Substrate support apparatus including a clamping pin

Abstract

A substrate support apparatus according to one embodiment includes a chuck plate rotatable about a rotation axis perpendicular to a ground surface, a plurality of bearing pins coupled to an upper portion of the chuck plate and contacting a lower side of a substrate to support the substrate, and a plurality of clamping pins coupled to the chuck plate at different locations outside of edges of the substrate supported by the plurality of bearing pins and configured to clamp the edges of the substrate, the plurality of clamping pins each being configured to rotate about a hinge axis between a closed position in which the clamping pin contacts the edge of the substrate to clamp the substrate and an open position in which the clamping pin does not contact the edge of the substrate.

Description

Technical Field

[0001] The following embodiments relate to a substrate support device including clamping pins. Background Technology

[0002] Semiconductor devices are manufactured by performing various processes, including deposition, photolithography, and etching, on substrates such as wafers. Semiconductor manufacturing processes require cleaning processes to remove residual film residues, impurities, polishing slurry particles, and other contaminants from the substrate. In particular, substrates that have undergone chemical mechanical polishing (CMP) often retain a large amount of foreign matter, necessitating multiple cleaning processes for its removal.

[0003] In the substrate cleaning process, a substrate support device supports the substrate edges to maintain the substrate position. Cleaning fluid is sprayed onto the held substrate surface to clean it. The substrate support device may include clamping pins for holding the substrate. Multiple clamping pins may be provided to support the substrate edges during substrate rotation. Depending on the structure of the clamping pins and / or the force with which the pins clamp the substrate, substrate damage may occur. Furthermore, even after the cleaning process is complete, particles generated during the substrate cleaning process may prevent the contact between the clamping pins and the substrate from disengaging.

[0004] The above background technology is technology that the inventor possessed or mastered in the process of deriving the disclosure of this application, and is not necessarily publicly known technology that was disclosed to the general public before this application. Summary of the Invention

[0005] One embodiment aims to provide a substrate support device capable of stably supporting the substrate during substrate rotation.

[0006] One embodiment aims to provide a substrate support device that can prevent clamping pins from damaging the substrate.

[0007] One embodiment aims to provide a substrate support device including a forced opening unit capable of forcibly releasing the contact between the substrate and the clamping pin.

[0008] According to one embodiment, a substrate support device includes: a chuck plate rotatable about a rotation axis perpendicular to the ground; a plurality of support pins connected to the upper part of the chuck plate and contacting the lower side of the substrate to support the substrate; and a plurality of clamping pins connected to different positions on the chuck plate in a manner located outside the edge of the substrate supported by the plurality of support pins, and used to clamp the edge of the substrate, wherein the plurality of clamping pins can be respectively configured to rotate about a hinge axis between a closed position and an open position, the closed position being a position in contact with the edge of the substrate to clamp the substrate, and the open position being a position not in contact with the edge of the substrate.

[0009] Multiple clamping pins can be configured to be in a closed position by centrifugal force when the chuck plate rotates, and in an open position by restoring force when the chuck plate does not rotate.

[0010] The multiple clamping pins may each include: a first portion having a counterweight disposed therein; and a second portion protruding from one side of the first portion along the length direction and used to contact the edge of the substrate.

[0011] The second part can be configured to directly contact the edge of the substrate via its outer surface to support the substrate.

[0012] The outer surface of the second part may have a groove that matches the edge of the substrate.

[0013] The chuck plate includes multiple stops that contact the first part when the multiple clamping pins are in the open position. The multiple stops can be configured to limit the rotation range of each of the multiple clamping pins.

[0014] The number of multiple support pins is the same as the number of multiple clamping pins, and the multiple support pins can be located between the corresponding clamping pins and the rotating shaft.

[0015] Multiple support pins can be arranged adjacent to their corresponding clamping pins.

[0016] The hinge axis can be configured to be parallel to the ground.

[0017] Multiple clamping pins can be configured to be arranged at equal angles along the edge of the substrate with respect to the rotation axis.

[0018] The substrate support device also includes a forced opening unit, which is used to rotate the clamping pin to the open position when the clamping pin is in the closed position.

[0019] The forced opening unit includes a cover that can move vertically. When multiple clamping pins are in the closed position, the multiple clamping pins can contact the cover and rotate to the open position as the cover descends.

