Cover plate type flexible directional sounding device and directional sounding display device

Abstract

The utility model discloses a cover plate type flexible directional sounding device and a directional sounding display device, the directional sounding device comprises a transparent vibration layer, a microstructure, a transparent non-vibration layer and a non-transparent frame decoration layer, the vibration layer comprises a first base material layer and a first conductive layer, the non-vibration layer comprises a second base material layer and a second conductive layer, and the second base material layer comprises a first conductive layer and a second conductive layer. The first base material layer and the second base material layer are flexible base material layers, and the frame decoration layer is arranged on a bottom surface frame, close to the non-vibration layer, of the first conductive layer and / or a top surface frame, away from the non-vibration layer, of the first base material layer and covers all wires in a frame area of the directional sound production device. The cover plate type flexible directional sounding device provided by the utility model is flexible, wide in application scene, lighter and thinner, and simplifies the casing design of a client.

Description

Technical Field

[0001] The utility model relates to the technical field of directional sound generation, in particular to a cover-type flexible directional sound generation device and a directional sound generation display device. Background Art

[0002] At present, with the development of ultra-thin electronic devices such as mobile phones and computers, the traditional speakers are too large to further reduce the size of electronic devices. The screen sound device can produce sound through the vibration of the screen, which is conducive to the further miniaturization of electronic devices. The screen directional sound device can further spread the sound emitted by the screen to a specific area, which is more conducive to protecting the privacy of electronic device users and preventing the sound from disturbing others.

[0003] The existing screen directional sound-emitting device includes a vibration layer, a supporting structure and a substrate layer. The vibration layer and the substrate layer are bonded to each other, and the supporting structure is supported between the vibration layer and the substrate layer. At least one electrode layer is provided on the vibration layer and the substrate layer to be connected to an external driving circuit. The external circuit supplies power, applies a voltage signal to the substrate layer and the vibration layer, drives the vibration layer to vibrate up and down, and emits an ultrasonic signal. The ultrasonic signal is self-demodulated by the air to produce audible sound.

[0004] However, the substrate layer of the above-mentioned existing screen directional sound-emitting device is generally made of hard glass, which is heavy and thick and cannot meet the market's demand for thinness and lightness. In addition, because the substrate layer is hard, the curvature is low and it can only be used on relatively flat surfaces, which limits its scope of use. Utility Model Content

[0005] The purpose of the utility model is to provide a cover-type flexible directional sound-emitting device and a directional sound-emitting display device which are flexible, widely applicable, thinner and lighter, and have a simplified client casing design.

[0006] To achieve the above-mentioned purpose, on the one hand, the utility model proposes a cover-type flexible directional sound-emitting device, comprising a transparent vibration layer, a microstructure, a transparent non-vibration layer and a non-transparent frame decoration layer, the vibration layer and the non-vibration layer frame are in contact with each other, the microstructure is arranged between the vibration layer and the non-vibration layer, so that an air gap required for the vibration layer to vibrate up and down is formed between the two; the vibration layer comprises a first substrate layer and a first conductive layer, the first conductive layer is entirely formed on the bottom surface of the first substrate layer close to the non-vibration layer, the non-vibration layer comprises a second substrate layer and a second conductive layer, the second conductive layer is entirely formed on the top surface of the second substrate layer close to the vibration layer, the first substrate layer and the second substrate layer are both flexible substrate layers, the frame decoration layer is arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer and / or on the top surface frame of the first substrate layer away from the non-vibration layer, covering all the wiring in the frame area of ​​the directional sound-emitting device.

[0007] In a preferred embodiment, the first substrate layer and the second substrate layer are made of any one of polyethylene terephthalate, polyimide film and ultra-thin flexible glass.

[0008] In a preferred embodiment, the frame decoration layer is a cover ink layer, which is conductive when it is arranged on the bottom frame of the first conductive layer close to the non-vibration layer, and is conductive or non-conductive when it is arranged on the top surface of the first substrate layer away from the non-vibration layer.

[0009] In a preferred embodiment, the cover plate ink layer is formed by any one of exposure and development, silk screen printing, spray printing, and spin coating processes.

[0010] In a preferred embodiment, the cover plate ink layer is a single-layer or multi-layer structure, and the multi-layer cover plate ink layer is stepped.

