Electronic circuit substrate and method for manufacturing the same

Abstract

Provided is an electronic circuit substrate capable of preventing discharge of a surface-mounted all-solid-state battery during a substrate manufacturing stage, and a manufacturing method thereof. The electronic circuit substrate 1 of the present invention is surface-mounted with an all-solid-state battery 10 and electronic components. The electronic components and the all-solid-state battery 10 are electrically connected to conductor wiring patterns 2, 4 formed in a substrate main body 8 that is electrically insulating, by soldering, thereby forming an electronic circuit. In an electrical line of the electronic circuit connected to a positive electrode of the all-solid-state battery 10 or an electrical line of the electronic circuit connected to a negative electrode of the all-solid-state battery, a switching unit 20 is provided that is capable of electrically cutting off between these electrical lines and switching from an electrically cut-off state to an electrically conductive state.

Description

Technical Field

[0001] This invention relates to an electronic circuit board formed by surface mounting an all-solid-state battery together with electronic components, and particularly to an electronic circuit board and a method thereof capable of preventing discharge of the surface-mounted all-solid-state battery and failure of the mounted components during the board manufacturing stage. Background Technology

[0002] In electronic circuit boards, which are formed by soldering electronic components onto printed circuit boards or similar substrates formed by printing electrical circuit wiring, batteries such as secondary batteries and high-capacity capacitors are sometimes mounted on the substrate as power sources for the electronic components (see, for example, Patent Document 1).

[0003] For example, when electronic components are mounted onto a wiring substrate by wave soldering, after the immersion process of immersing the substrate in a molten solder bath is completed and the electronic components are fully mounted onto the substrate, the battery is then mounted onto the substrate wiring using solder, or the battery is mounted onto a battery socket soldered to the substrate wiring. In the wave soldering method, molten solder is supplied to the soldered portion by contacting the soldered surface of the printed circuit board with a jet of molten solder to perform soldering.

[0004] Existing technical documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-108549 Summary of the Invention

[0006] However, when using all-solid-state batteries as the substrate for mounting, especially when surface-mounting the all-solid-state battery with electronic components such as DIP components onto the substrate and then immersing them together in a molten solder bath, there is a problem that the charge accumulated in the all-solid-state battery may be discharged due to a short circuit that occurs during solder immersion. As a result, in the finished substrate formed by surface-mounting the all-solid-state battery with the electronic components, the charge in the all-solid-state battery may be reduced or completely absent. Furthermore, such a short circuit may cause malfunctions in the all-solid-state battery itself and in other electronic components mounted on the electrical circuit board.

[0007] The present invention was made in view of the above circumstances, and its object is to provide an electronic circuit board and a method thereof capable of preventing discharge of surface-mounted solid-state batteries during the substrate manufacturing stage and preventing failure of surface-mounted electronic components.

[0008] To address the aforementioned problem, the present invention provides an electronic circuit board in which an all-solid-state battery and electronic components are surface-mounted together, characterized in that... The electronic components and the all-solid-state battery are electrically connected to a conductor wiring pattern formed on an electrically insulating substrate body by welding, thereby forming an electronic circuit. In the electrical circuit of the electronic circuit connected to the positive terminal of the all-solid-state battery or in the electrical circuit of the electronic circuit connected to the negative terminal of the all-solid-state battery, a switching unit is provided that is capable of electrically disconnecting these electrical circuits and switching from their electrically disconnected state to their electrically connected state.

[0009] According to the above-described structure of the present invention, a switching unit is provided that can electrically disconnect the electrical lines connected to the positive and negative terminals of the all-solid-state battery from each other and switch from an electrically disconnected state to an electrically connected state (a state in which the electrical lines are electrically connected). Therefore, if the switching unit is preset to a state in which the electrical lines are electrically disconnected from each other, when electronic components and / or the all-solid-state battery are electrically connected to a conductor wiring pattern (a part of the electrical lines forming the electronic circuit) by soldering to form an electronic circuit, especially even when the charged all-solid-state battery and the electronic components are disposed together on the substrate and immersed together in a molten solder bath, the charge stored in the all-solid-state battery will not be discharged due to a short circuit. In addition, after soldering is completed, if the switching unit is used to switch from the electrically disconnected state in which the electrical lines are electrically disconnected from each other to the electrically connected state in which the electrical lines are electrically connected, the desired electronic circuit configuration in which the charged state of the all-solid-state battery is maintained can be obtained in the finished substrate formed by surface mounting the all-solid-state battery and the electronic components together.

