model data, and the candidate second model data for pattern matching, it is possible to appropriately identify all the outlines of the lead elements placed at five different locations on the worktable 156 in four different postures. That is, when the individual control device 452 determines the element to be picked up from the multiple lead elements scattered on the worktable 156, it uses the candidate model data, the candidate first model data, and the candidate second model data to perform pattern matching with the multiple lead elements scattered on the worktable 156.

[0110] Specifically, first, the 2D camera 290 captures images of multiple lead elements dispersed on the worktable 156. Then, a separate control device 452 calculates the correlation value between the captured data of the multiple lead elements obtained by the 2D camera 290 and the candidates in the model data. As a result, the separate control device 452 determines lead elements with a correlation value of 90 or higher with the candidates in the model data as elements to be picked up. Next, the separate control device 452 calculates the correlation value between the captured data of lead elements other than those previously determined to be picked up and the candidates in the first model data. As a result, the separate control device 452 determines lead elements with a correlation value of 90 or higher with the candidates in the first model data as elements to be picked up. Next, the separate control device 452 calculates the correlation value between the captured data of lead elements other than those previously determined to be picked up and the candidates in the second model data. As a result, the separate control device 452 determines lead elements with a correlation value of 90 or higher with the candidates in the second model data as elements to be picked up. Furthermore, the individual control device 452 does not identify lead elements with a correlation value less than 90 with the candidates in the second model data as pickable objects. That is, lead elements with a correlation value less than 90 with the second model data are considered as unpickable elements.

[0111] In this way, by using the candidate of the model data, the candidate of the first model data, and the candidate of the second model data for pattern matching, the element that will be picked up can be determined from multiple lead elements 410 that are dispersed in different positions on the worktable 156 in different postures without reducing the threshold of the correlation value.

[0112] The worktable 156 is an example of a worktable. The 2D camera 290 is an example of a 2D camera. The lead wire element 410 is an example of a similar element. The individual control device 452 is an example of an information processing device.

[0113] Furthermore, the present invention is not limited to the above embodiments and can be implemented in various ways with modifications or improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, an operator manually places multiple lead elements 410 of the same type at multiple positions on the worktable 156. On the other hand, a robotic arm or the like can be provided in the bulk component supply device 32, and the robotic arm can automatically place the lead elements 410 on the worktable 156.

[0114] In addition, in the above embodiment, the two-dimensional camera 290 captures images of multiple lead elements 410 of the same type placed at multiple locations on the worktable 156 in a single, comprehensive view, and the individual control device 452 acquires the image data obtained from capturing images of multiple lead elements 410 in a comprehensive view. Alternatively, a lead element may be placed at a predetermined location on the worktable 156, and whenever the placement of that lead element is changed, the two-dimensional camera 290 captures an image of that lead element placed on the worktable 156, and the individual control device 452 acquires the image data obtained from capturing images of multiple lead elements 410 placed at multiple locations on the worktable 156 separately.

[0115] In addition, in the above embodiment, the operator places five lead elements 410 at five locations on the workbench 156 (center, lower right, lower left, upper right, and upper left), but the placement position is not limited, and the lead elements can be placed at any location on the workbench 156. Furthermore, the number of elements placed on the workbench 156 is not limited, and any number of lead elements can be placed at any location.

[0116] Furthermore, in the above embodiment, the model data is generated by a separate control device 452 of the component mounting machine 10, but the model data may also be generated by an information processing device different from the component mounting machine 10. Additionally, the model data generated by the information processing device different from the component mounting machine 10 is stored by the storage device 458.

[0117] Furthermore, in the above embodiments, the individual control device 452 generates candidate model data, candidate first model data, and candidate second model data, but it can also further generate candidate model data for third and subsequent generations. That is, for example, the individual control device 452 generates candidate second model data, and then compares the candidate model data, candidate first model data, and candidate second model data with each other. Figure 21For the pattern matching of the 20 lead elements shown, if any correlation value is not above 90, a third model data candidate is further generated. Thus, the individual control device 452 generates candidates for the third and subsequent model data, thereby ensuring that the correlation values ​​of all 20 lead elements are above 90. On the other hand, the individual control device 452 generates candidates for the first model data, and performs pattern matching between the candidate model data and the candidate first model data with the patterns of the 20 lead elements. If all correlation values ​​are above 90, there is no need to generate a second model data candidate.

[0118] Furthermore, while the above embodiment applies the invention to lead element 410, it can be applied to various types of elements. Specifically, for example, the invention can be applied to components of solar cells, components of power modules, and electronic circuit elements without leads.

[0119] In addition, in the above embodiment, the two-dimensional camera 290 can capture images of all the components scattered on a worktable 156 at a glance, but it can also divide the components scattered on the worktable 156 into multiple areas for imaging, for example, it can also capture images of each component individually.

[0120] Explanation of reference numerals in the attached figures

[0121] 156: Workbench 290: Two-dimensional camera 410: Lead wire element (component) 452: Individual control device (information processing device).

Claims

1. An information processing apparatus, wherein the information processing apparatus generates model data based on image data obtained by a two-dimensional camera capturing images of multiple elements of the same type placed at multiple locations on a worktable, the two-dimensional camera being fixedly disposed at a predetermined position at a predetermined height on the worktable.

2. The information processing apparatus according to claim 1, wherein, The information processing device generates model data based on the image data obtained by the two-dimensional camera from capturing multiple elements of the same type placed at multiple locations on the worktable in a single shot.

3. The information processing apparatus according to claim 1 or 2, wherein, The information processing device generates model data based on the image data obtained by the two-dimensional camera from multiple elements of the same type placed in the same posture at multiple positions on the worktable.

4. The information processing apparatus according to claim 3, wherein, The information processing device generates model data based on the image data obtained by the two-dimensional camera from shooting multiple components of the same type placed in multiple positions on the worktable in the same posture, and the image data obtained from shooting multiple components of the same type placed in multiple positions on the worktable in different postures.

5. A method for generating model data, comprising generating model data for identifying multiple components of the same type scattered on a workbench, wherein the method for generating model data performs the following steps: The component placement process involves placing components of the same type one by one in the same posture at multiple different positions on the worktable; and The component imaging process involves using a 2D camera fixed at a predetermined height and position on the worktable to simultaneously image multiple components of the same type and in the same posture placed at different positions on the worktable. The data used for identifying components is determined from the number of components that can be identified among the same type and same posture of components captured in one photograph during the component photographing process, if the number of such components exceeds a predetermined number. This data is then used to identify model data for multiple components of the same type scattered on the workbench.

Images