[0020] The forced opening unit includes a jet nozzle configured to jet fluid from the outside of the chuck plate toward a first portion of each of a plurality of clamping pins, wherein the plurality of clamping pins can be rotated to an open position by the jet fluid jetted from the jet nozzle when the plurality of clamping pins are in a closed position.

[0021] The chuck plate may include: a fluid inlet formed on the top of the chuck plate; and a discharge section communicating with the fluid inlet and formed inside the chuck plate to discharge fluid flowing in through the fluid inlet to the outside of the chuck plate.

[0022] The fluid inlet can be configured inside multiple carrier pins.

[0023] According to one embodiment, a substrate support device is capable of stably supporting a substrate during substrate rotation.

[0024] According to one embodiment, a substrate support device is capable of preventing clamping pins from damaging the substrate.

[0025] According to one embodiment, a substrate support device may include a forced opening unit capable of forcibly releasing the contact between the substrate and the clamping pin.

[0026] The effects of the substrate support device according to various embodiments are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0027] Figure 1 This is a front view of a substrate support device according to one embodiment.

[0028] Figure 2 This is a plan view of a chuck plate according to one embodiment.

[0029] Figure 3 A cross-sectional view of a substrate support device according to one embodiment shows the clamping pin in the closed position.

[0030] Figure 4 A cross-sectional view of a substrate support device according to one embodiment shows the clamping pin in the open position.

[0031] Figure 5 A cross-sectional view of a substrate support device according to one embodiment shows the operation of moving the clamping pin to the open position via the cover.

[0032] Figure 6 A cross-sectional view of a substrate support device according to one embodiment shows the operation of moving a clamping pin to an open position via a jet nozzle. Detailed Implementation

[0033] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various modifications can be made to the embodiments, the scope of the patent application is not limited or restricted by these embodiments. Rather, it should be understood that all modifications, equivalents, and even substitutions made to the embodiments are included within the scope of the claims.

[0034] The terminology used in the embodiments is for illustrative purposes only and should not be construed as intended to be limiting. Singular expressions include plural expressions unless the context clearly distinguishes them. In this specification, terms such as "comprising" or "having" should be understood to specify the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof described in the specification, and not to preclude the presence or additional possibilities of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

[0035] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. Terms as defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant art, and should not be construed as having an ideal or overly formal meaning unless expressly defined herein.

[0036] Furthermore, when describing the embodiments with reference to the accompanying drawings, regardless of the reference numerals, the same reference numerals are assigned to the same constituent elements, and repeated descriptions are omitted. When describing embodiments, detailed descriptions of related well-known technologies are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the embodiments.

[0037] Furthermore, when describing the constituent elements of the embodiments, terms such as first, second, A, B, (a), and (b) may be used. These terms are merely for distinguishing the constituent element from other constituent elements and do not limit the nature, order, or steps of the relevant constituent elements. When a constituent element is described as "connected," "combined," or "accessed" to other constituent elements, it should be understood that although the constituent element can be directly connected to or accessed to other constituent elements, there may also be other constituent elements that are "connected," "combined," or "accessed" between the constituent elements.

[0038] The constituent elements included in one embodiment and the constituent elements that share common functions are described using the same names in other embodiments. Unless otherwise stated, the descriptions described in any embodiment are applicable to other embodiments, and specific descriptions are omitted to the extent necessary for repetition.

[0039] Figure 1 This is a front view of a substrate support device according to one embodiment. Figure 2 This is a plan view of a chuck plate according to one embodiment.

[0040] Reference Figure 1 and Figure 2According to one embodiment, the substrate support device 1 can support a substrate W for substrate processing. For example, the substrate support device 1 can support the substrate W such that both sides of the substrate W are exposed to the outside for a cleaning process. At this time, a cleaning solution, chemical solution, or other fluid can be supplied to the surface of the substrate W to remove residual foreign matter. However, the process applied by the substrate support device 1 is not limited to substrate cleaning processes.

[0041] In one embodiment, the substrate W supported by the substrate support device 1 may be a silicon wafer used in semiconductor manufacturing. However, the type of substrate W is not limited to this. For example, the substrate W may also be a glass substrate for flat panel display devices such as liquid crystal displays (LCDs) or plasma display panels (PDFs). In one embodiment, the substrate W is circular, and its size may vary depending on the application.