[0011] In a preferred embodiment, the device also includes a first edge routing, an edge insulating layer, a second edge routing and a full-surface insulating layer, the first edge routing is covered on the bottom surface of the frame decoration layer close to the non-vibration layer when the frame decoration layer is arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer, and is directly arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer when the frame decoration layer is arranged on the top surface of the first substrate layer away from the non-vibration layer, and the edge insulating layer covers the bottom surface of the first edge routing close to the non-vibration layer; the second edge routing is arranged on the top surface frame of the second conductive layer close to the vibration layer, and the full-surface insulating layer covers the top surface of the second conductive layer close to the vibration layer and covers the second edge routing.

[0012] In a preferred embodiment, one end of the microstructure is formed in the bottom frame of the first conductive layer close to the non-vibration layer, and the other end is fixed to the entire insulating layer through an adhesive layer, or one end of the microstructure is formed in the top frame of the entire insulating layer close to the vibration layer, and the other end is fixed to the first conductive layer through an adhesive layer.

[0013] In a preferred embodiment, when the directional sound emitting device is used in a vehicle, industrial control or electronic field, any one or more coating layers of AG, AR, AF and HC are further provided on the surface of the first substrate layer away from the non-vibration layer.

[0014] In a preferred embodiment, the total thickness of the entire insulating layer and the adhesive layer on the non-vibration layer is 5um~10um, the total thickness of the first substrate layer and the first conductive layer is 120um~130um, the height of the microstructure is 6um~9um, the spacing is 2.2mm~2.6mm, and the shape is a single point or a single cluster of multiple points.

[0015] On the other hand, the utility model provides a directional sound display device, which includes the above-mentioned cover-type flexible directional sound device.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The utility model innovatively realizes the two functional layers (vibration layer and non-vibration layer) of the directional sound device with flexible film layers, so that the formed directional sound device is flexible as a whole and can be attached to a surface of any shape. Of course, it can also be used alone as an independent speaker. Compared with the existing structural design in which one layer is a hard layer and the other layer is a hard layer or a flexible layer, the scope of its application scenarios is greatly expanded, and it can be applied to almost any surface. The structural design in which both functional layers are flexible film layers can also reduce the weight and thinness of the directional sound device as a whole, making it lighter and thinner. In this way, when it is used in combination with an existing display device, the overall thickness and thinness of the formed directional sound display device can also be reduced, adapting to the design trend of lighter and thinner existing display devices.

[0018] 2. The utility model innovatively arranges a frame decoration layer on the functional layer. On the one hand, it can cover all the wiring in the frame area of ​​the directional sound-emitting device to enhance the overall aesthetics of the device. On the other hand, the frame decoration layer can be used as a part of the frame. In this way, when it is used in conjunction with a client (including a display device or other equipment), the client does not need to design a casing to shield and fix the frame of the directional sound-emitting device, thereby simplifying the design of the client. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a structural schematic diagram of a cover-type flexible directional sound-emitting device in one embodiment of the utility model;

[0020] Figure 2 This is a structural schematic diagram of a cover-type flexible directional sound-emitting device in another embodiment of the utility model;

[0021] Figure 3 This is a structural schematic diagram of a cover-type flexible directional sound-emitting device in another embodiment of the utility model;

[0022] Figure 4 It is a structural schematic diagram of a cover-type flexible directional sound-emitting device in another embodiment of the utility model.

[0023] The accompanying drawings are marked as follows:

[0024] 1. Vibration layer, 11. First substrate layer, 12. First conductive layer, 2. Microstructure, 3. Non-vibration layer, 31. Second substrate layer, 32. Second conductive layer, 4. Air gap, 5. Frame decoration layer, 6. First edge routing, 7. Edge insulation layer, 8. Second edge routing, 9. Whole-surface insulation layer, 10. Adhesive layer. DETAILED DESCRIPTION

[0025] The specific implementation modes of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0026] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0027] Combination Figure 1 to Figure 4 As shown, the utility model discloses a cover-type flexible directional sound-emitting device, which specifically includes a flexible vibration layer 1, a microstructure 2 and a flexible non-vibration layer 3. That is to say, the whole includes a double flexible substrate layer structure, that is, the vibration layer 1 and the non-vibration layer 3 are both flexible structures; the microstructure 2 is arranged between the vibration layer 1 and the non-vibration layer 3, and is used to provide an air gap 4 required for the vibration layer 1 to vibrate up and down.

