A millimeter wave wideband packaged antenna structure

Abstract

This invention provides a millimeter-wave broadband packaged antenna structure, comprising a packaging substrate composed of alternating stacked metal layers and dielectric layers. Multiple metal layers have vertically aligned center-gap regions. A driving patch, a microstrip line matching segment, and a stripline are sequentially connected and aligned along the signal transmission path. A parasitic patch, parallel to and vertically aligned with the driving patch, is located in an adjacent metal layer directly above it. These two patches are not directly electrically connected but are fed through electromagnetic field coupling, allowing the driving patch and parasitic patch to operate at similar but different resonant frequencies, forming a dual-resonance operating mode. This effectively expands the antenna impedance bandwidth. Stripline shielding holes are provided on both sides of the stripline, and antenna shielding holes are arranged around the edge of the gap regions to suppress signal leakage and cavity resonance. This invention replaces the traditional coplanar or slotted method with a vertically stacked coupling structure, achieving antenna miniaturization while significantly improving bandwidth, and enhancing the design freedom of impedance matching through the microstrip line matching segment.

Description

Technical Field

[0001] This invention relates to the field of packaged antenna technology, and in particular to a millimeter-wave broadband packaged antenna structure. Background Technology

[0002] Millimeter-wave antennas are specialized antennas operating in the 30GHz to 300GHz frequency band (wavelength 1-10mm), characterized by high bandwidth, low latency, and short wavelength. Their core function is to convert radio frequency signals into electromagnetic wave radiation or receive electromagnetic waves in space, and they are widely used in 5G communications, autonomous driving, radar systems, satellite communications, and other fields. Compared to lasers and infrared, millimeter waves have stronger penetration capabilities through environmental factors such as smoke and haze, making them suitable for complex scenarios.

[0003] Encapsulated antennas are a technology that integrates antennas and radio frequency circuits into a single package. Its core objective is to achieve system-level miniaturization, high performance, and low cost.

[0004] In 5G and future 6G communications, millimeter-wave bands have become a key technology due to their large bandwidth and high speed. However, high-frequency signals are susceptible to transmission attenuation and path loss. Millimeter-wave packaged antennas can reduce transmission loss caused by interconnect feeders and improve signal integrity. Furthermore, millimeter-wave packaged antennas are characterized by miniaturization and high integration, enabling compact designs through system-level packaging, making them suitable for mobile phones and other terminal devices. They also support large-scale antenna arrays such as MIMO.

[0005] Existing millimeter-wave packaged antennas face challenges in bandwidth expansion. Traditional microstrip patch antennas typically have narrow bandwidths, failing to meet the broadband requirements of packaged antennas. To expand bandwidth, existing technologies mainly employ two methods: one is to use coplanar arrangement of parasitic patches, but this method significantly increases the antenna's planar size, which is not conducive to high-density array integration and MIMO system applications; the other is to create slots on the patches to introduce multi-resonance, but in the millimeter-wave band, the required slot size is extremely small, typically sub-millimeter level, placing extremely high demands on the precision and consistency of the packaging process, significantly increasing the difficulty and cost of mass production. Summary of the Invention

[0006] The present invention provides a millimeter-wave broadband packaged antenna structure, which aims to solve the technical problem of narrow impedance bandwidth of traditional millimeter-wave packaged antennas.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solution: This invention provides a millimeter-wave broadband packaged antenna structure and its application, comprising: a packaged substrate, an antenna shielding hole, a stripline shielding hole, a parasitic patch, a driving patch, a microstrip line matching segment, and a stripline; The packaging substrate is composed of several alternately stacked metal layers and dielectric layers; wherein the opening regions on several of the metal layers form gap regions; The driving patch, microstrip line matching segment, and stripline are electrically connected in sequence and aligned along the center of the signal transmission path; The parasitic patch is disposed in an adjacent metal layer directly above the driving patch, and the parasitic patch is parallel to and perpendicularly aligned with the driving patch. There is no direct electrical connection between the parasitic patch and the driving patch. The parasitic patch is excited and fed by the driving patch through electromagnetic field coupling. The driving patch and the parasitic patch have similar but different resonant frequencies. The difference in their resonant frequencies enables the antenna to form a dual-resonance operating mode to extend the impedance bandwidth. The strip wire shielding holes are distributed on both sides of the strip wire; The antenna shielding hole is provided around the edge of the slot area.

[0008] As a further improvement, the number of metal layers in the packaging substrate is not less than 4 and is an even number.