[0010] Furthermore, in the above structure, the switching from an electrically disconnected state to an electrically connected state can be reversible, but is preferably irreversible. Additionally, in the above structure, the switching unit can have any structure and / or form, as long as it can electrically disconnect the electrical lines in the initial state and switch from its electrically disconnected state to its electrically connected state. For example, examples of switching units include switches that open and close electronic circuits by being disposed in a conductor wiring pattern, or cut holes that mechanically cut the conductor wiring pattern. Alternatively, the switching unit can also be a switching element that switches from an electrically disconnected state to an electrically connected state by applying a voltage; such a switching element can also include transistors, fuses, non-volatile memory, or optocouplers to form an electrical circuit. Furthermore, the switching element can be disposed at any location within the electronic circuit, for example, inside or outside a solid-state battery.

[0011] In addition, the present invention also provides a method for manufacturing an electronic circuit board having the above-described structure formed by surface mounting an all-solid-state battery together with electronic components.

[0012] The manufacturing method is characterized by a welding step in which electronic components and / or all-solid-state batteries are electrically connected to a conductor wiring pattern formed on an electrically insulating substrate body to form an electronic circuit. Prior to the welding step, the method includes an electrical disconnection step in which a switching unit provided in the electrical circuit of the electronic circuit connected to the positive terminal of the all-solid-state battery or the electrical circuit of the electronic circuit connected to the negative terminal of the all-solid-state battery electrically disconnects the electrical circuits. After the welding step, the switching unit is used to switch from the electrical disconnection state to an electrical conduction state in which the electrical circuits are electrically connected.

[0013] In such a manufacturing method, if the switching unit is pre-set to a state in which the electrical circuits are electrically disconnected from each other, then when electronic components and / or all-solid-state batteries are electrically connected to the conductor wiring pattern by welding to form an electronic circuit, especially even when the charged all-solid-state battery is disposed on the substrate together with the electronic components and immersed together in the molten solder bath, the charge stored in the all-solid-state battery will not be discharged due to a short circuit.

[0014] According to the electronic circuit board and manufacturing method of the present invention, it is possible to prevent surface-mount all-solid-state batteries from discharging during the substrate manufacturing stage. Attached Figure Description

[0015] Figure 1 This is a schematic perspective view of an electronic circuit board according to the first embodiment of the present invention, which includes a switching unit.

[0016] Figure 2 This is a schematic side cross-sectional view showing an electronic circuit board with a surface-mounted solid-state battery immersed in a molten solder bath.

[0017] Figure 3 This is a flowchart that schematically illustrates an example of the process steps in a manufacturing method for an electronic circuit board in which an all-solid-state battery is surface-mounted together with electronic components.

[0018] Figure 4 This is a schematic perspective view of an electronic circuit board according to the second embodiment of the present invention, which includes a switching unit.

[0019] Figure 5 This is an internal circuit diagram of a fully solid-state battery with internal switching elements.

[0020] Figure 6 (a) is Figure 5 A three-dimensional view of a solid-state battery cell, (b) showing the surface-mounted... Figure 5 A schematic three-dimensional view of the electronic circuit board of an all-solid-state battery.

[0021] Figure 7 It has a structure on the outside of the all-solid-state battery that is similar to... Figure 5 Electronic circuit diagram of the same switching element.

[0022] Figure 8 This is an electronic circuit diagram showing a second-type switching element inside an all-solid-state battery.

[0023] Figure 9 (a) is Figure 8 A three-dimensional view of a solid-state battery cell, (b) showing the surface-mounted... Figure 8 A schematic three-dimensional view of the electronic circuit board of an all-solid-state battery.

