Integrated circuit board pressing device
By designing the integrated circuit pressure plate device, the problem of hollow nail rack lifting after heating is solved, and the pressure plate window design is improved, achieving efficient Diebond operation and improving production efficiency and quality.
Patent Information
- Application Number
- CN202421299184.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-07
AI Technical Summary
When the Die Bond station of the integrated circuit is not carried out DAF product operation, the vacuum adsorption function cannot be turned on without pre-stacking, which affects efficiency and quality; the hollow nail stand is prone to lift after heating, resulting in die offset and corners, affecting product quality.
An integrated circuit platen device is designed, including a mounting member, a first and a second vertical connection member, a first and a second strip, and a notch and a curved section. The device removes the middle part of the connecting ribs and increases the compression of the unloaded area, prevents the nail frame from rising up, and improves the pressure plate window design to adapt to the integrated circuit of different shapes.
Effectively prevent the hollow nail stand from rising after heating, improves the efficiency and quality of the Diebond machine operation, overcomes the limitations of pre-film, and improves engineering capabilities and production efficiency.
Smart Images

Figure CN222600930U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit pressing plates, in particular to an integrated circuit pressing plate device. Background Art
[0002] When performing DAF product operations at the Die Bond station of integrated circuits, the vacuum adsorption function cannot be turned on due to the lack of pre-filming, which seriously affects the efficiency and quality of the operation. In addition, the hollow nail rack used in the DB station is prone to arching after heating, which not only causes the die to shift when loading, but may also cause the die to turn, thereby affecting the overall quality of the product. In order to solve these problems, the present invention proposes a newly designed integrated circuit pressing plate device, which aims to enhance the ability of the Diebond machine to operate DAF products. In the prior art, due to the tension generated by heating, especially the warping problem of the hollow nail rack, the product faces many challenges when operating the machine. Utility Model Content
[0003] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit pressing plate device.
[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit pressure plate device, including a mounting piece, a first vertical connecting piece is fixedly connected downwardly at the bottom of the mounting piece, a second vertical connecting piece is fixedly connected downwardly at one end of the mounting piece away from the first vertical connecting piece, the first vertical connecting piece is fixedly connected to a first pressure strip in the horizontal direction, the second vertical connecting piece is fixedly connected to a second pressure strip in the horizontal direction, the first pressure strip is not directly connected to the second pressure strip, a notch is provided between the first pressure strip and the second pressure strip, a first mounting bolt is threadedly connected to the mounting piece, a second mounting bolt is threadedly connected to the mounting piece, a screw hole is provided on the mounting piece, and an arc section is provided on the mounting piece.
[0005] As a further description of the above technical solution:
[0006] The first pressure strip and the second pressure strip are in the same plane, and the mounting member is parallel to the plane where the first pressure strip and the second pressure strip are located.
[0007] As a further description of the above technical solution:
[0008] The first vertical connection member and the second vertical connection member are in the same plane, and the mounting member is perpendicular to the plane where the first vertical connection member and the second vertical connection member are located.
[0009] As a further description of the above technical solution:
[0010] The width of the device is 102.50 mm and the length of the device is 59.00 mm.
[0011] As a further description of the above technical solution:
[0012] The first pressing strip is used for pressing the un-die area.
[0013] The utility model has the following beneficial effects:
[0014] This device removes the middle part of the connecting reinforcement and increases the un-die area for pressing. It can press the un-die area of the entire nail rack so that the nail rack will not warp up after heating. In addition, this device also improves the original pressure plate window design, overcoming the limitation that hollow nail rack products must be pre-laminated. Even if no Pre-tape heating products are used, normal operation can be carried out. These improvements have significantly improved engineering capabilities and increased production efficiency and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a top structural schematic diagram of the integrated circuit pressing plate device proposed by the utility model;
[0016] Figure 2 This is a bottom structural schematic diagram of the integrated circuit pressing plate device proposed by the utility model;
[0017] Figure 3 This is a top view of the integrated circuit pressing plate device proposed by the utility model.
[0018] Legend:
[0019] 1. Mounting piece; 2. First vertical connecting piece; 3. Second vertical connecting piece; 4. First pressure strip; 5. Second pressure strip; 6. Notch; 7. First mounting bolt; 8. Second mounting bolt; 9. Screw hole; 10. Arc segment. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Reference Figure 1-3The utility model provides an embodiment: an integrated circuit pressure plate device, including a mounting member 1, the mounting member 1 is a supporting structure of the entire pressure plate device, the bottom of the mounting member 1 is fixedly connected downwardly with a first vertical connecting member 2, the end of the mounting member 1 away from the first vertical connecting member 2 is fixedly connected downwardly with a second vertical connecting member 3, the first vertical connecting member 2 is fixedly connected to a first pressure strip 4 in the horizontal direction, and the second vertical connecting member 3 is fixedly connected to a second pressure strip 5 in the horizontal direction.
