Heating sheet, atomizing core, atomizer and electronic cigarette
By designing a heating sheet with heating zone and pores in an electronic cigarette and combining it with the structure of the atomizing core, the problems of heating instability and inconvenient assembly are solved, and more stable electrode contact and more uniform atomization effect are achieved. Improved user experience.
Patent Information
- Application Number
- CN202420847479.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-22
AI Technical Summary
The heating plates in existing electronic cigarettes have problems such as instability in heating and inconvenient assembly, which affect the atomization effect and user experience.
A heating sheet is designed, which includes a substrate, a heating zone, a heating layer and a plurality of pores for adsorption and guiding the atomization matrix, and is secured to the electrode through electrode contacts, increasing contact stability and assembly convenience. The heating sheet is arranged in the atomizing core, which includes an atomizing core housing, an atomizing base and a heating sheet to form a storage cavity to store and atomize the substrate.
The contact stability between the electrode contacts of the heating sheet and the electrode is improved, the assembly process of the device is simplified, and the atomization matrix is uniformly guided through the pore structure of the substrate, improving the atomization effect and user experience.
Smart Images

Figure CN222236710U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of atomization technology, and in particular to a heating plate, an atomization core, an atomizer, and an electronic cigarette including the atomization core. Background Art
[0002] An electronic cigarette (also called an "electronic cigarette") or a smoking device is an electronic delivery system for generating an aerosol from an atomized substrate for a user to inhale. The atomized substrate can be a liquid (e.g., a smoke liquid, etc.) or a solid or gel (e.g., a smoke paste), etc.
[0003] Generally, a conventional electronic cigarette mainly includes a cartridge storing an atomized matrix and a power supply device. The cartridge has a heating or evaporation device, such as an atomizer including an atomizer core. The power supply device supplies power to the atomizer core to convert the atomized matrix in the cartridge into an aerosol for the user to inhale. In many electronic cigarettes, the user's inhalation activates the atomizer core, vaporizing the liquid atomized matrix in the cartridge, and then the user inhales the generated aerosol through the mouthpiece.
[0004] The atomizer core is a key component in the electronic cigarette, which directly affects the aerosol generated by heating and atomization, thereby affecting the user experience. The heating plate in the existing atomizer core has problems such as unstable heating and inconvenient assembly. Utility Model Content
[0005] According to a first aspect of the present disclosure, a heating plate is provided, which is used to atomize an atomization matrix to form an aerosol, and the heating plate comprises: a substrate, which comprises a heating zone, a heating layer is arranged on the surface of the heating zone, and a plurality of pores arranged according to a preset rule are arranged inside the heating zone, the plurality of pores are used to adsorb the atomization matrix and guide the adsorbed atomization matrix to the heating layer; a plurality of electrode contacts are arranged on the surface of the heating zone; and a plurality of electrodes, the plurality of electrodes are respectively fixedly connected to a corresponding one of the plurality of electrode contacts.
[0006] According to another aspect of the present disclosure, an atomizer core is provided, comprising: an atomizer core shell, the atomizer core shell defining an air flow inlet, an air flow outlet, a accommodating space between the air flow inlet and the air flow outlet, and an atomizing substrate inlet, the atomizing substrate inlet leading to the accommodating space; an atomizer seat, the atomizer seat being arranged in the accommodating space and defining an atomizing channel and an opening for communicating with the air flow inlet and the air flow outlet, the opening being used to communicate the atomizing substrate inlet and the atomizing channel; and a heating plate according to the present disclosure, the heating plate being arranged in the atomizer seat, wherein the heating layer faces the atomizing channel, and a surface of the heating plate opposite to the heating layer faces the atomizing substrate inlet.
[0007] According to another aspect of the present disclosure, an atomizer is provided, comprising the atomizer core and a housing. The atomizer core is disposed in the housing, and a storage cavity for storing atomized substrate is formed between the housing and the atomizer core.
[0008] According to yet another aspect of the present disclosure, an electronic cigarette is provided, comprising the above-mentioned atomizer and a power supply assembly for supplying power to the atomizer.
[0009] According to one or more embodiments of the present disclosure, the present disclosure provides a heating sheet, by fixing the electrode contacts on the heating sheet to the electrodes. Compared with the contact-type connection between the electrode spring and the electrode contacts, the embodiments of the present disclosure can increase the contact stability between the electrode contacts and the electrodes. In addition, since there is no need to consider the connection between the electrode contacts on the heating sheet and the electrodes, the device (e.g., atomizer core, electronic cigarette, etc.) containing the heating sheet is more convenient to assemble. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without creative work. The drawings are as follows:
[0011] Figure 1 is a schematic diagram showing a heating sheet according to some embodiments of the present disclosure;
[0012] Figure 2 It shows Figure 1 A partial schematic diagram of a heating plate in FIG.
