Plate heat exchanger cooling element

Abstract

The application relates to a plate heat exchange cooling element, and relates to the technical field of heat exchange or heat transfer equipment parts. In order to solve the problem that heat interference between heat sources cannot be effectively inhibited and the temperature distribution uniformity of the heat source surface is poor when the existing micro-channel hollow plate body works simultaneously under multiple heat sources, the bottom surface of the hollow plate body is directly attached to the back surface of the heat source module; a TPMS heat exchange structure is arranged in the inlet cavity at the bottom center of the hollow plate body; a spider web radiation type flow channel structure is arranged in the hollow plate body and is in communication with the periphery of the TPMS heat exchange structure; a cooling liquid inlet is arranged at the bottom center of the hollow plate body and is in communication with the TPMS heat exchange structure; and at least one cooling liquid outlet is arranged at the side edge of the hollow plate body and is in communication with the spider web radiation type flow channel structure. The application is used for heat dissipation of the heat source module and can be widely applied to heat dissipation scenes of electronic devices, optoelectronic modules and other micro-distance heat source arrays.

Description

Technical Field

[0001] This invention belongs to the technical field of heat exchange or heat transfer equipment components, specifically relating to a plate-type heat exchange cooling element. This cooling element is used in the heat dissipation environment of electronic devices, optoelectronic modules, or battery packs. Background Technology

[0002] With the rapid development of highly integrated, high-power-density micro-particle heat source arrays (such as multi-chip modules, LED arrays, and battery modules), chip integration and power consumption continue to rise. Core computing and scheduling modules in system-level applications such as phased array antennas, core IGBT modules for electric vehicles, and optoelectronic co-packaged CPOs face unprecedented thermal management challenges. In high-density operating environments, the instantaneous local heat flux density of chips can even exceed the extremely high threshold of 800 W / cm². Traditional natural heat dissipation, air cooling, and even conventional liquid cooling radiators are gradually becoming inadequate for such extreme conditions. Liquid cooling technology, due to its high heat dissipation efficiency, has gradually become the mainstream solution for high-power chip thermal management. Among these, microchannel hollow plates are widely used in liquid cooling systems for high-density computing modules due to their compact structure, direct contact with heat sources, and ease of system integration.

[0003] Traditional direct-flow microchannel heat sinks have parallel flow channels with coolant flowing in a single direction. This structure has inherent drawbacks: firstly, the coolant flows primarily in laminar form within the straight channels, resulting in insufficient heat exchange between the near-wall fluid and the main flow area, hindering the formation of strong turbulence and limiting the convective heat transfer coefficient; secondly, the coolant's temperature gradually increases as it absorbs heat along the flow path, creating a significant temperature gradient along the flow direction at the heat source surface. To overcome this heat transfer barrier, the industry has begun using direct-contact cooling solutions to eliminate the thermal resistance of the first thermal interface material, TIM1. However, even with direct-contact solutions, existing conventional direct-flow heat sinks still exhibit serious performance deficiencies when facing the extreme non-uniform thermal loads commonly found in heterogeneous integrated packaging. Especially in extremely narrow layouts where the spacing between multiple cores is reduced to the hundreds of micrometers, traditional direct-flow designs cannot dynamically optimize the flow field based on hotspot distribution. This leads to a rapid temperature increase of the coolant after passing through the high heat source at the front end, resulting in severe localized overheating and thermal crosstalk between adjacent cores.

[0004] To address the issue of uneven heat dissipation in straight channels, researchers have proposed using topologies such as curved channels, wavy channels, biomimetic fractal channels, or spiderweb-like channels to increase fluid turbulence and extend the heat transfer path. In recent years, three-period minimal surface modulated surfaces (TPMS) have also attracted attention in the heat exchanger field due to their high specific surface area, good three-dimensional connectivity, and strong flow field disturbance capability. However, the aforementioned existing improvement schemes mostly focus on single-dimensional channel optimization or heat transfer enhancement under specific scenarios.

[0005] When dealing with heterogeneous chip integration scenarios with extremely narrow spacing between multiple cores and significant differences in heat flux density, existing solutions struggle to dynamically optimize the flow field based on hotspot distribution. Heat from the central hotspot region easily diffuses to the surrounding areas, causing crosstalk between heat sources. Consequently, the standard deviation of the temperature distribution on the surface of the heat sources is difficult to control within an ideal range.

