Integrated waterway substrate, liquid cooling system and power cabinet

Abstract

The application provides an integrated waterway substrate, a liquid cooling system and a power cabinet. The integrated waterway substrate is internally provided with a plurality of flow channels and a pressure relief structure. The plurality of flow channels comprises a first flow channel and a second flow channel. The first flow channel is in communication with a liquid inlet of a circulating pump, and the second flow channel is in communication with a liquid outlet of the circulating pump. The pressure relief structure comprises a liquid inlet and a pressure relief port. The liquid inlet is in communication with the second flow channel, and the pressure relief port is in communication with the first flow channel. The circulating pump is used for pumping the cooling working medium from the first flow channel to the second flow channel, and the pressure relief structure is used for partially relieving the cooling working medium in the second flow channel to the first flow channel. When the second flow channel is relieved, the pressure relief structure can directly discharge the cooling working medium to the first flow channel in the integrated waterway substrate without an external drain pipe. Therefore, the above integrated waterway substrate can not only reduce the space occupied by the pressure relief structure in the liquid cooling system, but also directly realize pressure relief in the internal part of the integrated waterway substrate, thereby reducing the risk of water leakage.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to an integrated water circuit board, a liquid cooling system, and a power supply cabinet. Background Technology

[0002] As the computing power of data centers increases, so does their energy consumption and heat dissipation. Liquid cooling is a reliable and feasible solution for cooling servers and reducing energy consumption in data centers. In a data center's liquid cooling system, the liquid cooling circulation is achieved through a circulation pump. The pressure of the coolant before the pump is low, and its flow path is a low-pressure path. After passing through the circulation pump, the pressure of the coolant increases, causing it to flow through a high-pressure path. The high-pressure coolant gradually decreases in pressure after passing through components such as cold plates and heat exchangers, becoming a low-pressure coolant again before re-entering the circulation pump for pressurization, thus achieving circulation.

[0003] To prevent the pressure of the coolant from exceeding the pressure limit of the pipeline, a safety valve is usually installed. The inlet of the safety valve is connected to the high-pressure flow path, and the pressure relief port requires an external drain pipe for pressure relief to prevent the coolant from spraying onto other components. When overpressure occurs in the liquid cooling system, the safety valve opens and discharges the coolant through the pressure relief port. However, the safety valve needs to be installed separately in the liquid cooling system. Not only does the safety valve itself occupy space, but the external drain pipe also occupies internal space in the liquid cooling system. Furthermore, the drain pipe poses a risk of leakage and is not conducive to the water and electrical isolation of the liquid cooling system. Summary of the Invention

[0004] This application provides an integrated water circuit board, liquid cooling system and power cabinet, so as to integrate the pressure relief structure into the water circuit board, thereby reducing the space occupied by the liquid cooling system and reducing the risk of water leakage.

[0005] In a first aspect, this application provides an integrated cooling substrate. The integrated cooling substrate has multiple flow channels and a pressure relief structure internally. Specifically, the aforementioned multiple flow channels include a first flow channel and a second flow channel. The first flow channel is connected to the inlet of a circulating pump, and the second flow channel is connected to the outlet of the circulating pump. The pressure relief structure includes an inlet and a pressure relief port. The inlet is connected to the second flow channel, and the pressure relief port is connected to the first flow channel. The pressure relief structure is used to release a portion of the cooling medium in the second flow channel to the first flow channel.

[0006] The integrated water channel substrate of this application can be applied to a liquid cooling system. The liquid cooling system may include a circulation pump, which connects the first and second flow channels of the integrated water channel substrate. This allows the circulation pump to pump the cooling medium from the first flow channel to the second flow channel. The first flow channel is a low-pressure flow path, and the second flow channel is a high-pressure flow path. When a pressure relief structure depressurizes the second flow channel, it can directly discharge the cooling medium into the first flow channel within the integrated water channel substrate, eliminating the need for an external drain pipe. Therefore, the aforementioned integrated water channel substrate not only reduces the space occupied by the pressure relief structure in the liquid cooling system but also allows for direct pressure relief within the integrated water channel substrate, thereby reducing the risk of leakage.

