Composite polyimide film, method for preparing the same, and use thereof

By introducing sheet-like boron nitride and spherical aluminum oxide thermally conductive fillers into a polyimide matrix and combining them with a specific diamine monomer, a composite polyimide film was prepared, which solved the problems of insufficient thermal conductivity, aging resistance and mechanical properties of thermal pads, and realized the application of highly efficient thermal management materials.

CN122404979APending Publication Date: 2026-07-17HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
Filing Date
2026-04-28
Publication Date
2026-07-17

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Abstract

本发明提供了一种复合聚酰亚胺膜、其制备方法及应用。该复合聚酰亚胺膜包括聚酰亚胺基体、以及分散在聚酰亚胺基体中的导热填料;聚酰亚胺基体由二酐单体与二胺单体缩聚而形成,且二胺单体的分子结构式为;导热填料中包括片状氮化硼以及球状三氧化二铝。本发明依托于聚酰亚胺(PI)与复配导热填料相结合的方式,并通过柔性二胺单体的引入,针对于复合聚酰亚胺膜,达到了显著提升导热性能、增强耐高温性、提高力学强度以及改善耐老化性的目的。
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