Semiconductor shake cleaning apparatus

Abstract

This invention relates to the field of semiconductor processing equipment technology, and discloses a semiconductor vibration cleaning device, comprising a housing, a mounting bracket fixedly mounted on the housing, a nozzle fixedly mounted on the mounting bracket, a nozzle fixedly mounted on the nozzle, and a megasonic generator fixedly mounted inside the nozzle; a disc fixedly mounted on the bottom of the housing, the disc having a vortex groove, a slide rod slidably mounted within the vortex groove, and a tray fixedly mounted on the slide rod for placing a wafer; a rotating cylinder rotatably mounted on the housing, the nozzle, the vortex groove, and the rotating cylinder being coaxial, and a guide rod fixedly mounted on the rotating cylinder. This semiconductor vibration cleaning device, through the combined constraint of the vortex groove and the straight groove, causes the wafer to move in a vortex pattern relative to the nozzle, and utilizes megasonic waves and airflow to control the pulsating spray of cleaning fluid, thereby achieving uniform and efficient megasonic vibration cleaning of the wafer surface.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, specifically to a semiconductor vibration cleaning device. Background Technology

[0002] During semiconductor wafer manufacturing, contaminants such as particles, metal ions, and organic residues adhere to their surfaces, requiring a cleaning process to remove them. Megasonic cleaning is a widely used precision cleaning technology that uses a megasonic generator to produce high-frequency acoustic waves that oscillate the cleaning fluid, utilizing cavitation and acoustic flow to remove tiny particles from the wafer surface. However, traditional megasonic cleaning equipment typically fixes the wafer on a rotating platform, with the nozzle spraying the megasonic cleaning fluid directly at the center of the wafer, while the platform rotates to centrifugally spread the cleaning fluid. This method results in uneven residence time of the cleaning fluid on the wafer surface: shorter residence time in the central area and longer residence time at the edges, and centrifugal force causes particles to move from the center to the edges, easily leading to secondary deposition.

[0003] To address these issues, some improvements employ planar reciprocating motion of the nozzle or wafer, such as linear or circular motion. However, linear motion suffers from abrupt speed changes at the endpoints, while circular motion results in insufficient cleaning in the central area. The ideal relative motion trajectory should ensure that the cleaning fluid evenly sweeps across every part of the wafer surface, without any dead zones from repeated scanning. Summary of the Invention

[0004] This invention provides a semiconductor vibration cleaning device, which has the beneficial effect of improving the uniformity and cleanliness of wafer cleaning, and solves the problems mentioned in the background art.

[0005] The present invention provides the following technical solution: a semiconductor vibration cleaning device, comprising a housing, a mounting bracket fixedly mounted on the housing, a nozzle fixedly mounted on the mounting bracket, a nozzle fixedly mounted on the nozzle, and a megohmmeter generator fixedly mounted inside the nozzle; A disc is fixedly installed at the bottom of the housing. A spiral groove is formed on the disc. A slide rod is slidably installed in the spiral groove. A tray is fixedly installed on the slide rod. The tray is used to place the wafer. A rotating cylinder is rotatably mounted on the housing. The nozzle, the vortex groove, and the rotating cylinder are all coaxial. A guide rod is fixedly mounted on the rotating cylinder. A straight groove is formed on the guide rod. The straight groove is distributed along the diameter direction of the rotating cylinder. The sliding rod is slidably connected in the straight groove. The housing is also provided with a drive mechanism. When the nozzle and the megasonic generator spray megasonic cleaning fluid to vibrate and clean the wafer, the drive mechanism drives the rotating drum to rotate, thereby causing the wafer to move along the trajectory of the vortex groove.

[0006] As an optional embodiment of the semiconductor vibration cleaning device of the present invention, the driving mechanism includes a motor fixedly installed in the housing, a first pulley fixedly installed on the output shaft of the motor, a second pulley fixedly installed on the rotating drum, and the first pulley and the second pulley being connected by a transmission belt.

