A material traceability and mistake-proofing binding method and system for a PCB plug-in process

Abstract

This invention relates to the field of printed circuit board (PCB) manufacturing equipment and process technology, specifically disclosing a material traceability and error-proofing binding method and system for PCB assembly. The invention first establishes a motherboard lifecycle traceability file, collecting and comparing the brand attribute information of core components to ensure correct material assembly. Then, using multi-stage torque assembly equipment, torque data is collected in real time and stress state assessment characteristics are generated to warn of potential assembly defects. Next, stress release and functional testing are performed using a timing-based opening and closing test fixture, dynamically adjusting the testing strategy to improve detection accuracy. Finally, based on quality interception judgment instructions, bidirectional barcode scanning and binding are executed at the final station, associating the system manufacturing information code with the media access control address code to generate unique and tamper-proof, full-chain error-proofing traceability closed-loop data. This invention improves the accuracy of material management, assembly quality, and product traceability in the PCB assembly process, providing an innovative solution for the electronics assembly field.

Description

Technical Field

[0001] This invention belongs to the field of printed circuit board manufacturing equipment and process technology, and relates to a material traceability and error-proof binding method and system for PCB insertion process. Background Technology

[0002] In the printed circuit board (PCB) manufacturing process, the component insertion process refers to the critical step of mounting and securing various core electronic components to designated holes or pads on the PCB. The quality of this process directly affects the electrical performance and long-term reliability of the entire PCB; therefore, achieving correct material assembly and precise process control is one of the core requirements in the electronics assembly field.

[0003] In existing technologies, error prevention for materials in the component insertion process often employs barcode scanning-based material verification systems. This involves scanning the barcodes on the material reel and comparing them with the work order information before assembly. For assembly process control, this typically relies on electric screwdrivers with preset fixed torque values, followed by functional power-on checks via a separate online testing station after assembly. These technologies usually operate independently within their respective stages, lacking effective correlation and closed-loop management between the data.

[0004] However, existing technical solutions have several significant drawbacks. Material verification only occurs at the initial loading point, failing to prevent material mixing or misuse due to human error at subsequent workstations. The torque assembly process lacks real-time data monitoring and in-depth analysis; a single final torque value cannot reflect the smoothness of the tightening process and is insufficient to predict potential stress damage. Subsequent functional testing is completely disconnected from the preceding assembly process data; the testing strategy is static and cannot conduct targeted in-depth testing for different assembly quality conditions. The data throughout the production chain is fragmented; there is no inseparable binding relationship between materials, process parameters, test results, and the product's unique identification information, making the information chain prone to breakage during product traceability and resulting in an incomplete error-proofing closed loop. Summary of the Invention

[0005] In view of this, in order to solve the problems mentioned in the background technology, a material traceability and error prevention binding method and system for PCB insertion process is proposed.

[0006] The objective of this invention can be achieved through the following technical solution: The first aspect of this invention provides a material traceability and error prevention binding method for PCB insertion process, including: S1, obtaining the system manufacturing information code of the motherboard for production filing and generating a motherboard life cycle traceability file.

[0007] S2. Collect the brand attribute information of the core components to be assembled, and compare the brand attribute information with the motherboard lifecycle traceability file to generate component matching verification results.

[0008] S3. Drive the multi-level torque assembly equipment to perform plug-in operations based on the component matching verification results, obtain real-time torque data during the assembly process, and generate stress state evaluation features based on the real-time torque data.

[0009] S4. Use a timing-based on / off test fixture to perform stress release and functional tests on the assembled motherboard, obtain test response signals, and generate quality interception judgment instructions based on stress state evaluation characteristics.

[0010] S5. Based on the quality interception judgment instruction, the terminal station performs a two-way scanning and binding operation, associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention and traceability closed-loop data.

[0011] The second aspect of the present invention provides a material traceability and error prevention binding system for PCB assembly process, comprising: a motherboard traceability file generation module, which obtains the system manufacturing information code of the motherboard for production filing and generates a motherboard lifecycle traceability file.

[0012] The component matching verification result generation module collects the brand attribute information of the core components to be assembled, compares the brand attribute information with the motherboard lifecycle traceability file, and generates the component matching verification result.

[0013] The stress state assessment feature generation module drives multi-level torque assembly equipment to perform plug-in operations based on the component matching verification results, obtains real-time torque data during the assembly process, and generates stress state assessment features based on the real-time torque data.

[0014] The quality interception judgment instruction generation module uses a timing opening and closing test fixture to perform stress release and functional tests on the assembled motherboard, obtains test response signals, and generates quality interception judgment instructions by combining stress state evaluation characteristics.

[0015] The traceability closed-loop data generation module performs a two-way barcode scanning and binding operation at the end station based on the quality interception judgment command. It associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention traceability closed-loop data.

[0016] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) The present invention connects material identification, assembly process monitoring, functional test verification and data encryption into an automated closed loop, realizing the data connection and error prevention of the entire chain from component warehousing to motherboard finished product output. This method can actively intercept the feeding of components with mismatched models, avoid batch assembly problems caused by manual material selection errors from the source, and improve the accuracy of material management and the first pass rate of the assembly line.

