An ai array chip integrated glass

Abstract

The application discloses AI array chip integrated glass, and belongs to the technical field of automobile glass and vehicle-mounted electronic integration. The glass comprises outer glass, inner glass and AI array chips arranged between the outer glass and the inner glass. The outer glass is equal-thickness flat glass. The inner glass is curved glass and is locally provided with chip mounting pits. The AI array chips are arranged in the chip mounting pits and are fixedly connected with flexible carriers. The whole is pressed into laminated glass through PVB material. The application utilizes glass heat conduction and driving wind energy to realize efficient heat dissipation. The embedded structure prevents oxidation of chip solder feet and prolongs service life. The curved surface and equal-thickness design reduces weight cost. Chip staggered arrangement and partitioned layout give consideration to field of view and computing power distribution.

Description

Technical Field

[0001] This invention relates to automotive glass and in-vehicle electronics integration technology, and more particularly to an automotive glass structure that integrates an AI array chip into laminated glass to achieve integrated heat dissipation and protection. Background Technology

[0002] The increasing demand for onboard AI computing power in smart cars presents challenges. Chip arrays generate significant heat, and traditional external mounting methods are prone to oxidation, have poor heat dissipation, occupy space, and negatively impact visibility and vehicle layout. Existing automotive glass lacks chip integration capabilities, making it difficult to meet the integration requirements of high computing power, high reliability, and lightweight design. Summary of the Invention

[0003] To address the aforementioned technical issues, an AI array chip integrated glass is provided, which integrates the AI ​​chip and the glass, improving heat dissipation efficiency, preventing solder pin oxidation, extending lifespan, and ensuring field of view, lightweight design, and structural strength.

[0004] To achieve the above objectives, the present invention discloses an AI array chip integrated glass, comprising an outer glass layer, an inner glass layer, and an AI array chip disposed between the outer glass layer and the inner glass layer. The outer glass layer is a flat glass of uniform thickness, and the inner glass layer is a curved glass with a chip mounting recess in a certain part. The AI ​​array chip is disposed in the chip mounting recess and fixedly connected to a flexible carrier plate. The whole is laminated glass by pressing PVB material.

[0005] Furthermore, the surface of the flexible carrier board is covered with a double-sided electromagnetic shielding film, and the front shielding film has a chip clearance opening.

[0006] Furthermore, the flexible carrier board is provided with potting holes at the positions corresponding to the chip body. At least two potting holes are provided around each chip body. Thermosetting adhesive is injected into the potting holes to seal and fill the chip body with the chip mounting recess.

[0007] Furthermore, the thickness ratio of the inner glass to the outer glass in the open field of view where there is no chip placement is 1:1, and the thickness ratio of the inner glass to the outer glass at the position directly below the chip mounting recess is 1:1.

[0008] Furthermore, the AI ​​array chips are arranged in a staggered manner. The AI ​​array chips include FPC lines disposed on both sides of the flexible substrate surface and chip bodies installed between the FPC lines. Each flexible substrate is independently equipped with a power supply port and a data communication port.

[0009] Furthermore, the flexible substrate integrates an NTC temperature sensor for monitoring the chip body temperature.

[0010] Furthermore, the layout ratio of the AI ​​array chip is as follows: the front and back account for 65% of the total area, and the sides account for 35% of the total area.

[0011] Compared with existing technologies, the beneficial effects of this invention are as follows: it utilizes glass heat absorption and heat conduction, combined with vehicle wind power to achieve efficient passive heat dissipation; the chip is embedded with glass to isolate air and moisture, prevent solder pin oxidation, and extend lifespan; the curved inner layer glass with equal thickness ratio design reduces weight and cost; the staggered arrangement and partitioned layout ensure the distribution of field of view and computing power; the shielding film and potting sealant improve anti-interference and structural reliability. Attached Figure Description

[0012] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0013] Figure 1 This is an exterior view of the vehicle according to the present invention.

[0014] Figure 2 This is a schematic diagram showing the location of the AI ​​array chip inside the laminated glass of the present invention.

[0015] Figure 3 For the present invention Figure 2 Cross-sectional view at point AA.

[0016] Figure 4 For the present invention Figure 2 Cross-sectional view at point BB.

[0017] Figure 5 This is a schematic diagram of the specific structure of the AI ​​array chip of the present invention.

[0018] Figure 6 This is a schematic diagram of the double-sided electromagnetic shielding film of the present invention.

