Small dehumidification device

Abstract

The utility model relates to the technical field of dehumidification equipment, and discloses a small dehumidification device which comprises a supporting framework and a control assembly, the supporting framework is in an I shape and comprises side plates symmetrically arranged on the two sides and a connecting plate connected with the side plates, the connecting plate is provided with a first grid used for heat dissipation, and the side plates form the left face and the right face of a shell; the interior of the shell is at least divided into two spaces by the connecting plate, the two spaces are the first space and the second space respectively, the first space is provided with a semiconductor condensation assembly which is used for condensing water vapor in air into liquid, and the second space is provided with a ventilation assembly which is used for ventilating the liquid. The ventilation assembly is used for dissipating heat of the semiconductor condensation assembly and driving air inside and outside the shell to move. According to the scheme, the I-shaped supporting framework is adopted, the supporting framework has the function of serving as a shell of the dehumidification device and also has the function of dissipating heat for the semiconductor chilling plate, the heat dissipation function and the protection function of the two sides of the shell are integrated, the structure is simplified, and the purpose of reducing the size is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of dehumidification equipment, in particular to a small dehumidification device. Background Art

[0002] A semiconductor dehumidifier is a device that uses semiconductor refrigeration chips to condense water vapor in the air into liquid, thereby achieving the purpose of dehumidification.

[0003] Chinese patent CN201811006071.7 discloses a condensation dehumidification device based on semiconductor refrigeration sheet, including: a housing; a mainboard control circuit, which is arranged in the housing; a fan, a heat sink, a semiconductor refrigeration sheet and a cooling sheet, the fan air intake, the heat sink, the semiconductor refrigeration sheet and the cooling sheet are arranged in the housing in a sequentially fitted manner, the fan and the semiconductor refrigeration sheet are respectively connected to the mainboard control circuit, the housing position corresponding to the air intake of the fan is provided with an air inlet, and the housing position corresponding to the blowing direction of the fan is provided with an air outlet; a water receiving trough, which is arranged at the falling position of the water droplets condensed on the cooling sheet, and the water outlet of the water receiving trough extends to the outside of the housing; a sponge pad, which is arranged between the heat sink and the cooling sheet. However, this dehumidification device has a complex structure and a large volume, and is not suitable for use in small energy storage scenarios.

[0004] The utility model overcomes the disadvantages of the prior art and provides a small dehumidification device which has a smaller size and can be suitable for dehumidification in an environment with a narrow installation space. Utility Model Content

[0005] The main purpose of the utility model is to provide a small dehumidification device, including a support frame and a control assembly, wherein the support frame is an I-shaped frame, and the support frame includes side plates symmetrically arranged on both sides and a connecting plate connecting the side plates, wherein the connecting plate is provided with a first grille for heat dissipation, and the side plates constitute the left and right sides of the housing;

[0006] The connecting plate divides the interior of the housing into at least two spaces, namely a first space and a second space. The first space is provided with a semiconductor condensation component, which is used to condense water vapor in the air into liquid. The second space is provided with a ventilation component, which is used to dissipate heat from the semiconductor condensation component and drive air movement inside and outside the housing.

[0007] The control component is arranged in the shell, and is respectively controlled and connected with the semiconductor condensation component and the ventilation component.

[0008] Optionally, the shell is a cube, and the length of the shell is 43-47 mm, the width is 33-37 mm, and the height is 62-66 mm.

[0009] Optionally, the semiconductor condensation component includes a semiconductor refrigeration sheet and a condenser, and the semiconductor refrigeration sheet is control-connected to the control component;

[0010] The cold surface of the semiconductor cooling plate is in contact with the condenser, and the hot surface is in contact with one side of the plane of the connecting plate. The other side of the connecting plate is provided with a plurality of the first grids, and the first grids are arranged in a vertical direction.

[0011] The semiconductor refrigeration sheet is surrounded by a heat insulation layer.

[0012] Optionally, one side of the condenser is a plane, which is in contact with the cold surface of the semiconductor refrigeration plate, and the other side of the condenser is provided with a second grid, which is arranged in a vertical direction and has a pointed bottom.

[0013] Optionally, a water collecting box is provided below the condenser, the bottom of the water collecting box is connected to an interface, and the interface extends out of the bottom of the shell.

[0014] Optionally, the ventilation component includes a fan and an air duct, the fan is arranged below the second space, the control component is arranged above the second space, a baffle is arranged between the fan and the control component, the fan is control-connected to the control component, and the air duct runs through the first space and the second space.

[0015] Optionally, the housing includes a detachable front cover, a rear cover, an upper cover and a lower cover, and the inner surface of the side plate is provided with a plurality of mounting grooves, and the mounting grooves are used to mount the front cover, the rear cover and the control assembly;

[0016] The upper cover is connected to the upper side of the connecting plate through a connecting piece, and the lower cover is connected to the lower side of the connecting plate through a connecting piece.

