Display device

Abstract

The utility model relates to a display device. The display device includes: a display layer including a plurality of light emitting diodes; a first insulating layer disposed on the display layer and including a first opening disposed in a gap between two light emitting diodes adjacent to each other among the plurality of light emitting diodes; and a second insulating layer disposed on the first insulating layer and including a second opening spaced apart from the first opening.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0119617 filed in the Korean Intellectual Property Office on September 8, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments relate to a display device, and more particularly, to a display device including a light emitting diode. Background Art

[0004] The display device may be an electronic device such as a mobile phone or a tablet personal computer (PC), or may be a part of an electronic device. The display device may provide visual information such as an image or video to a user. The recent display device may include a structure having a curved side or corner, and may display an image even on the curved side or corner. The display device may also include a display panel and a cover window disposed on the display panel to protect the display panel. Utility Model Content

[0005] In order to realize a display device having a curved structure, a display panel and a cover window may be combined with each other and bent. At this time, cracks may occur in a specific layer of the display panel due to strong stress and high strain.

[0006] One or more embodiments include a display device having a structure capable of relieving stress without reducing the thickness of a specific layer on which stress is concentrated. However, this is merely an example, and the scope of the present disclosure is not limited thereto.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0008] According to one or more embodiments, a display device includes: a display layer including a plurality of light-emitting diodes; a first insulating layer disposed on the display layer and including a first opening disposed in a gap between two light-emitting diodes adjacent to each other among the plurality of light-emitting diodes; and a second insulating layer disposed on the first insulating layer and including a second opening spaced apart from the first opening.

[0009] In an implementation, a portion of the second insulating layer may at least partially fill the first opening of the first insulating layer.

[0010] In an implementation, the second opening may be disposed above one of two light emitting diodes adjacent to each other.

[0011] In an embodiment, the first opening may have a shape surrounding the second opening in a plan view.

[0012] In an embodiment, the display device may further include a touch electrode disposed on the second insulating layer and including a wire passing between two light emitting diodes adjacent to each other in a plan view, wherein the wire may be disposed above the first opening.

[0013] In an embodiment, the display device may further include an encapsulation layer between the display layer and the first insulating layer, wherein the encapsulation layer may include: a first inorganic encapsulation layer; an organic encapsulation layer disposed on the first inorganic encapsulation layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer and including a third opening disposed below the first opening.

[0014] In an implementation, a depth of the first opening may be equal to a thickness of the first insulating layer, and a depth of the third opening may be less than or equal to a thickness of the second inorganic encapsulating layer.

[0015] In an implementation, the display device may further include an organic layer between the first insulating layer and the second insulating layer.

[0016] In an implementation, the organic layer may include an opening disposed below the second opening.

[0017] In an implementation, the second insulating layer may include a plurality of second openings, and one of the plurality of light emitting diodes may overlap with two or more of the plurality of second openings.

[0018] In an embodiment, the display device may have a display area and a peripheral area, wherein a plurality of light emitting diodes are arranged in the display area and the peripheral area is arranged outside the display area, wherein the first opening and the second opening may be arranged in the display area.

[0019] According to one or more embodiments, a display device includes: a display layer including a plurality of light emitting diodes; an encapsulation layer disposed on the display layer; and a touch layer disposed on the encapsulation layer. The touch layer includes: a touch electrode; and a first insulating layer and a second insulating layer between the touch electrode and the encapsulation layer. The first insulating layer includes a first opening, the second insulating layer includes a second opening, and the center of the first opening and the center of the second opening are spaced apart from each other.

[0020] In an implementation, a portion of the second insulating layer may at least partially fill the first opening.

[0021] In an implementation, the second opening may be disposed above one of the plurality of light emitting diodes.

[0022] In an embodiment, the touch electrode may include a conductive line and an opening defined by the conductive line. The conductive line of the touch electrode may be disposed over the first opening of the first insulating layer, and the opening of the touch electrode may be disposed over the second opening of the second insulating layer.

[0023] In an implementation, the touch layer may further include a third insulating layer disposed on the second insulating layer, and the third insulating layer may directly contact the first insulating layer at the second opening.

[0024] In an embodiment, the encapsulation layer may include: a first inorganic encapsulation layer; an organic encapsulation layer on the first inorganic encapsulation layer; and a second inorganic encapsulation layer on the organic encapsulation layer. The second inorganic encapsulation layer may include a third opening disposed below the first opening of the first insulating layer.

[0025] In an embodiment, the first opening may pass through the first insulating layer, and the third opening may be located above at least a portion of the second inorganic encapsulating layer in a depth direction.

[0026] In an implementation, the display device may further include an organic layer between the first insulating layer and the second insulating layer.

[0027] In an embodiment, the display device may have a display area and a peripheral area, wherein a plurality of light emitting diodes are arranged in the display area and the peripheral area surrounds the display area, wherein the first opening and the second opening may be arranged in the display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0029] Figure 1 is a perspective view schematically showing a display device according to an embodiment.

[0030] Figure 2 is an exploded perspective view schematically showing a display panel and a cover window of a display device according to an embodiment.

[0031] Figure 3 is a perspective view schematically showing a display panel of a display device according to an embodiment.

[0032] Figure 4 It is along Figure 1 The line IV-IV' is intercepted Figure 1 A cross-sectional view of a display device.

[0033] Figure 5 is a cross-sectional view showing a portion of a display panel according to an embodiment.

[0034] Figure 6is an enlarged plan view showing a portion of a display panel according to an embodiment.

[0035] Figure 7 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0036] Fig. 8A , Figure 8B , Figure 8C and Fig.8D is a cross-sectional view schematically illustrating a process of manufacturing a display panel according to an embodiment.

[0037] Fig. 9 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0038] Fig. 10A , Fig. 10B and Fig. 10C is a cross-sectional view schematically illustrating a process of manufacturing a display panel according to an embodiment.

[0039] Fig.11 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0040] Fig.12 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0041] Fig.13 is an enlarged plan view showing a portion of a display panel according to an embodiment. DETAILED DESCRIPTION

[0042] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always represent the same elements. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, the embodiments are described below only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0043] Since this specification allows various changes and many embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. The effects and features of the present disclosure and methods for achieving them will be explained with reference to the embodiments described in detail below with reference to the drawings. However, the present disclosure is not limited to the following embodiments and can be implemented in various forms.

[0044] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions thereof will be omitted.

[0045] It will be understood that when an element such as a layer, film, region, or plate is referred to as being "on" another element, the element may be "directly on" the other element, or intervening elements may be present therebetween. In addition, the size of the elements in the drawings may be exaggerated or reduced for ease of explanation. For example, because the size and thickness of the elements in the drawings are arbitrarily shown for ease of explanation, the present disclosure is not limited thereto.

