Copper foil electroplating control method and device based on magnetic force non-contact conduction

Abstract

The application relates to the technical field of copper foil electroplating preparation, and discloses a copper foil electroplating control method and device based on magnetic non-contact conduction, which comprises the following steps: according to the determined module calibration requirement parameters of the system, performing an initialization calibration operation on the clamping module and the magnetic non-contact conduction module of the system; the clamping module clamps a target copper foil to be electroplated; after the initialization calibration operation is completed, the basic running parameters of the system are determined, and after the system is started, the target copper foil is electroplated based on the basic running parameters; in the electroplating process, the target tension parameters and target induced current parameters of the target copper foil are collected to perform real-time linkage adjustment on the basic running parameters. It can be seen that the application can eliminate the stress interference of contact conduction from the root by combining the linkage adjustment process under the parameter differentiation based on the magnetic non-contact conduction technology, reduces the copper foil clamping edge breakage and film breakage, and thus improves the copper foil electroplating yield.

Description

Technical Field

[0001] This invention relates to the field of copper foil electroplating technology, and in particular to a method and apparatus for controlling copper foil electroplating based on magnetic non-contact conductivity. Background Technology

[0002] Composite copper foil, as a new generation of current collector material, has broad application prospects in the lithium battery field. However, during the electroplating process of composite copper foil, frequent breakage and film breakage in the edge area have become a common industry problem restricting the improvement of product yield. Traditional edge electroplating solutions generally adopt physical contact conductivity methods such as conductive copper strips, but this method is prone to local stress concentration on the film surface due to uneven contact pressure and component wear during long-term operation, leading to damage. At the same time, the existing process lacks effective coordination between tension control, speed difference control, and conductivity state. Sudden current changes can easily exacerbate the stress imbalance on the film surface, further worsening edge defects and seriously hindering the high-quality development of the lithium battery industry. Therefore, there is an urgent need for a composite copper foil electroplating control technology solution that can effectively improve the quality of edge electroplating. Summary of the Invention

[0003] This invention provides a method and apparatus for controlling copper foil electroplating based on magnetic non-contact conductivity, which eliminates stress interference from contact conductivity at the source, reduces copper foil edge breakage and film breakage, thereby improving the yield of copper foil electroplating.

[0004] To address the aforementioned technical problems, the first aspect of this invention discloses a copper foil electroplating control method based on magnetic non-contact conductivity. The method is applied to a copper foil electroplating control system based on magnetic non-contact conductivity. The system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side. The method includes: Determine the module calibration requirement parameters of the system, and perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters; the clamping module clamps the target copper foil to be electroplated; After completing the initialization calibration operation, the basic operating parameters of the system are determined, and after the system is started, the target copper foil is electroplated based on the basic operating parameters. During the electroplating process, the target tension parameters and target induced current parameters of the target copper foil are collected, and the basic operating parameters are adjusted in real time based on the target tension parameters and target induced current parameters.

[0005] As an optional implementation, in the first aspect of the present invention, the module calibration requirement parameters of the system include the clamping pressure calibration requirement parameters of the clamping module and the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module. The clamping pressure calibration requirements for the clamping module are determined in the following way: Obtain the substrate parameters of the target copper foil to be electroplated; the substrate parameters include substrate type parameters and / or substrate specification parameters; The clamping parameters of the clamping module for the target copper foil and the deformation-pressure relationship of the target adhesive block of the clamping module are obtained. Based on the substrate parameters, the clamping parameters, and the deformation-pressure relationship, the target condition of the force-bearing surface of the target copper foil is analyzed. The clamping parameters include at least one of the clamping edge area width parameter, film edge distance parameter, and clamping contact width parameter. The target condition of the force-bearing surface includes at least one of the force-bearing surface slippage, force-bearing surface deformation, and force-bearing surface adhesion. Based on the target conditions of the force-bearing surface, determine the clamping pressure calibration requirements parameters for the clamping module.

[0006] As an optional implementation, in the first aspect of the present invention, the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module are determined by the following method: Obtain the electroplating process requirements parameters of the target copper foil, the electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module, and the coil power tolerance threshold; the electroplating process requirements parameters include the electroplating current density parameters and the effective electroplating area parameters. Based on the electroplating process requirements, the electromagnetic coupling conversion efficiency parameters, and the coil power tolerance threshold, the initial current parameters of the excitation coil of the magnetic non-contact conductive module are determined. Obtain the excitation current-magnetic field strength relationship of the excitation coil, and determine the magnetic field strength parameters of the excitation coil under the initial applied current parameters based on the excitation current-magnetic field strength relationship. Based on the magnetic field strength parameters, the induced current parameters of the induction coil of the magnetic non-contact conductive module are determined, and the coating changes of the target copper foil are analyzed based on the induced current parameters. Based on the changes in the coating, the electromagnetic calibration requirements parameters for the magnetic non-contact conductive module are determined.

[0007] As an optional implementation, in the first aspect of the present invention, the initialization calibration operation performed on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters includes: According to the clamping pressure calibration requirement parameters of the clamping module, the target adhesive block of the clamping module is controlled to move towards the clamping edge film surface of the target copper foil, and the contact pressure value between the target adhesive block and the clamping edge film surface is collected in real time. Based on the contact pressure value and the clamping pressure calibration requirement parameters, determine whether the contact pressure value matches the clamping pressure calibration requirement parameters. If so, stop the target adhesive block from moving towards the clamping film surface and lock the position of the target adhesive block so as to clamp the target copper foil through the target adhesive block and complete the initialization calibration operation of the clamping module. According to the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module, an initial current matching the electromagnetic calibration requirement parameters is passed into the excitation coil on the side of the clamping roller system, and the induced current value of the induction coil generated based on the initial current is collected in real time. When the induced current value is in a preset stable state, the initial magnetic field strength value corresponding to the excitation coil under the initial current is recorded to complete the initialization calibration operation of the magnetic non-contact conductive module.

[0008] As an optional implementation, in the first aspect of the present invention, the basic operating parameters of the system include the basic speed difference parameters and the basic excitation current parameters of the system. The basic speed difference parameters are determined in the following way: Determine the substrate characteristic parameters of the target copper foil; the substrate characteristic parameters include substrate tensile characteristic parameters and / or substrate elastic deformation characteristic parameters; Based on the substrate characteristic parameters and the preset target surface requirement parameters of the target copper foil, the tension tolerance range of the target copper foil is determined; the target surface requirement parameters include surface flatness requirement parameters and / or surface integrity requirement parameters. The liquid resistance caused by the electrolyte in the electroplating bath to the target copper foil when the target copper foil passes through the electroplating bath of the system is analyzed, and the impact of the liquid resistance on the electroplating of the target copper foil is determined based on the liquid resistance. Analyze the mechanical slip parameters between the steel strip, the copper channel exit roller and the target copper foil in the system, and determine the transmission linear speed of the target copper foil based on the mechanical slip parameters; The basic operating parameters of the system are determined based on the tension tolerance range, the impact of electroplating, and the transmission line speed.

[0009] As an optional implementation, in the first aspect of the invention, the basic excitation current parameters are determined by the following method: Obtain the target clamping parameters of the target copper foil, and analyze the target clamping condition of the target copper foil during electroplating based on the target clamping parameters; the target clamping parameters include clamping area parameters and / or clamping film surface clamping stress parameters, and the target clamping condition includes clamping plating condition and / or clamping film surface damage condition; Based on the target clamping edge condition, determine the initial excitation current parameters of the system; The electromagnetic coupling conversion efficiency parameter of the magnetic non-contact conductive module is obtained, and the initial excitation current parameter is adjusted according to the electromagnetic coupling conversion efficiency parameter and the basic speed difference parameter to obtain the basic excitation current parameter of the system.

