An embedded wafer conveyance device and wafer conveyance system

Abstract

The application provides an embedded wafer conveying device and a wafer conveying system, wherein the conveying device is embedded in the interior of a wafer storage stocker and can be pulled out or pushed back by sliding; the conveying device comprises a first loading port configured to exchange a box with an external conveying equipment, a second loading port configured to exchange a box with a stacker of the wafer storage stocker, a mechanical hand used for conveying wafers, the second loading port is rotatable and is aligned with a wafer taking station of the mechanical hand after rotation, an edge finder used for centering a wafer, and a code reader used for reading a wafer mark. The Sorter is embedded in the Stocker, the floor space is reduced, unified supply is provided, and supply resources are saved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more specifically to an embedded wafer transport device and wafer transport system. Background Technology

[0002] In current Automated Material Handling Systems (AMHS) for semiconductors, wafer sorters and stockers are generally deployed separately. Specifically, the sorter and stocker are two independent physical devices, located in different areas or adjacent locations within the cleanroom. The movement of wafer pods (FOUP / FOSB) between them relies entirely on overhead cranes (OHT) or automated guided vehicles (AGVs): when batching, consolidation, sorting, or wafer-level inspection is required, the Manufacturing Execution System (MES) or Material Control System (MCS) first instructs the OHT to move the pod from the stocker location to the sorter's load port; after the sorter completes single-wafer-level operations (such as reading wafer ID, aligning notch, and reassembling), it returns the wafer to the pod or a new pod, and then the OHT moves the pod back to the stocker or directly to the next process stage.

[0003] Split-layout solutions dominate existing wafer fabs due to their flexibility. However, as semiconductor manufacturing moves towards smaller linewidths and more layers, production lines are placing higher demands on material turnover efficiency, cleanliness continuity, and real-time wafer-level control, highlighting the inherent limitations of split-layout deployments.

[0004] Each rewinding task requires the OHT to shuttle back and forth between the Stocker and Sorter, which can easily cause overhead crane congestion on heavy-duty production lines, resulting in 30% to 50% of the rewinding cycle time being consumed by material handling. Both machines have independent power supply, gas supply, and nitrogen purging / replacement systems, resulting in a large total footprint and high overall energy consumption.

[0005] Therefore, there is an urgent need for a semiconductor transport system that can integrate the functions of Sorter and Stocker, reduce intermediate handling steps, and improve equipment space utilization. Summary of the Invention

[0006] The purpose of this invention is to provide an embedded wafer transport device and wafer transport system that can integrate the functions of Sorter and Stocker, reduce intermediate handling steps, and improve equipment space utilization.

[0007] To achieve the above objectives, the present invention provides an embedded wafer transport device, which is embedded inside a wafer storage rack and can be slidably pulled out of or pushed into the wafer storage rack for resetting; the transport device includes:

[0008] The first loading port is configured for receiving and transferring material boxes to external handling equipment;

[0009] The second loading port is configured to receive material boxes from the stacker crane of the wafer storage vertical warehouse;

[0010] A robotic arm is used to handle wafers, and the second loading port is configured to rotate so that it aligns with the wafer picking station of the robotic arm after rotation.

[0011] Edge finder, used for wafer centering;

[0012] A barcode reader is used to read wafer markings.

[0013] In an optional configuration, the conveying device is located between the storage rack of the wafer storage warehouse and the external interface port.

[0014] In an optional embodiment, the conveying device includes a linear guide mechanism, which comprises a linear guide rail fixed to the floor inside the wafer storage rack and a slider installed at the bottom of the conveying device and slidingly engaging with the linear guide rail.

[0015] In an optional configuration, the first loading port and the second loading port are positioned opposite each other; the working area of ​​the robotic arm is located between the first loading port and the second loading port.

[0016] The working rotation angle of the second loading port is 180 degrees.

[0017] In an optional embodiment, the conveying device further includes an automatic teaching module, which includes a first offset detection sensor for detecting the horizontal position offset of the end fingers of the robotic arm and a second offset detection sensor for detecting the vertical position of the fingers.

[0018] In an optional embodiment, the conveying device further includes a wafer offset detection module, which includes a first offset detection sensor disposed at the first loading port and / or the second loading port, for detecting the horizontal offset of the wafer before it is placed into the hopper.

[0019] In an optional embodiment, the conveying device further includes a control module, which is communicatively connected to the warehouse controller of the wafer storage warehouse. After completing the operation of a single wafer, the control module directly sends the wafer status information to the warehouse controller to update the inventory record of the corresponding storage location.

