Cooling device, substrate processing device, and method for cooling a processing liquid

Abstract

This invention provides a cooling apparatus, a substrate processing apparatus, and a cooling method for a processing liquid. The cooling apparatus of this invention includes: a refrigerant output section that outputs refrigerant; a heat exchanger that cools the processing liquid by heat exchange with the refrigerant; a supply flow path forming section that forms a refrigerant supply flow path that circulates the refrigerant between the refrigerant output section and the heat exchanger; a bypass flow path forming section that forms a bypass flow path that allows the refrigerant output from the refrigerant output section to return to the refrigerant output section without passing through the heat exchanger; a temperature detection section that detects the temperature of the processing liquid output from the heat exchanger; and a control section that, based on the detection result of the temperature detection section, adjusts the flow rate ratio of the refrigerant flowing in the refrigerant supply flow path and the bypass flow path, respectively, thereby controlling the temperature of the processing liquid output from the heat exchanger.

Description

Technical Field

[0001] The present invention relates to, for example, techniques for cooling and outputting a processing liquid used for substrate processing. Background Technology

[0002] For example, in the manufacturing processes of various substrates such as semiconductor substrates and glass substrates, processing solutions of various compositions and temperatures are used to process the substrates. As such processing solutions, it is sometimes necessary to cool high-purity water such as deionized water or pure water to near its freezing point (0°C) (here, simply referred to as "cold water"). For example, in the technology described in Japanese Patent Application Publication No. 2024-134431 (Patent Document 1) previously disclosed by the applicant of this application, it is described that DIW (Deionized Water), which is a refrigerant whose temperature is adjusted to a low temperature, is brought into contact with the back side of the substrate for the purpose of cooling the substrate that is heated during the processing.

[0003] One method for generating such a low-temperature processing liquid is to introduce refrigerant and processing liquid into a heat exchanger, cooling the processing liquid through heat exchange between them. As the refrigerant in this case, for example, a refrigerant cooled by a device called a cooler is considered. Such a cooling device is suitable for maintaining the refrigerant temperature at a constant temperature lower than room temperature; however, it lacks adaptability to temperature changes. That is, a relatively long time is required until the refrigerant temperature stabilizes at the new target temperature. Therefore, when refrigerant output from a cooling device is introduced into a heat exchanger for cooling the processing liquid, the refrigerant temperature is changed, and further time is needed until it is reflected in the temperature of the processing liquid.

[0004] Thus, methods that change the refrigerant temperature to adjust the temperature of the processing liquid are difficult to precisely adjust due to their low responsiveness. Especially when the target cooling temperature of the processing liquid is close to its freezing point, a high degree of temperature control is required to prevent the processing liquid from freezing. Summary of the Invention

[0005] The present invention was made in view of the above-mentioned problems, and provides a cooling technology that can be used even when the target temperature is close to the freezing point and has excellent controllability.

[0006] One aspect of the present invention is a cooling apparatus for cooling and outputting a processed liquid, the cooling apparatus comprising: a refrigerant output section for outputting refrigerant; a heat exchanger for cooling the processed liquid by heat exchange with the refrigerant; a supply flow path forming section for forming a refrigerant supply flow path that circulates the refrigerant between the refrigerant output section and the heat exchanger; a bypass flow path forming section for forming a bypass flow path that allows the refrigerant output from the refrigerant output section to return to the refrigerant output section without passing through the heat exchanger; a temperature detection section for detecting the temperature of the processed liquid output from the heat exchanger; and a control section for adjusting the flow rate ratio of the refrigerant flowing in the refrigerant supply flow path and the bypass flow path respectively, based on the detection result of the temperature detection section, thereby controlling the temperature of the processed liquid output from the heat exchanger.

[0007] In this invention, the refrigerant output from the refrigerant outlet is distributed into a flow path via the heat exchanger and a bypass flow path without passing through the heat exchanger. Furthermore, the flow ratio between them is adjusted based on the temperature detection results of the processed liquid. In this structure, only the refrigerant supplied to the heat exchanger contributes to cooling the processed liquid within the refrigerant output from the refrigerant outlet. The greater its quantity, the higher the cooling capacity of the processed liquid in the heat exchanger. In other words, the cooling capacity of the heat exchanger varies depending on the flow rate of the input refrigerant.

[0008] In this invention, the flow rate ratio of the dispensed refrigerant is adjusted based on the temperature detection results of the processing liquid, thereby controlling the temperature of the processing liquid. Therefore, it is not necessary to change the temperature of the refrigerant itself, eliminating the problem of poor responsiveness caused by this. More precisely, changing the refrigerant flow rate based on the temperature detection results of the processing liquid leaves a certain time delay before the change is reflected in the temperature of the processing liquid. However, the refrigerant flow rate itself changes immediately, thus achieving a significant improvement compared to the time delay when the refrigerant temperature is changed.

[0009] On the other hand, the refrigerant flow ratio can, in principle, be continuously and steplessly changed. Therefore, the temperature of the cooled output liquid can be highly controlled; that is, the temperature of the liquid can be finely adjusted. Thus, even when the target cooling temperature is close to the freezing point of the liquid, the temperature can be stably maintained without freezing.

[0010] Another aspect of the present invention is a substrate processing apparatus comprising: a cooling unit having the same structure as the cooling apparatus described above; a substrate processing unit that processes a substrate using the processing liquid output from the cooling unit; and a supply pipe that supplies the processing liquid from the cooling unit to the substrate processing unit. In this invention, based on the same principle as the cooling apparatus described above, a processing liquid at the required and stable temperature can be supplied to the substrate processing unit. Therefore, the substrate can be processed effectively in the substrate processing unit.

[0011] Another aspect of the present invention is a cooling method for cooling and outputting a processed liquid, wherein a refrigerant supplied from a refrigerant supply source is diverted at a predetermined flow rate ratio to a flow path that inputs the refrigerant into a heat exchanger and a flow path that bypasses the heat exchanger. In the heat exchanger, the processed liquid is cooled by heat exchange with the refrigerant. The temperature of the processed liquid output from the heat exchanger is detected, and the flow rate ratio is adjusted based on the detection result, thereby controlling the temperature of the processed liquid.

[0012] In this invention, refrigerant is distributed between a flow path through a heat exchanger and a flow path without a heat exchanger, and the flow ratio is adjusted based on the temperature detection results of the output processed liquid. Therefore, by using the same principle as the aforementioned cooling device invention, excellent temperature control and stability can be achieved.

[0013] As described above, according to the present invention, the temperature of the processing liquid is controlled by adjusting the flow rate input to the heat exchanger, rather than the temperature of the refrigerant. The refrigerant flow rate can, in principle, be infinitely varied, thus enabling precise control of the processing liquid temperature with excellent controllability. Therefore, even when the target cooling temperature is close to the freezing point of the processing liquid, freezing of the processing liquid can be prevented. Attached Figure Description

[0014] Figure 1 This is a diagram showing the schematic structure of a first embodiment of the substrate processing system.