[0007] As an optional solution of the semiconductor vibration cleaning device of the present invention, the nozzle is provided with a liquid spraying mechanism, the liquid spraying mechanism includes a liquid outlet hole and a capillary hole opened in the nozzle, and the liquid outlet hole and the capillary hole are connected. The nozzle also has an air chamber and two first air holes. The two first air holes are symmetrically arranged based on the central axis of the liquid outlet hole, and both first air holes are connected to the air chamber.

[0008] As an optional embodiment of the semiconductor vibration cleaning device of the present invention, the nozzle is further provided with an air inflation mechanism, which is used to inflate the air chamber, thereby forming a negative pressure area at the capillary outlet through the two first air holes, causing the cleaning liquid in the liquid outlet hole to be sprayed out.

[0009] As an optional embodiment of the semiconductor vibration cleaning device of the present invention, wherein: two second air holes are symmetrically opened in the nozzle, and the air chamber is connected to the capillary through the two second air holes; By controlling the alternating opening and closing of the first vent and the second vent, the cleaning liquid is sprayed out of the liquid outlet when the first vent is vented, and the spraying of the cleaning liquid stops when the second vent is vented. The inflation mechanism includes a connecting groove formed in the nozzle, the first air hole is connected to the second air hole through the connecting groove, and a baffle is slidably installed in the connecting groove; The inflation mechanism also includes a spring, with both ends of the spring fixedly connected to the baffle and the inner wall of the communicating groove, respectively. The elastic force provided by the spring causes the baffle to be located on the side closer to the first air hole.

[0010] As an optional embodiment of the semiconductor vibration cleaning device of the present invention, a liquid tank is fixedly installed on the nozzle, one end of the liquid tank is connected to the liquid outlet through a first connecting pipe, and an injection pipe is fixedly installed on the other end of the liquid tank.

[0011] As an optional solution of the semiconductor vibration cleaning device of the present invention, the inflation mechanism includes an inflation tube fixedly installed on the nozzle, one end of the inflation tube extends out of the nozzle, and the other end of the inflation tube is connected to the air chamber through a second connecting pipe. A piston is slidably installed inside the inflation tube, and a fixed plug is fixedly installed inside the inflation tube. A one-way valve is fixedly installed on both the piston and the fixed plug. The one-way valve is used to restrict the gas to flow only from the outside of the nozzle to one side of the air chamber.

[0012] As an optional solution of the semiconductor vibration cleaning device of the present invention, the air inlet pipe is provided with a groove, a sliding plate is slidably installed in the groove, and the sliding plate is fixedly connected to the piston through a first connecting rod; A rotating rod is rotatably installed inside the nozzle, a turntable is fixedly installed on the rotating rod, and a connecting shaft is fixedly installed on the turntable.

[0013] As an optional solution of the semiconductor vibration cleaning device of the present invention, the air inflation mechanism further includes a second connecting rod, one end of which is rotatably connected to the connecting shaft, and the other end of which is movably hinged to the slide plate through a hinge shaft; A first bevel gear is fixedly installed on the rotating rod, and a second bevel gear is fixedly installed on the rotating drum. The first bevel gear meshes with the second bevel gear.

[0014] As an optional embodiment of the semiconductor vibration cleaning device of the present invention, the air inlet pipe is provided with a sealing groove, the sealing groove is connected to the slide groove, and a sealing plate is fixedly installed on the slide plate, the sealing plate being slidably connected to the sealing groove.

[0015] The present invention has the following beneficial effects: 1. This semiconductor vibration cleaning equipment utilizes a vortex-shaped groove on a disc and a radial straight groove on the guide rod of the rotating drum, constraining the sliding rod simultaneously. When the drum is driven to rotate, the sliding rod revolves around the axis of the drum while simultaneously sliding radially along the straight groove, thereby causing the wafer on the tray to move in a precise vortex-shaped trajectory relative to the fixed nozzle. This trajectory ensures that the megaacoustic cleaning fluid evenly sweeps across every part of the wafer surface, avoiding the problems of insufficient cleaning in the central area or over-cleaning in the edge area caused by traditional rotary cleaning, significantly improving the uniformity of the entire wafer cleaning process.