[0006] In summary, existing microchannel hollow plates have problems such as difficulty in effectively suppressing thermal crosstalk between heat sources and poor temperature distribution uniformity on the surface of heat sources when multiple heat sources are working simultaneously. Summary of the Invention

[0007] The purpose of this invention is to solve the problems of existing microchannel hollow plates, such as difficulty in effectively suppressing thermal crosstalk between heat sources and poor temperature distribution uniformity on the surface of heat sources when multiple heat sources are working simultaneously. Therefore, this invention provides a plate-type heat exchange cooling element.

[0008] The technical solution of the present invention is: a plate heat exchange cooling element, comprising a hollow plate, a TPMS heat exchange structure, a spider web radial flow channel structure, a coolant inlet and at least one coolant outlet;

[0009] The bottom surface of the hollow plate is directly attached to the back of the heat source; the TPMS heat exchange structure is located in the inlet cavity at the center of the bottom of the hollow plate; the spider web radial flow channel structure is located inside the hollow plate and is connected to the periphery of the TPMS heat exchange structure; the coolant inlet is located at the center of the bottom of the hollow plate and is connected to the TPMS heat exchange structure; at least one coolant outlet is located at the side edge of the hollow plate and is connected to the spider web radial flow channel structure.

[0010] Coolant is vertically injected into the TPMS heat exchange structure through the coolant inlet. The jet impacts the inner wall of the hollow plate directly below the heat source, forming a stagnation heat exchange zone. Subsequently, the coolant enters the spiderweb-radial flow channel structure and is diverted and diffused, finally being discharged from the coolant outlet.

[0011] Preferably, the wall thickness of the TPMS heat exchange structure increases gradually from the coolant inlet side to the bottom surface of the hollow plate.

[0012] Preferably, the wall thickness of the TPMS heat exchange structure gradually increases from 0.15 mm to 0.20 mm along the jet direction.

[0013] Preferably, the TPMS heat exchange structure is made of pure copper material and manufactured by 3D printing.

[0014] Furthermore, the spiderweb-shaped radial flow channel structure extends radially layer by layer from the periphery of the TPMS heat exchange structure to the edge of the hollow plate.

[0015] Furthermore, the spiderweb-radial flow channel structure includes multi-level polygonal branch channels, longitudinal branch main channels, transverse confluence main channels, left outlet channels, and right outlet channels. The longitudinal branch main channels and transverse confluence main channels are installed on the multi-level polygonal branch channels in a cross-shaped manner with the TPMS heat exchange structure as the center, and are connected to the spiderweb-like microchannels in the multi-level polygonal branch channels. The left outlet channels and right outlet channels are respectively installed on the transverse confluence main channels.

[0016] Preferably, the number of multi-level polygonal branch channels is 10-13 layers, the width of each branch channel is 0.25-0.35mm, and the spacing between adjacent branches is 0.3mm.

[0017] Preferably, the depth of the spiderweb-shaped microchannels in the spiderweb radial flow channel structure is 1.5 mm, and the width of the left and right outlet channels is 1.5 mm.

[0018] Preferably, there are two coolant outlets, symmetrically arranged on both sides of the hollow plate.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] This invention employs a direct-contact microchannel heat dissipation structure. Coolant is injected vertically from the central inlet, impacting the bottom surface of the hollow plate directly below the first heat source, forming stagnation point heat transfer; the high heat transfer surface of the TPMS heat transfer structure disperses the flow boundary layer, generating turbulent disturbance; subsequently, the coolant is distributed and diffused stepwise towards the second heat sources on both sides through a spiderweb-radial flow channel structure.

[0021] Under the same operating conditions, compared with the traditional DC channel heat sink, the highest temperature of the first heat source of the present invention is reduced from 69.6℃ to 61.07℃, which reduces the risk of thermal failure caused by extreme hot spots and is conducive to the stable operation of the high-density integrated heat source module.

[0022] The coolant flows outwards from the center in stages, preferentially flowing through the first heat source and then uniformly covering the area where the second heat source is located, thus improving the temperature uniformity of each heat source surface. In a conventional direct-flow reference, the maximum temperature standard deviation between heat source surfaces is 4.96℃, while this invention controls it to 2.6℃. Simultaneously, as the coolant flows from the central high-pressure area to the low-pressure areas on both sides, it continuously carries away heat from the extremely narrow gap, blocking the heat conduction path between the first and second heat sources and suppressing thermal crosstalk under such narrow spacing.

