Chip dual heat dissipation structure

Abstract

The utility model relates to the technical field of heat dissipation, and discloses a chip dual heat dissipation structure. The chip double-heat-dissipation structure comprises a vapor chamber which is used for being packaged on a chip and conducting heat of the chip, a middle frame is packaged on the top face of the vapor chamber, an upper cover is packaged on the middle frame, and a water inlet and a water outlet are formed in the left side and the right side of the top face of the upper cover. A plurality of integrally-formed heat dissipation fins are arranged on the bottom face of the upper cover, the bottoms of the heat dissipation fins abut against the top face of the vapor chamber, and a plurality of flow channels used for circulation of cooling liquid are formed among the heat dissipation fins. According to the dual-heat-dissipation structure of the chip, the heat of the vapor chamber is dissipated through the heat dissipation fins packaged on the vapor chamber and the cooling liquid circulating on the top cover, so that the heat absorbed by the vapor chamber can be transferred out at the first time, and the heat dissipation effect of the vapor chamber on the chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field, concretely to a chip double heat dissipation structure. BACKGROUND

[0002] With the rapid development of science and technology, the chip presents the development trend of high integration, complication and high frequency, but the higher and higher heat quantity of the chip becomes the key factor of hindering the performance and reliability promotion of the chip, in order to guarantee the maximum performance and stability of the chip, integrated heat dissipation parts are needed to dissipate heat for the chip, and most integrated heat dissipation parts cannot be directly fixed on the BGA circuit board body, therefore, the mode that a heat dissipation assembly is arranged above the chip and the integrated heat dissipation part is installed on the heat dissipation assembly to dissipate heat has been used by most manufacturers.

[0003] Nowadays, with the rise of mobile technology, 5G mobile communication, cloud computing, data center, block chain system and artificial intelligence, the amount of data generated in various industries is increasing day by day, especially the application of each technology node promotes the rise of high-density servers, and the core chips and graphics cards in the server need efficient heat dissipation, how to balance efficient computing and efficient heat dissipation is the key problem to be considered in server construction; the traditional heat dissipation assembly is usually a liquid cooling heat dissipation or air cooling heat dissipation structure, and with the increase of chip power, the heat quantity also increases a lot, obviously, the single liquid cooling heat dissipation assembly or air cooling heat dissipation assembly is difficult to meet the heat dissipation demand of high-power chips.

[0004] Therefore, a chip double heat dissipation structure is urgently needed to solve the above problems. INVENTION CONTENTS

[0005] Based on the above, the purpose of the utility model is to provide a chip double heat dissipation structure to solve the problem that the single liquid cooling heat dissipation assembly or air cooling heat dissipation assembly in the prior art is difficult to meet the heat dissipation of high-power chips.

[0006] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0007] The utility model provides a kind of chip double heat dissipation structure, including the heat sink for being encapsulated on chip and carrying out heat conduction, the top surface of the heat sink is encapsulated with middle frame, the upper cover is encapsulated on the middle frame, and the top surface of the upper cover is equipped with water inlet and water outlet on left and right sides;The bottom surface of the upper cover is equipped with a plurality of integrally-formed heat dissipation fins, and the bottom of a plurality of heat dissipation fins is abutted to the top surface of the heat sink, and a plurality of flow channels for cooling liquid flow are formed between a plurality of heat dissipation fins.

[0008] As an optional technical scheme of a kind of chip double heat dissipation structure, the two sides inner edge of the middle frame close to the water inlet and water outlet is "V" shaped structure;Reflux cavity is formed between the upper cover and the middle frame.

[0009] As an optional technical scheme of the chip double heat dissipation structure, two ends of the heat dissipation fins are respectively arranged towards the water inlet and the water outlet.

[0010] As an optional technical scheme of the chip double heat dissipation structure, the water inlet and the water outlet are respectively penetrated through the upper cover and connected with the backflow cavity.