[0013] Figure 3 It shows that the Figure 1 Schematic diagram of the atomizer core of the heating plate;
[0014] Figure 4 It shows Figure 3 A cross-sectional view of an atomizer core, wherein the section line passes through an atomizer substrate inlet;
[0015] Figure 5 It shows Figure 3 Exploded view of the atomizer core;
[0016] Figure 6 It shows that Figure 3 A three-dimensional picture of an electronic cigarette with an atomizer core.
[0017] Reference numerals list:
[0018] Heating plate 1; substrate 10; temperature measuring device 20; heating area 11; assembly area 12; groove 13; first electrode contact 31; second electrode contact 32; third electrode contact 33; pore 14; multiple electrodes 40; first electrode 41; second electrode 42; third electrode 43; connecting end 411 of the first electrode; connecting end 421 of the second electrode; connecting end 431 of the third electrode; lead portion 412 of the first electrode; lead portion 422 of the second electrode; lead portion 432 of the third electrode;
[0019] Atomizer core 100; atomizer core housing 110; atomizer seat 120; air flow inlet 111; air flow outlet 112; atomizer core accommodating space 113; atomizer substrate inlet 114; atomizer channel 121; opening 122; atomizer substrate absorbing material 61; flange 115;
[0020] Top cover 1100; storage chamber support 1200; bottom cover 1300; sealing member 1400; control member 1500; storage chamber 1201; nozzle portion 1101; power chamber 1202;
[0021] Electronic cigarettes 3,000; battery components 2,000. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0023] It should be noted that all directional indications in the embodiments of the present disclosure (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0024] In the present disclosure, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense, for example, it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.
[0025] In this article, "communication" refers to fluid communication, that is, fluid (including liquid and / or gas) can flow from one component to another component. In addition, in this article, communication between two components can refer to direct communication between the two components, for example, at least partial alignment between two holes, or communication through an intermediate medium.
[0026] In the present disclosure, unless otherwise stated, all numbers used in the specification and claims to represent component parameters, technical effects, etc. should be understood as being modified by the term "approximately" or "roughly" in any case. Therefore, unless otherwise indicated, the numerical parameters listed in the following specification and the attached claims are approximate values. For those skilled in the art, it can vary according to the desired properties and effects sought to be obtained through the present disclosure, and each numerical parameter should be interpreted according to the number of significant digits and conventional rounding methods or in a manner understood by those skilled in the art.
[0027] In the present disclosure, the terms used in the description of various examples are only for the purpose of describing specific examples and are not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element can be one or more. In addition, the term "and / or" used in the present disclosure covers any one of the listed items and all possible combinations.
[0028] "Atomized substrate" refers to a mixture or auxiliary substance that can be completely or partially atomized into an aerosol by an electronic device or similar device. The atomized substrate can be a liquid medium such as e-cigarette liquid, medical drugs, skin care lotion, etc. By atomizing these media, an aerosol that can be inhaled or absorbed can be delivered to the user.
[0029] "Aerosol" refers to a colloidal dispersion system formed by small solid or liquid particles dispersed and suspended in a gas medium.
[0030] "Atomizer" refers to a device that forms aerosol from stored atomizable substrate, i.e., atomized substrate, by heating or ultrasound. The atomizer core is one of the main components of the atomizer.
[0031] In the related art, the end of the electrode is usually set in the form of an electrode spring, and the electrode spring is directly contacted with the electrode contact on the heating plate to make an electrical connection without wire welding, etc. However, this method has the problem of unstable electrode contact.
[0032] In view of this, the present disclosure provides a heating sheet, by fixing the electrode contacts on the heating sheet to the electrodes. Compared with the contact-type connection between the electrode spring and the electrode contacts, the embodiments of the present disclosure can increase the contact stability between the electrode contacts and the electrodes. In addition, since there is no need to consider the connection between the electrode contacts on the heating sheet and the electrodes, the device (e.g., atomizer core, electronic cigarette, etc.) containing the heating sheet is more convenient to assemble.
[0033] The atomizer core according to the present disclosure can be used in an electronic cigarette. In the scope of the present disclosure, "electronic cigarette" refers to a system that generates an aerosol by atomizing a matrix, such as smoke liquid (specifically, smoke oil, etc.) for people to inhale, suck, chew or nasal inhalation, etc. In some examples, the electronic cigarette may include a storage chamber for storing the atomizer matrix and an atomizer core for adsorbing and atomizing the atomizer matrix to form an aerosol. Among them, the atomizer matrix can be in liquid form (for example, smoke liquid) or solid or gel form (for example, smoke paste), etc. It should be understood here that the atomizer core of the present disclosure can also be used in other equipment that requires atomization of the atomizer matrix, such as medical atomizers, skin care instruments, aromatherapy devices, etc.