[0010] As an optional implementation, in the first aspect of the present invention, the step of adjusting the basic operating parameters in real time based on the target tension parameter and the target induced current parameter includes: Based on the target tension parameters and target induced current parameters, determine the electroplating anomalies existing in the target copper foil; When the electroplating abnormality includes tension abnormality, the basic speed difference parameter is adjusted in a single linkage according to the tension abnormality. When the electroplating abnormality includes an abnormal induced current, the basic excitation current parameter and the basic speed difference parameter are adjusted in a dual linkage manner according to the abnormal induced current. When the electroplating abnormality includes the tension abnormality and the induced current abnormality, the basic speed difference parameter is adjusted in a single linkage. After the single linkage adjustment is completed, the basic excitation current parameter and the adjusted basic speed difference parameter are adjusted in a dual linkage.

[0011] A second aspect of this invention discloses a copper foil electroplating control device based on magnetic non-contact conductivity. The device is applied to a copper foil electroplating control system based on magnetic non-contact conductivity. The system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side. The device includes: A determination module is used to determine the module calibration requirement parameters of the system. The calibration module is used to perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the calibration requirement parameters of the module; the clamping module clamps the target copper foil to be electroplated; The determining module is further configured to determine the basic operating parameters of the system after the calibration module completes the initialization calibration operation; An electroplating module is used to electroplat the target copper foil based on the basic operating parameters after the system is started. The acquisition module is used to acquire the target tension parameters and target induced current parameters of the target copper foil during the electroplating process. The adjustment module is used to adjust the basic operating parameters in real time based on the target tension parameter and the target induced current parameter.

[0012] As an optional implementation, in the second aspect of the present invention, the module calibration requirement parameters of the system include the clamping pressure calibration requirement parameters of the clamping module and the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module. The clamping pressure calibration requirements for the clamping module are determined in the following way: Obtain the substrate parameters of the target copper foil to be electroplated; the substrate parameters include substrate type parameters and / or substrate specification parameters; The clamping parameters of the clamping module for the target copper foil and the deformation-pressure relationship of the target adhesive block of the clamping module are obtained. Based on the substrate parameters, the clamping parameters, and the deformation-pressure relationship, the target condition of the force-bearing surface of the target copper foil is analyzed. The clamping parameters include at least one of the clamping edge area width parameter, film edge distance parameter, and clamping contact width parameter. The target condition of the force-bearing surface includes at least one of the force-bearing surface slippage, force-bearing surface deformation, and force-bearing surface adhesion. Based on the target conditions of the force-bearing surface, determine the clamping pressure calibration requirements parameters for the clamping module.

[0013] As an optional implementation, in the second aspect of the invention, the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module are determined in the following manner: Obtain the electroplating process requirements parameters of the target copper foil, the electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module, and the coil power tolerance threshold; the electroplating process requirements parameters include the electroplating current density parameters and the effective electroplating area parameters. Based on the electroplating process requirements, the electromagnetic coupling conversion efficiency parameters, and the coil power tolerance threshold, the initial current parameters of the excitation coil of the magnetic non-contact conductive module are determined. Obtain the excitation current-magnetic field strength relationship of the excitation coil, and determine the magnetic field strength parameters of the excitation coil under the initial applied current parameters based on the excitation current-magnetic field strength relationship. Based on the magnetic field strength parameters, the induced current parameters of the induction coil of the magnetic non-contact conductive module are determined, and the coating changes of the target copper foil are analyzed based on the induced current parameters. Based on the changes in the coating, the electromagnetic calibration requirements parameters for the magnetic non-contact conductive module are determined.

[0014] As an optional implementation, in a second aspect of the present invention, the method by which the calibration module performs initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters specifically includes: According to the clamping pressure calibration requirement parameters of the clamping module, the target adhesive block of the clamping module is controlled to move towards the clamping edge film surface of the target copper foil, and the contact pressure value between the target adhesive block and the clamping edge film surface is collected in real time. Based on the contact pressure value and the clamping pressure calibration requirement parameters, determine whether the contact pressure value matches the clamping pressure calibration requirement parameters. If so, stop the target adhesive block from moving towards the clamping film surface and lock the position of the target adhesive block so as to clamp the target copper foil through the target adhesive block and complete the initialization calibration operation of the clamping module. According to the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module, an initial current matching the electromagnetic calibration requirement parameters is passed into the excitation coil on the side of the clamping roller system, and the induced current value of the induction coil generated based on the initial current is collected in real time. When the induced current value is in a preset stable state, the initial magnetic field strength value corresponding to the excitation coil under the initial current is recorded to complete the initialization calibration operation of the magnetic non-contact conductive module.

[0015] As an optional implementation, in the second aspect of the present invention, the basic operating parameters of the system include the basic speed difference parameters and the basic excitation current parameters of the system. The basic speed difference parameters are determined in the following way: Determine the substrate characteristic parameters of the target copper foil; the substrate characteristic parameters include substrate tensile characteristic parameters and / or substrate elastic deformation characteristic parameters; Based on the substrate characteristic parameters and the preset target surface requirement parameters of the target copper foil, the tension tolerance range of the target copper foil is determined; the target surface requirement parameters include surface flatness requirement parameters and / or surface integrity requirement parameters. The liquid resistance caused by the electrolyte in the electroplating bath to the target copper foil when the target copper foil passes through the electroplating bath of the system is analyzed, and the impact of the liquid resistance on the electroplating of the target copper foil is determined based on the liquid resistance. Analyze the mechanical slip parameters between the steel strip, the copper channel exit roller and the target copper foil in the system, and determine the transmission linear speed of the target copper foil based on the mechanical slip parameters; The basic operating parameters of the system are determined based on the tension tolerance range, the impact of electroplating, and the transmission line speed.

[0016] As an optional implementation, in a second aspect of the invention, the basic excitation current parameters are determined by the following method: Obtain the target clamping parameters of the target copper foil, and analyze the target clamping condition of the target copper foil during electroplating based on the target clamping parameters; the target clamping parameters include clamping area parameters and / or clamping film surface clamping stress parameters, and the target clamping condition includes clamping plating condition and / or clamping film surface damage condition; Based on the target clamping edge condition, determine the initial excitation current parameters of the system; The electromagnetic coupling conversion efficiency parameter of the magnetic non-contact conductive module is obtained, and the initial excitation current parameter is adjusted according to the electromagnetic coupling conversion efficiency parameter and the basic speed difference parameter to obtain the basic excitation current parameter of the system.

[0017] As an optional implementation, in the second aspect of the present invention, the method by which the adjustment module performs real-time linkage adjustment of the basic operating parameters based on the target tension parameter and the target induced current parameter specifically includes: Based on the target tension parameters and target induced current parameters, determine the electroplating anomalies existing in the target copper foil; When the electroplating abnormality includes tension abnormality, the basic speed difference parameter is adjusted in a single linkage according to the tension abnormality. When the electroplating abnormality includes an abnormal induced current, the basic excitation current parameter and the basic speed difference parameter are adjusted in a dual linkage manner according to the abnormal induced current. When the electroplating abnormality includes the tension abnormality and the induced current abnormality, the basic speed difference parameter is adjusted in a single linkage. After the single linkage adjustment is completed, the basic excitation current parameter and the adjusted basic speed difference parameter are adjusted in a dual linkage.

[0018] A third aspect of the present invention discloses another copper foil electroplating control device based on magnetic non-contact conductivity, the device comprising: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the copper foil electroplating control method based on magnetic non-contact conductivity disclosed in the first aspect of the present invention.

[0019] The fourth aspect of the present invention discloses a computer storage medium storing computer instructions, which, when invoked, are used to execute the copper foil electroplating control method based on magnetic non-contact conductivity disclosed in the first aspect of the present invention.