[0046] The x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0047] It will be understood that although the terms “first”, “second”, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0048] As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0049] It will also be understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0050] In the present specification, the expression "A and / or B" means only A, only B, or both A and B. In the present specification, the expression "at least one of A and B" means only A, only B, or both A and B.

[0051] Figure 1 is a perspective view schematically showing a display device 1 according to an embodiment.

[0052] refer to Figure 1 , the display device 1 according to the embodiment is configured to display a moving image or a still image. The display device 1 may be a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic organizer, an electronic book, a portable multimedia player (PMP), a navigation system, and an ultra mobile PC (UMPC). In addition, the display device 1 may be an electronic device such as a television, a laptop computer, a monitor, a billboard, and an Internet of Things (IoT) device. In an embodiment, the display device 1 may be a wearable device such as a smart watch, a watch phone, a glasses-type display, or a head-mounted display (HMD).

[0053] In an embodiment, the display device 1 may have a rectangular shape in a plan view. In an embodiment, the display device 1 may have one of various shapes such as a polygonal shape (e.g., a triangular shape, a rectangular shape, etc.), a circular shape, and an elliptical shape. In an embodiment, when the display device 1 has a polygonal shape in a plan view, the polygon may have rounded corners. For ease of explanation, the case where the display device 1 has a rectangular shape with rounded corners in a plan view is mainly described.

[0054] The display device 1 may have a short side in a first direction (e.g., ±x direction) and a long side in a second direction (e.g., ±y direction). In an embodiment, in the display device 1, the length of the side in the first direction (e.g., ±x direction) may be equal to the length of the side in the second direction (e.g., ±y direction). In an embodiment, the display device 1 may have a long side in the first direction (e.g., ±x direction) and a short side in the second direction (e.g., ±y direction). Each corner where the short side in the first direction (e.g., ±x direction) intersects with the long side in the second direction (e.g., ±y direction) may be rounded to have a certain curvature. In an embodiment, the third direction (e.g., ±z direction) may be the thickness direction of the display device 1.

[0055] Figure 2 1 is an exploded perspective view schematically showing the display panel 10 and the cover window CW of the display device 1 according to the embodiment. Figure 3 is a perspective view schematically showing a display panel 10 of a display device 1 according to an embodiment. Figure 4 It is along Figure 1 The line IV-IV' is intercepted Figure 1 sectional view of the display device 1.

[0056] refer to Figures 2 to 4 The display device 1 may include a display panel 10 and a cover window CW disposed on the display panel 10 .

[0057] The display panel 10 may include a main display area MDA, a side display area SDA, and a corner display area CDA as a display area DA. The display panel 10 may include a peripheral area PA surrounding the display area DA.

[0058] The main display area MDA is an area arranged in the central portion of the display panel 10, and may be flat without being curved. The main display area MDA may occupy the largest proportion of the display area DA of the display panel 10, and thus may provide most of the image. The main display area MDA may include short sides in the ±x direction and long sides in the ±y direction, and each corner where the short side intersects the long side may be rounded.

[0059] At least a portion of the side display area SDA may be bent to include a curved surface, and may extend outward from each side of the main display area MDA. The side display area SDA may include a first side display area SDA1, a second side display area SDA2, a third side display area SDA3, and a fourth side display area SDA4. In some embodiments, at least one of the first side display area SDA1, the second side display area SDA2, the third side display area SDA3, and the fourth side display area SDA4 may be omitted.

[0060] The first side display area SDA1 may be an area extending from a first side of the main display area MDA and bent with a specific curvature. The first side display area SDA1 may extend from the lower side (or -y direction side) of the main display area MDA. The first side display area SDA1 may be an area disposed on the lower side of the display panel 10.

[0061] The second side display area SDA2 may be an area extending from a second side of the main display area MDA and bent with a specific curvature. The second side display area SDA2 may extend from the right side (or +x direction side) of the main display area MDA. The second side display area SDA2 may be an area disposed on the right side of the display panel 10.

[0062] The third side display area SDA3 may be an area extending from a third side of the main display area MDA and bent with a specific curvature. The third side display area SDA3 may extend from the left side (or -x direction side) of the main display area MDA. The third side display area SDA3 may be an area disposed on the left side of the display panel 10.

[0063] The fourth side display area SDA4 may be an area extending from the fourth side of the main display area MDA and bent with a specific curvature. The fourth side display area SDA4 may extend from the upper side (or +y direction side) of the main display area MDA. The fourth side display area SDA4 may be an area provided on the upper side of the display panel 10.

[0064] The first side display area SDA1, the second side display area SDA2, the third side display area SDA3, and the fourth side display area SDA4 may each include a curved surface curved with a constant curvature. For example, the first side display area SDA1 and the fourth side display area SDA4 may each have a curved surface curved relative to a bending axis extending in the ±x direction. The second side display area SDA2 and the third side display area SDA3 may each have a curved surface curved relative to a bending axis extending in the ±y direction. The curvatures of the first side display area SDA1, the second side display area SDA2, the third side display area SDA3, and the fourth side display area SDA4 may be equal to or different from each other.

[0065] The corner display area CDA may be an area extending from a corner of the main display area MDA and bent with a specific curvature. The corner display area CDA may be between the first side display area SDA1, the second side display area SDA2, the third side display area SDA3, and the fourth side display area SDA4. For example, the corner display area CDA may be between the first side display area SDA1 and the second side display area SDA2, between the first side display area SDA1 and the third side display area SDA3, between the second side display area SDA2 and the fourth side display area SDA4, and between the third side display area SDA3 and the fourth side display area SDA4.

[0066] Since the corner display area CDA is between adjacent side display areas SDA having curved surfaces curved in different directions, the corner display area CDA may include a curved surface in which the curved surfaces curved in various directions are continuously connected to each other. In addition, when the curvatures of the adjacent side display areas SDA are different from each other, the curvature of the corner display area CDA may gradually change along the edge of the display device 1. For example, when the curvature of the first side display area SDA1 is different from the curvature of the second side display area SDA2, the corner display area CDA between the first side display area SDA1 and the second side display area SDA2 may have a curvature that gradually changes according to the position.

[0067] The display panel 10 can provide an image by using a main pixel PXm arranged in the main display area MDA, a side pixel PXs arranged in the side display area SDA, and a corner pixel PXc arranged in the corner display area CDA. Pixels such as the main pixel PXm, the side pixel PXs, and the corner pixel PXc can be implemented as display elements. The pixels can each include a red sub-pixel, a green sub-pixel, and a blue sub-pixel. In an embodiment, the pixels can each include a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel.

