Holey substrate and method of manufacturing the same

Abstract

A kind of hole base plate and its manufacturing method, including the steps of: providing first plate body and second plate body;Form multiple through holes in first plate body, including: at least one first alignment hole is formed in the selected site on first plate body, and at least one first through hole is formed by removing the first plate body of at least one region of the part of at least one region, wherein at least one region is different from at least one site;Form at least one through hole in second plate body, including: at least one second alignment hole is formed in the selected site on second plate body;First plate body and second plate body are superimposed, wherein at least one first alignment hole and at least one second alignment hole correspond to each other;And bond first plate body and second plate body.

Description

Technical Field

[0001] This invention relates to a chip packaging technology, and more particularly to a perforated substrate suitable for chip packaging and a method for manufacturing the same. Background Technology

[0002] Embedded packaging technology can embed chips, active components, and passive components into blind vias on a substrate for packaging, reducing package size and meeting the demand for thinner and lighter electronic products. Various methods can be used to process blind vias on a substrate. Regardless of the method, the ultra-thinning and lightweight nature of electronic products relies on improvements in processing quality, process stability, and the precision and dimensional control of blind vias. Summary of the Invention

[0003] This invention provides a method for manufacturing a perforated substrate, wherein the blind vias produced have an optimized shape, which helps to improve space utilization.

[0004] To achieve one or more of the above objectives or other objectives, an embodiment of the present invention provides a method for manufacturing a perforated substrate, comprising the steps of: providing a first plate and a second plate; forming a plurality of through holes in the first plate, including: selecting at least one portion on the first plate and forming at least one first aligned through hole, and selecting at least one region on the first plate and removing a portion of the first plate from the at least one region to form at least one first through hole, wherein the at least one region is different from the at least one portion; forming at least one through hole in the second plate, including: selecting at least one portion on the second plate and forming at least one second aligned through hole; stacking the first plate and the second plate, wherein the at least one first aligned through hole and the at least one second aligned through hole correspond to each other; and combining the first plate and the second plate.

[0005] In one embodiment of the above manufacturing method, the step of selecting at least one part on the first plate and forming at least one first alignment through hole further includes selecting multiple parts and forming multiple first alignment through holes, and the step of selecting at least one part on the second plate and forming at least one second alignment through hole further includes selecting multiple parts and forming multiple second alignment through holes, wherein the multiple first alignment through holes correspond to the multiple second alignment through holes respectively.

[0006] In one embodiment of the above manufacturing method, the step of selecting the at least one portion on the first plate and forming the at least one first alignment through hole further includes laser processing of the first plate to form the at least one first alignment through hole, and the step of selecting the at least one portion on the second plate and forming the at least one second alignment through hole further includes laser processing of the second plate to form the at least one second alignment through hole; the diameters of the at least one first alignment through hole and the at least one second alignment through hole are smaller than the diameter of the at least one first through hole.

[0007] In one embodiment of the above manufacturing method, the step of laser processing the first plate further includes drilling, cutting, etching, or a combination thereof on the first plate; the step of laser processing the second plate further includes drilling, cutting, etching, or a combination thereof on the second plate.

[0008] In one embodiment of the above manufacturing method, the step of laser processing the first plate further includes cutting the first plate along the edge of the at least one region.

[0009] In one embodiment of the above manufacturing method, the step of laser processing the first plate further includes drilling and etching the first plate to form the at least one first alignment through hole; the step of laser processing the second plate further includes drilling and etching the second plate to form the at least one second alignment through hole.

[0010] In one embodiment of the above manufacturing method, it further includes heat treatment, chemical treatment, or a combination thereof on the first plate, the second plate, or a combination thereof to bond the first plate and the second plate.

[0011] In one embodiment of the above manufacturing method, the method further includes filling metal in the at least one first alignment through hole and the at least one second alignment through hole.

[0012] The present invention also provides a perforated substrate, comprising a first plate and a second plate and having a plurality of holes; the plurality of holes includes:

[0013] At least one blind hole; the at least one blind hole opens on a surface of the first plate and has a bottom located on the second plate; and

[0014] At least one pair of through holes; the at least one pair of through holes passes through the first plate and the second plate, and opens on the surface of the first plate and a surface of the second plate;

[0015] The first plate and the second plate are connected to each other, and the perforated substrate further has a bonding layer located between the first plate and the second plate.

