Wafer data correlation system and method
The data acquisition and calculation module solves the problem of cross-process measurement data collection and calculation in the wafer data association system, enabling rapid and timely confirmation of machine status and ensuring the accuracy and consistency of measurement data.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SEMICON TECH INNOVATION CENT(BEIJING) CORP
- Filing Date
- 2025-01-21
- Publication Date
- 2026-07-24
AI Technical Summary
Existing wafer data association systems cannot locate, collect, and calculate measurement data across processes, leading to data errors and an inability to quickly and timely confirm machine status information.
Through the data acquisition module and the calculation module, it is determined whether the wafer contains grouping marks and cross-group marks, collects and calculates measurement data across processes, and combines measurement data from multiple batches of wafers in multiple process flows to achieve measurement data location, collection and calculation across processes.
It enables cross-process measurement data positioning, collection and calculation, avoids data errors, and allows users to quickly and timely confirm machine status information.
Smart Images
Figure CN122453549A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and in particular to a wafer data association system and method. Background Technology
[0002] The wafer fabrication process places high demands on the parameters and internal condition of the equipment. Wafer data association systems (Monitors) are often used to collect and calculate pre- and post-processing data to measure equipment performance and health, ensuring normal wafer processing. The working principle of a wafer data association system is as follows: a monitoring plan is created for a specific equipment and its performance. This plan requires configuration of parameters such as the wafer product ID, wafer count, monitoring process, process time, equipment ID, and processing capacity. It can be used to provide periodic measurement alerts and control over the equipment. The monitoring process typically includes pre-measurement, processing, and post-measurement. The calculation results of the pre- and post-measurement data determine whether the current processing capacity of the equipment is normal.
[0003] However, determining whether a specific parameter on the wafer is within the normal range requires combining wafer measurement data from multiple process flows, and the wafer processing times differ across these flows. Current wafer data association systems cannot acquire wafer data across different processes, nor can they combine wafer data from different process flows to complete calculations.
[0004] Therefore, it is necessary to provide more effective and reliable technical solutions to achieve the location, collection and calculation of measurement data across processes, avoid data errors, and enable users to quickly and timely confirm the machine status information. Summary of the Invention
[0005] This application provides a wafer data association system and method to realize the location, collection and calculation of measurement data across processes, avoid data errors, and enable users to quickly and timely confirm the status information of the equipment.
[0006] One aspect of this application provides a wafer data association system, comprising: a data acquisition module, wherein when the data acquisition module operates, it determines whether the first batch of wafers contains grouping marks and whether the measurement items of the first batch of wafers contain cross-group marks after the first batch of wafers has been processed in the machine; when it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, it collects data of all measurement items in the first batch of wafers that do not contain cross-group marks; and acquires data of corresponding measurement items of associated batches of wafers that correspond to the measurement items of the first batch of wafers that contain cross-group marks; and a data calculation module, wherein when the data calculation module operates, it calculates the collected and acquired data and determines whether the calculation results are normal.
[0007] In some embodiments of this application, the wafer data association system further includes: a marking module, which is used to group the first batch of wafers and associated batches of wafers associated with the first batch of wafers and mark them with grouping tags, and to mark the measurement items of the first batch of wafers that correspond to the measurement items of the associated batches of wafers with cross-group tags.
[0008] In some embodiments of this application, the data acquisition module further includes, when it is determined that the first batch of wafers does not contain grouping marks or that the measurement items of the first batch of wafers do not contain cross-group marks, collecting data of all measurement items in the first batch of wafers.
[0009] In some embodiments of this application, the wafer data association system further includes a control module, which controls the first batch of wafers to be transferred to a waiting station after the data acquisition module collects data of all measurement items in the first batch of wafers that do not contain cross-group markers and before acquiring data of the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers.
[0010] In some embodiments of this application, when the data calculation module determines that the calculation result is abnormal, it changes the locking mode of the first batch of wafers.
[0011] One aspect of this application also provides a wafer data association method, comprising: after the first batch of wafers is processed in a machine, determining whether the first batch of wafers contains grouping marks and whether the measurement items of the first batch of wafers contain cross-group marks; when it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, collecting data of all measurement items in the first batch of wafers that do not contain cross-group marks; acquiring data of corresponding measurement items of associated batches of wafers corresponding to measurement items containing cross-group marks in the measurement items of the first batch of wafers; calculating the collected and acquired data and determining whether the calculation results are normal.
