3-dimensional mounting device and 3-dimensional mounting method

Abstract

3-dimensional mounting device (10) has: worktable (20), which supports the stereoscopic substrate; mounting head (24), which installs component (2) on the surface of stereoscopic substrate; and controller (16). Controller (16) has: allowable angle acquisition unit (36), which acquires allowable angle, which indicates the inclination angle of component (2) that suppresses the position offset after installation to be below a specified amount; mounting sequence decision unit, which decides the mounting sequence of component (2) on multiple mounting areas (50) set on the surface of stereoscopic substrate, so that the component (2) after installation is below the allowable angle; worktable control unit (32), which controls worktable (20) so that multiple mounting areas (50) become horizontal state in sequence according to mounting sequence; and mounting head control unit (33), which controls mounting head (24) so that component (2) is installed in mounting area (50) in horizontal state in sequence according to mounting sequence.

Description

Technical Field

[0001] The technology disclosed in this specification relates to 3D installation devices and 3D installation methods. Background Technology

[0002] In the technical field of 3D mounting devices, 3D mounting devices for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, are known.

[0003] Patent Document 1: International Patent Application Publication No. 2018 / 207313 Summary of the Invention

[0004] When mounting components in mounting areas defined on the surface of a three-dimensional substrate, the tilt angle of the three-dimensional substrate is adjusted so that the mounting areas are horizontal. When mounting a first component in a first mounting area and then mounting a second component in a second mounting area, the first mounting area may be tilted relative to the horizontal plane. If the first mounting area is tilted relative to the horizontal plane, the first component may shift position due to gravity.

[0005] The purpose of the technology disclosed in this specification is to suppress component positional displacement.

[0006] This specification discloses a 3D mounting apparatus comprising: a worktable supporting a solid substrate; a mounting head mounting components on the surface of the solid substrate; and a controller. The controller comprises: a tolerance angle acquisition unit acquiring a tolerance angle representing the maximum value of the tilt angle of a component that suppresses post-mounted positional offset to below a predetermined amount; a mounting sequence determination unit determining the mounting sequence of components on multiple mounting areas set on the surface of the solid substrate, such that the mounted components are positioned below the tolerance angle; a worktable control unit controlling the worktable to sequentially align the multiple mounting areas in a horizontal state according to the mounting sequence; and a mounting head control unit controlling the mounting head to sequentially mount components in the horizontal mounting areas according to the mounting sequence.

[0007] In addition, the aforementioned 3D mounting device also has a coating head that applies adhesive to the surface of the three-dimensional substrate. The controller also has a fixing control unit that controls the coating head so that, after the first component is installed in the first mounting area and the first component is not below the allowable angle when the second component is installed, the first component and the first mounting area are fixed by adhesive after the first component is installed and before the three-dimensional substrate is tilted.

[0008] The effects of the invention

[0009] According to the technology disclosed in this specification, the positional displacement of the component is suppressed. Attached Figure Description

[0010] Figure 1 This is a perspective view showing the substrate and components involved in the first embodiment.

[0011] Figure 2 This is a perspective view of the tray that holds the substrate according to the first embodiment.

[0012] Figure 3 This is an exploded perspective view showing the substrate and tray according to the first embodiment.

[0013] Figure 4 This is a schematic side view of the 3D mounting device according to the first embodiment.

[0014] Figure 5 This is a schematic top view illustrating the 3D mounting device according to the first embodiment.

[0015] Figure 6 This is a perspective view showing the tray and workbench according to the first embodiment.

[0016] Figure 7 This is an exploded perspective view showing the tray and workbench according to the first embodiment.

[0017] Figure 8 This is a schematic diagram illustrating the mounting head according to the first embodiment.

[0018] Figure 9 This is a hardware structure diagram of the controller according to the first embodiment.

[0019] Figure 10 This is a functional block diagram illustrating the 3D mounting device according to the first embodiment.

[0020] Figure 11 This is a schematic top view of the substrate according to the first embodiment.

[0021] Figure 12 This diagram illustrates the operation of the workbench and mounting head according to the first embodiment.

[0022] Figure 13 This diagram illustrates the operation of the workbench and mounting head according to the first embodiment.

[0023] Figure 14 This diagram illustrates the operation of the laser head according to the first embodiment.

[0024] Figure 15 This diagram illustrates the positional offset of the component involved in the first embodiment.

[0025] Figure 16This diagram illustrates the installation sequence of the components involved in the first embodiment.

[0026] Figure 17 This diagram illustrates the installation sequence of the components involved in the first embodiment.

[0027] Figure 18 This diagram illustrates the component in the first embodiment that cannot eliminate positional offset.

[0028] Figure 19 This diagram illustrates the component in the first embodiment that cannot eliminate positional offset.

[0029] Figure 20 This diagram illustrates the operation of the 3D mounting device according to the first embodiment when there are components whose positional offset cannot be eliminated.

[0030] Figure 21 This diagram illustrates the operation of the 3D mounting device according to the first embodiment when there are components whose positional offset cannot be eliminated.

[0031] Figure 22 This is a flowchart illustrating the method for determining the installation order of the components involved in the first embodiment.

[0032] Figure 23 This is a flowchart illustrating the method for installing the components according to the first embodiment.

[0033] Figure 24 This is a schematic side view of the 3D mounting device according to the second embodiment.

[0034] Figure 25 This is a functional block diagram illustrating the 3D mounting device involved in the second embodiment.

[0035] Figure 26 This diagram illustrates the operation of the application head according to the second embodiment.

[0036] Figure 27 This diagram illustrates the operation of the 3D mounting device according to the second embodiment when there are components whose positional offset cannot be eliminated.

[0037] Figure 28 This diagram illustrates the operation of the 3D mounting device according to the second embodiment when there are components whose positional offset cannot be eliminated.

[0038] Figure 29 This is a flowchart illustrating the method for installing the components involved in the second embodiment.

[0039] Figure 30This is a schematic diagram illustrating the allowable angle storage unit involved in the implementation method.

[0040] Figure 31 This is a diagram schematically illustrating the controller involved in the implementation method. Detailed Implementation

[0041] Below, refer to the appendix. Figure 1 The implementation method will be described below. In this implementation, an XYZ orthogonal coordinate system is defined, and the positional relationships of each part will be described with reference to this XYZ orthogonal coordinate system. The direction of the X-axis, which is parallel to the defined plane, is defined as the X-axis direction. The direction of the Y-axis, which is parallel to the defined plane and orthogonal to the X-axis, is defined as the Y-axis direction. The direction of the Z-axis, which is parallel to the defined plane, is defined as the Z-axis direction. The direction of rotation or tilting centered on the X-axis direction is defined as the θX direction. The direction of rotation or tilting centered on the Y-axis direction is defined as the θY direction. The direction of rotation or tilting centered on the Z-axis direction is defined as the θZ direction. In this implementation, the defined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. In addition, in this implementation, the defined plane including the X-axis and Y-axis is appropriately referred to as the XY plane.

[0042] [First Embodiment]

[0043] The first embodiment will be described.