[0068] A separate image may be provided to the main display area MDA, the side display area SDA, and the corner display area CDA, respectively, or a portion of an image may be provided to the main display area MDA, the side display area SDA, and the corner display area CDA. Since the display panel 10 provides an image to the side display area SDA and the corner display area CDA as well as the main display area MDA, the ratio of the display area DA in the display device 1 may be increased. That is, in the display device 1 having the same size, the area of ​​the peripheral area PA may be reduced, and the area of ​​the display area DA may be increased.

[0069] The peripheral area PA may be disposed to completely or partially surround the periphery of the side display area SDA and the corner display area CDA. The peripheral area PA is an area where no image is displayed, and various wirings and driving circuits may be disposed in the peripheral area PA. A shielding member such as a light blocking member may be disposed in the peripheral area PA so that the member disposed in the peripheral area PA cannot be visually recognized.

[0070] refer to Figure 4 , the cover window CW may be provided on the front surface of the display panel 10. The "front surface" of the display panel 10 may be defined as a surface facing the direction in which the display panel 10 provides an image. For example, the front surface in the main display area MDA may be a surface facing the +z direction, which is the direction in which the image is provided.

[0071] The cover window CW may cover and protect the display panel 10. The cover window CW may have high transmittance to transmit light emitted from the display panel 10, and may have a small thickness to minimize the weight of the display device 1. In addition, in order to protect the display panel 10 from external impact, the cover window CW may have strong strength and hardness.

[0072] The cover window CW may include a transparent material. The cover window CW may include, for example, glass or plastic. When the cover window CW includes plastic, the cover window CW may be flexible. The cover window CW may include, for example, ultra-thin glass. Its strength is enhanced by chemical strengthening or thermal strengthening. In an embodiment, the cover window CW may include and colorless polyimide (CPI). In an implementation, the cover window CW may have a structure in which a flexible polymer layer is disposed on one surface of a glass substrate, or may include only a polymer layer.

[0073] The cover window CW may include a flat portion FP corresponding to the main display area MDA of the display panel 10 and a curved portion CVP corresponding to the side display area SDA and the corner display area CDA.

[0074] The flat portion FP of the cover window CW may be set to a flat surface and may overlap the main display area MDA of the display panel 10. The curved portion CVP of the cover window CW may be set to a curved surface. In this case, the curved portion CVP may have a constant curvature or a varying curvature. The curved portion CVP may include a first curved portion CVP1 and a second curved portion CVP2. The first curved portion CVP1 may be set to overlap the side display area SDA and the corner display area CDA of the display panel 10. The second curved portion CVP2 may be set to overlap the peripheral area PA of the display panel 10. The first curved portion CVP1 may be between the flat portion FP and the second curved portion CVP2.

[0075] A light blocking member (not shown) may be disposed on a portion of the second curved portion CVP2 of the cover window CW and may overlap the peripheral area PA of the display panel 10. The light blocking member may include a light blocking material. The light blocking material may include, for example, a resin including carbon black, carbon nanotubes, and a black dye. The light blocking member may cover the elements of the display panel 10 arranged in the peripheral area PA so that they are not visible.

[0076] The display panel 10 may be disposed below the cover window CW. The cover window CW and the display panel 10 may be connected to each other by an adhesive member (not shown). The adhesive member may be an optically clear adhesive film (OCA) or an optically clear resin (OCR). In some embodiments, a lower protective film (not shown) may be further disposed below the display panel 10 to protect the display panel 10.

[0077] Figure 5 is a cross-sectional view showing a portion of the display panel 10 according to the embodiment.

[0078] refer to Figure 5 The display panel 10 may include a substrate 100 , a display layer 200 disposed on the substrate 100 , an encapsulation layer 300 disposed on the display layer 200 , and a touch layer 400 disposed on the encapsulation layer 300 .

[0079] The display layer 200 including the pixels PX may be disposed on the substrate 100. The pixels PX may be arranged in the display area DA of the display panel 10. For example, the pixels PX may be arranged in the main display area (see FIG. 1 ) of the display panel 10. Figure 3 MDA), side display area (see Figure 3 SDA) and / or corner display area (see Figure 3 In other words, the pixel PX may be a primary pixel (see Figure 3 PXm), side pixels (see Figure 3 PXs) or corner pixels (see Figure 3 of PXc).

[0080] The pixel PX may include a plurality of sub-pixels. For example, the pixel PX may include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The sub-pixels may each include a light-emitting diode and a thin film transistor. For example, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 may include a first light-emitting diode LED1, a second light-emitting diode LED2, and a third light-emitting diode LED3, and a first thin film transistor TFT1, a second thin film transistor TFT2, and a third thin film transistor TFT3, respectively, and the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3 are each configured to emit light of a specific color.

[0081] The substrate 100 may include a glass material or a plastic polymer resin. The substrate 100 including the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multi-layer structure including a layer including a polymer resin and an inorganic layer.

[0082] The first light emitting diode LED1, the second light emitting diode LED2 and the third light emitting diode LED3 corresponding to the first subpixel PX1, the second subpixel PX2 and the third subpixel PX3 may be electrically connected to the first thin film transistor TFT1, the second thin film transistor TFT2 and the third thin film transistor TFT3 on the substrate 100, respectively.

[0083] The first light emitting diode LED1 corresponding to the first subpixel PX1 may be electrically connected to the first thin film transistor TFT1. The first thin film transistor TFT1 may include a first active layer A1, a first gate electrode G1 overlapping a portion of the first active layer A1, and a first source electrode S1 and a first drain electrode D1 each directly contacting a portion of the first active layer A1.

[0084] The second light emitting diode LED2 corresponding to the second subpixel PX2 may be electrically connected to the second thin film transistor TFT2. The second thin film transistor TFT2 may include a second active layer A2, a second gate electrode G2 overlapping a portion of the second active layer A2, and a second source electrode S2 and a second drain electrode D2 each directly contacting a portion of the second active layer A2.

[0085] The third light emitting diode LED3 corresponding to the third subpixel PX3 may be electrically connected to the third thin film transistor TFT3. The third thin film transistor TFT3 may include a third active layer A3, a third gate electrode G3 overlapping a portion of the third active layer A3, and a third source electrode S3 and a third drain electrode D3 each directly contacting a portion of the third active layer A3.

[0086] The first gate electrode G1, the second gate electrode G2 and the third gate electrode G3 may each include at least one material selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and copper (Cu), and may have a single-layer or multi-layer structure including the above materials.

[0087] The buffer layer 201 may be between the first active layer A1, the second active layer A2, and the third active layer A3 and the substrate 100 to prevent the penetration of impurities. The gate insulating layer 203 may be between the first active layer A1, the second active layer A2, and the third active layer A3 and the first gate electrode G1, the second gate electrode G2, and the third gate electrode G3. The interlayer insulating layer 205 may be disposed on the first gate electrode G1, the second gate electrode G2, and the third gate electrode G3. The buffer layer 201, the gate insulating layer 203, and the interlayer insulating layer 205 may each include an inorganic insulating material, such as silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (AlO x ), aluminum nitride (AlN x ), titanium oxide (TiO x ) or titanium nitride (TiN x ).

