An ultra-wideband high-isolation low-profile large-interval phased array antenna

Abstract

The application discloses an ultra-wideband high-isolation low-profile large-interval phased array antenna, and belongs to the technical field of phased array antennas. The antenna is composed of a plurality of two-dimensional periodically arranged antenna units, and the antenna unit comprises an antenna layer, an isolation layer, a resistive metasurface layer and a metal floor. The antenna layer is provided with orthogonal dual-polarized antenna units, and the antenna units are all double-layer PCB structures. The isolation layer is provided with orthogonal dual-polarized isolation units, and the isolation units are alternately arranged with the orthogonal grid of the antenna units. The isolation unit is a single-layer PCB structure, and is provided with a bent metal wire, a shielding patch and a lumped resistor. The resistive metasurface layer is composed of three cascaded FSS layers to form a filter structure, and is provided with through holes for the substrate to be inserted. The metal floor is provided with through holes for the substrate of the antenna layer to be assembled. The application can realize ultra-wideband, large-interval and low profile, improve channel isolation, suppress common-mode resonance and guarantee radiation efficiency.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, specifically to an ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna. Background Technology

[0002] The evolution of simultaneous transmit and receive (STAR) technology has made leveraging high isolation in the antenna domain to alleviate design pressures in the analog and digital domains an important technological approach. Simultaneously, large-pitch array strategies aimed at reducing the cost and complexity of large-scale arrays are also becoming a significant trend. This development direction presents new challenges for phased array antenna design: achieving excellent transmit and receive channel isolation characteristics while maintaining ultra-wide bandwidth, low profile, and large spacing. However, existing technologies are still insufficient under these multiple constraints: traditional Vivaldi antennas struggle to meet low-profile integration requirements; and while planar arrays, such as PUMA, offer the advantage of low profile, their bandwidth is limited to the tenth harmonic. Overcoming the bandwidth limitations imposed by the profile and eliminating the impact of harmful resonances on isolation under the premise of low profile and large spacing are pressing issues that need to be addressed.

[0003] Chinese invention patent CN115764331B proposes a high polarization isolation dual-polarized tightly coupled ultra-wideband phased array antenna, achieving an isolation of over 30dB. However, its bandwidth is limited to 4 times the frequency, which cannot meet the need for wider bandwidth.

[0004] In summary, existing high-isolation, low-profile phased array antennas generally suffer from technical defects such as narrow operating bandwidth, small array spacing, and difficulty in coordinating and optimizing bandwidth and isolation. They cannot simultaneously meet the comprehensive technical requirements of 10-octave ultra-wideband, large-spaced array, low-profile integration, and normal channel isolation exceeding 30dB. Currently, there is limited research on phased array antennas that address these multiple core performance indicators. Therefore, developing a phased array antenna that can overcome existing technical bottlenecks and simultaneously achieve the synergistic effects of ultra-wideband, high isolation, large spacing, and low profile has significant engineering value and practical implications. Summary of the Invention

[0005] To address the combined requirements of high isolation, large spacing, and low profile in ultra-wideband phased array antennas, this invention proposes an ultra-wideband, high-isolation, low-profile, large-spacing phased array antenna. This invention achieves a bandwidth of 22.5:1 and a normal channel isolation of greater than 30 dB with an array spacing greater than half the high-frequency wavelength and a low profile.

[0006] The technical solution adopted in this invention is as follows:

[0007] An ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna, comprising several two-dimensional periodically arranged antenna elements;

[0008] The antenna unit includes an antenna layer, an isolation layer, a resistive metasurface layer, and a metal ground plane;

[0009] The antenna layer includes horizontally polarized antenna units and vertically polarized antenna units that are orthogonally arranged with identical structures; both the horizontally polarized antenna units and the vertically polarized antenna units are vertically placed double-layer PCB structures.

[0010] The isolation layer includes horizontally polarized isolation units and vertically polarized isolation units that are orthogonally arranged with identical structures. The horizontally polarized isolation units are located at the midpoint of adjacent horizontally polarized antenna units, and the vertically polarized isolation units are located at the midpoint of adjacent vertically polarized antenna units. The antenna units and isolation units are arranged alternately in an orthogonal grid pattern to improve the channel isolation between antenna units and suppress common-mode resonance introduced by large spacing.