[0044] <Substrate>

[0045] Figure 1 This is a perspective view showing the substrate 1 and component 2 according to the embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may also include corners. Protrusions may also be provided on the surface of the substrate 1.

[0046] A circuit is disposed on the surface of substrate 1. In this embodiment, substrate 1 is formed by in-mold forming technology. Substrate 1 includes: a substrate 1A having a curved surface; and a thin film 1B bonded to the surface of substrate 1A. Thin film 1B is flexible. Thin film 1B is a flexible film. Thin film 1B contains the circuit. The surface of substrate 1 includes the surface of thin film 1B.

[0047] Component 2 includes electronic components. Component 2 can be a leaded electronic component with leads protruding from the body. Component 2 can also be a chip-type electronic component without leads. By mounting component 2 on the surface of substrate 1, an electronic device is manufactured.

[0048] <Tray>

[0049] Figure 2 This is a perspective view showing the tray 3 that holds the substrate 1 according to the embodiment. Figure 3 This is an exploded perspective view showing the substrate 1 and tray 3 according to the embodiment. The tray 3 holds the substrate 1. In the embodiment, the substrate 1 is processed in a state held by the tray 3. The tray 3 has: a support member 4 that supports the substrate 1; and a clamping mechanism 5 that fixes the substrate 1.

[0050] The support member 4 includes: a base portion 4A that supports the substrate 1 from the -Z side; a protective portion 4B that is respectively disposed on the +Y side and the -Y side of the base portion 4A; and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side.

[0051] The base portion 4A is a plate-shaped part with multiple openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0052] The protective part 4B is longer in the X-axis direction. A pair of protective parts 4B are provided. The pair of protective parts 4B are separated from each other in the Y-axis direction. One protective part 4B protrudes from the end on the +Y side of the upper surface of the base part 4A toward the +Z side. The other protective part 4B protrudes from the end on the -Y side of the upper surface of the base part 4A toward the +Z side.

[0053] Multiple pins 4C each protrude from the upper surface of the base portion 4A toward the +Z side. A portion of the pins 4C are disposed on the +Y side relative to the center of the base portion 4A. A portion of the pins 4C are disposed on the -Y side relative to the center of the base portion 4A. The multiple pins 4C disposed on the +Y side relative to the center of the base portion 4A support the +Y side end of the substrate 1. The multiple pins 4C disposed on the -Y side relative to the center of the base portion 4A support the -Y side end of the substrate 1.

[0054] A clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes: a pair of support portions 5A that support the -X side end of the substrate 1; and a movable portion 5B that supports the +X side end of the substrate 1. The movable portion 5B is located on the upper surface of the base portion 4A and is movable in the X-axis direction. With the substrate 1 positioned between the support portions 5A and the movable portion 5B, the movable portion 5B moves in the -X direction, thereby clamping the substrate 1 between the support portions 5A and the movable portion 5B. The substrate 1 is clamped by the support portions 5A and the movable portion 5B, thereby being fixed to the tray 3.

[0055] <3D Installation Device>

[0056] Figure 4 This is a schematic side view of the 3D mounting device 10 according to the embodiment. Figure 5This is a schematic top view of the 3D mounting device 10 according to the embodiment. The 3D mounting device 10 mounts the component 2 on the substrate 1.

[0057] The 3D mounting device 10 includes a base component 18, a conveying device 19, a worktable 20, a worktable moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a mounting head moving device 27, a dispensing device 11, a laser head 12, a chamber 29, and a controller 16.

[0058] The base component 18 supports the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, the dispensing device 11, the laser head 12, and the mounting head moving device 27.

[0059] The conveying device 19 transports the tray 3 holding the substrate 1 in the X-axis direction. The conveying device 19 transports the tray 3 to the processing position of the 3D mounting device 10. The processing position is defined in the transport path of the conveying device 19.

[0060] The conveying device 19 includes: a conveyor belt 19A that conveys the pallet 3 in the X-axis direction; and a guide member 19B that guides the pallet 3.

[0061] Guide member 19B is longer in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is positioned on the +Y side relative to tray 3. The other guide member 19B is positioned on the -Y side relative to tray 3.

[0062] The conveyor belt 19A is looped. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported by guide members 19B via drive pulleys and driven pulleys. The conveyor belts 19A are suspended on the drive pulleys and driven pulleys. One conveyor belt 19A is supported by one guide member 19B. The other conveyor belt 19A is supported by another guide member 19B.

[0063] In a pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the lower surface of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the lower surface of the pallet 3. A drive motor (not shown) rotates the drive pulley, thereby conveying the pallet 3 in the X-axis direction.

[0064] By means of an actuator (not shown), one guide member 19B can move relative to another guide member 19B in the Y-axis direction. By separating one guide member 19B and the other guide member 19B in the Y-axis direction, the support of the conveyor belt 19A to the pallet 3 is released.

[0065] Figure 6This is a perspective view showing the tray 3 and worktable 20 involved in the embodiment. Figure 7 This is an exploded perspective view showing the tray 3 and worktable 20 involved in the embodiment.

[0066] The worktable 20 supports the substrate 1 via the tray 3. The worktable 20 supports the tray 3, which is being transported to the processing position, from the -Z side. Two positioning members 20A are provided on the upper surface of the worktable 20. The positioning members 20A are inserted into holes 4D in the tray 3. The positioning members 20A are inserted into the holes 4D from the -Z side of the tray 3, thereby positioning the worktable 20 and the tray 3. A hook is provided at the upper end of the positioning member 20A. The hook hooks onto the tray 3. The hook contains a ball that moves under air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the tray 3, the ball hooks onto the tray 3, thereby securing the worktable 20 and the tray 3.

[0067] The table moving device 21 moves the table 20. In this embodiment, the table moving device 21 moves the table 20 in the Y-axis direction, Z-axis direction, θX direction, and θY direction, respectively. The table moving device 21 includes: a Y-axis motor that generates power to move the table 20 in the Y-axis direction; a Z-axis motor that generates power to move the table 20 in the Z-axis direction; an θX motor that generates power to rotate the table 20 in the θX direction; and an θY motor that generates power to rotate the table 20 in the θY direction.

[0068] After the pallet 3 is conveyed to the processing position by the conveyor 19, the guide member 19B on the +Y side moves in the +Y direction to separate from the other guide member 19B, and the worktable 20 moves in the +Z direction by the worktable moving device 21. The guide member 19B on the +Y side moves in the Y-axis direction to separate from the other guide member 19B, thereby releasing the support of the conveyor belt 19A on the pallet 3. With the support of the conveyor belt 19A on the pallet 3 released, the worktable 20 moves in the +Z direction, thereby transferring the pallet 3 from the conveyor 19 to the worktable 20. The worktable moving device 21 moves the worktable 20 in the +Y direction to the center of the two guide members 19B while the pallet 3 is supported by the worktable 20, thus enabling the worktable 20 to move in the Z-axis direction, the θX direction, and the θY direction respectively.