[0088] The first source electrode S1, the second source electrode S2, and the third source electrode S3 may be disposed on the interlayer insulating layer 205, and may be respectively connected to the first active layer A1, the second active layer A2, and the third active layer A3 through contact holes formed in the interlayer insulating layer 205 and the gate insulating layer 203. The first source electrode S1, the second source electrode S2, and the third source electrode S3 may each include at least one selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may include a single layer or a plurality of layers including the above materials.

[0089] The first drain electrode D1, the second drain electrode D2, and the third drain electrode D3 may be disposed on the interlayer insulating layer 205, and may be connected to the first active layer A1, the second active layer A2, and the third active layer A3, respectively, through contact holes formed in the interlayer insulating layer 205 and the gate insulating layer 203. The first drain electrode D1, the second drain electrode D2, and the third drain electrode D3 may each include at least one selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may include a single layer or multiple layers including the above materials. In some embodiments, the first source electrode S1, the second source electrode S2, and the third source electrode S3 and the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3 may include the same material.

[0090] The first organic insulating layer 207 may be disposed on the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3. For example, the first organic insulating layer 207 may be disposed to cover the first source electrode S1, the second source electrode S2, and the third source electrode S3 and the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3. The first organic insulating layer 207 may include an organic insulating material such as acryl, benzocyclobutene, polyimide, or hexamethyldisiloxane. The first organic insulating layer 207 may have a plurality of contact holes that overlap with the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3, respectively.

[0091] The contact metal CM may be disposed on the first organic insulating layer 207. The contact metal CM may include aluminum (Al), copper (Cu) and / or titanium (Ti), and may include a single layer or multiple layers including the above materials. A plurality of contact metals CM may be provided. The contact metal CM may directly contact the first drain electrode D1, the second drain electrode D2, and the third drain electrode D3 through contact holes formed in the first organic insulating layer 207, respectively.

[0092] The second organic insulating layer 209 may be between the first organic insulating layer 207 and the first light emitting diode LED1, the second light emitting diode LED2, and the third light emitting diode LED3. The second organic insulating layer 209 may include an organic insulating material such as acryl, benzocyclobutene, polyimide, or hexamethyldisiloxane. The second organic insulating layer 209 may include contact holes respectively overlapping the contact metals CM.

[0093] The first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be disposed on the second organic insulating layer 209. In some embodiments, the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed as reflective electrodes. For example, the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed by forming a reflective layer of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any compound thereof, and disposing a reflective layer of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (InO) on the reflective layer. 2 O 3) is formed by a layer formed by the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. The present disclosure is not limited thereto. The first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed of various materials, and the structures of the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may also be variously modified. For example, the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 may be formed as a single layer or multiple layers.

[0094] The first subpixel electrode 1210 , the second subpixel electrode 2210 , and the third subpixel electrode 3210 may be electrically connected to the overlapping contact metal CM through contact holes formed in the second organic insulating layer 209 , respectively.

[0095] Figure 5 It is shown that the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 are electrically connected to each other through the contact metal CM, but the present disclosure is not limited thereto. In an embodiment, the contact metal CM may be omitted, and one organic insulating layer may be between the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210. In an embodiment, three or more organic insulating layers may be between the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3 and the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210, and the first thin film transistor TFT1, the second thin film transistor TFT2, and the third thin film transistor TFT3 may be electrically connected to the first sub-pixel electrode 1210, the second sub-pixel electrode 2210, and the third sub-pixel electrode 3210 through a plurality of contact metals.

[0096] The subpixel defining layer 211 may cover the edge regions (or edges) of the first subpixel electrode 1210, the second subpixel electrode 2210, and the third subpixel electrode 3210. In other words, the subpixel defining layer 211 may include a plurality of openings corresponding to and exposing the central portions of the first subpixel electrode 1210, the second subpixel electrode 2210, and the third subpixel electrode 3210, respectively. The openings of the subpixel defining layer 211 may define the emission regions of the first subpixel PX1, the second subpixel PX2, and the third subpixel PX3, respectively.

[0097] The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may be respectively disposed on the first subpixel electrode 1210, the second subpixel electrode 2210, and the third subpixel electrode 3210. In an embodiment, the first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may be respectively disposed in the opening of the subpixel defining layer 211 to correspond to the first subpixel electrode 1210, the second subpixel electrode 2210, and the third subpixel electrode 3210.

[0098] The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may each include an organic emission layer including a low molecular weight material or a high molecular weight material. The first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220 may each have a single-layer or multi-layer structure including a hole injection layer, a hole transport layer, an organic emission layer, an electron transport layer, and / or an electron injection layer.

[0099] The opposing electrode 230 may be disposed on the first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220, respectively. The opposing electrode 230 may be formed integrally to cover the first intermediate layer 1220, the second intermediate layer 2220, and the third intermediate layer 3220. In some embodiments, the opposing electrode 230 may be formed as a (semi) transparent electrode. For example, the opposing electrode 230 may include at least one material selected from Ag, Al, Mg, Li, Ca, Cu, LiF / Ca, LiF / Al, MgAg, and CaAG, and may be formed as a thin film having a thickness of several nanometers (nm) to tens of nanometers (nm). In some embodiments, the composition and material of the opposing electrode 230 are not limited thereto, and various modifications are possible.

[0100] The encapsulation layer 300 may be disposed on the opposite electrode 230. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 sequentially stacked in the stated order.

[0101] Even when cracks occur in the encapsulation layer 300 due to the multi-layer structure of the encapsulation layer 300, such cracks may not extend between the first inorganic encapsulation layer 310 and the organic encapsulation layer 320 or between the organic encapsulation layer 320 and the second inorganic encapsulation layer 330. The encapsulation layer 300 may prevent or minimize the penetration of ambient moisture or oxygen into the display layer 200.

[0102] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include an inorganic insulating material such as silicon oxide (SiO x ), Silicon Nitride (SiN x), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ). ZnO x It can be ZnO and / or ZnO 2 .

[0103] The organic encapsulation layer 320 can relieve the internal stress of the first inorganic encapsulation layer 310 and / or the second inorganic encapsulation layer 330. The organic encapsulation layer 320 may include a polymer-based material. For example, the organic encapsulation layer 320 may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.) or any combination thereof.

[0104] The second inorganic encapsulation layer 330 may include a plurality of third openings 330-OP. The third openings 330-OP of the second inorganic encapsulation layer 330 may be arranged in a region between adjacent sub-pixels. For example, the third openings 330-OP may be arranged in a region between a first sub-pixel PX1 including a first light-emitting diode LED1 and a second sub-pixel PX2 including a second light-emitting diode LED2 and / or a region between a second sub-pixel PX2 including a second light-emitting diode LED2 and a third sub-pixel PX3 including a third light-emitting diode LED3. In an embodiment, the third openings 330-OP may pass through the second inorganic encapsulation layer 330.