[0020] In an optional embodiment, a transverse travel axis is provided between the first loading port and the second loading port; the robot arm is mounted on the transverse travel axis, and the line connecting the first loading port and the second loading port is perpendicular to the extension direction of the transverse travel axis.

[0021] In an alternative embodiment, the edge finder and the code reader are located at one end of the lateral movement axis.

[0022] The present invention also provides a wafer transport system, comprising:

[0023] The wafer storage automated warehouse is equipped with stacker cranes and storage racks for storing and transporting wafer boxes.

[0024] An embedded wafer flipper is slidably disposed inside the wafer storage stack and can be pulled out or pushed in and reset by sliding.

[0025] The embedded wafer flipping machine has a first loading port on its front for receiving material boxes from external handling equipment, and a second loading port on its back for receiving material boxes directly from the stacker crane of the wafer storage warehouse; the embedded wafer flipping machine integrates a robotic arm for handling wafers; the second loading port is configured to be rotatable, and after rotation, it is aligned with the wafer picking station of the robotic arm;

[0026] The embedded wafer fracturing machine also integrates an edge finder for aligning the wafers and a code reader for reading wafer markings.

[0027] The advantages of this invention are as follows: It embeds the Sorter inside the Stocker, reducing floor space and providing unified supply, thus saving supply resources. A linear guide rail is configured at the bottom of the Sorter, allowing it to be pulled out individually for maintenance. During this time, the Stocker's stacker crane can still access other storage locations normally; only a small number of storage locations associated with the Sorter are temporarily out of service. Furthermore, due to the linear guide rail and mechanical limit positioning, reset accuracy is guaranteed, and the Sorter can be pushed back in for normal use after maintenance. Attached Figure Description

[0028] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally denote like parts.

[0029] Figure 1 This is a schematic diagram of the front view structure of an embedded wafer transport device in one embodiment of the present invention.

[0030] Figure 2 This is a top view of an embedded wafer transport device according to an embodiment of the present invention.

[0031] Figure 3 This is a schematic diagram of the left-side structure of an embedded wafer transport device in one embodiment of the present invention.

[0032] Figure 4 This is a schematic diagram of wafer handling in an embedded wafer handling device according to an embodiment of the present invention.

[0033] Figure 5 This is a schematic diagram of the structure of an embedded wafer transfer device pulling out a wafer storage stack in one embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-First loading port; 2-Second loading port; 3-Transfer device; 4-Display screen; 5-Operating table; 6-Emergency stop button; 7-Warning light; 8-Slider; 9-Linear guide rail; 10-Transverse travel axis; 11-Robot arm; 12-Finger; 13-Edge finder; 14-Code reader; 15-Filter; 16-Wafer cassette; 17-Rotary worktable; 18-Wafer; 19-Wafer cassette; 20-Worktable; 21-Wafer storage rack; 22-First offset detection sensor bracket; 23-First offset detection sensor; 24-Second offset detection sensor bracket; 25-Second offset detection sensor. Detailed Implementation

[0036] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and drawings. However, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms and is not limited to the specific embodiments described herein. The accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0037] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0038] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0040] Example 1

[0041] Reference Figures 1 to 5This embodiment provides an embedded wafer transfer device 3, which is embedded inside the wafer storage cabinet 21 and can be pulled out or pushed in and reset by sliding.

[0042] The conveying device includes:

[0043] The first loading port 1 is configured to receive the material box 19 from external handling equipment;

[0044] The second loading port 2 is configured to transfer the material box 16 to the stacker crane of the wafer storage vertical warehouse 21;

[0045] Robotic arm 11 is used to transport wafers 18. The second loading port 2 is configured to be rotatable and aligned with the wafer picking station of the robotic arm 11 after rotation.

[0046] Edge finder 13 is used to center wafer 18;

[0047] Reader 14 is used to read the identifier of wafer 18.

[0048] Specifically, in this embodiment, the conveying device 3 is disposed between the storage rack of the wafer storage warehouse 21 and the external interface.

[0049] In this embodiment, the first loading port 1 and the second loading port 2 are arranged opposite to each other; the first loading port 1 is bolted to the front of the conveying device 3, and the second loading port 2 is bolted to the back of the conveying device 3. A display screen 4, an operating panel 5, an emergency stop button 6, and a warning light 7 are also installed on the external front of the conveying device 3. In this embodiment, there are two of each type of loading port. In other embodiments, the number of first loading ports 1 and second loading ports 2 can be one or more. In this embodiment, the working area of ​​the robotic arm 11 is located between the first loading port 1 and the second loading port 2; the working rotation angle of the second loading port 2 is 180 degrees.