[0069] When pallet 3 is transferred from worktable 20 to conveyor 19, worktable 20 moves in the -Y direction until one side of pallet 3 is on conveyor belt 19A, and guide member 19B on the +Y side moves in the -Y direction until the opposite side of pallet 3 is on conveyor belt 19A. After the hook at the upper end of positioning member 20A is released, worktable 20 is moved in the -Z direction by worktable moving device 21. This releases the support of worktable 20 on pallet 3, and pallet 3 is then supported by conveyor belt 19A.

[0070] The component supply device 22 supplies components 2. The component supply device 22 includes multiple belt feeders. The belt feeders hold multiple components 2. The component supply device 22 supplies at least one of the multiple components 2 to the supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Alternatively, the component supply device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0071] Mounting head 24 mounts component 2 onto substrate 1. Mounting head 24 supports multiple suction nozzles 23. Mounting head 24 holds and mounts component 2 supplied from component supply device 22 onto substrate 1 via suction nozzles 23. Mounting head 24 is movable between a supply position and a processing position, supplying component 2 from component supply device 22 to the supply position and positioning substrate 1 at the processing position. Mounting head 24 holds component 2 supplied to the supply position via suction nozzles 23, and after moving to the processing position, mounts it onto the surface of substrate 1 positioned at the processing position.

[0072] The mounting head moving device 27 moves the mounting head 24. In this embodiment, the mounting head moving device 27 moves the mounting head 24 in both the X-axis and Y-axis directions. The mounting head moving device 27 includes an X-axis moving device 27X, which moves the mounting head 24 in the X-axis direction; and a Y-axis moving device 27Y, which moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The X-axis moving device 27X moves in the Y-axis direction by the operation of the Y-axis moving device 27Y, thereby moving the mounting head 24 in the Y-axis direction.

[0073] Figure 8 This is a schematic diagram illustrating the mounting head 24 according to the embodiment. (See diagram below.) Figure 8As shown, the mounting head 24 has multiple suction nozzles 23. The suction nozzles 23 detachably hold the component 2. Each suction nozzle 23 is a suction nozzle for adsorbing and holding the component 2. An opening is provided at the lower end of the suction nozzle 23. The opening of the suction nozzle 23 is connected to a vacuum system. When the lower end of the suction nozzle 23 is in contact with the component 2, a suction action is performed from the opening at the lower end of the suction nozzle 23, thereby adsorbing and holding the component 2 at the lower end of the suction nozzle 23. By releasing the suction action from the opening, the component 2 is released from the suction nozzle 23. Alternatively, the suction nozzle 23 can also be a clamping suction nozzle that holds the component 2 in place.

[0074] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. Multiple shafts 23A are provided. Multiple nozzles 23 are connected to multiple shafts 23A respectively. Multiple nozzle moving devices 28 are provided. Multiple nozzle moving devices 28 are connected to multiple shafts 23A respectively. The nozzle 23 is supported by the mounting head 24 via the shafts 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shafts 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0075] The suction nozzle 23 can move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively via the mounting head moving device 27 and the suction nozzle moving device 28. By moving the suction nozzle 23, the component 2 held by the suction nozzle 23 can also move in the X-axis, Y-axis, Z-axis and θZ-axis directions respectively.

[0076] Camera 25 takes an image of substrate 1. In this embodiment, camera 25 takes an image of the surface of substrate 1 from the +Z side. Camera 25 is mounted on mounting head 24. Camera 25 moves together with mounting head 24 in the X-axis and Y-axis directions. Camera 25 can take an image of positioning marks provided on the surface of substrate 1. Camera 25 can also take an image of component 2 after it is mounted on substrate 1.

[0077] The dispensing applicator 11 applies solder paste to the substrate 1. The dispensing applicator 11 moves along the X-axis, Y-axis, and Z-axis directions on the +Z side relative to the delivery device 19. The dispensing applicator 11 and the mounting head 24 can move independently. After the solder paste is applied to the surface of the substrate 1 by the dispensing applicator 11, the mounting head 24 mounts the component 2 onto the substrate 1. The mounting head 24 mounts the component 2 onto the substrate 1 coated with solder paste.

[0078] The laser head 12 irradiates the solder paste with a laser, causing it to melt. After the component 2 is mounted onto the substrate 1 via the solder paste, the laser head 12 irradiates the solder paste with a laser, causing it to melt. The laser head 12 moves along the X-axis, Y-axis, and Z-axis directions on the +Z side relative to the delivery device 19. The laser head 12, the dispensing device 11, and the mounting head 24 can move independently.

[0079] The chamber 29 has an internal space that accommodates the base component 18, the conveying device 19, the worktable 20, the worktable moving device 21, the component supply device 22, the mounting head 24, the mounting head moving device 27, the nozzle moving device 28, the dispensing device 11, and the laser head 12.

[0080] <Controller>

[0081] Figure 9 This is a hardware structure diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has: a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), a storage device 16C, and an interface 16D including input / output circuitry. The functions of the controller 16 are stored as a computer program in the storage device 16C. The processor 16A reads the computer program from the storage device 16C and expands it to the main memory 16B, and executes the prescribed processing according to the computer program. In addition, the computer program can also be transmitted to the controller 16 via a network.

[0082] Figure 10 This is a functional block diagram illustrating the 3D mounting device 10 involved in the implementation method. For example... Figure 10 As shown, the controller 16 has an allowable angle storage unit 30, an installation sequence storage unit 40, a dispensing device control unit 31, a worktable control unit 32, an installation head control unit 33, a laser control unit 34, a position offset calculation unit 35, an allowable angle acquisition unit 36, and an installation sequence determination unit 37.

[0083] The dispensing control unit 31 controls the dispensing device 11. The dispensing control unit 31 controls the dispensing device 11 in a manner that the paste solder 60 is applied to the surface of the substrate 1.

[0084] Figure 11 This is a schematic top view of the substrate 1 involved in the embodiment. For example... Figure 11As shown, multiple mounting areas 50 are formed on the surface of the substrate 1. Each mounting area 50 is a region for mounting the component 2. The component 2 is mounted in each of the multiple mounting areas 50. The dispensing control unit 31 applies solder paste 60 to each of the multiple mounting areas 50.

[0085] The worktable control unit 32 controls the worktable 20. The mounting head control unit 33 controls the mounting head 24 in such a way that the component 2 is mounted on the base plate 1 supported by the worktable 20.

[0086] Figure 12 and Figure 13 Each figure illustrates the operation of the worktable 20 and mounting head 24 according to the embodiment. Multiple mounting areas 50 are provided on the surface of the substrate 1. Figure 12 and Figure 13 In the example shown, the mounting regions 50 defined on the surface of the substrate 1 include mounting regions 50A, 50B, and 50C. Solder paste 60 is applied to each of the mounting regions 50. The component 2 includes component 2A mounted in mounting region 50A, component 2B mounted in mounting region 50B, and component 2C mounted in mounting region 50C.

[0087] When mounting component 2 onto the mounting area 50 defined on the surface of substrate 1, the tilt angle of substrate 1 is adjusted so that the mounting area 50 becomes horizontal. The worktable control unit 32 controls the worktable 20 so that the multiple mounting areas 50 sequentially become horizontal. The mounting head control unit 33 controls the mounting head 24 so that component 2 is sequentially mounted in the horizontal mounting areas 50.