[0016] 2. This semiconductor vibration cleaning device, by setting out liquid outlet holes, capillary holes, air chambers and symmetrical first air holes in the nozzle, utilizes Bernoulli's principle to form negative pressure at the capillary outlet to draw out the cleaning liquid, thereby achieving valveless liquid flow control.

[0017] 3. This semiconductor vibration cleaning device further includes a second air vent and a spring-driven baffle, enabling automatic alternating opening and closing of the first and second air vents. When air supply stops, the cross-flow of air ejected from the second air vent can quickly intercept the liquid in the capillary pores, preventing cleaning fluid dripping and waste. This spraying mechanism, in conjunction with the vortex motion mechanism, can achieve synchronous coordination between the motion path and the spray pulses, improving cleaning efficiency and reducing liquid consumption. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the first overall cross-sectional structure of the present invention.

[0020] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the structure at point A in the middle.

[0021] Figure 4 For the present invention Figure 3 A magnified schematic diagram of the structure at point B in the middle.

[0022] Figure 5 This is a schematic diagram of the second overall cross-sectional structure of the present invention.

[0023] Figure 6 For the present invention Figure 5 A magnified schematic diagram of the structure at point C.

[0024] Figure 7 This is a cross-sectional view of the reciprocating motion component of the present invention.

[0025] Figure 8 This is a schematic diagram of the exploded structure of the inflation mechanism of the present invention.

[0026] Figure 9 This is a schematic diagram of the exploded structure of the present invention.

[0027] 1. Housing; 2. Mounting bracket; 3. Nozzle; 4. Nozzle; 5. Megasound generator; 6. Disc; 7. Spiral groove; 8. Slide rod; 9. Tray; 10. Rotary drum; 11. Guide rod; 12. Linear groove; 13. Motor; 14. First pulley; 15. Second pulley; 16. Drive belt; 17. Liquid outlet; 18. Capillary pore; 19. Air chamber; 20. First air hole; 21. Second air hole; 22. Connecting groove; 23. Baffle 24. Plate; 25. Spring; 26. Liquid tank; 27. First connecting pipe; 28. Liquid injection pipe; 29. ​​Air inlet pipe; 20. Second connecting pipe; 31. Piston; 32. Fixed plug; 33. One-way valve; 34. Slide groove; 35. Slide plate; 36. First connecting rod; 37. Rotating rod; 38. Turntable; 39. Connecting shaft; 40. Second connecting rod; 41. First bevel gear; 42. Second bevel gear; 43. Sealing groove; 44. Sealing plate. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1, please refer to Figures 1-8 A semiconductor vibration cleaning device includes a housing 1, a mounting bracket 2 fixedly mounted on the housing 1, a nozzle 3 fixedly mounted on the mounting bracket 2, a nozzle 4 fixedly mounted on the nozzle 3, and a megohm generator 5 fixedly mounted inside the nozzle 4.

[0030] A disc 6 is fixedly installed at the bottom of the housing 1. A spiral groove 7 is provided on the disc 6. A slide rod 8 is slidably installed in the spiral groove 7. A tray 9 is fixedly installed on the slide rod 8. The tray 9 is used to place the wafer.

[0031] A rotating cylinder 10 is rotatably mounted on the housing 1. The nozzle 4, the vortex groove 7, and the rotating cylinder 10 are all coaxial. A guide rod 11 is fixedly mounted on the rotating cylinder 10. A straight groove 12 is opened on the guide rod 11. The straight groove 12 is distributed along the diameter direction of the rotating cylinder 10. The slide rod 8 is slidably connected in the straight groove 12.