[0050] In this embodiment, the conveying device includes a linear guide mechanism, which comprises a linear guide rail 9 fixed to the internal ground of the wafer storage rack 21 and a slider 8 mounted on the bottom of the conveying device and slidingly engaging with the linear guide rail 9. A transverse travel axis 10 is provided between the first loading port 1 and the second loading port 2; the robot arm 11 is mounted on the transverse travel axis 10, and the extension direction of the transverse travel axis 10 is perpendicular to the line connecting the first loading port 1 and the second loading port 2.

[0051] In this embodiment, a slider 8 is bolted to the bottom of the conveying device 3, and a matching linear guide rail 9 is fixed to the ground by a mounting plate. A transverse travel axis 10 is bolted to the rear of the conveying device 3. A robotic arm 11 is fixed to the slide of the transverse travel axis 10 by a bracket. Fingers 12 are mounted at the end of the robotic arm 11. An edge finder 13 and a code reader 14 are mounted on one side of the interior. A filter 15 is mounted on the top of the device. A first offset detection sensor bracket 22 is bolted to the transfer port of the first loading port 1 and the second loading port 2, and a first offset detection sensor 23 is mounted on it. A second offset detection sensor bracket 24 is bolted near the edge finder 14, and a second offset detection sensor 25 is mounted on top of the second offset detection sensor bracket 24.

[0052] In this embodiment, an embedded sorter work area is set up between the storage rack and the external interface of the wafer storage stocker. This work area includes a wafer robot, a wafer edge finder, and a second loading port with a wafer cassette rotation function. The existing stocker stacker crane can directly place the cassettes on the platform of this second loading port, and the platform rotates 180° to align with the sorter robot's pick-up station. This structure eliminates the need for any external handling equipment between the stocker and the sorter, and the stacker crane can immediately return to perform other storage and retrieval tasks after placing the cassettes, enabling parallel operation of the pipeline.

[0053] The embedded Sorter is configured with a second loading port 2 embedded in the stocker and a first loading port 12 externally. It can receive material boxes transported from the process equipment by OHT / AGV / manual personnel. The embedded Sorter acts as a transfer between the external process equipment and the stocker, supporting single-piece-level inbound and outbound operations, thus avoiding the inefficiency caused by the stocker moving out entire boxes for unloading.

[0054] In this embodiment, the conveying device further includes a control module, which is communicatively connected to the warehouse controller of the wafer storage vertical warehouse. After completing a single wafer operation, the control module directly sends the wafer status information to the warehouse controller to update the inventory record of the corresponding storage location. In the prior art, data such as wafer ID and notch angle identified by the Sorter need to be written to the Stocker's database through MES, which is delayed and prone to loss. In this embodiment, the control module of the conveying device communicates directly with the controller of the wafer storage vertical warehouse, and immediately updates the wafer status to the inventory record of the corresponding storage location after a single wafer operation is completed. For example, if an anomaly is detected in the 5th wafer, the system can automatically mark the storage location corresponding to that wafer as "to be isolated" and prohibit its release from the warehouse. The direct communication connection between the Sorter and the Stocker reduces data processing and improves operating efficiency.

[0055] In this embodiment, wafer cassettes can be loaded onto both the first loading port 1 and the rotatable second loading port 2, thereby enabling the transfer of wafers between each other. Taking the transfer of wafers from the rotatable second loading port 2 to the first load 1 as an example, the wafer storage rack 21 places the wafer cassette 16 onto the rotary table 17 of the rotatable second loading port 2. The rotary table 17 rotates 180 degrees, rotating the wafer cassette 16 to the device side. The rotary table 17 carries the wafer cassette 16 and moves forward. The rotatable second loading port 2 automatically opens the wafer cassette 16 and scans its interior to obtain the position of the wafer 18. At the same time, the first loading port 1 loads the received wafer cassette 19. The table 20 carries the wafer cassette 19 and moves forward. The first loading port 1 automatically opens the wafer cassette 19 and scans its interior to obtain the position of the wafer. After the two target wafer cassettes are loaded, the wafer transfer begins. The robotic arm 11 moves laterally on the transverse travel axis 10 to align with the wafer cassette 16. The robotic arm 11 rotates and extends its fingers 12. The fingers 12 move below the wafer 18. The robotic arm 11 rises to lift the wafer 18 with the fingers 12. The finger 12 and wafer 18 retract, and the robotic arm 11 rotates to align the finger 12 and wafer 18 towards the edge finder 13. The robotic arm 11 extends the finger 12 to move the wafer 18 above the edge finder 13. The robotic arm 11 then descends to place the wafer 18 on the edge finder 13. The finger 12 retracts, and the edge finder 13 receives the wafer 18 and rotates it to complete the centering. The ID of the wafer 18 is then aligned with the code reader 14 to complete the ID reading. Finally, the notch of the wafer 18 is rotated... Once the desired angle is reached, the robotic arm 11 extends its fingers 12 to lift the wafer 18 upwards and then retracts. The robotic arm 11 rotates back to align with the wafer cassette 19 and places the wafer 18 into the wafer cassette 19. After the wafer transfer is completed, the first loading port 1 and the rotatable second loading port 2 unload the wafers in reverse order of the loading steps. Finally, the wafer cassette 16 is removed by the wafer storage rack 21, and the wafer cassette 19 is removed by an overhead crane (OHT), an automated guided vehicle (AGV), or manually, thus completing the wafer transfer operation.

