Radiator and humidifier

Abstract

The utility model discloses a radiator and humidifier relates to heat dissipation technical field, including the heat absorption body that has the flow chamber and is provided the cover body of heat absorption body one side, the flow chamber is provided with a plurality of radiating fins that are arranged at interval, the plurality of radiating fins define the cooling flow channel that allows the coolant to circulate, and the cover body is provided with the cover body. The cover body is provided with a liquid inlet communicated with the cooling flow channel and a liquid outlet communicated with the cooling flow channel, the side, facing the heat absorption body, of the cover body is provided with grooves matched with the heat dissipation fins, and the positions of the heat dissipation fins correspond to the positions of the grooves in a one-to-one mode so that the heat dissipation fins can stretch into the grooves. The LED lamp has the advantages of being high in heat dissipation efficiency and simple in structure.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a radiator and a humidifier. Background Art

[0002] At present, high-power PCB boards are increasingly widely used, and are indispensable in both civilian and military fields, such as image processors, industrial computers, servers, communication base stations, etc., and are also used in many high-end equipment. High-power PCB boards integrate multiple chips, transistors, inductors and other electronic components with high heat generation. With the advancement of technology, the performance of electronic components is constantly being optimized, the size is constantly decreasing, and the number is constantly increasing, which greatly improves the thermal power consumption and heat flux density of electronic components. When working in a high-temperature environment for a long time, the performance of electronic components will decrease and the life will be shortened. When the temperature rise exceeds the limit of the electronic components, the electronic components will directly fail. Therefore, modern electronic products cannot do without heat dissipation design. How to reasonably solve the heat dissipation problem and greatly improve its stability and reliability is the key to current research.

[0003] The traditional heat dissipation method is generally forced air cooling. Most air-cooled radiators are made of multiple heat sinks. However, the heat dissipation effect of the heat sink is limited during use, resulting in low heat dissipation effect and low heat dissipation efficiency. Utility Model Content

[0004] The utility model aims to solve one of the technical problems in the related art to a certain extent. To this end, the utility model provides a radiator and a humidifier, which have the advantages of high heat dissipation efficiency and simple structure.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A radiator comprises a heat absorbing body having a flow cavity and a cover body arranged on one side of the heat absorbing body, wherein a plurality of heat dissipating fins arranged at intervals are arranged in the flow cavity, and the plurality of heat dissipating fins define a cooling channel allowing coolant to flow, and the cover body is provided with a liquid inlet connected to the cooling channel and a liquid outlet connected to the cooling channel, and the cover body is provided with a groove matching the heat dissipating fin on one side facing the heat absorbing body, and the positions of the heat dissipating fins and the grooves correspond one to one so that the heat dissipating fins extend into the grooves.

[0007] Optionally, the heat dissipation fins are arranged in a staggered manner along the length direction of the heat absorption body.

[0008] Optionally, the heat absorption body includes a bottom wall and side walls, and the bottom of the heat dissipation fin is arranged on the bottom wall.

[0009] Optionally, a groove cooperating with the heat sink fin is formed on one side of the cover body facing the heat absorption body, and positions of the heat sink fin and the groove correspond one to one so that the heat sink fin extends into the groove.

[0010] Optionally, a first mounting block having a first mounting hole is formed on the cover body, and a second mounting block having a second mounting hole is formed on the heat absorption body, and the first mounting hole is connected to the second mounting hole by a fastener.

[0011] Optionally, at least one engaging member is provided on the heat absorption body, and the engaging member includes a slot, a horizontal portion, and a vertical portion connected to the horizontal portion, a portion of the slot is formed on the horizontal portion, and the other portion is formed on the vertical portion; a locking block is provided at one end of the cover body away from the first mounting block, and the locking block extends into the slot formed on the vertical portion.

[0012] Optionally, a locking hole is formed on a side of the heat absorbing body away from the cover body, and the heat dissipating fins adjacent to the locking hole are constructed as a cylindrical surface on a side close to the locking hole to avoid the locking hole.

[0013] Optionally, a positioning pin is formed on a side of the heat absorption body away from the cover body, and the positioning pin extends in a direction away from the cover body.

[0014] Optionally, a sealant is provided at the covering portion between the heat absorbing body and the cover body.