[0009] As a further improvement, the stripline includes a main stripline segment and a stripline extension segment. The two ends of the stripline extension segment are respectively connected to the main stripline segment and the microstrip matching segment, and the centers of the stripline extension segment, the microstrip matching segment and the driving patch are on the same straight line.

[0010] As a further improvement, the number of the gap regions is not less than 3, and they are respectively disposed on different metal layers, and the center of each gap region is aligned with the center of the parasitic patch in a direction perpendicular to the plane of the packaging substrate; the length and width of each gap region are the same.

[0011] As a further improvement, the extension section of the strip has the same width as the strip, the width of the strip is not less than 25 μm, and the gap between the strip and the same metal layer is not less than 25 μm.

[0012] As a further improvement, the stripline shielding holes are arranged along both sides of the stripline, and the spacing between adjacent stripline shielding holes on the same side is no greater than one-eighth of the dielectric wavelength; the minimum horizontal distance between the center of the stripline shielding hole and the edge of the metal layer is no greater than one-eighth of the dielectric wavelength.

[0013] As a further improvement, the antenna shielding holes are distributed around the outer edge of the gap region, and the spacing between adjacent antenna shielding holes is no greater than one-eighth of the dielectric wavelength; the distance between the center of the antenna shielding hole and the edge of the gap region is no greater than one-eighth of the dielectric wavelength.

[0014] As a further improvement, both the stripline shielding hole and the antenna shielding hole are metallized vias; the stripline shielding hole is formed by stacking two metallized vias in the vertical direction, and the antenna shielding hole is formed by stacking three metallized vias in the vertical direction.

[0015] The beneficial effects of this invention are: This invention introduces a new resonant point near the resonant point of the driving patch through a coupling feeding mechanism between the driving patch and the parasitic patch, effectively expanding the antenna's operating bandwidth. It also achieves a -10dB impedance bandwidth of 13%, far exceeding the bandwidth of traditional packaged antennas, meeting the requirements of millimeter-wave broadband communication systems. By employing a multi-layer stacked design within the packaging substrate, the antenna elements and RF circuitry can be integrated into a system-level package, resulting in a small overall planar size suitable for high-density array layouts and facilitating the miniaturization of terminal devices. Impedance matching between the stripline and the driving patch is achieved through a microstrip matching segment, replacing the traditional coaxial probe feeding method. This avoids matching difficulties caused by substrate thickness limitations, improving the adjustability and design freedom of impedance matching. The antenna structure eliminates the need for slotting on the patch or using coplanar parasitic patches, avoiding the technological challenges of micro-slotting in the millimeter-wave band, reducing processing difficulty and cost, and making it more suitable for mass production. The rational layout of the stripline shielding holes and antenna shielding holes effectively suppresses energy leakage and cavity resonance during signal transmission, improving antenna isolation and radiation efficiency while reducing mutual coupling between antenna elements. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a millimeter-wave broadband packaged antenna structure according to the present invention.

[0018] Figure 2 This is an exploded view of the structure of a millimeter-wave broadband packaged antenna according to the present invention.

[0019] Figure 3 This is a partial structural diagram of a millimeter-wave broadband packaged antenna structure according to the present invention. Figure 1 .

[0020] Figure 4 This is a partial structural diagram of a millimeter-wave broadband packaged antenna structure according to the present invention. Figure 2 .

[0021] In the diagram: 1-Metal layer, 2-Dielectric layer, 3-Antenna shielding hole, 4-Stripline shielding hole, 5-Parasitic patch, 6-Driver patch, 7-Microstripline matching segment, 8-Stripline, 9-Gap region. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0023] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] Reference Figure 1-4 As shown, a millimeter-wave broadband packaged antenna structure includes: a packaged substrate, an antenna shielding hole 3, a stripline shielding hole 4, a parasitic patch 5, a driving patch 6, a microstrip line matching segment 7, and a stripline 8. The packaging substrate consists of several alternately stacked metal layers 1 and dielectric layers 2; openings in several metal layers 1 form slot regions 9; a driving patch 6, a microstrip matching segment 7, and a stripline 8 are sequentially connected and aligned along the center of the signal transmission path; a parasitic patch 5 is disposed in the adjacent metal layer 1 directly above the driving patch 6, parallel to and perpendicularly aligned with the driving patch 6; there is no direct electrical connection between the parasitic patch 5 and the driving patch 6, and the parasitic patch 5 is fed through electromagnetic field coupling with the driving patch 6; the driving patch 6 and the parasitic patch 5 have similar but different resonant frequencies, and the difference in their resonant frequencies enables the antenna to form a dual-resonance operating mode to extend the impedance bandwidth; stripline shielding holes 4 are distributed on both sides of the stripline 8; antenna shielding holes 3 are arranged around the edge of the slot region 9. Through the coupling feeding mechanism between the driving patch 6 and the parasitic patch 5, a new resonant point is introduced near the resonant point of the driving patch 6, effectively extending the operating bandwidth of the antenna. This enables the antenna to achieve a -10dB impedance bandwidth of 13%, which is far higher than that of traditional packaged antennas, meeting the requirements of millimeter-wave broadband communication systems.