[0023] The complex internal flow channels within the hollow plate structure, while increasing the flow pressure drop from 12.02 kPa to approximately 30.55 kPa, remain within the normal operating range of a data center liquid-cooled pumping system. This system maintains a reasonable pressure drop while reducing hotspot temperatures, improving temperature distribution uniformity, and enhancing overall system reliability. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall assembly of the heat source module and the microchannel heat dissipation system.

[0025] Figure 2 This is a top view of the internal fluid domain structure of the hollow plate of the present invention (the figure shows TPMS filling in Example 1 as an example).

[0026] Figure 3 This is a front view schematic diagram of the internal fluid domain structure of the hollow plate body of the present invention.

[0027] Figure 4 This is a cross-sectional view of the hollow plate body along the center line of the outlet flow channel in Embodiment 1 of the present invention.

[0028] Figure 5 This is a cross-sectional view of the hollow plate body along the center line of the outlet flow channel in Embodiment 2 of the present invention.

[0029] Figure 6 This is a schematic diagram of the TPMS filling structure inside the inlet cylindrical cavity of Embodiment 1 of the present invention.

[0030] Figure 7 This is a schematic diagram of the TPMS filling structure inside the inlet cylindrical cavity of Embodiment 2 of the present invention.

[0031] Figure 8 This is a cross-sectional view of the grid perpendicular to the plane where the entrance is located in Embodiment 1 of the present invention.

[0032] Figure 9 yes Figure 8 A magnified view of a portion at point A, where point A is the TPMS heat exchange region.

[0033] Figure 10 These are the heat source surface temperature cloud maps of the embodiments of the present invention and the straight channel reference model, wherein (a) is the heat source surface temperature cloud map of Embodiment 1, (b) is the heat source surface temperature cloud map of the straight channel model, and (c) is the heat source surface temperature cloud map of Embodiment 2.

[0034] Figure 11 These are velocity and pressure cloud maps at the center cross-section of the microchannel in Embodiment 1 of the present invention, wherein (a) is the velocity cloud map at the center cross-section and (b) is the pressure cloud map at the center cross-section.

[0035] Figure 12 These are velocity and pressure cloud maps at the center section of the microchannel in Embodiment 2 of the present invention, wherein (a) is the velocity cloud map at the center section and (b) is the pressure cloud map at the center section.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. First heat source; 2. Second heat source; 3. Hollow plate; 4. TPMS heat exchange structure; 41. TPMS filled cavity inlet; 5. Spiderweb radial flow channel structure; 51. Multi-level polygonal branch channels; 52. Longitudinal branch main channel; 53. Lateral confluence main channel; 54. Left outlet channel; 55. Right outlet channel; 6. Coolant inlet; 7. Coolant outlet; 8. CFD model inlet. Detailed Implementation

[0038] Specific implementation method one: Combining Figures 1 to 7 This embodiment describes a plate-type heat exchange cooling element used to dissipate heat from a heat source module with a micron-level spacing between adjacent heat sources. The heat source module includes a first heat source 1 and second heat sources 2 symmetrically distributed on both sides of the first heat source 1. It includes a hollow plate 3, a TPMS heat exchange structure 4, a spiderweb-radial flow channel structure 5, a coolant inlet 6, and at least one coolant outlet 7. The bottom surface of the hollow plate 3 is directly attached to the back surface of the heat source module. The TPMS heat exchange structure 4 is disposed within the inlet cavity at the center of the bottom of the hollow plate 3. The spiderweb-radial flow channel structure 5 is disposed within the hollow plate 3. The plate 3 is internal and connected to the periphery of the TPMS heat exchange structure 4; the coolant inlet 6 is located at the bottom center of the hollow plate 3 and is connected to the TPMS heat exchange structure 4; at least one coolant outlet 7 is located at the side edge of the hollow plate 3 and is connected to the spider web radial flow channel structure 5; the coolant is vertically injected into the TPMS heat exchange structure 4 through the coolant inlet 6, and the jet impacts the inner wall surface of the bottom surface of the hollow plate 3 directly below the first heat source 1, forming a stagnation heat exchange zone; then the coolant enters the spider web radial flow channel structure 5 and is diverted and diffused in the direction of the second heat source 2, and finally discharged from the coolant outlet 7.