[0015] Optionally, a side of the heat absorbing body away from the cover body is configured as a smooth plane.

[0016] In addition, the utility model further provides a humidifier, including an atomizing assembly, a radiator, and a PCBA board for controlling the operation of the atomizing assembly, wherein the radiator includes any one of the radiators described above, and the PCBA board is attached to the surface of the heat absorbing body away from the cover. The reasoning process of the beneficial effects of the humidifier provided by the utility model is similar to that of the aforementioned radiator, and will not be repeated here.

[0017] Optionally, the atomization assembly includes a water supply tank, a lower water tank, a heating tank and an atomization tank which are connected in sequence through a liquid supply pipeline, the atomization tank is connected to the mist outlet of the humidifier, a heating element is provided in the heating tank, and an atomizer is provided in the atomization tank; the liquid inlet and the liquid outlet of the radiator are both connected to the liquid supply pipeline.

[0018] In this application, the radiator is directly designed with cooling channels on the heat-absorbing body, without the need to set up external coolant pipelines, which greatly reduces the volume of the radiator and can be designed separately for components that need to dissipate heat, making it more applicable. In summary, this application has a simple structure, low manufacturing cost, and uses liquid cooling to dissipate heat, which has higher heat dissipation efficiency.

[0019] These features and advantages of the utility model will be disclosed in detail in the following specific embodiments and drawings. The best implementation or means of the utility model will be fully presented in conjunction with the drawings, but it is not a limitation of the technical solution of the utility model. In addition, these features, elements and components appearing in each of the following texts and drawings are multiple, and are marked with different symbols or numbers for convenience, but all represent components with the same or similar structure or function. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings:

[0021] Figure 1 This is a schematic diagram of the structure of the liquid cooling system in the embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the radiator in the embodiment of the utility model;

[0023] Figure 3 for Figure 2 Explosion diagram of

[0024] Figure 4 It is a schematic diagram of the coolant entering and exiting the radiator in the embodiment of the utility model;

[0025] Figure 5 It is a schematic diagram of the flow direction of the coolant in the radiator in the embodiment of the utility model.

[0026] Among them, 1. radiator; 11. heat absorbing body; 111. flow chamber; 1111. bottom wall; 1112. side wall; 112. heat dissipation fins; 113. second mounting block; 114. card slot; 115. positioning pin; 116. locking hole; 12. cover body; 121. liquid inlet; 122. liquid outlet; 123. groove; 124. first mounting block; 125. card block; 2. PCBA board. DETAILED DESCRIPTION

[0027] The following is a detailed description of embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments in the implementation manner are intended to be used to explain the present invention and should not be construed as limiting the present invention.

[0028] References in this specification to "one embodiment" or "an example" or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment of the present patent disclosure. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0029] The heat sink in the related art has disadvantages:

[0030] 1. Radiators with relatively simple structures such as single aluminum sheet and single copper sheet can only meet the needs of some components with less heat. Once the components are overheated due to other abnormalities, they cannot meet the heat dissipation requirements and cannot control the heat dissipation effect;

[0031] 2. Most air-cooled radiators have built-in or external fans. Although they have a heat dissipation effect, the fan will absorb dust in the environment, causing other hidden dangers and abnormalities to the components. In addition, for components with higher heat generation, high-speed fans need to be configured, which will make a lot of noise. Therefore, their scope of use is greatly limited.

[0032] 3. Most water-cooled radiators have complex structures and high costs, and require external components to provide power to make the coolant flow.

[0033] 4. Semiconductor heat sinks are relatively expensive and noisy.

[0034] Example:

[0035] A heat sink, such as Figure 1 and Figure 2 As shown, the heat absorbing body 11 having a flow cavity 111 and a cover body 12 arranged on one side of the heat absorbing body 11 are provided. Figure 3 As shown, a plurality of heat dissipation fins 112 are arranged at intervals in the flow cavity 111, and the plurality of heat dissipation fins 112 define a cooling channel allowing the coolant to flow. A liquid inlet 121 connected to the cooling channel and a liquid outlet 122 connected to the cooling channel are provided on the cover body 12. A groove 123 cooperating with the heat dissipation fins 112 is provided on one side of the cover body 12 facing the heat absorption body 11, and the positions of the heat dissipation fins 112 and the groove 123 correspond one to one so that the heat dissipation fins 112 extend into the groove 123.