[0032] The housing 1 is also equipped with a drive mechanism. When the nozzle 4 and the megasonic generator 5 spray megasonic cleaning fluid to vibrate and clean the wafer, the drive mechanism drives the rotating drum 10 to rotate, thereby causing the wafer to move along the trajectory of the vortex groove 7.

[0033] The drive mechanism includes a motor 13 fixedly installed inside the housing 1. A first pulley 14 is fixedly installed on the output shaft of the motor 13, and a second pulley 15 is fixedly installed on the rotating drum 10. The first pulley 14 and the second pulley 15 are connected by a transmission belt 16.

[0034] In this embodiment: the housing 1 serves as the overall mounting base, and its interior is hollow to accommodate the cleaning work area. The mounting bracket 2 is fixed to the upper part of the housing 1, and the nozzle 3 is mounted on the mounting bracket 2, keeping the nozzle 4 vertically downward and aligned with the center of the tray 9. The disc 6 is fixed to the bottom of the housing 1, and its upper surface has a spiral groove 7. The trajectory of the spiral groove 7 gradually expands outward from the center of the disc 6, and its mathematical form is an equiangular spiral or an Archimedean spiral, to ensure that the linear velocity of the tray 9 is uniform when it moves.

[0035] The megasonic generator 5 is fixedly installed inside the nozzle 4. Its working principle is as follows: using piezoelectric ceramics or similar transducers, it converts high-frequency electrical signals into mechanical vibrations, generating megasonic waves. These waves propagate through the cleaning fluid medium within the nozzle 4, forming alternating compression and rarefaction zones in the liquid. In the rarefaction zone, the internal pressure of the liquid is lower than the saturated vapor pressure, generating numerous tiny vacuum bubbles (cavitation nuclei). In the subsequent compression zone, these bubbles are rapidly compressed and collapse, instantaneously generating localized high temperature, high pressure, and microjets. This process is called the "cavitation effect." Simultaneously, the megasonic waves propagating in the liquid also induce an overall acoustic flow (i.e., large-scale circulating flow of the liquid along the direction of sound wave propagation). The shock waves and microjets generated by the cavitation effect effectively remove submicron-sized particulate contaminants from the wafer surface, while the acoustic flow carries away loosened particles and prevents their redeposition. Compared to traditional ultrasonic cleaning, megasonic waves have higher frequencies, smaller cavitation bubbles, and a lower risk of damage to the wafer surface, making them particularly suitable for precision semiconductor cleaning.

[0036] The lower end of the slide rod 8 is slidably mounted inside the spiral groove 7, and the upper end is fixedly connected to the tray 9. The rotating drum 10 is rotatably mounted inside the housing 1, and its axis of rotation coincides with the central axis of the nozzle 4. A guide rod 11 is fixed on the rotating drum 10, and a straight groove 12 opened on the guide rod 11 extends along the diameter direction of the rotating drum 10. The slide rod 8 passes through the straight groove 12 and can slide along the straight groove 12.

[0037] The drive mechanism consists of a motor 13, a first pulley 14, a second pulley 15, and a transmission belt 16. The motor 13 is fixed to the side wall of the housing 1, and its output shaft drives the first pulley 14 to rotate. Power is transmitted to the second pulley 15 via the transmission belt 16, thereby driving the rotating drum 10 to rotate at a constant speed. When the rotating drum 10 rotates, the guide rod 11 rotates accordingly, and the straight groove 12 pushes the slide rod 8 to move under the constraint of the vortex groove 7. Since the vortex groove 7 is a curved groove and the straight groove 12 is a radial straight groove, their combined action causes the slide rod 8 to produce a compound motion: on the one hand, it revolves with the rotating drum 10, and on the other hand, it slides radially. Ultimately, the wafer on the tray 9 moves in a vortex trajectory relative to the nozzle 4. This trajectory allows the megasonic waves generated by the megasonic generator 5 and the cleaning fluid to evenly cover every surface of the wafer, avoiding concentric circular repetitive cleaning or a central dead zone.