[0015] Figure 2 This is a diagram showing an example of the structure of a cooling unit.

[0016] Figures 3A to 3C This is a diagram showing an example of the structure of a heat exchanger.

[0017] Figure 4A and Figure 4B This diagram illustrates the temperature adjustment process within the cooling unit.

[0018] Figure 5 This is a flowchart illustrating the temperature adjustment process in this embodiment.

[0019] Figure 6 This is a diagram showing the schematic structure of a second embodiment of the substrate processing system. Detailed Implementation

[0020] <First Implementation Method>

[0021] Figure 1 This diagram illustrates a schematic structure of a first embodiment of a substrate processing system equipped with the cooling device of the present invention. The substrate processing system S includes a processing liquid supply unit 1 and a substrate processing unit 9. The processing liquid supply unit 1 cools pure water or deionized water supplied from an external supply source to a predetermined temperature and outputs it as a processing liquid. The substrate processing unit 9 uses the processing liquid supplied from the processing liquid supply unit 1 to process the substrate to be processed. In the following description, the processing liquid is typically described as DIW. In the substrate processing unit 9, methods such as directly supplying the processing liquid to the substrate or mixing the processing liquid with other chemicals, organic solvents such as IPA (isopropanol), and supplying it to the substrate are possible. Furthermore, the substrate to be processed can be, for example, a semiconductor wafer, but is not limited to this. Additionally, the processing performed in the substrate processing unit 9 is typically represented by supplying the processing liquid, chemicals, etc., to the substrate and performing rinsing, wet cleaning, wet etching, etc., but is not particularly limited.

[0022] The processing liquid supply unit 1 has a piping system 2 for supplying DIW to the substrate processing unit 9. Various functional units are appropriately arranged on the piping to form a flow path for the processing liquid. More specifically, a control valve 211 is inserted into the piping 21 that connects to an external DIW supply source, and the end of the piping 21 is connected to a primary storage tank 51. When the control valve 211 is opened according to a control command from the control unit 8, which is responsible for the operation of the entire device, room temperature (RT) DIW supplied from the outside flows into the primary storage tank 51 through the piping 21.

[0023] Furthermore, in the following description, when referring to "flow direction," "upstream side," and "downstream side" at various locations in the flow path of the processing liquid or refrigerant, unless otherwise specified, they refer to the flow direction of the liquid at that location in the flow path, the upstream side of that direction, and the downstream side.

[0024] A piping 22 is connected to the lower part of the primary storage tank 51. A flow meter 221, a liquid delivery pump 222, a pressure sensor 223, a temperature sensor 224, a cooling unit 3, a pressure sensor 225, a control valve 226, a filter 227, etc., are connected to the piping 22. Additionally, these functional components can be appropriately added to locations not shown in the diagram, or some can be omitted. For example, in the heat exchanger 35 located in the cooling unit 3... Figure 2The pressure drop caused by the pressure loss of the heat exchanger 35 between the upstream (primary side) and downstream (secondary side) of the heat exchanger 35 can be obtained or calculated through prior experiments or simulations. Therefore, the pressure sensor 225 downstream of the heat exchanger 35 can also be configured to omit this component.

[0025] Flow meter 221 and the flow meter described later detect the flow rate of the liquid in the flow path. Liquid delivery pump 222 and the liquid delivery pump described later deliver liquid supplied from the upstream side of the flow path to the downstream side. Pressure sensor 225 and the pressure sensor described later detect the pressure of the liquid in the flow path. Temperature sensor 224 and the temperature sensor described later detect the temperature of the liquid in the flow path.

[0026] The flow meter, liquid delivery pump, pressure sensor, and temperature sensor are communicatively connected to the control unit 8, and the output signals from each of these sensors are sent to the control unit 8. Each liquid delivery pump and each control valve (described later) operates according to control commands from the control unit 8, adjusting the flow of the processed liquid in the flow path. The control unit 8 controls the operation of the liquid delivery pumps and control valves based on a pre-prepared control program and signals sent from sensors such as the flow meter, pressure sensor, and temperature sensor.

[0027] Cooling unit 3 has the function of reducing the temperature of the input liquid and outputting it. The final temperature of the processed liquid output from cooling unit 3 is not particularly limited; for example, the final temperature can be set to a temperature lower than room temperature and slightly higher than the freezing point of DIW (0°C), such as 5°C. Cooling unit 3 can be a single unit, but for example, in order to efficiently reduce the temperature of the processed liquid supplied at room temperature to the target temperature in a shorter time, it is desirable to connect multiple cooling units 3 in series. Figure 1 The example provided has four sets of cooling units 3. Alternatively, to increase the amount of cooling fluid, multiple cooling units 3 can be connected in parallel. The cooling units 3 will be described in detail later.

[0028] Pipe 22 branches into pipes 23 and 24 downstream of filter 227. A control valve 231 is inserted into pipe 23, and the end of pipe 23 is connected to the primary storage tank 51. That is, pipes 22 and 23 function as a circulation path for circulating the processed liquid relative to the primary storage tank 51. A delivery pump 222 for pressurizing the processed liquid and a cooling unit 3 for cooling the processed liquid are inserted into pipe 22, so that the processed liquid circulates in the circulation path, and the processed liquid in the primary storage tank 51 is maintained at a predetermined temperature lower than room temperature.

[0029] A control valve 241 is inserted into another pipe 24, the end of which is connected to a secondary storage tank 52. The cooled treatment fluid, transported via the pipe 24, flows into the secondary storage tank 52, where it is stored.

[0030] Two systems, delivery pipes 25 and 26, are connected to the lower part of the secondary storage tank 52. A liquid delivery pump 251, a temperature sensor 252, a cooling unit 3, and a control valve 253 are connected to pipe 25. Two sets of cooling units 3 are connected in series. Additionally, as needed, flow meters, temperature sensors, pressure sensors, and other functional components may be added, or some may be omitted. The end of pipe 25 is connected to the substrate processing unit 9. The liquid delivery pump 251 pressurizes the processing liquid supplied from the secondary storage tank 52 downstream. The processing liquid, after being temperature-adjusted by the two sets of cooling units 3 connected in series, is delivered to the substrate processing unit 9 via the control valve 253.

[0031] Similarly, a liquid delivery pump 261, a temperature sensor 262, a cooling unit 3, and a control valve 263 are connected to the piping 26. In addition, depending on the needs, flow meters, temperature sensors, pressure sensors, and other functional components may be added, or some may be omitted. The end of the piping 26 is connected to the substrate processing unit 9. The liquid delivery pump 261 pressurizes the processing liquid supplied from the secondary storage tank 52 downstream. The processing liquid, whose temperature has been finally adjusted by the two sets of cooling units 3 connected in series, is sent to the substrate processing unit 9 via the control valve 263.