[0007] The multiple flow channels of the aforementioned integrated water circuit board can be connected to other components of the liquid cooling system (including but not limited to circulating pumps, heat exchangers, cold plates, expansion tanks, replenishment pumps, replenishment tanks, etc.), thereby forming a circulating loop for the cooling medium. The pressure relief structure is used to release part of the cooling medium from the high-pressure flow path to the low-pressure flow path, wherein the pressure relief port can be connected to different locations in the low-pressure flow path.

[0008] In one technical solution, the inlet end of the first flow channel can be connected to the outlet of the cold plate, and the outlet end of the first flow channel can be connected to the inlet of the heat exchanger. The inlet end of the second flow channel can be connected to the outlet of the circulating pump, and the outlet end of the second flow channel can be connected to the inlet of the cold plate. The aforementioned multiple flow channels may also include a third flow channel, the inlet end of which can be connected to the outlet of the heat exchanger, and the outlet end of the third flow channel can be connected to the inlet of the circulating pump. In this technical solution, the circulating pump, the second flow channel, the cold plate, the first flow channel, the heat exchanger, the third flow channel, and the circulating pump are sequentially connected, thereby forming a circulating loop for the cooling medium. During pressure relief, the pressure relief structure releases pressure from the pumped cooling medium into the flow path between the cold plate and the heat exchanger.

[0009] In another technical solution, the inlet end of the first flow channel can be connected to the outlet of the heat exchanger, and the outlet end of the first flow channel can be connected to the inlet of the circulating pump. The inlet end of the second flow channel can be connected to the outlet of the circulating pump, and the outlet end of the second flow channel can be connected to the inlet of the cold plate. The aforementioned multiple flow channels may also include a third flow channel, the inlet end of which can be connected to the outlet of the cold plate, and the outlet end of the third flow channel can be connected to the inlet of the heat exchanger. In this technical solution, the circulating pump, the second flow channel, the cold plate, the third flow channel, the heat exchanger, the first flow channel, and the circulating pump are sequentially connected, thereby forming a circulating loop for the cooling medium. During pressure relief, the pressure relief structure releases pressure from the cooling medium after the pump into the flow path between the heat exchanger and the circulating pump. Furthermore, the positions of the heat exchanger and the cold plate can be interchanged. In another technical solution, the inlet end of the first flow channel is used to connect to the outlet of the cold plate, and the outlet end of the first flow channel is used to connect to the inlet of the circulating pump. The inlet end of the second flow channel is connected to the outlet of the circulating pump, and the outlet end of the second flow channel is connected to the inlet of the heat exchanger. The aforementioned multiple flow channels also include a third flow channel, whose inlet end is connected to the outlet of the heat exchanger, and whose outlet end is connected to the inlet of the cold plate. In this technical solution, the circulating pump, second flow channel, heat exchanger, third flow channel, cold plate, first flow channel, and circulating pump are sequentially connected, thus forming a circulating loop for the cooling medium. During pressure relief, the pressure relief structure releases pressure from the cooling medium after the pump into the flow path between the cold plate and the circulating pump.

[0010] The liquid cooling system may also include a replenishment tank, which can be connected to the inlet of the circulating pump via an integrated water circuit board. When the coolant in the circulation loop is insufficient, the replenishment tank can replenish the circulating pump to ensure that the coolant continues to circulate in the loop. Specifically, the aforementioned multiple flow channels may also include a fourth flow channel. The inlet of the fourth flow channel can be connected to the outlet of the replenishment tank, and the outlet of the fourth flow channel is connected to the inlet of the circulating pump.

[0011] In another technical solution, the inlet end of the first flow channel can be connected to the outlet of the replenishment tank, and the outlet end of the first flow channel can be connected to the inlet of the circulating pump. The inlet end of the second flow channel can be connected to the outlet of the circulating pump, and the outlet end of the second flow channel can be connected to the inlet of the cold plate. In this technical solution, the first flow channel can be used as a replenishment flow path to replenish the circulating pump when the cooling medium in the circulation loop is insufficient. During pressure relief, the pressure relief structure releases the pressure of the cooling medium after the pump into the flow path between the replenishment tank and the circulating pump.

[0012] The aforementioned multiple flow channels may further include a third flow channel and a fifth flow channel. The inlet of the third flow channel can be connected to the outlet of the cold plate, and the outlet of the third flow channel can be connected to the inlet of the heat exchanger. The inlet of the fifth flow channel can be connected to the outlet of the heat exchanger, and the outlet of the fifth flow channel can be connected to the inlet of the circulating pump. Therefore, the circulating pump, the second flow channel, the cold plate, the third flow channel, the heat exchanger, the fifth flow channel, and the circulating pump are sequentially connected to form a circulating loop for the cooling working fluid.