[0024] Figure 10 It has inside the all-solid-state battery Figure 8 The electronic circuit diagram of the switching element involved in the variation example.

[0025] Figure 11 This is an electronic circuit diagram of a third-type switching element located outside the all-solid-state battery.

[0026] Figure 12 This is a schematic perspective view of an electronic circuit board showing an example of a configuration in which an all-solid-state battery is retrofitted into a battery socket soldered to a substrate wiring. Detailed Implementation

[0027] The following is a reference to the appendix. Figure 1 The embodiments of the present invention will be described below. These embodiments, particularly in sensing systems, enable highly reliable systems and contribute to the development of resilient infrastructure, aiming at the United Nations Sustainable Development Goals (SDGs): "9. Building a foundation for industrial and technological innovation," specifically "9.1 To support the development of high-quality, reliable, sustainable, and resilient infrastructure, including regional / cross-border infrastructure, with a focus on economic development and human well-being that is affordable and equitable for all." Furthermore, while all-solid-state batteries are used as an example in the following embodiments, the present invention can also be applied to batteries other than all-solid-state batteries.

[0028] exist Figure 1The figure shows an electronic circuit board 1 according to the first embodiment of the present invention. As shown, the electronic circuit board 1 is a substrate body 8 with electrical insulation, formed by surface mounting an all-solid-state battery 10 together with electronic components (not shown). On the mounting surface 8a of the substrate body 8 on which the electronic components and the all-solid-state battery 10 are mounted, for example, a pair of conductor wiring patterns 2 and 4 are formed. As an example, one end of one conductor wiring pattern 2 is electrically connected to the positive electrode side of the all-solid-state battery 10 by solder, and one end of the other conductor wiring pattern 4 is electrically connected to the negative electrode side of the all-solid-state battery 10 by solder.

[0029] Furthermore, each conductor wiring pattern 2 and 4 extends to a corresponding via 3 and 5, which are through holes penetrating the substrate body 8. A pair of leads (pins) of the aforementioned electronic components, which are DIP components, are inserted from the mounting surface 8a side into these via 3 and 5. These leads protrude from the soldering surface 8b on the opposite side of the substrate body 8. Moreover, the protruding portions (soldered portions) of these leads are electrically connected to the conductive wiring patterns formed on the soldering surface 8b by solder.

[0030] In this way, the electronic components and the all-solid-state battery 10 are electrically connected to the conductor wiring pattern formed on the substrate body 8 by solder to form an electronic circuit. Therefore, the conductor wiring pattern, together with the electronic components, the internal circuit of the all-solid-state battery 10, etc., forms part of the electrical circuit of the electronic circuit.

[0031] Furthermore, the electronic circuit board 1 of this embodiment includes a switching unit in the electrical circuitry of the electronic circuitry connected to the positive terminal of the all-solid-state battery 10 or the electrical circuitry of the electronic circuitry connected to the negative terminal of the all-solid-state battery 10, capable of electrically disconnecting these electrical circuits and switching them from an electrically disconnected state to an electrically connected state. In particular, in this embodiment, a switch 20 for opening and closing the electronic circuitry is provided as a switching unit along the conductor wiring pattern 2 connected to the positive terminal of the all-solid-state battery 10. In this case, in the switch 20, one end of its electrical terminal 20b is electrically connected to the first electrical line 2a of the conductor wiring pattern 2, which is electrically connected to the positive terminal metal terminal 10a of the all-solid-state battery 10, and the other end of its electrical terminal 20a is electrically connected to the second electrical line 2b of the conductor wiring pattern 2 extending from the via 3.

[0032] Therefore, when switch 20 is open, electrical lines 2a and 2b are electrically disconnected from each other. Even if a short circuit occurs in the electronic circuitry due to soldering, the electrical lines connected to the positive terminal of the all-solid-state battery 10 and the electrical lines connected to the negative terminal of the all-solid-state battery 10 are electrically disconnected, preventing the all-solid-state battery 10 from discharging. On the other hand, when switch 20 is closed, the electrical lines are electrically connected to each other.