[0012] In some embodiments of this application, the wafer data association method further includes: grouping the first batch of wafers and associated batches of wafers associated with the first batch of wafers and marking them with group tags, and marking the measurement items in the measurement items of the first batch of wafers that correspond to the measurement items of the associated batch of wafers with cross-group tags.
[0013] In some embodiments of this application, when it is determined that the first batch of wafers does not contain grouping marks or the measurement items of the first batch of wafers do not contain cross-group marks, data of all measurement items in the first batch of wafers are collected.
[0014] In some embodiments of this application, after collecting data on all measurement items in the first batch of wafers that do not contain cross-group markers and before acquiring data on the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers, the first batch of wafers is transferred to a waiting station.
[0015] In some embodiments of this application, when the calculation result is determined to be abnormal, the locking mode of the first batch of wafers is changed.
[0016] This application provides a wafer data association system and method to realize the location, collection and calculation of measurement data across processes, avoid data errors, and enable users to quickly and timely confirm the status information of the equipment. Attached Figure Description
[0017] The following accompanying drawings describe in detail the exemplary embodiments disclosed in this application. The same reference numerals denote similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting and exemplary, and the drawings are for illustrative purposes only and are not intended to limit the scope of this application. Other embodiments may similarly fulfill the inventive intent of this application. It should be understood that the drawings are not drawn to scale.
[0018] in:
[0019] Figure 1 This is a flowchart of the wafer data association method described in an embodiment of this application. Detailed Implementation
[0020] The following description provides specific application scenarios and requirements for this application, intended to enable those skilled in the art to make and use the content of this application. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.
[0021] The technical solution of the present invention will be described in detail below with reference to the embodiments and accompanying drawings.
[0022] Figure 1 This is a flowchart of the wafer data association method described in an embodiment of this application. The wafer data association method described in the embodiment of this application will be described in detail below with reference to the accompanying drawings.
[0023] refer to Figure 1As shown, the wafer data association method described in this application includes: step S101, the first batch of wafers enters the metrology station. Specifically, this occurs after the first batch of wafers has been processed in the equipment and then enters the subsequent metrology station.
[0024] The complete process of the wafer data association method described in this application typically includes pre-measurement, processing, and post-measurement. It determines whether the current processing capability of the equipment is normal by calculating the measurement data before and after wafer processing. Measurement items include wafer structure data such as thickness, grain size, and linewidth. Taking thickness as an example, if the wafer thickness is 5 micrometers during pre-measurement and 6 micrometers during post-measurement after processing on the deposition equipment, the difference between the pre-measurement and post-measurement is 1 micrometer, indicating that the thickness of the wafer deposited film is approximately 1 micrometer. This 1-micrometer difference is compared with the theoretical deposition thickness. If the difference is within the error range, the deposition equipment is working normally; if the difference is outside the error range, the deposition equipment is not working normally. Of course, this is just a simple example; the calculations in actual processes are more complex. Step S101 here refers to the measurement station where the first batch of wafers enters the post-measurement stage after completing pre-measurement and processing.
[0025] In some embodiments of this application, the wafer data association method further includes: before step S101, grouping the first batch of wafers and associated batches of wafers associated with the first batch of wafers and marking them with group tags, and marking the measurement items in the measurement items of the first batch of wafers that correspond to the measurement items of the associated batches of wafers with cross-group tags. In the technical solution of this application, it is sometimes necessary to combine the measurement data of multiple batches of wafers in multiple process flows for calculation. Therefore, grouping and marking the multiple batches of wafers in multiple process flows that need to be combined with data is used for identification, indicating that the current batch of wafers may need to be combined with the data of other batches of wafers. In addition, when there are multiple measurement items for a certain batch of wafers, not all measurement items need to be combined with multiple batches of wafers, nor does each processing machine need to be combined with multiple batches of wafers. Therefore, only those measurement items that need to be combined with data are marked with cross-group tags, indicating that the measurement item needs to be combined with the data of other batches of wafers. For example, in this application, the first batch of wafers and associated batches of wafers can be grouped and marked with group tags.
[0026] Continue to refer to Figure 1 As shown, the wafer data association method described in this application further includes: step S102, determining whether the first batch of wafers contains grouping marks, and step S103, determining whether the measurement items of the first batch of wafers contain cross-group marks.