[0088] like Figure 12 As shown, when component 2A is being installed into mounting area 50A, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50A is in a horizontal state. The mounting head control unit 33 controls the mounting head 24 to install component 2A in the horizontal mounting area 50A. Component 2A is installed into mounting area 50A via solder paste 60 applied to mounting area 50A.

[0089] like Figure 13 As shown, after component 2A is installed in mounting area 50A, component 2B is installed in mounting area 50B. When component 2B is installed in mounting area 50B, the worktable control unit 32 controls the worktable 20 to make mounting area 50B horizontal. The mounting head control unit 33 controls the mounting head 24 to install component 2B in the horizontal mounting area 50B. Component 2B is installed in mounting area 50B via solder paste 60 applied to mounting area 50B.

[0090] After component 2B is installed in mounting area 50B, component 2C is installed in mounting area 50C. When component 2C is installed in mounting area 50C, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50C is in a horizontal state. The mounting head control unit 33 controls the mounting head 24 to install component 2C in the horizontal mounting area 50C. Component 2C is installed in mounting area 50C via solder paste 60 applied to mounting area 50C.

[0091] The laser control unit 34 controls the laser head 12. After the component 2 is mounted in the mounting area 50 via the solder paste 60, the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 with laser light. By irradiating the solder paste 60 with laser light, the solder paste 60 is melted. The molten solder paste 60 cools, thereby soldering the component 2 to the substrate 1.

[0092] Figure 14 This diagram illustrates the operation of the laser head 12 according to the embodiment. Figure 14 As shown, the laser head 12 irradiates the solder paste 60 with a laser after the component 2 is mounted onto the mounting area 50. While irradiating the solder paste 60 in the mounting area 50 where the component 2 is mounted, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 becomes horizontal. The worktable control unit 32 controls the worktable 20 so that the multiple mounting areas 50 are sequentially made horizontal. The laser control unit 34 controls the laser head 12 so that the solder paste 60 in the horizontally positioned mounting areas 50 is sequentially irradiated with a laser.

[0093] like Figure 14 As shown, when the solder paste 60 of the mounting area 50A, where component 2A is mounted, is irradiated with a laser, the worktable control unit 32 controls the worktable 20 to make the mounting area 50A horizontal. The laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of the horizontally positioned mounting area 50A with a laser. The solder paste 60 of the mounting area 50A melts under laser irradiation. The molten solder paste 60 of the mounting area 50A is cooled, thereby soldering component 2A to the mounting area 50A.

[0094] When the solder paste 60 of the mounting area 50B, where component 2B is mounted, is irradiated with a laser, the worktable control unit 32 controls the worktable 20 to make the mounting area 50B horizontal. The laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of the horizontally positioned mounting area 50B with a laser. The solder paste 60 of the mounting area 50B melts under laser irradiation. The molten solder paste 60 of the mounting area 50B is cooled, thereby soldering component 2B to the mounting area 50B.

[0095] When the solder paste 60 in the mounting area 50C, where component 2C is mounted, is irradiated with a laser, the stage control unit 32 controls the stage 20 to ensure that the mounting area 50C is horizontal. The laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 in the horizontally positioned mounting area 50C with a laser. The solder paste 60 in the mounting area 50C melts under laser irradiation. The molten solder paste 60 in the mounting area 50C is cooled, thereby soldering component 2C to the mounting area 50C.

[0096] <Permissible Angle>

[0097] The position offset calculation unit 35 calculates the position offset ΔD of the component 2 after it is installed in the mounting area 50. The camera 25 takes an image of the component 2 after it is installed on the substrate 1. Based on the image data of the installed component 2 taken by the camera 25, the position offset calculation unit 35 calculates the position offset ΔD of the installed component 2.

[0098] Figure 15 This diagram illustrates the positional offset of component 2 according to the embodiment. After component 2 is mounted in mounting region 50 via solder paste 60, component 2 is not soldered to mounting region 50 before laser irradiation of solder paste 60. Therefore, as... Figure 15 As shown, when the mounting area 50 is tilted relative to the horizontal plane, the component 2 may shift in position relative to the mounting area 50 due to gravity.

[0099] For example, Figure 13 As shown, after component 2A is installed in mounting area 50A, when component 2B is installed into mounting area 50B, mounting area 50A is tilted relative to the horizontal plane. With mounting area 50A tilted relative to the horizontal plane, component 2A may shift position due to gravity.

[0100] When calculating the position offset ΔD of component 2, after component 2 is mounted in the mounting area 50 via solder paste 60, and before laser irradiation of the solder paste 60, the camera 25 takes an image of component 2. The position offset calculation unit 35 can calculate the position offset ΔD of component 2 based on the image data of component 2 taken by the camera 25.

[0101] The allowable angle acquisition unit 36 ​​acquires an allowable angle θ, which represents the maximum value of the tilt angle of component 2 when the positional offset ΔD of the installed component 2 is suppressed to below a predetermined amount. The tilt angle of component 2 is equal to the tilt angle of the mounting area 50 on which component 2 is mounted. Both the tilt angle of component 2 and the tilt angle of the mounting area 50 are tilt angles relative to the horizontal plane. The predetermined amount is a value close to zero. In this embodiment, the allowable angle θ is the maximum value of the tilt angle at which component 2 does not substantially experience positional offset.

[0102] like Figure 15 As shown, when the position offset calculation unit 35 calculates the position offset ΔD, the worktable control unit 32 tilts the mounting area 50 to an arbitrary tilt angle. The worktable control unit 32 gradually increases the tilt angle of the mounting area 50 relative to the horizontal plane from 0 degrees. The camera 25 takes pictures of the component 2 mounted in the mounting area 50 where the tilt angle gradually increases. Based on the image data of the component 2 mounted in the mounting area 50 where the tilt angle gradually increases, the position offset calculation unit 35 can calculate the maximum value of the tilt angle of the component 2 where the position offset ΔD is below a predetermined value. In this embodiment, the position offset calculation unit 35 can calculate the maximum value of the tilt angle of the component 2 where the component 2 has not substantially undergone position offset, based on the image data of the component 2.

[0103] The allowable angle acquisition unit 36 ​​acquires the maximum value of the tilt angle of the component 2 that is below a predetermined amount, calculated by the position offset calculation unit 35, for the component 2. The position offset calculation unit 35 calculates the allowable angle θ for each of the multiple components 2 mounted to the substrate 1. The allowable angle acquisition unit 36 ​​acquires the allowable angle θ for each of the multiple components 2 mounted to the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 ​​is stored in the allowable angle storage unit 30.

[0104] <Installation Order>

[0105] The mounting sequence determination unit 37 determines the mounting sequence of component 2 on multiple mounting areas 50 set on the surface of the substrate 1, so that the tilt angle of component 2 after mounting on the substrate 1 is less than or equal to an allowable angle θ. The worktable control unit 32 controls the worktable 20 so that the multiple mounting areas 50 are sequentially horizontal according to the mounting sequence determined by the mounting sequence determination unit 37. The mounting head control unit 33 controls the mounting head 24 so that component 2 is sequentially mounted on the horizontal mounting areas 50 according to the mounting sequence determined by the mounting sequence determination unit 37.

