Display panel and display device

Abstract

The embodiment of the utility model provides a display panel and a display device, relates to the technical field of display, and is used for preventing the problems that cracks appear in an inorganic layer when holes are formed, and the cracks extend to a display area along the inorganic layer, so that the display of the display panel is abnormal. The display panel is provided with an open hole, the display panel is provided with a display area and a transition area, the display area surrounds the transition area, and the transition area surrounds the open hole. The display panel comprises a substrate, an isolation retaining wall located in a transition area and an inorganic lamination layer. The isolation retaining wall surrounds the opening, and a gap exists between the isolation retaining wall and the boundary of the opening. The inorganic lamination layer comprises a plurality of inorganic layers stacked on the substrate, and the inorganic lamination layer at least covers the display area. The inorganic laminated layer is also located in a spacer region between the isolation retaining wall and the boundary of the opening, and the thickness of the part, located in the display region, of the inorganic laminated layer is greater than that of the inorganic laminated layer in the spacer region; or, the inorganic lamination layer is not overlapped with the interval region. The display panel is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In some display devices, the sensor module is disposed in an opening in the display area. When the opening is cut, the inorganic material layer in the display device is prone to cracks and other defects. If the cracks extend into the display area, the display device may display abnormally. Utility Model Content

[0003] The purpose of the embodiments of the present disclosure is to provide a display panel and a display device, which are used to reduce the risk of cracks occurring in the inorganic stack when forming openings, thereby reducing the risk of cracks extending into the display area.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display panel is provided. The display panel is provided with an opening, and the display panel has a display area and a transition area, the display area surrounds the transition area, and the transition area surrounds the opening. The display panel includes: a substrate, an isolation barrier wall located in the transition area, and an inorganic laminate. The isolation barrier wall surrounds the opening, and there is a gap between the isolation barrier wall and the boundary of the opening. The inorganic laminate includes a plurality of inorganic layers stacked on the substrate, and the inorganic laminate at least covers the display area. The inorganic laminate is also located in the gap area between the isolation barrier wall and the boundary of the opening, and the thickness of the portion of the inorganic laminate located in the display area is greater than the thickness of the inorganic laminate located in the gap area; or, the inorganic laminate does not overlap with the gap area.

[0006] In the above display panel, by reducing the thickness of the inorganic stack in the opening area and around the opening area, the risk of cracks in the inorganic stack when forming the opening is reduced, and the risk of cracks extending into the display area is reduced, thereby improving the manufacturing yield of the display panel.

[0007] In some embodiments, the inorganic stack includes a first sub-stack, and the first sub-stack includes at least one gate insulating layer and at least one interlayer dielectric layer stacked. The first sub-stack covers at least the display area. The first sub-stack is also located in the spacing area, and the thickness of the portion of the first sub-stack located in the display area is greater than the thickness of the portion of the first sub-stack located in the spacing area; or, the first sub-stack does not overlap with the spacing area.

[0008] In some embodiments, the inorganic stack includes a second sub-stack, and the second sub-stack includes a first inorganic encapsulation structure and a second inorganic encapsulation structure stacked. The second sub-stack covers at least the display area. The second sub-stack is also located in the spacing area, and the thickness of the portion of the second sub-stack located in the display area is greater than the thickness of the portion of the second sub-stack located in the spacing area; or, the second sub-stack does not overlap with the spacing area.

[0009] In some embodiments, the first sub-stack includes a first portion located in the spacing area, and the isolation barrier wall and the first portion form a step difference. The display panel also includes a first protective portion, the first protective portion covers the side wall of the isolation barrier wall forming the step difference. The first protective portion includes an organic material.

[0010] In some embodiments, one end of the first protection portion is overlapped on a side of the isolation barrier wall away from the substrate.

[0011] In some embodiments, the display panel further comprises: a first cap layer disposed on a side of the isolation barrier away from the substrate. One end of the first cap layer extends to a side of the isolation barrier close to the opening, forms an undercut structure with a sidewall of the isolation barrier, and abuts against the first protective portion.

[0012] In some embodiments, the first sub-layer includes a second portion located on a side of the isolation retaining wall away from the opening, a groove is formed between the second portion and the isolation retaining wall, and the groove surrounds the opening. The display panel also includes: a second protective portion provided on a side wall of the groove away from the opening, and a second cap layer provided on a side of the second portion away from the substrate. The second protective portion includes an organic material. One end of the second cap layer extends to the top of the groove, forms an undercut structure with the side wall of the groove, and abuts against the second protective portion.

[0013] In some embodiments, the display panel further comprises: a third protective portion covering the side wall of the isolation retaining wall away from the hole, and a third cap layer located on the side of the isolation retaining wall away from the substrate. The third protective portion comprises an organic material. One end of the third cap layer extends to the side of the isolation retaining wall away from the hole, forms an undercut structure with the side wall of the isolation retaining wall, and abuts against the third protective portion.

[0014] In some embodiments, the display panel further comprises at least one planar layer located on a side of the first sub-layer away from the substrate. At least one of the first protective portion, the second protective portion and the third protective portion of the display panel is disposed on the same layer as the planar layer.

[0015] In some embodiments, a gap is provided on a surface of the isolation barrier away from the substrate, and the gap is arranged around the opening. The display panel further comprises: a filling part and a reinforcing part. The filling part is located in the gap; the filling part comprises an organic material. The reinforcing part is located between the bottom of the gap and the filling part, and between the side wall of the gap and the filling part; the reinforcing part comprises a metal material.

[0016] In some embodiments, the isolation retaining wall includes a first sub-retaining wall located on a side of the gap away from the opening, and a second sub-retaining wall located on a side of the gap close to the opening. The display panel also includes: a fourth cap layer located on a side of the first sub-retaining wall away from the substrate, and / or a fifth cap layer located on a side of the second sub-retaining wall away from the substrate. One end of the fourth cap layer extends to a side of the first sub-retaining wall away from the opening, forming an undercut structure with the side wall of the first sub-retaining wall. One end of the fifth cap layer extends to a side of the second sub-retaining wall close to the opening, forming an undercut structure with the side wall of the second sub-retaining wall.

[0017] In some embodiments, a portion of the first sub-layer of the inorganic stack forms an isolation barrier, and a second sub-layer of the inorganic stack covers the isolation barrier and the filling portion. At least one flat layer of the display panel is located between the first sub-layer and the second sub-layer. The filling portion is disposed in the same layer as a flat layer; or, in the case where the display panel includes multiple flat layers, the filling portion includes a plurality of sub-filling portions stacked and arranged, and each sub-filling portion is disposed in the same layer as a flat layer.

[0018] In some embodiments, the display panel further includes at least one source-drain conductive layer. At least one of the first cap layer, the second cap layer, the third cap layer, the fourth cap layer, the fifth cap layer and the enhancement part of the display panel is located in one source-drain conductive layer; or, in the case where the display panel includes multiple source-drain conductive layers, at least one of the first cap layer, the second cap layer, the third cap layer, the fourth cap layer, the fifth cap layer and the enhancement part of the display panel includes a plurality of stacked sub-cap layers, each sub-cap layer is located in one source-drain conductive layer, and two adjacent sub-cap layers are in contact.

