Packaging antenna and printed circuit board

Abstract

The utility model relates to the field of antennas, in particular to a packaged antenna and a printed circuit board. The orthogonal radiation grounding coupling sheet and the orthogonal parasitic grounding coupling sheet are arranged in the packaging antenna, so that the bandwidth can be expanded, the cross polarization ratio can be improved, the structure of the packaging antenna is simplified into a structure only provided with the ball grid array packaging layer, the parasitic layer and the patch layer, a radio frequency connector is not needed, and the cost is reduced. In addition, a first medium and a second medium which are used for transmitting radio-frequency signals at a high speed are further arranged, and the first medium and the second medium are connected through the prepreg in a bonding mode. Besides, a feed layer is further arranged, the packaging antenna works through the feed layer, and at the moment, coaxial via holes designed in the feed layer are connected with coaxial via holes of the metal cover plate through ball grids in the ball grid array packaging layer.

Description

Technical Field

[0001] The utility model relates to the field of antennas, in particular to a packaged antenna and a printed circuit board. Background Art

[0002] With the rapid development of satellite communications and radar, the integration and integration of transceiver antennas are becoming increasingly obvious. The existing antennas used for the transmission, reception and processing of RF signals are generally divided into: probe-fed patch antennas, broadband patch antennas, and phase-controlled antennas; among them, the probe-fed patch antennas do not have separate routing for impedance matching, and cannot achieve good standing waves for wide-band RF signals; broadband patch antennas are usually implemented in air cavities, E-shaped patches, multi-layer parasitics and other settings, with complex structures and high processing costs; a phased array antenna is provided with an RF connector at one end, and a connector is provided on the corresponding transceiver component. During use, the RF connector and the connector on the transceiver component have problems of unstable connection and poor contact, and the cost of setting up the RF connector and the transceiver component is high.

[0003] In view of the above-mentioned prior art, it is an urgent problem to be solved by those skilled in the art to find out how to process the radio frequency signals of the full frequency band while simplifying the antenna structure and reducing the cost. Utility Model Content

[0004] The utility model aims to provide a packaged antenna and a printed circuit board, which are used to solve the problem that radio frequency signals of the entire frequency band cannot be processed, and the antenna structure is complex and the cost is high.

[0005] In order to solve the above problems, the utility model provides a packaged antenna, comprising: a chip packaging module, a ball grid array packaging layer, a radiation patch, a radiation ground coupling piece, a parasitic patch, and a parasitic ground coupling piece;

[0006] The chip packaging module is connected to the ball grid array packaging layer for transmitting radio frequency signals;

[0007] The radiation patch is arranged between each group of the radiation ground coupling plates in a horizontal position, and each group of the radiation ground coupling plates is orthogonally arranged on the patch layer;

[0008] The parasitic ground coupling sheet is orthogonally arranged on the parasitic layer, and the parasitic layer is divided into four areas, and each of the areas is provided with the parasitic patch;

[0009] The radiation patch overlaps with the parasitic patch at the patch layer, and the parasitic layer is arranged above the patch layer, and the vertical projection of the parasitic layer overlaps with the vertical projection of the patch layer.

[0010] In another aspect, it also includes: a first medium;

[0011] The first medium is arranged between the parasitic layer and the patch layer, and a plurality of metallized holes are arranged on the first medium, and the positions of the metallized holes overlap with the positions of the parasitic ground coupling plates in the parasitic layer.

[0012] On the other hand, it also includes: a second medium;

[0013] The second medium is arranged below the patch layer, and a coaxial probe is arranged on the second medium for transmitting the radio frequency signal.

[0014] On the other hand, it also includes: a feed layer;

[0015] The feed layer is arranged between the second medium and the ball grid array packaging layer. A bottom metal ground is arranged on the feed layer. The bottom metal ground is connected to the coaxial probe through a plurality of coaxial vias.

[0016] On the other hand, it also includes: a prepreg;

[0017] The patch layer is embedded in the prepreg, and the prepreg is bonded to the first medium and the second medium.

[0018] On the other hand, the chip packaging module includes: a ceramic tube shell, a metal cover plate;

[0019] The ceramic tube shell is arranged below the metal cover plate, and a plurality of coaxial vias are arranged on the metal cover plate, and the coaxial vias of the metal cover plate are connected with the coaxial vias of the bottom metal ground.

[0020] On the other hand, the metallized hole penetrates the first medium, the patch layer, and the second medium.

[0021] On the other hand, the coaxial vias of the metal cover plate are connected to the ball grids in the ball grid array packaging layer, and the coaxial vias of the bottom metal ground are connected to the ball grids in the ball grid array packaging layer.