[0013] The pressure relief structure is integrated into the integrated water channel substrate. Specifically, the integrated water channel substrate also has a receiving cavity inside, with an inlet and a pressure relief port located on the inner wall of the receiving cavity. The pressure relief structure also includes a spring and a sealing membrane located within the receiving cavity. The sealing membrane covers the inlet, one end of the spring is fixedly connected to the receiving cavity, and the other end of the spring is fixedly connected to the sealing membrane and is used to apply a force toward the inlet to the sealing membrane. The pressure relief port is located between the other end of the spring and the inlet. When the pressure of the cooling medium in the second flow channel is within the pressure-bearing range of the pipeline in the circulation loop, the pressure relief structure does not operate. At this time, the sealing membrane covers the inlet under the action of the spring, preventing the cooling medium in the second flow channel from flowing into the receiving cavity. When the pressure of the cooling medium in the second flow channel is higher than the pressure-bearing range, the pressure relief structure relieves pressure. Specifically, under the pressure difference between the second flow channel and the receiving cavity, the sealing membrane is subjected to pressure away from the inlet. When the pressure is greater than the force of the spring, the sealing membrane is pushed open by the inlet, allowing the cooling medium to flow through the receiving cavity and then into the first flow channel from the pressure relief port. As the cooling medium in the second flow channel gradually decreases, the pressure on the sealing membrane also gradually decreases. When the pressure is less than the force of the spring, the sealing membrane returns to the inlet under the action of the spring to cover the inlet and complete the pressure relief.

[0014] In another technical solution, the pressure relief structure may include a safety valve, which is integrated as a separate component within the integrated water circuit substrate. Specifically, the integrated water circuit substrate also has a receiving cavity. The inner wall of the receiving cavity has a first connecting port and a second connecting port, wherein the first connecting port communicates with a first flow channel, and the second connecting port communicates with a second flow channel. The safety valve has an inlet and a pressure relief port, and is fixed within the receiving cavity. The inlet extends into the second connecting port, and the pressure relief port extends into the first connecting port. In this technical solution, by installing the safety valve within the receiving cavity, the inlet and pressure relief port can be connected to the corresponding flow channels through the connecting ports, without requiring an external drain pipe. This structure is simple and easy to install and operate.

[0015] Secondly, this application also provides a liquid cooling system. The liquid cooling system includes a circulating pump and an integrated water circuit board as described in the first aspect. A first flow channel of the integrated water circuit board is connected to the inlet of the circulating pump, and a second flow channel of the integrated water circuit board is connected to the outlet of the circulating pump. The circulating pump is used to pump the cooling medium from the first flow channel to the second flow channel. In the liquid cooling system of this application, the integrated water circuit board has an integrated pressure relief structure, allowing the cooling medium to be directly discharged from the high-pressure flow path to the low-pressure flow path within the integrated water circuit board without the need for an external drain pipe. Therefore, the aforementioned integrated water circuit board not only reduces the space occupied by the pressure relief structure in the liquid cooling system, but also allows for direct pressure relief within the integrated water circuit board, thereby reducing the risk of leakage.

[0016] In one technical solution, a circulating pump can be mounted on an integrated water channel substrate. Specifically, the surface of the integrated water channel substrate has two mounting ports, one of which communicates with a first flow channel, and the other communicates with a second flow channel. The inlet of the circulating pump can be directly threaded into and communicate with one of the aforementioned mounting ports, and the outlet of the circulating pump can be directly threaded into and communicate with the other aforementioned mounting port. In this technical solution, the integrated water channel substrate can serve both as a flow channel communicating with the circulating pump and as a mounting plate for the circulating pump, thereby simplifying the connection structure between the circulating pump and the integrated water channel substrate.

