Metallized film capacitor with low self-inductance
By adopting an electrode structure composed of the first electrode plate and the second electrode plate in the metallized film capacitor, the core part is blocked by the bent end, the problem of high self-induction of the capacitor is solved, and the optimization of EMC performance and electrical performance are achieved The improvement meets the electrical performance requirements in the fields of new energy and automotive electronics.
Patent Information
- Application Number
- CN202420130285.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-18
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-01-18
AI Technical Summary
Existing metallized film capacitors have high self-induction problems in applications, which affect EMC performance, and are difficult to meet the increased electrical performance requirements in inverter or controller system-level testing.
By adopting an electrode structure composed of a first electrode plate and a second electrode plate, wherein the first electrode plate is extended to the inner side of the shell and bent to form a bent section, separating and blocking the core portion, reducing the self-induction of the capacitor, and optionally including L-shaped cross-section, electrode plate matching of different materials and thicknesses, and rounded corner transitions to reduce interference.
It effectively reduces the self-induction of the capacitor, optimizes the EMC performance, meets the requirements for increased electrical performance in the fields of new energy and automotive electronics, and controls the physical size and manufacturing cost of the capacitor.
Smart Images

Figure CN222354956U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of metallized film capacitors, in particular to a metallized film capacitor with low self-inductance. Background Art
[0002] With the rapid development of power electronics technology, metallized film capacitors are increasingly used in industrial control, new energy, automotive electronics, rail transit, power grids and other fields. At the same time, with the upgrading of products, new application platforms are also increasingly requiring higher electrical performance from capacitors.
[0003] EMC performance testing is crucial in system-level testing of inverters or controllers. At the same time, the self-inductance parameters of capacitors also play a decisive role in EMC performance. In order to optimize EMC performance, the self-inductance of capacitors also needs to be as small as possible. Utility Model Content
[0004] The utility model aims to solve one of the technical problems in the above-mentioned technology at least to a certain extent. To this end, the purpose of the utility model is to provide a metallized film capacitor structure with the characteristics of low self-inductance.
[0005] To achieve the above object, the embodiment of the utility model provides a low self-inductance metallized film capacitor, comprising:
[0006] The shell has a core inside; the core is connected to an external circuit through electrodes, and the potting material fixes the core and part of the electrodes in the shell;
[0007] Electrode: including a first electrode plate and a second electrode plate both made of conductive materials, the first electrode plate being formed between the second electrode plate and the core; one end of the first electrode plate extending to the inner side of the shell and being bent toward the core to form a bent section; the second electrode plate being electrically connected to the core; the second electrode plate forming a pin connected to an external circuit.
[0008] According to the low self-inductance metallized film capacitor of the embodiment of the utility model, since the electrode is composed of a first electrode plate and a second electrode plate, the first electrode plate separates the core from the second electrode plate and also shields a part of the core through its own bent end, thereby reducing the self-inductance of the capacitor.
[0009] In addition, the low self-inductance metallized film capacitor proposed in the above embodiment of the utility model may also have the following additional technical features:
[0010] Optionally, the cross-section of the first electrode plate is L-shaped, one end of the L-shape is between the second electrode and the core, and the other end is the bent section.
[0011] Optionally, the material of the first electrode plate is a conductor different from that of the second electrode plate.
[0012] Optionally, the thickness of the first electrode plate is smaller than the thickness of the second electrode plate.
[0013] Optionally, the bending portion of the first electrode plate is a rounded transition. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 A three-dimensional diagram of an electrode connection structure according to an embodiment of the utility model;
[0015] Figure 2 A side view of an electrode connection structure according to an embodiment of the utility model;
[0016] Figure 3 A top view of an electrode connection structure according to an embodiment of the present invention;
[0017] Figure 4 It is a cross-sectional view of an electrode connection structure according to an embodiment of the utility model.
[0018] Description of labels:
[0019] The electrode 1 comprises a first electrode plate 11 and a bending section 111 and a second electrode plate 12 . DETAILED DESCRIPTION
[0020] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0021] In the utility model, since the electrode is composed of a first electrode plate and a second electrode plate, the first electrode plate separates the core from the second electrode plate and shields a part of the core through its own bent end, thereby reducing the self-inductance of the capacitor.
[0022] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.
[0023] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0024] Due to its structural characteristics, large-capacity metallized film capacitors will produce self-inductance during application. However, the self-inductance can be reduced by improving the electrode shape while keeping the package size and core structure unchanged.
[0025] Figure 1 to Figure 2 A low self-inductance metallized film capacitor according to an embodiment of the utility model comprises:
[0026] The shell (not shown in the figure) has a core (not shown in the figure) inside; the core is connected to the external circuit through the electrode 1, and the potting material (not shown in the figure) fixes the core and part of the electrode 1 in the shell;
[0027] Electrode 1: includes a first electrode plate 11 and a second electrode plate 12 both made of conductive materials, the first electrode plate 11 is formed between the second electrode plate 12 and the core; one end of the first electrode plate 11 is extended to the inner side of the shell and bent toward the core to form a bent section 111; the second electrode plate 12 is electrically connected to the core; the second electrode plate 12 forms a pin connected to an external circuit.
[0028] By means of the combined structure consisting of the first electrode plate 11 and the second electrode plate 12, and the first electrode plate 11 being bent to partially wrap the core, self-inductance can be reduced. In some embodiments, the material of the first electrode plate 11 and the material of the second electrode plate 12 can be different to meet the requirements of specific scenarios. Under the premise of avoiding pins of different polarities in the core to prevent short circuits, the first electrode plate 11 can be further extended to wrap more of the core. Different areas of the core wrapped by the first electrode plate 11 can correspond to the effect of reducing self-inductance in circuits of different frequencies.
[0029] Optionally, the first electrode plate 11 has an L-shaped cross section, with one end of the L-shape being between the second electrode and the core, and the other end being a bent section 111 , or it may be a U-shaped cross section, with the core being in a U-shaped groove.
[0030] Optionally, the thickness of the first electrode plate 11 is smaller than the thickness of the second electrode plate 12. By using different conductivity materials for the first electrode plate 11 and the second electrode plate 12, the thickness of the first electrode plate 11 can be reduced, the increase in capacitance size caused by the use of the embodiment of the utility model can be reduced, the physical size of the capacitor can be controlled, and the manufacturing cost can be reduced.
[0031] Optionally, the first electrode plate 11 has a rounded transition at a bend to reduce interference caused by its own structure.
[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0033] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.
[0035] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.
Claims
1. Low self-inductance metallized film capacitor, characterized by: include: The shell has a core inside; the core is connected to an external circuit through electrodes, and the potting material fixes the core and part of the electrodes in the shell; Electrode: including a first electrode plate and a second electrode plate both made of conductive materials, the first electrode plate being formed between the second electrode plate and the core; one end of the first electrode plate extending to the inner side of the shell and being bent toward the core to form a bent section; the second electrode plate being electrically connected to the core; the second electrode plate forming a pin connected to an external circuit.
2. The low self-inductance metallized film capacitor according to claim 1, characterized in that: The cross section of the first electrode plate is L-shaped, one end of the L-shape is between the second electrode and the core, and the other end is the bent section.
3. The low self-inductance metallized film capacitor according to claim 1, characterized in that: The material of the first electrode plate is a conductor different from the material of the second electrode plate.
4. The low self-inductance metallized film capacitor according to claim 1, characterized in that: The thickness of the first electrode plate is smaller than the thickness of the second electrode plate.
5. The low self-inductance metallized film capacitor according to claim 1, characterized in that: The bending part of the first electrode plate is a rounded transition.