[0019] In some embodiments, the display panel further comprises: a first etch stopper located at the bottom of a groove formed between the second portion of the first sub-stack of the display panel and the isolation barrier, and / or a second etch stopper located at the bottom of a gap formed by the isolation barrier. The material of the first etch stopper is different from the material of the inorganic stack. The material of the second etch stopper is different from the material of the inorganic stack.

[0020] In another aspect, a display device is provided, comprising: a display panel as described in any one of the above embodiments, and a circuit board, wherein the display panel is connected to the circuit board.

[0021] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0023] Figure 1 is a structural diagram of a display device according to some embodiments;

[0024] Figure 2 is a planar structural diagram of a display device according to some embodiments;

[0025] Figure 3 For some embodiments, the display panel is based on Figure 2 The cross-sectional structure diagram obtained by the cross-sectional line BB in;

[0026] Figure 4 is a planar structural diagram of a display panel according to some other embodiments;

[0027] Figure 5 is a partial cross-sectional structural diagram of a display panel during preparation according to some embodiments;

[0028] Figure 6 is a partial cross-sectional structural diagram of a display panel according to some embodiments;

[0029] Figure 7 For some embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0030] Figure 8 For other embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0031] Fig. 9 For display panels of some other embodiments, Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0032] Fig.10 For some further embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0033] Fig.11 For other embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0034] Fig.12For other embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0035] Fig.13 For other embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the cross-sectional line CC in;

[0036] Fig.14 For other embodiments, the display panel is based on Figure 4 The cross-sectional structure diagram obtained by the section line CC in . DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0039] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0040] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0041] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0042] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0043] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0044] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0045] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0046] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0047] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0048] The embodiment of the present disclosure provides a display device 100. Figure 1 and Figure 2 As shown, the display device 100 includes: a display panel 10 and a circuit board 20 , and the display panel 10 is connected to the circuit board 20 .

[0049] The display device 100 can be any device that displays, whether in motion (e.g., video), fixed (e.g., still images), text, or images. More specifically, it is contemplated that the embodiments described may be implemented in or associated with a variety of electronic devices, including, but not limited to, mobile phones, wireless devices, PDAs (Personal Digital Assistants), PIAs (Personal Information Assistants), handheld or portable computers, GPS receivers / navigators, cameras, video cameras, game consoles, wearable devices, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic billboards or signs, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0050] From the perspective of the light-emitting type of the display device 100, the display device 100 may be an OLED (Organic Light-Emitting Diode, or Organic Electroluminescence Display, organic light-emitting semiconductor) display device, a QLED (Quantum Dot Light Emitting Diodes, quantum dot electroluminescent diode) display device, an MLED (Mini Light Emitting Diodes, or Micro Light Emitting Diodes, micro light-emitting diode) display device, etc. From the perspective of the form of the display device 100, the display device 100 may be a flat display device, a curved display device, or a foldable display device, etc. From the perspective of the shape of the display device 100, the display device 100 may be rectangular or circular, etc. There is no limitation on this, and an adaptive design may be performed according to actual needs.

[0051] Exemplarily, the display device 100 may further include a frame and other electronic components, and the display panel 10 may be disposed in the frame, for example. The circuit board 20 is configured to send a drive signal, for example, a display drive signal and / or a touch drive signal, to the display panel 10. The display panel 10 displays an image and / or implements a touch operation under the drive of the circuit board 20.

[0052] Exemplarily, the circuit board 20 includes but is not limited to a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit).

[0053] In some embodiments, Figure 2 As shown, the display panel 10 has a display area AA (Active Area), and the display panel 10 includes a plurality of pixels disposed in the display area AA, and each pixel includes at least three sub-pixels P. A sub-pixel is the smallest light-emitting unit on the display panel 10, and the sub-pixel is used to display an image.

[0054] It should be noted that each pixel includes at least three sub-pixels, that is, each pixel may include three, four or more sub-pixels, and the multiple sub-pixels included in each pixel may be a row, a column or a group of sub-pixels, and a group of sub-pixels may be multiple sub-pixels adjacent to each other, and the adjacent multiple sub-pixels are arranged in a row, a column, an L-shape, a rectangle or a diamond, etc. The multiple sub-pixels P may be arranged in multiple rows and columns. At the same time, the luminous areas of the multiple sub-pixels included in each pixel may be the same or different.

[0055] The above is only an exemplary description and is not intended to limit the present disclosure. Adaptive design can be performed according to actual needs.

[0056] In some examples, multiple sub-pixels P emit light of the same color, and the display panel 10 may further include a color filter layer disposed on the light-emitting side of the multiple sub-pixels P, that is, the display panel 10 adopts a COE (CF On Encapsulation) structure.

[0057] For example, multiple sub-pixels P emit white light, red light, green light, blue light or other color light. In this case, the color light emitted by the sub-pixel P remains the same color light after passing through the color filter layer, or is converted into other color light for emission. Therefore, when multiple sub-pixels P emit the same color light, the display panel 10 can achieve multi-color light output.

[0058] In other examples, multiple sub-pixels P emit light of different colors. For example, multiple sub-pixels P include red sub-pixels that emit red light, green sub-pixels that emit green light, and blue sub-pixels that emit blue light, thereby realizing multi-color light output of the display panel 10.

[0059] In some embodiments, Figure 3 As shown, the display panel 10 includes: a substrate 1 and a plurality of pixel circuits arranged on the substrate 1, one pixel circuit is connected to one sub-pixel P, and the pixel circuit is configured to drive the sub-pixel P connected thereto to emit light.

[0060] Exemplarily, the substrate 1 may be a single-layer substrate including a layer of substrate material, or a composite substrate including at least two layers of substrate material stacked together; the substrate material may be a rigid material or a flexible material.

[0061] Rigid substrate materials include but are not limited to rigid glass, quartz or plastic, etc., and flexible substrate materials include but are not limited to flexible glass, FPC, PI base film (Polyimide), PC (Polycarbonate) or PVC (Polyvinyl Chloride) and the like.

[0062] Accordingly, the substrate 1 may be a rigid substrate or a flexible substrate. The rigid substrate may include one or more layers of rigid substrate material, or may include at least one layer of rigid substrate material and at least one layer of flexible substrate material stacked together.

[0063] It should be noted that the material selection of the substrate 1 is related to the specific design of the display panel 10 and can be selected according to actual needs. It is only used as an exemplary description here and is not intended to limit the present disclosure.

[0064] In some embodiments, Figure 3 As shown, the display panel 10 includes: a conductive stack 4 and at least one source-drain conductive layer SD disposed on a substrate 1, wherein the source-drain conductive layer SD is located on a side of the conductive stack 4 away from the substrate 1. The conductive stack 4 includes a semiconductor layer B and at least one gate conductive layer sequentially disposed in a direction away from the substrate 1. The conductive stack 4 and the at least one source-drain conductive layer SD can be collectively referred to as functional film layers in the display panel 10, each of which has a set conductive pattern, and adjacent functional film layers are spaced apart by an insulating film layer structure.

[0065] In some embodiments, Figure 3 As shown, the pixel circuit includes a thin film transistor T and a capacitor, and the thin film transistor T includes an active layer T1, a source electrode T2, a drain electrode T3 and a gate electrode T4.