[0034] Refer to the following Figures 1 to 5 The heating sheet and the atomizing core of the present disclosure are described in detail.
[0035] Figure 1 is a schematic diagram showing a heating sheet 1 according to some embodiments of the present disclosure; Figure 2 It shows Figure 1 A partial schematic diagram of the heating plate 1 in FIG.
[0036] like Figure 1 As shown, a heating chip 1 for atomizing an atomization substrate to form an aerosol may include a base 10 , a plurality of electrode contacts 30 and a plurality of electrodes 40 .
[0037] The substrate 10 includes a heating area 11. A heating layer (not shown) is provided on the surface of the heating area 11 and a plurality of pores 14 arranged according to a preset rule are provided inside the heating area 11. The plurality of pores 14 are used to adsorb the atomized substrate and guide the adsorbed atomized substrate to the heating layer.
[0038] A plurality of electrode contacts 30 are provided on the surface of the heating region where the heating layer is provided.
[0039] The plurality of electrodes 40 are respectively fixedly connected to a corresponding one of the plurality of electrode contacts.
[0040] The above embodiment can increase the contact stability between the electrode contacts and the electrodes. In addition, since there is no need to consider the connection between the electrode contacts and the electrodes on the heating sheet, the device (eg, atomizer core, electronic cigarette, etc.) containing the heating sheet is more convenient to assemble.
[0041] In some embodiments, the multiple pores in the heating area 11 of the substrate 10 can adsorb and guide the atomized matrix through capillary action, thereby avoiding direct contact between the heating layer and the atomized matrix, and further avoiding the atomized matrix (for example, e-liquid) from impacting the heating layer when the flow rate is too fast, causing it to directly enter the atomization channel without being atomized.
[0042] In some embodiments, the substrate 10 can be made of a silicon wafer (also known as a wafer). Among them, a silicon wafer refers to a sheet-like object made of silicon, and a silicon wafer of specifications such as 6 inches, 8 inches, and 12 inches can be selected to make the substrate. The silicon wafer may include a single crystal silicon wafer, a polycrystalline silicon wafer, and the like. By using a silicon wafer as the substrate 10, a chip manufacturing process (for example, photolithography, etc.) can be used to process a heating layer with micron-level pores and a low resistance value in the silicon wafer with high precision. In addition, a chip production line can also be used to manufacture the heating plate on a large scale and automatically. The substrate 10 of the present disclosure uses a silicon wafer to achieve a smaller volume of the heating plate 1 without affecting the strength of the substrate 10.
[0043] In some other embodiments, the substrate 10 may also be made of glass or the like. Glass is, for example, quartz glass, high silica glass, or the like. Quartz glass includes, but is not limited to, natural quartz glass, synthetic quartz glass, transparent quartz glass, opaque quartz glass, or the like. The heating area 11 of the substrate 10 may also be made of other materials that can be processed by laser or the like to have a plurality of pores arranged in a preset regular pattern. Quartz glass and other materials may be engraved with a plurality of micropores or pores arranged in a preset regular pattern by laser or other processing means.
[0044] In some embodiments, the cross-sectional shape of the substrate 10 can be set to be circular, square (such as Figure 1 shown) etc.
[0045] In some embodiments, the substrate 10 may further include an assembly area 12. The assembly area 12 is at least partially arranged around the heating area 11. The assembly area 12 of the substrate 10 is not processed in any way and no circuit is arranged thereon, so as to be used to assemble the assembly area 12 with corresponding components such as the atomizer core, thereby assembling the heating plate 1 into the atomizer core.
[0046] In some embodiments, the diameter of each of the multiple pores 14 in the heating area 11 of the substrate 10 is in the range of 30 μm to 100 μm, so that the multiple pores can achieve the functions of oil guiding and oil locking. Specifically, on the one hand, the atomized matrix can be adsorbed and guided through the multiple pores, and on the other hand, the tension of the atomized matrix such as the smoke oil can be used to prevent it from passing through the heating plate 1 and entering the atomization channel, thereby reducing the risk of leakage.