[0025] Furthermore, the packaging substrate is composed of multiple metal layers 1 and dielectric layers 2 stacked alternately, with no fewer than 4 metal layers and an even number, to ensure the symmetry and shielding integrity of the antenna structure in the vertical direction. The number of slot regions 9 is no less than 3, and each slot region 9 is disposed on a different metal layer 1. The center of each slot region 9 is aligned with the center of the parasitic patch 5 in a direction perpendicular to the plane of the packaging substrate. The length and width of each slot region 9 are the same. In this embodiment, preferably, 4 metal layers are provided. Figure 2 As shown, from top to bottom, there are a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer. The first metal layer is located on top of the packaging substrate, and a portion of its area is etched to form a slot region 9 to reduce obstruction of antenna radiation. The second metal layer is etched with an area for placing the parasitic patch 5, and a slot region 9 is formed between the parasitic patch 5 and the second metal layer. This slot region 9 is used to enhance coupling and control the electromagnetic field distribution. The third metal layer is etched with an area for placing the driving patch 6, the microstrip line matching segment 7, and the stripline 8. A slot region 9 is formed between the driving patch 6, the microstrip line matching segment 7, and the stripline 8 and the third metal layer. The third metal layer serves as the main feed and radiation structure layer of the antenna. The fourth metal layer is set as a complete reference ground layer to provide good grounding and shielding effects. The dielectric layer 2 uses a high-frequency, low-loss material. In this embodiment, the maximum length and maximum width of each slot region 9 disposed on different metal layers 1 are designed to be the same. This design ensures that these slotted areas are substantially aligned in the direction perpendicular to the substrate, thus structurally defining a vertically continuous radiating cavity with a rectangular cross-section, which encloses the driving patch 6, the parasitic patch 5, and their coupling regions. This well-defined cavity boundary helps to concentrate and regulate the near-field electromagnetic distribution of the antenna, providing a stable environment for impedance transformation of the microstrip matching segment 7 and the formation of dual resonances. Simultaneously, it provides a benchmark for the uniform arrangement of the peripheral antenna shielding holes 3, allowing them to be arranged closely along the cavity sidewalls to construct an effective vertical shielding barrier and suppress unwanted energy diffusion.

[0026] The metal layer 1 of the packaging substrate serves as a reference ground for the radiating patch body and the packaging substrate; the dielectric layer 2 of the packaging substrate serves as a filling medium between the metal layers 1.

[0027] In different applications, the number and thickness of the metal layer 1 and dielectric layer 2 of the packaging substrate may vary. Therefore, it is necessary to combine actual requirements and simulation design results to select the number and thickness of the packaging substrate layers, as well as the layers where the parasitic patch 5 and the driving patch 6 are located.

[0028] Furthermore, the slot region 9 is a dielectric filling region formed by etching away part of the metal on multiple metal layers, and the number of such slot regions is not less than three. In this embodiment, they are respectively disposed in the first metal layer, the second metal layer, and the third metal layer. The maximum length and maximum width of each slot region 9 are consistent, and its shape is preferably rectangular. The line connecting the center of each slot region 9 and the center of the parasitic patch 5 is perpendicular to the substrate plane. The slot region 9 surrounds the driving patch 6, the microstrip line matching segment 7, the stripline 8, and the parasitic patch 5, and is used to control the near-field distribution of the antenna and reduce interference with radiation.