[0039] In this embodiment, the TPMS heat exchange structure 4 has a TPMS filling cavity inlet 41. The TPMS heat exchange structure 4 is connected to the coolant inlet 6 through a CFD model inlet 8.

[0040] This invention proposes a direct-contact microchannel heat dissipation system for heterogeneous heat sources in high heat flux density electronic devices, aiming to solve the problems of localized overheating and severe thermal crosstalk caused by extremely uneven thermal loads in high-power heat source modules and their surrounding heterogeneous components (such as high-speed memory or dedicated accelerator chips) under three-dimensional packaging or ultra-narrow pitch high-density surface mounts. The overall structure includes a high-density heterogeneous heat source module and a hollow plate 3 covering the high-density heterogeneous heat source module. The heat source module includes a first heat source 1 with extremely high heat flux density (such as a core scheduling general computing cluster chip) and a second heat source 2 (such as a dedicated tensor matrix accelerator chip) symmetrically distributed on both sides with high heat flux density and a large area. The first heat source 1 and the second heat source 2 are arranged in a very compact micro-pitch on the packaging substrate. The hollow plate adopts a direct-contact packaging heat dissipation strategy, completely eliminating the traditional first thermal interface material (TIM1 layer). Its bottom effective heat dissipation contact surface is directly or separated by an extremely thin TIM2 layer and is bonded to the back of the heterogeneous heat source module.

[0041] The hollow plate has a specific centrally symmetrical fluid chamber inside. The chamber has a vertical fluid inlet structure in the core heating area corresponding to the high heat source module (i.e. directly below the first heat source 1), and fluid outlet structures (i.e. coolant outlets 7) are provided at the two side edges of the hollow plate.

[0042] The core flow channel design and working principle of this invention are as follows: synergistic heat exchange is achieved using jet impact and three-period minimal surface matte (TPMS), and the fluid is diverted and dispersed through a spiderweb-like microchannel. Specifically, the cryogenic coolant is injected through a central vertical inlet, and the jet impacts the bottom surface of the hollow plate directly below the first heat source and part of the second heat source, thereby forming a highly efficient stagnant heat exchange zone with an extremely high surface heat transfer coefficient. Furthermore, to further break the flow boundary layer generated by the jet impact and significantly expand the effective heat exchange area, the central impact zone is surrounded by a TPMS heat exchange structure with a complex three-dimensional interconnected network, replacing the traditional needle-fin array. After impacting the bottom surface, the coolant enters the TPMS pores, where it generates strong turbulent disturbances, secondary flows, and alternating flow directions under the guidance of its complex three-dimensional curved surface. This achieves efficient convective heat exchange in the core high heat flux density zone, precisely and rapidly eliminating extreme hot spots on the first heat source 1. Subsequently, the coolant, having absorbed core heat, diverts and diffuses from the central TPMS heat exchange area outwards into a spiderweb-like multi-level microchannel region. The spiderweb-like structure effectively extends the heat exchange path of the fluid, and the spiderweb-like microchannels fully cover the outer area of ​​the first heat source 1 and the extended area of ​​the second heat source 2. This design significantly improves the temperature uniformity of each heat source, thereby effectively suppressing heat source warping caused by uneven thermal stress.

[0043] This invention is based on the flow characteristics of fluid radiating from the center to both sides. The coolant flowing out from the central high-pressure zone effectively dissipates the heat generated between the narrowly spaced first heat source 1 and second heat source 2 as it flows outward. The aforementioned spatial layout, integrating a central jet, TPMS enhancement, and peripheral radiating channels, preferentially distributes the initial low-temperature coolant to the first heat source 1, which has a high heat flux density in the core heat source module, effectively blocking heat conduction and crosstalk from the central hot spot to the second heat sources 2 on both sides. Finally, the heated fluid converges at the coolant outlets 7 on both sides of the hollow plate 3 and is discharged, thus achieving uniform heat dissipation across the entire high-density heat source module and ensuring stable system operation.

[0044] Specific Implementation Method Two: Combining Figure 1 In this embodiment, the micron-level spacing between adjacent heat sources is 0.05-0.15 mm.