[0036] In this embodiment, a radiator 1 is provided, and its heat dissipation object includes but is not limited to heat-generating elements such as PCBA board 2. The radiator 1 is directly attached to the PCBA board 2 to take away the heat generated by the PCBA board 2. The radiator 1 includes a heat-absorbing body 11, and the heat-absorbing body 11 is made of metals such as aluminum, copper, and silver, has good thermal conductivity, and can quickly take away the heat of the PCBA board 2. Of course, the heat-absorbing body 11 can also be made of materials with heat absorption capacity such as rock wool board, glass wool, and EPS board. A flow cavity 111 is formed in the heat-absorbing body 11 to allow the flow of coolant. The shape of the flow cavity 111 can be consistent with the heat-absorbing body 11, or it can be inconsistent with the heat-absorbing body 11. A plurality of heat-dissipating fins 112 are arranged in the flow cavity 111 at intervals. The plurality of heat-dissipating fins 112 define a cooling channel in the flow cavity 111 that allows the coolant to flow. When the coolant flows through the cooling channel, it can take away the heat of the heat-absorbing body 11, so that the heat-absorbing body 11 can better dissipate heat for the PCBA board 2. Specifically, in this embodiment, the spacings between adjacent heat dissipation fins 112 are the same, and in other embodiments, the spacings between adjacent heat dissipation fins 112 may be different. The cover 12 is provided with a liquid inlet 121 and a liquid outlet 122 that are connected to the cooling channel. The liquid inlet 121 and the liquid outlet 122 are both arranged through the cover 12. In an electronic device with a liquid circulation system, the liquid inlet 121 and the liquid outlet 122 are directly connected to the liquid circulation system. At this time, there is no need to rely on external components (such as pumps, etc.) to provide power to make the coolant flow, reducing the dependence on external components, thereby reducing the manufacturing cost of the radiator 1.

[0037] In this embodiment, the heat dissipation fins 112 extend into the grooves 123 to provide a better sealing effect between the cover 12 and the heat absorbing body 11, thereby reducing the gap between the cover 12 and the heat absorbing body 11. In addition, the positioning and supporting effect of the grooves 123 on the heat dissipation fins 112 can also prevent the heat dissipation fins 112 from being offset or deformed during the flow of the coolant, thereby further improving the reliability and durability of the radiator 1.

[0038] The radiator 1 in the present application is provided with a plurality of spaced heat dissipation fins 112 in the flow cavity 111 of the heat absorbing body 11, which not only increases the heat dissipation area, but also optimizes the heat dissipation structure, making the heat dissipation more uniform. At the same time, the cooling channel defined by the heat dissipation fins 112 ensures that the coolant can fully flow through each heat dissipation fin 112, effectively absorbing and taking away heat, thereby greatly improving the heat dissipation effect. The radiator 1 in the present application is directly designed with a cooling channel on the heat absorbing body 11, without the need to set up an external coolant pipeline, which greatly reduces the volume of the radiator 1, and can be designed separately for components that need heat dissipation, making it more applicable. In summary, the present application has a simple structure, low manufacturing cost, and good heat dissipation effect. The flow direction of the coolant in the radiator is as follows: Figure 4 and Figure 5As shown, the direction of the arrow represents the direction of the coolant, and the coolant enters the radiator from the liquid inlet 121 and leaves the radiator from the liquid outlet 122. In the radiator, the coolant moves along the cooling channel. As the coolant moves along the path, the coolant takes away the heat of the heat absorbing body and increases its own temperature, that is, the coolant temperature at the liquid outlet 122 is higher than the coolant temperature at the liquid inlet 121.

[0039] In this embodiment, the heat absorbing body 11 is rectangular. In other embodiments, the design of the heat absorbing body 11 can also be customized according to specific needs, such as a spiral shape, a cylindrical shape, a special shape, etc. The shape should be selected based on the performance requirements, installation space, use environment and other factors of the radiator 1 to achieve the best heat dissipation effect.