[0019] In the diagram: 1 is the outer glass layer; 2 is the inner glass layer; 3 is the AI ​​array chip; 31 is the flexible carrier board; 311 is the potting port; 32 is the chip body; 33 is the FPC circuit; 34 is the NTC temperature sensor; 35 is the power supply port; 36 is the data communication port; 4 is the thermosetting adhesive; 5 is the electromagnetic shielding film; 51 is the chip clearance port. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0021] One embodiment of the present invention, such as Figure 1 and Figure 2 As shown, the outer glass 1 is a flat glass of uniform thickness to achieve lightweighting, and the inner glass 2 is a curved glass with chip mounting recesses in some areas. The AI ​​array chip 3 is set in the chip mounting recesses and fixedly connected to the flexible carrier board 31. The whole is laminated glass made of PVB material. The AI ​​array chips 3 are arranged in a staggered manner. The AI ​​array chip 3 includes FPC lines 33 set on both sides of the surface of the flexible carrier board 31 and chip bodies 32 installed between the FPC lines 33. Each flexible carrier board 31 is independently equipped with a power supply port 35 and a data communication port 36. The whole utilizes proportional heat absorption, heat conduction and wind energy of the vehicle to achieve efficient passive heat dissipation.

[0022] like Figure 6 As shown, the surface of the flexible carrier board 31 is covered with a double-sided electromagnetic shielding film 5. The front shielding film has a chip clearance opening 51, and the back shielding film is smooth, which improves anti-interference and structural reliability. The chip clearance opening 51 corresponds to the position of the chip mounting recess, ensuring that each chip is installed in place, isolating air and moisture, preventing oxidation of the solder feet, and extending service life.

[0023] like Figure 5 As shown, the flexible substrate 31 is provided with potting holes 311 at the position corresponding to the chip body 32. At least two potting holes 311 are provided around each chip body 32. Thermosetting adhesive 4 is injected into the potting holes 311 to seal and fill the chip body 32 and the chip mounting pit. After potting and curing, it is pressed together with the laminated glass and PVB material under high temperature and pressure. An NTC temperature sensor 34 is integrated on the flexible substrate 31 to monitor the temperature of the chip body 32.

[0024] like Figure 3 and Figure 4 As shown, the thickness ratio of the inner glass 2 to the outer glass 1 in the open field of view where there is no chip placement is 1:1, and the thickness ratio of the inner glass 2 to the outer glass 1 at the position directly below the chip mounting recess is 1:1.

[0025] The layout of AI array chip 3 is as follows: the front and back account for 65% of the total area, and the sides account for 35% of the total area, balancing computing power and field of view.

[0026] Several points need to be clarified: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and the relative positional relationships may change when the absolute position of the described objects changes. Second, in this document, relational terms such as "first" and "second" are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities.

[0027] The examples above are merely illustrative of the present invention and do not constitute a limitation on the scope of protection of the present invention. All designs that are the same as or similar to the present invention are within the scope of protection of the present invention.

Claims

1. An AI array chip integrated glass, comprising an outer glass layer (1), an inner glass layer (2), and an AI array chip (3) disposed between the outer glass layer (1) and the inner glass layer (2), characterized in that, The outer glass (1) is a flat glass of equal thickness, the inner glass (2) is a curved glass and has chip mounting recesses in some areas, the AI ​​array chip (3) is set in the chip mounting recesses and fixedly connected to the flexible carrier plate (31), and the whole is laminated glass by pressing PVB material.

2. The AI ​​array chip integrated glass according to claim 1, characterized in that, The flexible carrier board (31) is covered with a double-sided electromagnetic shielding film (5), and the front shielding film has a chip clearance opening (51).

3. An AI array chip integrated glass according to claim 1, characterized in that, The flexible carrier board (31) is provided with a potting hole (311) at the position corresponding to the chip body (32). Each chip body (32) has at least two potting holes (311) around its perimeter. Thermosetting adhesive (4) is injected into the potting hole (311) to seal and fill the chip body (32) with the chip mounting recess.

4. An AI array chip integrated glass according to claim 1, characterized in that, The thickness ratio of the inner glass (2) to the outer glass (1) in the open field of view where no chip is placed is 1:1, and the thickness ratio of the inner glass (2) to the outer glass (1) at the position directly below the chip mounting recess is 1:

1.

5. An AI array chip integrated glass according to claim 1, characterized in that, The AI ​​array chip (3) is arranged in a staggered manner. The AI ​​array chip (3) includes FPC lines (33) set on both sides of the surface of the flexible carrier board (31) and chip body (32) installed between the FPC lines (33). Each flexible carrier board (31) is independently provided with a power supply port (35) and a data communication port (36).

6. An AI array chip integrated glass according to claim 1, characterized in that, The flexible substrate (31) integrates an NTC temperature sensor (34) for monitoring the temperature of the chip body (32).

7. An AI array chip integrated glass according to claim 1, characterized in that, The layout ratio of the AI ​​array chip (3) is: the front and back account for 65% of the whole, and the sides account for 35% of the whole.

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