[0045] With this configuration, the present invention is preferably applicable to heat source modules where the distance between adjacent heat sources is only 0.05mm to 0.15mm. At this distance, the first heat source 1 and the second heat source 2 are very close together, and the heat generated by the first heat source 1 can easily be transferred directly to the second heat source 2 through the gap, causing thermal crosstalk. The present invention employs a method of prioritizing cooling of the first heat source 1 with a central jet, and then diverting the jet to both sides to cool the second heat source 2, thus carrying away the heat before it is conducted, thereby suppressing thermal crosstalk.

[0046] Specific implementation method three: Combining Figure 6 and Figure 7 In this embodiment, the wall thickness of the TPMS heat exchange structure 4 increases gradually from the coolant inlet 6 side to the bottom surface of the hollow plate 3.

[0047] This design allows the coolant to gradually encounter greater flow resistance along the jet path, enhancing the disruption of the thermal boundary layer and improving the heat exchange efficiency in the core hot spot area.

[0048] Specific implementation method four: Combination Figure 6 and Figure 7 In this embodiment, the wall thickness of the TPMS heat exchange structure 4 gradually increases from 0.15 mm to 0.20 mm along the jet direction.

[0049] With this configuration, the coolant is guided to generate stronger turbulent disturbances in the core area of ​​the jet impact by gradually increasing the wall thickness, breaking the thermal boundary layer and enhancing local heat transfer to cope with the high heat flux density of the extreme hot spot at the center of the first heat source 1.

[0050] Specific Implementation Method Five: Combining Figure 6 and Figure 7 This embodiment describes a TPMS heat exchange structure 4 manufactured using pure copper material via 3D printing.

[0051] With this configuration, this embodiment, as a preferred method, utilizes the high thermal conductivity of pure copper to quickly transfer heat, while simultaneously using 3D printing technology to achieve the one-piece molding of complex TPMS curved surface structures that cannot be completed by traditional machining.

[0052] Specific Implementation Method Six: Combination Figures 2 to 5 In this embodiment, the spiderweb-radial flow channel structure 5 extends radially from the periphery of the TPMS heat exchange structure 4 to the edge of the hollow plate 3, layer by layer.

[0053] This design facilitates the uniform guidance of the coolant flowing through the TPMS heat exchange structure from the central area to the areas where the second heat sources are located on both sides, extending the heat exchange path and improving the temperature uniformity of each heat source surface.

[0054] Specific implementation method seven: Combining Figures 2 to 5 This embodiment describes a spiderweb-radial flow channel structure 5, which includes multi-level polygonal branch channels 51, longitudinal branch main channels 52, transverse converging main channels 53, left outlet channels 54, and right outlet channels 55. The longitudinal branch main channels 52 and transverse converging main channels 53 are installed on the multi-level polygonal branch channels 51 in a cross-shaped manner with the TPMS heat exchange structure 4 as the center, and are connected to the spiderweb-like microchannels within the multi-level polygonal branch channels 51. The left outlet channels 54 and right outlet channels 55 are respectively installed on the transverse converging main channels 53.

[0055] With this configuration, this embodiment constructs a flow channel network consisting of a cross-shaped longitudinal main channel 52 and multi-level polygonal branch channels 51, which guides the coolant from the central TPMS heat exchange area to the left and right sides quickly and evenly, and finally discharges it through the channel of the coolant outlet 7, ensuring that the second heat sources 2 on both sides are cooled evenly.

[0056] Specific implementation method eight: Combination Figures 2 to 5 In this embodiment, the number of multi-level polygonal branch channels 51 is 10-13 layers, the width of each layer of branch channel is 0.25-0.35mm, and the spacing between adjacent branch channels is 0.3mm.

[0057] This configuration, by controlling the number of layers, width, and spacing of the branch channels, forms a spiderweb-like flow channel structure that expands layer by layer, ensuring that the coolant maintains an appropriate flow velocity and flow resistance during the flow process, and ensuring that the coolant can uniformly cover the entire area where the second heat source 2 is located.

[0058] Specific Implementation Method Nine: Combining Figure 1 and Figure 2This embodiment describes a spiderweb-like microchannel with a depth of 1.5 mm and widths of 1.5 mm for the left outlet channel 54 and the right outlet channel 55.

