A process for assembling a three-layer composite board by using a robot to flip the buckled composite board

Abstract

The present application relates to the technical field of multi-layer board automatic processing, in particular to a three-layer composite board assembly process using mechanical hand overturning and buckling. 2 2 Special glue, pushed to the stacking platform by electric pusher; control gantry suction cup to grab core material and accurately drop and overlap on the bottom layer board; through the vacuum suction cup to grab the single-sided glued upper layer board, use servo overturning mechanism to overturn it by 180° to make the glued surface face down, and control the alignment error within ±0.5mm under the auxiliary of mechanical limiting to buckle vertically on the surface of the core material. The automatic process strictly controls the placement time of board gluing to assembly completion between 10 minutes to 35 minutes. The present application realizes zero shear interlayer bonding by machine overturning and buckling, eliminates the problems of manual alignment error and sliding glue, and greatly improves the comprehensive structural strength of the composite board.​

Description

Technical Field

[0001] This invention relates to the field of automated processing technology for multilayer boards, and more specifically, to a process for assembling three-layer composite boards using a robotic arm for flipping and snapping. Background Technology

[0002] In the manufacturing process of multi-layer composite boards such as plywood, special insulation boards and cross-linked boards, the assembly process (i.e., the gluing and stacking of each layer of boards) is the core process that determines the interlayer bonding strength and structural stability of the final product.

[0003] Currently, the assembly of large-size, heavy three-layer composite boards (such as LNG insulation substrates) in the industry often faces the following technical challenges: First, due to the large size of the single boards and their extremely slippery surfaces after being coated with special adhesives, the current mainstream mechanical laying or manual flipping and stacking methods are prone to uncontrollable shearing and sliding at the moment of contact between the boards, resulting in a large alignment error (usually greater than 2mm) in the final three layers. This physical misalignment will translate into huge residual assembly stress inside the board during the subsequent hot and cold pressing stages, which can easily induce board deformation or interlayer tearing during use. Second, the existing flat-push board dropping mechanism will squeeze the adhesive layer when stacking the upper board, resulting in uneven adhesive distribution. Third, traditional assembly operations are highly dependent on manual labor, and the cycle is extremely unstable, which can easily cause the bottom or top boards to be left to sit for longer than the optimal activity period of the adhesive after application, resulting in irreversible loss of final bonding strength.

[0004] Therefore, there is an urgent need for an automated blank assembly process that can achieve zero shear force bonding, extremely high alignment accuracy, and strictly controllable aging time. Summary of the Invention

[0005] The purpose of this invention is to provide a three-layer composite board assembly process using a robotic arm for flipping and fastening, in order to solve the technical problems of large interlayer sliding shearing errors, low alignment accuracy, and loss of adhesive activity due to uncontrollable cycle time in existing assembly technologies.

[0006] To achieve the above objectives, the present invention provides a process for assembling a three-layer composite board using a robotic arm for flipping and fastening, comprising the following steps: S1. Applying adhesive to and conveying the bottom layer: The bottom layer is gripped by a vacuum suction cup and transferred to a small alignment device for alignment and positioning; the bonding surface of the bottom layer is uniformly coated with a special adhesive, with the amount of adhesive controlled at 180g / m². 2 Up to 200g / m 2 After the adhesive is applied, the bottom layer of material is pushed to the stacking platform along a preset trajectory by an electric pusher mechanism. S2. Core Material Precision Stacking: The core material is picked up by the vacuum suction cup of the gantry frame and moved to the top of the palletizing platform according to the preset path; the positioning system guides the core material to be precisely aligned with the bottom board, and then it is smoothly lowered and stacked on the adhesive surface of the bottom board; S3. Upper Layer Board Flipping and Overlapping: The upper layer board, coated with the special adhesive on one side, is picked up by a vacuum suction cup; the 180° flipping mechanism is controlled to flip the upper layer board 180° so that the adhesive side is facing down; the three layers are aligned by sensors and mechanical limit baffles, and the alignment error is controlled within ±0.5mm; then the upper layer board is smoothly overlapped onto the surface of the core material to complete the automated assembly of the three-layer composite board; The aging time for the bottom and top layers of the board, from the application of special adhesive to the completion of the three-layer composite board assembly, is strictly controlled between 10 and 35 minutes.