[0017] This invention introduces a real-time torque data acquisition and stress state quantitative assessment mechanism, transforming the previous tightening operation, which relied on worker experience, into a monitorable and evaluable digital process. Through comprehensive analysis of torque peak value and rate of change, it can promptly detect and warn of over-tightening or under-tightening defects caused by equipment malfunctions or process drift, thereby improving the mechanical reliability of plug-in connection points and reducing potential early failures caused by improper stress.

[0018] This invention creatively correlates and integrates the physical stress assessment results of the assembly process with subsequent functional test parameters. The test fixture adaptively adjusts the testing strategy based on the stress state of the previous process, realizing the transfer and cross-verification of quality information across processes. This data-association-based interception logic overcomes the potential for missed detections in a single testing step.

[0019] This invention ultimately uses bidirectional barcode scanning and cryptographic hashing algorithms to immutably bind the manufacturing information of the physical motherboard to its network hardware address and synchronize it to cloud archives. This generates unique and globally searchable traceability closed-loop data, enabling precise backtracking of key materials and process data throughout the entire lifecycle of any finished motherboard. This enhances product traceability and provides a solid data foundation for quality analysis and after-sales service. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the method steps of the present invention.

[0022] Figure 2 This is a schematic diagram of the system structure connection of the present invention. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figure 1The first aspect of the present invention provides a material traceability and error prevention binding method for PCB insertion process, including: S1, obtaining the system manufacturing information code of the motherboard for production filing and generating a motherboard life cycle traceability file.

[0025] Specifically, step S1 begins by reading the one-dimensional or two-dimensional barcode on the motherboard surface using a barcode scanning device to obtain a character sequence composed of numbers and letters. This sequence is defined as the system manufacturing information code, a unique string code assigned to the motherboard during the manufacturing process. Subsequently, the system performs format verification on this system manufacturing information code to ensure it conforms to predefined encoding rules, such as the length and character set must be consistent with the record template in the database. This verification process is based on statistical analysis of over 200 sets of industrial motherboard identification codes. After successful verification, the system performs a production filing operation, creating a new production tracking record for the motherboard. The core of the filing operation is the automatic generation of a filing number, which is calculated using a specific formula. In this formula, the symbol This represents the calculated filing number itself, which is an integer; symbol The numerical code representing the production line number is set based on the physical number mapping table of the production line. For example, production line number 1 corresponds to... ;symbol Represents a date sequence value, calculated as the number of days between the current date and a fixed base date, which is set based on the factory's production start date; symbol This represents the sequence number of motherboards successfully registered on this production line that day. Its initial value is 0, and it increments by 1 for each successful registration. All terms in this formula are dimensionless integers, expressed through coefficients. and To achieve the separation and combination of digits, ensuring the generated... It is unique and easy to parse. Ultimately, the system will assign a system manufacturing information code and a filing number. The creation timestamp and initial status tag are written together into the database of the manufacturing execution system to form a complete structured record. This record is defined as the motherboard lifecycle traceability file, which is the basis for data querying and updating in all subsequent steps.

[0026] For example, a barcode scanner reads the QR code on the motherboard surface and parses the system manufacturing information code as the string MB20240315001. The system verifies that this string conforms to the predetermined rule of "MB" prefix followed by 11 digits. Assuming this motherboard was documented on production line number 2, the date sequence value... The timeframe is 445 days. A system database query revealed that 89 files had been successfully created on production line number 2 that day, i.e., sequence numbers. The current value is 89. [The remaining text appears to be incomplete and requires further context.] , , Substitute into the formula Calculations were performed to obtain the filing number. The system then combines the system manufacturing information code MB20240315001, the file number 2004450089, the current timestamp, and the status label "in production" into a record and writes it into the database, thus successfully generating the motherboard lifecycle traceability file for the motherboard.

[0027] S2. Collect the brand attribute information of the core components to be assembled, and compare the brand attribute information with the motherboard lifecycle traceability file to generate component matching verification results.

[0028] In a specific embodiment of the present invention, the brand attribute information of the core components to be assembled is collected, and the brand attribute information is compared with the motherboard lifecycle traceability file to generate component matching verification results, including: extracting the motherboard model and specification features from the motherboard lifecycle traceability file.

[0029] The surface silkscreen image of the core component to be assembled is obtained by image recognition equipment, and the features of the surface silkscreen image are extracted to generate brand attribute information.

[0030] In a specific embodiment of the present invention, a surface silkscreen image of the core component to be assembled is obtained by an image recognition device, and features are extracted from the surface silkscreen image to generate brand attribute information, including: controlling the image recognition device to take multi-angle pictures of the core component to be assembled to obtain multi-dimensional surface silkscreen images.

[0031] Image denoising and edge enhancement are performed on multidimensional surface screen printing images to generate clearer screen printing images.

[0032] The optical character recognition algorithm is used to extract text from the cleared silkscreen image to generate brand attribute information.

[0033] The manufacturer's brand information is correlated and matched with the motherboard model and specifications to generate component matching verification results.