[0047] In some embodiments, the minimum distance between adjacent pores in the plurality of pores 14 is in the range of 30 μm to 100 μm. The minimum distance between adjacent pores in the plurality of pores refers to the closest distance between the edges of two adjacent pores. The above dimensions can facilitate uniform distribution of a sufficient number of pores within the substrate 10 to ensure uniformity of the conduction atomized matrix and the amount of the stored atomized matrix.
[0048] In some embodiments, the heating layer on the surface of the heating zone 11 of the substrate 10 is formed by metal plating (e.g., electroplating, evaporation, etc.) on the surface of the heating zone 11, so as to form a heating layer on the surface of the heating zone. In the case where the substrate 10 is a silicon wafer, it is convenient to accurately process a heating layer with a lower resistance value on the heating zone 11. In some examples, the resistance range of the heating layer can be in the range of 0.4Ω to 2.0Ω. It should be understood that the resistance of the heating layer can also be set to other values as needed.
[0049] In some embodiments, the heating layer may be made of metal such as tungsten, iron-chromium-aluminum or nickel-chromium alloy.
[0050] In some embodiments, the heating plate 1 may further include a temperature measuring device 20. The temperature measuring device 20 is located on the substrate 10 and is used to measure the temperature of the heating zone 11. At this time, the substrate 10 may further include a groove 13 extending inward from the surface of the heating zone 11 where the heating layer is provided, for accommodating the temperature measuring device 20. By providing the groove 13 in the heating zone 11 to accommodate the temperature measuring device 20, on the one hand, the temperature measuring device 20 can be isolated from the heating layer to avoid the temperature measuring device 20 contacting the heating layer and causing a short circuit, and on the other hand, the temperature measuring device 20 can be closer to the heating zone 11, so as to more accurately obtain the temperature of the heating zone 11 (more precisely, the heating layer).
[0051] In some embodiments, the temperature measuring device 20 may be a thermal resistor or a thermocouple, etc., which converts the change in resistance value into an electrical signal according to the property that the resistance value of a metal conductor or semiconductor changes with temperature, thereby achieving the purpose of temperature measurement. The temperature measurement of a thermal resistor or a thermocouple has high sensitivity, good stability and high accuracy. In some examples, the resistance value of the thermocouple or the thermal resistor is, for example, about 20Ω. Alternatively, in the case where the substrate 10 is a silicon wafer, a PN junction can be formed by doping on the silicon wafer, thereby utilizing the temperature sensitivity of the PN junction to use the PN junction as the temperature measuring device 20.
[0052] In some embodiments, the plurality of electrode contacts 30 may include a first electrode contact 31, a second electrode contact 32, and a third electrode contact 33. The first electrode contact 31 (e.g., a positive electrode contact) and the second electrode contact 32 (e.g., a negative electrode contact) are connected to the heating layer, and the second electrode contact 32 and the third electrode contact 33 are connected to the temperature measuring device 20. In some examples, the first electrode contact 31 and the second electrode contact 32 may be connected to the positive electrode and the negative electrode of a power source to power the temperature measuring device 20 and the heating layer. Thus, the heating layer and the temperature measuring device 20 may share a second electrode contact 32 (e.g., a negative electrode contact) to simplify the structure of the heating sheet 1.
[0053] In some embodiments, the third electrode contact 33 for the temperature measuring device 20 is used for anti-counterfeiting identification and transmission of the temperature measurement signal of the temperature measuring device 20. In the case where the temperature measuring device 20 is a thermal resistor, the temperature measurement signal may be a resistance signal. In other words, the resistance change signal measured by the temperature measuring device 20 may be read from the third electrode contact 33, thereby obtaining the temperature change amount of the heating area 11. In addition, the third electrode contact 33 may also carry anti-counterfeiting information to facilitate anti-counterfeiting identification of the atomizer core.
[0054] Accordingly, the plurality of electrodes 40 may include a first electrode 41, a second electrode 42 and a third electrode 43. The first electrode 41 is fixedly connected to the first electrode contact 31. The second electrode 42 is fixedly connected to the second electrode contact 32. The third electrode 43 is fixedly connected to the third electrode contact 33.
[0055] Alternatively, the plurality of electrode contacts may also be provided as 2 or 4 electrode contacts, etc., and accordingly, the plurality of electrodes may be provided as 2 or 4 electrodes, etc., and the present disclosure is not limited thereto.