[0007] In S1, the moisture content of the bottom layer, core material, and top layer veneers is controlled between 6% and 10%.

[0008] In S1 and S3, the special adhesive is a mixture of liquid phenolic resin and powdered curing agent, and the mixing weight ratio of the mixture is: 100 parts liquid phenolic resin, 10 to 18 parts powdered curing agent, 0 to 15 parts water, and 0 to 10 parts flour; the physicochemical properties of the mixed special adhesive meet the following requirements: solid content of 47.5% to 49.5% and pH value of 12 to 13.

[0009] In step S1, the electric pusher mechanism pushes the bottom layer material to the palletizing platform along a preset trajectory. The pushing speed of the electric pusher mechanism is set to 15m / min to 20m / min. The small alignment device includes a cylinder-driven push plate and a mechanical alignment reference baffle, which are used to eliminate the placement offset error of the bottom layer material during initial feeding.

[0010] In S3, the working negative pressure value of both the vacuum suction cup and the gantry vacuum suction cup is set to -60kPa to -85kPa when gripping the sheet metal.

[0011] In S3, after the automated assembly of the three-layer composite board is completed, cold pressing and hot pressing processes are also included; the cold pressing time of the three-layer composite board is 8 to 10 minutes; the assembly and standing time from the end of cold pressing to the start of hot pressing is controlled between 30 and 60 minutes.

[0012] An automated assembly system for three-layer composite panels is provided to realize the above-mentioned assembly process of three-layer composite panels using a robotic arm for flipping and fastening. The system includes a feeding module, an adhesive application module, and a stacking module arranged in sequence. The feeding module includes a small positioning device. The adhesive application module is connected to an electric pusher mechanism, the output end of which points to the stacking platform. The stacking module is located above the stacking platform and includes a gantry vacuum suction cup for gripping the core material, a vacuum suction cup for gripping the upper layer of panels, and a 180° flipping mechanism that is drivenly connected to the vacuum suction cup.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: This three-layer composite board assembly process, utilizing a robotic arm for flipping and fastening, abandons the traditional flat-laying and pushing logic, and introduces a 180° flipping mechanism. At the moment the surface materials are stacked, the robotic arm, holding the upper layer of board material, flips 180 degrees under the drive of a servo motor. Combined with high-precision sensors and mechanical baffles, it completes the final snap-fit ​​using a vertical motion trajectory. This eliminates the frictional shear force during the lateral contact of the board layers, ensuring the absolute uniformity of the high-viscosity adhesive coating and locking the overall alignment error of the three layers within ±0.5mm, significantly reducing residual assembly stress generated during subsequent pressing.

[0014] Secondly, the entire assembly process is executed unmanned by automated robotic arms and electric pushers (15-20 m / min). The resting time from gluing to the completion of the interlocking is precisely quantified to between 10 and 35 minutes. This time window matches the initial tack activation curve of the special liquid phenolic adhesive: at this time, the adhesive surface is slightly dry to prevent dripping, while the internal resin maintains excellent penetration and fluidity, allowing it to penetrate the board's ducts to the deepest level after flipping and interlocking, forming a strong mechanical interlocking bond. Attached Figure Description

[0015] Figure 1 This is an overall flowchart of Embodiment 1 of the present invention. Detailed Implementation

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] In embodiments of the present invention, the assembly process relies on an automated production line system centrally controlled by a PLC. The small alignment device includes mutually perpendicular X-axis and Y-axis cylinder-driven push plates and a reference right-angle baffle. When the bottom layer of material enters the workstation, the push plate action presses the material against the baffle, eliminating the initial placement angle deviation. The electric pusher mechanism uses a high-torque motor-driven belt conveyor for horizontal pushing. The 180° flipping mechanism includes a servo motor-driven flipping spindle and a flipping arm connected to the spindle. A vacuum suction cup array is arranged at the end (maintaining a working negative pressure of -60kPa to -85kPa to prevent heavy plates from falling). Photoelectric sensors detect the edge of the material in real time and feed back to the central controller, achieving millimeter-level precise drop and snapping.