[0038] It should be noted that, to improve the smoothness of movement, self-lubricating bushings can be embedded in the contact surfaces of the slide rod 8 and the vortex groove 7, and grease can be added periodically. Additionally, a rolling bearing is provided between the rotating drum 10 and the housing 1 to reduce frictional resistance.

[0039] Example 2, please refer to Figures 1-8 The nozzle 3 is equipped with a liquid spraying mechanism, which includes a liquid outlet 17 and a capillary 18 opened in the nozzle 4, and the liquid outlet 17 and the capillary 18 are connected.

[0040] The nozzle 4 is also provided with an air chamber 19 and two first air holes 20. The two first air holes 20 are symmetrically arranged based on the central axis of the liquid outlet hole 17, and both first air holes 20 are connected to the air chamber 19.

[0041] The nozzle 3 is also equipped with an inflation mechanism, which is used to inflate the air chamber 19, thereby creating a negative pressure area at the outlet of the capillary pore 18 by jetting air through the two first air holes 20, causing the cleaning liquid in the liquid outlet 17 to be sprayed out.

[0042] Two second air holes 21 are symmetrically opened inside the nozzle 4, and the air chamber 19 is connected to the capillary pore 18 through the two second air holes 21.

[0043] By controlling the alternating opening and closing of the first vent 20 and the second vent 21, the cleaning fluid is sprayed out of the liquid outlet 17 when the first vent 20 is vented, and the spraying of the cleaning fluid stops when the second vent 21 is vented.

[0044] The inflation mechanism includes a connecting groove 22 opened in the nozzle 4, the first air hole 20 is connected to the second air hole 21 through the connecting groove 22, and a baffle 23 is slidably installed in the connecting groove 22.

[0045] The inflation mechanism also includes a spring 24, with both ends of the spring 24 fixedly connected to the baffle 23 and the inner wall of the connecting groove 22, respectively. The elastic force provided by the spring 24 causes the baffle 23 to be located on the side closer to the first air hole 20.

[0046] A liquid tank 25 is fixedly installed on the nozzle 3. One end of the liquid tank 25 is connected to the liquid outlet 17 through the first connecting pipe 26, and the other end of the liquid tank 25 is fixedly installed with a liquid injection pipe 27.

[0047] In this embodiment: the nozzle 3 integrates a spraying mechanism to spray the cleaning fluid onto the wafer surface in the form of an atomized or fine stream. The nozzle 4 has a liquid outlet 17 and a capillary 18 arranged sequentially from top to bottom, both coaxial and connected. The liquid outlet 17 has a relatively large diameter (e.g., 1-2 mm) to facilitate the flow of the cleaning fluid; the capillary 18 has an extremely small diameter (e.g., 0.1-0.3 mm), utilizing surface tension to naturally stop the liquid when no external pressure is applied, preventing dripping.

[0048] The air chamber 19 surrounds the liquid outlet 17 but is not directly connected to it. Two first air holes 20 are symmetrically and obliquely positioned, with their lower outlets located below the capillary pore 18 on either side, and their outlet directions obliquely intersecting below the extended center line of the capillary pore 18. When compressed air is introduced into the air chamber 19, the gas is ejected at high speed from the first air holes 20. According to Bernoulli's principle, a low-pressure zone is formed at the outlet of the capillary pore 18, thereby "drawing" out the cleaning fluid from the capillary pore 18 and atomizing it for spraying. After the air supply stops, surface tension again stops the liquid flow.