[0020] Compared with the prior art, the embodiments of the present invention have the following beneficial effects: In this embodiment of the invention, based on the determined module calibration requirements parameters of the system, initialization calibration operations are performed on the clamping module and the magnetic non-contact conductive module of the system. The clamping module clamps the target copper foil to be electroplated. After completing the initialization calibration operation, the basic operating parameters of the system are determined, and after the system is started, the target copper foil is electroplated based on the basic operating parameters. During the electroplating process, the target tension parameters and target induced current parameters of the target copper foil are collected to make real-time linkage adjustments to the basic operating parameters. It can be seen that implementing this invention, based on magnetic non-contact conductive technology and combined with a linkage adjustment process under parameter differences, eliminates stress interference from contact conductivity at its source, reduces copper foil edge breakage and film breakage, thereby improving the yield of copper foil electroplating. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic flowchart of a copper foil electroplating control method based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 2 This is a schematic flowchart of another copper foil electroplating control method based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a copper foil electroplating control device based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 4 This is a schematic diagram of another copper foil electroplating control device based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 5 This is a schematic diagram of the framework of a copper foil electroplating control system based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product, or end that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or ends.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] This invention discloses a method and apparatus for controlling copper foil electroplating based on magnetic non-contact conductivity, which eliminates stress interference from contact conductivity at the source, reduces copper foil edge breakage and film breakage, thereby improving the yield of copper foil electroplating.

[0027] Example 1 Please see Figure 1 , Figure 1 This is a schematic flowchart of a copper foil electroplating control method based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 1The described magnetic non-contact conductive copper foil electroplating control method can be applied to the electroplating control of various types of composite copper foils, such as PET (polyethylene terephthalate) composite copper foil, PP (polypropylene) composite copper foil, etc., and is not limited in the embodiments of this invention. Optionally, this method can be implemented by a magnetic non-contact conductive copper foil electroplating control device, which can be integrated into a copper foil electroplating control system (which may be configured with a control terminal), or it can be a local server or cloud server for processing the magnetic non-contact conductive copper foil electroplating control process, etc., and is not limited in the embodiments of this invention. The method is applied to a magnetic non-contact conductive copper foil electroplating control system (the schematic diagram of the system can be shown in the figure below). Figure 5 As shown in the diagram, the system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side to achieve non-contact current transmission through magnetic field coupling between the excitation coil and the induction coil. Figure 1 As shown, the copper foil electroplating control method based on magnetic non-contact conductivity may include the following operations: 101. Determine the module calibration requirements parameters of the system, and perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirements parameters; the clamping module clamps the target copper foil to be electroplated.

[0028] In this embodiment of the invention, the system's module calibration requirements parameters include the clamping pressure calibration requirements parameters of the clamping module and the electromagnetic calibration requirements parameters of the magnetic non-contact conductive module.

[0029] Furthermore, the clamping pressure calibration requirements for the clamping module were determined in the following way: Obtain the substrate parameters of the target copper foil to be electroplated; The clamping parameters of the clamping module for the target copper foil and the deformation-pressure relationship of the target adhesive block of the clamping module are obtained. Based on the substrate parameters, clamping parameters and deformation-pressure relationship, the stress surface of the target copper foil is analyzed. Based on the target conditions of the force-bearing surface, determine the required parameters for clamping pressure calibration of the clamping module.

[0030] In this optional embodiment, the substrate parameters may include substrate type parameters and / or substrate specification parameters; and the clamping parameters may include at least one of the following: clamping edge area width parameter, film edge distance parameter, and clamping contact width parameter; and the target conditions of the force-bearing surface may include at least one of the following: force-bearing surface slippage, force-bearing surface deformation, and force-bearing surface adhesion.

[0031] For example, the stress-bearing surface of the target copper foil can be understood as follows: a PET copper foil with a thickness of a μm has an in-plane tensile strength of approximately 200~250MPa, and is located in a 1200mm wide clamping area (10mm from the film edge on one side, with a clamping contact width of approximately 10mm). Due to its small stress-bearing area, if the clamping pressure is too low, slippage will occur between the film surface and the clamping module, making it impossible to ensure uniform material transfer during electroplating; if the clamping pressure is too high, plastic deformation will occur in the PET base film, directly causing micro-wrinkles on the film surface, which will easily lead to uneven coating or breaks in the subsequent electroplating. Meanwhile, when the target adhesive block is a polyurethane elastic adhesive block, its elastic deformation is linearly related to the pressure. Under appropriate pressure (i.e., undergoing a certain deformation), it can ensure surface contact with the film surface (avoiding local stress concentration caused by point contact) while controlling the compressive stress of the adhesive block on the film surface within the elastic range. This fundamentally avoids film surface damage caused by contact stress, thus balancing clamping stability and stress-free requirements. Therefore, it is necessary to analyze the target copper foil's stress surface condition under each sub-parameter of the clamping parameters based on the substrate parameters and the deformation-pressure relationship, in order to find the optimal solution from each sub-parameter and determine the clamping pressure calibration requirements of the clamping module.

[0032] Furthermore, the electromagnetic calibration requirements for the magnetic non-contact conductive module are determined in the following way: Obtain the electroplating process requirements parameters of the target copper foil, the electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module, and the coil power tolerance threshold. Based on the electroplating process requirements, electromagnetic coupling conversion efficiency parameters, and coil power tolerance threshold, the initial current parameters of the excitation coil of the magnetic non-contact conductive module are determined. Obtain the excitation current-magnetic field strength relationship of the excitation coil, and determine the magnetic field strength parameters of the excitation coil under the initial current parameters based on the excitation current-magnetic field strength relationship; Based on the magnetic field strength parameters, the induced current parameters of the induction coil of the magnetic non-contact conductive module are determined, and the coating changes of the target copper foil are analyzed based on the induced current parameters. Based on the changes in the coating, the electromagnetic calibration requirements parameters for the magnetic non-contact conductive module are determined.

[0033] In this optional embodiment, the electroplating process requirements parameters may include electroplating current density parameters and effective electroplating area parameters.

[0034] For example, the process of determining the initial current parameter can be understood as follows: First, when the induced current density of the target copper foil edge is set to 2.0A / dm² (lower than the current density of the main area, representing the differential electroplating parameter for the edge), the effective electroplating area of ​​the 1200mm wide edge region is a fixed value (2dm² on one side, 4dm² on both sides). The total induced current required for the edge is calculated to be 8A (current density × effective area = 2.0A / dm² × 4dm²). Then, based on the electromagnetic coupling structure of the excitation coil and the induction coil (number of coil turns, core specifications, etc.), the electromagnetic coupling conversion efficiency parameter of the magnetic non-contact conductive module can be determined, such as 45%~50%. Then, using the conversion formula, it can be calculated that to obtain an induced current of 8A, the initial current required to be applied to the excitation coil is approximately 0.75~0.85A. After actual production line debugging, 0.8A is the optimal value, at which point the induced current stabilizes at 8A, and the current density precisely matches the process requirement of 2.0A / dm². In addition, when the excitation coil power is 600W, the actual power consumption of the coil is about 480W under an initial current of 0.8A, which is lower than the rated power. This can reduce the excessive temperature rise of the coil due to overcurrent (excessive coil temperature rise will reduce electromagnetic coupling efficiency), thereby ensuring the stability of equipment operation.

[0035] Furthermore, the analysis process of the coating variation of the target copper foil can be understood as follows: When the excitation coil is a C-type coil with a silicon steel core, within the operating current range of 0.5~1.5A, the magnetic field strength of the core has a strictly linear relationship with the excitation current. According to equipment calibration, the current-magnetic field conversion coefficient of this coil is 150mT / A. Therefore, the magnetic field strength at a current of 0.8A is 0.8A × 150mT / A = 120mT, which is the inherent calibration result of the equipment structure. Subsequently, since the initial magnetic field strength of 120mT is the critical magnetic field threshold for stabilizing the edge induced current at 8A, if the magnetic field strength is too small, the induced current density will be lower than 1.8A / dm², resulting in a thinner edge coating; if the magnetic field strength is too large, the induced current density will be higher than 2.2A / dm², easily inducing dendrite growth in the edge coating, leading to film breakage. Therefore, 120mT is the optimal magnetic field strength to ensure the electroplating process parameters. In addition, if the coil ages slightly during the production process, the excitation current is still 0.8A but the magnetic field strength is only 105mT. It can be directly determined that the electromagnetic coupling efficiency has decreased. The excitation current needs to be adjusted to 0.9A through the central control system to restore the magnetic field strength, compensate for the loss of coil aging, and ensure that the induced current density remains stable at 2.0A / dm².