[0022] On the other hand, the chip packaging module is connected to a component for processing the radio frequency signal.

[0023] In order to solve the above problems, the utility model also provides a printed circuit board, including all the above packaged antennas.

[0024] The utility model provides a packaged antenna in which an orthogonal radiation ground coupling plate and an orthogonal parasitic ground coupling plate are provided to expand the bandwidth, thereby being able to process radio frequency signals of the entire frequency band, and simplifying the structure of the packaged antenna to a structure consisting only of a ball grid array packaging layer, a parasitic layer, and a patch layer, and no radio frequency connector is required, thereby reducing costs.

[0025] In addition, it is also necessary to say that a first medium and a second medium are provided for high-speed transmission of radio frequency signals, and the first medium and the second medium are bonded by a semi-cured sheet, so as to better parameterize the radio frequency signal while fixing the first medium and the second medium by bonding, thereby reducing costs; in addition, a feeding layer is provided, and the packaged antenna is enabled to work through the feeding layer. At this time, the ball grid in the ball grid array packaging layer is connected to the coaxial via of the metal cover plate through the coaxial via designed in the feeding layer.

[0026] The utility model also provides a printed circuit board, which has the same effect as above. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present utility model, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] FIG1 is a schematic diagram of the structure of an antenna provided by the present utility model;

[0029] FIG2 is a schematic diagram of the structure of the parasitic layer provided by the utility model;

[0030] FIG3 is a schematic diagram of the structure of the patch layer provided by the utility model;

[0031] FIG4 is a schematic structural diagram of a first medium provided by the present invention;

[0032] FIG5 is a schematic diagram of the structure of the second medium provided by the present invention;

[0033] FIG6 is a schematic diagram of the structure of the feed layer provided by the utility model;

[0034] FIG7 is a schematic diagram of the structure of a ball grid array packaging layer provided by the present invention;

[0035] FIG8 is a schematic diagram of the structure of the metal cover provided by the present invention;

[0036] FIG9 is a schematic diagram of the structure of the ceramic tube shell provided by the utility model;

[0037] FIG10 is a return loss curve diagram after the radiation ground coupling plate and the parasitic ground coupling plate are provided in the utility model;

[0038] FIG11 is a gain curve diagram of the present invention without the radiation ground coupling plate and the parasitic ground coupling plate;

[0039] FIG12 is a gain curve diagram of the present invention after providing a radiation ground coupling plate and a parasitic ground coupling plate;

[0040] FIG13 is a curve diagram of the total radiation efficiency of the packaged antenna provided by the present invention;

[0041] FIG. 14 is a standing wave curve diagram provided by the present utility model.

[0042] Among them, 10 is a radiation patch, 11 is a parasitic patch, 12 is a radiation ground coupling plate, 13 is a parasitic ground coupling plate, 14 is a parasitic layer, 15 is a patch layer, 16 is a first medium, 17 is a metallized hole, 18 is a second medium, 19 is a coaxial probe, 20 is a feeding layer, 21 is a coaxial via arranged on the bottom metal ground, 22 is a ball grid array packaging layer, 23 is a metal cover plate, 24 is a ceramic tube shell, and 25 is a coaxial via arranged on the metal cover plate. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.

[0044] The core of the utility model is to provide a packaged antenna and a printed circuit board, which are used to process radio frequency signals of the full frequency band while simplifying the antenna structure and reducing the cost.

[0045] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] With the rapid development of satellite communications and radars, the integration and integration of transceiver antennas are becoming more and more advanced. Among them, phased array antennas have powerful scanning and beamforming capabilities, among which Aip packaged antennas (Antenna in Package) and Aop packaged antennas (Antenna over Package) are the main application antennas. It should be noted that the Aip packaged antenna is packaged using ceramic technology, but the dielectric constant of ceramics is high, which reduces the radiation efficiency of the packaged antenna, and the installation height of the packaged antenna is easily affected by the ceramic technology and cannot be made too high, and it is impossible to process low-frequency band (X-band and Ku-band) RF signals. However, the Aip packaged antenna set up using photolithography technology is more expensive; it is understandable that the Aop packaged antenna is relatively more flexible and can process RF signals of the full frequency band. Compared with phased array antennas, it has lower costs and higher reliability.