[0011] Both the horizontal polarization isolation unit and the vertical polarization isolation unit include a vertically placed single-layer PCB structure, a pair of bent metal lines, and a shielding patch. The bent metal lines are mirror-symmetrically arranged on the front or back of the single-layer PCB structure, with a first lumped resistor loaded in the middle and the bottom end coupled to the first FSS layer of the resistive metasurface layer, making the first FSS layer serve as the equivalent ground plane for high-frequency electromagnetic waves. The shielding patch is located on the front and back of the lower region of the single-layer PCB structure, and its width is the same as that of the single-layer PCB structure.

[0012] The resistive metasurface layer includes a first FSS layer, a second FSS layer, and a third FSS layer arranged in parallel from top to bottom. The three FSS layers form a three-stage cascaded filter structure to absorb the short-circuit point of low-frequency electromagnetic waves and reflect high-frequency electromagnetic waves, thereby improving radiation efficiency. At the same time, each FSS layer is provided with vertically aligned cross-shaped through holes and two peripheral rectangular through holes to allow for the interlocking assembly of the single-layer PCB structure of the isolation layer and the double-layer PCB structure of the antenna layer.

[0013] The metal floor is arranged parallel to the resistive metasurface layer below, and the metal floor has two peripheral rectangular through holes for the antenna layer double-layer PCB structure to be inserted and assembled.

[0014] Preferably, the array spacing of the phased array antenna is 0.55~0.65λ. H , λ H This is the wavelength corresponding to the highest operating frequency.

[0015] Preferably, the first FSS layer is a low-pass filter layer, the second FSS layer is a band-pass filter layer, and the third FSS layer is a band-pass filter layer.

[0016] Preferably, the double-layer PCB structure and the single-layer PCB structure are provided with mutually cooperating slot structures, and the antenna unit and the isolation unit are assembled in an orthogonal grid manner by engaging the slots.

[0017] Preferably, the lower sections of the horizontal polarization isolation unit and the vertical polarization isolation unit are narrowed in width and interlock to form a cross-shaped structure; the lower sections of the horizontal polarization antenna unit and the vertical polarization antenna unit are narrowed in width to pass through the peripheral rectangular through holes provided on the resistive metasurface layer and the metal floor, respectively.

[0018] Preferably, both the horizontally polarized antenna unit and the vertically polarized antenna unit include a double-layer PCB structure; the first outer surface of the double-layer PCB structure is printed with a microstrip line, a coupling patch A, a first short-circuit post A, and a second short-circuit post A, the middle layer is printed with an antenna unit FSS and a dipole radiator, and the second outer surface is printed with a microstrip line ground, a coupling patch B, a first short-circuit post B, a second short-circuit post B, and a rectangular open ring;

[0019] Among them, coupling patch A, first shorting post A, and second shorting post A have the same structure and projected coincidence with coupling patch B, first shorting post B, and second shorting post B, respectively;

[0020] The dipole radiator includes two symmetrically arranged dipole arms, and a feed point is provided at the adjacent top end of the two symmetrical dipole radiating arms.

[0021] The microstrip line and the microstrip line ground together constitute a microstrip line feed balun, which is used to feed the dipole radiator.

[0022] The coupling patch is projected to cover the gap between adjacent dipole radiators to enhance the coupling between adjacent dipole radiators, thereby expanding the bandwidth;

[0023] The first and second short-circuit pillars are symmetrically arranged on both sides of the microstrip line feed balun. The upper end is connected to the coupling patch, and the lower end is coupled to the first FSS layer to suppress common-mode resonance.

[0024] The antenna element FSS is positioned above the dipole radiator to improve impedance matching across the entire frequency band.

[0025] The rectangular open ring is a non-closed ring formed by corresponding openings in the upper and lower arms of a complete rectangular metal ring. The opening area allows the microstrip line to pass through, and a second lumped resistor is loaded in the middle of the left and right arms of the ring. The rectangular open ring works in conjunction with the resistive metasurface to extend the antenna bandwidth and improve radiation efficiency.