[0032] Furthermore, the substrate processing unit 9 and the secondary storage tank 52 are connected via piping (return piping) 27 and 28 of the two systems. A control valve 271 is inserted into piping 27. Processing liquid returning from the substrate processing unit 9 flows into the secondary storage tank 52 via piping 27. Similarly, a control valve 281 is inserted into piping 28. Processing liquid returning from the substrate processing unit 9 flows into the secondary storage tank 52 via piping 28.

[0033] Thus, between the processing liquid supply unit 1 and the substrate processing unit 9, two independent delivery piping systems and two independent return piping systems are provided as the flow path for the processing liquid to flow between the two. More specifically, the processing liquid delivered to the substrate processing unit 9 via piping 25 is ultimately returned to the secondary storage tank 52 via piping 27. Furthermore, the processing liquid delivered to the substrate processing unit 9 via piping 26 is ultimately returned to the secondary storage tank 52 via piping 28.

[0034] Therefore, the processing liquid supply unit 1 can supply processing liquid to the two sets of processing units that are independently arranged in the substrate processing unit 9. The temperature and flow rate of these processing liquids can be made different as needed. Furthermore, in this example, two systems are provided for supplying and recovering processing liquid to the substrate processing unit 9 as described above, but their number can be appropriately changed according to the requirements of the substrate processing unit 9.

[0035] Furthermore, a circulation pipe 255, branching upstream of the control valve 253, is provided on the delivery pipe 25, and the end of the circulation pipe 255 is connected to the return pipe 27. A control valve 256 is inserted into the circulation pipe 255. Similarly, a circulation pipe 265, branching upstream of the control valve 263, is provided on the delivery pipe 26, and the end of the circulation pipe 265 is connected to the return pipe 28. A control valve 266 is inserted into the circulation pipe 265.

[0036] The delivery pipe 25 and the return pipe 27 form a circulation path that includes the substrate processing unit 9. A cooling unit 3 is provided on this circulation path, thus enabling the delivery of a temperature-stable processing liquid to the substrate processing unit 9. Alternatively, by circulating the processing liquid via the circulation pipe 255, the processing liquid can be circulated within the processing liquid supply unit 1 without being delivered to the substrate processing unit 9. The same applies to the delivery pipe 26 and the return pipe 28.

[0037] The parts of the piping and functional components that come into contact with the treatment liquid in the piping system 2 are made of resin material. Fluoropolymers, such as PFA (perfluoroalkoxy alkane) resin or PTFE (polytetrafluoroethylene) resin, can be appropriately used as materials that do not allow impurities such as metal ions to dissolve into the treatment liquid.

[0038] Figure 2 This is a diagram illustrating an example of the structure of a cooling unit. Multiple cooling units 3 installed in the piping system 2 are based on the same principle, but their size (capacity) and cooling capacity do not necessarily need to be the same; they can be appropriately selected according to the temperature and flow rate of the processing fluid to be handled by each cooling unit 3.

[0039] The cooling unit 3 has a refrigeration circuit 31, a circulating fluid circuit 33, and a heat exchanger 35 as its main structures. Furthermore, as for the refrigeration circuit 31, a commercially available refrigeration circuit can be used; therefore, only the minimum structure required for principle explanation is illustrated here, and its function is simply explained. Additionally, pressure sensors and temperature sensors that are appropriately installed in the flow path as needed are omitted from description.

[0040] In cooling unit 3, a second refrigerant circulating in circulating liquid circuit 33 is cooled using a first refrigerant cooled by refrigeration circuit 31. Heat exchanger 35 then uses this cooled second refrigerant to cool the processing liquid. As a result, the processing liquid is cooled to the desired target cooling temperature. The reason for cooling the processing liquid in this two-stage cooling process with the circulating liquid circuit 33 sandwiched in is to remove metals that could become contaminants from the piping and other parts that come into contact with the DIW (distilled liquid) as processing liquid, thus outputting high-purity DIW.

[0041] The refrigeration circuit 31, also known as a cooler, includes a compressor 311, an air-cooled condenser 312, an evaporator 313, and piping 314 connecting them to form a circulation path. The circulation path is filled with a suitable refrigerant (first refrigerant), such as Freon or a Freon substitute, at high pressure. The refrigerant, compressed and pressurized by the compressor 311 and the air-cooled condenser 312, vaporizes in the evaporator 313, absorbing heat from the surrounding environment, thereby cooling the object. Here, a second refrigerant, filled in the circulating liquid circuit 33, is used to cool the object.

[0042] A fan motor 315 is positioned near the air-cooled condenser 312 to dissipate the condensation heat generated by the first refrigerant to the outside. Additionally, although not shown in the diagram, functional components such as the expansion valve, pressure sensor, and temperature sensor are appropriately positioned within the refrigeration circuit 31.

[0043] The circulating liquid circuit 33 delivers the refrigerant (second refrigerant) cooled by the refrigeration circuit 31 to the downstream heat exchanger 35. For this purpose, the circulating liquid circuit 33 includes a structure with a storage tank 331, a liquid delivery pump 332, control valves 333, 335, and 336, and a flow meter 334 inserted into a piping 34. More specifically, the piping 34 includes a piping 341 connecting the lower part of the storage tank 331 to the input port 352 of the heat exchanger 35, a piping 342 connecting the output port 353 of the heat exchanger 35 to the evaporator 313, a piping 343 connecting piping 341 and piping 342, and a piping 344 connecting the evaporator 313 to the storage tank 331.

[0044] A liquid delivery pump 332, a control valve 333, and a flow meter 334 are connected to piping 341. Additionally, a control valve 336 is connected to piping 342. Piping 343 is configured to connect the downstream side of the flow meter 334 in piping 341 to the downstream side of the control valve 336 in piping 342, and a control valve 335 is installed in its flow path.

[0045] According to control commands from control unit 8, liquid pump 332 pumps refrigerant, and when control valve 333 opens, refrigerant from storage tank 331 is supplied to heat exchanger 35. Additionally, by opening control valve 336, piping 342 can receive refrigerant returning from heat exchanger 35. Furthermore, by opening control valve 335, at least a portion or all of the refrigerant pumped by liquid pump 332 can bypass heat exchanger 35 and flow into piping 342.

[0046] As described later, in this embodiment, the circulating liquid circuit 33 circulates a refrigerant at a constant temperature and flow rate. The temperature of the process liquid (DIW) output from the heat exchanger 35 is controlled by distributing the refrigerant between the heat exchanger 35 and the piping 343 at a predetermined flow ratio.

[0047] The refrigerant flowing from heat exchanger 35 and piping 343 into piping 342 returns to storage tank 331 via evaporator 313 and piping 344. Thus, a flow path is formed in the circulating liquid circuit 33 for the refrigerant (second refrigerant) to circulate from storage tank 331 through evaporator 313, and the second refrigerant, cooled by evaporator 313, circulates within the circulating liquid circuit 33. This stabilizes the temperature of the circulating refrigerant.