[0036] 102. After completing the initialization calibration operation, determine the basic operating parameters of the system, and after starting the system, electroplate the target copper foil based on the basic operating parameters.

[0037] In this embodiment of the invention, the basic operating parameters of the system include the basic speed difference parameters and the basic excitation current parameters, and may also include the induced current density fluctuation range.

[0038] Furthermore, the basic speed difference parameters are determined in the following way: Determine the substrate characteristic parameters of the target copper foil; Based on the substrate characteristic parameters and the preset target copper foil film surface target requirement parameters, determine the tensile tolerance range of the target copper foil; The liquid resistance caused by the electrolyte in the electroplating bath to the target copper foil when it passes through the system's electroplating bath is analyzed, and the impact of the liquid resistance on the electroplating of the target copper foil is determined based on the liquid resistance. The mechanical slip parameters between the steel strip, the copper channel exit roller and the target copper foil of the system are analyzed, and the transmission linear speed of the target copper foil is determined based on the mechanical slip parameters. The basic operating parameters of the system are determined based on the tension tolerance range, the impact of electroplating, and the transmission line speed.

[0039] In this optional embodiment, the substrate characteristic parameters may include substrate tensile characteristic parameters and / or substrate elastic deformation characteristic parameters; the film surface target requirement parameters may include film surface flatness requirement parameters and / or film surface integrity requirement parameters.

[0040] It should be noted that the core function of the basic speed difference parameter (where basic speed difference parameter = copper tank exit roller speed / steel belt speed) is to provide micro-tension to the edge of the film surface, ensuring that the film material is flat and smooth without looseness or wrinkles during the electroplating process, while reducing the possibility of film surface stretching and breakage caused by excessive tension. Its determination is based on repeated adjustments and considerations of the mechanical properties of the film material, the process environment within the electroplating tank, and the characteristics of the film material transport equipment. Specifically, the basis can be understood as follows: Because PET-based films, as flexible polymer substrates, have poor tensile strength and a narrow range of elastic deformation, their surfaces can become loose and wrinkled during transport if the tension is zero, leading to uneven plating during electroplating. Excessive tension, on the other hand, can cause irreversible plastic stretching of the film surface, resulting in warping of the copper foil during subsequent forming, or even micro-cracks at the edges. Subsequent electroplating under current impact is prone to developing into tears or film breakage. Therefore, determining the tension tolerance range of the target copper foil is crucial for establishing suitable basic speed difference parameters. This provides a matching micro-tension (e.g., 5~15N) to the film surface, precisely within the elastic deformation range of the base film. This ensures a smooth, wrinkle-free surface without stress damage from stretching, representing the optimal balance between "smooth transport" and "no stress damage." Meanwhile, during the electroplating of the target copper foil, the film material needs to pass through the electroplating bath, and the liquid will generate viscous resistance on the film surface. If the speed of the copper bath exit roller and the steel strip are exactly the same (i.e., the basic speed difference parameter = 1), the liquid resistance will cause the film surface to be slightly loose in the bath, resulting in poor adhesion with the electroplating roller system. This can easily lead to problems such as electroplating solution retention and uneven coating thickness in the edge area. Therefore, slightly increasing the basic speed difference parameter, such as 1.01~1.03, can offset the effect of liquid resistance, ensure that the film material is tightly adhered to the roller system, make the current distribution in the edge electroplating area uniform, and reduce the occurrence of dendrite growth in the coating caused by excessive local current. Furthermore, due to the slight mechanical slippage between the steel strip, copper tank exit roller and the film material in the production line (the coefficient of friction between the roller surface and the film surface is constant), without micro-speed difference compensation, the slippage will cause the film material transmission linear speed to be slightly lower than the set value, affecting the electroplating efficiency; a speed difference coefficient of 1.01~1.03 can accurately compensate for the mechanical slippage, ensuring that the actual transmission linear speed of the film material is consistent with the process set linear speed, and ensuring the accurate matching of electroplating time and current density.

[0041] Furthermore, the basic excitation current parameters are determined in the following way: Obtain the target clamping parameters of the target copper foil, and analyze the target clamping condition of the target copper foil during electroplating based on the target clamping parameters; Determine the initial excitation current parameters of the system based on the target edge conditions; The electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module are obtained, and the initial excitation current parameters are adjusted according to the electromagnetic coupling conversion efficiency parameters and the basic speed difference parameters to obtain the basic excitation current parameters of the system.

[0042] In this optional embodiment, the target clamping parameters may include clamping area parameters and / or clamping film surface holding stress parameters, and the target clamping condition may include clamping coating condition and / or clamping film surface damage condition.

[0043] It should be noted that the configuration of the basic excitation current parameters includes two parts: the differentiated current density between the clamping edge and the main body area, and the dynamic adjustment rule of the excitation current with the linear velocity. The core basis is the special process characteristics of the clamping edge area, the growth law of the electroplated coating, and the physical characteristics of electromagnetic coupling, while matching the electroplating compatibility of the substrate. Specifically, the basis can be understood as follows: Even with elastic clamping, the clamped edge film surface will still experience slight contact stress from the adhesive block. If the same current density (e.g., 2.3 A / dm²) is used as the main body area, the high current will accelerate uneven growth of the coating at the stress points, easily forming coating protrusions and dendrites, piercing the base film, or causing film surface cracking. Reducing the current to, for example, 2.0 A / dm² can slow down the coating growth rate, allowing for uniform coating deposition and avoiding coating defects at stress points. At the same time, the clamped edge is a narrow area (10 mm from the film edge), and even with magnetic non-contact conductivity, the current is still prone to concentrate at the edge. If the current density is too high, an "edge effect" will occur, causing the clamped edge coating to be thicker than the main body, resulting in embrittlement or even ablation of the clamped edge copper foil, making subsequent processing prone to film breakage. A current density of 2.0 A / dm² can offset the edge effect, ensuring that the thickness of the clamped edge coating is consistent with that of the main body area. Meanwhile, since the coating thickness of the composite copper foil with uniform coating thickness is a core indicator, the coating thickness is determined by the electroplating current density and the residence time of the film material in the electroplating zone (formula: coating thickness ∝ current density × electroplating time). When the linear speed of the film material increases, the residence time in the electroplating zone will shorten proportionally. If the excitation current remains unchanged and the induced current density remains constant, the shortened electroplating time will lead to a thinner coating. Therefore, it is necessary to increase the excitation current with the increase of linear speed to increase the induced current density, compensate for the shortened residence time, and ensure that the coating thickness remains stable within the process requirements. Furthermore, since the excitation coil and the induction coil are linearly coupled, the excitation current and the induced current are in a strictly linear proportion. Therefore, the induced current density can be precisely controlled by a fixed current adjustment coefficient (e.g., excitation current +0.1A for every 1m / min increase in linear speed), without the need for complex calculations, adapting to the real-time speed adjustment requirements of the production line.

[0044] Furthermore, the following three points need to be addressed during system startup: Real-time speed difference adaptation: The central control system automatically calculates and adjusts the actual speed of the copper channel outlet roller according to the preset speed difference formula to make it accurately match, such as a speed of (120r / min×1.01~1.03), so as to complete the speed difference start-up adaptation. Real-time current adaptation: Based on the baseline speed, the initial operating current of the excitation coil is determined according to the adjustment coefficient; at the same time, the central control system supplies this current to the excitation coil through an independent DC power supply, and the Hall current sensor collects the induced current in real time to confirm that the induced current density is stable, thus completing the current start-up adaptation. Real-time tension monitoring: The micro-tension sensor collects the actual tension of the clamping edge after startup, confirming that the tension value is stable near the reference value (e.g., fluctuation ≤ ±1%), and there is no initial stress imbalance.

[0045] It should be noted that after the system starts up, if the speed difference matching is accurate, the current density meets the standard, and the tension is stable, the system will enter the stable production stage. If any one of the three indicators fails to meet the standard, the central control system will pause the start-up and readjust the parameters until they meet the standard.

[0046] 103. During the electroplating process, the target tension parameters and target induced current parameters of the target copper foil are collected, and the basic operating parameters are adjusted in real time based on the target tension parameters and target induced current parameters.