[0066] Exemplarily, the semiconductor layer B includes an active layer pattern T1, and the active layer pattern T1 includes a source region, a drain region, and a channel region of each transistor TFT. In some examples, the thin film transistor TFT may be a low-temperature polysilicon thin film transistor, that is, the semiconductor layer B uses low-temperature polysilicon. In other examples, the thin film transistor TFT may also be an oxide thin film transistor, that is, the semiconductor layer B uses a metal oxide, such as indium gallium zinc oxide or indium gallium tin oxide.

[0067] like Figure 3 As shown, the active layer pattern T1 is located in the semiconductor layer B, and the gate T4 is located in a gate conductive layer (eg Figure 3 The source electrode T2 and the drain electrode T3 are located in a source-drain conductive layer SD (eg, Figure 3 In the first source-drain conductive layer SD1) shown in FIG.

[0068] In some embodiments, Figure 3 As shown, at least one gate conductive layer includes a first gate conductive layer 41 and a second gate conductive layer 42 sequentially arranged in a direction away from the substrate 1. Figure 3 As shown, the first gate conductive layer 41 includes a first gate conductive pattern, which overlaps with the orthographic projection of the channel region of the active layer pattern T1 on the substrate 1, and the overlapping portion of the first gate conductive pattern and the channel region of the active layer pattern T1 serves as the gate of each transistor TFT.

[0069] like Figure 3 As shown, the first gate conductive pattern also includes a first plate C1 of a capacitor C of each pixel circuit, the second gate conductive layer 42 includes a second gate conductive pattern, the second gate conductive pattern includes a second plate C2 of a capacitor C of each pixel circuit, and the first plate C1 and the second plate C2 overlap to form a capacitor.

[0070] In some embodiments, Figure 3 As shown, the display panel 10 further includes: an inorganic stack 2 and at least one flat layer PLN disposed on the substrate 1, wherein the flat layer PLN is located on a side of the inorganic stack 2 away from the substrate 1. The inorganic stack 2 at least covers the display area AA. The inorganic stack 2 includes a plurality of inorganic layers stacked on the substrate 1, wherein the plurality of inorganic layers includes a first sub-stack 21, and the first sub-stack 21 includes at least one gate insulating layer GI (Gate Insulator) and at least one interlayer dielectric layer IDL (Interlayer dielectric layer) stacked.

[0071] For example, Figure 3 As shown, the planar layer PLN is located on a side of the first sub-layer stack 21 away from the substrate 1 .

[0072] The material of the planarization layer PLN (eg, the first planarization layer PLN1 and the second planarization layer PLN2 ) includes, but is not limited to, any one of polymers such as acrylate, epoxy, or polyurethane.

[0073] The planarization layer PLN can be formed by processes such as inkjet printing (IJP, Ink-Jet Printing), screen printing, flash evaporation, PECVD (Plasma Enhanced Chemical Vapor Deposition) or PEALD (Plasma Enhanced Atomic Layer Deposition).

[0074] This is only an exemplary description and is not intended to limit the present disclosure.

[0075] Exemplarily, both the gate insulating layer GI and the interlayer dielectric layer IDL include insulating inorganic materials.

[0076] The materials of the gate insulating layer GI and the interlayer dielectric layer IDL include but are not limited to any one of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), aluminum oxide (Al2O3) and titanium oxide (TiO2). The interlayer dielectric layer IDL can be formed by CVD (Chemical Vapor Deposition), ALD (Atomic Layer Deposition) or sputtering process.

[0077] This is only an exemplary description and the present disclosure is not limited thereto.

[0078] Exemplarily, the semiconductor layer B is adjacent to a gate conductive layer, and a gate insulating layer GI is disposed between the adjacent semiconductor layer B and the gate conductive layer. When the display panel 10 includes two or more gate conductive layers, a gate insulating layer GI is disposed between adjacent gate conductive layers.

[0079] Exemplarily, the source-drain conductive layer SD is located on a side of the gate conductive layer away from the substrate 1 , and an interlayer dielectric layer IDL is disposed between adjacent source-drain conductive layers SD and gate conductive layers.

[0080] Exemplarily, a flat layer PLN is disposed adjacent to a side of each source / drain conductive layer SD away from the substrate 1. Figure 3 As shown, the display panel 10 includes a first source-drain conductive layer SD1 and a second source-drain conductive layer SD2 sequentially arranged in a direction away from the substrate 1, and a flat layer PLN (eg Figure 3 The first planar layer PLN1 shown in FIG. 1 is provided with a planar layer PLN (eg, Figure 3 The second flat layer PLN2 shown in FIG.

[0081] Exemplarily, the planarization layer PLN includes an insulating organic material.

[0082] In some embodiments, Figure 3 As shown, the display panel 10 further includes a light emitting structure layer 5 disposed on a side of the source-drain conductive layer SD away from the substrate 1. The light emitting structure layer 5 includes a plurality of light emitting structures 5a, and the light emitting structure layer 5 includes a first electrode layer 51, a light emitting functional layer EL, a second electrode layer 53, a pixel defining layer 54, a spacer layer 55 and an encapsulation structure 56.

[0083] The pixel defining layer 54 is arranged on the side of the first electrode layer 51 away from the substrate 1. The first electrode layer 51 includes multiple first electrodes. Multiple opening areas are arranged in the pixel defining layer 54. Each opening area exposes at least a portion of a first electrode, and each light-emitting structure 5a is arranged in an opening area.

[0084] The first electrode layer 51 may be an anode layer, and correspondingly, the second electrode layer 53 may be a cathode layer. Alternatively, the first electrode layer 51 may be a cathode layer, and correspondingly, the second electrode layer 53 may be an anode layer. The material of the first electrode layer 51 may include, but is not limited to, at least one of ITO (Indium tin oxide), IZO (Indium zinc oxide), Au, Ag, Pt, Al, Li, Mg, Ca, and In. The material of the second electrode layer 53 may include, but is not limited to, at least one of ITO, IZO, Au, Ag, Pt, Al, Li, Mg, Ca, and In.

[0085] The first electrode layer 51 and the second electrode layer 53 may be formed by evaporation, sputtering or ALD.

[0086] In the display area AA, the contour line of each opening area of ​​the pixel defining layer 54 is within one first electrode. The light-emitting functional layer EL is arranged on the side of the first electrode layer 51 away from the substrate 1, and the light-emitting functional layer EL includes a plurality of light-emitting portions 52, each of which is located in one opening area. The spacer layer 55 is arranged between the pixel defining layer 54 and the light-emitting functional layer EL.

[0087] The light-emitting functional layer EL only includes a light-emitting layer; or, the light-emitting functional layer 51 also includes at least one of an electron transport layer (ETL, Election Transporting Layer), an electron injection layer (EIL, Election Injection Layer), a hole transport layer (HTL, Hole Transporting Layer) and a hole injection layer (HIL, Hole Injection Layer).

[0088] Exemplarily, the light emitting functional layer EL may be formed by evaporation or inkjet printing process.

[0089] This is only an exemplary description and is not intended to limit the present disclosure.