[0027] In some embodiments of this application, reference is made to Figure 1As shown, when it is determined that the first batch of wafers does not contain grouping marks or that the measurement items of the first batch of wafers do not contain cross-group marks, it indicates that data acquisition across process flows is not currently required. Therefore, proceed to step S104 and execute the standard steps. The standard steps refer to those identical to those in the current conventional process, namely, collecting data from all required measurement items in the first batch of wafers, performing calculations, and determining whether the equipment is functioning correctly based on the calculation results.
[0028] In some embodiments of this application, reference continues to be made to Figure 1 As shown, when it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, it indicates that data needs to be obtained across process flows. Therefore, step S105 is initiated to collect data for all measurement items in the first batch of wafers that do not contain cross-group marks. Since data needs to be obtained across process flows, i.e., measurement data from other batches of wafers needs to be acquired, it is necessary to wait for the data acquisition of other batches of wafers within the same group to be completed. At this time, data for all measurement items in this batch of wafers that do not contain cross-group marks are collected first.
[0029] Continue to refer to Figure 1 As shown, the wafer data association method described in this application further includes: step S106, obtaining data of the corresponding measurement items of the associated batch of wafers that correspond to the measurement items containing cross-group markers in the measurement items of the first batch of wafers. Here, "corresponding" refers to the corresponding measurement items in the corresponding batch of wafers that the first batch of wafers needs to obtain across processes.
[0030] In some embodiments of this application, after collecting data from all measurement items in the first batch of wafers that do not contain cross-group markers, and before acquiring data from the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers, the first batch of wafers is transferred to a waiting station. Different batches of wafers within the same group have different time progress; for example, the time progress of the first batch of wafers is different from that of the associated batch of wafers. When the first batch of wafers is progressing faster, it is necessary to wait for the associated batch of wafers. The technical solution of this application does not need to consider the processing order and time of different batches of wafers. Batch wafers that complete processing first will wait at the waiting station until all batches of wafers within the same group have completed processing and data is collected. To avoid wasting and occupying the measurement station, during the waiting period from step S105 to step S106, the first batch of wafers is first transferred to the waiting station. Specifically, the first batch of wafers is locked and marked with a lock tag, indicating that there are still corresponding associated batch wafers whose measurement items have not been completed.
[0031] Continue to refer to Figure 1As shown, the wafer data association method described in this application further includes: step S107, calculating the collected and acquired data and determining whether the machine is normal based on the calculation results.
[0032] In some embodiments of this application, when the machine is determined to be normal, step S108 involves unlocking the first batch of wafers and proceeding to the next station.
[0033] In some embodiments of this application, when the calculation result is determined to be abnormal, step S109 involves changing the locking mode of the first batch of wafers. Different locking modes represent different locking reasons. In the previous locking mode, the marked locking reason was that it was necessary to wait for data from other batches of wafers. At this time, it is necessary to change the locking mode to indicate that the locking reason is that the calculation result is abnormal and it is necessary to wait for staff to handle it.
[0034] The wafer data association method described in this application groups and marks different batches of wafers that need to acquire data across processes, and then marks the measurement items that need to acquire data across processes as well. During the measurement process, the corresponding steps are performed according to whether there are marks, so as to realize the location, collection and calculation of measurement data across processes, avoid data errors, and enable users to quickly and timely confirm the machine status information.
[0035] Embodiments of this application also provide a wafer data association system for executing the wafer data association method described above, comprising: a data acquisition module, wherein when the data acquisition module operates, it determines whether the first batch of wafers contains grouping marks and whether the measurement items of the first batch of wafers contain cross-group marks after the first batch of wafers has been processed in the machine; when it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, it collects data of all measurement items in the first batch of wafers that do not contain cross-group marks; and acquires data of corresponding measurement items of associated batch wafers corresponding to measurement items containing cross-group marks in the measurement items of the first batch of wafers; and a data calculation module, wherein when the data calculation module operates, it calculates the collected and acquired data and determines whether the calculation results are normal.