[0056] In some embodiments, at least one of the plurality of electrodes 40 may include a connection end, and the connection end is fixedly connected to a corresponding electrode contact of the plurality of electrode contacts by welding. Figure 2 As shown, the connection end 411 of the first electrode is fixedly connected to the first electrode contact 31 by welding; the connection end 421 of the second electrode is fixedly connected to the second electrode contact 32 by welding; and the connection end 431 of the third electrode is fixedly connected to the third electrode contact 33 by welding. The above connection method by welding can increase the stability of the electrical connection between the electrode and the electrode contact. In addition, by selecting the connection method of welding, in actual production, the electrode can be welded to the electrode contact using, for example, surface mounting technology in the chip manufacturing process, so as to facilitate the assembly of the heating plate and facilitate the large-scale and automated manufacturing of the heating plate using a chip production line. Alternatively, the connection ends of at least some of the electrodes in the plurality of electrodes can also be fixedly connected to the electrode contacts by bonding or the like.
[0057] In some embodiments, in addition to the connection end, at least one of the plurality of electrodes may each include a lead portion. The width of the connection end may be set to be greater than the width of the lead portion to facilitate stable connection between the connection end and the electrode contact. Figure 2 As shown, the lateral width of the connecting end 411 of the first electrode is greater than the lateral width of the lead portion 412 of the first electrode; the lateral width of the connecting end 421 of the second electrode is greater than the lateral width of the lead portion 422 of the second electrode; and the lateral width of the connecting end 431 of the third electrode is greater than the lateral width of the lead portion 432 of the third electrode.
[0058] In some embodiments, a pad (not shown) may be provided on the electrode contact using a welding connection method, and the connecting end is attached to the pad by welding to be fixedly connected to the corresponding electrode contact. For example, a pad may be provided on the first electrode contact so that the connecting end 411 of the first electrode is fixedly connected to the first electrode contact 31 by welding. The pad between the connecting end and the electrode contact can not only serve as a connection point between the electrode and the electrode contact, thereby increasing the reliability of the electrical connection, but also can be used to support the connecting end and maintain the distance between the electrode and the electrode contact so as to facilitate accurate connection between them. In addition, the pad between the connecting end and the electrode contact can also optimize the effect of the subsequent welding step. Specifically, the pad can be customized according to the size and shape of the connecting end of the electrode to optimize the welding effect. The pad can be set to a circular, oval, rectangular, octagonal and special shape, etc.
[0059] In some embodiments, the pad may include a silver pad, a tin-lead pad, or a copper pad, etc. Among them, the copper pad has the advantage of being able to withstand high temperatures, thereby making the welding connection more secure.
[0060] In some embodiments, the pad is coated with solder paste, and the connecting end is placed on the coated solder paste to be attached to the pad by welding. In some examples, the solder paste can be a putty-like mixture of powdered metal solder and sticky flux, so as to act as a temporary glue, that is, to fix the connecting end of the electrode and the pad on the electrode contact in place before welding. Afterwards, the solder in the solder paste can be melted by welding techniques such as reflow soldering, thereby establishing a connection between the connecting end of the electrode and the pad on the electrode contact. Among them, the solder paste can be, for example, tin paste, that is, the solder in the solder paste is tin. Alternatively, the powdered metal solder in the solder paste can also be other metals.
[0061] When welding is used as a connection method and pads and / or solder paste are provided on the electrode contacts, the electrodes can be welded to the electrode contacts by using, for example, surface mounting technology in the chip manufacturing process, thereby facilitating the assembly of the heating plate and facilitating the large-scale and automated manufacturing of the heating plate using a chip production line. The manufacturing process of the surface mount technology may be, for example, as follows: solder pads are respectively set on the first electrode contact 31, the second electrode contact 32 and the third electrode contact 33 of the heating plate 1; a placement machine (for example, an automatic placement machine) applies solder paste on predetermined positions of the respective solder pads of the first electrode contact 31, the second electrode contact 32 and the third electrode contact 33 through a template (for defining predetermined positions for the solder pads to facilitate the application of solder paste) and a scraper (a tool for cleaning) at an angle of, for example, 45° to 60°; the connecting end 411 of the first electrode, the connecting end 421 of the second electrode, and the connecting end 431 of the third electrode are respectively placed on the solder paste applied on the solder pads of the first electrode contact 31, the second electrode contact 32 and the third electrode contact 33, and then the temporarily connected electrodes and electrode contacts are transported to a soldering furnace (for example, a reflow soldering furnace) to melt the solder in the solder paste, thereby soldering the connecting ends of the electrodes to the solder pads of the electrode contacts.
[0062] According to another aspect of the present disclosure, Figures 3 to 5 As shown, an atomizer core 100 is also provided, which may include an atomizer core housing 110, an atomizer seat 120 and Figure 1 A heating sheet 1 is described.
[0063] The atomizer core housing 110 defines an air flow inlet 111 , an air flow outlet 112 , a receiving space 113 between the air flow inlet 111 and the air flow outlet 112 , and an atomizer substrate inlet 114 leading into the receiving space 113 .