[0034] Specifically, step S2 is implemented based on the generated motherboard lifecycle traceability file. First, the motherboard model and specification characteristics are extracted from the motherboard lifecycle traceability file. According to a pre-set data parsing template, the system locates and reads the model and specification field from the structured record of the motherboard lifecycle traceability file. This field stores a list of core component brands and model codes that are allowed to be installed, as determined by the motherboard design specifications. These codes exist in semicolon-separated strings, such as "DDR4_3200_BrandA; PCIe3.0_BrandB". This extracted list of strings is defined as the benchmark for comparison, i.e., the motherboard model and specification characteristics.

[0035] The next step involves collecting and generating brand attribute information for the core component to be assembled. An image recognition device, typically an industrial camera, fixed to the end effector of a robotic arm, rotates around the core component placed on a fixture. The robotic arm, according to a pre-programmed sequence, controls the camera to capture images from three fixed angles: the front, left, and right sides of the component. This results in three images containing different perspectives of the silkscreened text on the component's surface, forming a multi-dimensional silkscreen image. The acquired multi-dimensional silkscreen image is then preprocessed. The system sequentially applies a Gaussian filter algorithm to each image to suppress random noise, with the filter kernel size set to 5 pixels based on noise analysis of 500 sets of industrial silkscreen images. After filtering, the Sobel operator is used for edge enhancement, highlighting the boundaries between text and background, ultimately resulting in a sharp, clear silkscreen image with clean backgrounds. Finally, an open-source optical character recognition (OCR) engine is used. This engine identifies characters by analyzing the distribution patterns of bright and dark pixels in the image, performing text region detection and character recognition on the cleared silkscreen image. The identified text string is filtered according to rules to remove meaningless symbols and retain key fields such as brand name, model, and specifications. These fields are then concatenated into a standard format string, such as "BrandX_DDR4_3200". This string is defined as the brand attribute information extracted from the physical component.

[0036] After information collection is complete, the brand attribute information is correlated and matched with the motherboard model and specifications. The system splits the brand attribute information string into a set of information according to a preset delimiter. At the same time, the motherboard model specification string is split into a standard specification list by semicolons. Matching analysis calculates the information set. With Specifications List This is achieved by matching elements within the same string, using similarity. Quantification is performed, and the calculation formula is as follows: In the formula, the symbols This represents the calculated matching similarity, with a value between 0 and 1; the symbol... Represents the set of keywords extracted from brand attribute information; symbol This represents the set of standard specification codes extracted from the motherboard model and specification characteristics; Operations Represents finding the set With sets The intersection of the two, that is, the elements they share; symbols and Representing sets The number of elements in the intersection set. This formula calculates the percentage of keywords in the brand attribute information that appear in the motherboard's allowed specifications list. Similarity. A value of 1 indicates a complete match, a value greater than or equal to 0.8 indicates a match of key parameters, and otherwise it is considered a non-match. The system uses this value based on... The value obtained generates a component matching verification result, which is a status indicator including "match successful", "parameter warning" or "match failed" and a specific similarity value. The data structure.

[0037] For example, the motherboard model specification string extracted by the system from the motherboard lifecycle traceability file is "DDR4_3200_BrandX; PCIe4.0_BrandY". The device to be installed is a memory module; the text recognized from its surface by the image recognition device, after processing, generates the brand attribute information string "BrandX_DDR4_3200". This brand attribute information is then split into sets. Break down the motherboard model specifications into a list. Calculate the intersection. Due to the list The element "DDR4_3200_BrandX" contains the set All keywords in the string are determined by string inclusion relationship; this element is related to the set. The sets match, therefore the number of intersections is 1. Number of elements The value is 3. Substitute it into the formula. To obtain similarity If this result is less than 0.8, the system determines it as a "match failed" and generates a value containing this status and... The component matching verification results. Conversely, if the brand attribute information is "DDR4_3200_BrandX", the split and assembled ,and If the element "DDR4_3200_BrandX" corresponds completely, then The system determined that "matching was successful".

[0038] S3. Drive the multi-level torque assembly equipment to perform plug-in operations based on the component matching verification results, obtain real-time torque data during the assembly process, and generate stress state evaluation features based on the real-time torque data.

[0039] In a specific embodiment of the present invention, a multi-level torque assembly device is driven to perform plug-in operation based on the component matching verification result, real-time torque data during the assembly process is obtained, and stress state evaluation features are generated based on the real-time torque data, including: parsing the component matching verification result to obtain the component type identifier, and determining the corresponding target torque threshold range based on the component type identifier.

[0040] The multi-stage torque assembly equipment is controlled to perform fastening operations according to the target torque threshold range, and real-time torque data is collected during the fastening process.

[0041] Calculate the deviation between real-time torque data and the target torque threshold range, and generate stress state assessment features based on the deviation.

[0042] In a specific embodiment of the present invention, the deviation between the real-time torque data and the target torque threshold range is calculated, and stress state evaluation features are generated based on the deviation values, including: extracting peak torque features and torque change rate features from the real-time torque data.

[0043] The peak torque characteristic is compared with the upper and lower limits of the target torque threshold range to obtain the peak deviation value.

[0044] By combining the peak deviation value with the torque change rate characteristics, a weighted calculation is performed to generate stress state assessment characteristics.