[0090] Illustratively, the spacer layer 55 may include ball spacers (BS) and / or post spacers (PS).

[0091] In some embodiments, Figure 3 As shown, the display panel 10 includes: a plurality of pixel circuits and a plurality of light emitting structures 5a. Exemplarily, each sub-pixel P includes a light emitting structure 5a, each pixel circuit is connected to a light emitting structure 5a, and the pixel circuit is configured to drive the light emitting structure 5a connected thereto to emit light.

[0092] In a sub-pixel P, the first electrode of the light emitting structure 5a is electrically connected to a source T2 or a drain T3 of a thin film transistor among a plurality of thin film transistors T included in the pixel circuit. Figure 3 In the figure, the first electrode is electrically connected to the source T2 of the thin film transistor T. It should be noted that the source T2 and the drain T3 can be interchangeable. Figure 3 T2 in the figure represents the drain. Figure 3 T3 in represents the source. In some examples, such as Figure 3As shown, the source T2 or the drain T3 of the thin film transistor is electrically connected to the first electrode through the switching electrode Z located in the second source-drain conductive layer SD2.

[0093] In some embodiments, the packaging structure 56 is a single-layer structure, such as Figure 3 As shown, the encapsulation structure 56 includes a first inorganic encapsulation structure 221, and the first inorganic encapsulation structure 221 at least covers the display area AA. The first inorganic encapsulation structure 221 at least covers the light-emitting portions 52 of the plurality of light-emitting structures 5a, and the orthographic projections of the plurality of light-emitting portions 52 on the substrate 1 fall within the range of the orthographic projections of the first inorganic encapsulation structure 221 on the substrate 1.

[0094] By providing the first inorganic packaging structure 221 , water and oxygen can be isolated and external water vapor can be prevented from entering, thereby improving the packaging effect of the packaging structure 56 .

[0095] In other embodiments, Figure 3 As shown, the encapsulation structure 56 is a stacked structure, and the encapsulation structure 56 also includes an organic encapsulation structure 8 and a second inorganic encapsulation structure 222, and the organic encapsulation structure 8 is located between the first inorganic encapsulation structure 221 and the second inorganic encapsulation structure 222. The organic encapsulation structure 8 at least covers the display area AA, and the second inorganic encapsulation structure 222 at least covers the organic encapsulation structure 8. The orthographic projection of the second inorganic encapsulation structure 222 on the substrate 1 includes the orthographic projection of the organic encapsulation structure 8 on the substrate 1.

[0096] By providing the first inorganic encapsulation structure 221 and the second inorganic encapsulation structure 222 , water and oxygen are effectively isolated and external water vapor is prevented from entering, thereby improving the encapsulation effect of the encapsulation structure 56 .

[0097] The organic packaging structure 8 can not only serve as a packaging layer for the light emitting structure 5a, but also as a stress release layer to release stress between inorganic packaging structures (for example, between the first inorganic packaging structure 221 and the second inorganic packaging structure 222), thereby preventing the packaging structure 56 from producing cracks and other defects under the action of stress.

[0098] For example, the first inorganic encapsulation structure 221 may adopt a single-layer structure or a stacked-layer structure. The first inorganic encapsulation structure 221 includes, but is not limited to, any one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide.

[0099] This is only an exemplary description and the present disclosure is not limited thereto.

[0100] It can be understood that when the first inorganic encapsulation structure 221 is a stacked structure, the first inorganic encapsulation structure 221 can be a stacked aluminum oxide, silicon nitride and aluminum oxide film layer structure; or, the first inorganic encapsulation structure 221 can be a stacked titanium oxide, silicon nitride oxide and titanium oxide film layer structure.

[0101] Exemplarily, the first inorganic encapsulation structure 221 may be formed by using a PECVD, PEALD or sputtering process.

[0102] This is only an exemplary description and is not intended to limit the present disclosure.

[0103] For example, the second inorganic encapsulation structure 222 may adopt a single-layer structure or a stacked-layer structure. The material of the second inorganic encapsulation structure 222 includes, but is not limited to, any one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide.

[0104] This is only an exemplary description and the present disclosure is not limited thereto.

[0105] It can be understood that when the second inorganic packaging structure 222 adopts a stacked structure design, the second inorganic packaging structure 222 can be a stacked aluminum oxide, silicon nitride and aluminum oxide film layer structure; the second inorganic packaging structure 222 can also be a stacked titanium oxide, silicon nitride oxide and titanium oxide film layer structure.

[0106] By way of example, the second inorganic encapsulation structure 222 may be formed by using a PECVD, PEALD or sputtering process.

[0107] Exemplarily, the material of the organic encapsulation structure 8 may be at least one of acrylate, epoxy or polyurethane polymers, etc. The organic encapsulation structure 8 may be formed by inkjet printing, screen printing, flash evaporation, PECVD or PEALD, etc.

[0108] The material of the organic encapsulation structure 8 may also be at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin. The organic encapsulation structure 8 may be formed by an exposure and development process. By forming the organic encapsulation structure 8 by an exposure and development process, the boundary position of the organic encapsulation structure 8 may be more accurately controlled, so that the boundary position of the formed organic encapsulation structure 8 is more accurate.

[0109] This is merely an exemplary description, and the material selection and specific structure of the packaging structure 56 can be adaptively designed according to actual needs, and the present disclosure does not limit this.

[0110] In some embodiments, Figure 3 As shown, the inorganic stack 2 further includes a second sub-stack 22 , which is located on a side of the first sub-stack 21 away from the substrate 1 , and the second sub-stack 22 at least covers the display area AA.

[0111] The second sub-laminate 22 at least includes a first inorganic encapsulation structure 221 ; or, the second sub-laminate 22 includes a first inorganic encapsulation structure 221 and a second inorganic encapsulation structure 222 which are stacked.

[0112] Exemplarily, the planar layer PLN is located between the first sub-layer stack 21 and the second sub-layer stack 22 .

[0113] Figure 4 FIG. 1 is a planar structural diagram of a display panel 10 of some embodiments. In order to clearly show the positional relationship between the inorganic stack and the opening H, Figure 4 Only the inorganic stack 2 is shown, and the display panel 10 also has other film layer structures. Figure 5 is a partial cross-sectional structural diagram of a display panel during the preparation process of some embodiments, Figure 6 Based on Figure 5 The partial cross-sectional structure diagram of the display panel after the film layer structure in the area defined by the opening H is removed is shown.

[0114] In some embodiments, the display device 100 may further include a sensor module, such as an under-screen camera and an under-screen fingerprint recognition sensor, so that the display device 100 can realize a variety of different functions such as taking pictures, recording videos, fingerprint recognition or facial recognition. This is only an exemplary description of some possible implementations of the present disclosure, and there is no limitation on the type of sensor module, which can be adaptively designed according to actual needs.

[0115] For example, Figure 4 As shown, the display panel 10 is provided with an opening H, and a sensor module is arranged in the opening H. The sensor module includes but is not limited to a camera module. In the display panel 10, the opening H can be a blind hole or a through hole. That is, the portion of the substrate 1 corresponding to the area defined by the opening H can be partially removed, or completely removed.

[0116] The display panel 10 has a display area AA and a transition area TA. The display area AA surrounds the transition area TA, and the transition area TA surrounds the opening H.