[0017] Thirdly, this application also provides a power supply cabinet. The power supply cabinet includes a load and a liquid cooling system, which is used to dissipate heat from the load. The liquid cooling system of this power supply cabinet occupies a small space, is not prone to leakage, and can provide better heat dissipation to the load. Attached Figure Description

[0018] Figure 1 A schematic diagram of a data center provided in an embodiment of this application;

[0019] Figure 2 A schematic diagram of a liquid cooling system provided in an embodiment of this application;

[0020] Figure 3 Another schematic diagram of the liquid cooling system provided in the embodiments of this application;

[0021] Figure 4 Another schematic diagram of the liquid cooling system provided in the embodiments of this application;

[0022] Figure 5 Another schematic diagram of the liquid cooling system provided in the embodiments of this application;

[0023] Figure 6 This is a partial schematic diagram of the water channel substrate provided in an embodiment of this application.

[0024] Figure label:

[0025] 10-Data Center 20-Chilled Water System 21-Cooling Tower

[0026] 22-Cooling pump; 23-Chiller unit; 24-Refrigeration pump

[0027] 25-Air conditioning unit; 30-Liquid cooling system; 31-Cold tower

[0028] 32-Heat exchanger; 33-Water pump; 34-Circulating pump

[0029] 35-Pressure relief structure; 36-Cold plate; 37-Expansion tank

[0030] 38-Replenishment pump; 39-Replenishment tank; 40-Computer room

[0031] 41-Power supply cabinet; 60-Integrated water circuit board; 61-Receiving cavity

[0032] 351 - Spring, 352 - Sealing membrane Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0034] It should be noted that the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0035] To facilitate understanding of the integrated cooling substrate provided in this application embodiment, its application scenarios are described below. The integrated cooling substrate of this application can be used, but is not limited to, in scenarios requiring liquid cooling, such as data centers and energy storage cabinets. It can be used to dissipate heat from electronic equipment in data centers or energy storage cabinets, thereby ensuring the normal operation of the data center. With the development of computer and network technology, the power of high-performance electronic devices is constantly increasing, and the integration of power devices is becoming increasingly sophisticated, resulting in a higher power density for electronic devices. Since electronic devices generate heat during operation, high-power devices can cause excessive heat load on the electronic devices, and sustained high temperatures can severely affect the performance of electronic devices, even leading to damage. Therefore, to ensure the reliable operation of electronic devices, good heat dissipation capabilities are often required. Currently, heat dissipation mainly relies on configuring a cooling system.

[0036] Figure 1 This is a schematic diagram of a data center provided in an embodiment of this application. Figure 1As shown, data center 10 typically uses a chilled water system 20 and a liquid cooling system 30 to dissipate heat from the power cabinet 41 in the server room 40. Specifically, the server room 40 of data center 10 can be equipped with a cooling dispensing unit (CDU), and the liquid cooling system 30 can dissipate heat from the power cabinet 41 through the CDU. The liquid cooling system 30 includes a cooling tower 31, a heat exchanger 32, a water pump 33, etc. The cooler working fluid in the cooling tower 31 can be transported to the CDU through the pipe shown by the dashed line and exchange heat with the load of the power cabinet 41. After heat exchange, the heated working fluid returns to the cooling tower 31 through the pipe shown by the dashed line, and this cycle continuously dissipates heat from the data center 10. The chilled water system 20 includes a cooling tower 21, a cooling pump 22, a chiller unit 23, a chilled water pump 24, and an air conditioning unit 25. The air conditioning unit 25 is located inside the computer room 40. Low-temperature chilled water is pumped to the air conditioning unit 25, which removes heat from the computer room 40. The water is then cooled by the cooling tower 21 and the chiller unit 23. This cycle repeats continuously to achieve continuous heat dissipation for the data center 10. The power cabinet 41 can be an energy storage cabinet, a server, or an uninterruptible power supply (UPS).

[0037] Both the liquid cooling system 30 and the chilled water system 20 can be equipped with safety valves in their respective circulation loops to prevent the working fluid pressure from exceeding the pipeline's pressure limit. Existing safety valves are typically installed in high-pressure pipelines, with a drain pipe connected to the pressure relief port. During pressure relief, the safety valve opens and discharges through the pressure relief port. However, directly installing the safety valve on the pipeline requires separate assembly, and the safety valve itself, along with the external drain pipe, occupies space in the data center 10, which is detrimental to the high-density structural layout of the data center 10. Furthermore, the drain pipe poses a risk of leakage, hindering the separation of water and electricity.