[0029] Furthermore, the stripline 8 has an extension segment, which connects the stripline 8 to the microstrip matching segment 7. The microstrip matching segment 7 is then connected to the driver patch 6. In this embodiment, the stripline 8, the stripline extension segment, the microstrip matching segment 7, and the driver patch 6 are connected as a single, integral metal layer. The centers of the stripline extension segment, the microstrip matching segment 7, and the driver patch 6 are aligned on the same straight line, and they maintain center alignment along the signal transmission path to ensure impedance continuity. The driver patch 6 is located on the third metal layer, and the parasitic patch 5 is located on the second metal layer directly above it. The two are parallel and perpendicularly aligned, and are fed through electromagnetic coupling without physical connection. The stripline extension segment has the same width as the stripline 8, the stripline 8 has a width of not less than 25 μm, and the gap between the stripline 8 and the same metal layer is not less than 25 μm.

[0030] Furthermore, the stripline shielding vias 4 are arranged in rows along both sides of the stripline 8 to suppress lateral leakage and mode coupling of signals during transmission. The spacing between adjacent stripline shielding vias 4 on the same side is no greater than one-eighth of the dielectric wavelength, and the minimum horizontal distance between the center of the stripline shielding via 4 and the edge of the metal layer 1 is no greater than one-eighth of the dielectric wavelength, in order to optimize the shielding effect and save layout space. In a specific embodiment, the minimum safe spacing is 70 μm, and the maximum effective shielding distance is one-eighth of the dielectric wavelength. Secondly, in this embodiment, the stripline shielding via 4 is composed of two stacked metallized vias, each corresponding to a different thickness of the dielectric layer 2. The metallized vias can be copper metallized vias. According to the packaging substrate process, the diameter of the metallized via is determined by the thickness of the dielectric layer 2 where the via is located, and the minimum center-to-center distance between adjacent vias is determined by the via diameter.

[0031] Antenna shielding holes 3 are uniformly arranged around the outer edge of each slot area 9, used to connect the metal reference ground of each layer, forming a continuous shielding cavity to suppress antenna energy leakage into the substrate. The spacing between adjacent antenna shielding holes 3 is the same and does not exceed one-eighth of the dielectric wavelength, and the distance between the center of the antenna shielding hole 3 and the edge of the slot area 9 does not exceed one-eighth of the dielectric wavelength. In a specific embodiment, the minimum safe distance is 70 μm, and the maximum effective connection distance is one-eighth of the dielectric wavelength. In this embodiment, the antenna shielding holes 3 are formed by stacking three metallized vias (top, middle, and bottom) to ensure reliable electrical connection from the top layer to the bottom layer. The metallized vias can be copper metallized vias. According to the packaging substrate process, the diameter of the metallized via is determined by the thickness of the dielectric layer 2 where the via is located, and the minimum center-to-center distance between adjacent vias is determined by the via diameter. The "one-eighth of the dielectric wavelength" and "one-quarter of the dielectric wavelength" refer to the wavelength of electromagnetic waves propagating in a specific medium, calculated using the following formula: / , in the formula, The speed of light in a vacuum. The operating frequency of electromagnetic waves, The relative permittivity of the dielectric material is taken as the main basis for the relative permittivity of the dielectric layer 2 between the core radiation region of the antenna, i.e., the driving patch 6 and the adjacent reference ground. This is because the dielectric properties of this region dominate the resonance and near-field distribution of the antenna.

[0032] In this embodiment, the stripline shielding hole 4 consists of two metallized vias, with the upper via having a diameter of 80 μm and the lower via having a diameter of 60 μm. The minimum center-to-center distance between the stripline shielding holes 4 is 140 μm, and the minimum distance between the center of the stripline shielding hole 4 and the edge of the same metal layer 1 is 70 μm. The antenna shielding hole 3 consists of three metallized vias, with the upper via having a diameter of 60 μm, the middle via having a diameter of 80 μm, and the lower via having a diameter of 60 μm. The minimum center-to-center distance between the antenna shielding holes 3 is 140 μm, and the minimum distance between the center of the antenna shielding hole 3 and the edge of the metal layer 1 is 70 μm.

[0033] Furthermore, a millimeter-wave broadband packaged antenna structure can be used for broadband conversion of 77 GHz millimeter-wave signals between the packaged substrate and free space.

[0034] Further, Example 1: Due to limitations in packaging technology, the stripline 8 has a linewidth of no less than 25 μm, a gap of no less than 25 μm between its two sides, a center-to-center distance of no less than 140 μm between adjacent stripline shielding holes 4 and adjacent antenna shielding holes 3, a distance between the center of the stripline shielding hole 4 and the center of the antenna shielding hole 3 and the edge of the metal layer 1, and a distance of no less than 70 μm. The gaps between the microstrip matching segment 7, the driving patch 6, and the parasitic patch 5 and the reference ground in the same layer are no less than 25 μm. According to the packaging process, the thickness of the dielectric layer 2 determines the diameter of the metallized vias passing through this layer; for example, a 30 μm thick dielectric layer 2 has a via diameter of 60 μm, and a 200 μm thick dielectric layer 2 has a via diameter of 80 μm.