[0048] A pressure sensor 337 and a temperature sensor 338 are installed downstream of the liquid delivery pump 332 in piping 341. Additionally, a temperature sensor 339 is installed downstream of the confluence point of piping 342 and piping 343. Based on the output signals from these sensors, the control unit 8 controls the liquid delivery pump 332 and control valves 333, 335, and 336 to deliver refrigerant at a predetermined temperature and flow rate into the heat exchanger 35.

[0049] As the second refrigerant, a liquid capable of cooling to a temperature lower than the final target cooling temperature of the processed liquid (5°C in this example; hereinafter referred to as the "final target temperature") without freezing is used. For example, ethylene glycol (EG) or an aqueous solution thereof with a melting point of -13°C can be preferably used. In addition, the temperature of the second refrigerant is maintained at a temperature lower than the target temperature of the processed liquid that should be output by the cooling unit 3.

[0050] As will be explained in detail later, the heat exchanger 35 has an input port 355a for receiving the process liquid (DIW) to be cooled, an output port 356a for outputting the cooled DIW, an input port 352 for receiving the second refrigerant, and an output port 353 for discharging the refrigerant.

[0051] The DIW (distilled water) to be cooled is input to the input port 355a. Additionally, a pipe 375 for bypassing the heat exchanger 35 is provided between the input port 355a and the output port 356a, and a control valve 376 is inserted into the pipe 375. The control valve 376 is opened as needed, thereby bypassing the heat exchanger 35. For example, if the temperature of the input DIW is already below the target temperature, bypassing the heat exchanger 35 can prevent excessive temperature drop.

[0052] On the output side of the heat exchanger 35, more specifically, a temperature sensor 378 is provided downstream of the confluence point of the output from the heat exchanger 35 and the output from the piping 375. Therefore, the temperature sensor 378 detects the temperature of the cooled DIW output from the heat exchanger 35, or the temperature of the uncooled DIW flowing in through the heat exchanger 35.

[0053] Multiple cooling units 3, configured as described above, are arranged in the flow path as needed. In this embodiment, four sets of cooling units 3 are connected in series on pipe 22. Additionally, two sets of cooling units 3 are also connected in series on pipes 25 and 26 respectively. Figure 1 As shown, a temperature sensor 224 is installed on the input side of the upstream cooling unit among the multiple cooling units 3 connected in series on the piping 22, i.e., on the upstream side of the cooling unit 3. In addition, temperature sensors 252 and 262 are also installed on the piping 25 and 26, respectively.

[0054] Moreover, such as Figure 2 As shown, in each cooling unit 3, a temperature sensor 378 is provided at its output section, specifically at the confluence point of the output from the heat exchanger 35 and the output from the piping 375. This temperature sensor 378 detects the temperature of the DIW output by the cooling unit 3. This is based on the temperature of the input DIW from the perspective of other cooling units 3 located downstream of the current cooling unit 3. Thus, for each heat exchanger 35, temperature sensors are provided on both its input and output sides.

[0055] Figures 3A to 3C This is a diagram showing an example of the structure of a heat exchanger. More specifically, Figure 3A This is a diagram showing the appearance of heat exchanger 35. Figure 3A In the diagram, the dashed line represents its imaginary central axis AX. Additionally, Figure 3B This is a longitudinal sectional view showing a section along the central axis AX of the heat exchanger 35. Figure 3C It is a cross-sectional view showing a section orthogonal to the central axis AX.

[0056] The heat exchanger 35 has a housing 351 that is generally cylindrical in shape, extending along the central axis AX, and hollow inside, in other words, blocked at both ends of the cylinder. On the side of the housing 351, an inlet port 352 is provided near one end 351a, and an outlet port 353 is provided near the opposite end 351b. Refrigerant supplied from the circulating fluid circuit 33 flows through the inlet port 352 into the internal space defined by the inner wall of the housing 351, and flows out through the outlet port 353. The refrigerant flowing into the internal space of the housing 351 fills the outside of the inner tube inserted into the internal space for DIW flow. The space within the internal space of the housing 351, excluding the space occupied by the inner tube and its interior, is called the flow space Sc. The refrigerant supplied from the circulating fluid circuit 33 to the heat exchanger 35 flows through the flow space Sc.

[0057] A plurality of inner tubes 354 are inserted through the flow space Sc from one end 351a to the other end 351b of the housing 351. At one end 351a, the inner tube 354 terminates at a terminal member 355, and the internal space Sd of the inner tube 354 communicates with the internal space St of the terminal member 355. Similarly, at the other end 351b, the inner tube 354 terminates at a terminal member 356, and the internal space Sd of the inner tube 354 communicates with the internal space Su of the terminal member 356. Therefore, between the terminal members 355 and 356, their internal spaces St and Su are connected via the internal space Sd of the inner tube 354.

[0058] An input port 355a for receiving DIW (distilled water) as the object to be cooled is provided at the end of the terminal component 355. An output port 356a for discharging DIW is provided at the end of the terminal component 356. The input port 355a is connected to one end of each of the plurality of inner tubes 354, and the other end of each inner tube 354 is connected to the output port 356a. Therefore, the plurality of inner tubes 354 are arranged in parallel within the flow path of the DIW. The DIW flowing into the internal space St from the input port 355a branches into the plurality of inner tubes 354, flows out through each internal space Sd into the internal space Su, and is discharged downstream of the heat exchanger 35 through the output port 356a. In other words, the terminal component 355 and the plurality of inner tubes 354 function as a manifold for branching DIW, and the plurality of inner tubes 354 and the terminal component 356 function as a manifold for merging DIW.

[0059] Furthermore, in the following description, when it is necessary to distinguish between input port 355a and input port 352, they will be referred to as "DIW input port 355a" and "refrigerant input port 352," respectively. Similarly, when it is necessary to distinguish between output port 356a and output port 353, they will be referred to as "DIW output port 356a" and "refrigerant output port 353," respectively.

[0060] The inner tube 354 and the terminal components 355 and 356 are formed of a resin material that does not leach impurities such as metal ions. Similar to other piping, fluoropolymer materials such as PFA resin can be appropriately used. For example, PFA can be used to manufacture the inner tube 354. Furthermore, for the terminal components 355 and 356, which require complex shapes, PTFE resin can be used in addition to PFA resin. Moreover, the terminal components 355 and 356 can be made to have the same shape as each other.

[0061] Terminal components 355 and 356 are fixed to housing 351 by cover components 357 and 358, respectively. Specifically, terminal component 355 is mounted to one end 351a of housing 351 by being clamped between one end 351a and cover component 357. Similarly, terminal component 356 is mounted to the other end 351b of housing 351 by being clamped between the other end 351b and cover component 358. Cover components 357 and 358 may have the same shape.