[0045] Specifically, step S3 takes the component matching verification result generated in step S2 as input. This result must include confirmation information with a status of "match successful" and a component type identifier field, such as "DDR4_SODIMM". First, the component matching verification result is parsed to extract the component type identifier string. The system uses this string as the query key to retrieve data from a pre-set assembly process parameter database. This database is built based on 1000 destructive tests and finite element analyses of different component physical structures and material strengths, storing the safe range of fastening forces corresponding to each component type. The search result consists of two values, representing the minimum allowable torque values. With maximum torque value Both values ​​are in Newton-meters (N·m), and together they form a closed interval, namely the target torque threshold interval. .

[0046] Subsequently, the multi-stage torque assembly equipment is controlled for actual operation. Based on the component type identifier, the system retrieves the corresponding fastening trajectory program from the motion control library, driving a servo motor to move an electric screwdriver equipped with a force sensor to the target screw hole on the mainboard. The fastening operation is performed at the midpoint of the target torque threshold range. As an initial reference target, the device begins to rotate and press down, while simultaneously acquiring the instantaneous torque value applied by the screwdriver head at a frequency of 1000 Hz via an embedded force sensor, forming a torque-time sequence. This time series data is defined as real-time torque data.

[0047] Finally, in-depth analysis of the real-time torque data is performed to generate stress state assessment features. This process is further subdivided into three steps. The first step is responsible for feature extraction; the algorithm traverses the entire real-time torque data sequence to find its maximum value, which is defined as the peak torque feature. The unit is Newton-meter (N·m). Simultaneously, the average slope of torque change over time is calculated from the initial increase in torque to its peak value; this slope is defined as the torque rate of change characteristic curve. The unit is Newton-meter per second. Its calculation formula is: ,in It is the torque value corresponding to the starting point of a significant increase in torque. and These are the timestamps corresponding to the start and peak points, respectively. Next, the peak torque characteristics... Compare with the upper and lower limits of the target torque threshold range. Calculate two deviation values: the deviation relative to the lower limit. and deviation relative to the upper limit Peak deviation value It is determined by the smaller of these two deviation values, i.e. .this This value reflects the closest distance between the peak torque and the boundary of the safe range. A value greater than or equal to 0 indicates that the peak torque is within the range, while a value less than 0 indicates that it exceeds the boundary. Finally, this is combined with the peak torque deviation value. Characteristics of Torque Change Rate A comprehensive evaluation needs to be conducted. To eliminate the influence of dimensions and make different indicators comparable, a comprehensive evaluation is required. and Normalization is performed. Based on historical assembly data statistics, a typical expected range for peak deviation is set. The typical range of torque change rate is 0.5 N·m. It is 50 N·m / s. The normalized index is and Stress state assessment characteristics The formula is derived through weighted calculation. In the formula, the symbols Representing the final stress state assessment characteristic, it is a dimensionless score value, typically ranging from 0 to 2; symbol and These are weighting coefficients, set to 0.7 and 0.3 respectively based on engineering experience, and satisfying the following conditions: ; This is the ideal normalized rate of torque change, set to 0.5 according to the principle of smooth assembly. This formula calculates the stress state assessment characteristics of peak position safety and torque growth smoothness. A higher value indicates a better assembly stress state.

[0048] It should be noted that the "multi-stage" feature of the 'multi-stage' assembly equipment in this embodiment is specifically reflected in the breakdown of a single tightening action into three continuous dynamic stages within a microsecond time: The first stage is the rapid fitting stage: the servo motor drives the screw downward at a high speed (e.g., 80% of the maximum speed) until the force sensor detects that the torque reaches 30% of the lower limit of the target torque threshold range. This stage aims to quickly eliminate thread clearance and improve cycle efficiency; The second stage is the deceleration and locking stage: the system instantly switches the control loop, and the motor speed drops sharply to 20%, slowly approaching the target torque threshold range with a constant and gradual torque increment. This slow entry is a key prerequisite for obtaining the aforementioned stable 'torque change rate characteristic'; The third stage is the torque holding and judgment stage: when the torque enters the target range, the motor maintains the current applied torque and stops rotating (holding pressure for about 50 milliseconds). Only after confirming that the torque has no step decay (eliminating the risk of stripping) is the single tightening considered to be over. By combining the above multi-stage actions, not only is assembly efficiency guaranteed, but the transient stress change caused by single-stage high-speed impact is also suppressed from the physical source.

[0049] For example, the component type identifier in the component matching verification result is "M2_SSD". The system queries the database to obtain the target torque threshold range for screws of this type of solid-state drive. Niu·Mi, that is , Multi-stage torque assembly equipment Tightening is performed with Newton-meter torque as the target. The acquired real-time torque data sequence shows the initial torque. Niu·Mi, in It started to rise at the second, at Peak value reached in seconds Newton-meter (N·m). Calculation of torque rate of change characteristics. Newton-meters per second. Next, the peak deviation value is calculated. , ,therefore Cows and rice. Normalization is performed. , .Will , , and weight , Substitute into the evaluation formula: The system generates stress state assessment features. The value is low, mainly due to the rate of change of torque. Far below the ideal value This indicates that the tightening process may be too fast or slippage may occur.

[0050] S4. Use a timing-based on / off test fixture to perform stress release and functional tests on the assembled motherboard, obtain test response signals, and generate quality interception judgment instructions based on stress state evaluation characteristics.