[0011] As an optional technical scheme of the chip double heat dissipation structure, the heat conduction plate is composed of a top cover and a base, and a containing cavity is formed between the top cover and the base; the bottom surface of the top cover and the upper end surface of the base are respectively provided with a heat conduction layer, and a plurality of heat conduction components are arrayed between the two heat conduction layers.

[0012] As an optional technical scheme of the chip double heat dissipation structure, the heat conduction component comprises a heat conduction column and a heat conduction ring sleeved on the heat conduction column, and the upper and lower ends of the heat conduction column and the heat conduction ring are respectively abutted on the heat conduction layers.

[0013] As an optional technical scheme of the chip double heat dissipation structure, the heat conduction layer is a heat conduction copper mesh or a copper powder structure layer.

[0014] As an optional technical scheme of the chip double heat dissipation structure, the heat conduction column and the heat conduction ring are cylindrical, or ellipsoidal, or cuboid structures; and a plurality of evaporation capillary holes are arranged on the heat conduction ring.

[0015] As an optional technical scheme of the chip double heat dissipation structure, the bottom surface of the base is provided with an empty cavity for packaging a chip.

[0016] As an optional technical scheme of the chip double heat dissipation structure, the upper cover, the middle frame, the top cover and the base are connected through laser welding.

[0017] The chip double heat dissipation structure has the advantages that:

[0018] The chip double heat dissipation structure comprises a heat conduction plate for heat conduction of a chip, a middle frame and an upper cover; the upper cover is packaged with the heat conduction plate through the middle frame; the top surface of the upper cover is provided with a water outlet and a water inlet, and the bottom surface is provided with a plurality of heat dissipation fins.

[0019] Under the above structure, the heat pipe encapsulated on the chip absorbs heat of the chip and transmits the heat to the heat dissipation fins through the top cover of the heat pipe; the water inlet and the water outlet are connected with the external circulation system to inject the cooling liquid from the water inlet, circulate the cooling liquid between the flow channels of the heat dissipation fins and the upper end surface of the top cover, and output the cooling liquid from the water outlet after heat conduction to the heat dissipation fins and the top cover, so as to form a liquid cooling heat dissipation system; since the heat pipe itself has high heat conduction effect, the heat dissipation fins encapsulated on the heat pipe and the cooling liquid circulating on the top cover dissipate heat of the heat pipe, so that the heat absorbed by the heat pipe can be transmitted in the first time, and the heat dissipation effect of the heat pipe on the chip is improved; on the other hand, the heat conduction components arranged in the heat pipe enable the working medium in the containing cavity to transmit heat on the chip to the top cover more quickly and uniformly, so as to improve the heat exchange efficiency of the heat pipe. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an overall explosion schematic view of the chip double heat dissipation structure in the embodiment of the utility model;

[0021] Figure 2 It is a sectional view of the chip double heat dissipation structure in the embodiment of the utility model;

[0022] Figure 3 It is a bottom view of the upper cover and the middle frame in the embodiment of the utility model;

[0023] Figure 4 It is an explosion schematic view of the heat pipe in the embodiment of the utility model;

[0024] Figure 5 It is a sectional view of the heat conduction ring in the embodiment of the utility model.

[0025] In the drawing:

[0026] 1, upper cover; 10, water inlet; 11, water outlet; 12, heat dissipation fin; 13, backflow cavity; 2, middle frame; 3, heat pipe; 30, top cover; 31, base; 32, heat conduction component; 320, heat conduction column; 321, heat conduction ring; 322, evaporation capillary hole; 33, heat conduction layer; 34, empty cavity. DETAILED DESCRIPTION

[0027] The utility model will be further described in detail in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that, in order to facilitate the description, only the parts related to the utility model are shown in the drawings rather than all the structures.

[0028] In the description of the utility model, unless another definite provision and limit, the term "link", "connect", "fix" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can pass through the indirect connection of intermediate medium, can be two elements internal communication or two element mutual action relation.For the ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0029] In the utility model, unless another definite provision and limit, the first feature is "on" or "under" the second feature can include the direct contact of the first and second features, also can include the contact of the first and second features not direct contact but through the contact between other features between them.Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than the second feature.The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than the second feature.