[0062] The housing 351 and the cover components 357 and 358 are made of metal, such as stainless steel, and are connected to each other by bolts or other connecting components not shown. As will be described later, the refrigerant and DIW are supplied to the heat exchanger 35 under pressure, but by making the housing 351 a robust metal material, it can withstand such pressure. The resin-made terminal components 355 and 356 are not very resistant to pressure on their own, but by using the cover components 357 and 358 to reinforce them from the outside, they can also withstand such pressure.

[0063] The flow space Sc and the internal space Sd of the inner tube 354 are isolated from each other by the tube wall of the inner tube 354, and the refrigerant flowing in the flow space Sc is isolated from the DIW flowing in the internal space Sd. The outer surface of the tube wall is in contact with the low-temperature refrigerant. Therefore, the DIW is cooled by heat exchange with the refrigerant through the tube wall and is output from the output port 356a at a lower temperature than when it is input from the inlet port 355a. Multiple inner tubes 354 run through the inside of the housing 351, thus enabling high-efficiency cooling of the DIW. Here, the refrigerant and DIW flow in the same direction within the heat exchanger 35 (in... Figure 3A (From center to right), but for example, the refrigerant input and output can be reversed so that the refrigerant flow direction is opposite to the DIW flow direction.

[0064] Furthermore, in the case of multi-stage connected cooling units 3, the cooling target temperature of each cooling unit 3 does not need to be the final target temperature. That is, in the structure that uses multi-stage cooling units 3 to make the DIW reach the final target temperature in stages, the temperature reduction in each cooling unit 3 can be smaller. In this case, the temperature of the input DIW and the temperature of the output DIW are different for each cooling unit 3, therefore, the construction and specifications of each cooling unit 3 do not necessarily need to be the same.

[0065] Next, the specific method for adjusting the temperature of the processing fluid using cooling unit 3 will be explained. First, to explain the principle, refer to... Figure 4A and Figure 4B The temperature adjustment method for a single cooling unit 3 will be explained. Furthermore, the cooling unit 3 located at the upstream end of the piping 22 will be used as an example for explanation, but the operation is the same for cooling units 3 in other locations.

[0066] Figure 4A and Figure 4B This diagram illustrates the temperature adjustment process within the cooling unit. More specifically, Figure 4A This is a schematic diagram of the structure of cooling unit 3. Figure 4B This is a graph showing the relationship between the opening degree of the control valve in circulator loop 33 and the DIW temperature. Figure 4A In the diagram, the dashed arrow indicates the flow of refrigerant delivered by the liquid pump 332 and input into the heat exchanger 35, with its flow rate indicated by the symbol F1. Additionally, the dashed arrow indicates the flow of refrigerant bypassed by the piping 343 and not passing through the heat exchanger 35, with its flow rate indicated by the symbol F2.

[0067] The refrigerant pump 332 consistently delivers refrigerant at a constant temperature and flow rate. The refrigerant delivered at a constant flow rate is distributed to the heat exchanger 35 and piping 343, with the flow rate ratio determined by the opening degrees of control valves 335 and 336. The overall flow rate (F1+F2) remains constant regardless of the opening degrees of control valves 335 and 336.

[0068] Control valves 335 and 336 are flow regulating valves, and their opening degrees are adjusted complementaryly by the control unit 8. That is, when control valve 335 is 100% open, control valve 336 is 0% open; as the opening of control valve 335 decreases, the opening of control valve 336 increases. Finally, when control valve 335 is 0% open, control valve 336 is 100% open.

[0069] The symbol T1 represents the temperature of the DIW input to the heat exchanger 35, detected by the temperature sensor 224. The symbol To represents the temperature of the DIW output from the heat exchanger 35, detected by the temperature sensor 378.

[0070] exist Figure 4B In the diagram, the horizontal axis represents the opening degree of control valve 335. Further explanation is omitted below, but as described above, when the opening degree of control valve 335 changes from 0% to 100%, complementaryly, the opening degree of control valve 336 changes from 100% to 0%. For example... Figure 4B As shown in the upper diagram, when the control valve 335 is 0% open, all the refrigerant flows into the heat exchanger 35. Therefore, the temperature of the DIW output from the heat exchanger 35 is at its lowest at this time, denoted by the symbol T2.

[0071] As the opening of control valve 335 increases from 0%, flow rate F1 decreases, while flow rate F2 increases. The amount of refrigerant flowing into heat exchanger 35 decreases, and the temperature of DIW output from heat exchanger 35 rises. When the opening of control valve 335 reaches 100%, no refrigerant flows into heat exchanger 35, and therefore the temperature of DIW becomes the same as the input temperature T1. Furthermore, for the sake of explanation, it is assumed here that the opening of control valve 335 has a linear relationship with the temperature of DIW, but this is not necessarily true. However, the tendency for the temperature of DIW output from heat exchanger 35 to increase monotonically with increasing opening of control valve 335 remains unchanged.

[0072] Therefore, the temperature To of DIW can take any value between temperature T2 and temperature T1 when the opening degree of control valve 335 is any value X. That is, the temperature of DIW can be adjusted by adjusting the opening degree of control valve 335 (and control valve 336).

[0073] Furthermore, in order to set the output DIW temperature to a preset target temperature, the output DIW temperature T2 must be lower than the target temperature when all the refrigerant is input to the heat exchanger 35. The temperature and flow rate of the refrigerant circulating in the circulating liquid circuit 33 are set to meet this condition. The operating conditions of the circulating liquid circuit 33, set in this way, do not change in subsequent operations. That is, as long as the circulator circuit 33 has the function of delivering refrigerant at a constant temperature and a constant flow rate, even if the responsiveness is low, it will not be a problem in the temperature adjustment of the DIW.

[0074] In this temperature adjustment method, the cooling capacity of the heat exchanger 35 changes immediately by increasing or decreasing the refrigerant flow rate, thereby changing the temperature of the DIW. More precisely, a time delay corresponding to the heat capacity of the heat exchanger 35 itself occurs, but this is sufficiently small compared to the response delay caused by the heat capacity of the circulating liquid loop 33 when the refrigerant temperature changes. Furthermore, as described above, the temperature of the DIW can be steplessly adjusted by controlling the opening degree of valves 335 and 336.

[0075] Therefore, if the temperature detection of the DIW by the temperature sensor 378 and the opening adjustment of the control valves 335 and 336 based on the result are performed with a sufficiently short control cycle, the temperature To of the DIW output by the cooling unit 3 can be controlled with excellent controllability and stability. In particular, the feature of being able to immediately raise the temperature when the temperature To of the DIW is lower than the target temperature is a significant advantage in reliably preventing the DIW from freezing even when the target temperature is set close to the freezing point.