[0028] In this embodiment, the vibration layer 1 specifically includes a first substrate layer 11 and a first conductive layer 12. The first substrate layer 11 is a flexible film material layer. When implemented, any one of polyethylene terephthalate (PET), polyimide film (CPI) and ultra-thin flexible glass (UTG) can be used. The thickness can be set to 30um to 120um depending on the usage scenario. For example, in a specific embodiment, the first substrate layer 11 uses UTG, and its thickness is 30um±0.5um; or in another specific embodiment, the first substrate layer 11 uses UTG, and its thickness is 100um±0.5um; or in another specific embodiment, the first substrate layer 11 uses UTG, and its thickness is 70um±0.5um. The source of raw materials during its specific preparation, the lower surface of the more mature UTG film layer on the market or its upper and lower surfaces generally have a HCL layer, which plays a high-transmittance insulation role. The thickness of the HCL layer can be 7um±0.5um. The first conductive layer 12 is formed entirely on the bottom surface of the first substrate layer 11 near the non-vibration layer 3. When implemented, its material can be any one of ITO (indium tin oxide), METAL MESH (metal mesh), AG (silver), nano silver and other plating layers, and its thickness is as thin as possible. For example, in a specific embodiment, its thickness can be 0.5um. In this embodiment, the vibration layer 1 is transparent as a whole.

[0029] Preferably, a cover-type flexible directional sound-emitting device disclosed in the utility model further includes a frame decoration layer 5. When implemented, the frame decoration layer 2 can be arranged on the bottom frame of the first conductive layer 12 close to the non-vibration layer 3, and / or arranged on the top frame of the first substrate layer 11 away from the non-vibration layer 3, covering all the wiring in the frame area of ​​the directional sound-emitting device, thereby improving the overall aesthetics of the directional sound-emitting device. The frame decoration layer 5 is preferably arranged on the bottom frame of the first conductive layer 12. This method can make the in-plane step difference of the overall directional sound-emitting device low and the flatness good, so that the degree of integration in visual effect is high, and the product reliability is high. When implemented specifically, the frame decoration layer 5 can be a cover ink layer, and the color can be a variety of black, glossy black, matte black or colorful, and the frame effect is highly diversified. And when the cover ink layer is arranged on the bottom frame of the first conductive layer 12 close to the non-vibration layer 3, it is preferably arranged to be conductive, that is, a conductive cover ink layer, so that the conductivity of the first conductive layer 12 can be enhanced, and the cover ink layer can be colorfully designed. When it is arranged on the top frame of the first substrate layer 11 away from the non-vibration layer 3, it can be conductive or non-conductive, preferably non-conductive. In implementation, the cover plate ink layer can be arranged as a multi-layer structure, and the multi-layer cover plate ink layer can be designed as a step-shaped structure, which is more beautiful. The color of the cover plate ink layer can be determined according to customer needs. If it is black, it can be one black layer or multiple black layers. During preparation, the cover plate ink layer can be formed by any one of the processes such as exposure and development, silk screen printing, spray printing, and spin coating.

[0030] In addition, the cover-type flexible directional sound-emitting device disclosed in the utility model further includes a first edge routing 6 and an edge insulating layer 7, wherein when the frame decoration layer 5 is arranged on the bottom surface frame of the first conductive layer 12 close to the non-vibration layer 3, the first edge routing 6 is covered on the bottom surface of the frame decoration layer 5 close to the non-vibration layer 3, and at this time, the first edge routing 6 can be thinned or even omitted; when the frame decoration layer 5 is arranged on the top surface frame of the first substrate layer 11 away from the non-vibration layer 3, the first edge routing 6 is directly arranged on the bottom surface frame of the first conductive layer 12 close to the non-vibration layer 3, which is used to enhance the overall conductivity of the first conductive layer 12. The edge insulating layer 7 covers the bottom surface of the first edge routing 6 close to the non-vibration layer 3, which is used to insulate and isolate the vibration layer 1 and the non-vibration layer 3. In implementation, the first edge routing 6 can be a conductive copper routing or a silver paste routing. When it is a conductive copper routing, it can be formed by making an edge pattern through a mask or copper plating the entire surface and then exposing, developing and etching; when it is a silver paste routing, it can be realized by a silk screen process.