[0038] In view of this, this application provides an integrated water circuit board, liquid cooling system and power cabinet, so as to integrate the pressure relief structure into the water circuit board, thereby reducing the space occupied by the liquid cooling system and reducing the risk of water leakage.

[0039] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0040] In this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0041] This application provides a power cabinet 41, which can be applied to power supply systems or data centers. Taking the power cabinet 41 as an example, the power cabinet 41 may include a load and a liquid cooling system 30, wherein the liquid cooling system 30 can be any of the liquid cooling systems described above, and the liquid cooling system 30 is used to dissipate heat from the load.

[0042] Figure 2 This is a schematic diagram of a liquid cooling system provided in an embodiment of this application. Figure 2 As shown, the liquid cooling system 30 includes a circulating pump 34 and an integrated water circuit board. The integrated water circuit board has multiple flow channels and a pressure relief structure 35 internally. Specifically, the aforementioned multiple flow channels include a first flow channel AB and a second flow channel CD. The first flow channel AB is connected to the inlet of the circulating pump 34, and the second flow channel CD is connected to the outlet of the circulating pump 34. The pressure relief structure 35 includes an inlet M and a pressure relief port N. The inlet M is connected to the second flow channel CD, and the pressure relief port N is connected to the first flow channel AB. The circulating pump 34 pumps the cooling medium from the first flow channel AB to the second flow channel CD, and the pressure relief structure 35 releases pressure from a portion of the cooling medium in the second flow channel CD back to the first flow channel AB.

[0043] In the above embodiment, the circulation pump 34 connects the first flow channel AB and the second flow channel CD of the integrated water circuit substrate. The circulation pump 34 pumps the cooling medium from the first flow channel AB to the second flow channel CD. The first flow channel AB is located before the pump, which is the low-pressure flow path; the second flow channel CD is located after the pump, which is the high-pressure flow path. When the liquid cooling system 30 experiences blockage, overcharging of the working medium, or excessively high system temperature, the pressure in the liquid cooling system 30 becomes too high and exceeds the pressure relief threshold of the pressure relief structure 35, thus activating the pressure relief structure 35 to release pressure. When the pressure relief structure 35 releases pressure to the second flow channel CD, it can directly release the cooling medium flowing from the outlet of the circulation pump 34 to the first flow channel AB within the integrated water circuit substrate, without requiring an external drain pipe. Therefore, the above-mentioned integrated water circuit substrate not only reduces the space occupied by the pressure relief structure 35 in the liquid cooling system 30, but also achieves pressure relief directly within the integrated water circuit substrate, thereby reducing the risk of leakage.

[0044] The multiple flow channels of the aforementioned integrated water circuit board can be connected to other components of the liquid cooling system 30 (including but not limited to the circulating pump 34, heat exchanger 32, cold plate 36, expansion tank 37, replenishment pump 38, replenishment tank 39, etc.), thereby forming a circulating loop for the cooling medium. The pressure relief structure 35 is used to relieve part of the cooling medium in the high-pressure flow path to the low-pressure flow path, wherein the pressure relief port N can be connected to different locations in the low-pressure flow path.

[0045] like Figure 2 As shown, in one embodiment, the inlet end of the first flow channel AB is connected to the outlet end of the cold plate 36, and the outlet end of the first flow channel AB is connected to the inlet end of the heat exchanger 32. The inlet end of the second flow channel CD is connected to the outlet end of the circulating pump 34, and the outlet end of the second flow channel CD is connected to the inlet end of the cold plate 36. The aforementioned multiple flow channels may further include a third flow channel EF, whose inlet end is connected to the outlet end of the heat exchanger 32, and its outlet end is connected to the inlet end of the circulating pump 34. In this embodiment, the circulating pump 34, the second flow channel CD, the cold plate 36, the first flow channel AB, the heat exchanger 32, the third flow channel EF, and the circulating pump 34 are sequentially connected to form a circulating loop for the cooling medium. During pressure relief, the pressure relief structure 35 releases pressure from the pumped cooling medium into the flow path between the cold plate 36 and the heat exchanger 32.

[0046] In the above embodiments, the circulation loop may further include an expansion tank 37. The expansion tank 37 is used to balance pressure fluctuations in the liquid cooling system 30 to ensure hydraulic stability of the liquid cooling system 30. Specifically, in the liquid cooling system 30, when the pressure in the circulation loop decreases, the gas pressure inside the expansion tank 37 will be greater than the pressure of the cooling working fluid. The gas expands to expel water from the tank and replenish the loop, thereby maintaining the pressure stability of the liquid cooling system 30. This structure can effectively buffer changes in the working fluid pressure, prevent water hammer, and thus protect the liquid cooling system 30 from damage.