[0033] Based on the above structure, for example... Figure 2 As shown, when soldering is performed by supplying molten solder to the soldered portion by contacting the soldered surface 8b of the electronic circuit board 1 (board body 8) containing the soldered portion with the jet wave of molten solder 50, as... Figure 3 As shown, initially after the electronic components and the all-solid-state battery 10 are mounted onto the electronic circuit board 1 (mounting surface 8a of the board body 8) (step S1) (or before mounting), the switching unit is set to an electrically off state (step S2).

[0034] Specifically, in this embodiment, as an example, with the positive metal terminal 10a of the all-solid-state battery 10 pre-connected to the first electrical line 2a of the conductor wiring pattern 2 by soldering, the negative metal terminal 10b of the all-solid-state battery 10 pre-connected to the conductor wiring pattern 4 by soldering, and the switch 20 soldered to the electrical lines 2a and 2b as described above, leads of electronic components (not shown) as DIP components are inserted into the vias 3 and 5, and the switch 20 is turned off to electrically disconnect the electrical lines 2a and 2b from each other. Furthermore, the setting of the electrical disconnection state via the switch unit can be performed at any stage, as long as it is done before soldering where a short circuit may occur.

[0035] Subsequently, in this installation state, such as Figure 2 As shown, molten solder is supplied to the soldered part by contacting the soldering surface 8b of the electronic circuit board 1 (board body 8) with the jet wave of molten solder 50 to perform soldering (step S3). At this time, a short circuit may occur in the electronic circuit line during soldering, but the electrical lines of the electronic circuit connected to the positive terminal of the all-solid-state battery 10 and the electronic circuit connected to the negative terminal of the all-solid-state battery 10 are electrically disconnected by the disconnected switch 20, thus preventing the all-solid-state battery 10 from discharging. Afterwards, if the soldering is completed and all electronic components are electrically connected to the electronic circuit line, the switch unit is then electrically turned on (step S4). Specifically, in this embodiment, the switch 20 is closed.

[0036] Thus, in this embodiment, a switch 20 is provided that can electrically disconnect the electrical lines connected to the positive and negative terminals of the all-solid-state battery 10 from each other and switch from an electrically disconnected state to an electrically connected state (a state in which the electrical lines are electrically connected). Therefore, if the switch 20 is preset to a state in which the electrical lines are electrically disconnected from each other, when electronic components and the all-solid-state battery 10 are electrically connected to the conductor wiring pattern (a part of the electrical lines forming the electronic circuit) by soldering to form an electronic circuit, especially even if the charged all-solid-state battery 10 and the electronic components are disposed together on the substrate and immersed together in the molten solder bath, the charge stored in the all-solid-state battery 10 will not be discharged due to a short circuit.

[0037] exist Figure 4 The figure shows an electronic circuit board 1A according to the second embodiment of the present invention, which includes a switching unit. As shown, the switching unit in this embodiment is not a switch 20 that allows reversible switching between an electrically cut-off state and an electrically connected state as in the first embodiment, but is configured such that the switching from an electrically cut-off state to an electrically connected state is irreversible. That is, the switching unit in this embodiment is formed as a cut hole 90 that mechanically cuts off the conductor wiring pattern 2. In its original state, such a cut hole 90 continuously electrically cuts off the electrical lines 2a and 2b from each other, but at the point when the soldering is completed as described above and all electronic components are electrically connected to the electronic circuit lines, the hole is filled with solder, thereby becoming an electrically connected state that allows the electrical lines 2a and 2b to be electrically connected to each other. The cut hole 90 can be through or have a concave shape. It is also possible that, inside the cut hole 90, in a mutually electrically cut-off state, a plating area connected to the electrical line 2a and a plating area connected to the electrical line 2b are formed.

[0038] exist Figure 5 The image shows another form of a switching unit disposed on an electronic circuit board. In this example, the switching unit is formed as a switching element that switches from an electrically off state to an electrically on state by applying a voltage, and is installed inside an all-solid-state battery. Specifically, in this example, the switching element includes a transistor T and a fuse F, forming an electrical circuit. This will be described below.