[0056] like Figure 5 As shown, during maintenance, the conveying device 3 is pulled out of the wafer storage rack 21 along the linear guide rail 9, and then pushed back after maintenance is completed.

[0057] In this embodiment, the conveying device further includes a wafer offset detection module. The wafer offset detection module includes a first offset detection sensor 23 disposed at the first loading port and / or the second loading port, used to detect the horizontal offset of the wafer before it is placed into the cassette. Taking the second loading port 2 side as an example, when the wafer 18 enters the wafer cassette 16, the optical axis of the first offset detection sensor 23 is triggered. By the time the optical axes of the sensors on the left and right sides of the wafer 18 are triggered and the time the wafer continues to move forward and leave the optical axis, plus the wafer conveying speed, the horizontal offset of the wafer can be calculated, and then the software compensates for the wafer placement.

[0058] Wafers are highly valuable after processing. In extreme cases, wafer misalignment can occur, causing the wafer to collide with the side of the wafer cassette and break (extreme cases include software errors, hardware wear and tear, and process instability), resulting in significant losses. The wafer misalignment detection module in this embodiment can monitor the wafer misalignment returned to the wafer cassette in real time throughout the Sorter's lifecycle. When the misalignment is large enough to collide with the side of the wafer cassette, an alarm will be triggered, further avoiding the risk of wafer breakage and providing early warnings that the Sorter needs maintenance. This accurately provides early warnings for wafer breakage and equipment maintenance.

[0059] In this embodiment, the conveying device further includes an automatic teaching module, which includes a first offset detection sensor 23 for detecting the horizontal position offset of the finger at the end of the robotic arm and a second offset detection sensor 25 for detecting the vertical position offset of the finger.

[0060] The transport device periodically, or after replacing a finger, moves the finger to a fixed coordinate position next to the first offset detection sensor 23. Horizontal left-right and forward-backward movements trigger the first offset detection sensor 23. The software calculates the horizontal offset of the finger by comparing the triggered movement distance with the initial distance. The finger is then moved to a fixed coordinate position below the optical axis of the second offset detection sensor 25. Moving the finger upward triggers the second offset detection sensor 25, which detects the vertical offset of the finger. Similarly, the software compares the vertical offset with the initial distance to obtain the vertical offset of the finger. Finally, the horizontal and vertical offsets of the finger are compensated for at each image acquisition position without manual instruction.

[0061] The distal digits of a robotic arm are made of fragile ceramic components and require multiple replacements during their lifespan. Traditionally, replacement requires pulling out the sort and manually recalibrating each station before pushing it back in, which is very time-consuming. The automatic teaching module in this embodiment eliminates the need to pull out the sort and recalibrate each station after finger replacement; automatic calibration allows continued use of the sort, significantly improving finger replacement efficiency.

[0062] This embodiment utilizes the existing high-precision stacker (or robotic arm) within the wafer storage automated warehouse to directly transfer the wafer trays from their storage locations to the operating area of ​​the wafer transport device. After wafer flipping is completed, the trays are returned to their target storage locations, completely eliminating the need for external handling. This improvement can reduce the total time for a single wafer flipping task by approximately 40%, while also reducing overhead crane network congestion.

[0063] In existing technologies, the Sorter and Stocker are independent and require separate supply configurations. This embodiment embeds the Sorter within the Stocker, reducing floor space and unifying the supply, thus saving supply resources.

[0064] In this embodiment, a linear guide rail is configured at the bottom of the sorter. When the sorter needs maintenance, it can be pulled out individually. At this time, the stacker crane of the sorter can still access other storage locations normally, and only a small number of storage locations associated with the sorter will be temporarily out of service. Moreover, due to the linear guide rail and mechanical limit positioning, the reset accuracy is guaranteed. After maintenance is completed, it can be pushed back in for normal use, avoiding the need for re-teaching at the handover position.