[0017] Optionally, ventilation holes connecting the first space and the second space are respectively provided at the upper and lower parts of the connecting plate, a first through hole is provided below the front cover surface, a second through hole is provided below the rear cover surface, and the second through hole is arranged opposite to the fan.

[0018] Optionally, the air duct includes a first air duct and a second air duct;

[0019] The first air duct starts from the first through hole, passes through the bottom of the semiconductor condensation component, passes through the ventilation hole under the connecting plate, passes through the fan and ends at the second through hole;

[0020] The second air duct starts from the first through hole, passes through the semiconductor condensation component, passes through the ventilation hole above the connecting plate, passes through the connecting plate, the control component and the fan, and ends at the second through hole.

[0021] Optionally, the connecting plate is provided with a line hole for wiring, and a fixing clip is provided on the outside of the shell.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The small dehumidifier provided by the utility model adopts an I-shaped supporting frame. The supporting frame serves as the shell of the dehumidifier and also has the function of dissipating heat for the semiconductor refrigeration plate. The heat dissipation function and the protection function on both sides of the shell are integrated together, and the structure is streamlined to achieve the purpose of reducing the volume. The connecting plate divides the interior of the shell into two parts to install the semiconductor condensation component and the ventilation component, and the internal space is reasonably used to achieve the purpose of reducing the volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0025] Figure 1 This is a schematic diagram of an embodiment of a small dehumidification device of the utility model. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of an embodiment of a small dehumidification device of the utility model. Figure 2 ;

[0027] Figure 3 This is a cross-sectional view of an embodiment of a small dehumidification device of the utility model;

[0028] Figure 4 This is a schematic diagram of the air duct of an embodiment of a small dehumidification device of the utility model;

[0029] Figure 5 This is a top view of a small dehumidification device embodiment of the utility model with the upper cover hidden;

[0030] Figure 6 It is a schematic diagram of an explosion of an embodiment of a small dehumidification device of the utility model.

[0031] Reference numerals:

[0032] 1-support frame; 11-side panel; 12-connecting plate; 13-first grille; 14-installation slot; 15-ventilation hole; 16-line hole; 2-control component; 21-baffle; 3-shell; 31-first space; 32-second space; 33-front cover; 331-first through hole; 34-back cover; 341-second through hole; 35-upper cover; 36-lower cover; 4-semiconductor condensation component; 41-semiconductor refrigeration plate; 42-condenser; 43-insulation layer; 44-second grille; 5-ventilation component; 51-fan; 52-air duct; 521-first air duct; 522-second air duct; 6-water collection box; 61-interface; 7-connector; 8-fixing clamp. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements between them. When an element is described as "connected" to another element, it can be directly connected to another element, or there can be one or more centered elements between them. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for illustrative purposes. In the description of the utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. The term "include" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may be present or added.

[0034] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present utility model. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0035] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0036] At present, the dehumidification method is to condense the water vapor in the air by cooling. The semiconductor refrigeration chip, also called the thermoelectric refrigeration chip, is a heat pump with a simple structure. It can be used in some scenes with limited space and no refrigerant pollution, and has the advantage of high reliability requirements. How to make the dehumidification device smaller on the basis of the refrigeration and dehumidification of the semiconductor refrigeration chip so that it can be used in scenes with narrow installation positions, such as dehumidification in energy storage boxes, is the problem to be solved by the utility model.

[0037] like Figure 1-6 The figure is a schematic diagram of an embodiment of a small dehumidification device provided by the utility model.

[0038] Please refer to Figure 1-6 This embodiment is used for dehumidification in a narrow installation environment, and includes a support frame 1 and a control component 2. The cross section of the support frame 1 is an I-shaped structure, and the support frame 1 includes side panels 11 symmetrically arranged on both sides and a connecting plate 12 connecting the side panels 11. The connecting plate 12 is provided with a first grille 13 for heat dissipation, and the side panels 11 constitute the left and right sides of the housing 3.

[0039] The connecting plate 12 divides the interior of the shell 3 into at least two spaces, namely a first space 31 and a second space 32. The first space 31 is provided with a semiconductor condensation component 4, which is used to condense water vapor in the air into liquid. The second space 32 is provided with a ventilation component 5, which is used to dissipate heat from the semiconductor condensation component 4 and drive the air movement inside and outside the shell 3.

[0040] The control component 2 is arranged in the housing 3, and the control component 2 is respectively controlled and connected with the semiconductor condensation component 4 and the ventilation component 5.

[0041] Specifically, the control component 2 adopts a PCB circuit board structure. The support frame 1 adopts an aluminum alloy structure with good thermal conductivity. The I-shaped support frame 1 is processed from standard parts, which is easy to produce.