[0106] Figure 16 and Figure 17 Each diagram illustrates the installation sequence of component 2 involved in the implementation method. Figure 16 and Figure 17 In the example shown, the allowable angle θa of component 2A is less than the allowable angle θb of component 2B. Figure 16 This illustrates an example of installing component 2B into mounting area 50B after component 2A has been installed into mounting area 50A. Figure 17 This illustrates an example of installing component 2A into mounting area 50A after component 2B has been installed into mounting area 50B.

[0107] like Figure 16 As shown in the figure marked (A), when 2A is installed into the installation area 50A, the workbench control unit 32 controls the workbench 20 to make the installation area 50A horizontal. Figure 16 As shown in Figure (B), when component 2B is installed into mounting area 50B after component 2A is installed into mounting area 50A, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50B is horizontal. Since component 2A has a small allowable angle θa, it is highly likely that component 2A will shift position due to gravity when mounting area 50A is tilted relative to the horizontal plane.

[0108] like Figure 17 As shown in the figure marked (A), when component 2B is installed into mounting area 50B, the worktable control unit 32 controls the worktable 20 to make mounting area 50B horizontal. Figure 17 As shown in the figure marked (B), when component 2A is installed into mounting area 50A after component 2B is installed in mounting area 50B, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50A is horizontal. Component 2B has a large allowable angle θb, therefore, even if mounting area 50B is tilted relative to the horizontal plane, the possibility of component 2B shifting position is low.

[0109] like Figure 17 As shown, by installing component 2B with a larger allowable angle θb first, and then installing component 2A with a smaller allowable angle θa, the positional offset of components 2A and 2B is suppressed. The installation sequence determination unit 37 determines the installation order of components 2 in the multiple installation areas 50 by installing component 2 with a larger allowable angle θb first, and then installing component 2 with a smaller allowable angle θa. The installation order determined by the installation sequence determination unit 37 is stored in the installation sequence storage unit 40.

[0110] The installation order of component 2 determined by the installation order determination unit 37 is stored in the installation order storage unit 40. By installing the components in this order, positional deviation is suppressed.

[0111] <Handling of components whose positional misalignment cannot be eliminated>

[0112] Due to the weight and size of component 2, and the shape of the substrate 1, even if the installation sequence is adjusted, there may still be components 2 that cannot be positioned below the allowable angle θ when installing them. That is, even if the installation sequence is adjusted, there may still be components 2 whose positional misalignment cannot be eliminated.

[0113] In the following description, the component 2 whose positional offset can be eliminated by adjusting the installation sequence is appropriately referred to as an allowable component, and the component 2 whose positional offset cannot be eliminated even if the installation sequence is adjusted is appropriately referred to as a non-allowable component.

[0114] Figure 18 and Figure 19 Each figure illustrates the component 2, whose positional offset cannot be eliminated according to the embodiment. Figure 18 and Figure 19 In the example shown, the mounting regions 50 defined on the surface of substrate 1 include mounting regions 50D, 50E, and 50F. Solder paste 60 is applied to each of the mounting regions 50. Component 2 includes component 2D mounted to mounting region 50D, component 2E mounted to mounting region 50E, and component 2F mounted to mounting region 50F. Component 2F has a large allowable angle θf. Component 2D has a small allowable angle θd, and component 2E has a small allowable angle θe. Component 2F is a permissible component. Components 2D and 2E are each non-permissible components. Figure 18 This illustrates an example of mounting component 2E to mounting area 50E after component 2D is mounted to mounting area 50D. Figure 19 This illustrates an example of mounting component 2D to mounting region 50D after component 2E has been mounted to mounting region 50E. Component 2F has already been mounted to mounting region 50F.

[0115] like Figure 18As shown in the figure marked (A), when component 2D is installed into mounting area 50D, the worktable control unit 32 controls the worktable 20 to make mounting area 50D horizontal. Figure 18 As shown in Figure (B), when component 2E is installed into mounting area 50E after component 2D is installed into mounting area 50D, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50E is horizontal. Since component 2D has a small allowable angle θd, it is highly likely that component 2D will shift position due to gravity when mounting area 50D is tilted relative to the horizontal plane.

[0116] like Figure 19 As shown in the figure marked (A), when component 2E is installed into mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50E horizontal. Figure 19 As shown in Figure (B), when component 2D is installed into mounting area 50D after component 2E is installed in mounting area 50E, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50D is horizontal. Since component 2E has a small allowable angle θe, when mounting area 50E is tilted relative to the horizontal plane, component 2E is highly likely to shift position due to gravity.

[0117] That is, if component 2D is installed in mounting area 50D and then component 2E is installed in mounting area 50E, component 2D may not be below the allowable angle θd when component 2E is installed, resulting in a positional shift of component 2D. Even if the installation order is reversed, if component 2E is installed in mounting area 50E and then component 2D is installed in mounting area 50D, it is still possible that component 2E may not be below the allowable angle θe when component 2D is installed.

[0118] Existence occurs as Figure 18 and Figure 19 In the case described, where component 2D is installed in mounting area 50D, and component 2D does not fall below the allowable angle θd when component 2E is installed, even if the installation order is reversed, component 2E does not fall below the allowable angle θe when component 2D is installed after component 2E is installed in mounting area 50E. In this case, the laser control unit 34 irradiates the solder paste 60 in mounting area 50D with a laser after component 2D is installed and before the substrate 1 is tilted, thus fixing component 2D by soldering before the tilting that occurs with the installation of component 2E. In the case of the reversed installation order, the laser head 12 is controlled so that the solder paste 60 in mounting area 50E is irradiated with a laser after component 2E is installed and before the substrate 1 is tilted.

[0119] Figure 20 and Figure 21 Each figure illustrates the operation of the 3D mounting device 10 when there is a component 2 whose positional offset cannot be eliminated, according to the embodiment.

[0120] like Figure 20 As shown in the figure marked (A), when component 2D is installed into mounting area 50D, the worktable control unit 32 controls the worktable 20 to make mounting area 50D horizontal. Figure 20 As shown in Figure (B), after component 2D is mounted in mounting region 50D, while maintaining the horizontal state of mounting region 50D, a laser is applied to the solder paste 60 in mounting region 50D. The solder paste 60, molten by the laser, cools, thereby soldering component 2D to mounting region 50D.

[0121] like Figure 21 As shown in Figure (A), after component 2D is welded to mounting area 50D, component 2E is installed onto mounting area 50E. When component 2E is installed onto mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50E horizontal. With mounting area 50E horizontal, mounting area 50D is tilted relative to the horizontal plane. Since component 2D is welded to mounting area 50D, even if the tilt angle of mounting area 50D exceeds the allowable angle θd, positional displacement of component 2D is suppressed. Figure 21 As shown in Figure (B), after component 2E is mounted in mounting area 50E, while maintaining mounting area 50E in a horizontal state, a laser is used to irradiate the solder paste 60 in mounting area 50E. The solder paste 60, melted by the laser, cools, thereby soldering component 2E to mounting area 50E. Then, permissible components are sequentially soldered using the laser.