[0016] In one embodiment of the above-described perforated substrate, the diameter of the at least one blind hole is larger than the diameter of the at least one pair of through holes, and the perforated substrate further includes a metal filler disposed in the at least one pair of through holes.

[0017] In one embodiment of the porous substrate described above, the bonding layer further includes a molten region, a heat-affected region, a chemically bonded region, a phase change region, an optical heterogeneous region, or a combination thereof.

[0018] Because the present invention employs the steps of forming through holes in the first plate and the second plate respectively, and then stacking and combining the first plate and the second plate, the blind holes of the substrate can have a regular spatial shape like through holes through the through holes and their forming means, thereby achieving size control and improved precision of the blind holes.

[0019] To make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic flowchart of a method for manufacturing a perforated substrate according to the first embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram illustrating the implementation steps of an embodiment of the present invention.

[0022] Figures 3A-3B This is a schematic diagram illustrating another step of an embodiment of the present invention.

[0023] Figure 4 This is a schematic diagram illustrating another step of an embodiment of the present invention.

[0024] Figure 5 This is a flowchart illustrating the second embodiment of the present invention.

[0025] Figure 6 This is a cross-sectional schematic diagram of a perforated substrate according to an embodiment of the present invention.

[0026] Figure 7 This is a cross-sectional schematic diagram of a perforated substrate according to another embodiment of the present invention.

[0027] In the attached figures, the following labels are used:

[0028] 1: Perforated substrate

[0029] 10: First Plate

[0030] 100: Surface

[0031] 101: First Surface

[0032] 103: Third Surface

[0033] 20: Second Plate

[0034] 200: Surface

[0035] 202: Second Surface

[0036] 202': Bottom

[0037] 204: Fourth Surface

[0038] 30: Hole

[0039] 300: Alignment through hole

[0040] 301, 302: Openings

[0041] 310: First alignment through hole

[0042] 313: Third alignment through hole

[0043] 315: Fifth alignment through hole

[0044] 320: Second alignment through hole

[0045] 324: Fourth alignment through hole

[0046] 326: Sixth alignment through hole

[0047] 400: First through hole

[0048] 400': Blind hole

[0049] 401: Opening

[0050] 410: Inner wall surface

[0051] 600: Bonding layer

[0052] 700: Metal packing

[0053] x, y, z: Direction

[0054] d1, d1', d2, d2', D, D': Aperture

[0055] S910~S950: Steps Detailed Implementation

[0056] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention. Furthermore, the terms "first," "second," etc., mentioned in this specification or the claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements. The terms "approximately" and "about" in the specification indicate a degree or value that includes the optimal degree, the optimal value, and an allowable error of ±5% or ±10%.

[0057] This invention provides a method for manufacturing a perforated substrate, and further allows for the formation of blind vias on the substrate. The substrate is suitable for electronic component packaging, and the blind vias on the substrate can be used to house active components, passive components, and / or for electrical connections. The manufacturing method of this invention helps optimize the morphology of blind vias on the substrate and improves space utilization.

[0058] Figure 1 This is a schematic flowchart of an embodiment of the manufacturing method of a perforated substrate according to the present invention. Figure 1 As shown, the embodiment of the present invention includes steps S910 to S950. Step S910 involves providing a first plate and a second plate; step S920 mainly involves forming a plurality of through holes in the first plate; step S930 mainly involves forming at least one through hole in the second plate; step S940 mainly involves stacking the first plate and the second plate; and step S950 involves joining the first plate and the second plate. Steps S910 to S950 are further described below.

[0059] In step S910, the first plate 10 and the second plate 20 can be organic plates or glass plates. The organic plate is primarily made of organic resin or a combination of organic resin and glass fiber. The glass plate can be made of, for example, alkali-free glass, quartz glass, soda-lime glass, borosilicate glass, aluminosilicate glass, or optical glass, but is not limited thereto. Organic plates or glass plates can be selected based on requirements such as cost-effectiveness, mechanical toughness or flatness, electrical insulation, dielectric properties, thermal stability, and chemical resistance. The first plate 10 and the second plate 20 can be made of the same material.