[0042] In one embodiment, the housing 3 is a cube, and the length of the housing 3 is 43-47 mm, the width is 33-37 mm, and the height is 62-66 mm. The dehumidification device in this embodiment has a specific size of 45 mm in length, 35 mm in width, and 64 mm in height, which is only the size of a palm and is suitable for use in extremely small installation environments.

[0043] In one embodiment, the semiconductor condensation component 4 includes a semiconductor cooling sheet 41 and a condenser 42, and the semiconductor cooling sheet 41 is controlled and connected to the control component 2. The cold surface of the semiconductor cooling sheet 41 is in contact with the condenser 42, and the hot surface is in contact with one side of the plane of the connecting plate 12. The other side of the connecting plate 12 is provided with a plurality of first grids 13, and the first grids 13 are arranged in a vertical direction. The semiconductor cooling sheet 41 is surrounded by a heat insulation layer 43.

[0044] The semiconductor refrigeration sheet 41 utilizes the Peltier effect of semiconductor materials. When direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, thereby achieving the purpose of cooling. The control component 2 controls the operation of the semiconductor refrigeration sheet 41. The first grid 13 and the connecting plate 12 are an integrated structure. The first grid 13 is arranged vertically to reduce the obstruction of air flow between the upper and lower parts of the first grid 13. The heat insulation layer 43 is made of conventional heat insulation material, which is used to isolate the hot and cold surfaces of the semiconductor refrigeration sheet 41 from heat exchange from all sides, thereby reducing the impact on the cooling efficiency.

[0045] In one embodiment, one side of the condenser 42 is a plane that is in contact with the cold surface of the semiconductor refrigeration plate 41. The other side of the condenser 42 is provided with a second grid 44 that is vertically arranged and has a pointed bottom.

[0046] The condenser 42 and the second grille 44 are an integrated structure. The second grille 44 is vertically arranged to reduce the obstruction of air flow between the upper and lower parts of the second grille 44 and to prevent condensed water from accumulating on the second grille 44 and affecting the heat exchange efficiency. The bottom cross section of the second grille 44 is a triangular pointed shape to facilitate the condensed water to collect and drip at the tip.

[0047] In one embodiment, a water collecting box 6 is provided below the condenser 42, and the bottom of the water collecting box is connected to an interface 61, and the interface 61 extends out of the bottom of the housing 3. The water collecting box 6 is located inside the housing 3 and is used to collect condensed water dripping from the condenser 42. The interface 61 is used for an external pipeline to transfer the condensed water in the condensed water collecting box 6 through the interface 61 and the external pipeline.

[0048] In one embodiment, the ventilation component 5 includes a fan 51 and an air duct 52. The fan 51 is arranged below the second space 32. A control component 2 is arranged above the second space 32. A baffle 21 is arranged between the fan 51 and the control component 2. The fan 51 is control-connected to the control component 2. The air duct 52 runs through the first space 31 and the second space 32.

[0049] The control component 2 controls the operation of the fan 51. The fan 51 rotates to drive air to flow between the first space 31 and the second space 32 along the air duct 52, thereby achieving air heat exchange and condensation of water vapor in the air.

[0050] In one embodiment, the housing 3 includes a detachable front cover 33, a rear cover 34, an upper cover 35 and a lower cover 36. The inner surface of the side plate 11 is provided with a plurality of mounting grooves 14, and the mounting grooves 14 are used to mount the front cover 33, the rear cover 34 and the control assembly 2. The upper cover 35 is connected to the upper side of the connecting plate 12 through the connecting member 7, and the lower cover 36 is connected to the lower side of the connecting plate 12 through the connecting member 7. This drawer-type installation design is convenient for assembly. The connecting member 7 is specifically a screw.

[0051] In one embodiment, ventilation holes 15 connecting the first space 31 and the second space 32 are respectively provided at the upper and lower parts of the connecting plate 12, a first through hole 331 is provided below the surface of the front cover 33, and a second through hole 341 is provided below the surface of the rear cover 34. The second through hole 341 is arranged opposite to the fan 51.

[0052] The first through hole 331 is composed of a plurality of horizontal strip-shaped holes, and the second through hole 341 is an annular hole matching the size of the fan 51 .

[0053] In one embodiment, the air duct 52 includes a first air duct 521 and a second air duct 522. The first air duct 521 starts from the first through hole 331, passes through the bottom of the semiconductor condensation component 4 (i.e., the condenser 42), passes through the ventilation hole 15 below the connecting plate 12, passes through the fan 51 and reaches the second through hole 341 as the end point. The second air duct 522 starts from the first through hole 331, passes through the semiconductor condensation component 4 (i.e., the second grille 44 of the condenser 42), passes through the ventilation hole 15 above the connecting plate 12, passes through the connecting plate 12 (first grille 13), the control component 2 and the fan 51 and reaches the second through hole 341 as the end point.