[0030] In the description of the embodiment, the orientation or position relationship of the terms "on", "under", "left", "right" and the like is based on the orientation or position relationship shown in the drawing, only for the convenience of description and simplification operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the utility model.

[0031] In the description of the utility model, unless otherwise stated, the meaning of "a plurality of" is two or more than two.In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0032] This invention provides a dual heat dissipation structure for a chip. A heat spreader 3 encapsulated on the chip absorbs heat from the chip, transferring it through the top cover 30 of the heat spreader 3 to the heat dissipation fins 12. An inlet 10 and an outlet 11 connect to an external circulation system, injecting coolant from the inlet 10 and allowing it to flow through the channels between the heat dissipation fins 12 and the upper surface of the top cover 30 for heat conduction. The coolant is then output from the outlet 11, forming a liquid cooling system. Because the heat spreader 3 itself has efficient heat conduction, and the heat dissipation fins 12 encapsulated on the heat spreader 3 and the coolant flowing through the top cover 30 further dissipate heat, the heat absorbed by the heat spreader 3 can be transferred out immediately, improving the heat dissipation effect on the chip. Furthermore, several heat-conducting components 32 inside the heat spreader 3 allow the working fluid in the cavity to transfer heat from the chip to the top cover 30 more quickly and evenly, improving the heat exchange efficiency of the heat spreader 3.

[0033] Specifically, such as Figure 3 As shown, the inlet 10 and outlet 11 are respectively connected to the top cover 1 through a conductive path. The inner edges of the middle frame 2 near the inlet 10 and outlet 11 are arranged in a "V" shape, forming a return flow cavity 13 between the heat dissipation fins 12, the top cover 1, and the middle frame 2. The two ends of the heat dissipation fins 12 are respectively arranged towards the inlet 10 and outlet 11. Thus, the two ends of the flow channels between the inlet 10, outlet 11, and multiple heat dissipation fins 12 are respectively connected to the return flow cavity 13. In this configuration, when the coolant is input from the inlet 10, it flows sequentially through the return cavity 13 below the inlet 10 and then through the flow channel between the heat dissipation fins 12 into the return cavity 13 below the outlet 11. Since the inner side of the middle frame 2 has a "V" shaped structure, the coolant can effectively accumulate in the return cavity 13 and be quickly output from the outlet 11, which improves the flow speed of the coolant in the flow channel and accelerates the heat exchange efficiency between the coolant and the heat dissipation fins 12 and the heat exchange plate 3.

[0034] In this embodiment, as Figure 2 and Figure 4 As shown, the heat spreader 3 comprises a base 31 and a top cover 30 encapsulated on the base 31. A cavity is formed between the base 31 and the top cover 30, and a working fluid (e.g., coolant) is injected into the cavity. The bottom surface of the top cover 30 and the upper surface of the base 31 are respectively provided with a heat-conducting layer 33. In this embodiment, the heat-conducting layer 33 is a copper mesh or copper powder structure layer with high thermal conductivity. The copper mesh or copper powder structure layer enables the heat absorbed by the chip by the base 31 to be quickly transferred to the working fluid in the cavity and then to the heat dissipation fins 12 on the upper surface of the top cover 30. The heat is efficiently conducted through the circulating coolant, which improves the heat exchange efficiency of the heat spreader 3 for the chip.