[0122] <Methods for determining the installation order>

[0123] Figure 22 This is a flowchart illustrating the method for determining the installation order of component 2 according to the embodiment. When determining the installation order, a test substrate 1 and test component 2 are used.

[0124] The worktable control unit 32 controls the worktable 20 so that the multiple mounting areas 50 are sequentially made horizontal. The dispensing device control unit 31 controls the dispensing device 11 so that paste solder 60 is applied to the multiple mounting areas 50 of the substrate 1 respectively (step SA1).

[0125] The mounting head control unit 33 controls the mounting head 24 to install the component 2 in the horizontal mounting area 50 (step SA2).

[0126] The position offset calculation unit 35 causes the camera 25 to take a picture of the component 2 in the mounting area 50 (step SA3).

[0127] The position offset calculation unit 35 calculates the position offset ΔD of each component 2 based on the image data of component 2 captured in step SA3 (step SA4). It then determines whether the position offset ΔD calculated by the position offset calculation unit 35 is below a predetermined amount (step SA5).

[0128] If it is determined in step SA5 that the position offset ΔD is below a specified amount (step SA5: Yes), the worktable control unit 32 increases the tilt angle of the mounting area 50 and repeats the shooting and position offset ΔD calculation performed by the position offset calculation unit 35 (step SA6).

[0129] If it is determined in step SA5 that the position offset ΔD exceeds the specified amount (step SA5: No), the tilt angle before the position offset ΔD exceeds the specified amount is stored in the allowable angle storage unit 30 as the allowable angle θ of the tilt angle of the component 2 (step SA7).

[0130] This operation is performed for each component 2 mounted on the substrate 1. If it is the same component 2, the allowable angle θ stored in the allowable angle storage unit 30 can also be applied to other substrates 1.

[0131] The installation sequence determination unit 37 determines the installation sequence of the components 2 in the multiple installation areas 50 based on the allowable angle θ of each component 2.

[0132] The installation sequence determination unit 37 makes a temporary determination of the installation sequence based on the optimal installation sequence when there is an existing planar substrate (step SA8).

[0133] When installing in the order of installation, check whether each component 2 is a permissible component or a non-permissible component (step SA9).

[0134] If a component becomes a non-permitted component, the installation sequence is moved backward, and each component 2 is checked to see if it becomes a permitted or non-permitted component (step SA10).

[0135] Repeat the reordering and checking of the installation sequence until the identification of permissible and non-permissible parts no longer changes (step SA11).

[0136] The installation sequence and the identification of permitted and non-permitted components in that sequence are stored in the installation sequence storage unit 40 (step SA12).

[0137] By processing in the manner described above, the component 2, which has a small allowable angle θ and is prone to positional displacement, is installed later in the installation sequence and is less affected by the tilting of the substrate 1 during the installation of other components 2. Therefore, the number of permissible components increases and the number of non-permissible components decreases, thereby enabling continuous installation operations and shortening the installation cycle.

[0138] <Installation Method>

[0139] Figure 23 This is a flowchart illustrating the installation method of component 2 according to the embodiment.

[0140] The dispensing control unit 31 controls the dispensing device 11 to apply paste solder 60 to multiple mounting areas 50 of the substrate 1 respectively (step SB1).

[0141] The workbench control unit 32 controls the workbench 20 so that multiple installation areas 50 are sequentially horizontal according to the installation order stored in the installation order storage unit 40. The installation head control unit 33 controls the installation head 24 so that the components 2 are sequentially installed in the horizontal installation areas 50 according to the installation order stored in the installation order storage unit 40, and the permissible components are installed (step SB2).

[0142] The mounting head control unit 33 determines whether there are any unacceptable parts (step SB3).

[0143] If it is determined in step SB3 that an unacceptable component exists (step SB3: Yes), the mounting head control unit 33 installs the unacceptable component into the mounting area 50 (step SB4).

[0144] For reference Figure 20 and Figure 21 As explained, after the non-permitted component is installed in the mounting area 50, while maintaining the horizontal state of the mounting area 50, the laser control unit 34 controls the laser head 12 to irradiate the paste solder 60 of the non-permitted component with laser (step SB5).

[0145] The mounting head control unit 33 determines whether the installation of all non-permitted components is complete (step SB6).

[0146] If the installation of the non-permitted component is not completed in step SB6 (step SB6: No), return to the processing of step SB4.

[0147] If the installation of a non-permissible component is determined to be completed in step SB6 (step SB6: Yes), the laser control unit 34 controls the laser head 12 to irradiate the paste solder 60 of the permissible component with laser light (step SB7).

[0148] The laser control unit 34 controls the laser head 12 to sequentially irradiate the solder paste 60 of each of the multiple permissible components with laser. Similarly, if it is determined in step SB3 that there are no non-permissible components (step SB3: No), the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of each of the multiple permissible components with laser (step SB7).

[0149] The welding sequence performed by laser at this time is set to be the reverse of the component installation sequence, thereby preventing the permissible tilt of the component before welding from exceeding the angle during installation.

[0150] <Effect>

[0151] As explained above, according to the embodiment, the installation order of component 2 is determined based on the allowable angle θ of component 2. Since the installation order of component 2 is determined in such a way that the installed component 2 is below the allowable angle θ, positional deviation of component 2 is suppressed.

[0152] The 3D mounting device 10 is designed to achieve optimal production cycle time and improve productivity when continuously adsorbing and loading the component 2. According to the present invention, by identifying permissible and non-permissible components, permissible components can be mounted by continuously adsorbing and loading them as in the past. In 3D mounting where the substrate 1 is tilted while loading, the reduction in production cycle time can also be minimized.

[0153] [Second Embodiment]

[0154] The second embodiment will be described. In the following description, structural elements that are the same as or equivalent to those in the above embodiment will be labeled with the same reference numerals, and the description of these structural elements will be simplified or omitted.

[0155] Figure 24 This is a schematic side view of the 3D mounting device 110 according to the embodiment. In this embodiment, the 3D mounting device 110 includes: a coating head 13 for coating an adhesive 70 onto the surface of a substrate 1; and an ultraviolet light head 14 for emitting ultraviolet light. Figure 24 The illustration of the dispensing applicator 11 is omitted. In addition, the paste solder 60 can also be applied to the substrate 1 using a different applicator than the 3D mounting device 110.

[0156] Figure 25This is a functional block diagram illustrating the 3D mounting device 110 according to the embodiment. In this embodiment, the controller 16 includes a fixed control unit 38 that controls the coating head 13 and the ultraviolet light head 14 respectively.

[0157] Figure 26 This diagram illustrates the operation of the application head 13 according to the embodiment. In this embodiment, adhesive 70 is applied to the mounting area 50 where a non-permissible component is mounted. The non-permissible component and the mounting area 50 are secured by the adhesive 70.