[0105] The touch layer 400 may be disposed on the encapsulation layer 300. The touch layer 400 may include first, second, third, and fourth touch insulating layers 410, 420, 430, and 440, and first and second touch electrodes MTL1 and MTL2 (collectively referred to as touch electrodes MTL).

[0106] The first touch insulating layer 410 may be disposed on the second inorganic encapsulation layer 330. The first touch insulating layer 410 may include a first opening 410-OP arranged in a region between adjacent sub-pixels. The first opening 410-OP of the first touch insulating layer 410 may overlap with the third opening 330-OP of the second inorganic encapsulation layer 330 and be above the third opening 330-OP of the second inorganic encapsulation layer 330. The first opening 410-OP may pass through the first touch insulating layer 410. Therefore, a portion of the upper surface of the organic encapsulation layer 320 may be exposed through the first opening 410-OP and the third opening 330-OP.

[0107] The second touch insulating layer 420 may be disposed on the first touch insulating layer 410. A portion of the second touch insulating layer 420 may at least partially (e.g., completely) fill the first opening 410-OP of the first touch insulating layer 410 and the third opening 330-OP of the second inorganic encapsulation layer 330. The second touch insulating layer 420 may be in direct contact with the organic encapsulation layer 320 within the first opening 410-OP and the third opening 330-OP. The second touch insulating layer 420 may include second openings 420-OP that overlap with the sub-pixels and are above the sub-pixels, respectively. For example, the second touch insulating layer 420 may include second openings 420-OP that overlap with the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3, respectively. The second opening 420-OP may be spaced apart from the first opening 410-OP and the third opening 330-OP. The second opening 420-OP may pass through the second touch insulating layer 420. Therefore, a portion of the upper surface of the first touch insulating layer 410 may be exposed through the second opening 420-OP. The second touch insulation layer 420 may include grooves 420 -G respectively overlapping the first opening 410 -OP and the third opening 330 -OP.

[0108] The first touch insulating layer 410 and the second touch insulating layer 420 may each include an inorganic insulating material such as silicon oxide (SiO x ), silicon nitride (SiN x ) or silicon oxynitride (SiON).

[0109] The first touch electrode MTL1 may be disposed on the second touch insulation layer 420. A portion of the first touch electrode MTL1 may be disposed in the groove 420-G of the second touch insulation layer 420.

[0110] The third touch insulating layer 430 may be disposed on the first touch electrode MTL1. The third touch insulating layer 430 may cover the first touch electrode MTL1 and may flatten the surface on which the second touch electrode MTL2 is disposed. The third touch insulating layer 430 may at least partially (e.g., completely) fill the second opening 420-OP of the second touch insulating layer 420. The third touch insulating layer 430 may be in direct contact with the first touch insulating layer 410 at the second opening 420-OP. The third touch insulating layer 430 may have a plurality of contact holes that allow the first touch electrode MTL1 and the second touch electrode MTL2 to directly contact each other.

[0111] The second touch electrode MTL2 may be disposed on the third touch insulating layer 430. The second touch electrode MTL2 may be used as a sensor configured to sense a touch input of a user. The first touch electrode MTL1 may be used as a connection portion that connects the patterned second touch electrodes MTL2 to each other in one direction. In some embodiments, both the first touch electrode MTL1 and the second touch electrode MTL2 may be used as sensors. The first touch electrode MTL1 and the second touch electrode MTL2 may be electrically connected to each other through a contact hole formed in the third touch insulating layer 430. The second touch electrode MTL2 may include an opening MTL2-OP.

[0112] The fourth touch insulating layer 440 may be disposed on the second touch electrode MTL2 and may cover the second touch electrode MTL2. Figure 5 , but an additional layer such as an optical function layer may be disposed on the fourth touch insulation layer 440 .

[0113] The first touch electrode MTL1 and the second touch electrode MTL2 may each include a metal layer or a transparent conductive layer. The metal layer may include molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al) and any alloy thereof. The transparent conductive layer may include a transparent conductive oxide (e.g., ITO, IZO, ZnO, indium tin zinc oxide (ITZO), etc.), a conductive polymer (e.g., polyethylene dihydroxythiophene (PEDOT: poly-(3,4)-ethylene dihydroxythiophene)), a metal nanowire, a carbon nanotube, or graphene.

[0114] The third touch insulating layer 430 and the fourth touch insulating layer 440 may each include an inorganic material or an organic material. When the third touch insulating layer 430 and the fourth touch insulating layer 440 each include an inorganic material, the third touch insulating layer 430 and the fourth touch insulating layer 440 may each include a silicon nitride (SiN x ), aluminum nitride (AlN x ), zirconium nitride (ZrN x ), titanium nitride (TiN x ), Hafnium Nitride (HfN x ), Tantalum Nitride (TaN x ), silicon oxide (SiO x ), aluminum oxide (AlO x ), titanium oxide (TiO x ), tin oxide (SnO x ), cerium oxide (CeO x) and silicon oxynitride (SiON). When the third touch insulating layer 430 and the fourth touch insulating layer 440 each include an organic material, the third touch insulating layer 430 and the fourth touch insulating layer 440 may each include at least one selected from acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0115] Figure 6 is an enlarged plan view showing a portion of a display panel according to an embodiment.

[0116] refer to Figure 6 , the second touch electrode MTL2 may include a wire ML passing through adjacent light emitting diodes LED. The wire ML may include a first wire ML1 and a second wire ML2. The first wire ML1 may extend in a first direction (e.g., ±x direction), and the second wire ML2 may extend in a second direction (e.g., ±y direction). The first wire ML1 and the second wire ML2 may cross each other and form a plurality of openings MTL2-OP of the second touch electrode MTL2. In other words, the second touch electrode MTL2 may have a grid shape or a mesh shape including an opening MTL2-OP. The light emitting diodes LED may be arranged in the openings MTL2-OP of the second touch electrode MTL2, respectively. For example, the first light emitting diode LED1, the second light emitting diode LED2, and the third light emitting diode LED3 (collectively referred to as the light emitting diodes LED) may be arranged in the openings MTL2-OP of the second touch electrode MTL2, respectively.

[0117] The first touch electrode MTL1 may be disposed below the second touch electrode MTL2 while overlapping the second touch electrode MTL2. In an embodiment, the first touch electrode MTL1 may extend in the second direction (e.g., ±y direction), and the length of the first touch electrode MTL1 in the first direction (e.g., ±x direction) may be greater than the length of the second touch electrode MTL2 in the first direction (e.g., ±x direction). In an embodiment, the first touch electrode MTL1 may extend in the first direction (e.g., ±x direction), and the length of the first touch electrode MTL1 in the second direction (e.g., ±y direction) may be greater than the length of the second touch electrode MTL2 in the second direction (e.g., ±y direction).