[0047] In this embodiment of the invention, the target tension parameter of the target copper foil can be acquired by a micro-tension sensor, while the target induced current parameter can be acquired by a current monitoring unit.

[0048] As can be seen, implementing the embodiments of the present invention enables precise and controllable magnetic non-contact electroplating of composite copper foil through a three-stage control strategy of "initial calibration—basic operation—real-time linkage". First, based on the characteristics of the copper foil substrate, initial calibration is performed on the clamping module and the magnetic non-contact conductive module to ensure that the clamping pressure and electromagnetic parameters accurately match the process requirements, guaranteeing electroplating stability from the source. Second, basic operating parameters are determined and precisely adapted at startup to provide appropriate micro-tension to the clamping film surface, balancing smooth transmission and stress-free damage. Third, during the electroplating process, target tension and induced current parameters are collected in real time and adjusted in conjunction with the basic operating parameters to dynamically compensate for deviations caused by factors such as liquid resistance, mechanical slip, and coil aging, ensuring uniform coating thickness and significantly improving the electroplating yield and product consistency of the composite copper foil.

[0049] In an optional embodiment, step 101 above, which involves performing initialization calibration operations on the system's clamping module and magnetic non-contact conductive module based on module calibration requirement parameters, includes: According to the clamping pressure calibration requirements of the clamping module, the target adhesive block of the clamping module is controlled to move towards the clamping edge film surface of the target copper foil, and the contact pressure value between the target adhesive block and the clamping edge film surface is collected in real time. Based on the contact pressure value and the clamping pressure calibration requirements, determine whether the contact pressure value matches the clamping pressure calibration requirements. If so, stop the target adhesive block from moving towards the clamping film surface and lock the position of the target adhesive block so as to clamp the target copper foil through the target adhesive block and complete the initial calibration operation of the clamping module. According to the electromagnetic calibration requirements of the magnetic non-contact conductive module, an initial current matching the electromagnetic calibration requirements is passed into the excitation coil on the clamping roller system side, and the induced current value of the induction coil generated based on the initial current is collected in real time. When the induced current value is in a preset stable state, the initial magnetic field strength value corresponding to the excitation coil under the initial current is recorded to complete the initialization calibration operation of the magnetic non-contact conductive module.

[0050] In this optional embodiment, the initial calibration operation can be understood as follows: 1. Initial calibration of the elastic clamping calibration mechanism Obtain the preset clamping pressure reference value (e.g., 15N) of the elastic clamping calibration device, and according to this parameter, start the electric push rod of the pre-tightening calibration mechanism to perform the movement operation of the rubber block towards the clamping film surface. During the process, the pressure sensor built into the rubber block collects the contact pressure feedback value between the rubber block and the clamping film surface in real time. Based on the real-time pressure feedback from the pressure sensor, determine whether the calibration condition of feedback value equal to 15N is met. If so, immediately control the electric push rod to stop running and perform the rubber block position locking operation to obtain a stable pressure and fixed position of the clamping edge elastic clamping state, and determine that the elastic clamping calibration mechanism initialization calibration is complete. 2. Initialization and calibration of magnetic non-contact conductive module The initial current preset value (e.g., 0.8A) of the excitation coil of the magnetic non-contact conductive module is obtained, and according to this parameter, an initial current of 0.8A is supplied to the excitation coil outside the clamping roller system through an independent DC power supply to perform the magnetic field generation operation. During the process, the induced current data of the induction coil on the clamping film side is collected in real time through the Hall current sensor. Based on the induced current acquisition results of the Hall current sensor, determine whether the calibration condition of stable and unfluctuating induced current value is met. If so, immediately record the initial magnetic field strength (e.g., 120mT) of the current magnetic field coupling area to obtain the initial state of non-contact conductivity with stable magnetic field strength and normal current transmission, and determine that the initial calibration of the magnetic non-contact conductivity module is complete.

[0051] As can be seen, this optional embodiment can ensure that each module is in optimal working condition before the system is started through closed-loop feedback initialization calibration: the contact pressure between the adhesive block and the clamping film surface is fed back in real time by the pressure sensor, and the preset clamping pressure reference value is accurately matched and locked immediately, avoiding subjective errors of manual adjustment, ensuring that the clamping force is stable within the elastic range, and eliminating the risk of film surface damage and slippage from the source; at the same time, after the Hall sensor confirms that the induced current value is stable, the initial magnetic field strength is recorded, ensuring the accuracy and reliability of the electromagnetic coupling parameters, laying a solid foundation for the stability of the current density in the subsequent electroplating process.

[0052] Example 2 Please see Figure 2 , Figure 2 This is a schematic flowchart of another copper foil electroplating control method based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 2The described magnetic non-contact conductive copper foil electroplating control method can be applied to the electroplating control of various types of composite copper foils, such as PET (polyethylene terephthalate) composite copper foil, PP (polypropylene) composite copper foil, etc., and is not limited in the embodiments of this invention. Optionally, this method can be implemented by a magnetic non-contact conductive copper foil electroplating control device, which can be integrated into a copper foil electroplating control system (which may be configured with a control terminal), or it can be a local server or cloud server for processing the magnetic non-contact conductive copper foil electroplating control process, etc., and is not limited in the embodiments of this invention. The method is applied to a magnetic non-contact conductive copper foil electroplating control system (the schematic diagram of the system can be shown in the figure below). Figure 5 As shown in the diagram, the system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side to achieve non-contact current transmission through magnetic field coupling between the excitation coil and the induction coil. Figure 2 As shown, the copper foil electroplating control method based on magnetic non-contact conductivity may include the following operations: 201. Determine the module calibration requirements parameters of the system, and perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirements parameters.

[0053] 202. After completing the initialization calibration operation, determine the basic operating parameters of the system, and after starting the system, electroplate the target copper foil based on the basic operating parameters.

[0054] 203. During the electroplating process, collect the target tension parameters and target induced current parameters of the target copper foil, and determine the electroplating abnormalities existing in the target copper foil based on the target tension parameters and target induced current parameters.

[0055] In this embodiment of the invention, when the target tension parameter is too large or too small, the electroplating abnormality of the target copper foil is determined to include tension abnormality; when the target induced current parameter is too large, too small, or fluctuates greatly, the electroplating abnormality is determined to include induced current abnormality; when the target tension parameter is too large / too small, and the target induced current parameter is too large / too small / fluctuates greatly, the electroplating abnormality is determined to include both tension abnormality and induced current abnormality.

[0056] 204. When electroplating abnormalities include tension abnormalities, the basic speed difference parameter shall be adjusted in a single linkage according to the tension abnormality.

[0057] In this embodiment of the invention, for example, when the target tension parameter exceeds the upper threshold, the system sends a control signal to the steel strip servo motor to increase the steel strip speed. Simultaneously, the speed of the copper groove exit roller is adjusted synchronously according to the basic speed difference ratio, resulting in a reduction in film tension. When the target tension parameter is below the lower threshold, the system sends a control signal to the steel strip servo motor to decrease the steel strip speed. Simultaneously, the speed of the copper groove exit roller is adjusted synchronously according to the basic speed difference ratio, resulting in an increase in film tension (this belongs to tension-speed difference single linkage control). After fine-tuning, the system obtains the new actual value of the clamping edge tension in real time and determines whether it has recovered to the threshold range. If it has not recovered, the above speed fine-tuning operation can be repeated in increments of 0.1% until the tension reaches the target. If it has recovered, the speed fine-tuning operation is stopped, maintaining the current speed difference parameter.

[0058] 205. When electroplating abnormalities include abnormal induced current, the basic excitation current parameters and basic speed difference parameters shall be adjusted in a dual linkage manner according to the abnormal induced current conditions.