[0022] The first pressure strip 4 is not directly connected to the second pressure strip 5. A gap 6 is provided between the first pressure strip 4 and the second pressure strip 5. The first pressure strip 4 is used for pressing the non-die area. The gap 6 is adapted to different integrated circuit layouts and shapes. By designing the gap 6, the middle part of the connecting rib is removed, and the pressing of the non-die area is increased. The non-die area of the entire nail rack can be pressed, so that the nail rack will not warp after heating.
[0023] A first mounting bolt 7 is threadedly connected to the mounting member 1, a second mounting bolt 8 is threadedly connected to the mounting member 1, a screw hole 9 is provided on the mounting member 1, the first mounting bolt 7 and the second mounting bolt 8 are used for installing and fixing the device, and an arc segment 10 is provided on the mounting member 1 to meet the pressing requirements of integrated circuits of different shapes.
[0024] The first pressure strip 4 and the second pressure strip 5 are in the same plane, and the mounting member 1 is parallel to the plane where the first pressure strip 4 and the second pressure strip 5 are located.
[0025] The first vertical connector 2 and the second vertical connector 3 are in the same plane, and the mounting member 1 is perpendicular to the plane where the first vertical connector 2 and the second vertical connector 3 are located.
[0026] The width of the device is 102.50 mm and the length of the device is 59.00 mm.
[0027] Working principle: When the integrated circuit needs to be pressed, the operator first places the integrated circuit on the pressing plate device;
[0028] Adjust the positions of the first pressure strip 4 and the second pressure strip 5 by means of the first mounting bolt 7 and the second mounting bolt 8 to ensure that they can correctly press the un-die area of the integrated circuit;
[0029] The first pressure strip 4 and the second pressure strip 5 are designed on the same plane and parallel to the mounting member 1, so as to ensure that the pressure during pressing is evenly distributed;
[0030] The first vertical connecting member 2 and the second vertical connecting member 3 are also designed on the same plane, perpendicular to the mounting member 1, to ensure the stability and accuracy of the layering strip;
[0031] By adjusting the bolts, the first pressure strip 4 and the second pressure strip 5 can be closely fitted to the integrated circuit, and the notch 6 is designed to adapt to the specific shape of the integrated circuit to achieve precise pressing;
[0032] The design of the arc segment 10 enables the mounting member 1 to better adapt to integrated circuits of different shapes, thereby improving the adaptability and effect of the pressing;
[0033] The dimensions of the device (width 102.50 mm, length 59.00 mm) are designed based on the common dimensions of integrated circuits to ensure that the pressure plate device can be applied to a variety of integrated circuit products;
[0034] Through the above design, the integrated circuit pressing plate device of the utility model can effectively improve the pressing quality and efficiency of the integrated circuit.
[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An integrated circuit pressing plate device, comprising a mounting member (1), characterized in that: The bottom of the mounting member (1) is fixedly connected downwardly with a first vertical connecting member (2); one end of the mounting member (1) away from the first vertical connecting member (2) is fixedly connected downwardly with a second vertical connecting member (3); the first vertical connecting member (2) is fixedly connected horizontally with a first pressure strip (4); the second vertical connecting member (3) is fixedly connected horizontally with a second pressure strip (5); the first pressure strip (4) and the second pressure strip (5) are not directly connected; a notch (6) is provided between the first pressure strip (4) and the second pressure strip (5); a first mounting bolt (7) is threadedly connected to the mounting member (1); a second mounting bolt (8) is threadedly connected to the mounting member (1); a screw hole (9) is provided on the mounting member (1); and an arc section (10) is provided on the mounting member (1).
2. The integrated circuit pressing plate device according to claim 1, characterized in that: The first pressure strip (4) and the second pressure strip (5) are in the same plane, and the mounting member (1) is parallel to the plane where the first pressure strip (4) and the second pressure strip (5) are located.
3. The integrated circuit pressing plate device according to claim 2, characterized in that: The first vertical connection member (2) and the second vertical connection member (3) are in the same plane, and the mounting member (1) is perpendicular to the plane where the first vertical connection member (2) and the second vertical connection member (3) are located.
4. The integrated circuit pressing plate device according to claim 3, characterized in that: The width of the device is 102.50 mm and the length of the device is 59.00 mm.
5. The integrated circuit pressing plate device according to claim 4, characterized in that: The first pressure strip (4) is used for pressing the un-die area.