[0118] The second opening 420-OP of the second touch insulating layer 420 may overlap with the opening MTL2-OP of the second touch electrode MTL2. The size of the second opening 420-OP of the second touch insulating layer 420 may be smaller than the size of the opening MTL2-OP of the second touch electrode MTL2. Therefore, a portion of the upper surface of the second touch insulating layer 420 may be exposed through the opening MTL2-OP of the second touch electrode MTL2. A portion of the upper surface of the first touch insulating layer 410 may be exposed through the second opening 420-OP of the second touch insulating layer 420.

[0119] Figure 7 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment. Figure 7 yes Figure 5 An enlarged cross-sectional view of region VII.

[0120] refer to Figure 7 , the first touch insulation layer 410 , the second touch insulation layer 420 , and the second inorganic encapsulation layer 330 may include a first opening 410 -OP, a second opening 420 -OP, and a third opening 330 -OP, respectively.

[0121] Hereinafter, the width of the opening may be understood to refer to the minimum width of the opening. For example, the first width w1 (i.e., the width of the first opening 410-OP of the first touch insulating layer 410) may refer to the minimum width of the first opening 410-OP. The second width w2 (i.e., the width of the second opening 420-OP of the second touch insulating layer 420) may refer to the minimum width of the second opening 420-OP. The third width w3 (i.e., the width of the third opening 330-OP of the second inorganic encapsulation layer 330) may refer to the minimum width of the third opening 330-OP. The fourth width w4 (i.e., the width of the opening MTL2-OP of the second touch electrode MTL2) may refer to the minimum width of the opening MTL2-OP of the second touch electrode MTL2.

[0122] The first touch insulating layer 410 may include a first opening 410-OP, and the second inorganic encapsulation layer 330 may include a third opening 330-OP. A side surface of the first touch insulating layer 410 adjacent to the first opening 410-OP and a side surface of the second inorganic encapsulation layer 330 adjacent to the third opening 330-OP may be on the same plane. In an embodiment, a side surface of each of the first touch insulating layer 410 and the second inorganic encapsulation layer 330 may have a taper relative to an upper surface of the organic encapsulation layer 320. Therefore, the first width w1 may be greater than the third width w3. In an embodiment, when a side surface of each of the first touch insulating layer 410 and the second inorganic encapsulation layer 330 is perpendicular to an upper surface of the organic encapsulation layer 320, the first width w1 may be equal to the third width w3.

[0123] although Figure 7 It is shown that the first width w1 and the third width w3 are smaller than the second width w2, but the present disclosure is not limited thereto. In an embodiment, the first width w1 and / or the third width w3 may be equal to or greater than the second width w2.

[0124] The second touch insulating layer 420 may include a second opening 420-OP and a groove 420-G. The second opening 420-OP may be arranged in a region between the first openings 410-OP adjacent to each other and in a region between the third openings 330-OP adjacent to each other. The second opening 420-OP may pass through the second touch insulating layer 420. The groove 420-G may overlap with the first opening 410-OP and the third opening 330-OP. The groove 420-G may not pass through the second touch insulating layer 420. The width of the groove 420-G may be less than the first width w1 and / or the third width w3.

[0125] although Figure 7 It is shown that the second width w2 is smaller than the fourth width w4, but the present disclosure is not limited thereto. In an embodiment, the second width w2 may be equal to the fourth width w4.

[0126] When the width of the upper surface of the second touch insulating layer 420 is defined as the first length s1 and the width of the lower surface of the first touch electrode MTL1 is defined as the second length s2, the first length s1 may be equal to the second length s2. For example, the side surface of the second touch insulating layer 420 and the side surface of the first touch electrode MTL1 may be on the same plane.

[0127] The thickness of the first touch insulating layer 410 may be defined as a first thickness t1, and the depth of the first opening 410-OP may be defined as a first depth d1. The thickness of the second touch insulating layer 420 may be defined as a second thickness t2, and the depth of the second opening 420-OP may be defined as a second depth d2. The thickness of the second inorganic encapsulation layer 330 may be defined as a third thickness t3, and the depth of the third opening 330-OP may be defined as a third depth d3.

[0128] The first opening 410-OP, the second opening 420-OP, and the third opening 330-OP may respectively pass through the first touch insulation layer 410, the second touch insulation layer 420, and the second inorganic encapsulation layer 330. In other words, the first depth d1 may be equal to the first thickness t1, the second depth d2 may be equal to the second thickness t2, and the third depth d3 may be equal to the third thickness t3.

[0129] In some embodiments, the sum of the first thickness t1, the second thickness t2, and the third thickness t3 may be approximately In some embodiments, the sum of the first thickness t1, the second thickness t2, and the third thickness t3 may be about In some embodiments, the sum of the first thickness t1 and the third thickness t3 may be equal to the second thickness t2. For example, the sum of the first thickness t1 and the third thickness t3 may be approximately And the second thickness t2 may be about In some embodiments, the first thickness t1 may be equal to the third thickness t3. For example, the first thickness t1 may be approximately And the third thickness t3 may be about According to an embodiment, the reliability of the display panel can be improved by ensuring sufficient thickness of the first touch insulating layer 410, the second touch insulating layer 420, and the second inorganic encapsulation layer 330. In addition, since the first opening 410-OP, the second opening 420-OP, and the third opening 330-OP are provided, cracks due to stress during bending can be prevented. Of course, the scope of the present disclosure is not limited to these values.

[0130] FIG. 8A to FIG. 8D is a cross-sectional view schematically showing a process of manufacturing a display panel according to an embodiment. FIG. 8A to FIG. 8D It may be possible to show the manufacturing according to the embodiment Figure 7 0 is a cross-sectional view of the process of the display panel shown in .

[0131] refer to Fig. 8A In a state where the organic encapsulation layer 320 is formed, a second encapsulation material layer 330' and a first insulating material layer 410' may be disposed on the organic encapsulation layer 320. The second encapsulation material layer 330' may include a second inorganic encapsulation layer (see Figure 5 The first insulating material layer 410' may include the same material as the first touch insulating layer (see Figure 5 The third insulating material layer 430' may be provided on the first insulating material layer 410'. The third insulating material layer 430' may include an opening corresponding to a portion of the first insulating material layer 410' and exposing a portion of the first insulating material layer 410'. The third insulating material layer 430' may include an opening corresponding to a portion of the first insulating material layer 410' and exposing a portion of the first insulating material layer 410'. Figure 5 The material of 430) is the same material.