[0039] In the illustrated all-solid-state battery 10A, which incorporates a built-in switching element, an electrical line L2 extending from the negative terminal of the power supply unit E is connected to the negative terminal 10b (GND), and an electrical line L1 extending from the positive terminal of the power supply unit E is connected to the positive terminal 10a (Vcc). A PMOS transistor T is disposed along electrical line L1. Specifically, the wiring portion L1a of electrical line L1 connected to the positive terminal of the power supply unit E is connected to the source (S) of the PMOS transistor T, and the wiring portion L1b of electrical line L1 connected to the positive terminal 10a is connected to the drain (D) of the PMOS transistor T. Furthermore, an electrical line L3 extending from the gate (G) of the PMOS transistor T has two resistors R connected in series and is connected to electrical line L2. The portion of electrical line L3 between the two resistors R and the wiring portion L1a of electrical line L1 are connected by a fuse F. The fuse F is connected to the fuse terminal 10c of the all-solid-state battery 10A.

[0040] like Figure 6 As shown, the electronic circuit board 1B, which is surface-mounted with an all-solid-state battery 10A of this structure, has conductor wiring patterns 2 and 4 that are respectively connected to the positive terminal 10a and the negative terminal 10b of the all-solid-state battery 10A, and also has conductor wiring pattern 9 that is connected to the fuse terminal 10c of the all-solid-state battery 10A. The conductor wiring pattern 9 extends to the via 7 for mounting components for applying voltage. Furthermore, in this structure, terminals 10a, 10b, and 10c are formed on the same side of the battery 10A.

[0041] When the fuse F is not disconnected and the electrical circuits L1a and L3 are connected to each other, no potential difference occurs between the gate and source of the transistor T due to the voltage of the power supply E. Therefore, the transistor T does not conduct between the wiring portions L1a and L1b of the electrical circuit (Vcc=0V). That is, it is an electrically disconnected state where the electrical circuit connected to the positive terminal of the all-solid-state battery 10A and the electrical circuit connected to the negative terminal of the all-solid-state battery 10A are electrically disconnected. Therefore, even if welding is performed in this state, the all-solid-state battery 10A will not discharge. In contrast, when a high voltage is applied to the fuse terminal 10c to disconnect the fuse F, the gate potential of the transistor T becomes the GND potential, and the source potential of the transistor T becomes the potential of the power supply E. A potential difference occurs between the gate and source of the transistor T, so the transistor T conducts between the wiring portions L1a and L1b of the electrical circuit (Vcc=voltage of the power supply E). That is, an electrical continuity state in which the electrical circuit of the electronic circuit connected to the positive terminal of the all-solid-state battery 10A and the electrical circuit of the electronic circuit connected to the negative terminal of the all-solid-state battery 10A are electrically connected. Therefore, after soldering is completed, if a high voltage is applied to the fuse terminal 10c, the desired electronic circuit configuration in which the state of charge of the all-solid-state battery is maintained can be obtained in the finished substrate formed by surface mounting the all-solid-state battery and electronic components together.

[0042] Figure 7 Showing will be with Figure 5 The switching unit described in connection with this circuit structure is located external to the all-solid-state battery 10. Therefore, in this case, if a circuit structure similar to... Figure 1 In the circuit configuration described in connection with this, electrical lines 2a and 2b of conductor wiring pattern 2 replace wiring portions L1a and L1b of the aforementioned electrical line L1, and conductor wiring pattern 4 replaces the aforementioned electrical line L2.

[0043] exist Figure 8 The image shows another configuration of a switching unit disposed on an electronic circuit board. In this example, the switching unit is also formed as a switching element that switches from an electrically off state to an electrically on state by applying a voltage (signal), and is installed inside an all-solid-state battery. Specifically, in this example, the switching element includes a transistor T and a non-volatile memory M, forming an electrical circuit. This will be described below.