[0059] This configuration ensures that the coolant maintains a high flow rate within the microchannels to enhance heat transfer, while matching the outlet channel depth with the microchannel depth to avoid additional local pressure drops caused by abrupt changes in cross-section.

[0060] Specific Implementation Method Ten: Combining Figures 1 to 5 In this embodiment, there are two coolant outlets 7, which are symmetrically arranged on both sides of the hollow plate 3.

[0061] This configuration allows the coolant to flow symmetrically from the central TPMS heat exchange area to both sides with equal path lengths, ensuring that the second heat source 2 on both sides receives the same cooling effect and preventing one side from overheating and the other side from becoming too cold.

[0062] In practical applications and CFD (Computational Fluid Dynamics) simulation verification, the high heat flux density heterogeneous heat source direct-contact microchannel heat dissipation system of this invention serves as the core cooling component and is applied to the computing module of electronic devices based on high-density 2.5D heterogeneous packaging.

[0063] This module comprises a primary heat source 1 (e.g., the central control core particle) measuring 5mm × 5mm and two secondary heat sources 2 (e.g., acceleration core particles) symmetrically distributed on either side, each measuring 3mm × 9mm. The distance between adjacent heat sources is only 0.1mm. The background high heat flux density of both types of heat sources (i.e., primary heat source 1 and secondary heat source 2) is set to 300W / cm², and an extreme hot spot region of 1.5mm × 1.5mm exists at the very center of primary heat source 1, with a local heat flux density as high as 800W / cm². To facilitate CFD simulation and focus on the flow field analysis of the core heat transfer region, [further details are needed]. Figure 1 The overall structure, including the inlet and outlet pagoda joint, has been reasonably simplified.

[0064] The original overall dimensions of the heat dissipation system base with inlet and outlet pagoda connectors were 40mm long, 25mm wide, and 3.5mm thick (this thickness does not include the protruding height of the pagoda connector itself). After removing the pagoda connector structure, the core heat dissipation hollow plate used for actual simulation verification was simplified into a cuboid model of 25mm×25mm×3.5mm.

[0065] CFD model fluid domain, such as Figure 2 , Figure 3As shown, the spiderweb-like microchannel has a depth of 1.5 mm, the left outlet channel 54 and the right outlet channel 55 have a width of 1.5 mm, the CFD model inlet 8 has a diameter of 1.8 mm, and the TPMS-filled cavity inlet 41 has a diameter of 2.4 mm. The multi-level polygonal branch channels 51 have 11 layers, each with a width of 0.3 mm and a spacing of 0.3 mm. This invention uses ANSYS Fluent 2024 R1 simulation software, sets the cooling medium to deionized water, provides an inlet flow rate of 0.4 L / min and a constant inlet temperature of 300 K, sets the outlets on both sides to pressure outlet conditions (gauge pressure set to 0), sets the contact surface of the heat source to a constant heat flux density, and sets the remaining outer surfaces to adiabatic walls. The TransitionSST turbulence model is used, while ensuring y+≈1, with a mesh size of 8 million. The mesh of its three-dimensional model's central section is shown below. Figure 8 , Figure 9 As shown. To verify the heat dissipation advantages of this invention, a traditional DC-channel heat sink is introduced as a comparison benchmark. The overall fluid domain of the benchmark model is confined within the same rectangular envelope space as this invention (i.e., maintaining the same length, width, and outer perimeter dimensions and a channel depth of 1.5 mm), and the same 0.3 mm rib width and spacing are maintained. Simulation results show that under the same operating conditions, the highest temperature of the heat source surface of this benchmark model reaches 69.6℃, and the inlet and outlet pressure drop is 12.02 kPa. The temperature standard deviation of each independent heat source surface is statistically analyzed, with the maximum value being 4.96℃. Given the spatial topological characteristics of the internal microchannels and three-period minimal surface (TPMS) structure of this invention, traditional machining methods (such as CNC) cannot achieve the integral molding of this flow channel with an internal micro-topological structure. Therefore, this heat dissipation system is manufactured using 3D printing technology with high thermal conductivity pure copper material. The TPMS heat exchange structure described in this invention is preferably a D-shaped (Diamond) minimal surface, and its spatial morphology can be defined by the following implicit surface mathematical approximation formula:

[0066]

[0067] A thin-walled TPMS heat exchange structure is generated by offsetting the 0 isosurface vertically. To further enhance the top-down impact convection heat transfer effect of the cooling fluid and to reasonably control the local flow resistance, its wall thickness is designed to gradually increase from 0.15 mm to 0.2 mm along the jet direction.