[0076] The temperature adjustment described above can be performed in each of the series-connected cooling units 3. In particular, when the temperature of the DIW to be cooled is sufficiently high relative to the final target temperature, such as when the processing fluid supply unit 1 is started, the temperature of the DIW can be reduced in a short time by adding the cooling capacities of each cooling unit 3. On the other hand, when the temperature of the input DIW has been sufficiently reduced beforehand, the series-connected cooling units 3 only need to provide enough cooling capacity to compensate for the temperature rise of the DIW as a whole, and it is not necessary for all of them to operate. For example, by operating only one or two sets of cooling units 3 located downstream in the arrangement of the series-connected cooling units 3, the temperature of the already cooled DIW can be maintained.

[0077] To enable such temperature adjustment, for example, for each of the multiple cooling units 3 connected in series, it is possible to set the target temperature to be higher for the upstream cooling unit and lower for the downstream cooling unit. Based on this, if the target temperature of the downstream cooling unit 3 is set to the final required DIW temperature, the required DIW temperature can be stably output.

[0078] Thus, when the temperature of the DIW is higher than the target temperature, each cooling unit 3 operates to cool the DIW to the target temperature. On the other hand, if the temperature of the input DIW is already lower than the target temperature, the cooling unit 3 outputs the DIW without further cooling. Therefore, over-cooling of the DIW can be avoided. For example, the target temperature in the downstream cooling unit 3 can be set as the final target temperature, and the target temperature in one of the upstream cooling units 3 can be set to be about 1°C to 2°C higher than the final target temperature. Thus, the temperature adjustment range of the downstream cooling unit 3 only needs to be about 1°C to 2°C, thereby suppressing the temperature fluctuation of the final output DIW to about 1°C. Therefore, the problem of the DIW freezing due to excessive temperature drop can also be avoided.

[0079] Figure 5This is a flowchart illustrating the temperature adjustment process in this embodiment. This process is achieved by the control unit 8 executing a pre-prepared control program, causing each part of the device to perform predetermined actions. First, the circulation of the DIW to be cooled begins (step S101). That is, the DIW supplied from the outside via piping 21 and stored in the primary storage tank 51 circulates in the circulation path via piping 22 and 23. Specifically, control valve 226 on piping 22 and control valve 231 on piping 23 are opened, and the liquid pump 222 delivers DIW at a constant flow rate, thereby circulating the DIW back to the primary storage tank 51 via piping 22 and 23.

[0080] In the initial stage of processing, the control valve 335 of each cooling unit 3 is 0% open, i.e., the control valve 335 is closed (step S102). On the other hand, the control valve 336 is 100% open at this time. Therefore, all the refrigerant delivered from the liquid pump 332 flows into the heat exchanger 35, and the DIW is cooled by heat exchange with the refrigerant. Through multiple cooling units 3, the temperature of the DIW decreases in stages.

[0081] The temperature To of the DIW output from the cooling unit 3 is detected by the temperature sensor 378 and compared with the preset target temperature Tt (step S103). Here, the target temperature Tt is set individually for each of the plurality of cooling units 3. As mentioned above, the target temperature Tt is set lower for the cooling unit 3 further downstream, and the target temperature Tt of the cooling unit 3 at the very downstream end is the final target temperature (e.g., 5°C).

[0082] If the temperature To of the DIW is higher than the target temperature Tt ("Yes" in step S103), the opening of the control valve 335 is reduced (step S104). This increases the proportion of refrigerant flowing through the heat exchanger 35, increasing the cooling capacity of the heat exchanger 35 and thus lowering the temperature of the DIW. Conversely, if the temperature To of the DIW is lower than the target temperature Tt ("No" in step S103), the opening of the control valve 335 is increased (step S105), reducing the amount of refrigerant flowing into the heat exchanger 35 and causing the temperature of the DIW to rise.

[0083] The above process continues until the temperature To of the DIW output from the downstream cooling unit 3 becomes a suitable temperature for external output (No in step S106). If this condition is met (Yes in step S106), external output is permitted (step S107). Afterward, the control valve 241 on the piping 24 can be opened to transfer the DIW to the secondary storage tank 52. At this point, the temperature of the output DIW is approximately the final target temperature.

[0084] Even after external output is possible, the DIW cycle and temperature adjustment of each cooling unit 3 described above continue until it is determined that cooling can be terminated (step S108). Thus, the cooled DIW gradually accumulates in the primary storage tank 51, and the fully cooled DIW circulates in the circulation path. Finally, the opening of the control valve 376 is independently adjusted based on the target temperature set for each cooling unit 3 and the detected temperature. This establishes a state that prevents freezing due to over-cooling of the DIW and allows for rapid supply of processing fluid at a predetermined temperature when required.

[0085] Furthermore, the temperature of the cooled DIW is expected to rise during its flow through the piping system 2 after piping 24. Therefore, a final temperature adjustment is performed by connecting the cooling unit 3 to the piping 25 and 26 before it is sent to the substrate processing unit 9. Here, multiple (specifically two) cooling units 3 are also connected in series. Based on the same principle as above, the opening of the control valve 376 is adjusted according to the temperature detection result, thereby enabling the DIW, adjusted to the desired temperature, to be sent to the substrate processing unit 9.

[0086] As described above, in this embodiment, the cooling unit 3 installed in the flow path cools the DIW (distillate liquid) that is being cooled. The temperature adjustment method involves distributing a refrigerant at a constant temperature and a constant flow rate to the flow path through the heat exchanger 35 and a flow path bypassing the flow path, and adjusting the ratio of their flow rates based on the temperature detection results of the DIW output from the cooling unit 3.

[0087] In this control method, the refrigerant circulating in the circulating liquid circuit 33 is diverted into two flow paths within a portion of the flow path, but the refrigerant temperature and flow rate themselves remain unchanged. Therefore, the low responsiveness in the refrigeration circuit 31 and the circulating liquid circuit 33 does not affect the temperature adjustment of the processed liquid. On the other hand, by adjusting the amount of refrigerant flowing in, the cooling capacity of the heat exchanger 35 can be varied steplessly and over a wide range. This can be achieved simply by changing the flow ratio based on the operation of control valves 335 and 336. As a result, in this embodiment, the DIW cooled to the desired temperature can be output with excellent controllability and stability. Therefore, even when the target temperature is close to the freezing point, freezing of the DIW can be prevented.

[0088] <Second Implementation Method>

[0089] Figure 6This is a diagram showing a schematic structure of a second embodiment of a substrate processing system having the cooling device of the present invention. The structure and operation of the substrate processing system S2 in the second embodiment are basically the same as those in the first embodiment, except for the aspects described below. Here, parts having the same structure and function as those in the above embodiments are labeled with the same symbols and their descriptions are omitted; the differences from the first embodiment are mainly described.