[0117] In some examples, there is no film structure in the area defined by the opening H. In the process of manufacturing the display panel 10, various functional film layers (such as Figure 3 The source-drain conductive layer SD and the conductive stack 4 shown in FIG. 4 and the interlayer insulating layer (eg Figure 3 Then, the film layer structures such as the inorganic stack 2 and the planar layer PLN shown in the figure are removed, and then the parts of the film layer structures on the substrate 1 located in the area defined by the opening H are removed.

[0118] like Figure 5As shown, the initial inorganic stack 2' may be formed first, and then the portion of the initial inorganic stack 2' located in the area defined by the opening H is removed to obtain the inorganic stack 2'. The initial inorganic stack 2' includes an initial first sub-stack 21' and an initial second sub-stack 22'. The initial first sub-stack 21' and the initial second sub-stack 22' both cover the entire substrate 1, and the initial first sub-stack 21' and the initial second sub-stack 22' are located in the display area AA, and are located in the transition area GA and the area defined by the opening H.

[0119] The thickness h1 of the portion of the initial first sub-layer 21' located in the display area AA is the same as or substantially the same as the thickness h2 of the portion of the initial first sub-layer 21' located in the area defined by the opening H; and the thickness h1 of the portion of the initial first sub-layer 21' located in the display area AA is the same as or substantially the same as the thickness h2 of the portion of the initial first sub-layer 21' located in the transition area TA.

[0120] The thickness h3 of the portion of the initial second sub-layer 22' located in the display area AA is the same as or substantially the same as the thickness h4 of the portion of the initial second sub-layer 22' located in the area defined by the opening H; and the thickness h3 of the portion of the initial second sub-layer 22' located in the display area AA is the same as or substantially the same as the thickness h2 of the portion of the initial second sub-layer 22' located in the transition area TA.

[0121] like Figure 5 and Figure 6 As shown, when the film layer structure in the area defined by the opening H is removed, the film layer structure composed of inorganic materials (such as the initial inorganic stack 2') is prone to cracks when subjected to stress. When the cracks extend to the display area AA, the display panel 10 may experience defects such as GDSH (Growing dark spot at hole), resulting in abnormal display of the display panel 10 and reducing the display quality of the display panel 10.

[0122] Based on this, an embodiment of the present disclosure provides a display panel 10 .

[0123] In some embodiments, Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, the display panel 10 includes: an inorganic stack 2 and an isolation barrier 3, wherein the isolation barrier 3 is located in the transition area TA. The isolation barrier 3 surrounds the opening H and is spaced apart from the boundary of the opening H. The inorganic stack 2 includes multiple inorganic layers stacked on the substrate 1, and the inorganic stack 2 at least covers the display area AA.

[0124] For example, Figure 7 , Figure 8 , Fig. 9 and Fig.10As shown, part of the first sub-layer 21 of the inorganic layer stack 2 forms the isolation barrier 3 .

[0125] In some examples, such as Figure 7 , Figure 8 and Fig. 9 As shown, the inorganic stack 2 is also located in the spacing area GA between the isolation barrier 3 and the boundary of the opening H, and the thickness of the inorganic stack 2 located in the display area AA (eg Figure 7 , Figure 8 and Fig. 9 d1+d3) is greater than the thickness of the inorganic stack 2 in the spacing region GA (e.g. Figure 7 , Figure 8 and Fig. 9 That is, during the preparation of the display panel 10, see Figure 5 , Figure 7 , Figure 8 and Fig. 9 , a portion of the initial inorganic stack 2 ′ located in the spacing area GA is thinned and removed to reduce the thickness of the portion of the inorganic stack 2 located in the spacing area GA.

[0126] In other examples, such as Fig.10 As shown, the inorganic stack 2 does not overlap with the spacing area GA. That is, during the preparation process of the display panel 10, see Figure 5 and Fig.10 , the portion of the initial inorganic stack 2 ′ located in the spacing area GA is completely removed, that is, there is no inorganic stack 2 in the spacing area GA.

[0127] In the process of manufacturing the display panel 10, see Figure 5 , the thickness of the formed initial inorganic stack 2' at each position on the substrate 1 is substantially the same, the thickness of the initial inorganic stack 2' located in the display area AA is h1+h3, the thickness of the initial inorganic stack 2' located in the spacing area GA and the area defined by the opening H is h2+h4, and h1+h3=h2+h4. After the initial inorganic stack 2' is formed, and when the film structure in the area defined by the opening H is removed, the portion of the initial inorganic stack 2' located in the area defined by the opening K and in the spacing area GA can be thinned first, and the portion of the initial inorganic stack 2' located in the area defined by the opening K and in the spacing area GA can be completely or partially removed.

[0128] Exemplarily, the substrate 1 and the film layer structure on the substrate 1 are removed in the area defined by the opening H by using a cutting process. In this way, when removing the film layer structure in the area defined by the opening H, since the initial inorganic stack 2' in the spacing area GA in and around the area defined by the opening H has been thinned or removed, the risk of cracks in the inorganic material layer (for example, the inorganic stack 2) when removing the film layer structure in the area defined by the opening H can be reduced, thereby reducing the risk of cracks spreading along the inorganic stack 2 to the display area AA, thereby improving the manufacturing yield of the display panel 10.

[0129] In some embodiments, Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, the inorganic stack 2 includes a first sub-stack 21 and a second sub-stack 22. The thickness of the first sub-stack 21 located in the display area AA is d1, and the thickness of the first sub-stack 21 located in the gap area GA is d2; the thickness of the second sub-stack 22 located in the display area AA is d3, and the thickness of the second sub-stack 22 located in the gap area GA is d4; the thickness of the inorganic stack 2 located in the display area AA is d1+d3, and the thickness of the inorganic stack 2 located in the gap area GA is d2+d4, and d1+d3>d2+d4.

[0130] For example, Figure 8 , Fig. 9 , Fig.10 and Fig.11 As shown, the first sub-stack 21 includes at least one gate insulating layer GI and at least one interlayer dielectric layer IDL (Interlayer dielectric layer) stacked. The first sub-stack 21 at least covers the display area AA. The first sub-stack 21 is also located in the spacing area GA, and the thickness d1 of the portion of the first sub-stack 21 located in the display area AA is greater than the thickness d2 of the portion of the first sub-stack 21 located in the spacing area GA; or, the first sub-stack 21 does not overlap with the spacing area GA.

[0131] See also Figure 5 , Figure 8 , Fig. 9 and Fig.11 In the process of preparing the display panel 10, the portion of the initial first sub-layer 21' located in the area defined by the spacing area GA and the opening H may be thinned and partially removed to reduce the thickness of the portion of the initial first sub-layer 21' located in the area defined by the spacing area GA and the opening H, so that the thickness d1 of the portion of the formed first sub-layer 21 located in the display area AA is greater than the thickness d2 of the portion of the first sub-layer 21 located in the spacing area GA.

[0132] See also Figure 5 and Fig.10 During the preparation of the display panel 10, the initial first sub-layer 21' located in the area defined by the spacing area GA and the opening H can also be completely removed, so that the formed first sub-layer 21 does not overlap with the spacing area GA and the area defined by the opening H.