[0047] FIG1 is a schematic diagram of the structure of an antenna provided by the utility model. As shown in FIG1 , the packaged antenna in this embodiment includes: a chip packaging module, a ball grid array packaging layer 22, a radiation patch 10, a radiation ground coupling plate 12, a parasitic patch 11, and a parasitic ground coupling plate 13;

[0048] The chip packaging module is connected to the ball grid array packaging layer 22 for transmitting radio frequency signals;

[0049] The radiation patch 10 is arranged between each group of radiation ground coupling plates 12 in a horizontal position, and each group of radiation ground coupling plates 12 is orthogonally arranged on the patch layer 15;

[0050] The parasitic ground coupling plate 13 is orthogonally arranged on the parasitic layer 14, and divides the parasitic layer 14 into four areas, and a parasitic patch 11 is arranged in each area;

[0051] The position of the radiation patch 10 on the patch layer 15 overlaps with the position of the parasitic patch 11 on the parasitic layer 14 , and the parasitic layer 14 is arranged above the patch layer 15 , and the vertical projection of the parasitic layer 14 overlaps with the vertical projection of the patch layer 15 .

[0052] It should be noted that the packaged antenna is a rectangular printed circuit board, which has a total of 4 layers, namely: a parasitic layer 14, a patch layer 15, a feed layer 20 and a chip packaging layer. In some embodiments, the chip packaging module is also directly referred to as a module; wherein the signal is input from one end of the chip packaging module through the component, at which time a radio frequency signal is generated and transmitted to the ball grid array packaging layer 22; it should be noted that the component can be a connecting line between various power equipment, and can also be a power transmission line in a power grid;

[0053] The packaged antenna involved in this embodiment, in which an orthogonal radiation ground coupling plate 12 and an orthogonal parasitic ground coupling plate 13 are provided, can expand the bandwidth, so that the RF signal of the entire frequency band can be processed, and the structure of the packaged antenna is simplified to a structure with only a ball grid array packaging layer 22, a parasitic layer 14, and a patch layer 15, and no RF connector is required, thereby reducing the cost.

[0054] FIG2 is a schematic diagram of the structure of the parasitic layer provided by the utility model. As shown in FIG2 , in the parasitic layer 14, four parasitic patches 11 and two parasitic ground coupling sheets 13 are arranged. In this embodiment, the parasitic ground coupling sheet 13 is a dumbbell-shaped ground coupling sheet. At this time, the two dumbbell-shaped ground coupling sheets are vertically and orthogonally arranged on the parasitic layer 14, and the arrangement of the two dumbbell-shaped ground coupling sheets divides the parasitic layer 14 into four areas, wherein each area is provided with a parasitic patch 11;

[0055] FIG3 is a schematic diagram of the structure of the patch layer provided by the present invention. As shown in FIG3 , in the patch layer 15, four radiating patches 10 and four groups of radiating ground coupling plates 12 are provided. In the present embodiment, the radiating ground coupling plates 12 are cardioid ground coupling plates, and the cardioid ground coupling plates are arranged in groups of two, wherein one group of radiating ground coupling plates 12 is placed with one radiating patch 10 sandwiched therebetween. At this time, two groups of radiating ground coupling patches and two correspondingly placed radiating patches 10 are arranged at one of the diagonally opposite corners of the patch layer 15 of the package antenna, and the other two groups of radiating patches 10 and two correspondingly placed radiating patches 10 are arranged at the other of the diagonally opposite corners of the patch layer 15 of the package antenna.

[0056] FIG4 is a schematic diagram of the structure of the first medium provided by the utility model. As shown in FIG4, the first medium 16 is arranged between the parasitic layer 14 and the patch layer 15, and a plurality of metallized holes 17 are arranged on the first medium 16, and the position of the metallized holes 17 overlaps with the position of the parasitic ground coupling plate 13 in the parasitic layer 14. In this embodiment, it should be noted that there are a plurality of metallized holes 17, and each metallized hole 17 is a through hole of a relatively small size, and all the metallized holes 17 arranged on the first medium 16 penetrate the first medium 16. In this embodiment, the dielectric constant of the first medium 16 is set to 2.94, the loss tangent angle is 0.0011, and the medium thickness is 0.381 mm; at this time, the metallized holes 17 can achieve a shielding effect to prevent each parasitic patch 11 from having a radiation effect on the other parasitic patches 11;

[0057] FIG5 is a schematic diagram of the structure of the second medium provided by the utility model. As shown in FIG5 , the second medium 18 is arranged below the patch layer 15, and a coaxial probe 19 is arranged on the patch layer 15 for transmitting radio frequency signals. It should be noted that all the metallized holes 17 arranged on the second medium 18 penetrate the second medium 18; and two coaxial probes 19 are arranged at the same position corresponding to each area of ​​the corresponding parasitic patch 11 arranged on the parasitic layer 14; at this time, a total of 8 coaxial probes 19 are arranged on the second medium 18; in this embodiment, the dielectric constant of the second medium 18 is set to 2.94, the loss tangent is 0.0011, and the medium thickness is 1.016mm;