[0036] In some embodiments of this application, the wafer data association system further includes a marking module, which is used to group the first batch of wafers and associated batches of wafers associated with the first batch of wafers and mark them with grouping tags, and to mark the measurement items of the first batch of wafers that correspond to the measurement items of the associated batches of wafers with cross-group tags. In the technical solution of this application, sometimes it is necessary to combine the measurement data of multiple batches of wafers in multiple process flows for calculation. Therefore, multiple batches of wafers in multiple process flows that need data combination are grouped and marked with grouping tags for identification, indicating that the current batch of wafers may need to be combined with data from other batches of wafers. Furthermore, when a batch of wafers has multiple measurement items, not all measurement items need to be combined with multiple batches of wafers, nor does each processing machine need to be combined with multiple batches of wafers. Therefore, only those measurement items that need data combination are marked with cross-group tags, indicating that the measurement item needs to be combined with data from other batches of wafers. For example, in this application, the first batch of wafers and associated batches of wafers can be grouped and marked with grouping tags.
[0037] Then refer to Figure 1 As shown, after the first batch of wafers enters the measurement station, the data acquisition module of this application executes step S102 to determine whether the first batch of wafers contains a grouping mark, and executes step S103 to determine whether the measurement items of the first batch of wafers contain a cross-group mark.
[0038] In some embodiments of this application, reference is made to Figure 1 As shown, when it is determined that the first batch of wafers does not contain grouping marks or that the measurement items of the first batch of wafers do not contain cross-group marks, it indicates that data acquisition across process flows is not currently required. The data acquisition module executes step S104, which involves performing the standard steps. The standard steps refer to those identical to those in the current conventional process, namely, collecting data from all required measurement items in the first batch of wafers, performing calculations, and determining whether the equipment is functioning correctly based on the calculation results.
[0039] In some embodiments of this application, reference continues to be made to Figure 1 As shown, when it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, it indicates that data needs to be acquired across process flows. The data acquisition module executes step S105 to collect data for all measurement items in the first batch of wafers that do not contain cross-group marks. Since data needs to be acquired across process flows, i.e., measurement data from other batches of wafers needs to be acquired, it is necessary to wait for the data acquisition of other batches of wafers within the same group to be completed. At this time, data for all measurement items in this batch of wafers that do not contain cross-group marks are collected first.
[0040] Continue to refer to Figure 1 As shown, the data acquisition module executes step S106 to acquire data of the corresponding measurement items in the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers. Here, "corresponding" refers to the corresponding measurement items in the corresponding batch of wafers that the first batch of wafers needs to acquire across processes.
[0041] In some embodiments of this application, the wafer data association system further includes a control module. After the data acquisition module collects data on all measurement items in the first batch of wafers that do not contain cross-group markers, and before acquiring data on the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers, the control module controls the first batch of wafers to be transferred to a waiting station. Different batches of wafers within the same group have different time progresses. For example, the time progress of the first batch of wafers is different from that of the associated batch of wafers. When the first batch of wafers is progressing faster, it needs to wait for the associated batch of wafers. The technical solution of this application does not need to consider the processing order and time of different batches of wafers. Batch wafers that complete processing first will wait at the waiting station until all batches of wafers within the same group have completed processing and data is collected. To avoid wasting and occupying the measurement station, during the waiting period from step S105 to step S106, the first batch of wafers is transferred to the waiting station first. Specifically, the first batch of wafers is locked and marked with a lock tag, indicating that there are still corresponding batches of wafers whose measurement items have not been completed.
[0042] Continue to refer to Figure 1 As shown, when the data calculation module is working, it executes step S107 to calculate the collected and acquired data and determine whether the machine is normal based on the calculation results.
[0043] In some embodiments of this application, when the machine is determined to be normal, the control module executes step S108 to release the lock of the first batch of wafers and proceed to the next station.
[0044] In some embodiments of this application, when the calculation result is determined to be abnormal, step S109 involves changing the locking mode of the first batch of wafers. Different locking modes represent different locking reasons. In the previous locking mode, the marked locking reason was that data from other batches of wafers needed to be waited for. At this time, the locking mode needs to be changed to indicate that the locking reason is that the calculation result is abnormal and that processing by personnel is required. Changing the locking mode of the first batch of wafers can be accomplished by the marking module.
[0045] The wafer data association system described in this application groups and marks different batches of wafers that need to acquire data across processes. Then, it also marks the measurement items that need to acquire data across processes. During the measurement process, the corresponding steps are performed based on whether the items are marked. This enables the location, collection, and calculation of measurement data across processes, avoids data errors, and allows users to quickly and timely confirm the machine status information.