[0158] In this embodiment, the adhesive 70 is UV-curable. After the non-permissible component is mounted on the mounting area 50 via the adhesive 70 and the solder paste 60, the fixing control unit 38 controls the UV light head 14 to irradiate the adhesive 70 applied to the mounting area 50 with UV light.

[0159] Figure 27 and Figure 28 These figures illustrate the operation of the 3D mounting device 110 when a component 2, whose positional offset cannot be eliminated, exists in the embodiment.

[0160] When component 2D is installed in mounting area 50D and component 2E is installed, component 2D is not below the allowable angle θd. When component 2E is installed in mounting area 50E and component 2D is installed, component 2E is not below the allowable angle θe. The fixing control unit 38 controls the coating head 13 so that component 2D and mounting area 50D are fixed by adhesive 70 after component 2D is installed and before substrate 1 is tilted. When component 2E is installed and before substrate 1 is tilted, component 2E and mounting area 50E are fixed by adhesive 70.

[0161] Before component 2D, which is a non-permitted component, is installed into mounting area 50D, solder paste 60 and adhesive 70 are applied to mounting area 50D. Before component 2E, which is a non-permitted component, is installed into mounting area 50E, solder paste 60 and adhesive 70 are applied to mounting area 50E.

[0162] like Figure 27 As shown in Figure (A), when component 2D is installed onto mounting area 50D, the worktable control unit 32 controls the worktable 20 to ensure that mounting area 50D is horizontal. Component 2D is installed onto mounting area 50D via adhesive 70 and solder paste 60. Figure 27As shown in Figure (B), after component 2D is mounted on mounting area 50D via adhesive 70 and solder paste 60, while maintaining the horizontal state of mounting area 50D, the adhesive 70 of mounting area 50D is irradiated with ultraviolet light. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 is cured, thereby fixing component 2D and mounting area 50D in place.

[0163] like Figure 28 As shown in Figure (A), after component 2D and mounting area 50D are fixed with adhesive 70, component 2E is mounted onto mounting area 50E. When component 2E is mounted onto mounting area 50E, the worktable control unit 32 controls the worktable 20 to make mounting area 50E horizontal. With mounting area 50E horizontal, mounting area 50D is tilted relative to the horizontal plane. Since component 2D is fixed to mounting area 50D with adhesive 70, even if the tilt angle of mounting area 50D exceeds the allowable angle θd, positional displacement of component 2D is suppressed. Figure 28 As shown in Figure (B), after component 2E is mounted to mounting area 50E via adhesive 70 and solder paste 60, while maintaining the horizontal state of mounting area 50E, the adhesive 70 of mounting area 50E is irradiated with ultraviolet light. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 is cured, thereby fixing component 2E and mounting area 50E in place.

[0164] The curing of the adhesive by ultraviolet light does not need to be carried out immediately after component 2 is installed, as long as it is carried out before component 2 is tilted to an allowable angle θ or higher. Therefore, adjacent non-allowable components can also be cured simultaneously as long as this condition is met, thereby enabling faster production cycle times.

[0165] Figure 29 This is a flowchart illustrating the installation method of component 2 according to the embodiment.

[0166] The dispensing control unit 31 controls the dispensing device 11 to apply paste solder 60 to multiple mounting areas 50 of the substrate 1 respectively (step SC1).

[0167] The workbench control unit 32 controls the workbench 20 so that multiple installation areas 50 are sequentially made horizontal according to the installation order stored in the installation order storage unit 40. The mounting head control unit 33 controls the mounting head 24 so that the component 2 is sequentially installed in the horizontal installation areas 50 according to the installation order stored in the installation order storage unit 40 (step SC2).

[0168] The mounting head control unit 33 determines whether there are any unacceptable parts (step SC3).

[0169] If it is determined in step SC3 that a non-permitted component exists (step SC3: Yes), the fixing control unit 38 applies adhesive 70 to the mounting area 50 where the non-permitted component is installed (step SC4).

[0170] The mounting head control unit 33 installs the non-permitted component into the mounting area 50 (step SC5).

[0171] For reference Figure 27 and Figure 28 As explained, after the non-permitted component is installed in the mounting area 50, the fixing control unit 38 controls the ultraviolet light head 14 within the range that the tilt angle of the mounting area 50 does not exceed the permissible angle θ, so that the adhesive 70 of the non-permitted component is irradiated with ultraviolet light.

[0172] The installation head control unit 33 determines whether the installation of all non-permitted components is complete (step SC6).

[0173] If the installation of the non-permitted component is not completed in step SC6 (step SC6: No), return to the processing of step SC4.

[0174] If, in step SC6, it is determined that the installation of non-permitted components is complete (step SC6: Yes), the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of all components 2, including both permitted and non-permitted components, with the laser (step SC7). Similarly, if, in step SC3, it is determined that no non-permitted components exist (step SC3: No), the laser control unit 34 controls the laser head 12 to irradiate the solder paste 60 of all permitted components with the laser (step SC7).

[0175] By setting the laser irradiation sequence to be the reverse of the installation sequence, it is possible to prevent the permissible tilt of the components before welding from exceeding the reference angle.

[0176] Furthermore, in step SC7, the laser head 12 can be omitted, and the substrate 1 with multiple components 2 mounted can be moved into the reflow oven without tilting. In this case, welding by laser is not required, and productivity can be significantly improved through concentrated welding.

[0177] As explained above, in this embodiment, the reduction in productivity of 3D installation can be minimized, and the positional deviation of component 2 can be suppressed. In this embodiment, even if there are unacceptable components, the positional deviation of unacceptable components is suppressed by the adhesive 70.

[0178] [Other Implementation Methods]

[0179] Figure 30 This diagram schematically illustrates the allowable angle storage unit 30 according to the embodiment. In the above embodiment, the allowable angle θ is calculated based on image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 can also be measured using a measuring device different from the 3D mounting device 10. In this case, it is also possible to obtain the allowable angle data directly from the image data of the component 2 without using the allowable angle acquisition unit 36. Figure 30 The relevant data (allowable angle table) between component 2 and the allowable angle θ shown are directly stored from external measurement data into the allowable angle storage unit 30.

[0180] Figure 31 This is a schematic diagram illustrating the controller 16 involved in the implementation method. (See diagram for example.) Figure 31 As shown, the controller 16 may also have a permissible angle calculation unit 39, which calculates the permissible angle θ of component 2 based on the weight of component 2. The permissible angle acquisition unit 36 ​​can also acquire the permissible angle θ from the permissible angle calculation unit 39. The weight of component 2 and the permissible angle θ are correlated. The greater the weight of component 2, the smaller the permissible angle θ becomes. Furthermore, the permissible angle calculation unit 39 can calculate the permissible angle θ by considering not only the weight of component 2, but also the volume of component 2 and the physical properties of the solder paste 60. Because the calculation accuracy of the permissible angle θ is improved by considering not only the weight of component 2, but also the volume of component 2 and the physical properties of the solder paste 60.