[0133] By reducing the thickness of the first sub-layer 21 located in the cutting area and the periphery of the cutting area (the area defined by the opening H and the spacing area GA), the thickness of the inorganic stack 2 located in the cutting area and the periphery of the cutting area is reduced, thereby reducing the risk of cracks in the inorganic stack 2 when removing the film layer structure of the substrate 1 located in the cutting area. The risk of cracks in the inorganic stack 2 extending to the display area AA and causing defects such as GDSH is reduced, thereby improving the production yield of the display panel 10.

[0134] For example, Figure 7 , Fig. 9 , Fig.10 and Fig.11 As shown, the second sub-laminate 22 includes a first inorganic encapsulation structure 221 and a second inorganic encapsulation structure 222 stacked. The second sub-laminate 22 at least covers the display area AA. The second sub-laminate 22 is also located in the spacing area GA, and the thickness d3 of the portion of the second sub-laminate 22 located in the display area AA is greater than the thickness d4 of the portion of the second sub-laminate 22 located in the spacing area GA; or, the second sub-laminate 22 does not overlap with the spacing area GA.

[0135] See also Figure 5 , Figure 7 , Figure 8 and Fig.11 During the preparation process of the display panel 10, the portion of the initial second sub-layer 22' located in the area defined by the spacing area GA and the opening H may be thinned and partially removed to reduce the thickness of the portion of the initial second sub-layer 22' located in the area defined by the spacing area GA and the opening H, so that the thickness d2 of the portion of the formed second sub-layer 22 located in the display area AA is greater than the thickness d4 of the portion of the second sub-layer 22 located in the spacing area GA.

[0136] See also Figure 5 and Fig.10 During the preparation of the display panel 10, the initial second sub-layer 22' located in the area defined by the spacing area GA and the opening H can also be completely removed, so that the formed second sub-layer 22 does not overlap with the spacing area GA and the area defined by the opening H.

[0137] By reducing the thickness of the second sub-layer 22 located in the cutting area and the periphery of the cutting area (the area defined by the opening H and the spacing area GA), the thickness of the inorganic stack 2 located in the cutting area and the periphery of the cutting area is reduced, thereby reducing the risk of cracks in the inorganic stack 2 when removing the film layer structure of the substrate 1 located in the cutting area. This reduces the risk of cracks in the inorganic stack 2 extending into the display area AA and causing defects such as GDSH, thereby improving the production yield of the display panel 10.

[0138] During the manufacturing process of the display panel 10, the first sub-layer 21 and the second sub-layer 22 are formed in steps, and the step of forming the first sub-layer 21 is before forming the second sub-layer 22. Therefore, during the manufacturing process of the display panel 10, during the manufacturing process of the first sub-layer 21 and the second sub-layer 22, at least one of the first sub-layer 21 and the second sub-layer 22 may be thinned.

[0139] Exemplarily, d1≥d2, d1>0, d2≥0; and / or, d3≥d4, d3>0, d4≥0. Moreover, when d1=d2, d3≠d4; when d3=d4, d1≠d2. When d2=0, the first sub-laminate 21 does not overlap with the spacing area GA, and when d4=0, the second sub-laminate 22 does not overlap with the spacing area GA.

[0140] In the display panel 10, only the first sub-layer 21 may be thinned, in which case d1>d2, and d3=d4. The first sub-layer 21 may be thinned by completely or partially removing the portion of the initial first sub-layer 21' located in the spacing area GA; when a portion of the portion of the initial first sub-layer 21' located in the spacing area GA is removed, d2>0; when the portion of the initial first sub-layer 21' located in the spacing area GA is completely removed, the first sub-layer 21 does not overlap with the spacing area GA, that is, d2=0.

[0141] Of course, only the second sub-stack 22 may be thinned, in which case d3>d4 and d1=d2. The second sub-stack 22 may be thinned by completely or partially removing the portion of the initial second sub-stack 22' located in the spacing area GA; in the case of partially removing the portion of the initial second sub-stack 22' located in the spacing area GA, d4>0; in the case of completely removing the portion of the initial second sub-stack 22' located in the spacing area GA, the second sub-stack 22 does not overlap with the spacing area GA, that is, d4=0.

[0142] In addition, both the first sub-stack 21 and the second sub-stack 22 may be thinned, in which case d1>d2, and d3>d4. As mentioned above, the thinning process for the first sub-stack 21 may be to completely or partially remove the portion of the initial first sub-stack 21' located in the spacing area GA, d2=0 or d2>0. The thinning process for the second sub-stack 22 may be to completely or partially remove the portion of the initial second sub-stack 22' located in the spacing area GA, d4=0 or d4>0.

[0143] After forming the initial first sub-layer 21', the portion of the first sub-layer 21' located in the area defined by the opening K and the portion located in the spacing area GA can be thinned, and the portion of the first sub-layer 21' located in the area defined by the opening K and the portion located in the spacing area GA can be completely or partially removed, thereby reducing the risk of cracks in the inorganic material layer (for example, the inorganic stack 2) when cutting the opening H area, and further reducing the risk of cracks in the inorganic material layer extending to the display area AA, effectively improving the production yield of the display panel 10 and avoiding the GDSH problem of the display panel 10.

[0144] In some embodiments, Figure 8 , Fig. 9 and Fig.11 As shown, the first sub-layer 21 includes a first portion 211 located in the spacing area GA, and the isolation barrier 3 forms a step with the first portion 211. The display panel 10 also includes a first protective portion F1, which covers the sidewall of the isolation barrier 3 forming the step. The first protective portion F1 includes an organic material.

[0145] Exemplarily, when the display panel 10 includes one or more flat layers PLN, the first guard portion F1 may be located in one flat layer PLN. When the display panel 10 includes multiple (two or more) flat layers PLN, the first guard portion F1 may also include a plurality of stacked sub-guard portions, each of which is located in one flat layer PLN, and two adjacent sub-guard portions are in contact.

[0146] In this way, there is no need to set up a film layer structure for preparing the first protective part F1, which does not increase the preparation cost of the display panel 10. The first protective part F1 can be formed simultaneously with the formation of the flat layer PLN, without adding additional preparation steps of the display panel 10.

[0147] Of course, the first protection portion F1 may also be located in other organic material film layers of the display panel 10 . For example, the first protection portion F1 may also be located in the pixel defining layer 54 or the spacer layer 55 .

[0148] See also Figure 5 , Figure 8 , Fig. 9 and Fig.11 , by covering the side wall of the step difference formed between the isolation retaining wall 3 and the first part 211 of the first sub-layer 21 with a first protective portion F1 formed of organic material, when the portion of the initial first sub-layer 21' located in the area defined by the opening H is removed, even if a crack appears in the first sub-layer 21, in the process of the crack extending along the cutting boundary (the boundary of the first sub-layer 21 close to the opening H) to the display area AA, when the crack extends to the first protective portion F1, the first protective portion F1 formed of organic material can play the role of a stress release structure, and the stress in the first sub-layer 21 is transferred to the first protective portion F1 through the crack and released, and the extension path of the crack is blocked and cut off by the first protective portion F1, so that the crack will not extend to the display area AA, thereby playing a role in crack prevention, and avoiding the problem of poor display caused by the crack generated in the first sub-layer 21 extending to the display area AA.