[0031] The non-vibration layer 3 specifically includes a second substrate layer 31 and a second conductive layer 32, wherein, like the above-mentioned vibration layer, the second substrate layer 31 is also a flexible film material layer. When implemented, any one of polyethylene terephthalate (PET), polyimide film (CPI) and ultra-thin flexible glass (UTG) can be used. The thickness can be set to 30um to 120um depending on the usage scenario. For example, in one specific embodiment, the second substrate layer 31 uses UTG, and its thickness is 30um±0.5um; or in another specific embodiment, the second substrate layer 31 uses UTG, and its thickness is 100um±0.5um; or in another specific embodiment, the second substrate layer uses UTG, and its thickness is 70um±0.5um. The source of raw materials during its specific preparation, the lower surface of the more mature UTG film layer on the market or its upper and lower surfaces generally have a HCL layer (not shown in the figure), which plays a high-transmittance insulation role, and the thickness of the HCL layer can be 7um±0.5um. The second conductive layer 32 is formed entirely on the top surface of the second substrate layer 31 near the vibration layer 1. When implemented, its material can also be any one of ITO (indium tin oxide), METAL MESH (metal mesh), AG (silver), nano silver and other plating layers. Its thickness is as thin as possible. For example, in a specific embodiment, its thickness can be 0.5um. In this embodiment, the non-vibration layer 3 is also transparent as a whole.

[0032] In addition, a cover-type flexible directional sound-emitting device disclosed by the utility model also includes a second edge wiring 8 and a whole-surface insulating layer 9, wherein the second edge wiring 8 is arranged on the top surface frame of the second conductive layer 32 close to the vibration layer 1, and the whole-surface insulating layer 9 covers the second conductive layer 32 on the top surface close to the vibration layer 1 and covers the second edge wiring 8, so as to achieve insulation isolation between the vibration layer 1 and the non-vibration layer 3. During implementation, the material and processing technology of the second edge wiring 8 are the same as those of the first edge wiring, and the details can be referred to the above description, which will not be repeated here. During implementation, the whole-surface insulating layer 9 can be realized by any one of the processes such as exposure and development, silk screen printing, spray printing, and spin coating.

[0033] The microstructure 2 is arranged between the vibration layer 1 and the non-vibration layer 3, and is used to form an air gap 4 between the vibration layer 1 and the non-vibration layer 3 for the vibration layer 1 to vibrate up and down. During implementation, one end of the microstructure can be formed in the bottom frame of the first conductive layer 12 close to the non-vibration layer 3, and the other end is fixed to the entire insulating layer 9 through the adhesive layer 10, that is, the microstructure 2 is formed in the bottom frame of the first conductive layer 12 close to the non-vibration layer 3, and the entire insulating layer 9 of the non-vibration layer 3 is formed with the adhesive layer 10 on the entire surface of the top surface close to the vibration layer 1. When the vibration layer 1 and the non-vibration layer 3 are frame-bonded, the other end of the microstructure 3 is fixed to the non-vibration layer 3 through the adhesive layer 10 on the non-vibration layer 3. Of course, in other alternative embodiments, one end of the microstructure 2 can also be formed in the top frame of the entire insulating layer 9 of the non-vibration layer 3 close to the vibration layer 1, and the other end is fixed to the first conductive layer 12 through the adhesive layer 10, that is, the microstructure 2 is formed on the non-vibration layer 3, and the adhesive layer 10 is formed on the vibration layer 1. During implementation, the bonding layer 10 preferably selects a material with high dielectric constant and low dielectric loss, which can prevent the polarization of the material from causing unstable electric field voltage. In a specific implementation case, the bonding layer 10 can select UV glue, and the curing wavelength needs to select a band with high transmittance, and the bonding layer 10 can be realized by any one of the processes such as coating, spin coating, 2D / 3D printing / printing, and before contacting the microstructure 2, keep its surface dry or completely uncured. And the bonding layer 10 preferably has a material with a certain range of wettability, which is convenient for the embedding of the microstructure 2. When the microstructure 2 is embedded in the bonding layer 10, a triangular slope will be formed around the bottom of the microstructure 2. The ramp can fix the microstructure 2 and the bonding layer 10 to maintain a high effect, and the product reliability is good. In addition, during implementation, the microstructure 2 can select a non-polarized or polarized electrolyte material, preferably a non-polarized electrolyte material, and the polarized dielectric material is preferably a high dielectric symmetry material. The microstructure 2 can be realized by any one of the following processes: exposure and development process, screen printing process, and 2D / 3D printing process, and preferably, the exposure and development process with high precision is adopted.