[0040] In this embodiment, the cover 12 and the heat absorbing body 11 can be made of not only aluminum alloy and heat conductive plastic, but also various metal alloys and plastics such as copper and steel, or even a combination of metal and plastic. The cover 12 and the heat absorbing body 11 can be mass-produced by aluminum die casting, sand casting, pouring and other processes with low scrap rate.

[0041] In this embodiment, the heat sink 1 is applied to the PCBA board 2. In other embodiments, the heat sink 1 also has other application scenarios, such as: Typical application scenarios of the heat sink:

[0042] 1. In order to accurately control the water temperature of a coffee machine, a hanging iron or a water boiler, a thyristor component must be used to drive and control the heating device. Since the power of the heating device is often around 1000 watts or more, the corresponding thyristor heat generation is also very large. The heat sink 1 can be used to dissipate the heat of the thyristor component.

[0043] 2. Applied in the walking power system of smart vacuum cleaners, smart logistics carts, express delivery robots and hotel commercial robots, etc. Due to the compact structure, it is impossible to use a large motor to drive it. The thyristor device on the PCBA is often used for power input to drive a high-power micro motor.

[0044] 3. Various electronic and electrical equipments also need to use thyristors for power output and control for precise power output control, so the heat sink 1 in this application is needed for heat dissipation.

[0045] The heat dissipation fins 112 are arranged in a staggered manner along the length direction of the heat absorption body 11 .

[0046] The heat dissipation fins 112 are arranged in a staggered manner along the length of the heat absorbing body 11, optimizing and extending the flow path of the coolant. The liquid inlet 121 and the liquid outlet 122 opened on the cover body 12 are closely connected with the cooling channel, forming an efficient circulation path, and the coolant can quickly enter and flow out of the radiator 1, effectively exchanging heat, avoiding the accumulation and increase of heat, thereby maintaining the stable operation of the equipment.

[0047] The heat absorbing body 11 includes a bottom wall 1111 and a side wall 1112 , and the bottom of the heat dissipating fin 112 is disposed on the bottom wall 1111 .

[0048] In the present embodiment, the bottom of the heat sink fin 112 is connected to the bottom wall 1111 by welding, riveting or other mechanical connection methods. The heat sink fins 112 are arranged along the bottom wall 1111 to form a spaced structure to increase the heat dissipation area and optimize the heat dissipation effect. The heat sink fins 112 themselves are also made of a material with good thermal conductivity so that heat can be quickly transferred to various parts of the fins. In other embodiments, the heat sink fins 112 can also be integrally formed with the bottom wall 1111. In addition, the heat sink fins 112 are integrally formed on the side wall 1112 perpendicular to the bottom wall 1111, so that the connection between the heat sink fins 112 and the flow chamber 111 is more secure and the processing cost is lower.

[0049] A first mounting block 124 having a first mounting hole is formed on the cover body 12 , and a second mounting block 113 having a second mounting hole is formed on the heat absorbing body 11 . The first mounting hole and the second mounting hole are connected by a fastener.

[0050] The design of the two mounting blocks enables the cover 12 and the heat absorbing body 11 to be precisely aligned during assembly, and further ensures the accurate fit between the heat dissipation fins 112 and the grooves 123, thereby ensuring the heat dissipation effect. The first mounting hole and the second mounting hole can be firmly connected by fasteners such as bolts and nuts, thereby connecting the cover 12 and the heat absorbing body 11. This connection method is simple and effective and has high reliability and stability, and can withstand various stresses and vibrations generated by the radiator 1 during operation. Connection through fasteners also facilitates the disassembly and maintenance of the radiator 1. When it is necessary to clean or replace parts of the radiator 1, the cover 12 and the heat absorbing body 11 can be easily separated by loosening the fasteners, and then reassembled after necessary operations.

[0051] At least one locking member is provided on the heat absorbing body 11 of the heat sink fin, and the heat sink fin locking member includes a slot 114, a horizontal portion, and a vertical portion connected to the horizontal portion of the heat sink fin. A portion of the heat sink fin slot 114 is formed on the horizontal portion of the heat sink fin, and the other portion is formed on the vertical portion of the heat sink fin. A locking block 125 is provided at one end of the heat sink fin cover 12 away from the first mounting block 124 of the heat sink fin, and the heat sink fin locking block 125 extends into the heat sink fin slot 114 formed on the vertical portion of the heat sink fin.