[0068] This embodiment 1 provides an annular filled strong convection heat transfer structure. In this embodiment, the layer containing the inlet microchannel has a cylindrical cavity with a diameter of 2.4 mm. This cavity was originally completely filled with the aforementioned D-type TPMS heat transfer structure. Subsequently, a cylindrical channel with a diameter of 1 mm (i.e., the TPMS filling cavity inlet 41) was hollowed out at the very center. This construction allows the D-type TPMS heat transfer structure 4 to form an annular tube wall filling layer with an outer diameter of 2.4 mm and an inner diameter of 1.0 mm, ultimately resulting in a TPMS heat transfer region with a porosity of 0.563. When 0.4 L / min of cooling water enters from the center, some fluid can directly pass through the unobstructed 1 mm cylindrical channel in the center to reach the bottom extreme hot spot (i.e., the first heat source 1) for preliminary cooling, while the surrounding fluid passes through the D-type TPMS annular region with a wall thickness gradient of 0.15 mm to 0.2 mm. This design, while ensuring the penetration intensity of the core jet, utilizes the annular TPMS heat exchange structure to generate intense turbulent disturbances and secondary flows, effectively improving the convective heat transfer coefficient around the central hot spot and enhancing the overall heat transfer efficiency in that region. Fluent simulations have verified that the residual reaches 10. -4 After assuming the order of magnitude and global flux conservation, the simulation results are as follows: Figure 10 As shown, it can control the highest temperature of the heat source surface at 62.45℃, the pressure drop generated by the cooling system is 39.89 kPa, and the maximum standard deviation of temperature within each heat source is 2.56℃. Combined with... Figure 10 As can be seen from the temperature cloud map of the heat source surface, compared with the obvious deep red high-temperature area in the center of the straight-channel reference model, the high-temperature distribution range of the extreme hot spot region in the center of Example 1 is significantly reduced. Further combined with... Figure 11 As can be seen from the velocity and pressure contour plot at the center section, the cooling medium experiences a sharp increase in local velocity due to pore flow restriction as it flows through the central annular TPMS heat exchange structure. Based on Bernoulli's principle and the abrupt change characteristics of the flow channel cross-section, a localized negative static pressure region appears in the high-velocity region and its downstream side (e.g., ...). Figure 11 (As shown in the blue area of ​​the pressure cloud map). The strong disturbance caused by this high flow velocity effectively disrupts the thermal boundary layer and enhances the heat transfer capacity of the core region.

[0069] Example 2 provides a centrally solid-filled, highly turbulent heat transfer structure. Unlike Example 1, in this example, the layer containing the inlet microchannels is completely filled only within a cylindrical region with a central diameter of 1.8 mm using the aforementioned gradient thin-walled D-type TPMS heat transfer structure. The periphery of this 1.8 mm cylindrical region is not filled with TPMS and is directly connected to the zigzag microchannels, ultimately resulting in a TPMS heat transfer region with a porosity of 0.547. This configuration allows the cooling medium, after being injected from the central inlet, to directly impact the central 1.8 mm diameter D-type TPMS heat transfer structure. Because the fluid must penetrate a complex network of interwoven pores and increasing wall thickness from 0.15 mm to 0.2 mm, the jet is effectively dispersed before contacting the extreme hotspot at the bottom layer, which reaches a height of 800 W / cm², creating extremely strong turbulence. This highly concentrated strong turbulence effectively enhances the heat transfer capacity of the central extreme hotspot region. Subsequently, the high-temperature hot fluid, having absorbed heat, is diverted to the direction of the second heat source 2 on both sides through the zigzag microchannels without TPMS obstruction on the periphery. Simulation results are as follows Figure 12 As shown, the data indicates that the highest temperature at the heat source surface was further reduced to 61.07℃; simultaneously, thanks to the reduction in overall flow resistance volume, the system pressure drop significantly decreased to 30.55 kPa, and the maximum temperature standard deviation among all heat source surfaces was 2.6℃. (Comparison) Figure 10 As can be seen from the temperature cloud map, the overall temperature distribution morphology of Example 2 is basically consistent with that of Example 1 in terms of macroscopic appearance, both exhibiting excellent isotropic characteristics, but their actual peak temperature has been further reduced. Combined with... Figure 12 According to velocity and pressure cloud analysis, compared to Example 1, the peak flow velocity of the fluid at this location is mitigated due to the reduction in the central solid filling area, thus reducing the local negative pressure. This structural adjustment not only effectively suppresses the excessive pressure drop caused by flow separation but also maintains a high flow velocity sufficient to suppress the scattered flow, achieving a better balance between fluid resistance and heat transfer performance. The comparison of the above examples shows that a reasonable layout of the filling area and pore characteristics of the TPMS heat exchange structure, combined with direct contact technology, can achieve good temperature control in the heat dissipation of heterogeneous chips with extremely narrow spacing. This invention improves the overall heat dissipation performance of the system while maintaining a reasonable pressure drop range.