[0060] Step S920 further includes: selecting at least one portion on the first plate and forming at least one first alignment through hole at the at least one portion; and: selecting at least one region on the first plate and removing a portion of the first plate in the at least one region to form at least one first through hole; wherein the at least one region is different from the at least one portion. Figure 2 sectional view and Figures 3A-3BAs shown in the top view, the selection of part P1 and region A in steps S920 and S930 may be performed on the surface 100 of the first plate 10 and the surface 200 of the second plate 20. Part P1 may be located on the surface 100 of the first plate 10, while region A may be the area marked by the dashed line in the figure. The dashed line can be regarded as the edge I of region A; the dashed line forms a closed outline, and the marked region A is a closed region. Part P2 is located on the surface 200 of the second plate 20; the positions of part P2 and part P1 may correspond to each other. For example, when the first plate 10 and the second plate 20 are arranged in their thickness direction z, the projection of part P1 on the second plate 20 may approximately correspond to part P2, and vice versa. In other words, when surfaces 100 and 200 are viewed as xy planes, parts P1 and part P2 may, for example, have approximately corresponding (x, y) coordinates. "Correspondence" in this document may also be defined as at least partial overlap in the top view direction.

[0061] Generally, there can be multiple locations P1, P2, and region A, with the same number of locations P1 and P2. In this case, multiple locations P1 and multiple locations P2 can correspond to each other. Furthermore, in other embodiments of the present invention, region A can also be selected and through holes can be formed on the surface 200 of the second plate 20.

[0062] In embodiments of the present invention, the formation of the first alignment via 310 can be achieved, for example, by laser processing of the first plate 10. Similarly, the formation of the second alignment via 320 can be achieved by laser processing of the second plate 20. Laser processing may include drilling, cutting, etching, and combinations thereof. The present invention does not limit the laser processing method; for example, one or more methods including laser drilling, laser cutting, mechanical, thermal processing, water jetting, chemical, etching, etc., may be used, and are not limited to those listed. In several embodiments of the present invention, the first alignment via 310 and the second alignment via 320 are formed by methods including laser drilling and etching. Further description follows.

[0063] like Figure 2 and 3AAs shown, the surface 100 of the first plate 10 includes opposing first surfaces 101 and third surfaces 103. A first alignment through-hole 310 opens onto the first surface 103 and the third surface 103, and in several embodiments of the invention, the first alignment through-hole 310 is a generally vertically oriented alignment through-hole (i.e., perpendicular to surface 100), and its length is approximately equal to the thickness of the first plate 10. The surface 200 of the second plate 20 includes opposing second surfaces 204 and fourth surfaces 204. A second alignment through-hole 320 opens onto the second surface 202 and the fourth surface 204, and in several embodiments of the invention, the second alignment through-hole 320 is also a generally vertically oriented alignment through-hole, and its length is approximately equal to the thickness of the second plate 20. By performing, for example, laser drilling at location P1, the first alignment through-hole 310 can have a diameter d1, and by performing laser drilling at location P2, the second alignment through-hole 320 can have a diameter d2, and the diameters d1 and d2 can be approximately equal. In several embodiments of the present invention, the sizes of the apertures d1 and d2 can be, for example, several micrometers, but are not limited thereto. The shapes of the first alignment through-hole 310 and the second alignment through-hole 320 in the figures are merely examples; the present invention does not limit the shape of the alignment through-holes. Figure 2 and 3A As illustrated, a plurality of first alignment through holes 310, including a third alignment through hole 313 and a fifth alignment through hole 315, can be further formed on the first plate 10, and a plurality of second alignment through holes 320, including a fourth alignment through hole 324 and a sixth alignment through hole 326, can be further formed on the second plate 20, and they generally correspond to the third alignment through holes 313 and the fifth alignment through holes 315, respectively. Furthermore, the first plate 10 and the second plate 20 can be further etched. Etching can be used for, for example, hole diameter compensation and hole shape modification, as well as to modify burrs caused by drilling and cutting, and improve roughness. Through etching, the first alignment through holes 310 and the second alignment through holes 320 can be enlarged, so that the first alignment through hole 310 has a hole diameter d1' and the second alignment through hole 320 has a hole diameter d2', and the hole diameter d1' is greater than d1 and the hole diameter d2' is greater than d2.

[0064] The etching of the first plate 10 and the second plate 20 can be performed simultaneously or under the same conditions. For example... Figure 4 As shown, taking wet etching as an example, "simultaneous" means immersing both the first plate 10 and the second plate 20 in the etchant E. However, wet etching is not limited to immersion. Etching agents used for wet etching include acidic and alkaline etchants. Acidic etchants can be, for example, hydrofluoric acid, acetic acid, oxalic acid, citric acid, nitric acid, hydrochloric acid, sulfuric acid, and phosphoric acid solutions, but are not limited thereto. Alkaline etchants can be, for example, sodium hydroxide and potassium hydroxide solutions, but are not limited thereto. Different etchants can be used in combination, or in combination with additives.