[0026] Preferably, the bent metal wire is composed of a first vertical segment, a second horizontal segment, a third vertical segment, and a fourth horizontal segment connected end to end from bottom to top. Each segment is bent at a right angle, and a first lumped resistor is loaded on the third vertical segment and set close to the edge of the single-layer PCB structure.

[0027] Preferably, the resistive conductive pattern layer of the first FSS layer includes a large square metal patch and a forked structure or a zigzag structure disposed between the large square patches.

[0028] The resistive conductive patterned layer of the second FSS layer includes a square metal ring surrounding the cross-shaped through hole;

[0029] The resistive conductive patterned layer of the third FSS layer includes a square metal ring surrounding the cross-shaped through hole, and a finger-like structure or a zigzag line structure is provided between adjacent square metal rings.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] To address the requirements of high isolation, large spacing, and low profile in ultra-wideband phased array antennas, this invention proposes an ultra-wideband, high-isolation, low-profile, large-spacing phased array antenna. First, this invention integrates a resistive metasurface layer into the phased array antenna. This structure consists of a filter structure formed by three cascaded layers: a first low-pass FSS layer, a second band-pass FSS layer, and a third band-pass FSS layer. This absorbs back-radiated electromagnetic waves from dipoles at short-circuit effect frequencies, effectively suppressing low-frequency short-circuit effects while extending the bandwidth and ensuring radiation efficiency remains within a reasonable range, extending the antenna bandwidth to 22.5:1. Simultaneously, rectangular open loops integrating a second lumped resistor are placed on both sides of the microstrip line ground of the antenna element, further optimizing the antenna radiation performance. Next, to suppress common-mode resonance introduced by the large-spacing array, this invention uses the bent metal wire of the isolation unit to treat the first FSS layer of the resistive metasurface layer as an equivalent ground plane for high-frequency electromagnetic waves, effectively suppressing common-mode resonance. Finally, a shielding patch is placed in the lower region of the isolation unit to effectively optimize the electric field uniformity between antenna elements and the orthogonality of different polarization electric fields, further improving the channel isolation between antenna elements. This invention can achieve an ultra-wideband ratio of 22.5:1 and a bandwidth of 0.6λ. H Large-pitch array, 0.07λ L It has a low profile height and a normal port isolation of better than 30dB. Attached Figure Description

[0032] Figure 1 This is a 3D schematic diagram and unit model of a phased array antenna according to an embodiment of the present invention;

[0033] Figure 2 This is an exploded view of the unit model of the phased array antenna according to an embodiment of the present invention;

[0034] Figure 3 This is an exploded view of the antenna element according to an embodiment of the present invention;

[0035] Figure 4 This is a front view of the antenna element according to an embodiment of the present invention;

[0036] Figure 5 This is a front view of the isolation unit according to an embodiment of the present invention;

[0037] Figure 6 This is an exploded view of the resistive metasurface layer according to an embodiment of the present invention;

[0038] Figure 7 This is a top view of each FSS layer of the resistive metasurface layer in an embodiment of the present invention;

[0039] Figure 8 This is a curve showing the channel isolation during scanning in the normal direction, as described in an embodiment of the present invention.

[0040] Figure 9 These are the active standing wave curves during normal and scanning operations in an embodiment of the present invention.

[0041] Figure reference numerals: 1. Antenna layer, 101. Antenna element FSS, 102. Rectangular coupling patch, 103. First shorting post, 104. Second shorting post, 105. Dipole radiator, 106. Rectangular open ring, 107. Second lumped resistor, 108. Microstrip line, 109. Microstrip line ground, 110. Double-layer PCB structure; 2. Isolation layer, 201. Bent metal wire, 202. First lumped resistor, 203. Shielding patch, 204. Single-layer PCB structure; 3. Resistive metasurface layer, 301. First FSS layer, 302. Second FSS layer, 303. Third FSS layer; 4. Metal ground plane. Detailed Implementation

[0042] The technical solutions of this invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. The components of this invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Furthermore, in the description of this invention, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] This embodiment provides an ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna operating in the 0.8-18 GHz frequency band. Figure 1 As shown, the antenna includes 7 The antenna elements are arranged in a two-dimensional periodic pattern. In this embodiment, the array spacing of the phased array antenna is 10 mm, which is approximately equal to 0.6λ. H , λ H The wavelength corresponding to the highest operating frequency is 28 mm, approximately equal to 0.07λ. L , λ L This is the wavelength corresponding to the lowest operating frequency.