[0035] Stripline 8 Dimensions Design: Taking a 50Ω characteristic impedance as an example, with a dielectric constant of 3.6 and a loss tangent of 0.0043 for the packaging substrate dielectric layer 2, the thickness of the dielectric layer 2 below stripline 8 is 30μm, the thickness of the dielectric layer 2 above stripline 8 is 200μm, the thickness of the metal layer 1 of stripline 8 is 18μm, and the metal conductivity is 5.8e. 7 Given a signal strength (S / m) and a transmission frequency of 78.5 GHz, the initial linewidth of stripline 8 is calculated to be 52 μm using transmission line calculation software such as TXLINE, and the initial gap between the two sides of stripline 8 is calculated to be 50 μm. A stripline model is then established using full-wave electromagnetic simulation software such as CST. The stripline shielding aperture 4 consists of two metallized vias with diameters of 80 μm and 60 μm, respectively. The distance between the center of the stripline shielding aperture 4 and the edges of the reference ground on both sides of stripline 8 is set to 70 μm, and the center-to-center spacing between adjacent stripline shielding apertures 4 is set to 140 μm. After software simulation optimization, the final stripline width with a characteristic impedance of 50 Ω is 30 μm, and the gap between the two sides is 65 μm.

[0036] Antenna design: Based on an antenna center operating frequency of 78.5 GHz, the relative permittivity of the dielectric layer 2 between the driving patch 6 and the underlying reference ground is 3.6, and the thickness of dielectric layer 2 is 30 μm. According to the formula:

[0037] In the above formula, For patch width, At the speed of light, The central operating frequency, The relative permittivity of the dielectric between the patch and the reference ground;

[0038] In the above formula, For the effective dielectric constant, The thickness of the dielectric between the patch and the reference ground;

[0039] In the above formula, This is the equivalent radiation gap length;

[0040] In the above formula, This refers to the patch length; The initial width of the driver patch 6 can be calculated to be 1.26 mm, and the initial length to be 1 mm using the above formula. The width direction refers to the direction perpendicular to the extension of the stripline 8, and the length direction refers to the direction parallel to the extension of the stripline 8.

[0041] The packaging substrate is configured with the following parameters: a dielectric layer above the first metal layer with a thickness of 20 μm, a dielectric constant of 2.6, and a loss tangent of 0.022; a first metal layer with a thickness of 15 μm; a dielectric layer below the first metal layer with a thickness of 30 μm, a dielectric constant of 3.6, and a loss tangent of 0.0043; a second metal layer with a thickness of 18 μm; a dielectric layer above the third metal layer with a thickness of 200 μm, a dielectric constant of 3.7, and a loss tangent of 0.0041; a third metal layer with a thickness of 18 μm; a dielectric layer below the third metal layer with a thickness of 30 μm, a dielectric constant of 3.6, and a loss tangent of 0.0043; and a fourth metal layer with a thickness of 15 μm. Assume the initial length and width of the parasitic patch are the same as the driving patch; the initial length of the microstrip line matching segment is one-quarter of the initial length of the driving patch, i.e., 0.25 mm; the initial width of the microstrip line matching segment is one-half of the initial width of the driving patch, i.e., 0.63 mm; the initial maximum length of the outer contour of each slot region is twice the initial length of the driving patch, i.e., 2 mm, and the initial maximum width of the outer contour of each slot region is twice the initial width of the driving patch, i.e., 2.52 mm; the stripline extension connects the stripline and the microstrip line matching segment, and the width of the stripline extension is the same as the width of the stripline. The antenna shielding aperture consists of three metallized vias, with the central metallized via having a diameter of 80 μm and the upper and lower metallized vias both having a diameter of 60 μm; the antenna shielding apertures are distributed around the edge of the outer contour of the slot region, and the distance between the center of the antenna shielding aperture and the edge of the outer contour of the slot region is set to 70 μm; the center-to-center spacing between adjacent antenna shielding apertures is set to a minimum of 140 μm and a maximum of one-eighth of the dielectric wavelength, according to the formula:

[0042] In the above formula, One-eighth of the medium wavelength; The antenna center frequency is 78.5 GHz. The relative permittivity of the dielectric layer beneath the driver patch is taken as 3.6.