[0064] The atomization substrate inlet 114 is formed in the wall of the atomization core housing 110 and penetrates the wall of the atomization core housing 110, so as to connect the space outside the atomization core housing 110 and the accommodation space 113 (such as Figure 4 As shown), the atomizing matrix outside the atomizing core housing 110 can enter the interior of the atomizing core housing 110.
[0065] like Figure 4 As shown, the atomizer seat 120 is disposed in the accommodation space 113, and the atomizer seat 120 defines an atomization channel 121 for communicating with the airflow inlet 111 and the airflow outlet 112. The cavity approximately in the center of the atomizer seat 120 forms the atomization channel 121 for air, steam, and aerosol to flow through. When the atomizer seat 120 is installed in the accommodation space 113 of the atomizer core housing 110, one end of the atomization channel 121 is communicated with the airflow inlet 111 of the atomizer core housing 110, and the other end is communicated with the airflow outlet 112.
[0066] The atomizer seat 120 further defines an opening 122 for connecting the atomizing substrate inlet 114 and the atomizing channel 121. Since the opening 122 is formed in the side wall of the atomizer seat 120 and penetrates the side wall, the opening 122 is opposite to the atomizing substrate inlet 114 and leads to the atomizing channel 121, so the atomizing substrate located outside the atomizing core housing 110 can enter the atomizing channel 121 via the atomizing substrate inlet 114 and the opening.
[0067] The heating sheet 1 is arranged in the atomizing seat 120, the heating layer faces the atomizing channel 121, and the surface of the heating sheet 1 opposite to the heating layer faces the atomizing substrate inlet 114. Thus, the atomizing substrate entering through the atomizing substrate inlet 114 (and the opening 122) can reach the heating sheet 1, and penetrate into the heating layer through the multiple pores in the base 10 of the heating sheet 1, so as to be heated by the heating layer and atomized to form an aerosol.
[0068] In the above embodiment, if Figure 4 As shown, when the user inhales at the airflow outlet 112, the airflow can reach the airflow outlet 112 from the airflow inlet 111 via the atomization channel 121 in the atomization seat 120, thereby forming an airflow path. A part of the airflow path (i.e., the atomization channel 121) forms an atomization chamber. Wherein, one side of the heating plate 1 is communicated with the atomization substrate inlet 114 via an opening 122, and the other side is in fluid communication with the atomization channel 121. The atomization substrate located outside the atomization core housing 110 penetrates into the substrate 10 of the heating plate 1 through the atomization substrate inlet 114 and the opening, and then continues to penetrate into the heating layer of the heating plate 1, so as to reach the heating layer on the first surface of the heating plate 1, and steam is formed after being heated and atomized by the heating layer. Steam is entrained in the air flowing through the atomization channel 121 to form an aerosol for the user to inhale.
[0069] In some embodiments, the heating plate 1 may be disposed in the opening 122 of the atomizer seat 120 , and the opening 122 may be provided with a step for supporting the heating plate 1 .
[0070] In the above case, the surface of the substrate 10 opposite to the heating layer can directly cover the atomizing substrate inlet 114. Thus, the substrate 10 can play the role of a buffer structure between the heating layer and the atomizing substrate, preventing the atomizing substrate (e.g., tobacco oil) from impacting the heating layer when the flow rate is too fast, thereby causing it to not be atomized and directly enter the atomizing channel 121, but to be guided to the heating layer through the multiple pores 14 of the substrate 10 for heating, thereby promoting the uniformity of heating. By using the substrate 10 of the heating sheet 1 as a guiding buffer structure between the atomizing substrate inlet 114 and the heating layer, there is no need to additionally provide an additional atomizing substrate absorbing material 61, thereby reducing the number of components and manufacturing costs.
[0071] Alternatively, to further reduce the risk of leakage, Figure 3 As shown, the atomizer core may further include a sleeve-shaped atomizer matrix absorption material 61. The atomizer matrix absorption material 61 is sleeved on the atomizer seat 120 (specifically, on the periphery of the atomizer seat), and the outer side of the atomizer matrix absorption material 61 covers the atomizer matrix inlet 114 from the inner side of the atomizer core housing 110, and the inner side of the atomizer matrix absorption material 61 is against the heating plate 1. Thus, a buffer structure can be further provided between the heating plate 1 and the atomizer matrix to prevent the atomizer matrix (for example, smoke oil) from impacting the heating plate 1 when the flow rate is too fast, thereby causing it to directly enter the atomization channel 121 without atomization.