[0149] In some embodiments, Figure 8 , Fig. 9 and Fig.10 As shown, one end of the first protection portion F1 overlaps the side of the isolation barrier 3 away from the substrate 1 .

[0150] By increasing the coverage area of ​​the first protective portion F1 on the portion of the isolation retaining wall 3 close to the opening H, the first protective portion F1 can better block and cut off the extension of cracks in the first sub-layer 21, so that the cracks will not extend to the display area AA, thereby better preventing cracks and avoiding the problem of poor display caused by the cracks generated in the first sub-layer 21 extending to the display area AA.

[0151] In some embodiments, Fig.11 As shown, the display panel 10 further includes: a first cap layer M1 disposed on the side of the isolation barrier 3 away from the substrate 1. One end of the first cap layer M1 extends to the side of the isolation barrier 3 close to the opening H, forms an undercut structure with the side wall of the isolation barrier 3, and abuts against the first protective portion F1.

[0152] The undercut structure formed between the first cap layer M1 and the side wall of the isolation retaining wall 3 is formed by extending one end of the first cap layer M1 abutting against the first protection part F1 to a certain distance in the direction away from the isolation retaining wall 3. Fig.11 A “house eaves” structure is formed at one end where the first cap layer M1 and the first protective part F1 abut against each other, and the end of the first cap layer M1 on the side where the first protective part F1 abuts against each other is farther away from the isolation retaining wall 3 than the first protective part F1.

[0153] Exemplarily, when the display panel 10 includes one or more source-drain conductive layers SD, the first cap layer M1 may be located in one source-drain conductive layer SD. When the display panel 10 includes multiple (two or more) source-drain conductive layers SD, the first cap layer M1 may also include a plurality of stacked sub-cap layers, each of which is located in one source-drain conductive layer SD, and two adjacent sub-cap layers are in contact.

[0154] In the case where the first cap layer M1 includes multiple sub-cap layers, compared with the first cap layer M1 being located in a source-drain conductive layer SD, the first cap layer M1 is thicker, and the distance between the surface of the first cap layer M1 away from the substrate 1 and the first protective portion F1 is farther, when the light-emitting layer EL is subsequently formed, it is more conducive to the light-emitting layer EL being disconnected at the bottom cut structure formed by the first cap layer M1 and the side wall of the isolation barrier 3.

[0155] like Fig.11 As shown, by setting the first protective part F1, it can not only prevent cracks but also support the first cap layer M1. In this way, when the first cap layer M1 is formed, one end of the first cap layer M1 abuts against the first protective part F1, which is more conducive to forming an undercut structure between the first cap layer M1 and the side wall of the isolation retaining wall 3.

[0156] See also Figure 5 , the source-drain conductive layer SD is located on the side of the first sub-layer stack 21 away from the substrate 1, and the light-emitting layer EL is located on the side of the source-drain conductive layer SD away from the substrate 1. Therefore, in the process of manufacturing the display panel 10, by arranging the first cap layer M1 on the top of the isolation barrier wall 3, the first cap layer M1 and the side wall of the isolation barrier wall 3 form an undercut structure, and the light-emitting layer EL is formed by, for example, an evaporation process. In this way, when the light-emitting layer EL is formed, the light-emitting layer EL can be naturally disconnected at the undercut structure formed by the first cap layer M1 and the side wall of the isolation barrier wall 3.

[0157] In the process of water vapor spreading from the opening H along the light-emitting layer EL to the display area AA, since the light-emitting layer EL is disconnected at the bottom cut structure formed by the first cap layer M1 and the side wall of the isolation retaining wall 3, the path for the water vapor to spread is cut off. Therefore, the water vapor cannot continue to spread to the display area AA, thereby avoiding display abnormalities in the display panel 10 and improving the manufacturing yield of the display panel 10.

[0158] In some embodiments, Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11As shown, the first sub-stack 21 includes a second portion 212 located on the side of the isolation retaining wall 3 away from the opening H, and a groove is formed between the second portion 212 and the isolation retaining wall 3, and the groove surrounds the opening H. The display panel 10 also includes: a second protective portion F2 provided on the side wall of the groove away from the opening H, and a second cap layer M2 provided on the side of the second portion 212 away from the substrate 1. The second protective portion F2 includes an organic material. One end of the second cap layer M2 extends to the top of the groove, forms an undercut structure with the side wall of the groove, and abuts against the second protective portion F2.

[0159] The undercut structure formed between the second cap layer M2 and the side wall of the groove is formed by the end of the second cap layer M2 abutting against the second protection part F2 extending a certain distance toward the direction of the second protection part F2 close to the opening H. Fig.11 An "eaves"-like structure is formed at one end where the second cap layer M2 and the second protective part F2 abut against each other, and the end of the second cap layer M2 close to the opening H is closer to the opening H than the second protective part F2.

[0160] Exemplarily, when the display panel 10 includes one or more flat layers PLN, the second guard portion F2 may be located in one flat layer PLN. When the display panel 10 includes multiple (two or more) flat layers PLN, the second guard portion F2 may also include a plurality of stacked sub-guard portions, each of which is located in one flat layer PLN, and two adjacent sub-guard portions are in contact.

[0161] In this way, there is no need to set up a film layer structure for preparing the second protective part F2, which will not increase the manufacturing cost of the display panel 10. The second protective part F2 can be formed simultaneously with the formation of the flat layer PLN, without adding additional manufacturing steps of the display panel 10.

[0162] Of course, the second protection portion F2 may also be located in other organic material film layers of the display panel 10 . For example, the second protection portion F2 may also be located in the pixel defining layer 54 or the spacer layer 55 .

[0163] By covering the side wall of the groove far away from the opening H with a second protective portion F2 formed by organic material, when the portion of the initial first sub-layer 21' located in the area defined by the opening H is removed, even if a crack appears in the first sub-layer 21, in the process of the crack extending along the cutting boundary (the boundary of the first sub-layer 21 close to the opening H) to the display area AA, when the crack extends to the second protective portion F2, the second protective portion F2 formed by the organic material can play the role of a stress release structure, and the stress in the first sub-layer 21 is transferred to the second protective portion F2 through the crack and released, and the extension path of the crack is blocked and cut off by the second protective portion F2, so that the crack will not extend to the display area AA, thereby playing a role in crack prevention, and avoiding the problem of poor display caused by the crack generated in the first sub-layer 21 extending to the display area AA.

[0164] Exemplarily, when the display panel 10 includes one or more source-drain conductive layers SD, the second cap layer M2 may be located in one source-drain conductive layer SD. When the display panel 10 includes multiple (two or more) source-drain conductive layers SD, the second cap layer M2 may also include a plurality of stacked sub-cap layers, each of which is located in one source-drain conductive layer SD, and two adjacent sub-cap layers are in contact.

[0165] In the case where the second cap layer M2 includes multiple sub-cap layers, compared with the second cap layer M2 being located in a source-drain conductive layer SD, the second cap layer M2 is thicker, and the distance between the surface of the second cap layer M2 away from the substrate 1 and the second protective portion F2 is farther, when the light-emitting layer EL is subsequently formed, it is more conducive to the light-emitting layer EL being disconnected at the bottom cut structure formed by the second cap layer M2 and the side wall of the groove.