[0052] The cooperation between the block 125 and the slot 114 increases the connection strength between the cover 12 and the heat absorbing body 11, and also helps to prevent loosening or misalignment due to vibration or external force during use. At the same time, the existence of the block 125 and the slot 114 also facilitates the installation of the radiator 1. During the installation process, the user can align the block 125 with the slot 114, and then gently press or push to make the two fit tightly together. This installation method is simple and easy, does not require the use of complex tools or equipment, and reduces the difficulty and cost of installation. Specifically, in this embodiment, there are two engaging members.

[0053] A locking hole 116 is formed on one side of the heat absorbing body 11 away from the heat sink fin cover 12 , and the heat sink fin 112 adjacent to the locking hole 116 is configured as a cylindrical surface on one side close to the heat sink fin locking hole 116 to avoid the heat sink fin locking hole 116 .

[0054] In this embodiment, the locking hole 116 is used to fix the heat absorption body 11 on the PCBA board 2. Specifically, the heat absorption body 11 can be fixed on the PCBA board 2 by passing fasteners such as screws and bolts through the PCBA board 2 and the locking hole 116.

[0055] A positioning pin 115 is formed on one side of the heat sink fin body 11 away from the heat sink fin cover 12 , and the heat sink fin positioning pin 115 extends in a direction away from the heat sink fin cover 12 .

[0056] In this embodiment, the positioning pins 115 can assist in positioning when the heat absorption body 11 is installed on the PCBA board 2 , so that the heat absorption body 11 can be accurately installed on the PCBA board 2 .

[0057] The joint between the heat absorbing body 11 and the cover body 12 is provided with a sealant.

[0058] The sealant can ensure that the connection between the heat absorbing body 11 and the cover body 12 has good sealing performance, preventing the coolant or other media from leaking during the circulation process. In addition, the sealant also has certain corrosion resistance and high temperature resistance, can resist the erosion of coolant and other chemicals, maintain a long-term sealing effect, and can withstand the high temperature generated by the radiator 1 during operation, and is not easy to soften or deform. The user can evenly apply a layer of sealant on the connection between the heat absorbing body 11 and the cover body 12, and then cover the cover body 12 tightly on the heat absorbing body 11. Through proper compression and curing, the sealant can be firmly attached to the connection to form a reliable sealing structure.

[0059] The side of the heat absorbing body 11 away from the cover body 12 is configured as a smooth plane.

[0060] In this embodiment, the heat absorbing body 11 with a smooth surface is easier to fit and install with the PCBA board 2. Whether it is installed by direct contact or indirect installation, the design of the smooth surface can reduce the resistance and difficulty during installation and improve the installation efficiency. At the same time, the tightly fitting installation method also helps to reduce heat loss and further improve the heat dissipation effect. Since the smooth surface has no uneven structure, the heat is distributed more evenly on the plane, so that it can be transferred to the heat dissipation fins 112 more quickly, and then carried away by the coolant, so that the radiator 1 can dissipate heat more efficiently when facing high-load work, ensuring the stable operation of the equipment.

[0061] This embodiment also provides a humidifier, including an atomizing assembly, a heat sink and a PCBA board 2 for controlling the operation of the atomizing assembly. The heat sink 1 includes the aforementioned heat sink 1, and the PCBA board 2 is bonded to the surface of the heat absorbing body 11 away from the cover body 12.

[0062] In this embodiment, the PCBA board 2 is the heat source in the system, which generates a large amount of heat during operation, and the radiator 1 can effectively dissipate the heat. The radiator 1 has components such as a flow cavity 111, heat dissipation fins 112, and a cover body 12, and ensures efficient heat dissipation performance and good sealing by optimizing the structure and using sealants. In the liquid cooling system, the coolant enters the flow cavity 111 of the radiator 1, and then flows through the heat dissipation fins 112 to absorb the heat generated by the PCBA board 2. The design of the heat dissipation fins 112 increases the heat dissipation area and improves the heat dissipation efficiency. At the same time, the sealant between the cover body 12 and the heat absorption body 11 ensures that the circulation of the coolant will not leak, thereby ensuring the stable operation of the system.