[0042] According to one embodiment, a substrate support device 1 may include a shaft 100, a chuck plate 200, a support pin 210 connected to the chuck plate 200, and a clamping pin 300. The shaft 100 is rotatable about a rotation axis X perpendicular to the ground. The chuck plate 200 is connected to the upper part of the shaft 100 and can rotate together with the shaft 100 about the rotation axis X perpendicular to the ground. A support area for placing a substrate W may be formed on the upper side of the chuck plate 200. In one embodiment, as described below, when the substrate W is clamped by the support pin 210 and the clamping pin 300, the substrate W can be aligned on the support area formed on the upper part of the chuck plate 200. The substrate support device 1 can rotate about the rotation axis X while the substrate W is located on the upper side of the chuck plate 200, thereby rotating the substrate W. Hereinafter, unless otherwise stated, the substrate support device 1 will be described based on the state in which the substrate support device 1 supports the substrate W, that is, the state in which the substrate W is aligned and placed on the support area.

[0043] In one embodiment, the support pin 210 may be connected to the upper part of the chuck plate 200. For example, multiple support pins 210 may be provided, and the multiple support pins 210 may be located at different positions on the chuck plate 200. The multiple support pins 210 may be arranged at equal angles along concentric circles with respect to the rotation axis X. The support pins 210 may be configured such that their upper ends protrude upwards toward the upper side of the chuck plate 200. The upper ends of the multiple support pins 210 may protrude at the same height relative to the upper surface of the chuck plate 200. In one embodiment, the support pins 210 may support different portions of the substrate W located in the support area through their protruding upper ends. For example, the substrate W may be supported by the support pins 210 and spaced apart from the upper surface of the chuck plate 200. The spacing between the upper surface of the chuck plate 200 and the substrate W may be the same as the protrusion height of the support pins 210 relative to the upper surface of the chuck plate 200.

[0044] In one embodiment, a fluid inlet 230 may be formed on the chuck plate 200. The fluid inlet 230 may communicate with a discharge portion (not shown) formed inside the chuck plate 200 and / or shaft 100. Fluid generated during the substrate cleaning process (e.g., cleaning fluid) may flow from the top of the chuck plate 200 into the discharge portion through the fluid inlet 230. The fluid flowing into the discharge portion may be discharged to the outside of the chuck plate 200, for example, by a pump (not shown) configured to apply negative pressure to the discharge portion. When viewed from above, the fluid inlet 230 may be disposed inside the support pin 210. For example, the fluid inlet 230 may be disposed inside the support pin 210 adjacent to the rotation axis X.

[0045] In one embodiment, the clamping pins 300 may be connected to different positions on the chuck plate 200. The clamping pins 300 may be located outside the edge of the substrate W supported by the carrier pins 210 to clamp the edge of the substrate W. For example, multiple clamping pins 300 may be symmetrically arranged on the chuck plate 200. For example, multiple clamping pins 300 may be arranged at equal angles along concentric circles (e.g., the edge of the substrate W) on the chuck plate 200 with respect to the rotation axis X. Figure 1 and Figure 2 The diagram shows a chuck plate 200 connected to four clamping pins 300, but the configuration and / or number of clamping pins 300 are not limited thereto. For example, the chuck plate 200 may also be connected to six clamping pins 300.

[0046] In one embodiment, the support pin 210 may be located between the clamping pin 300 and the rotation axis X. The number of support pins 210 may be the same as the number of clamping pins 300. The clamping pin 300 closest to each support pin 210 may be referred to as the clamping pin 300 corresponding to each support pin 210. The support pin 210 may be located between the corresponding clamping pin 300 and the rotation axis X. In other words, the support pin 210 may be located on the virtual line segment connecting the corresponding clamping pin 300 and the rotation axis X. The support pin 210 may be arranged adjacent to the corresponding clamping pin 300. In other words, the support pin 210 may be configured inside the corresponding clamping pin 300, maintaining a minimum distance from the clamping pin 300. With this structure, the substrate support device 1 can be configured such that the support pin 210 contacts the lower side of the substrate W, and the clamping pin 300 contacts the edge of the substrate W, thereby supporting the substrate W.

[0047] Figure 3 This is a cross-sectional view of a substrate support device according to one embodiment, showing the clamping pin in the closed position. Figure 4 This is a cross-sectional view of a substrate support device according to one embodiment, showing the clamping pin in the open position.