[0047] In addition, the liquid cooling system 30 may also be equipped with a replenishment tank 39, which can be connected to the inlet of the circulation pump 34 via an integrated water circuit board. When the coolant in the circulation loop is insufficient, the replenishment tank 39 can replenish the coolant to the circulation pump 34 to ensure that the coolant continues to circulate in the circulation loop. Specifically, the above-mentioned multiple flow channels may also include a fourth flow channel PF. The inlet of the fourth flow channel PF is connected to the outlet of the replenishment tank 39, and the outlet of the fourth flow channel PF is connected to the inlet of the circulation pump 34. Furthermore, a replenishment pump 38 may also be provided between the replenishment tank 39 and the circulation pump 34, which is used to pump the coolant in the replenishment tank 39 to the circulation pump 34.

[0048] Figure 3 Another schematic diagram of a liquid cooling system provided in an embodiment of this application. (See diagram below.) Figure 3As shown, in another embodiment, the inlet end of the first flow channel AB is connected to the outlet end of the heat exchanger 32, and the outlet end of the first flow channel AB is connected to the inlet end of the circulating pump 34. The inlet end of the second flow channel CD is connected to the outlet end of the circulating pump 34, and the outlet end of the second flow channel CD is connected to the inlet end of the cold plate 36. The above-mentioned multiple flow channels may also include a third flow channel EF, the inlet end of the third flow channel EF is connected to the outlet end of the cold plate 36, and the outlet end of the third flow channel EF is connected to the inlet end of the heat exchanger 32. In this embodiment, the circulating pump 34, the second flow channel CD, the cold plate 36, the third flow channel EF, the heat exchanger 32, the first flow channel AB, and the circulating pump 34 are sequentially connected to form a circulating loop for the cooling working fluid. During pressure relief, the pressure relief structure 35 relieves the pressure of the cooling working fluid after the pump into the flow path between the heat exchanger 32 and the circulating pump 34.

[0049] The positions of the heat exchanger 32 and the cold plate 36 can be interchanged. Figure 4 Another schematic diagram of a liquid cooling system provided in an embodiment of this application. (See diagram below.) Figure 4 As shown, the inlet end of the first flow channel AB is connected to the outlet end of the cold plate 36, and the outlet end of the first flow channel AB is connected to the inlet end of the circulating pump 34. The inlet end of the second flow channel CD is connected to the outlet end of the circulating pump 34, and the outlet end of the second flow channel CD is connected to the inlet end of the heat exchanger 32. The aforementioned multiple flow channels also include a third flow channel EF, whose inlet end is connected to the outlet end of the heat exchanger 32, and its outlet end is connected to the inlet end of the cold plate 36. In this embodiment, the circulating pump 34, the second flow channel CD, the heat exchanger 32, the third flow channel EF, the cold plate 36, the first flow channel AB, and the circulating pump 34 are sequentially connected to form a circulating loop for the cooling medium. During pressure relief, the pressure relief structure 35 releases pressure from the pumped cooling medium into the flow path between the cold plate 36 and the circulating pump 34.

[0050] Figure 5 Another schematic diagram of a liquid cooling system provided in an embodiment of this application. (See diagram below.) Figure 5 As shown, in another embodiment, the inlet of the first flow channel AB is connected to the outlet of the replenishment tank 39, and the outlet of the first flow channel AB is connected to the inlet of the circulating pump 34. The inlet of the second flow channel CD is connected to the outlet of the circulating pump 34, and the outlet of the second flow channel CD is connected to the inlet of the cold plate 36. In this embodiment, the first flow channel AB can be used as a replenishment flow path to replenish the circulating pump 34 when the cooling medium in the circulation loop is insufficient. During pressure relief, the pressure relief structure 35 relieves the pressure of the cooling medium after the pump into the flow path between the replenishment tank 39 and the circulating pump 34.