[0070] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make other changes within the spirit of the invention and apply it to fields not mentioned in the invention. Of course, all such changes made in accordance with the spirit of the invention should be included within the scope of protection claimed by the invention.

Claims

1. A plate heat exchanger cooling element, characterized in that: It includes a hollow plate (3), a TPMS heat exchange structure (4), a spider web radial flow channel structure (5), a coolant inlet (6), and at least one coolant outlet (7). The bottom surface of the hollow plate (3) is directly attached to the back of the heat source; The TPMS heat exchange structure (4) is located in the inlet cavity at the bottom center of the hollow plate (3); the spider web radial flow channel structure (5) is located inside the hollow plate (3) and communicates with the periphery of the TPMS heat exchange structure (4); the coolant inlet (6) is located at the bottom center of the hollow plate (3) and communicates with the TPMS heat exchange structure (4); at least one coolant outlet (7) is located at the side edge of the hollow plate (3) and communicates with the spider web radial flow channel structure (5); Coolant is vertically injected into the TPMS heat exchange structure (4) through the coolant inlet (6). The jet impacts the inner wall of the bottom surface of the hollow plate (3) directly below the heat source, forming a stagnation heat exchange zone. Subsequently, the coolant enters the spider web radial flow channel structure (5) and is diverted and diffused, and finally discharged from the coolant outlet (7).

2. The plate heat exchanger cooling element according to claim 1, characterized in that: The wall thickness of the TPMS heat exchange structure (4) increases gradually from the coolant inlet (6) side to the bottom side of the hollow plate (3).

3. A plate heat exchanger cooling element according to claim 2, characterized in that: The wall thickness of the TPMS heat exchange structure (4) gradually increases from 0.15 mm to 0.20 mm along the jet direction.

4. A plate heat exchanger cooling element according to claim 3, characterized in that: The TPMS heat exchange structure (4) is made of pure copper material and manufactured by 3D printing.

5. A plate heat exchanger cooling element according to claim 1, characterized in that: The spiderweb-shaped radial flow channel structure (5) extends radially from the periphery of the TPMS heat exchange structure (4) to the edge of the hollow plate (3) layer by layer.

6. A plate heat exchanger cooling element according to claim 5, characterized in that: The spiderweb radial flow channel structure (5) includes multi-level polygonal branch channels (51), longitudinal branch main channels (52), transverse confluence main channels (53), left-side outlet channels (54) and right-side outlet channels (55). The longitudinal diversion main channel (52) and the transverse convergence main channel (53) are installed on the multi-level polygonal diversion branch (51) in a cross-shaped manner with the TPMS heat exchange structure (4) as the center, and are connected to the spider web microchannel in the multi-level polygonal diversion branch (51); The left exit channel (54) and the right exit channel (55) are respectively installed on the transverse main confluence channel (53).

7. A plate heat exchanger cooling element according to claim 6, characterized in that: The number of the multi-level polygonal branch channels (51) is 10-13 layers, the width of each layer of branch channel is 0.25-0.35mm, and the spacing between adjacent branch channels is 0.3mm.

8. A plate heat exchanger cooling element according to claim 7, characterized in that: In the spiderweb radial flow channel structure (5), the depth of the spiderweb-shaped microchannel is 1.5 mm, and the width of the left outlet channel (54) and the right outlet channel (55) is 1.5 mm.

9. A plate heat exchanger cooling element according to claim 8, characterized in that: There are two coolant outlets (7), which are symmetrically arranged on both sides of the hollow plate (3).

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