[0048] Reference Figures 1 to 4The clamping pin 300 can be configured to rotate about a hinge axis 340 between an open position and a closed position. In one embodiment, the clamping pin 300 can rotate about the hinge axis 340 to selectively contact the edge of the substrate W. The hinge axis 340 can be perpendicular to the rotation axis X. For example, if the rotation axis X is perpendicular to the ground, the hinge axis 340 can be parallel to the ground. In one embodiment, the closed position can refer to... Figure 3 As shown, the clamping pin 300 contacts the edge of the substrate W to clamp the substrate W. In one embodiment, the open position may refer to... Figure 4 As shown, the clamping pin 300 is not in contact with the edge of the substrate W.

[0049] According to one embodiment, the clamping pin 300 may include a first portion 310 and a second portion 320, wherein the second portion 320 protrudes from one side of the first portion 310 (e.g., the upper side of the first portion 310) and selectively contacts the substrate W.

[0050] In one embodiment, the first portion 310 may be configured such that a hinge axis 340 passes through the first portion 310. For example, the hinge axis 340 may pass through the first portion 310 and be connected to the chuck plate 200.

[0051] In one embodiment, the second portion 320 may protrude upward from the first portion 310. The second portion 320 may extend upward from the first portion 310 and be formed in a straight line shape along its length. When the clamping pin 300 is in the closed position, the upper end of the second portion 320 may be higher than or the same height as the substrate W located in the bearing area, so that the second portion 320 can contact the edge of the substrate W. In one embodiment, the second portion 320 may directly contact the edge of the substrate W through its outer side to support the substrate W. When the clamping pin 300 is in the open position, the outer side of the second portion 320 may be spaced away from the edge of the substrate W. For example, as the clamping pin 300 rotates about the hinge axis 340, the second portion 320 may selectively contact the edge of the substrate W. In one embodiment, the outer side of the second portion 320 may be formed with a groove (not shown) adapted to the edge of the substrate W. When the clamping pin 300 is in the closed position, the groove of the second portion 320 may engage with the edge of the substrate W. With this structure, the clamping pin 300 can support the substrate W without contacting the upper side of the substrate W, thereby preventing damage to the substrate W.

[0052] In one embodiment, when no external force (e.g., centrifugal force) is applied, the clamping pin 300 can rotate from the closed position to the open position by the restoring force generated by the center of gravity. For example, the clamping pin 300 may have a weight distribution that is more stable in the open position than in the closed position. When the clamping pin 300 is in the closed position, the center of gravity of the clamping pin 300 may be located on the side opposite to the substrate W with respect to the hinge axis 340. For example, when the clamping pin 300 is in the closed position, the center of gravity of the clamping pin 300 may be located outside the hinge axis 340 (e.g., ...). Figure 3 (Right side). When the clamping pin 300 is not subjected to external force, it has maximum stability when its center of gravity is located below the hinge axis 340. Therefore, when the clamping pin 300 is no longer subjected to external force, it can rotate around the hinge axis 340 through the restoring force generated by the center of gravity of the clamping pin 300 (e.g., ...). Figure 3 (Rotation clockwise). When the clamping pin 300 is rotated to the open position, the rotation of the clamping pin 300 can be limited by the stopper 220 described later.

[0053] In one embodiment, in order to generate a restoring force through the aforementioned center of gravity, the clamping pin 300 may be configured to have the following weight distribution: with the open position as a reference, the center of gravity of the clamping pin 300 is located outside the hinge axis 340 (e.g.: Figure 3 (Right side). For example, the center of gravity of the clamping pin 300 may be located in the first part 310 outside the hinge axis 340 (e.g.: Figure 3 (Right side) portion. In one embodiment, the clamping pin 300 may include a counterweight 330 disposed on the first portion 310 to place the center of gravity on the first portion 310. At this time, the counterweight 330 may be located below and outside the hinge axis 340, and the second portion 320 may be formed at a position where it can contact the substrate W in the closed position.