[0051] The aforementioned multiple flow channels may further include a third flow channel EF and a fifth flow channel GB. The inlet of the third flow channel EF is connected to the outlet of the cold plate 36, and the outlet of the third flow channel EF is connected to the inlet of the heat exchanger 32. The inlet of the fifth flow channel GB is connected to the outlet of the heat exchanger 32, and the outlet of the fifth flow channel GB is connected to the inlet of the circulating pump 34. Therefore, the circulating pump 34, the second flow channel CD, the cold plate 36, the third flow channel EF, the heat exchanger 32, the fifth flow channel GB, and the circulating pump 34 are sequentially connected to form a circulating loop for the cooling working fluid.

[0052] Figure 6 This is a partial schematic diagram of the water channel substrate provided in an embodiment of this application. Figure 6 As shown, the pressure relief structure 35 is integrated into the integrated water channel substrate 60. Specifically, the integrated water channel substrate 60 also has a receiving cavity 61 inside, with the liquid inlet M and the pressure relief port N opened on the inner wall of the receiving cavity 61. The pressure relief structure 35 also includes a spring 351 and a sealing diaphragm 352 located within the receiving cavity 61. Figure 6 As shown in the lower left figure, a sealing membrane 352 covers the inlet M. One end of a spring 351 is fixedly connected to the receiving cavity 61, and the other end of the spring 351 is fixedly connected to the sealing membrane 352 and is used to apply a force toward the inlet M to the sealing membrane 352. A pressure relief port N is located between the other end of the spring 351 and the inlet M. When the pressure of the cooling medium in the second flow channel CD is within the pressure-bearing range of the pipeline in the circulation loop, the pressure relief structure 35 does not operate. At this time, the sealing membrane 352, under the action of the spring 351, covers the inlet M, preventing the cooling medium in the second flow channel CD from flowing into the receiving cavity 61. Figure 6 As shown in the lower right figure, when the pressure of the cooling medium in the second flow channel CD is higher than the pressure bearing range, the pressure relief structure 35 relieves pressure. Specifically, under the pressure difference between the second flow channel CD and the receiving cavity 61, the sealing membrane 352 is subjected to pressure away from the inlet M. When the pressure is greater than the force of the spring 351, the sealing membrane 352 is pushed open from the inlet M, allowing the cooling medium to flow through the receiving cavity 61 and then into the first flow channel AB from the pressure relief port N. As the amount of cooling medium in the second flow channel CD gradually decreases, the pressure on the sealing membrane 352 also gradually decreases. When the pressure is less than the force of the spring 351, the sealing membrane 352 returns to the inlet M under the action of the spring 351 to cover the inlet M and complete the pressure relief.

[0053] In another embodiment, the pressure relief structure 35 may include a safety valve, which is integrated as a separate component within the integrated water circuit substrate 60. Specifically, the integrated water circuit substrate 60 also has a receiving cavity 61. The inner wall of the receiving cavity 61 has a first connecting port and a second connecting port, wherein the first connecting port communicates with the first flow channel AB, and the second connecting port communicates with the second flow channel CD. The safety valve has an inlet port M and a pressure relief port N, and the safety valve is fixed within the receiving cavity 61. The inlet port M extends into the second connecting port, and the pressure relief port N extends into the first connecting port. In this embodiment, by installing the safety valve within the receiving cavity, the inlet port M and the pressure relief port N can be connected to the corresponding flow channels through the connecting ports, without the need for an external drain pipe. This structure is simple and easy to install and operate.

[0054] In one embodiment, the circulating pump 34 can be mounted on the integrated water channel substrate 60. Specifically, the surface of the integrated water channel substrate 60 has two mounting ports, one of which communicates with the first flow channel AB, and the other of which communicates with the second flow channel CD. The inlet of the circulating pump 34 can be directly threaded to and communicate with one of the aforementioned mounting ports, and the outlet of the circulating pump 34 can be directly threaded to and communicate with the other of the aforementioned mounting ports. In this embodiment, the integrated water channel substrate 60 can serve both as a flow channel communicating with the circulating pump 34 and as a mounting plate for the circulating pump 34, thereby simplifying the connection structure between the circulating pump 34 and the integrated water channel substrate 60.