[0063] The atomization assembly includes a water supply tank, a lower water tank, a heating tank and an atomization tank which are connected in sequence through a liquid supply pipeline. The atomization tank is connected to the mist outlet of the humidifier. A heating element is provided in the heating tank, and an atomizer is provided in the atomization tank. The liquid inlet 121 and the liquid outlet 122 of the radiator 1 are both connected to the liquid supply pipeline.

[0064] In this embodiment, the liquid inlet 121 and the liquid outlet 122 of the radiator 1 are both connected to the liquid supply pipeline in the humidifier, that is, the coolant in the radiator 1 comes directly from the liquid supply pipeline, and does not need to rely on external components such as pumps to provide power for the coolant to circulate, thereby reducing the volume of the radiator 1.

[0065] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present invention shall be included in the scope of the claims.

Claims

1. A heat sink, comprising a heat absorbing body (11) having a flow cavity (111) and a cover (12) arranged on one side of the heat absorbing body (11), characterized in that: A plurality of heat dissipation fins (112) are arranged in the flow cavity (111), and the plurality of heat dissipation fins (112) define a cooling channel that allows the circulation of coolant. A liquid inlet (121) connected to the cooling channel and a liquid outlet (122) connected to the cooling channel are provided on the cover body (12). A groove (123) that cooperates with the heat dissipation fins (112) is provided on one side of the cover body (12) facing the heat absorption body (11), and the positions of the heat dissipation fins (112) and the grooves (123) correspond one to one so that the heat dissipation fins (112) extend into the grooves (123).

2. The heat sink according to claim 1, characterized in that: The heat dissipation fins (112) are arranged in a staggered manner along the length direction of the heat absorption body (11).

3. The heat sink according to claim 1, characterized in that: The heat absorbing body (11) comprises a bottom wall (1111) and a side wall (1112), and the bottom of the heat dissipation fin (112) is arranged on the bottom wall (1111).

4. The heat sink according to claim 1, characterized in that: A first mounting block (124) having a first mounting hole is formed on the cover body (12), and a second mounting block (113) having a second mounting hole is formed on the heat absorbing body (11), wherein the first mounting hole and the second mounting hole are connected via a fastener.

5. The heat sink according to claim 4, characterized in that: At least one engaging member is provided on the heat absorption body (11), and the engaging member comprises a slot (114), a horizontal portion, and a vertical portion connected to the horizontal portion, a portion of the slot (114) is formed on the horizontal portion, and another portion is formed on the vertical portion; a locking block (125) is provided at one end of the cover body (12) away from the first mounting block (124), and the locking block (125) extends into the slot (114) formed on the vertical portion.

6. The radiator according to any one of claims 1 to 5, characterized in that: A locking hole (116) is formed on a side of the heat absorbing body (11) away from the cover body (12), and a heat dissipating fin (112) adjacent to the locking hole (116) is constructed as a cylindrical surface on a side close to the locking hole (116) to avoid the locking hole (116).

7. The radiator according to any one of claims 1 to 5, characterized in that: A positioning pin (115) is formed on a side of the heat absorbing body (11) away from the cover body (12), and the positioning pin (115) extends in a direction away from the cover body (12).

8. The radiator according to any one of claims 1 to 5, characterized in that: A sealant is provided at the covering portion between the heat absorbing body (11) and the cover body (12).

9. A humidifier, comprising an atomizing assembly, a heat sink and a PCBA board (2) for controlling the operation of the atomizing assembly, characterized in that: The heat sink (1) comprises the heat sink according to any one of claims 1 to 8, and the PCBA board (2) is bonded to a surface of the heat absorbing body (11) away from the cover body (12).

10. A humidifier according to claim 9, characterized in that: The atomizing assembly comprises a water supply tank, a lower water tank, a heating tank and an atomizing tank which are sequentially connected via a liquid supply pipeline; the atomizing tank is connected to a mist outlet of the humidifier; a heating element is arranged in the heating tank; and an atomizer is arranged in the atomizing tank; the liquid inlet (121) and the liquid outlet (122) of the radiator (1) are both connected to the liquid supply pipeline.

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