[0044] like Figure 1 , Figure 2 As shown, the antenna unit includes an antenna layer, an isolation layer, a resistive metasurface layer, and a metal ground plane.

[0045] The antenna layer includes horizontally polarized antenna elements and vertically polarized antenna elements that are structurally identical and orthogonally arranged; for example... Figure 3 , Figure 4 As shown, both the horizontally polarized antenna unit and the vertically polarized antenna unit include a double-layer PCB structure, with the upper region of the double-layer PCB structure having a width of 10mm and the lower region having a width of 5mm.

[0046] The first outer side of the dual-layer PCB structure is printed with a microstrip line, a rectangular coupling patch A, a first shorting post A, and a second shorting post A. The middle layer is printed with an antenna element FSS and a dipole radiator. The second outer side is printed with a microstrip line ground, a rectangular coupling patch B, a first shorting post B, a second shorting post B, and a rectangular open ring.

[0047] The dipole radiator includes two symmetrically arranged dipole arms, and a feed point is provided at the adjacent top end of the two symmetrical dipole radiating arms.

[0048] The microstrip line and the microstrip line ground together constitute a broadband microstrip line feed balun, which is connected to the feed point of the dipole radiator through a metal via and a metal feed line, thus feeding the dipole radiator.

[0049] Among them, rectangular coupling patch A, first shorting post A, and second shorting post A have the same structure and project to overlap with rectangular coupling patch B, first shorting post B, and second shorting post B, respectively.

[0050] A rectangular coupling patch is projected to cover the gap between adjacent dipole radiators to enhance the coupling between adjacent dipole radiators, thereby expanding the bandwidth.

[0051] The first and second short-circuit posts are symmetrically arranged on both sides of the microstrip line feed balun. The upper end is connected to the coupling patch, and the lower end is coupled to the first FSS layer to suppress common-mode resonance.

[0052] The antenna element FSS is positioned above the dipole radiator and includes two rows of periodically arranged rectangular metal patches to improve impedance matching across the entire frequency band.

[0053] The rectangular open ring is a non-closed ring formed by corresponding openings in the upper and lower arms of a complete rectangular metal ring. The opening area is for the microstrip line to pass through. A second lumped resistor with a resistance of 10 ohms is loaded in the middle part of the left and right arms of the ring. The rectangular open ring works in conjunction with the resistive metasurface to extend the antenna bandwidth and improve radiation efficiency.

[0054] The isolation layer includes horizontally polarized isolation units and vertically polarized isolation units that are orthogonally arranged with identical structures. The horizontally polarized isolation units are located at the midpoint of adjacent horizontally polarized antenna units, and the vertically polarized isolation units are located at the midpoint of adjacent vertically polarized antenna units. The antenna units and isolation units are arranged alternately in an orthogonal grid pattern to improve the channel isolation between antenna units and suppress common-mode resonance introduced by large spacing.

[0055] The horizontal polarization isolation unit and the vertical polarization isolation unit, such as Figure 5 As shown, each includes a vertically placed single-layer PCB structure, a pair of bent metal lines, and a shielding patch.

[0056] The upper region of the single-layer PCB structure has a width of 10mm, and the lower region has a width of 5mm.

[0057] The bent metal wire is mirror-symmetrically arranged on the front of the single-layer PCB structure. It consists of a first vertical segment, a second horizontal segment, a third vertical segment, and a fourth horizontal segment connected end to end from bottom to top. Each segment is bent at a right angle and has lengths of 1.8mm, 0.8mm, 1.6mm, and 0.8mm, respectively. The third vertical segment is located near the edge of the single-layer PCB structure and has a first lumped resistor with a resistance of 10 ohms loaded in the middle.