[0072] Alternatively, the atomizer core may also include a sheet of atomizer substrate absorption material, which is also arranged between the atomizer core housing and the atomizer seat. In this case, the first side of the atomizer substrate absorption material covers the atomizer substrate inlet from the inner side of the atomizer core housing, and the second side thereof opposite to the first side is against the heating plate.
[0073] In some other embodiments, the heating plate 1 may be arranged in the atomization channel 121 of the atomization seat 120, and the atomization matrix absorption material may be a sheet structure, which may be embedded in the opening of the atomization seat 120 and located between the atomization matrix inlet 114 and the heating plate 1. The first side of the atomization matrix absorption material covers the atomization matrix inlet 114 from the inner side of the atomization core housing 110, and the second side thereof opposite to the first side is against the heating plate 1. Thus, a buffer structure may be further arranged between the heating plate 1 and the atomization matrix to prevent the atomization matrix (e.g., e-liquid) from impacting the heating plate 1 when the flow rate is too fast, thereby causing it to directly enter the atomization channel 121 without being atomized.
[0074] The atomized matrix absorption material in the aforementioned various embodiments may include cotton or woven fabric, which includes but is not limited to sanitary napkins, inert cotton, organic cotton, composite cotton, linen cotton, asbestos, and fiber cotton. Cotton or woven fabric is composed of fibers, which can achieve the effects of oil absorption and oil conduction, thereby better achieving the effect of buffering and avoiding excessive oil. In addition, cotton has the characteristic of uniformly distributed pores, making the oil conduction smoother.
[0075] In some embodiments, the plurality of electrodes 40 at least partially extend out of the atomizer core housing 110 to facilitate electrical connection with a power supply assembly, a control component, etc., thereby facilitating power supply to, for example, a heating layer and a temperature measuring device, and / or facilitating control of the heating plate by the control component.
[0076] In some embodiments, Figure 3 and Figure 4As shown, a flange 115 (e.g., a flange at least partially arranged along the circumference of the atomizer core housing) is provided on the portion of the atomizer core housing 110 close to the airflow outlet 112, so as to be used for sleeve-mounting a seal 1400 (e.g., Figure 6 The above embodiment can facilitate the installation of the sealing member, thereby promoting the sealing of the storage chamber of the atomizer (as will be referred to below). Figure 6 Detailed description).
[0077] According to another aspect of the present disclosure, Figure 6 As shown, an atomizer 1000 is provided, comprising: the above-mentioned atomizer core 100; and a shell (for example, comprising a top cover 1100, a storage cavity support 1200 and a bottom cover 1300), the atomizer core 100 is arranged in the shell, and a storage cavity 1201 for storing atomized matrix is formed between the shell (specifically, its inner wall) and the atomizer core (specifically, its outer wall).
[0078] In some embodiments, the housing may include: a top cover 1100, a storage chamber support 1200, and a bottom cover 1300. The top cover 1100 may include a mouthpiece 1101 connected to the air flow outlet of the atomizer core 100. The bottom cover 1300 may include an air inlet connected to the air flow inlet 111 of the atomizer core 100. The storage chamber support 1200 is connected between the top cover 1100 and the bottom cover 1300, and is used to accommodate the atomizer core 100. It is thus convenient to support the atomizer core in the housing and form a storage chamber for storing the atomized matrix. At this time, the storage chamber can be defined by the space between the inner wall of the storage chamber support, the inner wall of the top cover, and the outer wall of the atomizer core housing of the atomizer core.
[0079] In some other embodiments, the housing may also include a one-piece housing.
[0080] In some embodiments, the atomizer 1000 may further include a seal 1400, which is sleeved on the atomizer core housing 110 of the atomizer core 100 and is arranged between the top cover 1100 and the storage chamber support 1200. At this time, the storage chamber 1201 is enclosed by the seal 1400 (specifically, its bottom surface), the storage chamber support 1200 (specifically, its inner wall) and the atomizer core 100 (specifically, its outer wall) (that is, the space between the three is limited). The above-mentioned seal of the atomizer core housing 110 can promote the sealing of the enclosed storage chamber. In some examples, the seal 1400 can be made of colloid or the like. In addition, materials for adsorbing the atomization matrix, such as oil-locking cotton, etc., can also be placed in the storage chamber.
[0081] In some embodiments, a power cavity 1202 arranged side by side with the storage cavity 1201 is further provided in the storage cavity support 1200 for placing the power supply assembly 2000. Thus, the storage cavity for storing the atomized matrix and the power supply cavity for placing the power supply assembly can be integrated into one housing, thereby reducing the number of components of the atomizer and even the electronic cigarette.