[0035] It should be noted that, in order to further accelerate the heat conduction between the heat spreader 3 and the heat dissipation fins 12, a plurality of heat-conducting components 32 are connected in an array between the two heat-conducting layers 33. The heat-conducting components 32 include heat-conducting pillars 320 and heat-conducting rings 321 sleeved on the heat-conducting pillars 320. The upper and lower ends of the heat-conducting pillars 320 and the heat-conducting rings 321 are respectively connected to the two heat-conducting layers 33. In this embodiment, the heat-conducting pillars 320 and the heat-conducting rings 321 are preferably made of copper with a cylindrical, elliptical, or cuboid structure. The arrangement of the heat-conducting rings 321 and the heat-conducting pillars 320 further improves the heat conduction efficiency between the base 31 and the top cover 30. At the same time, the heat-conducting rings 321 are provided with a plurality of evaporation capillaries 322 (such as... Figure 5 As shown), the evaporation capillary pores 322 not only increase the heat exchange area between the working fluid and the heat-conducting column 320, but also enable the working fluid in the accommodating cavity to conduct heat quickly and evenly. The accommodating cavity is generally filled with 70% to 80% of its capacity of working fluid. After the working fluid is filled, the accommodating cavity is evacuated to lower the melting point of the working fluid and increase the heat flow of the working fluid in the accommodating cavity, so that the top cover 30 can quickly transfer heat to the heat dissipation fins 12.

[0036] like Figure 2 As shown, the bottom of the heat spreader 3, i.e. the bottom of the base 31, is provided with an upwardly recessed cavity 34, which is used for chip or circuit board packaging. A thermally conductive layer 33 (e.g., an indium foil) can also be coated in the cavity, and the chip body conducts heat through the thermally conductive layer 33 and the heat spreader 3. It should be noted that in this embodiment, the upper cover 1, the middle frame 2, the top cover 30, and the base 31 are integrated by laser welding. On the one hand, this can avoid the leakage of coolant or working fluid in traditional adhesive sealing structures during long-term use, thus improving the sealing and stability of the entire chip dual heat dissipation structure. On the other hand, the compact size of this chip dual heat dissipation structure can be widely used in various circuit systems to dissipate heat from the chip. The combination of liquid cooling and the heat spreader 3 enables high-power chips to be effectively cooled.

[0037] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A dual heat dissipation structure for a chip, comprising a heat spreader plate packaged on the chip for conducting heat to it, characterized in that, The top surface of the heat spreader is encapsulated with a middle frame, and the middle frame is encapsulated with a top cover. The top surface of the top cover has water inlet and water outlet on the left and right sides. The bottom surface of the top cover has a plurality of integrally formed heat dissipation fins. The bottom of the plurality of heat dissipation fins abuts against the top surface of the heat spreader, and multiple flow channels for coolant circulation are formed between the plurality of heat dissipation fins.

2. The chip dual heat dissipation structure according to claim 1, characterized in that, The inner sides of the middle frame near the inlet and outlet are V-shaped; a reflux cavity is formed between the top cover and the middle frame.

3. The chip dual heat dissipation structure according to claim 2, characterized in that, The two ends of several of the heat dissipation fins are respectively positioned facing the water inlet and the water outlet.

4. The chip dual heat dissipation structure according to claim 3, characterized in that, The inlet and outlet of the water flow pass through the upper cover and are connected to the return flow chamber.

5. The chip dual heat dissipation structure according to claim 1, characterized in that, The heat spreader consists of a top cover and a base, with a cavity formed between the top cover and the base. The bottom surface of the top cover and the upper surface of the base are respectively provided with heat-conducting layers, and several heat-conducting components are connected in an array between the two heat-conducting layers.

6. The chip dual heat dissipation structure according to claim 5, characterized in that, The heat-conducting component includes a heat-conducting column and a heat-conducting ring sleeved on the heat-conducting column, with the upper and lower ends of the heat-conducting column and the heat-conducting ring respectively abutting against the heat-conducting layer.

7. The chip dual heat dissipation structure according to claim 6, characterized in that, The thermally conductive layer is a thermally conductive copper mesh or copper powder structure layer.

8. The chip dual heat dissipation structure according to claim 7, characterized in that, The heat-conducting pillar and heat-conducting ring are cylindrical, elliptical, or cuboid structures; the heat-conducting ring is provided with a number of evaporation capillaries.

9. The chip dual heat dissipation structure according to claim 8, characterized in that, The bottom surface of the base is provided with a cavity for packaging chips.

10. A dual heat dissipation structure for a chip according to claim 9, characterized in that, The upper cover, middle frame, top cover, and base are connected by laser welding.

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