[0065] The handling device in this embodiment is equipped with an automatic wafer offset detection function, which effectively avoids significant losses caused by wafer offset leading to breakage when placing the wafer into the wafer cassette. The handling device is also equipped with an automatic teaching function, which automatically corrects the finger's wafer picking position by detecting the offset in three directions: forward / backward, left / right, and up / down, reducing teaching time and solving the problem of inconvenient teaching due to the embedded stocker-side loadport.

[0066] Example 2

[0067] This embodiment provides a wafer transport system, including:

[0068] The wafer storage automated warehouse is equipped with stacker cranes and storage racks for storing and transporting wafer boxes.

[0069] An embedded wafer flipper is slidably disposed inside the wafer storage stack and can be pulled out or pushed in and reset by sliding.

[0070] The embedded wafer flipping machine has a first loading port on its front for receiving material boxes from external handling equipment, and a second loading port on its back for receiving material boxes directly from the stacker crane of the wafer storage warehouse; the embedded wafer flipping machine integrates a robotic arm for handling wafers; the second loading port is configured to be rotatable, and after rotation, it is aligned with the wafer picking station of the robotic arm;

[0071] The embedded wafer fracturing machine also integrates an edge finder for aligning the wafers and a code reader for reading wafer markings.

[0072] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An embedded wafer transport device, characterized in that, The conveying device is embedded inside the wafer storage rack and can be pulled out or pushed in and reset by sliding; the conveying device includes: The first loading port is configured for receiving and transferring material boxes to external handling equipment; The second loading port is configured to receive material boxes from the stacker crane of the wafer storage vertical warehouse; A robotic arm is used to handle wafers, and the second loading port is configured to rotate so that it aligns with the wafer picking station of the robotic arm after rotation. Edge finder, used for wafer centering; A barcode reader is used to read wafer markings.

2. The embedded wafer transport device as described in claim 1, characterized in that, The conveying device is located between the storage rack of the wafer storage vertical warehouse and the external interface.

3. The embedded wafer transport device as described in claim 1, characterized in that, The conveying device includes a linear guide mechanism, which includes a linear guide rail fixed to the floor inside the wafer storage rack and a slider installed at the bottom of the conveying device and slidingly engaging with the linear guide rail.

4. The embedded wafer transport device as described in claim 1, characterized in that, The first loading port and the second loading port are arranged opposite to each other; the working area of ​​the robotic arm is located between the first loading port and the second loading port; The working rotation angle of the second loading port is 180 degrees.

5. The embedded wafer transport device as described in claim 1, characterized in that, The conveying device also includes an automatic teaching module, which includes a first offset detection sensor for detecting the horizontal position offset of the end finger of the robotic arm and a second offset detection sensor for detecting the vertical position of the finger.

6. The embedded wafer transport device as described in claim 1, characterized in that, The conveying device further includes a wafer offset detection module, which includes a first offset detection sensor disposed at the first loading port and / or the second loading port for detecting the horizontal offset of the wafer before it is placed into the hopper.

7. The embedded wafer transport device as described in claim 1, characterized in that, The conveying device also includes a control module, which is communicatively connected to the warehouse controller of the wafer storage warehouse. After completing the operation of a single wafer, the control module directly sends the wafer status information to the warehouse controller to update the inventory record of the corresponding storage location.

8. The embedded wafer transport device as described in claim 1, characterized in that, A transverse travel axis is provided between the first loading port and the second loading port; the robot arm is mounted on the transverse travel axis, and the line connecting the first loading port and the second loading port is perpendicular to the extension direction of the transverse travel axis.

9. The embedded wafer transport device as described in claim 8, characterized in that, The edge finder and the code reader are located at one end of the lateral movement axis.

10. A wafer transport system, characterized in that, include: The wafer storage automated warehouse is equipped with stacker cranes and storage racks for storing and transporting wafer boxes. An embedded wafer flipper is slidably disposed inside the wafer storage stack and can be pulled out or pushed in and reset by sliding. The embedded wafer flipping machine has a first loading port on its front for receiving material boxes from external handling equipment, and a second loading port on its back for receiving material boxes directly from the stacker crane of the wafer storage warehouse; the embedded wafer flipping machine integrates a robotic arm for handling wafers; the second loading port is configured to be rotatable, and after rotation, it is aligned with the wafer picking station of the robotic arm; The embedded wafer fracturing machine also integrates an edge finder for aligning the wafers and a code reader for reading wafer markings.

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