An automatic matching and laying device for breeding substrate of lepidogrammitis spores and a breeding method thereof
The automatic mixing and spreading device for fern spore seedling cultivation substrate solves the problem of uneven substrate particle size by using the intelligent deformation control of double panels based on the difference in the contour of the chute, achieving uniform mixing and spreading of the substrate and improving the survival rate of seedlings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INSTITUTE OF MICROBIOLOGY JIANGXI ACADEMY OF SCIENCES (JIANGXI INSTITUTE OF WATERSHED ECOLOGY)
- Filing Date
- 2026-05-19
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the mixing and spreading of fern spore seedling substrates suffer from problems such as uneven substrate particle size, insufficient air permeability, and insufficient water retention, resulting in low survival rates.
An automatic mixing and spreading device for fern spore seedling cultivation substrate is adopted. By utilizing the contour difference between the first and second protrusions on the arc-shaped chute, the sliding rod controls the intelligent deformation of the double-panel at different positions to achieve substrate shearing, compression, lifting and spreading, ensuring uniform mixing and spreading.
It significantly improved the seedling survival rate of fern spores. By ensuring the air permeability and water retention of the substrate, it solved the problem of uneven substrate particle size and improved the survival rate of seedlings.
Smart Images
Figure CN122397593A_ABST