[0065] The removal of the first plate 10 in region A in step S920 can be achieved by laser processing. In several embodiments of the invention, the laser processing of the first plate 10 further includes, but is not limited to, laser cutting the first plate 10 along edge I of region A. When performing laser cutting, for example, a laser beam with a specific power can be used to cut through the first plate 10, and the laser beam can be further moved along edge I. Since edge I forms a closed profile, the cutting along edge I removes a portion of the first plate 10 in region A. By making the cutting surface substantially perpendicular to surface 100, the resulting first through hole 400 can have a substantially perpendicular inner wall surface 410.

[0066] The shape of the first through-hole 400 in the figure is merely an example, and the present invention does not limit the shape of the through-hole. The first through-hole 400 has a diameter D. Taking a square as an example, the diameter D can be equivalent to the side length of the square; while if the first through-hole 400 is circular, the diameter D can be equivalent to the diameter of the circle. In embodiments of the present invention, the first through-hole 400 is generally larger than the first aligned through-hole 310 and the second aligned through-hole 320, that is, the diameter D > the diameter d1 and the diameter d2. The size of the first through-hole 400 can be adapted to the placement of electronic components. Furthermore, as mentioned above, etching can further modify, for example, the hole shape, burrs, and improve the roughness of the first through-hole 400, but is not limited thereto. The etched first through-hole 400 can have a diameter D', and the diameter D' can be larger than D, and larger than the diameters d1' and d2'.

[0067] like Figure 5 As shown, the manufacturing method of several embodiments of the present invention may further include step S935: filling at least one first alignment through-hole and at least one second alignment through-hole with metal. The metal may be a conductive material and may further be conductive for electrical connection. The metal used for filling may be copper, aluminum, silver, or alloys thereof, and is not limited thereto. Figure 2 As shown, the metal filler 700 can be further distributed in the opening 301 of the first alignment through hole 310 and the opening 302 of the second alignment through hole 320. In other words, the surface of the metal filler 700 can substantially correspond to surface 100 and surface 200. When the first plate 10 and the second plate 20 are stacked and combined, the metal filler 700 in the first alignment through hole 310 and the metal filler 700 in the second alignment through hole 320 can be interconnected.

[0068] Step S940 further includes: arranging the first plate and the second plate opposite to each other, with the surface of the first plate facing the surface of the second plate, and ensuring that at least one first alignment through hole and at least one second alignment through hole correspond to each other. Step S940 may also arrange the first plate 10 and the second plate 20 according to the correspondence between the first alignment through hole 310 and the second alignment through hole 320. In several embodiments of the present invention, the first plate 10 and the second plate 20 may have the same dimensions, including the same length and width, and their edges correspond to each other after being stacked. The height (thickness) of the first plate 10 may be less than or equal to the height of the second plate 20, but the present invention is not limited thereto.

[0069] exist Figure 2 In this embodiment, the first plate 10, arranged opposite to each other, faces the second surface 202 of the second plate 20 with its first surface 101 facing it, and is joined to each other through the first surface 101 and the second surface 202. The first surface 101 and the second surface 202 are also referred to as the mating surface or the contact surface. A plurality of first alignment through holes 310 and a plurality of second alignment through holes 320 are respectively corresponding, that is, the third alignment through hole 313 corresponds to and at least partially overlaps the fourth alignment through hole 324 in the top view, and the fifth alignment through hole 315 corresponds to and at least partially overlaps the sixth alignment through hole 326 in the top view. In several embodiments of the present invention, the at least partial overlap of the first alignment through holes 310 and the second alignment through holes 320 in the top view allows the metal fillers 700 within them to correspond to and contact each other.

