Industrial computer mainboard iterative layout optimization method, device and equipment based on thermal simulation and thermal effect atlas

By constructing a thermal effect matrix and an automatic layout optimization method guided by airflow, the problem of unquantifiable thermal coupling on industrial computer motherboards was solved, achieving global temperature optimization and iterative efficiency improvement, thus ensuring the heat dissipation performance and reliability of industrial computer motherboards.

CN122452489APending Publication Date: 2026-07-24JIAHE TECH (SHENZHEN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIAHE TECH (SHENZHEN) CO LTD
Filing Date
2026-05-06
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing industrial control computer motherboard layout designs cannot quantitatively assess the thermal coupling strength between components, making it difficult to achieve global optimization. The iteration efficiency is low and the optimization results are inaccurate. In particular, it is difficult to effectively utilize air ducts for directional decoupling in the case of multiple heat source coupling.

Method used

By constructing a thermal effect matrix H, the temperature contribution coefficient of components to the grid cells is quantified, the thermal coupling conflict degree is calculated, and the positions of components are automatically adjusted based on the airflow direction to form a thermal effect map, thereby achieving automatic iterative optimization of the layout.

Benefits of technology

Precise quantification of thermal coupling ensures global temperature optimization, avoids repeated hot spot migration, improves iteration efficiency and the accuracy of optimization results, and enhances the heat dissipation performance and reliability of industrial control computer motherboards.

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Abstract

The application relates to an industrial computer mainboard iterative layout optimization method, device and equipment based on thermal simulation and thermal effect atlas, and particularly relates to the technical field of industrial computer hardware design and thermal design, which constructs a thermal effect matrix through a differential disturbance method, accurately quantifies the temperature contribution coefficient of each component to each grid unit on the mainboard, and calculates the thermal coupling conflict degree between each pair of components based on the thermal effect matrix, thereby solving the technical problem that multi-thermal source coupling cannot be quantitatively analyzed; the global peak temperature change is used as the acceptance criterion of layout movement, so that the thermal performance is improved on the global level in each iteration; meanwhile, the historical optimal layout is reserved, temperature rebound caused by the last movement is avoided, and the defects that hot spots are repeatedly migrated and are easily trapped in local optimization in manual iteration are overcome; iteration is automatically performed, and the iteration efficiency is improved; the wind direction is considered in the iteration process, and the accuracy of the optimization result is improved.
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