[0054] In one embodiment, the counterweight 330 may be subjected to a downward gravitational force and / or a centrifugal force toward the outside of the chuck plate 200. As the chuck plate 200 rotates about the rotation axis X, an external force, such as a centrifugal force (e.g., ), may be applied to the clamping pin 300. Figure 3 (Arrow). The clamping pin 300 can be rotated to the closed position by external force, and the second part 320 can contact the edge of the substrate W. When the chuck plate 200 stops rotating, the external force applied to the clamping pin 300 can be released. At this time, the clamping pin 300 can be rotated to the open position by the restoring force generated by the center of gravity, and the contact between the second part 320 and the edge of the substrate W can be released.

[0055] According to this structure, when an external force (e.g., centrifugal force generated by the rotation of the chuck plate 200) is applied to the clamping pin 300 to rotate it, the clamping pin 300 rotates from the open position to the closed position; when the external force applied to the clamping pin 300 is released, the clamping pin 300 can rotate from the closed position to the open position by the restoring force generated by the center of gravity. Therefore, the action of supporting the substrate W by the clamping pin 300 can be automatically performed without a separate power source.

[0056] In one embodiment, the chuck plate 200 may further include a stop 220 configured to limit the rotational range of the clamping pin 300. When the clamping pin 300 is in the open position, the stop 220 may contact the clamping pin 300 to prevent the clamping pin 300 from rotating beyond its designated range. Figure 4 The opening position shown (e.g.: Figure 4 (Clockwise rotation). For example, stopper 220 may be located outside the edge of chuck plate 200 to contact clamping pin 300. The number of stoppers 220 may be the same as the number of clamping pins 300. As chuck plate 200 rotates, clamping pin 300 may rotate about hinge axis 340 (e.g.: Figure 3 (Counterclockwise rotation). Thus, the second portion 320 of the clamping pin 300 can contact the edge of the substrate W. As the chuck plate 200 stops rotating, the clamping pin 300 can rotate about the hinge axis 340 (e.g., ...). Figure 4 (Clockwise rotation). This releases the contact between the second portion 320 of the clamping pin 300 and the edge of the substrate W. The clamping pin 300 can rotate about the hinge axis 340 until the first portion 310 contacts the stop 220. In other words, when the clamping pin 300 is in the open position and the first portion 310 contacts the stop 220, the clamping pin 300 no longer rotates about the hinge axis 340. This structure limits the rotational range of the clamping pin 300. However, Figure 2 For convenience, this can be understood as showing the chuck plate 200 in a state where the stopper 220 is not connected.

[0057] Figure 5 A cross-sectional view of a substrate support device according to one embodiment shows the action of moving the clamping pin to the open position via the cover. Figure 6 A cross-sectional view of a substrate support device according to one embodiment shows the action of moving a clamping pin to an open position via a jet nozzle.

[0058] Reference Figure 5 and Figure 6 The substrate support device 1 may further include a forced opening unit, which is used to rotate the clamping pin 300 to the open position when the clamping pin 300 is in the closed position. As the chuck plate 200 stops rotating, the clamping pin 300 can rotate about the hinge axis 340 (e.g.: Figure 4(Rotating clockwise) can release the contact between the clamping pin 300 and the substrate W. However, even if the chuck plate 200 stops rotating, the contact between the clamping pin 300 and the substrate W may not be released due to particles or other contaminants generated during the substrate W cleaning process. In this case, the contact between the clamping pin 300 and the substrate W can be forcibly released by the forced opening unit.

[0059] According to one embodiment, the forced opening unit may include a cover 400 movable in a vertical direction. The cover 400 may be formed to surround the chuck plate 200 from above. The cover 400 may be configured to contact a first portion 310 of a clamping pin 300 in a descending state. For example, the cover 400 may include a step portion 410 for contacting the first portion 310 of the clamping pin 300. During the descent of the cover 400 from above, a portion of the cover 400 (e.g., the step portion 410) may contact the first portion 310 of the clamping pin 300. The clamping pin 300 may contact and rotate with the descending action of the cover 400 to release the contact between the clamping pin 300 and the substrate W. In other words, a portion of the cover 400 (e.g., the step portion 410) may press the first portion 310, causing the clamping pin 300 to rotate (e.g., ...). Figure 5 (Rotation clockwise). Through this structure, the clamping pin 300 contacts the cover 400 when it is in the closed position and can be rotated to the open position.