[0059] In an embodiment of the present invention, for example, when the actual value of the edge induced current density fed back by the Hall current sensor is obtained, if it is determined that the edge induced current density fluctuates greatly according to the parameter, the system simultaneously sends control signals to the independent DC power supply and the steel strip / copper groove outlet roller servo motor to perform two operations simultaneously: (1) outputting ±0.05A current adjustment to the excitation coil (+0.05A if the current density is too low, and -0.05A if it is too high); (2) performing a ±0.1% fine adjustment on the steel strip speed that matches the direction of current adjustment, so as to avoid the current sudden change aggravating the force on the film surface, thereby obtaining the effect that the induced current density tends to be stable and the force on the film surface does not change suddenly (belonging to the current-speed difference dual linkage control). After fine-tuning, the system acquires the new actual value of the induced current density in real time and determines whether it has recovered to within the threshold of 2.0A / dm²±2%. If it has not recovered, the above double fine-tuning operation of current ±0.05A and speed ±0.1% is repeated until the current reaches the standard. If it has recovered, the current and speed fine-tuning operation is stopped to maintain the current excitation current and speed difference parameters.

[0060] 206. When electroplating abnormalities include tension abnormalities and induced current abnormalities, the basic speed difference parameter shall be adjusted in a single linkage. After the single linkage adjustment is completed, the basic excitation current parameter and the adjusted basic speed difference parameter shall be adjusted in a double linkage.

[0061] In this embodiment of the invention, for example, when the actual value of the clamping tension fed back by the micro-tension sensor and the actual value of the induced current density fed back by the Hall current sensor are obtained, if it is determined that neither of the two parameters is within the preset threshold range, or if the fluctuation is large, then the above-mentioned tension-speed difference single linkage control operation is executed first, until the actual value of the clamping tension recovers to the normal threshold range, and a basic state of stable film surface stress is obtained. Subsequently, based on the new actual rotation speed of the steel strip / copper channel exit roller after tension control, the system obtains the actual value of the induced current density at this time, and if it is determined that it is not within the preset threshold range, or if the fluctuation is large, then the above-mentioned current-speed difference dual linkage control operation is executed (the fine adjustment amplitude is adapted to the current speed difference), so as to obtain the effect that the induced current density recovers to within the threshold and the speed difference matches the current. After fine adjustment, the system continues to monitor the actual values ​​of tension and current, and determines whether they have both recovered to within their respective thresholds and tend to be stable; if so, all fine adjustment operations are stopped; if any parameter is still abnormal, the above steps are repeated until both parameters meet the standard. Among these, tension control should be prioritized because tension imbalance will directly lead to stress concentration on the film surface, causing immediate tears and film breakage. Abnormal current mainly affects the uniformity of the coating and indirectly leads to subsequent defects. Therefore, the control logic always prioritizes "stability of physical stress on the film surface" and then ensures that the electroplating process parameters meet the standards.

[0062] In summary, this invention provides a composite copper foil electroplating control technology solution combining "magnetic non-contact conductivity" and "tension-speed difference-current linkage regulation," representing a deep integration of hardware structural innovation and dynamic process control. Specifically, magnetic non-contact conductivity eliminates the stress interference problem of traditional contact conductivity at the hardware level. Through an electromagnetic induction coupling structure of "excitation coil + induction coil," non-contact current transmission is achieved: an excitation coil is placed on the clamping roller system side, and an induction coil is integrated on the clamping film surface side. Magnetic field coupling is used to transmit current to the clamping electroplating area, reducing contact between the physical conductive components on the film surface and fundamentally avoiding stress interference caused by contact conductivity, thus laying a stress-free foundation for the electroplating process. The tension-speed difference-current linkage control is to achieve real-time matching and dynamic compensation of the three core parameters from the process end (these three parameters are not isolated, but have a strong causal relationship, which is the basis of linkage: (1) Speed ​​difference determines tension: the speed difference between the copper tank exit roller and the steel belt is the direct source of the micro-tension of the clamping film surface. The change of speed difference will directly lead to tension fluctuation; (2) Tension affects conductivity: the imbalance of film surface tension will cause film surface stretching / relaxation, which will cause the magnetic field coupling gap between the induction coil and the excitation coil to change, and then cause the induced current fluctuation; (3) Current mutation has a counteracting effect on tension: the sudden increase / decrease of induced current will cause the electrodeposition rate of the electroplating area to change abruptly, and internal stress will be generated between the film surface and the coating, which will indirectly aggravate the force imbalance of the film surface), solve the problem of force and conductivity abnormality caused by parameter imbalance during electroplating, and finally form a closed-loop optimization of stress-free structure and process self-adaptation, and thoroughly reduce the clamping edge breakage and film breakage defect rate.

[0063] In this embodiment of the invention, for other descriptions of steps 201-202, please refer to the detailed description of steps 101-102 in Embodiment 1. This embodiment of the invention will not repeat them.

[0064] As can be seen, implementing the embodiments of the present invention enables accurate identification of electroplating anomalies by real-time acquisition of the clamping tension parameters and induced current parameters of the target copper foil, and adopts differentiated linkage control strategies for different anomaly types: when tension is abnormal, a single linkage adjustment based on speed difference is executed, which is rapid and simple to control; when induced current is abnormal, a dual linkage adjustment based on excitation current and speed difference is executed to prevent sudden changes in film surface force and ensure electroplating uniformity; when both types of anomalies coexist, a graded control strategy of first single linkage and then dual linkage is adopted to balance control efficiency and stability. At the same time, the system uses small-amplitude step fine-tuning combined with closed-loop feedback judgment to gradually approach the target threshold, effectively reducing the impact of parameter sudden changes on the film surface, and significantly improving electroplating quality and system operational reliability.

[0065] Example 3 Please see Figure 3 , Figure 3This is a schematic diagram of a copper foil electroplating control device based on magnetic non-contact conductivity, as disclosed in an embodiment of the present invention. The device is applied to a copper foil electroplating control system based on magnetic non-contact conductivity. The system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side, such as... Figure 3 As shown, the copper foil electroplating control device based on magnetic non-contact conductivity may include: Module 301 is used to determine the module calibration requirement parameters of the system. The calibration module 302 is used to perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters; the clamping module clamps the target copper foil to be electroplated; The determination module 301 is also used to determine the basic operating parameters of the system after the calibration module 302 completes the initialization calibration operation; The electroplating module 303 is used to electroplat the target copper foil based on the basic operating parameters after the system is started. The acquisition module 304 is used to acquire the target tension parameters and target induced current parameters of the target copper foil during the electroplating process. The adjustment module 305 is used to adjust the basic operating parameters in real time based on the target tension parameters and the target induced current parameters.

[0066] In this embodiment of the invention, the module calibration requirements parameters of the system include the clamping pressure calibration requirements parameters of the clamping module and the electromagnetic calibration requirements parameters of the magnetic non-contact conductive module.

[0067] The clamping pressure calibration requirements for the clamping module were determined in the following way: Obtain the substrate parameters of the target copper foil to be electroplated; The clamping parameters of the clamping module for the target copper foil and the deformation-pressure relationship of the target adhesive block of the clamping module are obtained. Based on the substrate parameters, clamping parameters and deformation-pressure relationship, the stress surface of the target copper foil is analyzed. Based on the target conditions of the force-bearing surface, determine the required parameters for clamping pressure calibration of the clamping module.

[0068] In this optional embodiment, the substrate parameters include substrate type parameters and / or substrate specification parameters; the clamping parameters include at least one of the clamping edge area width parameters, film edge distance parameters, and clamping contact width parameters; and the target conditions of the force-bearing surface include at least one of the force-bearing surface slippage, force-bearing surface deformation, and force-bearing surface adhesion.

[0069] Furthermore, the electromagnetic calibration requirements for the magnetic non-contact conductive module were determined in the following way: Obtain the electroplating process requirements parameters of the target copper foil, the electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module, and the coil power tolerance threshold. Based on the electroplating process requirements, electromagnetic coupling conversion efficiency parameters, and coil power tolerance threshold, the initial current parameters of the excitation coil of the magnetic non-contact conductive module are determined. Obtain the excitation current-magnetic field strength relationship of the excitation coil, and determine the magnetic field strength parameters of the excitation coil under the initial current parameters based on the excitation current-magnetic field strength relationship; Based on the magnetic field strength parameters, the induced current parameters of the induction coil of the magnetic non-contact conductive module are determined, and the coating changes of the target copper foil are analyzed based on the induced current parameters. Based on the changes in the coating, the electromagnetic calibration requirements parameters for the magnetic non-contact conductive module are determined.