[0058] In addition, it should be noted that a prepreg is also provided in the package antenna; at this time, the patch layer 15 is embedded in the prepreg, and the prepreg is bonded to the first medium 16 and the second medium 18; in this embodiment, the dielectric constant of the prepreg is set to 3.0, the loss tangent is 0.0021, and the dielectric thickness is 0.1 mm; finally, the first medium 16 and the second medium 18 should be set to materials with a low coefficient of thermal expansion (CTE) to prevent the package from deforming and cracking during welding; it can be understood that the metallized hole 17 passes through the first medium 16, the patch layer 15, and the second medium 18;

[0059] FIG6 is a schematic diagram of the structure of the feed layer provided by the utility model. As shown in FIG6 , the packaged antenna is further provided with a feed layer 20; at this time, the feed layer 20 is provided with a bottom metal ground, the feed layer 20 is provided between the second medium 18 and the ball grid array package layer 22, and a bottom metal ground is provided on the feed layer 20, and the bottom metal ground is connected to the coaxial probe 19 through a plurality of coaxial vias 21 provided;

[0060] FIG7 is a schematic diagram of the structure of the ball grid array packaging layer provided by the utility model. As shown in FIG7 , a plurality of ball grids are provided in the ball grid array packaging layer 22. However, it can be understood that, in FIG7 , the corresponding positions in the coaxial vias of the above-mentioned feed layer 20 are not provided with ball grids, but are provided with routing lines, and are connected to the coaxial vias of the bottom metal ground through the routing lines;

[0061] Ball Grid Array (BGA) is a surface mount packaging technology used in integrated circuits. This technology is often used to permanently fix devices such as microprocessors. The ball grid array package can provide more pins than other packages such as dual in-line packages or quad flat packages. The entire bottom surface of the package can be used as pins instead of only part of the pins. At this time, the ball grid array package can also have a shorter average wire length for better high-speed performance;

[0062] In some embodiments, the chip packaging module includes: a ceramic tube shell 24 and a metal cover plate 23; the ceramic tube shell 24 is arranged below the metal cover plate 23, and a plurality of coaxial vias are arranged on the metal cover plate 23, and the coaxial vias 25 of the metal cover plate are connected to the coaxial vias of the underlying metal ground; wherein, the coaxial vias 25 of the metal cover plate are connected to the corresponding ball grids in the ball grid array packaging layer 22 through routing, and the coaxial vias of the underlying metal ground are connected to the ball grids in the ball grid array packaging layer 22.

[0063] Figure 8 is a schematic diagram of the structure of the metal cover provided by the utility model. As shown in Figure 8, a metal cover 23 is provided on the top layer of the chip packaging module. At this time, the metal cover 23 is connected to the ball grid in the ball grid array packaging layer 22, and four coaxial vias are provided on the metal cover 23. It should be noted that, whether it is the coaxial via 21 provided on the bottom metal ground or the coaxial via 25 provided on the metal cover, the outer circle thereof is the dug-out metal. Figure 9 is a schematic diagram of the structure of the ceramic tube shell provided by the utility model. As shown in Figure 9, the ceramic tube shell 24 can encapsulate the entire chip packaging module, and the ceramic tube shell 24 adopts a ceramic process.

[0064] It should also be noted that FIG10 is a return loss curve diagram after the radiation ground coupling plate and the parasitic ground coupling plate provided by the present invention are provided. According to FIG10 , the abscissa of the curve diagram is the frequency, and the ordinate of the curve diagram is the return loss value. At this time, the frequency can be divided into a low frequency (f_L), an intermediate frequency (f_C), and a high frequency (f_H). When the frequency exceeds the intermediate frequency (f_C), the return loss value of the radiation ground coupling plate 12 and the parasitic ground coupling plate 13 is provided, which is less than the return loss value of the radiation ground coupling plate 12 and the parasitic ground coupling plate 13 not provided.

[0065] When the angle between the polarization plane of the RF signal and the normal plane of the earth changes periodically from 0 to 360°, it can be understood that the electric field remains unchanged in magnitude, but changes in direction over time. When the trajectory of the end of the electric field vector is projected as a circle on a plane perpendicular to the propagation direction, it is called circular polarization. When the amplitudes of the horizontal and vertical components of the electric field are equal and the phase difference is 90° or 270°, circular polarization can be obtained. If the polarization plane rotates over time and forms a right-handed spiral relationship with the propagation direction of the electromagnetic wave, it is called right-handed circular polarization. On the contrary, if it forms a left-handed spiral relationship, it is called left-handed circular polarization.