[0046] This application provides a wafer data association system and method to realize the location, collection and calculation of measurement data across processes, avoid data errors, and enable users to quickly and timely confirm the status information of the equipment.
[0047] In summary, after reading this application, those skilled in the art will understand that the foregoing application content is presented by way of example only and is not restrictive. Although not explicitly stated herein, those skilled in the art will understand that this application is intended to encompass various reasonable changes, improvements, and modifications to the embodiments. These changes, improvements, and modifications are all within the spirit and scope of the exemplary embodiments of this application.
[0048] It should be understood that the term "and / or" as used in this embodiment includes any or all combinations of one or more of the associated listed items. It should be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intermediate element.
[0049] Similarly, it should be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element, it may be directly on that other element, or there may be intermediate elements present. Conversely, the term "directly" means without intermediate elements. It should also be understood that the terms "comprising," "including," "including," or "comprises," as used in this application, indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.
[0050] It should also be understood that although the terms first, second, third, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, without departing from the teachings of this application, a first element in some embodiments may be referred to as a second element in other embodiments. The same reference numerals or the same reference signs denote the same elements throughout the specification.
[0051] Furthermore, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. For instance, etched areas shown as rectangular typically have circular or curved features. Therefore, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shape of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.
Claims
1. A wafer data association system, characterized in that, include: The data acquisition module, when in operation: After the first batch of wafers is processed in the machine, it is determined whether the first batch of wafers contains grouping marks and whether the measurement items of the first batch of wafers contain cross-group marks. When it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, data of all measurement items in the first batch of wafers that do not contain cross-group marks are collected; Obtain the data of the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers; The data calculation module, when in operation, performs calculations on the collected and acquired data and determines whether the calculation results are normal.
2. The wafer data association system as described in claim 1, characterized in that, Also includes: The marking module is used to group the first batch of wafers and associated batches of wafers associated with the first batch of wafers and mark them with grouping tags, and to mark the measurement items of the first batch of wafers that correspond to the measurement items of the associated batches of wafers with cross-group tags.
3. The wafer data association system as described in claim 1, characterized in that, The data acquisition module also includes the following steps when it is determined that the first batch of wafers does not contain grouping marks or that the measurement items of the first batch of wafers do not contain cross-group marks: collecting data of all measurement items in the first batch of wafers.
4. The wafer data association system as described in claim 1, characterized in that, Also includes: After the data acquisition module collects data on all measurement items in the first batch of wafers that do not contain cross-group markers, and before acquiring data on the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers, the control module controls the first batch of wafers to be transferred to the waiting station.
5. The wafer data association system as described in claim 1, characterized in that, When the data calculation module determines that the calculation result is abnormal, it changes the locking mode of the first batch of wafers.
6. A wafer data association method, characterized in that, include: After the first batch of wafers is processed in the machine, it is determined whether the first batch of wafers contains grouping marks and whether the measurement items of the first batch of wafers contain cross-group marks. When it is determined that the first batch of wafers contains grouping marks and the measurement items of the first batch of wafers contain cross-group marks, data of all measurement items in the first batch of wafers that do not contain cross-group marks are collected; Obtain the data of the corresponding measurement items of the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers; The collected and acquired data are processed and the results are evaluated to determine if they are valid.
7. The wafer data association method as described in claim 6, characterized in that, Also includes: The first batch of wafers and the associated batch of wafers are grouped and marked with group tags, and the measurement items of the first batch of wafers that correspond to the measurement items of the associated batch of wafers are marked with cross-group tags.
8. The wafer data association method as described in claim 6, characterized in that, When it is determined that the first batch of wafers does not contain grouping marks or that the measurement items of the first batch of wafers do not contain cross-group marks, data of all measurement items in the first batch of wafers are collected.
9. The wafer data association method as described in claim 6, characterized in that, After collecting data for all measurement items in the first batch of wafers that do not contain cross-group markers, and before acquiring data for the corresponding measurement items in the associated batch of wafers that contain cross-group markers in the measurement items of the first batch of wafers, the first batch of wafers is transferred to the waiting site.
10. The wafer data association method as described in claim 6, characterized in that, If the calculation result is determined to be abnormal, the locking mode of the first batch of wafers is changed.