[0090] The main difference between the substrate processing system S2 of the second embodiment and the substrate processing system S of the first embodiment lies in the arrangement of the cooling unit. In the processing liquid supply unit 1A of this embodiment, from... Figure 2 The cooling units 3A and 3B shown are connected in series on the piping 22 after removing the bypass piping 375, control valve 376, and temperature sensor 378. Multiple cooling units 3A and 3B are connected in series in this example (5 groups). Cooling units 3A and 3B have the same construction, but are marked with different symbols in the following description to distinguish them.

[0091] For the three sets of cooling units 3A on the upstream side, a pipe 381 is provided to bypass them together, and a control valve 382 is inserted into the pipe 381. A temperature sensor 228 is installed on the pipe 22 after merging with the pipe 381. For the two sets of cooling units 3B on the downstream side, a pipe 383 is provided to bypass them together, and a control valve 384 is inserted into the pipe 383. A temperature sensor 229 is installed on the downstream side of the latter.

[0092] Furthermore, the structure downstream of the secondary storage tank 52 is also modified. Specifically, the piping 26 and its associated pump 261, temperature sensor 262, etc., are omitted. Instead, the DIW is delivered to the substrate processing unit 9 via the control valve 258 through the piping 25 branching off from the piping 25. Moreover, only one cooling unit 3 is used on the piping 25. Additionally, the structure downstream of the secondary storage tank 52 can be the same as in the first embodiment.

[0093] This embodiment treats the three cooling units 3A as a single cooling unit. Additionally, the two cooling units 3B are treated as a single cooling unit. These aspects differ significantly from the first embodiment. The temperature adjustment of the DIW in this case is as follows.

[0094] That is, in the three sets of cooling units 3A on the upstream side, the opening of control valves 335 and 336 is adjusted in a coordinated manner among the cooling units 3A. The temperature of the DIW output from the downstream cooling unit 3A is detected by temperature sensor 228. Based on the detection result, the opening of control valves 335 and 336 is adjusted uniformly in all three sets of cooling units 3A. Thus, the three sets of cooling units 3A operate as a unified whole, and their output temperature is maintained at the target temperature. Similarly, the two sets of cooling units 3B on the downstream side are also controlled uniformly. The specific control content is the same as the principle described above. Furthermore, if the temperature of the input DIW is lower than the target temperature, the cooling units are bypassed by appropriately opening control valves 382 and 384.

[0095] The main advantages of using a unified control system for temperature adjustment across multiple cooling units are as follows: First, the number of control valves required for control is reduced, thus simplifying control. Furthermore, interference between adjustment results at different levels is prevented. Moreover, this reduction in the number of components leads to lower equipment costs and reduced resource consumption.

[0096] Furthermore, the cooling unit 3 on the piping 25 can be configured with the same structure as the cooling unit in the first embodiment, and its temperature adjustment can be applied. Figure 4A and Figure 4B Temperature adjustment follows the principle shown.

[0097] <Variation Example>

[0098] In addition to the two embodiments described above, intermediate embodiments are also considered. For example, in Figure 1 In the substrate processing system S of the first embodiment shown, the temperature of each of the four cooling units 3 on the piping 22 is adjusted individually. For example, they can be replaced with cooling units 3A of the second embodiment, and then divided into two groups on the upstream side and two groups on the downstream side, and their temperatures can be adjusted together. In addition, in these embodiments, the number of cooling units is not limited to the number shown in the figure, and can be increased or decreased appropriately.

[0099] <Other>

[0100] As explained above, in the above embodiments, the substrate processing systems S and S2 correspond to the "substrate processing apparatus" of the present invention, and the processing liquid supply unit 1 and the substrate processing unit 9 function as the "cooling unit" and "substrate processing unit" of the present invention, respectively. Furthermore, the pipes 25 and 26 connecting them correspond to the "supply pipes" of the present invention.

[0101] Furthermore, in the processing liquid supply units 1 and 1A of the above embodiments, the heat exchanger 35 and the temperature sensor 378 function as the "heat exchanger" and "temperature detection unit" of the present invention, respectively. On the other hand, the refrigeration circuit 31 and the circulating liquid circuit 33 are integrated and function as the "refrigerant output unit" and "refrigerant supply source" of the present invention. In addition, the pipes 341, 342, and 344 in the piping 34 of the circulating liquid circuit 33 are integrated and function as the "supply flow path forming unit" of the present invention. On the other hand, the piping 343 functions as the "bypass flow path forming unit" of the present invention.

[0102] Furthermore, in the above embodiments, the primary storage tank 51 functions as the "storage tank" of the present invention, and the pipes 23 and 24 function as "circulation flow path forming parts". Additionally, the secondary storage tank 52 also functions as the "storage tank" of the present invention, and the pipes 25, 26, 27, and 28 function as "circulation flow path forming parts". Furthermore, the pipe 21 functions as the "inlet pipe" of the present invention.

[0103] Furthermore, the present invention is not limited to the embodiments described above. Various modifications can be made beyond the scope of the invention as long as they do not depart from its spirit. For example, in the above description, several examples were given regarding the number of cooling units installed in the piping system, but the number and the overall structure of the piping system are not limited to those shown here and are arbitrary.

[0104] Furthermore, in the above embodiment, the cooling unit for the cooling process fluid uses a structure where a first refrigerant cools a second refrigerant, and the second refrigerant cools the process fluid. However, as long as the structure is based on the principle of cooling the process fluid through heat exchange with the refrigerant, its specific structure is not limited to the above structure and can be arbitrary. Furthermore, the construction of the heat exchanger is not limited to the structure shown in FIG3, and various constructions can be applied. Additionally, the process fluid supply unit 1 in the above embodiment includes a refrigeration circuit 31 and a circulating fluid circuit 33, which serve as the "refrigeration output unit" of the present invention. However, it can also be configured to operate by receiving refrigerant from an external refrigerant supply source that provides refrigerant with a constant output temperature and flow rate.

[0105] In addition, the temperature adjustment process in the above embodiments ( Figure 5 In this system, the opening degree of the control valve is adjusted based on whether the temperature of the treated liquid is higher or lower than the target temperature Tt. However, the target temperature does not need to be a single value; for example, it can be specified as a temperature range.

[0106] Furthermore, in the above embodiment, the processing liquid targeted for cooling is DIW, but the composition and temperature of the processing liquid are not limited to this and are arbitrary. For example, the present invention can also be applied to the purpose of cooling various chemical solutions, organic solvents, etc., used in substrate processing. In this case, the material of the piping can be appropriately selected according to the properties of the processing liquid. For example, if the purity of the processing liquid is not a major issue, from the viewpoint of cooling efficiency, the inner tube of the heat exchanger can be made of metal. In addition, the application of the cooled processing liquid is not limited to substrate processing and is arbitrary.

[0107] As illustrated above with specific embodiments, in the cooling apparatus of the present invention, the temperature and flow rate of the refrigerant output from the refrigerant output unit can also be configured to be constant regardless of the flow ratio. With such a structure, the refrigerant output unit only needs to be able to output refrigerant at a constant temperature and flow rate. Therefore, the responsiveness of the refrigerant output unit itself will not affect the temperature adjustment of the processed liquid.