[0054] The two air ducts design can increase the internal air flow, enhance the dehumidification effect, and increase the heat exchange of the connecting plate 12. In addition, the air first passes through the condenser 42, the air temperature is reduced, and then reaches the heat dissipation area (the first grid 13 of the connecting plate 12), which is more conducive to heat dissipation of the hot surface of the semiconductor cooling plate 41. The first air duct 521 covers the air convection at the bottom of the dehumidifier, and the second air duct 522 covers the air convection at the top and bottom of the dehumidifier.

[0055] In one embodiment, the connection plate 12 is provided with a line hole 16 for wiring, and a fixing clip 8 is provided on the outer side of the housing 3. The line hole 16 is used for passing the connection line between the semiconductor cooling plate 41 and the control component 2, and the fixing clip 8 is used for installing the dehumidification device in the dehumidification area.

[0056] In summary, the dehumidification device embodiment provided by the utility model adopts an I-shaped support frame, which serves as the shell of the dehumidification device and also has the function of dissipating heat for the semiconductor refrigeration plate, integrating the heat dissipation function and the protection function on both sides of the shell, streamlining the structure to achieve the purpose of reducing the volume, and the connecting plate divides the interior of the shell into two parts to install the semiconductor condensation component and the ventilation component, so as to rationally utilize the internal space to achieve the purpose of reducing the volume.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A small dehumidification device, characterized in that: It includes a support frame and a control assembly, the support frame is an I-shaped frame, the support frame includes side panels symmetrically arranged on both sides and a connecting plate connecting the side panels, the connecting plate is provided with a first grille for heat dissipation, and the side panels constitute the left and right sides of the housing; The connecting plate divides the interior of the housing into at least two spaces, namely a first space and a second space. The first space is provided with a semiconductor condensation component, which is used to condense water vapor in the air into liquid. The second space is provided with a ventilation component, which is used to dissipate heat from the semiconductor condensation component and drive air movement inside and outside the housing. The control component is arranged in the shell, and is respectively controlled and connected with the semiconductor condensation component and the ventilation component.

2. The small dehumidification device according to claim 1, characterized in that: The shell is a cube, and the length of the shell is 43-47 mm, the width is 33-37 mm, and the height is 62-66 mm.

3. The small dehumidification device according to claim 1, characterized in that: The semiconductor condensation component includes a semiconductor refrigeration sheet and a condenser, and the semiconductor refrigeration sheet is control-connected to the control component; The cold surface of the semiconductor cooling plate is in contact with the condenser, and the hot surface is in contact with one side of the plane of the connecting plate. The other side of the connecting plate is provided with a plurality of the first grids, and the first grids are arranged in a vertical direction. The semiconductor refrigeration sheet is surrounded by a heat insulation layer.

4. The small dehumidification device according to claim 3, characterized in that: One side of the condenser is a plane, which is in contact with the cold surface of the semiconductor refrigeration plate. The other side of the condenser is provided with a second grid, which is arranged in a vertical direction and has a pointed bottom.

5. The small dehumidification device according to claim 3, characterized in that: A water collecting box is arranged below the condenser, and the bottom of the water collecting box is connected to an interface, and the interface extends out of the bottom of the shell.

6. The small dehumidification device according to any one of claims 1 to 5, characterized in that: The ventilation component includes a fan and an air duct. The fan is arranged below the second space. The control component is arranged above the second space. A baffle is arranged between the fan and the control component. The fan is control-connected to the control component. The air duct runs through the first space and the second space.

7. The small dehumidification device according to claim 6, characterized in that: The housing comprises a detachable front cover, a rear cover, an upper cover and a lower cover, and the inner surface of the side plate is provided with a plurality of mounting grooves, and the mounting grooves are used to mount the front cover, the rear cover and the control assembly; The upper cover is connected to the upper side of the connecting plate through a connecting piece, and the lower cover is connected to the lower side of the connecting plate through a connecting piece.

8. The small dehumidification device according to claim 7, characterized in that: The connecting plate is provided with ventilation holes connecting the first space and the second space at the upper and lower parts, a first through hole is provided below the front cover surface, a second through hole is provided below the rear cover surface, and the second through hole is arranged opposite to the fan.

9. The small dehumidification device according to claim 8, characterized in that: The air duct includes a first air duct and a second air duct; The first air duct starts from the first through hole, passes through the bottom of the semiconductor condensation component, passes through the ventilation hole under the connecting plate, passes through the fan and ends at the second through hole; The second air duct starts from the first through hole, passes through the semiconductor condensation component, passes through the ventilation hole above the connecting plate, passes through the connecting plate, the control component and the fan, and ends at the second through hole.

10. The small dehumidification device according to claim 1, characterized in that: The connection plate is provided with a line hole for wiring, and a fixing clip is provided on the outer side of the shell.

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