[0132] Reference together Fig. 8A and Figure 8B, a portion of the first insulating material layer 410' and a portion of the second encapsulation material layer 330' may be removed by using the third insulating material layer 430' as a mask. In an embodiment, the first touch insulating layer 410 and the second inorganic encapsulation layer 330 may be patterned. The process of removing a portion of the first insulating material layer 410' and a portion of the second encapsulation material layer 330' may include dry etching and dry ashing.

[0133] The first touch insulating layer 410 may be a portion remaining after a portion of the first insulating material layer 410' is removed, and the first opening 410-OP may be a space where a portion of the first insulating material layer 410' is removed. The second inorganic encapsulation layer 330 may be a portion remaining after a portion of the second encapsulation material layer 330' is removed, and the third opening 330-OP may be a space where a portion of the second encapsulation material layer 330' is removed.

[0134] Because the first touch insulation layer 410 and the second inorganic encapsulation layer 330 may be patterned at the same time, side surfaces of the first touch insulation layer 410 and the second inorganic encapsulation layer 330 where the first and third openings 410 -OP and 330 -OP are formed may be on the same plane.

[0135] refer to Figure 8C , you can Figure 8B In the embodiment shown in FIG. 4 , a second insulating material layer 420 ′, a first electrode material layer MTL1 ′, a first photoresist PR1 , and a second photoresist PR2 are disposed on the first electrode material layer MTL1 ′.

[0136] The second insulating material layer 420' may cover the first touch insulating layer 410 and the second inorganic encapsulation layer 330. The second insulating material layer 420' may at least partially (e.g., completely) fill the first opening 410-OP and the third opening 330-OP, and may include a groove 420-G overlapping the first opening 410-OP and the third opening 330-OP. The second insulating material layer 420' may directly contact the organic encapsulation layer 320 at the first opening 410-OP and the third opening 330-OP.

[0137] The first electrode material layer MTL1 ′ may cover the second insulating material layer 420 ′.

[0138] The first photoresist PR1 may be disposed on the first electrode material layer MTL1' while overlapping one of the first openings 410-OP. The second photoresist PR2 may be spaced apart from the first photoresist PR1 and may be disposed on the first electrode material layer MTL1' while overlapping another of the first openings 410-OP. The thickness of the first photoresist PR1 may be different from the thickness of the second photoresist PR2. For example, the first photoresist PR1 may be a full-tone mask, and the second photoresist PR2 may be a half-tone mask.

[0139] Reference together Figure 8C and Fig.8D , by using the first photoresist PR1 and the second photoresist PR2 as a mask, a portion of each of the first electrode material layer MTL1' and the second insulating material layer 420' may be removed. In an embodiment, the first touch electrode MTL1 and the second touch insulating layer 420 may be patterned. The process of removing a portion of each of the first electrode material layer MTL1' and the second insulating material layer 420' may include dry etching and wet etching.

[0140] Because the first photoresist PR1 is a full-tone mask, a portion of the first electrode material layer MTL1' and a portion of the second insulating material layer 420' may remain in a region overlapping the first photoresist PR1. The remaining portion of the first electrode material layer MTL1' may be the first touch electrode MTL1. The remaining portion of the second insulating material layer 420' may be a portion of the second touch insulating layer 420.

[0141] Because the second photoresist PR2 is a half-tone mask, the first electrode material layer MTL1 ′ may be removed from the region overlapping the second photoresist PR2 , and a portion of the second insulating material layer 420 ′ may remain therein. The remaining portion of the second insulating material layer 420 ′ may be a portion of the second touch insulating layer 420 .

[0142] The first electrode material layer MTL1' and the second insulating material layer 420' may both be removed from the region not overlapping the first photoresist PR1 and the second photoresist PR2, and a portion of the upper surface of the first touch insulating layer 410 may be exposed. The second opening 420-OP of the second touch insulating layer 420 may be a space where a portion of the second insulating material layer 420' is removed.

[0143] Since the first touch electrode MTL1 and the second touch insulating layer 420 can be patterned at the same time, the side surface of the first touch electrode MTL1 and the side surface of the second touch insulating layer 420 can be on the same plane. Figure 7 430 and 440) and the second touch electrode (see Figure 7 MTL2) to achieve Figure 7 The embodiment shown in .

[0144] Fig. 9 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0145] refer to Fig. 9 , a width of an upper surface of the second touch insulation layer 420 may be defined as a first length s1, and a width of a lower surface of the first touch electrode MTL1 may be defined as a second length s2.

[0146] In an embodiment, the first length s1 may be greater than the second length s2. Therefore, the side surface of the first touch electrode MTL1 may be spaced apart from the side surface of the second touch insulation layer 420. The second touch insulation layer 420 may directly contact the third touch insulation layer 430 in a region adjacent to a region overlapping the first touch electrode MTL1.

[0147] FIG. 10A to FIG. 10C is a cross-sectional view schematically showing a process of manufacturing a display panel according to an embodiment. FIG. 10A to FIG. 10C It may be possible to show the manufacturing according to the embodiment Fig. 9 0 is a cross-sectional view of the process of the display panel shown in .

[0148] refer to Fig. 10A , you can Figure 8B In the embodiment shown in , a second insulating material layer 420' and a photoresist PR are disposed on the first and second insulating material layers 420'. A portion of the second insulating material layer 420' may at least partially (e.g., completely) fill the first opening 410-OP and the third opening 330-OP. The photoresist PR may include an opening overlapping the region between the first openings 410-OP. The various portions of the photoresist PR may have the same thickness.

[0149] Reference together Fig. 10A and Fig. 10B , the second touch insulation layer 420 may be formed by removing a portion of the second insulation material layer 420'. In an implementation, the second touch insulation layer 420 may be patterned.

[0150] The second touch insulating layer 420 may be a portion remaining after removing a portion of the second insulating material layer 420', and the second opening 420-OP may be a space where a portion of the second insulating material layer 420' is removed. The second opening 420-OP may be disposed in a region between the first openings 410-OP adjacent to each other.

[0151] refer to Fig. 10C , you can Fig. 10BThe first touch electrode MTL1 is formed on the embodiment shown in FIG. The first touch electrode MTL1 may be patterned by using a mask separated from the second touch insulating layer 420. Therefore, the side surface of the first touch electrode MTL1 and the side surface of the second touch insulating layer 420 may not be on the same plane. In an embodiment, the first length s1 may be different from the second length s2. Thereafter, the third touch insulating layer and the fourth touch insulating layer (see FIG. 4 ) may be provided. Fig. 9 430 and 440) and the second touch electrode (see Fig. 9 MTL2) to achieve Fig. 9 The embodiment shown in .

[0152] Fig.11 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0153] refer to Fig.11 , the third opening 330 -OP of the second inorganic encapsulating layer 330 may not pass through the second inorganic encapsulating layer 330 .