[0018] The special adhesive mentioned is formulated with Taier 15M930 liquid phenolic adhesive as the main agent.

[0019] Example 1: This embodiment of the invention provides a process for assembling a three-layer composite board using a robotic arm for flipping and fastening, using a board with a moisture content of 8% as the substrate. The process includes the following steps: S1: Prepare a special adhesive (100 parts 15M930 resin, 14 parts powdered hardener, 5 parts water, 2 parts flour, solid content 48.5%). Use a vacuum suction cup to transfer the bottom layer to the small positioning device for positioning. Apply the adhesive evenly to one side of the bonding surface, with an adhesive application rate of 190g / m². 2 It is precisely pushed to the palletizing platform at a speed of 18m / min by an electric pusher mechanism.

[0020] S2: The gantry vacuum suction cup grabs the uncoated core material and, guided by the positioning system, lowers it vertically and smoothly stacks it on the coated surface of the bottom board.

[0021] S3: Vacuum suction cup gripping single-sided adhesive application (adhesive amount 190g / m²) 2 The upper layer of the material is rotated 180° by controlling the rotating spindle so that the glued surface faces down. The sensor, together with the mechanical limit baffle, locks the three-dimensional coordinates and presses it vertically against the core material surface.

[0022] The entire process is unmanned, with the aging time precisely controlled at 20 minutes. After the blanks are assembled, they undergo 9 minutes of cold pressing and are left to stand for 45 minutes before entering the hot pressing process.

[0023] Example 2: The process steps are the same as in Example 1, except that the parameters are adjusted as follows: The moisture content of the bottom board in S1 is 10%, and the amount of adhesive applied is controlled at 180g / m². 2 The electric pusher mechanism was set to push at a speed of 15 m / min. After the upper and middle layers of the S3 were flipped and buckled, the actual recorded storage time was 30 minutes, the cold pressing time was 10 minutes, and the assembly and settling time was 60 minutes.

[0024] Example 3: The process steps are the same as in Example 1, except that the parameters are adjusted as follows: The moisture content of the bottom board in S1 is 6%, and the amount of adhesive applied is controlled at 200g / m². 2 The electric pusher mechanism is set to push at a speed of 20m / min. After the upper and middle layers of the S3 are flipped and buckled, the actual recorded storage time is reduced to 10 minutes, the cold pressing time is 8 minutes, and the assembly settling time is 30 minutes.

[0025] Comparative Example 1: Manual flipping and assembly of blanks. This comparative example does not use automated robotic arms or flipping mechanisms. The amount of adhesive applied to the bottom plate is the same as in Example 1 (190 g / m²). 2 Then, four workers visually aligned the core material and lifted it onto the top layer; the upper layer was manually flipped and pushed to the alignment position by the workers, and the actual placement time reached 45 minutes.

[0026] Comparative Example 2: Flat-push mechanical dropping, without 180-degree flipping. This comparative example omits the 180-degree flipping and buckling action. The upper layer of board, with the glued surface facing down, is directly pushed forward and slid onto the core material surface via a horizontal conveyor belt, with a settling time of 20 minutes.

[0027] The finished sheets obtained in Examples 1-3 and Comparative Examples 1-2 were subjected to destructive shear force tests and optical appearance inspections. The results are shown in the table below:

[0028] As shown in the table above, although Comparative Example 2 controlled the curing time, the horizontal pushing action caused lateral shear friction when the upper board came into contact with the core material, resulting in glue accumulation at the front end and insufficient glue at the rear end, with a decrease in shear strength of nearly 22%. This process achieves zero shear force contact through vertical buckling after a 180° robotic arm flip, with uniform glue layer distribution and minimal alignment error.