[0058] The bottom end of the first vertical segment is coupled to the first FSS layer of the resistive metasurface layer, making the first FSS layer serve as the equivalent ground plane for high-frequency electromagnetic waves.

[0059] The shielding patch is disposed on the front and back of the lower region of the single-layer PCB structure, with a distance of 2mm from the metal ground plane, the same width as the single-layer PCB structure, and a length of 6mm.

[0060] The resistive metasurface layer, such as Figure 6 , Figure 7 As shown, the structure includes a first FSS low-pass layer, a second FSS band-pass layer, and a third FSS band-pass layer arranged in parallel from top to bottom. These three FSS layers form a three-stage cascaded filter structure to absorb low-frequency electromagnetic waves at short-circuit points and reflect high-frequency electromagnetic waves, thereby improving radiation efficiency. Simultaneously, each FSS layer has vertically aligned cross-shaped through-holes and two peripheral rectangular through-holes to allow for the interlocking assembly of a single-layer PCB structure for the isolation layer and a double-layer PCB structure for the antenna layer. In this embodiment, the resistive conductive pattern layer of the first FSS layer includes a large square metal patch with a side length of 7mm. A forked structure is provided between the large square patches, with the width of the interlocking fingers and the gap being 0.1mm. The resistive conductive pattern layer of the second FSS layer includes a square metal ring surrounding the cross-shaped through-holes, with an outer side length of 7mm and a line width of 0.35mm. The resistive conductive patterned layer of the third FSS layer includes a square metal ring surrounding the cross-shaped through hole, with an outer side length of 8 mm and a line width of 0.2 mm. A finger-like structure is provided between adjacent square metal rings, with the interlocking fingers and the gap width being 0.2 mm.

[0061] The metal floor is arranged parallel to the resistive metasurface layer below, and the metal floor has two peripheral rectangular through holes for the antenna layer double-layer PCB structure to be inserted and assembled.

[0062] Figure 8 The isolation curves of the antenna in this embodiment at different scanning angles are given. It can be seen that the normal isolation is higher than 30dB within the operating frequency band. Figure 9The active standing wave (VSWR) curves of the antenna in this embodiment at different scanning angles are presented. It can be seen that the antenna can achieve an active VSWR of less than 3 within a bandwidth of 22.5 octaves (0.8-18 GHz). Furthermore, with the array spacing of this embodiment, the number of channels in the same antenna area will be reduced by 17%, effectively reducing cost and the integration difficulty of the RF front-end.

[0063] The above description is merely an embodiment of the present invention and is not intended to limit the scope of protection of the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna, comprising several two-dimensional periodically arranged antenna elements; Its features are, The antenna unit includes an antenna layer, an isolation layer, a resistive metasurface layer, and a metal ground plane; The antenna layer includes horizontally polarized antenna elements and vertically polarized antenna elements with identical structures and orthogonally arranged; both the horizontally polarized antenna elements and the vertically polarized antenna elements are vertically placed double-layer PCB structures. The isolation layer includes horizontally polarized isolation units and vertically polarized isolation units that are orthogonally arranged with identical structures. The horizontally polarized isolation units are located at the midpoint of adjacent horizontally polarized antenna units, and the vertically polarized isolation units are located at the midpoint of adjacent vertically polarized antenna units. The antenna units and isolation units are arranged alternately in an orthogonal grid pattern to improve the channel isolation between antenna units and suppress common-mode resonance introduced by large spacing. Both the horizontal polarization isolation unit and the vertical polarization isolation unit include a vertically placed single-layer PCB structure, a pair of bent metal lines, and a shielding patch. The bent metal lines are mirror-symmetrically arranged on the front or back of the single-layer PCB structure, with a first lumped resistor loaded in the middle and the bottom end coupled to the first FSS layer of the resistive metasurface layer, making the first FSS layer serve as the equivalent ground plane for high-frequency electromagnetic waves. The shielding patch is located on the front and back of the lower region of the single-layer PCB structure, and its width is the same as that of the single-layer PCB structure. The resistive metasurface layer includes a first FSS layer, a second FSS layer, and a third FSS layer arranged in parallel from top to bottom. The three FSS layers form a three-stage cascaded filter structure to absorb the short-circuit point of low-frequency electromagnetic waves and reflect high-frequency electromagnetic waves, thereby improving radiation efficiency. At the same time, each FSS layer is provided with vertically aligned cross-shaped through holes and two peripheral rectangular through holes to allow for the interlocking assembly of the single-layer PCB structure of the isolation layer and the double-layer PCB structure of the antenna layer. The metal floor is arranged parallel to the resistive metasurface layer below, and the metal floor has two peripheral rectangular through holes for the antenna layer double-layer PCB structure to be inserted and assembled.

2. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 1, characterized in that, The phased array antenna spacing is 0.55~0.65λ. H , λ H This is the wavelength corresponding to the highest operating frequency.

3. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 2, characterized in that, The first FSS layer is a low-pass filter layer, the second FSS layer is a band-pass filter layer, and the third FSS layer is a band-pass filter layer.

4. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in any one of claims 1-3, characterized in that, The double-layer PCB structure and the single-layer PCB structure are provided with mutually cooperating slot structures, and the antenna unit and the isolation unit are assembled in an orthogonal grid manner by the slots engaging.

5. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 4, characterized in that, The lower sections of the horizontally polarized isolation unit and the vertically polarized isolation unit are narrowed in width and interlock to form a cross-shaped structure; the lower sections of the horizontally polarized antenna unit and the vertically polarized antenna unit are narrowed in width to pass through the peripheral rectangular through holes set in the resistive metasurface layer and the metal floor, respectively.

6. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 5, characterized in that, Both the horizontally polarized antenna unit and the vertically polarized antenna unit include a double-layer PCB structure. The first outer side of the double-layer PCB structure is printed with a microstrip line, a coupling patch A, a first short-circuit post A, and a second short-circuit post A. The middle layer is printed with an antenna unit FSS and a dipole radiator. The second outer side is printed with a microstrip line ground, a coupling patch B, a first short-circuit post B, a second short-circuit post B, and a rectangular open ring. Among them, coupling patch A, first shorting post A, and second shorting post A have the same structure and projected coincidence with coupling patch B, first shorting post B, and second shorting post B, respectively; The dipole radiator includes two symmetrically arranged dipole arms, and a feed point is provided at the adjacent top end of the two symmetrical dipole radiating arms. The microstrip line and the microstrip line ground together constitute a microstrip line feed balun, which is used to feed the dipole radiator. The coupling patch is projected to cover the gap between adjacent dipole radiators to enhance the coupling between adjacent dipole radiators, thereby expanding the bandwidth; The first and second short-circuit pillars are symmetrically arranged on both sides of the microstrip line feed balun. The upper end is connected to the coupling patch, and the lower end is coupled to the first FSS layer to suppress common-mode resonance. The antenna element FSS is positioned above the dipole radiator to improve impedance matching across the entire frequency band. The rectangular open ring is a non-closed ring formed by corresponding openings in the upper and lower arms of a complete rectangular metal ring. The opening area allows the microstrip line to pass through, and a second lumped resistor is loaded in the middle of the left and right arms of the ring. The rectangular open ring works in conjunction with the resistive metasurface to extend the antenna bandwidth and improve radiation efficiency.

7. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 5, characterized in that, The bent metal wire is composed of a first vertical segment, a second horizontal segment, a third vertical segment, and a fourth horizontal segment connected end to end from bottom to top. Each segment is bent at a right angle, and a first lumped resistor is loaded on the third vertical segment and set close to the edge of the single-layer PCB structure.

8. The ultra-wideband, high-isolation, low-profile, large-pitch phased array antenna as described in claim 5, characterized in that, The resistive conductive patterned layer of the first FSS layer includes a large square metal patch and a forked structure or a zigzag structure disposed between the large square patch. The resistive conductive patterned layer of the second FSS layer includes a square metal ring surrounding the cross-shaped through hole; The resistive conductive patterned layer of the third FSS layer includes a square metal ring surrounding the cross-shaped through hole, and a finger-like structure or a zigzag line structure is provided between adjacent square metal rings.

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