[0049] To more precisely control the start and stop of the injection, this embodiment also includes two second air holes 21, whose outlets are directly connected to the inside of the capillary pores 18. The first air hole 20 and the second air hole 21 are connected by a connecting groove 22, in which a baffle 23 is slidably installed and is provided with a reset force by a spring 24. In the initial state, the spring 24 pushes the baffle 23 to the first air hole 20, closing the first air hole 20. When the inflation mechanism supplies air, the gas pressure overcomes the spring force of the spring 24, pushing the baffle 23 to slide to the second air hole 21, closing the second air hole 21, and simultaneously opening the first air hole 20, at which point the injection starts. When the inflation mechanism stops supplying air, the spring 24 resets, the baffle 23 returns to the first air hole 20, closing the first air hole 20, and the second air hole 21 opens. Residual gas enters the inside of the capillary pores 18 from the second air hole 21, forming a cross-flow seal and quickly stopping the liquid.

[0050] It should be further noted that spring 24 is made of fatigue-resistant stainless steel wire (such as SUS304 or SUS316) and is pre-compressed to ensure that spring 24 is always under compression during operation, avoiding plastic deformation caused by repeated stretching. A safety margin is also designed based on the expected number of switching cycles.

[0051] The mating surfaces between the baffle 23 and the connecting groove 22 are ground, and a miniature sealing ring (such as an O-ring) or a conical sealing structure can be added to the baffle 23 to prevent gas leakage from affecting the reliability of alternating opening and closing.

[0052] The liquid tank 25 is connected to the liquid outlet 17 via the first connecting pipe 26, and the liquid injection pipe 27 is used for external liquid replenishment. A liquid level sensor can be installed inside the liquid tank 25.

[0053] Example 3, please refer to Figures 2-8 The inflation mechanism includes an inflation tube 28 fixedly installed on the nozzle 3. One end of the inflation tube 28 extends out of the nozzle 3, and the other end of the inflation tube 28 is connected to the air chamber 19 through the second connecting pipe 29.

[0054] A piston 30 is slidably installed inside the inflation tube 28, and a fixed plug 31 is fixedly installed inside the inflation tube 28. A one-way valve 32 is fixedly installed on both the piston 30 and the fixed plug 31. The one-way valve 32 is used to restrict the gas to flow only from the outside of the nozzle 3 to the side of the air chamber 19.

[0055] The inflation tube 28 has a groove 33, and a slide plate 34 is slidably installed in the groove 33. The slide plate 34 is fixedly connected to the piston 30 through the first connecting rod 35.

[0056] A rotating rod 36 is rotatably installed inside the nozzle 3, a turntable 37 is fixedly installed on the rotating rod 36, and a connecting shaft 38 is fixedly installed on the turntable 37.

[0057] The inflation mechanism also includes a second connecting rod 39, one end of which is rotatably connected to the connecting shaft 38, and the other end of which is movably hinged to the slide plate 34 via a hinge shaft.

[0058] A first bevel gear 40 is fixedly installed on the rotating rod 36, and a second bevel gear 41 is fixedly installed on the rotating drum 10. The first bevel gear 40 and the second bevel gear 41 mesh.

[0059] A sealing groove 42 is provided on the inflation tube 28. The sealing groove 42 is connected to the slide groove 33. A sealing plate 43 is fixedly installed on the slide plate 34. The sealing plate 43 is slidably connected in the sealing groove 42.

[0060] In this embodiment, the inflation mechanism is used to provide periodic or continuous compressed air to the air chamber 19. Its power comes from the rotation of the drum 10, thus eliminating the need for an additional air source or solenoid valve, simplifying the equipment structure and reducing costs.

[0061] The inflation tube 28 is fixed to the nozzle 3. One end is connected to the air chamber 19 via the second connecting pipe 29, and the other end opens to the outside of the nozzle 3 as an air inlet. Inside the inflation tube 28, from bottom to top, are a fixed plug 31 and a piston 30, forming a compression chamber between them. The fixed plug 31 is fixed, while the piston 30 can slide up and down. A one-way valve 32 is installed on both the piston 30 and the fixed plug 31, both allowing gas to flow from the outside to the side of the air chamber 19 (i.e., when the piston 30 moves upward, the upper one-way valve 32 is closed and the lower one-way valve 32 is open, pressing the gas in the compression chamber towards the air chamber 19; when the piston 30 moves downward, the upper one-way valve 32 is open and the lower one-way valve 32 is closed, and external gas is drawn into the compression chamber).