[0034] In a specific embodiment, the total thickness of the entire insulating layer 9 and the adhesive layer 10 on the non-vibration layer 3 can be 5um to 10um. The lower the thickness, the greater the Coulomb force of the electric field; the total thickness of the first substrate layer 11 and the first conductive layer 12 is 120um to 130um; the height of the microstructure 2 is 6um to 9um, the spacing is 2.2mm to 2.6mm, and the shape can be a single point or a single cluster of multiple points. The size of a single point is preferably less than 20um, the maximum diameter of a single cluster is less than 100um, and the total width is less than 130um. The smaller the microstructure 2, the higher the visibility of the directional sound-emitting device formed as a whole.

[0035] In a specific embodiment, the thickness of the entire insulating layer 9 on the non-vibration layer 3 is 0 to 2 um, and the lower the thickness, the greater the Coulomb force of the electric field; the first substrate layer 11 adopts UTG, and an HCL layer is provided on the bottom surface of the first substrate layer 11, and its total thickness is 47.5 um to 49.5 um; the height of the microstructure 2 is 6 um to 9 um, and the spacing is 1.6 mm to 1.8 mm.

[0036] In a specific embodiment, the thickness of the entire insulating layer 9 on the non-vibration layer 3 is 0 to 2 um, and the lower the thickness, the greater the Coulomb force of the electric field; the first substrate layer 11 adopts UTG, and an HCL layer is provided on the top and bottom surfaces of the first substrate layer 11, and the total thickness is 54.5 um to 56.5 um; the height of the microstructure 2 is 6 um to 10 um, and the spacing is 1.6 mm to 2.0 mm.

[0037] In a specific embodiment, the first substrate layer 11 is made of UTG, and an HCL layer is disposed on the bottom surface of the first substrate layer 11, and the total thickness thereof is 108.55um-117.5um; the height of the microstructure 2 is 6um-9um, and the spacing is 2.4mm-3.4mm.

[0038] In a specific embodiment, the first substrate layer 11 is made of UTG, and HCL layers are provided on the top and bottom surfaces of the first substrate layer 11, with a total thickness of 116.5um to 118.5um; the height of the microstructure 2 is 6um to 9um, and the spacing is 2.5mm to 3.5mm.

[0039] In a specific embodiment, the first substrate layer 11 is made of UTG, and an HCL layer is disposed on the bottom surface of the first substrate layer 11, and the total thickness thereof is 77.55um-79.5um; the height of the microstructure 2 is 6um-9um, and the spacing is 2.1mm-2.9mm.

[0040] In a specific embodiment, the first substrate layer 11 is made of UTG, and HCL layers are provided on the top and bottom surfaces of the first substrate layer 11, with a total thickness of 84.5um to 86.5um; the height of the microstructure 2 is 6um to 9um, and the spacing is 2.2mm to 3.0mm.

[0041] In addition, when the above-mentioned directional sound-emitting device is used in a vehicle, industrial control or electronic field, in order to meet the effect of preventing the surface of the directional sound-emitting device or the display device bonded thereto from being touched and scratched, the surface of the first substrate layer 11 away from the non-vibration layer is also provided with any one or more of AG (anti-glare), AR (anti-reflection), AF (anti-fingerprint), and HC (hardening) coating treatments. In one implementation case, the surface of the first substrate layer 11 is treated with 10um hardening (HC), and the surface pencil hardness can reach 750g, 2H or more.

[0042] The utility model discloses a directional sound display device, comprising the above-mentioned cover-type flexible directional sound device, wherein the structure of the cover-type flexible directional sound device can refer to the above description and will not be repeated here.

[0043] The advantages of the utility model are as follows: 1. The utility model innovatively realizes the two functional layers (vibration layer and non-vibration layer) of the directional sound device with flexible film layers, so that the formed directional sound device is flexible as a whole and can be attached to a surface of any shape. Of course, it can also be used alone as an independent speaker. Compared with the existing structural design in which one layer is a hard layer and the other layer is a hard layer or a flexible layer, the scope of its application scenarios is greatly expanded, and it can be applied to almost any surface. Moreover, the structural design in which both functional layers are flexible film layers can also reduce the weight and thinness of the directional sound device as a whole, making it lighter and thinner. In this way, when it is used in combination with an existing display device, the overall thickness and thinness of the formed directional sound display device can also be reduced, adapting to the design trend of lighter and thinner existing display devices. 2. The utility model innovatively arranges a frame decoration layer on the functional layer. On the one hand, it can cover all the wiring in the frame area of ​​the directional sound-emitting device to enhance the overall aesthetics of the device. On the other hand, the frame decoration layer can be used as a part of the frame. In this way, when it is used in conjunction with a client (including a display device or other equipment), the client does not need to design a casing to shield and fix the frame of the directional sound-emitting device, thereby simplifying the design of the client.