[0051] In a specific embodiment of the present invention, a timing-based opening and closing test fixture is used to perform stress release and functional testing on the assembled motherboard, obtain test response signals, and generate a quality interception judgment instruction in combination with stress state assessment characteristics, including: determining the closing speed parameters and holding time parameters of the timing-based opening and closing test fixture according to the stress state assessment characteristics.

[0052] The timing opening and closing test fixture is controlled according to the closing speed parameters and the holding time parameters to press the assembled motherboard and obtain the test response signal under the pressing state.

[0053] The functional status index is obtained by analyzing the test response signal, and the functional status index is fused with the stress state assessment characteristics to generate a quality interception judgment command.

[0054] In a specific embodiment of the present invention, the functional status index is obtained by analyzing the test response signal, and the functional status index is fused and analyzed with the stress state assessment features to generate a quality interception judgment instruction, including: performing analog-to-digital conversion and filtering on the test response signal to extract stable functional status index.

[0055] The functional status indicators are input into the status assessment model for logical operations to obtain the functional pass rate parameter.

[0056] Determine whether the function pass rate parameter is greater than or equal to the preset function pass rate threshold, and whether the stress state assessment feature is greater than or equal to the preset stress feature threshold. If both conditions are met, a release command is generated; otherwise, an interception command is generated.

[0057] Specifically, step S4 uses the stress state assessment feature generated in the preceding steps as a key input; this feature is a quantified score. First, the closing speed parameters and holding time parameters of the timing-based opening and closing test fixture are determined based on the stress state assessment feature. The system has a pre-stored set of benchmark test parameters, including the basic closing speed. Set to 50 mm / s, basic holding time Set to 5 seconds. Stress state assessment characteristics. The value is used to dynamically adjust these benchmark parameters, and the adjustment follows these principles: A lower value indicates potential problems with the assembly stress state or an unstable process, requiring a gentler stress release method. Therefore, the closing speed parameter... The calculation formula is: Pressure holding time parameter The calculation formula is: In the formula, the symbols Represents the final determined closure velocity parameter, in millimeters per second; symbol This represents the final determined pressure holding time parameter, in seconds; symbol and It is an adjustment coefficient, set based on regression analysis of motherboard deformation data after testing 200 motherboards with different parameters. millimeters per second Second. The input stress state evaluation features. When When using reference parameters; The smaller the value, the slower the closing speed and the longer the holding time.

[0058] Then, according to the calculated closing velocity parameters With holding time parameter The timing-based on / off test fixture presses the assembled motherboard together. This fixture is a pressure plate mechanism driven by a servo motor and equipped with pressure feedback. The system controls the pressure plate at a speed... The pressure plate descends at a constant speed until the pressure sensor detects that the pressure has reached a preset contact pressure value that will not damage the motherboard, such as 50 Newtons. At this point, the pressure plate stops descending and begins the pressure holding phase, which lasts for [duration missing]. Seconds. Throughout the pressing and holding process, the electrical performance probes integrated into the fixture remain in contact with specific test points on the motherboard, supplying power to the motherboard and sending predefined test command sequences, while continuously monitoring the voltage and current signals returned by the motherboard. These time-varying analog voltage and current signals are synchronously acquired and together constitute the test response signal.

[0059] The test response signal is then analyzed and fused. This process begins with a sub-step: preprocessing the test response signal. The simulated voltage and current signals are first converted into digital signals by an analog-to-digital converter (ADC), a circuit that converts continuous voltage values ​​into discrete digital sequences, at a sampling rate of 10 kHz. A digital filtering algorithm is then employed, specifically a low-pass filter with a cutoff frequency of 100 Hz, to remove high-frequency noise and extract a stable, smooth signal waveform. From the processed signal, key data points, such as the steady-state voltage values ​​of each power supply line, are extracted according to a predefined timing sequence. Static current value and the amplitude of the response pulse to specific test commands. These extracted quantitative data collectively constitute the functional status indicators.

[0060] Next, the functional status indicators are input into the status assessment model for logical operations. This model is essentially a set of parallel judgment rules. Each functional status indicator has its acceptable range, which is determined based on the motherboard design specifications. The model iterates through all indicators, counting the number of indicators within the acceptable range, denoted as . And count the total number of detection indicators. Functional pass rate parameter The calculation formula is: . It is a value between 0 and 1, where 1 represents that all test items are qualified.

[0061] Finally, determine the functional pass rate parameters. Characteristics of stress state assessment Whether all release conditions are met. The system presets two independent thresholds that must be met simultaneously: the functional pass rate threshold. This means that all functional tests must pass; stress state assessment characteristic threshold. The logic for generating the quality interception judgment command is as follows: If and If so, then the command "allow passage" is generated; if or If so, the command "intercept" will be generated, and the command will include the specific unmet conditions.