[0062] The piston 30 is fixedly connected to the slide plate 34 via the first connecting rod 35. The slide plate 34 is slidably installed in the groove 33 on the side wall of the inflation pipe 28. A rotating rod 36 is rotatably installed inside the nozzle 3. A first bevel gear 40 is fixed to the upper end of the rotating rod 36, meshing with a second bevel gear 41 fixed on the rotating drum 10. A turntable 37 is fixed to the lower end of the rotating rod 36. A connecting shaft 38 is eccentrically arranged on the turntable 37. The two ends of the second connecting rod 39 are respectively hinged to the connecting shaft 38 and the slide plate 34. When the rotating drum 10 rotates, the rotating rod 36 rotates through the bevel gear pair, the turntable 37 rotates, and the second connecting rod 39 converts the rotational motion into the reciprocating linear motion of the slide plate 34, thereby driving the piston 30 to move up and down reciprocally, realizing continuous inflation.

[0063] It should be further noted that a sealing groove 42 is provided at the slide groove 33. The sealing plate 43 is fixed on the slide plate 34 and slidably fitted within the sealing groove 42. The sealing groove 42 can be filled with grease or fitted with a rubber sealing strip to prevent external dust from entering the inflation tube 28 and to prevent compressed gas from leaking from the slide groove 33. In addition, a lip seal ring is provided on the outer circumference of the piston 30.

[0064] To eliminate pressure pulsation, a buffer gas container can be set between the second connecting pipe 29 and the air chamber 19, or the bevel gear transmission ratio can be adjusted to make the piston 30 move at a high frequency, using the airflow inertia to smooth pressure fluctuations.

[0065] This inflation mechanism enables pulsed spraying of cleaning fluid synchronized with the movement of tray 9 (multiple pulses are sprayed per rotation), which helps improve cleaning uniformity and reduce liquid waste.

[0066] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0067] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A semiconductor vibration cleaning device, comprising a housing (1), characterized in that: A mounting bracket (2) is fixedly installed on the housing (1), a nozzle (3) is fixedly installed on the mounting bracket (2), a nozzle (4) is fixedly installed on the nozzle (3), and a megohm generator (5) is fixedly installed inside the nozzle (4). A disk (6) is fixedly installed at the bottom of the housing (1). A spiral groove (7) is provided on the disk (6). A slide rod (8) is slidably installed in the spiral groove (7). A tray (9) is fixedly installed on the slide rod (8). The tray (9) is used to place the wafer. A rotating cylinder (10) is rotatably mounted on the housing (1). The nozzle (4), the vortex groove (7), and the rotating cylinder (10) are all coaxial. A guide rod (11) is fixedly mounted on the rotating cylinder (10). A straight groove (12) is opened on the guide rod (11). The straight groove (12) is distributed along the diameter direction of the rotating cylinder (10). The slide rod (8) is slidably connected in the straight groove (12). The housing (1) is also provided with a drive mechanism. When the nozzle (4) and the megasonic generator (5) spray megasonic cleaning fluid to vibrate and clean the wafer, the drive mechanism drives the rotating drum (10) to rotate, thereby causing the wafer to move along the trajectory of the vortex groove (7).

2. The semiconductor vibration cleaning equipment according to claim 1, characterized in that: The drive mechanism includes a motor (13) fixedly installed inside the housing (1), a first pulley (14) fixedly installed on the output shaft of the motor (13), and a second pulley (15) fixedly installed on the drum (10). The first pulley (14) and the second pulley (15) are connected by a transmission belt (16).