[0044] The foregoing description of specific exemplary embodiments of the utility model is for the purpose of illustration and illustration. These descriptions are not intended to limit the utility model to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the utility model and various different options and changes. The scope of the utility model is intended to be limited by the claims and their equivalents.

Claims

1. A cover-type flexible directional sound-emitting device, characterized in that: The device includes a transparent vibration layer, a microstructure, a transparent non-vibration layer and a non-transparent frame decoration layer, the vibration layer and the non-vibration layer frame are in contact with each other, the microstructure is arranged between the vibration layer and the non-vibration layer, so that an air gap required for the vibration layer to vibrate up and down is formed between the two; the vibration layer includes a first substrate layer and a first conductive layer, the first conductive layer is formed entirely on the bottom surface of the first substrate layer close to the non-vibration layer, the non-vibration layer includes a second substrate layer and a second conductive layer, the second conductive layer is formed entirely on the top surface of the second substrate layer close to the vibration layer, the first substrate layer and the second substrate layer are both flexible substrate layers, the frame decoration layer is arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer and / or on the top surface frame of the first substrate layer away from the non-vibration layer, covering all the wiring in the frame area of ​​the directional sound-emitting device.

2. A cover-type flexible directional sound-emitting device as claimed in claim 1, characterized in that: The first substrate layer and the second substrate layer are made of any one of polyethylene terephthalate, polyimide film and ultra-thin flexible glass.

3. A cover-type flexible directional sound-emitting device as claimed in claim 1, characterized in that: The frame decoration layer is a cover plate ink layer, which is conductive when arranged on the bottom frame of the first conductive layer close to the non-vibration layer, and is conductive or non-conductive when arranged on the top frame of the first substrate layer away from the non-vibration layer.

4. A cover-type flexible directional sound-emitting device as claimed in claim 3, characterized in that: The cover plate ink layer is formed by any one of exposure and development, silk screen printing, spray printing and spin coating processes.

5. A cover-type flexible directional sound-emitting device as claimed in claim 3, characterized in that: The cover plate ink layer is a single-layer or multi-layer structure, and the multi-layer cover plate ink layer is stepped.

6. A cover-type flexible directional sound-emitting device as claimed in claim 1, characterized in that: The device also includes a first edge routing, an edge insulating layer, a second edge routing and a whole-surface insulating layer. The first edge routing is covered on the bottom surface of the frame decoration layer close to the non-vibration layer when the frame decoration layer is arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer, and is directly arranged on the bottom surface frame of the first conductive layer close to the non-vibration layer when the frame decoration layer is arranged on the top surface of the first substrate layer away from the non-vibration layer, and the edge insulating layer covers the bottom surface of the first edge routing close to the non-vibration layer; the second edge routing is arranged on the top surface frame of the second conductive layer close to the vibration layer, and the whole-surface insulating layer covers the top surface of the second conductive layer close to the vibration layer and covers the second edge routing.

7. A cover-type flexible directional sound-emitting device as claimed in claim 6, characterized in that: One end of the microstructure is formed in the bottom frame of the first conductive layer close to the non-vibration layer, and the other end is fixed to the entire insulating layer through an adhesive layer, or one end of the microstructure is formed in the top frame of the entire insulating layer close to the vibration layer, and the other end is fixed to the first conductive layer through an adhesive layer.

8. A cover-type flexible directional sound-emitting device as claimed in claim 1, characterized in that: When the directional sound-emitting device is used in a vehicle, industrial control or electronic field, any one or more coating layers of AG, AR, AF and HC are further provided on the surface of the first substrate layer away from the non-vibration layer.

9. A cover-type flexible directional sound-emitting device as claimed in claim 7, characterized in that: The total thickness of the entire insulating layer and the adhesive layer on the non-vibration layer is 5um to 10um, the total thickness of the first substrate layer and the first conductive layer is 120um to 130um, the height of the microstructure is 6um to 9um, the spacing is 2.2mm to 2.6mm, and the shape is a single point or a single cluster of multiple points.

10. A directional sound display device, characterized in that: The directional sound display device includes the cover-type flexible directional sound device described in any one of claims 1 to 9 above.

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