[0154] In some embodiments, the third opening 330-OP may be a blind hole that does not pass through the second inorganic encapsulation layer 330. For example, when the thickness of the second inorganic encapsulation layer 330 is defined as the third thickness t3 and the depth of the third opening 330-OP is defined as the third depth d3, the third depth d3 may be less than the third thickness t3. In an area overlapping with the third opening 330-OP, the second inorganic encapsulation layer 330 may have a fourth thickness t4 that is less than the third thickness t3. In an embodiment, the sum of the third depth d3 and the fourth thickness t4 may be equal to the third thickness t3.

[0155] In some embodiments, the fourth thickness t4 may be less than the third depth d3. For example, the third thickness t3 may be about The third depth d3 may be approximately And the fourth thickness t4 may be about In some embodiments, the fourth thickness t4 may be about or smaller.

[0156] In some embodiments, because the third opening 330-OP does not pass through the second inorganic encapsulation layer 330, the second touch insulation layer 420 may be spaced apart from the organic encapsulation layer 320 without being in direct contact with the organic encapsulation layer 320. The second touch insulation layer 420 may be in direct contact with a portion of the upper surface of the second inorganic encapsulation layer 330 in a region overlapping the first opening 410-OP and the third opening 330-OP.

[0157] Fig.12 is an enlarged cross-sectional view showing a portion of a display panel according to an embodiment.

[0158] refer to Fig.12 , the organic layer OL may be disposed under the second touch insulation layer 420 .

[0159] The organic layer OL may be between the first touch insulating layer 410 and the second touch insulating layer 420. A portion of the organic layer OL may be disposed in the first opening 410-OP and the third opening 330-OP. The organic layer OL may cover a portion of the upper surface of the first touch insulating layer 410, and a portion of the organic layer OL may be disposed in the first opening 410-OP and may cover the side surface of the first touch insulating layer 410. In addition, a portion of the organic layer OL may be disposed in the third opening 330-OP and may cover the side surface of the second inorganic encapsulation layer 330. The organic layer OL may be in direct contact with the organic encapsulation layer 320 within the third opening 330-OP, and may cover a portion of the upper surface of the organic encapsulation layer 320 exposed through the third opening 330-OP.

[0160] The organic layer OL may include an opening OL-OP overlapping the second opening 420-OP. A portion of the upper surface of the first touch insulating layer 410 may be exposed through the opening OL-OP of the organic layer OL. At this time, the first touch insulating layer 410 and the third touch insulating layer 430 may be in direct contact with each other through the opening OL-OP of the organic layer OL. Because the organic layer OL includes an opening OL-OP disposed below the second touch insulating layer 420 and overlapping the second opening 420-OP, it can be said that the upper surface of the organic layer OL is covered by the second touch insulating layer 420. A portion of the third touch insulating layer 430 may be arranged in the opening OL-OP of the organic layer OL and may cover the side surface of the organic layer OL. The organic layer OL may additionally relieve stress that may occur within the display panel and may also prevent the expansion of cracks that occur in some layers.

[0161] Fig.13 is an enlarged plan view showing a portion of a display panel according to an embodiment.

[0162] refer to Fig.13 ,and Figure 6 Unlike, one of the openings MTL2-OP of the second touch electrode MTL2 may overlap with the plurality of second openings 420-OP.

[0163] In an embodiment, the second openings 420-OP of the second touch insulation layer 420 may be arranged in a lattice pattern or a checkerboard shape. Therefore, the upper surfaces of the second touch insulation layer 420 and the first touch insulation layer 410 exposed by the second openings 420-OP may also be arranged in a lattice pattern or a checkerboard shape.

[0164] The light emitting diodes LED may overlap with the second openings 420-OP, respectively. For example, the first light emitting diode LED1 may partially overlap with four second openings 420-OP. The second light emitting diode LED2 may completely overlap with one second opening 420-OP and partially overlap with four second openings 420-OP. The third light emitting diode LED3 may partially overlap with four second openings 420-OP.

[0165] although Fig.13 The second opening 420-OP is shown to have a substantially square shape, wherein each side of the second opening 420-OP is parallel to each side of the opening MTL2-OP of the second touch electrode MTL2, but the present disclosure is not limited thereto. In an embodiment, the shape of the second opening 420-OP may be variously modified. For example, the second opening 420-OP may have a trapezoidal shape, a diamond shape, a circular shape, or an elliptical shape. The number of second openings 420-OP overlapping the opening MTL2-OP of the second touch electrode MTL2 may also be variously changed.

[0166] According to an embodiment, a display device including a structure capable of reducing stress or strain without reducing the thickness of an inorganic insulating layer of a touch layer can be realized. Therefore, the reliability of the display device can be ensured, and cracks can be prevented from occurring during a bending process. The scope of the present disclosure is not limited by this effect.

[0167] It should be understood that the embodiments described herein should be considered to be merely descriptive and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, characterized in that include: A display layer including a plurality of light emitting diodes; a first insulating layer disposed on the display layer and comprising a first opening disposed in a gap between two adjacent light emitting diodes among the plurality of light emitting diodes; as well as The second insulating layer is disposed on the first insulating layer and includes a second opening spaced apart from the first opening.

2. The display device according to claim 1, characterized in that A portion of the second insulating layer at least partially fills the first opening of the first insulating layer.

3. The display device according to claim 1, characterized in that The second opening is disposed above one of the two light emitting diodes adjacent to each other.

4. The display device according to claim 1, characterized in that In a plan view, the first opening has a shape surrounding the second opening.

5. The display device according to claim 4, characterized in that: Also included is a touch electrode, which is disposed on the second insulating layer and includes a wire passing between the two light emitting diodes adjacent to each other in a plan view, Wherein, the conductive wire is arranged above the first opening.

6. The display device according to claim 1, characterized in that: Also included is an encapsulation layer between the display layer and the first insulating layer, Wherein, the encapsulation layer comprises: a first inorganic encapsulation layer; an organic encapsulation layer, disposed on the first inorganic encapsulation layer; and The second inorganic encapsulation layer is disposed on the organic encapsulation layer and includes a third opening disposed below the first opening.

7. The display device according to claim 6, characterized in that: The depth of the first opening is equal to the thickness of the first insulating layer, and A depth of the third opening is less than or equal to a thickness of the second inorganic encapsulation layer.

8. The display device according to claim 1, characterized in that: An organic layer is also included between the first insulating layer and the second insulating layer.

9. The display device according to claim 8, characterized in that: The organic layer includes an opening disposed below the second opening.

10. The display device according to claim 1, characterized in that The second insulating layer includes a plurality of second openings, and One of the plurality of light emitting diodes overlaps with two or more of the plurality of second openings.

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