[0062] It should be noted that the key physical means to achieve 'stress release' lies in the fact that this timing-based opening and closing test fixture not only has a top pressure plate mechanism, but also a contoured support pin bed underneath that precisely conforms to the bottom contour and non-woven areas of the motherboard. During the torque tightening process in step S3, the forced pressing of the screws inevitably generates microscopic bending stress and assembly internal stress in local areas of the motherboard (especially inside multilayer boards). When the test fixture in this step presses down according to the calculated 'closing speed', and the motherboard is tightly fitted to the bottom support pin bed to enter the 'holding pressure time', this overall, uniform mechanical clamping force forces the motherboard to return to an absolutely flat state. During the continuous holding pressure period, the internal stress accumulated due to local tightening will be transmitted and released to a wide flat area through the microscopic creep effect of the material. This physical 'stress release' not only eliminates the motherboard's hidden mechanical deformation but also has a strong test exposure function: if the previous torque assembly caused microcracks (cold soldering or stress damage) on the component pads to be in a critical fracture state, these few seconds of forced stress release and flattening will physically pull the microcracks open, thus manifesting as open circuits or impedance abnormalities in the subsequent synchronous 'functional tests,' which will then be accurately intercepted by the system. This is the core error-proofing mechanism of this system, which deeply integrates mechanical stress control with electrical performance testing.

[0063] For example, following the example in step S3, the input stress state evaluation features Calculate the closing velocity parameters. Millimeters per second. Calculate the pressure holding time parameter. The timing-controlled opening and closing test fixture closed at approximately 25.9 mm / s, held for approximately 7.4 seconds, and acquired the test response signal. Functional status indicators were extracted from the signal; assuming 10 indicators were tested, including 3.3V, 5V, and 12V power supply voltages and the core chip reset signal, etc. The status assessment model check found that all 10 indicators were within the acceptable range. , The functional pass rate parameter was calculated. . judge satisfy ,but Not satisfied The system generates a quality interception judgment instruction of "intercept" because "stress state assessment characteristics are below the threshold".

[0064] S5. Based on the quality interception judgment instruction, the terminal station performs a two-way scanning and binding operation, associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention and traceability closed-loop data.

[0065] In a specific embodiment of the present invention, the end-station bidirectional scanning and binding operation is performed based on the quality interception judgment command, which associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention traceability closed-loop data, including: when the quality interception judgment command is parsed and the motherboard status is confirmed to be qualified, the end-station scanning device is activated.

[0066] The system manufacturing information code on the motherboard and the media access control address code of the network interface are read by the end-station scanning device.

[0067] The system manufacturing information code and media access control address code are concatenated and encrypted to update the motherboard lifecycle traceability file and generate a closed-loop data system for error prevention and traceability.

[0068] In a specific embodiment of the present invention, the system manufacturing information code and the media access control address code are concatenated and encrypted to update the motherboard lifecycle traceability file and generate full-chain error prevention and traceability closed-loop data, including: using a hash algorithm to perform one-way hash calculation on the system manufacturing information code and the media access control address code to generate a unique identity verification hash value.

[0069] The unique identity verification hash value is written as an index key value into the motherboard lifecycle traceability file for updating.

[0070] The updated motherboard lifecycle traceability profile is synchronized to the cloud-based manufacturing execution system to generate a closed-loop data loop for error prevention and traceability across the entire chain.

[0071] Specifically, the implementation of step S5 strictly depends on the quality interception judgment instruction generated in step S4. This instruction must contain a clear status identifier, such as its instruction content string being "allow" or "intercept". First, the quality interception judgment instruction is parsed. The system reads the instruction and compares whether the instruction content string is exactly equal to "allow". Only when the strings match perfectly can the system confirm that the motherboard status is qualified and then activate the physically waiting end-station scanning device via an electrical signal. This device typically contains two independent barcode scanners. If the instruction content is "intercept" or something else, the process terminates, and no further operations are performed.

[0072] After confirming the motherboard's qualification, a bidirectional scanning operation is performed using an activated end-station scanning device. The system controls the first scanning head to read the QR code on the motherboard's silkscreen or label. The decoded string is defined as the system manufacturing information code, which typically contains information such as the production batch and serial number. Simultaneously, the system controls the second scanning head to read the barcode pre-attached to the motherboard's network interface. The decoded string is defined as the Media Access Control Address code, a globally unique hardware address for network devices. The two scanning actions are triggered sequentially by the program and are ensured to be completed within 3 seconds. The two strings read are temporarily stored in memory variables.

[0073] Next, the system manufacturing information code and media access control address code are associated and the file is updated. This process is divided into three steps. First, data concatenation and encryption preparation are performed. The system concatenates the system manufacturing information code string and the media access control address code string with an invisible special delimiter, the ASCII code 0x1E, to form a long input string. Subsequently, the SHA-256 hash algorithm is used to perform a one-way hash calculation on this concatenated input string. The SHA-256 algorithm is an irreversible computation function that converts input data of arbitrary length into a 256-bit fixed-length output string. The generated 64-bit hexadecimal string is defined as a unique identity verification hash value. Its calculation formula can be expressed as: , where the symbol Represents the generated 64-bit hexadecimal hash value; symbol Represents the system manufacturing information code string; symbol Represents the media access control address code string; operator This represents string concatenation; 0x1E is the hexadecimal representation of the delimiter. This calculation ensures that even if only one character differs between the two source codes, the generated code will still produce the desired result. They will be completely different.