3. The semiconductor vibration cleaning device according to claim 1, characterized in that: The nozzle (3) is provided with a liquid spraying mechanism, which includes a liquid outlet (17) and a capillary (18) opened in the nozzle (4), and the liquid outlet (17) and the capillary (18) are connected. The nozzle (4) is also provided with an air chamber (19) and two first air holes (20). The two first air holes (20) are symmetrically arranged based on the central axis of the liquid outlet (17), and both first air holes (20) are connected to the air chamber (19).

4. The semiconductor vibration cleaning device according to claim 3, characterized in that: The nozzle (3) is also provided with an inflation mechanism, which is used to inflate the air chamber (19) with air, thereby spraying airflow through the two first air holes (20) to form a negative pressure area at the outlet of the capillary (18) so that the cleaning liquid in the liquid outlet (17) is sprayed out.

5. A semiconductor vibration cleaning device according to claim 4, characterized in that: The nozzle (4) has two symmetrically arranged second air holes (21), and the air chamber (19) is connected to the capillary pore (18) through the two second air holes (21); By controlling the first vent (20) and the second vent (21) to open and close alternately, the cleaning liquid is sprayed out of the liquid outlet (17) when the first vent (20) is ventilated, and the spraying of the cleaning liquid is stopped when the second vent (21) is ventilated. The inflation mechanism includes a connecting groove (22) opened in the nozzle (4), the first air hole (20) is connected to the second air hole (21) through the connecting groove (22), and a baffle (23) is slidably installed in the connecting groove (22). The inflation mechanism also includes a spring (24), the two ends of which are fixedly connected to the baffle (23) and the inner wall of the connecting groove (22), respectively. The elastic force provided by the spring (24) causes the baffle (23) to be located on the side close to the first air hole (20).

6. The semiconductor vibration cleaning device according to claim 5, characterized in that: A liquid tank (25) is fixedly installed on the nozzle (3). One end of the liquid tank (25) is connected to the liquid outlet (17) through the first connecting pipe (26), and the other end of the liquid tank (25) is fixedly installed with an injection pipe (27).

7. A semiconductor vibration cleaning device according to claim 6, characterized in that: The inflation mechanism includes an inflation tube (28) fixedly installed on the nozzle (3), one end of the inflation tube (28) extends out of the nozzle (3), and the other end of the inflation tube (28) is connected to the air chamber (19) through a second connecting pipe (29); A piston (30) is slidably installed inside the inflation tube (28), and a fixed plug (31) is fixedly installed inside the inflation tube (28). A one-way valve (32) is fixedly installed on both the piston (30) and the fixed plug (31). The one-way valve (32) is used to restrict the gas to flow only from the outside of the nozzle (3) to the side of the air chamber (19).

8. A semiconductor vibration cleaning device according to claim 7, characterized in that: The air tube (28) is provided with a groove (33), and a slide plate (34) is slidably installed in the groove (33). The slide plate (34) is fixedly connected to the piston (30) through the first connecting rod (35). A rotating rod (36) is rotatably installed inside the nozzle (3), a turntable (37) is fixedly installed on the rotating rod (36), and a connecting shaft (38) is fixedly installed on the turntable (37).

9. A semiconductor vibration cleaning device according to claim 8, characterized in that: The inflation mechanism also includes a second connecting rod (39), one end of which is rotatably connected to the connecting shaft (38), and the other end of which is movably hinged to the slide plate (34) via a hinge shaft; A first bevel gear (40) is fixedly installed on the rotating rod (36), and a second bevel gear (41) is fixedly installed on the rotating cylinder (10). The first bevel gear (40) meshes with the second bevel gear (41).

10. A semiconductor vibration cleaning device according to claim 8, characterized in that: A sealing groove (42) is provided on the inflation tube (28), the sealing groove (42) is connected to the sliding groove (33), and a sealing plate (43) is fixedly installed on the sliding plate (34), the sealing plate (43) is slidably connected in the sealing groove (42).

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