[0044] In the illustrated all-solid-state battery 10B, which incorporates a built-in switching element, an electrical line L2 extending from the negative terminal of the power supply unit E is connected to the negative terminal 10b (GND), and an electrical line L1 extending from the positive terminal of the power supply unit E is connected to the positive terminal 10a (Vcc). A PMOS transistor T is disposed along electrical line L1. Specifically, the wiring portion L1a of electrical line L1 connected to the positive terminal of the power supply unit E is connected to the source (S) of PMOS transistor T, and the wiring portion L1b of electrical line L1 connected to the positive terminal 10a is connected to the drain (D) of PMOS transistor T. Furthermore, an electrical line L3 extending from the gate (G) of PMOS transistor T is connected to non-volatile memory M. The non-volatile memory M is also connected to the control terminal 10d and the write / erase terminal 10e of the all-solid-state battery 10B. Additionally, an electrical line L5 connecting the non-volatile memory M to the control terminal 10d is connected to electrical line L2 via an electrical line L4 having a resistor R.

[0045] like Figure 9 As shown, the electronic circuit board 1C, which is surface-mounted with such a solid-state battery 10B, has conductor wiring patterns 2 and 4 connected to the positive terminal 10a and negative terminal 10b of the solid-state battery 10B, respectively. In addition, it also has conductor wiring pattern 31 connected to the control terminal 10d of the solid-state battery 10B, and conductor wiring pattern 33 connected to the write / erase terminal 10e of the solid-state battery 10B. Conductor wiring patterns 31 and 33 extend to vias 27 and 29 for mounting elements for voltage (signal) application. Furthermore, in this structure, terminals 10a, 10b, 10d, and 10e are formed on the same side of the battery 10B.

[0046] When the data in the non-volatile memory M is held as "1" and no potential difference exists between the gate and source of the transistor T, the transistor T does not conduct between the wiring portions L1a and L1b of the electrical circuit (Vcc=0V). That is, it is an electrically disconnected state where the electrical circuit connected to the positive terminal of the all-solid-state battery 10B and the electrical circuit connected to the negative terminal of the all-solid-state battery 10B are electrically disconnected. Therefore, even if soldering is performed in this state, the all-solid-state battery 10B will not discharge. Conversely, when a high-level voltage (signal) is applied to the control terminal 10d and a low-level voltage (signal) is applied to the write / erase terminal 10e, the data in the non-volatile memory M is erased (changing data "1" to data "0"). When a potential difference exists between the gate and source of the transistor T, the transistor T conducts between the wiring portions L1a and L1b of the electrical circuit (Vcc=voltage of the power supply section E). That is, an electrical conduction state in which the electrical circuitry of the electronic circuit connected to the positive terminal of the all-solid-state battery 10B and the electrical circuitry of the electronic circuitry connected to the negative terminal of the all-solid-state battery 10B are electrically connected. Therefore, after soldering is completed, if a high-level voltage (signal) is applied to the control terminal 10d and a low-level voltage (signal) is applied to the write / erase terminal 10e, the desired electronic circuitry configuration in which the state of charge of the all-solid-state battery is maintained can be obtained in the finished substrate formed by surface mounting the all-solid-state battery and electronic components together.

[0047] In addition, such as Figure 10 As shown in the all-solid-state battery 10C, the reliability of PMOS control can be improved by having the switching unit have multiple non-volatile memories M, and by making the transistor T not conduct if all memories M are not "0".

[0048] In addition, in such and Figure 7 In connection with this explanation, if the switching unit is placed outside the all-solid-state battery 10, it can also replace the fuse F, and as... Figure 11 The diagram shows the use of optocoupler P in conjunction with transistor T. In this case, if there is no input from control terminal 60, no potential difference occurs between the gate and source of transistor T due to the voltage of power supply E, so transistor T does not conduct between electrical lines 2a and 2b (Vcc = 0V). Conversely, when a low-level voltage (signal) is applied to control terminal 60, the output of optocoupler P becomes "0", a potential difference occurs between the gate and source of transistor T, and transistor T conducts between electrical lines 2a and 2b (Vcc = voltage of power supply E).