[0070] In this optional embodiment, the electroplating process requirements parameters include electroplating current density parameters and effective electroplating area parameters.

[0071] Furthermore, the system's basic operating parameters include the system's basic speed difference parameters and basic excitation current parameters; The basic speed difference parameters are determined in the following way: Determine the substrate characteristic parameters of the target copper foil; Based on the substrate characteristic parameters and the preset target copper foil film surface target requirement parameters, determine the tensile tolerance range of the target copper foil; The liquid resistance caused by the electrolyte in the electroplating bath to the target copper foil when it passes through the system's electroplating bath is analyzed, and the impact of the liquid resistance on the electroplating of the target copper foil is determined based on the liquid resistance. The mechanical slip parameters between the steel strip, the copper channel exit roller and the target copper foil of the system are analyzed, and the transmission linear speed of the target copper foil is determined based on the mechanical slip parameters. The basic operating parameters of the system are determined based on the tension tolerance range, the impact of electroplating, and the transmission line speed.

[0072] In this optional embodiment, the substrate characteristic parameters include substrate tensile characteristic parameters and / or substrate elastic deformation characteristic parameters; the film surface target requirement parameters include film surface flatness requirement parameters and / or film surface integrity requirement parameters.

[0073] Furthermore, the basic excitation current parameters are determined in the following way: Obtain the target clamping parameters of the target copper foil, and analyze the target clamping condition of the target copper foil during electroplating based on the target clamping parameters; Determine the initial excitation current parameters of the system based on the target edge conditions; The electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module are obtained, and the initial excitation current parameters are adjusted according to the electromagnetic coupling conversion efficiency parameters and the basic speed difference parameters to obtain the basic excitation current parameters of the system.

[0074] In this optional embodiment, the target clamping parameters include clamping area parameters and / or clamping film surface holding stress parameters, and the target clamping condition includes clamping coating condition and / or clamping film surface damage condition.

[0075] It is evident that implementation Figure 3 The described magnetic non-contact conductive copper foil electroplating control device achieves precise and controllable magnetic non-contact electroplating of composite copper foil through a three-stage control strategy: initialization calibration, basic operation, and real-time linkage. First, based on the characteristics of the copper foil substrate, initialization calibration is performed on the clamping module and the magnetic non-contact conductive module to ensure that the clamping pressure and electromagnetic parameters precisely match the process requirements, guaranteeing electroplating stability from the source. Second, basic operating parameters are determined and precisely adapted at startup to provide appropriate micro-tension to the clamping film surface, balancing smooth transmission and stress-free damage. Third, during the electroplating process, target tension and induced current parameters are collected in real time and adjusted in conjunction with the basic operating parameters to dynamically compensate for deviations caused by factors such as liquid resistance, mechanical slip, and coil aging, ensuring uniform coating thickness and significantly improving the electroplating yield and product consistency of composite copper foil.

[0076] In an optional embodiment, the calibration module 302 performs initialization calibration operations on the system's clamping module and magnetic non-contact conductive module according to module calibration requirement parameters, specifically including: According to the clamping pressure calibration requirements of the clamping module, the target adhesive block of the clamping module is controlled to move towards the clamping edge film surface of the target copper foil, and the contact pressure value between the target adhesive block and the clamping edge film surface is collected in real time. Based on the contact pressure value and the clamping pressure calibration requirements, determine whether the contact pressure value matches the clamping pressure calibration requirements. If so, stop the target adhesive block from moving towards the clamping film surface and lock the position of the target adhesive block so as to clamp the target copper foil through the target adhesive block and complete the initial calibration operation of the clamping module. According to the electromagnetic calibration requirements of the magnetic non-contact conductive module, an initial current matching the electromagnetic calibration requirements is passed into the excitation coil on the clamping roller system side, and the induced current value of the induction coil generated based on the initial current is collected in real time. When the induced current value is in a preset stable state, the initial magnetic field strength value corresponding to the excitation coil under the initial current is recorded to complete the initialization calibration operation of the magnetic non-contact conductive module.

[0077] It is evident that implementation Figure 3The described magnetic non-contact conductive copper foil electroplating control device can ensure that each module is in optimal working condition before system startup through closed-loop feedback initialization calibration: the contact pressure between the adhesive block and the clamping film surface is fed back in real time by a pressure sensor, and the device is locked immediately after accurately matching the preset clamping pressure reference value, avoiding subjective errors of manual adjustment and ensuring that the clamping force is stable within the elastic range, eliminating the risk of film surface damage and slippage from the source; at the same time, after confirming the stability of the induced current value by a Hall sensor, the initial magnetic field strength is recorded, ensuring the accuracy and reliability of electromagnetic coupling parameters, laying a solid foundation for the stability of current density in the subsequent electroplating process.

[0078] In another optional embodiment, the adjustment module 305 adjusts the basic operating parameters in real time based on the target tension parameter and the target induced current parameter, specifically including: Based on the target tension parameters and the target induced current parameters, determine the electroplating anomalies existing in the target copper foil; When electroplating abnormalities include tension abnormalities, the basic speed difference parameter is adjusted in a single linkage according to the tension abnormality. When electroplating abnormalities include abnormal induced current, the basic excitation current parameters and basic speed difference parameters are adjusted in a dual linkage manner according to the abnormal induced current conditions. When electroplating abnormalities include tension abnormalities and induced current abnormalities, a single linkage adjustment is made to the basic speed difference parameter. After the single linkage adjustment is completed, a dual linkage adjustment is made to the basic excitation current parameter and the adjusted basic speed difference parameter.

[0079] It is evident that implementation Figure 3 The described magnetic non-contact conductive copper foil electroplating control device can accurately identify electroplating anomalies by real-time acquisition of the clamping tension parameters and induced current parameters of the target copper foil. It employs differentiated linkage control strategies for different anomaly types: for tension anomalies, it performs a single linkage adjustment based on speed difference, providing rapid response and simple control; for induced current anomalies, it performs a dual linkage adjustment based on excitation current and speed difference to prevent sudden changes in film surface force and ensure electroplating uniformity; when both types of anomalies coexist, it adopts a graded control strategy of first single linkage and then dual linkage to balance control efficiency and stability. Simultaneously, the system uses small-amplitude step-by-step fine-tuning combined with closed-loop feedback judgment to gradually approach the target threshold, effectively reducing the impact of parameter mutations on the film surface and significantly improving electroplating quality and system operational reliability.

[0080] Example 4 Please see Figure 4 , Figure 4 This is a schematic diagram of another copper foil electroplating control device based on magnetic non-contact conductivity disclosed in an embodiment of the present invention. Figure 4As shown, the copper foil electroplating control device based on magnetic non-contact conductivity may include: Memory 401 storing executable program code; Processor 402 coupled to memory 401; The processor 402 calls the executable program code stored in the memory 401 to execute the steps in the copper foil electroplating control method based on magnetic non-contact conductivity described in Embodiment 1 or Embodiment 2 of the present invention.

[0081] Example 5 This invention discloses a computer storage medium storing computer instructions. When these computer instructions are invoked, they are used to execute the steps in the copper foil electroplating control method based on magnetic non-contact conductivity described in Embodiment 1 or Embodiment 2 of this invention.

[0082] Example 6 This invention discloses a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to perform the steps in the copper foil electroplating control method based on magnetic non-contact conductivity described in Embodiment 1 or Embodiment 2.

[0083] The device embodiments described above are merely illustrative. The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0084] Through the detailed description of the above embodiments, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, including read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically-Erasable Programmable Read-Only Memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0085] Finally, it should be noted that the copper foil electroplating control method and apparatus based on magnetic non-contact conductivity disclosed in the embodiments of the present invention are merely preferred embodiments of the present invention and are only used to illustrate the technical solutions of the present invention, not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for controlling copper foil electroplating based on magnetic non-contact conductivity, characterized in that, The method is applied to a copper foil electroplating control system based on magnetic non-contact conductivity. The system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side. The method includes: Determine the module calibration requirement parameters of the system, and perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters; the clamping module clamps the target copper foil to be electroplated; After completing the initialization calibration operation, the basic operating parameters of the system are determined, and after the system is started, the target copper foil is electroplated based on the basic operating parameters. During the electroplating process, the target tension parameters and target induced current parameters of the target copper foil are collected, and the basic operating parameters are adjusted in real time based on the target tension parameters and target induced current parameters.