[0029] Comparative Example 1 had a curing time of 45 minutes, exceeding the optimal activity period of the adhesive. Premature resin cross-linking resulted in a loss of deep penetration ability, leading to a sharp drop in shear force. Furthermore, manual handling caused misalignment, which converted into residual stress after cold pressing, causing warping. This process, through a fully automated production line that locks in the curing time, ensures a better mechanical interlocking bond between layers.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A process for assembling three-layer composite panels using a robotic arm for flipping and fastening, characterized in that, Includes the following steps: S1. Applying adhesive to and conveying the bottom layer: The bottom layer is gripped by a vacuum suction cup and transferred to a small alignment device for alignment and positioning; the bonding surface of the bottom layer is uniformly coated with a special adhesive, with the amount of adhesive controlled at 180g / m². 2 Up to 200g / m 2 After the adhesive is applied, the bottom layer of material is pushed to the stacking platform along a preset trajectory by an electric pusher mechanism. S2, Core Material Stacking: The core material is picked up by the vacuum suction cup of the gantry frame and moved to the top of the stacking platform according to the preset path; the core material is guided to align with the bottom board through the positioning system, and then placed down and stacked on the adhesive surface of the bottom board; S3. Upper Layer Board Flipping and Overlapping: The upper layer board, coated with special adhesive on one side, is picked up by a vacuum suction cup; the 180° flipping mechanism is controlled to flip the upper layer board 180° so that the adhesive side is facing down; the three layers are aligned by sensors and mechanical limit baffles, and the alignment error is controlled within ±0.5mm; then the upper layer board is overlapped onto the surface of the core material by vertical movement, completing the automated assembly of the three-layer composite board; The aging time for the bottom and top layers of the board from the application of special adhesive to the completion of the three-layer composite board assembly is strictly controlled between 10 and 35 minutes.

2. The three-layer composite plate assembly process using a robotic arm for flipping and fastening as described in claim 1, characterized in that, In S1, the moisture content of the bottom layer board, the core material, and the top layer board is controlled between 6% and 10%.

3. The three-layer composite board assembly process using a robotic arm for flipping and fastening as described in claim 1, characterized in that, In S1 and S3, the special adhesive is a mixture of liquid phenolic resin and powdered curing agent, and the mixing weight ratio of the mixture is: 100 parts liquid phenolic resin, 10 to 18 parts powdered curing agent, 0 to 15 parts water, and 0 to 10 parts flour; the special adhesive after mixing meets the following specifications: solid content of 47.5% to 49.5% and pH value of 12 to 13.

4. The three-layer composite plate assembly process using a robotic arm for flipping and fastening as described in claim 1, characterized in that, In step S1, the electric pusher mechanism pushes the bottom layer of material to the palletizing platform along a preset trajectory. The pushing speed of the electric pusher mechanism is set to 15m / min to 20m / min. The small alignment device includes a cylinder-driven push plate and a mechanical alignment reference baffle, which are used to eliminate the placement offset error of the bottom layer of material during initial feeding.

5. The three-layer composite plate assembly process using a robotic arm for flipping and fastening as described in claim 1, characterized in that, In S3, the working negative pressure value of both the vacuum suction cup and the gantry vacuum suction cup is set to -60kPa to -85kPa when gripping the sheet metal.

6. The three-layer composite plate assembly process using a robotic arm for flipping and fastening as described in claim 1, characterized in that, In S3, after the automated assembly of the three-layer composite board is completed, cold pressing and hot pressing processes are also included; the cold pressing time of the three-layer composite board is 8 to 10 minutes; the assembly and standing time from the end of cold pressing to the start of hot pressing is controlled between 30 and 60 minutes.

7. An automated assembly system for a three-layer composite plate, characterized in that, The process for assembling a three-layer composite board using a robotic arm for flipping and fastening as described in any one of claims 1 to 6 includes a feeding module, an adhesive application module, and a stacking and stacking module arranged sequentially. The feeding module includes a small positioning device. The adhesive application module is followed by an electric pusher mechanism, the output end of which points towards the stacking platform. The stacking and stacking module is located above the stacking platform and includes a gantry vacuum suction cup for gripping the core material, a vacuum suction cup for gripping the upper layer of the board, and a 180° flipping mechanism that is drively connected to the vacuum suction cup.

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