[0060] According to one embodiment, the forced opening unit may include a jet nozzle 500. The jet nozzle 500 is configured to jet a jet fluid F. The jet nozzle 500 may jet the jet fluid F toward a first portion 310 of the clamping pin 300. For example, the jet fluid F may include deionized water (DIW). The clamping pin 300 may be rotated by the jet pressure applied by the jet fluid F to release the contact between the clamping pin 300 and the substrate W. In other words, the jet fluid F may press against the first portion 310, causing the clamping pin 300 to rotate (e.g., ...). Figure 6 (Clockwise rotation). With this structure, the clamping pin 300, in the closed position, can be rotated to the open position by the ejected fluid F. The ejection nozzle 500 can be configured to adjust the direction of the ejected fluid F.

[0061] As described above, although the embodiments have been illustrated with limited figures, those skilled in the art can make various technical modifications and variations based on the above. For example, even if the described techniques are performed in a different order than the described method, and / or the described system, structure, device, circuit, and other constituent elements are combined or integrated in a different form than the described method, or are replaced or substituted by other constituent elements or equivalents, appropriate results can still be achieved.

[0062] Therefore, other embodiments, other implementations, and matters equivalent to those in the patent claims also fall within the scope of the claims.

Claims

1. A substrate support device, characterized in that, include: A chuck plate that can rotate about a rotation axis perpendicular to the ground; Multiple support pins are connected to the upper part of the chuck plate and contact the lower side of the substrate to support the substrate. as well as Multiple clamping pins are connected to different positions on the chuck plate in the form of being located on the outer side of the substrate edge supported by multiple carrier pins, and are used to clamp the substrate edge. Multiple clamping pins are configured to rotate about a hinge axis between a closed position and an open position. The closed position is the position where the pins contact the edge of the substrate to clamp the substrate, and the open position is the position where the pins do not contact the edge of the substrate.

2. The substrate support device according to claim 1, characterized in that, Multiple clamping pins are configured to be in a closed position by centrifugal force when the chuck plate rotates, and in an open position by restoring force when the chuck plate does not rotate.

3. The substrate support device according to claim 1, characterized in that, The multiple clamping pins include: The first part contains a counterweight; and The second part protrudes along the length direction from one side of the first part and is used to contact the edge of the substrate.

4. The substrate support device according to claim 3, characterized in that, The second part is configured to directly contact the edge of the substrate via its outer surface to support the substrate.

5. The substrate support device according to claim 3, characterized in that, The outer surface of the second part has a groove that matches the edge of the substrate.

6. The substrate support device according to claim 3, characterized in that, The chuck plate includes multiple stops that contact the first part when the multiple clamping pins are in the open position. Multiple stops are configured to limit the rotation range of each of the multiple clamping pins.

7. The substrate support device according to claim 1, characterized in that, The number of multiple support pins is the same as the number of multiple clamping pins. Multiple load-bearing pins are located between the corresponding clamping pins and the rotating shaft among multiple clamping pins.

8. The substrate support device according to claim 7, characterized in that, Multiple support pins are respectively arranged adjacent to their corresponding clamping pins.

9. The substrate support device according to claim 1, characterized in that, The hinge axis is configured to be parallel to the ground.

10. The substrate support device according to claim 1, characterized in that, Multiple clamping pins are configured to be arranged at equal angles along the edge of the substrate, with the rotation axis as the reference.

11. The substrate support device according to claim 3, characterized in that, It also includes a forced opening unit, which is used to rotate the clamping pin to the open position when the clamping pin is in the closed position.

12. The substrate support device according to claim 11, characterized in that, The forced opening unit includes a cover that can move vertically. With the multiple clamping pins in the closed position, the multiple clamping pins contact the cover and rotate to the open position as the cover descends.

13. The substrate support device according to claim 11, characterized in that, The forced opening unit includes a jet nozzle configured to jet fluid from the outside of the chuck plate toward a first portion of each of the plurality of clamping pins. With multiple clamping pins in the closed position, the jet fluid ejected by the jet nozzles through the multiple clamping pins rotates to the open position.

14. The substrate support device according to claim 1, characterized in that, The chuck plate includes: A fluid inlet is formed on top of the chuck plate; and The discharge section is connected to the fluid inlet and is formed inside the chuck plate to discharge the fluid flowing in through the fluid inlet to the outside of the chuck plate.

15. The substrate support device according to claim 14, characterized in that, The fluid inlet is located inside multiple support pins.

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