Multilayer circuit board pressing method and pressing apparatus
By using an anti-overflow adhesive structure with a thickness less than that of the core board and an infrared positioning frame for precise positioning during the lamination process of multilayer circuit boards, the problem of adhesive flow caused by excessive pressure in the board edge area was solved, thereby achieving uniformity of the dielectric layer and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-15
- Publication Date
- 2026-07-24
AI Technical Summary
During the lamination process of multilayer circuit boards, excessive stress in the board edge area leads to increased PP adhesive flow, resulting in the dielectric layer failing to meet customer requirements after lamination and a high product scrap rate.
During the lamination process, an anti-overflow adhesive structure with a thickness less than that of the core board is used to surround the core board. The intermediate spacer and the anti-overflow adhesive structure are precisely positioned using an infrared positioning frame to control the pressure distribution and adhesive flow path.
Reducing the amount of PP adhesive flowing in the edge area of the board improves the uniformity of the medium layer after lamination, reduces product scrap rate, and increases production efficiency and product yield.
Smart Images
Figure CN122458341A_ABST