[0074] Then this unique identity verification hash value The system uses the creation number generated in step S1 as the primary key to locate the motherboard lifecycle traceability file record for that motherboard in the manufacturing execution system database. Then, it writes "Binding Status: Completed" to a specified field in this record and stores the "Binding Hash Value" in the "Binding Hash Value" field. At the same time, the current timestamp is recorded as the binding time. This operation essentially digitally anchors the physical motherboard to its network identity.

[0075] Finally, the system uses encrypted network protocols, such as TLS 1.3, to upload the updated motherboard lifecycle traceability file, containing the bound hash value, to the central database of the cloud-based manufacturing execution system. After the cloud database confirms receipt and storage, it returns a synchronization success receipt to the local system. Upon receiving this receipt, the local system generates a data credential containing the file number, binding time, hash value, and synchronization status. This credential marks the formal generation of the entire chain of error-proofing and traceability closed-loop data, which can be queried and verified in subsequent logistics, quality inspection, and after-sales processes.

[0076] For example, the quality interception judgment instruction string generated in step S4 is "Release". After system parsing, it confirms that the motherboard is qualified and activates the last-station scanning device. The first scanner reads the motherboard QR code and obtains the system manufacturing information code string "MB20240315001". The second scanner reads the network port barcode and obtains the media access control address code string "00:1A:2B:3C:4D:5E". The two codes are concatenated with a separator to form the input string "MB20240315001[0x1E]00:1A:2B:3C:4D:5E". The SHA-256 algorithm is applied to this string to calculate, assuming a unique identity verification hash value is generated. The hash value is "a1b2c3d4e5f67890123456789abcdef0123456789abcdef0123456789abcdef". The system locates the motherboard lifecycle traceability file with file number 2004450089, updates the binding status to "completed", and writes the above hash value into the corresponding field. This updated record is securely uploaded to the cloud, and the cloud returns a synchronization success signal. The system then generates a closed-loop data for full-chain error prevention and traceability, which includes the key index hash value "a1b2c3d4e5f67890123456789abcdef0123456789abcdef0123456789abcdef".

[0077] Reference Figure 2 The second aspect of the present invention provides a material traceability and error prevention binding system for PCB assembly process, including: a motherboard traceability file generation module, a component matching verification result generation module, a stress state assessment feature generation module, a quality interception judgment instruction generation module, and a traceability closed-loop data generation module.

[0078] The motherboard traceability file generation module is connected to the component matching verification result generation module. The component matching verification result generation module is connected to the stress state assessment feature generation module. The stress state assessment feature generation module is connected to the quality interception judgment instruction generation module. Both the motherboard traceability file generation module and the quality interception judgment instruction generation module are connected to the traceability closed-loop data generation module.

[0079] The motherboard traceability file generation module obtains the motherboard's system manufacturing information code for production filing and generates a motherboard lifecycle traceability file.

[0080] The component matching verification result generation module collects the brand attribute information of the core components to be assembled, compares the brand attribute information with the motherboard lifecycle traceability file, and generates the component matching verification result.

[0081] The stress state assessment feature generation module drives multi-level torque assembly equipment to perform plug-in operations based on the component matching verification results, obtains real-time torque data during the assembly process, and generates stress state assessment features based on the real-time torque data.

[0082] The quality interception judgment instruction generation module uses a timing opening and closing test fixture to perform stress release and functional tests on the assembled motherboard, obtains test response signals, and generates quality interception judgment instructions by combining stress state evaluation characteristics.

[0083] The traceability closed-loop data generation module performs a two-way barcode scanning and binding operation at the end station based on the quality interception judgment command. It associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention traceability closed-loop data.

[0084] The above content is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, and all such modifications or additions should fall within the protection scope of the present invention.

Claims

1. A method for material traceability and error prevention in PCB assembly process, characterized in that, include: S1. Obtain the system manufacturing information code of the motherboard for production filing and generate a motherboard lifecycle traceability file; S2. Collect the brand attribute information of the core components to be assembled, and compare the brand attribute information with the motherboard lifecycle traceability file to generate component matching verification results; S3. Drive the multi-level torque assembly equipment to perform plug-in operation based on the component matching verification results, obtain real-time torque data during the assembly process, and generate stress state evaluation features based on the real-time torque data. S4. Use a timing opening and closing test fixture to perform stress release and functional tests on the assembled motherboard, obtain test response signals, and generate quality interception judgment instructions in combination with stress state evaluation characteristics. S5. Based on the quality interception judgment instruction, the terminal station performs a two-way scanning and binding operation, associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention and traceability closed-loop data.

2. The material traceability and error-proofing binding method for a PCB assembly process according to claim 1, characterized in that, The process involves collecting the brand attribute information of the core components to be assembled, comparing the brand attribute information with the motherboard lifecycle traceability file, and generating component matching verification results, including: Extract the motherboard model and specification characteristics from the motherboard lifecycle traceability file; The surface silkscreen image of the core component to be assembled is obtained by image recognition equipment, and the features of the surface silkscreen image are extracted to generate brand attribute information. The manufacturer's brand information is correlated and matched with the motherboard model and specifications to generate component matching verification results.

