A solderless method of electronic interconnection
By setting mounting holes and chambers on the connectors and using bonding or interference fit to achieve electrical connection of conductive balls, the problems of thermal stress and solder joint fatigue caused by traditional welding are solved, achieving high reliability and flexible electronic interconnection, and improving product integration and space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF ELECTRONICS SCI & TECH OF CHINA
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional welding technology suffers from thermal stress, heat accumulation, and weld fatigue cracking in high-frequency, high-density, and three-dimensional stacking applications. It cannot effectively solve the mechanical stress caused by the mismatch of thermal expansion coefficients, and the welding process is difficult to repeat and disassemble.
Mounting holes are provided on the connector by means of bonding or interference fit to form a cavity to accommodate the conductive ball, and electrical connection is achieved through solder pads. The position of the connector can be fixed mechanically by disassembly, avoiding the heat effects and rigid connection problems caused by welding.
It achieves solderless electrical connections, solves the problem of mismatched thermal expansion coefficients, improves the stability and reliability of interconnects, supports close arrangement of devices, breaks through the minimum spacing limit of traditional processes, and improves product integration and space utilization.
Smart Images
Figure CN122421801A_ABST