[0070] The manufacturing method of this invention may further include subjecting the first plate 10, the second plate 20, or a combination thereof to, for example, heat treatment, chemical treatment, a combination thereof, or other treatments that promote plate bonding. The treatment may be performed on the surfaces of the first plate 10 and the second plate 20 used for bonding. Figure 2 For example, in the embodiments described herein, heat treatment, chemical treatment, or other treatments with the same effect may be performed on the first surface 101 and the second surface 202. The heat treatment described herein can achieve an effect including melting at the contact surfaces. The stacked first plate 10 and second plate 20 are joined by melting and subsequent solidification of their contact surfaces; the metal filler 700 on the contact surfaces may also be joined by heat treatment, but is not limited thereto. The present invention does not limit the means of heat treatment, but in some embodiments, heat treatment may include laser welding. Furthermore, the effect of heat treatment is not limited to melting.

[0071] The chemical treatment described herein can achieve effects including surface activation at the contact surfaces. The stacked first plate 10 and second plate 20 are bonded at the contact surfaces through surface activation, for example, by chemical bonding; the metal filler 700 on the contact surfaces can also be connected through chemical treatment, but is not limited thereto. This invention does not limit the means of chemical treatment, but in some embodiments, the chemical treatment may include hybrid bonding. Furthermore, the effects of the chemical treatment are not limited to surface activation.

[0072] The aforementioned treatment and methods for promoting plate bonding can be selected from one or more materials, depending on the materials of the first plate 10 and the second plate 20, and the material of the metal filler 700. In step S950, the first plate 10 and the second plate 20 can be further bonded under appropriate conditions depending on the treatment method and methods. For example, the bonding conditions can be optimized by operations such as temperature, pressure, and time. After bonding, a perforated substrate 1 with blind holes 400' is formed.

[0073] The present invention also provides a perforated substrate. For example... Figure 6 As shown, a perforated substrate 1 according to an embodiment of the present invention includes a first plate 10 and a second plate 20, and has a plurality of holes 30. Among the plurality of holes 30, there is at least one blind hole 400' and at least one pair of alignment vias 300. The blind hole 400' opens onto the surface 100 of the first plate 10 and has a bottom 202'. The bottom 202' is located on the second plate 20 and has a roughness of ≤100 nm. The alignment vias 300 pass through the first plate 10 and the second plate 20, and open onto the surface 100 of one side of the first plate 10 and the surface 200 of one side of the second plate 20. The first plate 10 and the second plate 20 are interconnected. The surfaces 100 and 200 where the openings of the alignment vias 300 are located constitute the surface of the perforated substrate 1.

[0074] The perforated substrate of the present invention can be prepared by one embodiment of the aforementioned manufacturing method. In several embodiments of the present invention, such as... Figure 2 , Figure 3B and Figure 6 As shown, a blind hole 400' can be formed by a first through hole 400 and opens onto the third surface 103 of the first plate 10; the third surface 103 also forms the surface of one side of the perforated substrate 1. The portion of the second surface 202 projected onto the second plate 20 by the first through hole 400 becomes the bottom 202' of the blind hole 400'. The blind hole 400' has a generally vertical inner wall surface 410 and can also be used to mount electronic components. A alignment through hole 300 can be formed by connecting a first alignment through hole 310 and a second alignment through hole 320 in series and opens onto the third surface 103 of the first plate 10 and the fourth surface 204 of the second plate 202. The fourth surface 204 also forms the surface of the other side of the perforated substrate 1.

[0075] like Figure 6 As shown, the perforated substrate 1 further has a bonding layer 600 located between the first plate 10 and the second plate 20. The bonding layer 600 may include, but is not limited to, a molten region, a heat-affected region, a chemically bonded region, a phase change region, an optical heterogeneous region, or a combination thereof. The bonding layer 600 may reflect the processing method, means, and conditions for promoting plate bonding in steps S940 and S950. For example, when the first plate 10 and the second plate 20 are bonded by heat treatment of the contact surface, the bonding layer 600 may include, but is not limited to, a molten region, a heat-affected region, a phase change region, an optical heterogeneous region, or a combination thereof; when the first plate 10 and the second plate 20 are bonded by chemical treatment of the contact surface, the bonding layer 600 may include, but is not limited to, a chemically bonded region.

[0076] In several embodiments of the present invention, such as Figures 6-7 As shown, the perforated substrate 1 further includes a metal filler 700. The metal filler 700 is disposed within the alignment via 300 and can be used for electrical connections of the perforated substrate 1. Figure 7 As shown, the bonding layer 600 may further include a metal bonding region 650, and reflects the treatment method, means, and conditions of the metal filler 700 in steps S940 and S950.