[0066] FIG11 is a gain curve diagram of the present invention without the radiation ground coupling plate and the parasitic ground coupling plate, and FIG12 is a gain curve diagram of the present invention after the radiation ground coupling plate and the parasitic ground coupling plate are provided. In combination with FIG11 and FIG12 , the abscissa of the gain curve diagram is the azimuth, and the ordinate of the gain curve diagram is the gain. At this time, it can be known that the cross-polarization ratio of the packaged antenna after the radiation ground coupling plate 12 and the parasitic ground coupling plate 13 are provided is better than the cross-polarization ratio of the packaged antenna without the radiation ground coupling plate 12 and the parasitic ground coupling plate 13;

[0067] Figure 13 is a total radiation efficiency curve of the packaged antenna provided by the present invention. As shown in Figure 13, the horizontal axis of the curve graph is the frequency, and the vertical axis of the curve graph is the total radiation efficiency value. At this time, the frequency can be divided into low frequency (f_L), medium frequency (f_C), and high frequency (f_H). It can be seen that the total radiation efficiency of the packaged antenna is between 0.95-1 (it can also be understood that the total radiation efficiency is between 95%-100%).

[0068] Figure 14 is a standing wave curve diagram provided by the utility model. As shown in Figure 14, the horizontal axis of the standing wave curve diagram is the frequency, and the vertical axis of the curve diagram is the active standing wave coefficient. At this time, the frequency can be divided into low frequency (f_L), medium frequency (f_C), and high frequency (f_H). At this time, it can be known that the active standing wave of the packaged antenna involved in this embodiment is good.

[0069] The packaged antenna embodiment is described in detail above, and the utility model also provides a corresponding embodiment of a printed circuit board.

[0070] The above is a detailed introduction to a packaged antenna and a printed circuit board provided by the utility model. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

[0071] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

Claims

1. A packaged antenna, characterized in that: include: Chip packaging module, ball grid array packaging layer, radiation patch, radiation ground coupling sheet, parasitic patch, parasitic ground coupling sheet; The chip packaging module is connected to the ball grid array packaging layer for transmitting radio frequency signals; The radiation patch is arranged between each group of the radiation ground coupling plates in a horizontal position, and each group of the radiation ground coupling plates is orthogonally arranged on the patch layer; The parasitic ground coupling sheet is orthogonally arranged on the parasitic layer, and the parasitic layer is divided into four areas, and each of the areas is provided with the parasitic patch; The radiation patch overlaps with the parasitic patch at the patch layer, and the parasitic layer is arranged above the patch layer, and the vertical projection of the parasitic layer overlaps with the vertical projection of the patch layer.

2. The packaged antenna according to claim 1, characterized in that: Also includes: First medium; The first medium is arranged between the parasitic layer and the patch layer, and a plurality of metallized holes are arranged on the first medium, and the positions of the metallized holes overlap with the positions of the parasitic ground coupling plates in the parasitic layer.

3. The packaged antenna according to claim 2, characterized in that: Also includes: Second medium; The second medium is arranged below the patch layer, and a coaxial probe is arranged on the second medium for transmitting the radio frequency signal.

4. The packaged antenna according to claim 3, characterized in that: Also includes: Feed layer; The feed layer is arranged between the second medium and the ball grid array packaging layer. A bottom metal ground is arranged on the feed layer. The bottom metal ground is connected to the coaxial probe through a plurality of coaxial vias.

5. The packaged antenna according to claim 3, characterized in that: Also includes: Prepreg; The patch layer is embedded in the prepreg, and the prepreg is bonded to the first medium and the second medium.

6. The packaged antenna according to claim 4, characterized in that: The chip packaging module includes: a ceramic tube shell and a metal cover plate; The ceramic tube shell is arranged below the metal cover plate, and a plurality of coaxial vias are arranged on the metal cover plate, and the coaxial vias of the metal cover plate are connected with the coaxial vias of the bottom metal ground.

7. The packaged antenna according to claim 3, characterized in that: The metallized hole penetrates the first medium, the patch layer, and the second medium.

8. The packaged antenna according to claim 6, characterized in that: The coaxial vias of the metal cover plate are connected to the ball grids in the ball grid array packaging layer, and the coaxial vias of the bottom metal ground are connected to the ball grids in the ball grid array packaging layer.

9. The packaged antenna according to claim 1, characterized in that: The chip packaging module is connected to the component and is used to process the radio frequency signal.

10. A printed circuit board, characterized in that: include: The packaged antenna according to any one of claims 1 to 9.

Images