2. The copper foil electroplating control method based on magnetic non-contact conductivity according to claim 1, characterized in that, The system's module calibration requirements include the clamping pressure calibration requirements of the clamping module and the electromagnetic calibration requirements of the magnetic non-contact conductive module. The clamping pressure calibration requirements for the clamping module are determined in the following way: Obtain the substrate parameters of the target copper foil to be electroplated; the substrate parameters include substrate type parameters and / or substrate specification parameters; The clamping parameters of the clamping module for the target copper foil and the deformation-pressure relationship of the target adhesive block of the clamping module are obtained. Based on the substrate parameters, the clamping parameters, and the deformation-pressure relationship, the target condition of the force-bearing surface of the target copper foil is analyzed. The clamping parameters include at least one of the clamping edge area width parameter, film edge distance parameter, and clamping contact width parameter. The target condition of the force-bearing surface includes at least one of the force-bearing surface slippage, force-bearing surface deformation, and force-bearing surface adhesion. Based on the target conditions of the force-bearing surface, determine the clamping pressure calibration requirements parameters for the clamping module.

3. The copper foil electroplating control method based on magnetic non-contact conductivity according to claim 2, characterized in that, The electromagnetic calibration requirements of the magnetic non-contact conductive module were determined in the following way: Obtain the electroplating process requirements parameters of the target copper foil, the electromagnetic coupling conversion efficiency parameters of the magnetic non-contact conductive module, and the coil power tolerance threshold; the electroplating process requirements parameters include the electroplating current density parameters and the effective electroplating area parameters. Based on the electroplating process requirements, the electromagnetic coupling conversion efficiency parameters, and the coil power tolerance threshold, the initial current parameters of the excitation coil of the magnetic non-contact conductive module are determined. Obtain the excitation current-magnetic field strength relationship of the excitation coil, and determine the magnetic field strength parameters of the excitation coil under the initial applied current parameters based on the excitation current-magnetic field strength relationship. Based on the magnetic field strength parameters, the induced current parameters of the induction coil of the magnetic non-contact conductive module are determined, and the coating changes of the target copper foil are analyzed based on the induced current parameters. Based on the changes in the coating, the electromagnetic calibration requirements parameters for the magnetic non-contact conductive module are determined.

4. The copper foil electroplating control method based on magnetic non-contact conductivity according to claim 3, characterized in that, The initialization calibration operation performed on the clamping module and the magnetic non-contact conductive module of the system according to the module calibration requirement parameters includes: According to the clamping pressure calibration requirement parameters of the clamping module, the target adhesive block of the clamping module is controlled to move towards the clamping edge film surface of the target copper foil, and the contact pressure value between the target adhesive block and the clamping edge film surface is collected in real time. Based on the contact pressure value and the clamping pressure calibration requirement parameters, determine whether the contact pressure value matches the clamping pressure calibration requirement parameters. If so, stop the target adhesive block from moving towards the clamping film surface and lock the position of the target adhesive block so as to clamp the target copper foil through the target adhesive block and complete the initialization calibration operation of the clamping module. According to the electromagnetic calibration requirement parameters of the magnetic non-contact conductive module, an initial current matching the electromagnetic calibration requirement parameters is passed into the excitation coil on the side of the clamping roller system, and the induced current value of the induction coil generated based on the initial current is collected in real time. When the induced current value is in a preset stable state, the initial magnetic field strength value corresponding to the excitation coil under the initial current is recorded to complete the initialization calibration operation of the magnetic non-contact conductive module.

5. The copper foil electroplating control method based on magnetic non-contact conductivity according to any one of claims 1-4, characterized in that, The basic operating parameters of the system include the basic speed difference parameters and the basic excitation current parameters of the system. The basic speed difference parameters are determined in the following way: Determine the substrate characteristic parameters of the target copper foil; the substrate characteristic parameters include substrate tensile characteristic parameters and / or substrate elastic deformation characteristic parameters; Based on the substrate characteristic parameters and the preset target surface requirement parameters of the target copper foil, the tension tolerance range of the target copper foil is determined; the target surface requirement parameters include surface flatness requirement parameters and / or surface integrity requirement parameters. The liquid resistance caused by the electrolyte in the electroplating bath to the target copper foil when the target copper foil passes through the electroplating bath of the system is analyzed, and the impact of the liquid resistance on the electroplating of the target copper foil is determined based on the liquid resistance. Analyze the mechanical slip parameters between the steel strip, the copper channel exit roller and the target copper foil in the system, and determine the transmission linear speed of the target copper foil based on the mechanical slip parameters; The basic operating parameters of the system are determined based on the tension tolerance range, the impact of electroplating, and the transmission line speed.

6. The copper foil electroplating control method based on magnetic non-contact conductivity according to claim 5, characterized in that, The basic excitation current parameters are determined in the following way: Obtain the target clamping parameters of the target copper foil, and analyze the target clamping condition of the target copper foil during electroplating based on the target clamping parameters; the target clamping parameters include clamping area parameters and / or clamping film surface clamping stress parameters, and the target clamping condition includes clamping plating condition and / or clamping film surface damage condition; Based on the target clamping edge condition, determine the initial excitation current parameters of the system; The electromagnetic coupling conversion efficiency parameter of the magnetic non-contact conductive module is obtained, and the initial excitation current parameter is adjusted according to the electromagnetic coupling conversion efficiency parameter and the basic speed difference parameter to obtain the basic excitation current parameter of the system.

7. The copper foil electroplating control method based on magnetic non-contact conductivity according to claim 6, characterized in that, The step of adjusting the basic operating parameters in real time based on the target tension parameter and the target induced current parameter includes: Based on the target tension parameters and target induced current parameters, determine the electroplating anomalies existing in the target copper foil; When the electroplating abnormality includes tension abnormality, the basic speed difference parameter is adjusted in a single linkage according to the tension abnormality. When the electroplating abnormality includes an abnormal induced current, the basic excitation current parameter and the basic speed difference parameter are adjusted in a dual linkage manner according to the abnormal induced current. When the electroplating abnormality includes the tension abnormality and the induced current abnormality, the basic speed difference parameter is adjusted in a single linkage. After the single linkage adjustment is completed, the basic excitation current parameter and the adjusted basic speed difference parameter are adjusted in a dual linkage.

8. A copper foil electroplating control device based on magnetic non-contact conductivity, characterized in that, The device is applied to a copper foil electroplating control system based on magnetic non-contact conductivity. The system integrates an excitation coil on the clamping roller side and an induction coil on the clamping film side. The device includes: A determination module is used to determine the module calibration requirement parameters of the system. The calibration module is used to perform initialization calibration operations on the clamping module and the magnetic non-contact conductive module of the system according to the calibration requirement parameters of the module; the clamping module clamps the target copper foil to be electroplated; The determining module is further configured to determine the basic operating parameters of the system after the calibration module completes the initialization calibration operation; An electroplating module is used to electroplat the target copper foil based on the basic operating parameters after the system is started. The acquisition module is used to acquire the target tension parameters and target induced current parameters of the target copper foil during the electroplating process. The adjustment module is used to adjust the basic operating parameters in real time based on the target tension parameter and the target induced current parameter.

9. A copper foil electroplating control device based on magnetic non-contact conductivity, characterized in that, The device includes: Memory containing executable program code; A processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the copper foil electroplating control method based on magnetic non-contact conductivity as described in any one of claims 1-7.

10. A computer storage medium, characterized in that, The computer storage medium stores computer instructions, which, when invoked, are used to execute the copper foil electroplating control method based on magnetic non-contact conductivity as described in any one of claims 1-7.

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