[0077] In summary, this invention provides a method for manufacturing a perforated substrate and a perforated substrate 1. The blind hole 400' of the perforated substrate 1 may have a generally vertical inner wall surface 410 and a substantially horizontal bottom 202' formed by the surface 200 of the second plate 20. The angle (i.e., Taper angle) between the first surface 100 where the opening 401 of the blind hole 400' is located and the inner wall surface 410 may be greater than 80 degrees, thus resulting in a regular spatial shape and improved space utilization. Due to the improved space utilization, the capacity and density of components can also be increased, further enabling compact chip packaging and the thinning of electronic products. Furthermore, compared to substrates where blind holes are formed in a single molding process, especially glass substrates, the method of using two plates joined together to form a perforated substrate in this invention can solve the problem of excessive stress concentration at the corners of blind holes, which may easily lead to breakage in subsequent manufacturing applications.

[0078] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing a perforated substrate, characterized in that, include: A first plate and a second plate are provided; Multiple through holes are formed in the first plate, including: At least one portion is selected on the first plate, and at least one first alignment through hole is formed at the at least one portion; and At least one region is selected on the first plate, and a portion of the first plate is removed from the at least one region to form at least one first through hole; wherein the at least one region is different from the at least one portion; At least one through hole is formed in the second plate, including: At least one portion is selected on the second plate, and at least one second alignment through hole is formed at the at least one portion; The first plate and the second plate are stacked, wherein the at least one first alignment through hole corresponds to the at least one second alignment through hole; and Combine the first plate with the second plate.

2. The method for manufacturing a perforated substrate as described in claim 1, characterized in that, The step of selecting at least one part on the first plate and forming at least one first alignment through hole further includes selecting multiple parts and forming multiple first alignment through holes, and the step of selecting at least one part on the second plate and forming at least one second alignment through hole further includes selecting multiple parts and forming multiple second alignment through holes, wherein the multiple first alignment through holes correspond to the multiple second alignment through holes respectively.

3. The method for manufacturing a perforated substrate as described in claim 1, characterized in that, The step of selecting at least one portion on the first plate and forming at least one first alignment through hole further includes laser processing of the first plate to form at least one first alignment through hole, and the step of selecting at least one portion on the second plate and forming at least one second alignment through hole further includes laser processing of the second plate to form at least one second alignment through hole; the diameters of the at least one first alignment through hole and the at least one second alignment through hole are smaller than the diameter of the at least one first through hole.

4. The method for manufacturing a perforated substrate as described in claim 3, characterized in that, The laser processing step of the first plate further includes drilling, cutting, etching, or a combination thereof on the first plate; the laser processing step of the second plate further includes drilling, cutting, etching, or a combination thereof on the second plate.

5. The method for manufacturing a perforated substrate as described in claim 4, characterized in that, The laser processing step of the first plate further includes cutting the first plate along the edge of the at least one region.

6. The method for manufacturing a perforated substrate as described in claim 4, characterized in that, The laser processing step of the first plate further includes drilling and etching the first plate to form the at least one first alignment through hole; the laser processing step of the second plate further includes drilling and etching the second plate to form the at least one second alignment through hole.

7. The method for manufacturing a perforated substrate as described in claim 1, characterized in that, Further, it includes heat treatment, chemical treatment, or a combination thereof on the first plate, the second plate, or a combination thereof to bond the first plate and the second plate.

8. The method for manufacturing a perforated substrate as described in claim 1, characterized in that, It further includes filling metal in the at least one first alignment through hole and the at least one second alignment through hole.

9. A perforated substrate, characterized in that, It includes a first plate and a second plate and has a plurality of holes; the plurality of holes include: At least one blind hole; the at least one blind hole opens on a surface of the first plate and has a bottom located on the second plate; and At least one pair of through holes; the at least one pair of through holes passes through the first plate and the second plate, and opens on the surface of the first plate and a surface of the second plate; The first plate and the second plate are connected to each other, and the perforated substrate further has a bonding layer located between the first plate and the second plate.

10. The perforated substrate as claimed in claim 9, characterized in that, The diameter of the at least one blind hole is larger than the diameter of the at least one pair of through holes, and the perforated substrate further includes a metal filler disposed in the at least one pair of through holes.

11. The perforated substrate as claimed in claim 9, characterized in that, The bonding layer further includes a molten region, a heat-affected region, a chemically bonded region, a phase change region, an optical heterogeneous region, or a combination thereof.

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