[0055] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An integrated water channel substrate, characterized in that, The integrated water circuit substrate has multiple flow channels and pressure relief structures inside, wherein: The plurality of flow channels include a first flow channel and a second flow channel. The first flow channel is used to communicate with the inlet of the circulating pump, and the second flow channel is used to communicate with the outlet of the circulating pump. The pressure relief structure includes an inlet and a pressure relief port. The inlet is connected to the second flow channel, and the pressure relief port is connected to the first flow channel. The pressure relief structure is used to release a portion of the cooling working fluid in the second flow channel to the first flow channel.

2. The integrated water channel substrate as described in claim 1, characterized in that, The inlet end of the first flow channel is used to connect to the outlet of the cold plate, and the outlet end of the first flow channel is used to connect to the inlet of the heat exchanger; the inlet end of the second flow channel is used to connect to the outlet of the circulating pump, and the outlet end of the second flow channel is used to connect to the inlet of the cold plate. The plurality of flow channels also includes a third flow channel, the inlet end of which is used to connect to the outlet of the heat exchanger, and the outlet end of which is used to connect to the inlet of the circulating pump.

3. The integrated water channel substrate as described in claim 1, characterized in that, The inlet end of the first flow channel is connected to the outlet end of the heat exchanger, and the outlet end of the first flow channel is connected to the inlet end of the circulating pump; the inlet end of the second flow channel is connected to the outlet end of the circulating pump, and the outlet end of the second flow channel is connected to the inlet end of the cold plate; the plurality of flow channels further includes a third flow channel, the inlet end of which is connected to the outlet end of the cold plate, and the outlet end of the third flow channel is connected to the inlet end of the heat exchanger; or, The inlet end of the first flow channel is used to connect to the outlet of the cold plate, and the outlet end of the first flow channel is used to connect to the inlet of the circulating pump; the inlet end of the second flow channel is used to connect to the outlet of the circulating pump, and the outlet end of the second flow channel is used to connect to the inlet of the heat exchanger; the plurality of flow channels also includes a third flow channel, the inlet end of the third flow channel is used to connect to the outlet of the heat exchanger, and the outlet end of the third flow channel is used to connect to the inlet of the cold plate.

4. The integrated water channel substrate as described in claim 2 or 3, characterized in that, The plurality of flow channels also includes a fourth flow channel, the inlet of which is used to communicate with the outlet of the replenishment tank, and the outlet of which is used to connect with the inlet of the circulation pump.

5. The integrated water channel substrate as described in claim 1, characterized in that, The inlet end of the first flow channel is used to connect with the outlet of the replenishment tank, and the outlet end of the first flow channel is used to connect with the inlet of the circulation pump; the inlet end of the second flow channel is used to connect with the outlet of the circulation pump, and the outlet end of the second flow channel is used to connect with the inlet of the cold plate.

6. The integrated water channel substrate as described in any one of claims 1 to 5, characterized in that, The integrated water circuit substrate also has a receiving cavity inside, and the liquid inlet and the pressure relief port are opened on the inner wall of the receiving cavity; the pressure relief structure also includes a spring and a sealing membrane located in the receiving cavity, the sealing membrane covering the liquid inlet, one end of the spring being fixedly connected to the receiving cavity, and the other end of the spring being fixedly connected to the sealing membrane and used to apply a force toward the liquid inlet to the sealing membrane; the pressure relief port is located between the other end of the spring and the liquid inlet.

7. The integrated water channel substrate as described in any one of claims 1 to 5, characterized in that, The integrated water circuit substrate is further provided with a receiving cavity inside. The inner wall of the receiving cavity is provided with a first connecting port and a second connecting port. The first connecting port is connected to the first flow channel, and the second connecting port is connected to the second flow channel. The pressure relief structure includes a safety valve, which is fixed inside the receiving cavity; the safety valve has a liquid inlet and a pressure relief port, the liquid inlet extending into the second connecting port and the pressure relief port extending into the first connecting port.

8. A liquid cooling system, characterized in that, The device includes a circulating pump and an integrated water circuit substrate as described in any one of claims 1 to 7, wherein the first flow channel is connected to the inlet of the circulating pump, the second flow channel is connected to the outlet of the circulating pump, and the circulating pump is used to pump the cooling working fluid from the first flow channel to the second flow channel.

9. The liquid cooling system as described in claim 8, characterized in that, The circulating pump is installed on the integrated water circuit base plate.

10. A power supply cabinet, characterized in that, Includes a load and a liquid cooling system as described in claim 8 or 9, the liquid cooling system being used to dissipate heat from the load.

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