[0049] Furthermore, as another embodiment of surface mounting the all-solid-state battery 10 onto an electronic circuit board, such as... Figure 12As shown, it is also considered that the all-solid-state battery 10 is subsequently installed in a battery socket 70 whose electrical terminals have been soldered to conductor wiring patterns 2, 4. Naturally, in this case, the all-solid-state battery 10 is installed into the battery socket 70 after the soldering process, which could potentially cause a short circuit, is completed. Furthermore, external terminals for connection to conductor wiring patterns 2, 4 are formed on the outer bottom surface of the socket 70, and internal terminals for connection to the electrodes of the all-solid-state battery 10 are formed inside the socket 70; these terminals are electrically connected to each other.

[0050] The present invention has been described above in relation to various embodiments, but the present invention is not limited to the above embodiments and can be implemented in various modifications without departing from its spirit. For example, in the present invention, the shape of the switching unit, the shape of the wiring pattern, the electronic components, the number of all-solid-state batteries, etc., are not limited to the examples of the above embodiments. In addition, without departing from the spirit of the present invention, some or all of the above embodiments may be combined, or a part of the structure may be omitted from one of the above embodiments.

[0051] Explanation of symbols

[0052] 1, 1A, 1B, 1C: Electronic circuit board; 10, 10A, 10B, 10C: All-solid-state battery; 2, 4: Conductor wiring pattern; 20: Switch (switching unit); 90: Cut hole (switching unit); F: Fuse (switching element); M: Non-volatile memory (switching element); P: Optocoupler (switching element); T: Transistor (switching element).

Claims

1. An electronic circuit board, which is an electronic circuit board formed by surface mounting an all-solid-state battery and electronic components together, characterized in that, The electronic components and the all-solid-state battery are electrically connected to a conductor wiring pattern formed on an electrically insulating substrate body by welding, thereby forming an electronic circuit. In the electrical circuit of the electronic circuit connected to the positive terminal of the all-solid-state battery or in the electrical circuit of the electronic circuit connected to the negative terminal of the all-solid-state battery, a switching unit is provided that is capable of electrically disconnecting these electrical circuits and switching from their electrically disconnected state to their electrically connected state.

2. An electronic circuit board, which is an electronic circuit board formed by surface mounting a battery and electronic components together, characterized in that, The electronic components and the battery are electrically connected to a conductor wiring pattern formed on an electrically insulating substrate body by welding, thereby forming an electronic circuit. In the electrical circuit of the electronic circuit connected to the positive terminal of the battery or in the electrical circuit of the electronic circuit connected to the negative terminal of the battery, a switching unit is provided that is capable of electrically disconnecting these electrical circuits and switching from their electrically disconnected state to their electrically connected state.

3. The electronic circuit board according to claim 1 or 2, characterized in that, The switching from the electrically disconnected state to the electrically connected state is irreversible.

4. The electronic circuit board according to claim 1 or 2, characterized in that, The switching unit is a switch disposed on the conductor wiring pattern and used to open and close the electronic circuit.

5. The electronic circuit board according to claim 1 or 2, characterized in that, The switching unit is a cut hole that mechanically cuts off the conductor wiring pattern.

6. The electronic circuit board according to claim 1 or 2, characterized in that, The switching unit includes a switching element that switches from the electrically disconnected state to the electrically connected state by being subjected to a voltage.

7. The electronic circuit board according to claim 6, characterized in that, The switching elements include transistors, fuses, non-volatile memory, or optocouplers to form an electrical circuit.

8. The electronic circuit board according to claim 6, characterized in that, The switching element is located inside the all-solid-state battery.

9. A manufacturing method for manufacturing an electronic circuit board in which a battery and electronic components are surface-mounted together, characterized in that, The process includes a soldering step that electrically connects the electronic components and / or the battery to a conductor wiring pattern formed on an electrically insulating substrate body, thereby forming an electronic circuit. Prior to the welding step, an electrical disconnection step is included, in which a switching unit disposed in either the electrical circuit of the electronic circuit connected to the positive terminal of the battery or the electrical circuit of the electronic circuit connected to the negative terminal of the battery electrically disconnects the electrical circuits. After the welding step, the switching unit is used to switch from the electrically disconnected state to the electrically connected state that electrically connects the electrical lines.

10. The manufacturing method according to claim 8, characterized in that, The soldering step is performed by placing the charged battery and the electronic components together on the substrate and immersing them in a molten solder bath.

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