3. The material traceability and error-proofing binding method for a PCB assembly process according to claim 2, characterized in that, The process of acquiring the surface silkscreen image of the core component to be assembled using an image recognition device, extracting features from the surface silkscreen image, and generating brand attribute information includes: The image recognition equipment is controlled to take multi-angle photos of the core components to be assembled, thereby obtaining multi-dimensional surface silkscreen images. Image denoising and edge enhancement are performed on multidimensional surface screen printing images to generate clearer screen printing images; The optical character recognition algorithm is used to extract text from the cleared silkscreen image to generate brand attribute information.

4. The material traceability and error-proofing binding method for a PCB insertion process according to claim 1, characterized in that, The process of driving a multi-level torque assembly device to perform plug-in operations based on component matching verification results, acquiring real-time torque data during the assembly process, and generating stress state assessment features based on the real-time torque data includes: Parse the component matching verification results to obtain the component type identifier, and determine the corresponding target torque threshold range based on the component type identifier; Control the multi-stage torque assembly equipment to perform fastening operations according to the target torque threshold range, and collect real-time torque data during the fastening process; Calculate the deviation between real-time torque data and the target torque threshold range, and generate stress state assessment features based on the deviation.

5. The material traceability and error-proofing binding method for a PCB insertion process according to claim 4, characterized in that, The calculation of the deviation between the real-time torque data and the target torque threshold range, and the generation of stress state assessment features based on the deviation, includes: Extract peak torque characteristics and torque change rate characteristics from real-time torque data; The peak torque characteristic is compared with the upper and lower limits of the target torque threshold range to obtain the peak deviation value; By combining the peak deviation value with the torque change rate characteristics, a weighted calculation is performed to generate stress state assessment characteristics.

6. The material traceability and error-proofing binding method for a PCB insertion process according to claim 1, characterized in that, The process of using a timing-based on / off test fixture to perform stress release and functional testing on the assembled motherboard, acquiring test response signals, and generating quality interception judgment instructions based on stress state assessment characteristics includes: The closing speed parameters and holding time parameters of the timing opening and closing test fixture are determined based on the stress state assessment characteristics. The timing opening and closing test fixture is controlled according to the closing speed parameter and the holding pressure time parameter to press the assembled motherboard and obtain the test response signal in the pressed state. The functional status index is obtained by analyzing the test response signal, and the functional status index is fused with the stress state assessment characteristics to generate a quality interception judgment command.

7. A material traceability and error-proofing binding method for a PCB assembly process according to claim 6, characterized in that, The process involves analyzing the test response signal to obtain functional status indicators, fusing these indicators with stress state assessment features, and generating a quality interception judgment instruction, including: The test response signal is subjected to analog-to-digital conversion and filtering to extract stable functional status indicators; The functional status indicators are input into the status assessment model for logical operations to obtain the functional pass rate parameter. Determine whether the function pass rate parameter is greater than or equal to the preset function pass rate threshold, and whether the stress state assessment feature is greater than or equal to the preset stress feature threshold. If both conditions are met, a release command is generated; otherwise, an interception command is generated.

8. The material traceability and error-proofing binding method for a PCB insertion process according to claim 1, characterized in that, The process of executing the end-station bidirectional barcode scanning and binding operation based on the quality interception judgment command associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention and traceability closed-loop data, including: When the quality interception judgment command confirms that the motherboard status is qualified, the last station scanning device is activated. The system manufacturing information code on the motherboard and the media access control address code of the network interface are read separately by the end-station scanning device. The system manufacturing information code and media access control address code are concatenated and encrypted to update the motherboard lifecycle traceability file and generate a closed-loop data system for error prevention and traceability.

9. A material traceability and error-proofing binding method for a PCB insertion process according to claim 8, characterized in that, The process of concatenating and encrypting the system manufacturing information code and media access control address code, updating the motherboard lifecycle traceability file, and generating a closed-loop data system for error prevention and traceability includes: A hash algorithm is used to perform one-way hash calculation on the system manufacturing information code and the media access control address code to generate a unique identity verification hash value. The unique identity verification hash value is written as an index key value into the motherboard lifecycle traceability file for updating; The updated motherboard lifecycle traceability profile is synchronized to the cloud-based manufacturing execution system to generate a closed-loop data loop for error prevention and traceability across the entire chain.

10. A material traceability and error-proofing binding system for PCB assembly process, characterized in that, include: The motherboard traceability file generation module obtains the system manufacturing information code of the motherboard for production filing and generates a motherboard lifecycle traceability file. The component matching verification result generation module collects the brand attribute information of the core components to be assembled, compares the brand attribute information with the motherboard lifecycle traceability file for consistency, and generates the component matching verification result. The stress state assessment feature generation module drives a multi-level torque assembly device to perform plug-in operations based on the component matching verification results, obtains real-time torque data during the assembly process, and generates stress state assessment features based on the real-time torque data. The quality interception judgment instruction generation module uses a timing opening and closing test fixture to perform stress release and functional tests on the assembled motherboard, obtains test response signals, and generates quality interception judgment instructions in combination with stress state evaluation characteristics. The traceability closed-loop data generation module performs a two-way barcode scanning and binding operation at the end station based on the quality interception judgment command. It associates the system manufacturing information code with the media access control address code, updates the motherboard lifecycle traceability file, and generates full-chain error prevention traceability closed-loop data.

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