[0108] Furthermore, for example, the flow rate of the processing fluid flowing into the heat exchanger can also be constant. With such a structure, the amount of processing fluid being cooled remains unchanged, i.e., the load is constant, thus enabling excellent controllability and high stability in controlling the temperature of the processing fluid.

[0109] Alternatively, the cooling device may include multiple heat exchangers connected in series and multiple refrigerant outlets corresponding to each heat exchanger. With this structure, by using multiple heat exchangers to cool the processing liquid in stages, the temperature of the processing liquid can be significantly reduced in a short time. In this case, the temperature detection unit may detect the temperature of the processing liquid output from the downstream heat exchanger among the multiple heat exchangers, and the control unit may adjust the flow ratio of each refrigerant outlet based on the detection results of the temperature detection unit. Alternatively, for example, the device may be configured to provide multiple temperature detection units that independently detect the temperature of the processing liquid output from each of the multiple heat exchangers, and the control unit may adjust the flow ratio of each refrigerant outlet based on the temperature detection results of the processing liquid output from the corresponding heat exchanger. With any of these methods, the final temperature of the processing liquid can be stably controlled with excellent controllability.

[0110] Alternatively, for example, the cooling device of the present invention may also include: a storage tank for storing the processing liquid; and a circulation flow path forming section for forming a circulation flow path that supplies the processing liquid from the storage tank to the heat exchanger and returns it from the heat exchanger to the storage tank. With this structure, by circulating the processing liquid while it is being cooled, it is possible to pre-store the sufficiently cooled processing liquid. Furthermore, with circulation, the temperature of the processing liquid input to the heat exchanger decreases, so the heat exchanger does not need to drastically lower the temperature of the processing liquid, thereby improving temperature stability.

[0111] In this case, an inlet pipe can be connected to the storage tank to introduce unconditioned processing fluid into the storage tank. With this configuration, processing fluid consumed due to external output can be replenished from the outside. Therefore, even if the temperature inside the storage tank temporarily rises, it can be restored to a low temperature state through circulation via a heat exchanger.

[0112] As the processing fluid of this invention, deionized water or pure water can be used, for example. Water is a liquid with a high specific heat, and it is particularly difficult to adjust its temperature without freezing it in temperature ranges close to its freezing point. In this invention, the cooling capacity of the heat exchanger is adjusted by keeping the temperature and output flow rate of the refrigerant constant and by increasing or decreasing the amount flowing into the heat exchanger, thus enabling well-controllable regulation of the processing fluid temperature even in such temperature ranges.

[0113] Industrial availability

[0114] This invention can be applied to all technologies for cooling processing fluids, and is particularly suitable for fields that require cooling processing fluids to temperatures close to their freezing points without freezing.

[0115] Symbol Explanation

[0116] 1.1A Processing Fluid Supply Unit (Cooling Device);

[0117] 8. Control Department;

[0118] 9. Substrate processing section;

[0119] 21 Piping (Inlet Piping);

[0120] Piping 23~28 (circulation flow path forming section);

[0121] Piping 25 and 26 (supply piping);

[0122] 35 heat exchanger;

[0123] 51. Primary storage tank (storage tank);

[0124] 52 Secondary storage tank (storage tank);

[0125] Piping 341, 342, 344 (supply flow path forming section);

[0126] 343 piping (bypass flow path forming section);

[0127] 378 Temperature Sensor (Temperature Detection Unit);

[0128] S, S2 substrate processing system (substrate processing device).

Claims

1. A cooling device for cooling and discharging a processing liquid, characterized in that, The cooling device includes: The refrigerant output section outputs refrigerant. A heat exchanger that cools the processing liquid by exchanging heat with the refrigerant; A supply flow path forming section forms a refrigerant supply flow path that allows the refrigerant to circulate between the refrigerant output section and the heat exchanger; A bypass flow path forming section is formed so that the refrigerant output from the refrigerant output section returns to the refrigerant output section without passing through the heat exchanger; A temperature detection unit that detects the temperature of the processing liquid output from the heat exchanger; as well as The control unit adjusts the flow ratio of the refrigerant flowing in the refrigerant supply path and the bypass path, respectively, based on the detection results of the temperature detection unit, thereby controlling the temperature of the processed liquid output by the heat exchanger.

2. The cooling device according to claim 1, characterized in that, The temperature and flow rate of the refrigerant output from the refrigerant output section are constant and independent of the flow rate ratio.

3. The cooling device according to claim 1, characterized in that, The flow rate of the processing liquid flowing into the heat exchanger is constant.

4. The cooling device according to any one of claims 1 to 3, characterized in that, The cooling device includes: Multiple heat exchangers connected in series with each other; and The plurality of refrigerant outlets are respectively provided corresponding to the plurality of heat exchangers. The temperature detection unit detects the temperature of the processing liquid output from the most downstream heat exchanger among the plurality of heat exchangers. Based on the detection results of the temperature detection unit, the control unit adjusts the flow ratio of the plurality of refrigerant output units simultaneously.

5. The cooling device according to any one of claims 1 to 3, characterized in that, The cooling device includes: Multiple heat exchangers connected in series with each other; A plurality of refrigerant outlets are respectively provided corresponding to the plurality of heat exchangers; and The plurality of temperature detection units individually detect the temperature of the processed liquid output from the plurality of heat exchangers. The control unit adjusts the flow ratio of each refrigerant output unit based on the temperature detection result of the processing liquid output from the corresponding heat exchanger.

6. The cooling device according to any one of claims 1 to 3, characterized in that, The cooling device includes: Storage tank for storing the treatment liquid; and A circulation flow path forming section forms a circulation flow path that supplies the processing liquid from the storage tank to the heat exchanger and returns it from the heat exchanger to the storage tank.

7. The cooling device according to claim 6, characterized in that, An inlet pipe is connected to the storage tank to introduce the unconditioned treatment liquid into the storage tank.

8. The cooling device according to any one of claims 1 to 3, characterized in that, The treatment solution is deionized water or pure water.

9. A substrate processing apparatus, characterized in that, have: A cooling unit having the same structure as the cooling device described in claim 1; A substrate processing unit that processes a substrate using the processing liquid output from the cooling unit; and A supply pipe supplies the processing liquid from the cooling section to the substrate processing section.

10. A cooling method for cooling and outputting a processing liquid, characterized in that, The refrigerant supplied from the refrigerant supply source is diverted at a predetermined flow rate into a path that introduces the refrigerant into the heat exchanger and a path that bypasses the heat exchanger. In the heat exchanger, the processing liquid is cooled by heat exchange with the refrigerant. The temperature of the processed liquid output from the heat exchanger is detected, and the flow ratio is adjusted based on the detection result, thereby controlling the temperature of the processed liquid.

Images