[0082] According to another aspect of the present disclosure, Figure 6 As shown, an electronic cigarette 3000 is provided, comprising: the above-mentioned atomizer 1000; and a power supply component 2000 (for example, a battery cell) for supplying power to the atomizer.
[0083] In some embodiments, the electronic cigarette may further include a control member 1500 (e.g., a PCB circuit board, etc.) disposed in the housing (e.g., the bottom cover 1300) of the atomizer 1000. An external circuit may be integrated on the control member 1500 for controlling the power supply circuit between the power supply assembly and the heating plate. The control member may control the power supply of the power supply assembly to the heating plate according to input control parameters (e.g., control parameters input by the user, changes in air pressure in the electronic cigarette, and / or the temperature of the heating layer measured by the temperature measuring device, etc.). Specifically, for example, a button may be provided on the outer surface of the electronic cigarette for the user to input control parameters to control the heating of the heating plate. In addition, an airflow sensor may also be provided at the airflow inlet and / or the air inlet to monitor changes in air pressure in the electronic cigarette.
[0084] The above are only embodiments or examples of the present disclosure, and the patent scope of the present disclosure is not limited thereto. All equivalent structural transformations made by using the contents of the present disclosure and the drawings, or direct / indirect applications in other related technical fields under the concept of the present disclosure are included in the patent protection scope of the present disclosure. Various elements in the embodiments or examples may be omitted or replaced by their equivalent elements. In addition, the steps may be performed in an order different from that described in the present disclosure. Furthermore, the various elements in the embodiments or examples may be combined in various ways. It is important that with the evolution of technology, many of the elements described herein may be replaced by equivalent elements that appear after the present disclosure.
Claims
1. A heating sheet, characterized in that: The heating sheet is used to atomize the atomization substrate to form an aerosol, and the heating sheet comprises: A substrate, the substrate comprising a heating zone, a heating layer being arranged on the surface of the heating zone and a plurality of pores arranged according to a preset rule being arranged inside the heating zone, the plurality of pores being used to adsorb the atomized substrate and guide the adsorbed atomized substrate to the heating layer; a plurality of electrode contacts disposed on the surface of the heating zone; and A plurality of electrodes are respectively fixedly connected to a corresponding one of the plurality of electrode contacts.
2. The heating sheet according to claim 1, characterized in that: At least one electrode among the plurality of electrodes comprises a connection end portion, and the connection end portion is fixedly connected to a corresponding electrode contact among the plurality of electrode contacts by welding.
3. The heating sheet according to claim 2, characterized in that: The corresponding electrode contacts are provided with pads, and the connection ends are attached to the pads by welding to be fixedly connected with the corresponding electrode contacts.
4. The heating sheet according to claim 3, characterized in that: The pad is a copper pad.
5. The heating sheet according to claim 3, characterized in that: The pad is coated with solder paste, and the connection end is placed on the coated solder paste to be attached to the pad by soldering.
6. The heating sheet according to claim 1, characterized in that: The heating plate also includes: a temperature measuring device, which is located on the substrate and is used to measure the temperature of the heating zone, and the multiple electrode contacts include a first electrode contact, a second electrode contact and a third electrode contact, wherein the first electrode contact and the second electrode contact are electrically connected to the heating layer, and the second electrode contact and the third electrode contact are electrically connected to the temperature measuring device.
7. The heating sheet according to claim 1, characterized in that: The substrate is made of a silicon wafer.
8. An atomizer core, characterized in that: The atomizer core comprises: An atomizer core housing, the atomizer core housing defining an airflow inlet, an airflow outlet, a receiving space between the airflow inlet and the airflow outlet, and an atomizer substrate inlet, the atomizer substrate inlet leading into the receiving space; an atomizer seat, the atomizer seat being disposed in the accommodating space and defining an atomization channel and an opening for communicating with the airflow inlet and the airflow outlet, the opening being for communicating with the atomization substrate inlet and the atomization channel; and The heating plate according to any one of claims 1 to 7, wherein the heating plate is arranged in the atomization seat, wherein the heating layer faces the atomization channel, and the surface of the heating plate opposite to the heating layer faces the atomization substrate inlet.
9. An atomizer, characterized in that: The atomizer comprises: The atomizer core according to claim 8; and The shell is provided in the atomizer core, and a storage cavity for storing atomizer substrate is formed between the shell and the atomizer core.
10. An electronic cigarette, characterized in that: The electronic cigarette comprises: The atomizer according to claim 9; and A power supply assembly for supplying power to the atomizer.
Citation Information
Cited By
Heating piece, atomization core, atomizer and electronic cigarette
WO2025145765A1