A polycrystalline diamond compact containing a material with a negative thermal expansion coefficient, a method of making the same, and a drill bit
By adding a material with a negative coefficient of thermal expansion to polycrystalline diamond composite sheets, the problems of high thermal stress and environmental pollution in traditional composite sheets are solved, and the high-temperature stability and impact resistance are improved, while the wear resistance is also significantly enhanced.
Patent Information
- Application Number
- CN202510076047.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-07-17
AI Technical Summary
In traditional polycrystalline diamond composite sheets, the large difference in the coefficients of thermal expansion between cobalt and diamond leads to high thermal stress and easy failure. Furthermore, traditional cobalt removal methods suffer from environmental pollution and long processing times.
A polycrystalline diamond composite sheet containing a material with a negative coefficient of thermal expansion, such as zirconium tungstate, hafnium tungstate, or nepheline, is prepared by adding such material to the polycrystalline diamond composite layer of the polycrystalline diamond composite sheet through high temperature and high pressure synthesis.
It significantly improves the high-temperature stability and impact resistance of polycrystalline diamond composite sheets, reduces deformation, enhances wear resistance, and achieves heat resistance up to nearly 900℃, while maintaining a moderate cost.
Smart Images
Figure CN122403986A_ABST