[0043] The wavelength of one-eighth of the medium can be calculated using the formula to be approximately 252 μm.

[0044] Based on the above conditions and initial parameter values, a packaged antenna model was built in CST software, with the packaged substrate area covering all the aforementioned structures. Through simulation optimization, the final optimized values ​​for all parameters are as follows: parasitic patch length 0.69mm, width 0.887mm; driving patch length 0.699mm, width 0.967mm; microstrip line matching segment length 0.26mm, width 0.684mm; maximum length of the slot region's outer contour 1.36mm, maximum width 1.77mm; the center-to-center spacing of the antenna shielding holes distributed along the longest side of the slot region's outer contour is 0.25mm; the center-to-center spacing of the antenna shielding holes along the widest side of the slot region's outer contour near the microstrip line matching segment is 0.20125mm; and the center-to-center spacing of the antenna shielding holes along the widest side of the slot region's outer contour away from the microstrip line matching segment is 0.23875mm. Thus, a millimeter-wave broadband packaged antenna with a center operating frequency of 78.5GHz, a relative bandwidth of 13%, and a gain of 6dBi was realized.

[0045] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A millimeter-wave broadband packaged antenna structure, characterized in that, include: Packaging substrate, antenna shielding hole (3), stripline shielding hole (4), parasitic patch (5), driving patch (6), microstrip line matching segment (7) and stripline (8); The packaging substrate is composed of several alternately stacked metal layers (1) and dielectric layers (2); wherein the opening regions on several of the metal layers (1) form gap regions (9). The driving patch (6), the microstrip matching segment (7) and the stripline (8) are electrically connected in sequence and aligned along the center of the signal transmission path; The parasitic patch (5) is disposed in the adjacent metal layer (1) directly above the driving patch (6). The parasitic patch (5) and the driving patch (6) are parallel to each other and their centers are vertically aligned. There is no direct electrical connection between the parasitic patch (5) and the driving patch (6). The parasitic patch (5) is excited and fed by the driving patch (6) through electromagnetic field coupling. The driving patch (6) and the parasitic patch (5) have similar but different resonant frequencies. The difference in their resonant frequencies enables the antenna to form a dual-resonant working mode, thereby expanding the impedance bandwidth. The strip wire shielding holes (4) are distributed on both sides of the strip wire (8); The antenna shielding hole (3) is disposed around the edge of the slit area (9).

2. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, The number of metal layers (1) in the packaging substrate is not less than 4 and is an even number.

3. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, The stripline (8) includes a main stripline segment and a stripline extension segment. The two ends of the stripline extension segment are respectively connected to the main stripline segment and the microstrip matching segment (7), and the centers of the stripline extension segment, the microstrip matching segment (7) and the drive patch (6) are on the same straight line.

4. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, The number of the gap regions (9) is not less than 3, and they are respectively disposed on different metal layers (1). The center of each gap region (9) is aligned with the center of the parasitic patch (5) in a direction perpendicular to the plane of the encapsulation substrate. The length and width of each gap region (9) are the same.

5. The millimeter-wave broadband packaged antenna structure according to claim 3, characterized in that, The width of the extended section of the strip is the same as that of the strip (8), the width of the strip (8) is not less than 25 μm, and the gap between the strip (8) and the same metal layer (1) is not less than 25 μm.

6. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, The stripline shielding holes (4) are arranged along both sides of the stripline (8), and the spacing between adjacent stripline shielding holes (4) on the same side is no greater than one-eighth of the dielectric wavelength; the minimum horizontal distance between the center of the stripline shielding hole (4) and the edge of the metal layer (1) is no greater than one-eighth of the dielectric wavelength.

7. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, The antenna shielding holes (3) are distributed around the outer edge of the gap area (9), and the distance between adjacent antenna shielding holes (3) is no greater than one-eighth of the medium wavelength; the distance between the center of the antenna shielding hole (3) and the edge of the gap area (9) is no greater than one-eighth of the medium wavelength.

8. The millimeter-wave broadband packaged antenna structure according to claim 1, characterized in that, Both the stripline shielding hole (4) and the antenna shielding hole (3) are metallized vias; the stripline shielding hole (4) is formed by stacking two metallized vias in the vertical direction, and the antenna shielding hole (3) is formed by stacking three metallized vias in the vertical direction.

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