[0181] The present invention includes the following methods. (1)

[0183] A 3D installation device, which has: The worktable supports the three-dimensional substrate; A mounting head that mounts components on the surface of the stereolithography substrate; and Controller The controller has: The allowable angle acquisition unit acquires the allowable angle, which represents the maximum tilt angle of the component that suppresses the post-installation positional offset to below a specified amount; The mounting sequence determining unit determines the mounting sequence of components on multiple mounting areas set on the surface of the three-dimensional substrate, so that the mounted components are below the allowable angle. A workbench control unit controls the workbench so that the plurality of installation areas sequentially become horizontal according to the installation sequence; and The mounting head control unit controls the mounting head to install components sequentially in the horizontal mounting area according to the mounting sequence. (2)

[0185] According to the 3D mounting device described in (1), wherein, The controller has a position offset calculation unit that calculates the position offset of the installed component based on image data of the installed component. The allowable angle acquisition unit obtains the maximum value of the tilt angle of the component that is below the specified amount, calculated by the position offset calculation unit. (3)

[0187] According to the 3D mounting device described in (1), wherein, The controller has a permissible angle storage unit that stores relevant data between the component and the permissible angle. The allowable angle storage unit obtains the allowable angle from the allowable angle acquisition unit and stores it. (4)

[0189] According to the 3D mounting device described in (1), wherein, The controller has a permissible angle calculation unit that calculates the permissible angle based on the weight of the component. The allowable angle acquisition unit obtains the allowable angle from the allowable angle calculation unit. (5)

[0191] According to the 3D mounting device described in (1), wherein, The installation sequence determination unit determines the installation sequence so that the installed component will not exceed the allowable angle when installing subsequent components. (6)

[0193] According to the 3D mounting device described in (5), among which, Apply solder paste to the mounting area. It has a laser head that irradiates the solder paste with a laser after the component is mounted into the mounting area. The controller has a laser control unit that controls the laser head so that, in cases where it is not possible to achieve an installation sequence where the first component is installed after the first component is installed in the first mounting area and the first component is installed at an angle below the allowable angle, the first component is soldered by irradiating the paste solder in the first mounting area with a laser after the first component is installed and before the three-dimensional substrate is tilted. (7)

[0195] According to the 3D mounting device described in (1), wherein, It also includes a coating head for applying adhesive to the surface of the stereolithography substrate. The controller also has a fixing control unit that controls the coating head so that, after the first component is installed in the first mounting area and before the three-dimensional substrate is tilted, the first component and the first mounting area are fixed by an adhesive, provided that the first component cannot be below the allowable angle when the second component is installed. (8)

[0197] According to the 3D mounting device described in (7), among which, The adhesive is UV-curable. It has an ultraviolet light sensor that emits ultraviolet light. The fixed control unit controls the ultraviolet light head to irradiate the adhesive applied to the installation area with ultraviolet light. (9)

[0199] A 3D installation method comprising the following steps: Obtain the allowable angle, which represents the maximum tilt angle of the component that will suppress the positional offset of the component after mounting on the surface of the stereo substrate to a specified amount; The mounting sequence of components on multiple mounting areas set on the surface of the three-dimensional substrate is determined so that the mounted components are below the allowable angle. Rotate the three-dimensional substrate so that the plurality of mounting areas, in the mounting sequence, sequentially become horizontal; and The components are installed sequentially in the horizontal mounting area according to the installation sequence. (10)

[0201] According to the 3D installation method described in (9), among which, It also includes the following steps: after the first component is installed in the first mounting area and the first component cannot be below the allowable angle when the second component is installed, the first component and the stereo substrate are fixed by an adhesive after the first component is installed and before the stereo substrate is tilted.

[0202] This application is based on Japanese Patent Application Nos. 2023-223337 and 2023-223338, filed on December 28, 2023, the contents of which are incorporated herein by reference.

Claims

1. A 3D installation device, comprising: The worktable supports the three-dimensional substrate; A mounting head that mounts components on the surface of the stereolithography substrate; and Controller The controller has: The allowable angle acquisition unit acquires the allowable angle, which represents the maximum tilt angle of the component that suppresses the post-installation positional offset to below a specified amount; The mounting sequence determining unit determines the mounting sequence of components on multiple mounting areas set on the surface of the three-dimensional substrate, so that the mounted components are below the allowable angle. A workbench control unit controls the workbench so that the multiple installation areas are sequentially made horizontal according to the installation sequence; as well as The mounting head control unit controls the mounting head to install components sequentially in the horizontal mounting area according to the mounting sequence.

2. The 3D installation device according to claim 1, wherein, The controller has a position offset calculation unit that calculates the position offset of the installed component based on image data of the installed component. The allowable angle acquisition unit obtains the maximum value of the tilt angle of the component that is below the specified amount, calculated by the position offset calculation unit.

3. The 3D installation device according to claim 1, wherein, The controller has a permissible angle storage unit that stores relevant data between the component and the permissible angle. The allowable angle storage unit obtains the allowable angle from the allowable angle acquisition unit and stores it.

4. The 3D installation device according to claim 1, wherein, The controller has a permissible angle calculation unit that calculates the permissible angle based on the weight of the component. The allowable angle acquisition unit obtains the allowable angle from the allowable angle calculation unit.

5. The 3D installation device according to claim 1, wherein, The installation sequence determination unit determines the installation sequence so that the installed component will not exceed the allowable angle when installing subsequent components.

6. The 3D installation device according to claim 5, wherein, Apply solder paste to the mounting area. It has a laser head that irradiates the solder paste with a laser after the component is mounted into the mounting area. The controller has a laser control unit that controls the laser head so that, in cases where it is not possible to achieve an installation sequence where the first component is installed after the first component is installed in the first mounting area and the first component is installed at an angle below the allowable angle, the first component is soldered by irradiating the paste solder in the first mounting area with a laser after the first component is installed and before the three-dimensional substrate is tilted.

7. The 3D mounting device according to claim 1, wherein, It also includes a coating head for applying adhesive to the surface of the stereolithography substrate. The controller also has a fixing control unit that controls the coating head so that, after the first component is installed in the first mounting area and before the three-dimensional substrate is tilted, the first component and the first mounting area are fixed by an adhesive, provided that the first component cannot be below the allowable angle when the second component is installed.

8. The 3D mounting device according to claim 7, wherein, The adhesive is UV-curable. It has an ultraviolet light sensor that emits ultraviolet light. The fixed control unit controls the ultraviolet light head to irradiate the adhesive applied to the installation area with ultraviolet light.

9. A 3D installation method, comprising the following steps: Obtain the allowable angle, which represents the maximum tilt angle of the component that will suppress the positional offset of the component after mounting on the surface of the stereo substrate to a specified amount; The mounting sequence of components on multiple mounting areas set on the surface of the three-dimensional substrate is determined so that the mounted components are below the allowable angle. Rotate the three-dimensional substrate so that the plurality of mounting areas, in the mounting sequence, sequentially become horizontal; and The components are installed sequentially in the horizontal mounting area according to the installation sequence.

10. The 3D installation method according to claim 9, wherein, It also includes the following steps: after the first component is installed in the first mounting area and the first component cannot be below the allowable angle when the second component is installed, the first component and the stereo substrate are fixed by an adhesive after the first component is installed and before the stereo substrate is tilted.

Images