[0166] like Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11 As shown, by providing the second protection part F2, it can not only prevent cracks, but also support the second cap layer M2. By providing the second protection part F2, when forming the second cap layer M2, it is easier for one end of the second cap layer M2 to abut against the second protection part F2, so that it is more conducive to forming an undercut structure between the second cap layer M2 and the side wall of the groove.

[0167] By setting a second cap layer M2 on a side of the second portion 212 of the first sub-layer 21 away from the substrate 1, the second cap layer M2 and the side wall of the groove form an undercut structure. During the preparation of the display panel 10, the light-emitting layer EL is formed by, for example, an evaporation process. In this way, when the light-emitting layer EL is formed, the light-emitting layer EL can be naturally disconnected at the undercut structure formed by the second cap layer M2 and the side wall of the groove.

[0168] In the process of water vapor diffusing from the opening H along the light-emitting layer EL to the display area AA, since the light-emitting layer EL is disconnected at the bottom cut structure formed by the second cap layer M2 and the side wall of the groove, the path for the water vapor to diffuse is cut off. Therefore, the water vapor cannot continue to diffuse to the display area AA, thereby avoiding display abnormalities in the display panel 10 and improving the manufacturing yield of the display panel 10.

[0169] In some embodiments, Fig.11 As shown, the display panel 10 further includes: a third protective portion F3 covering the side wall of the isolation retaining wall 3 away from the hole H, and a third cap layer M3 located on the side of the isolation retaining wall 3 away from the substrate 1. The third protective portion F3 includes an organic material. One end of the third cap layer M3 extends to the side of the isolation retaining wall 3 away from the hole H, forms an undercut structure with the side wall of the isolation retaining wall 3, and abuts against the third protective portion F3.

[0170] The undercut structure formed between the third cap layer M3 and the side wall of the isolation retaining wall 3 is formed by extending one end of the third cap layer M3 abutting against the third protection part F3 to a certain distance in the direction away from the isolation retaining wall 3. Fig.11 A "house eaves" structure is formed at one end where the third cap layer M3 and the third protective part F3 are abutted, and the end of the side where the third cap layer M3 and the third protective part F3 are abutted is farther away from the isolation retaining wall 3 than the second protective part F2.

[0171] For example, Fig.11 As shown, when the display panel 10 includes the first protective portion F1 and the third protective portion F3 , the first cap layer M1 and the third cap layer M3 may be the same cap layer.

[0172] Exemplarily, when the display panel 10 includes one or more flat layers PLN, the third guard portion F3 may be located in one flat layer PLN. When the display panel 10 includes multiple (two or more) flat layers PLN, the third guard portion F3 may also include a plurality of stacked sub-guard portions, each of which is located in one flat layer PLN, and two adjacent sub-guard portions are in contact.

[0173] In this way, there is no need to set up a film layer structure for preparing the third protection part F3, which will not increase the manufacturing cost of the display panel 10. The third protection part F3 can be formed simultaneously with the formation of the planar layer PLN, without adding additional manufacturing steps of the display panel 10.

[0174] Of course, the third protection portion F3 may also be located in other organic material film layers of the display panel 10 . For example, the third protection portion F3 may also be located in the pixel defining layer 54 or the spacer layer 55 .

[0175] By covering the side wall of the isolation retaining wall 3 far from the opening H with a third protective portion F3 formed of organic material, when the portion of the initial first sub-layer 21' located in the area defined by the opening H is removed, even if a crack appears in the first sub-layer 21, in the process of the crack extending along the cutting boundary (the boundary of the first sub-layer 21 close to the opening H) to the display area AA, when the crack extends to the third protective portion F3, the third protective portion F3 formed of organic material can play the role of a stress release structure, and the stress in the first sub-layer 21 is transferred to the third protective portion F3 through the crack and released, and the extension path of the crack is blocked and cut off by the third protective portion F3, so that the crack will not extend to the display area AA, thereby playing a role in crack prevention, and avoiding the problem of poor display caused by the crack generated in the first sub-layer 21 extending to the display area AA.

[0176] Exemplarily, when the display panel 10 includes one or more source-drain conductive layers SD, the third cap layer M3 may be located in one source-drain conductive layer SD. When the display panel 10 includes multiple (two or more) source-drain conductive layers SD, the third cap layer M3 may also include a plurality of stacked sub-cap layers, each sub-cap layer is located in one source-drain conductive layer SD, and two adjacent sub-cap layers are in contact.

[0177] In the case where the third cap layer M3 includes multiple sub-cap layers, compared with the third cap layer M3 being located in a source-drain conductive layer SD, the third cap layer M3 is thicker, and the distance between the surface of the third cap layer M3 away from the substrate 1 and the third protective portion F3 is farther, when the light-emitting layer EL is subsequently formed, it is more conducive to the light-emitting layer EL being disconnected at the bottom cut structure formed by the third cap layer M3 and the side wall of the isolation barrier 3.

[0178] like Fig.11 As shown, by setting the third protective part F3, it can not only prevent cracks, but also support the third cap layer M3. In this way, when the third cap layer M3 is formed, one end of the third cap layer M3 abuts against the third protective part F3, which is more conducive to forming an undercut structure between the third cap layer M3 and the side wall of the groove.

[0179] By setting a third cap layer M3 on the side of the isolation barrier 3 away from the substrate 1, the third cap layer M3 and the side wall of the isolation barrier 3 form an undercut structure. During the preparation of the display panel 10, the light-emitting layer EL is formed by, for example, a vapor deposition process. In this way, when the light-emitting layer EL is formed, the light-emitting layer EL can be naturally disconnected at the undercut structure formed by the third cap layer M3 and the side wall of the isolation barrier 3.

[0180] In the process of water vapor spreading from the opening H along the light-emitting layer EL to the display area AA, the light-emitting layer EL is disconnected at the bottom cut structure formed by the third cap layer M3 and the side wall of the isolation retaining wall 3, cutting off the path for the water vapor to spread. Therefore, the water vapor cannot continue to spread to the display area AA, thereby avoiding display abnormalities in the display panel 10 and improving the manufacturing yield of the display panel 10.

[0181] In summary, when the display panel 10 further includes at least one flat layer PLN located on the side of the first sub-layer 21 away from the substrate 1, at least one of the first protective part F1, the second protective part F2 and the third protective part F3 of the display panel 10 is arranged on the same layer as the flat layer PLN.

[0182] In some embodiments, Fig.12 , Fig.13 and Fig.14 As shown, a gap is provided on the surface of the isolation retaining wall 3 away from the substrate 1 , and the gap is arranged around the opening H.

[0183] By setting a gap on the surface of the isolation retaining wall 3 away from the substrate 1, a crack is generated in the inorganic film layer (for example, the first sub-layer 21) included in the display panel 10, and when the crack extends from the side of the opening H along the first sub-layer 21 to the display area AA, in the process of the crack extending to the display area AA, when the crack extends to the position of the gap, the stress in the inorganic film layer is transferred to the gap through the crack and is released, and the extension path of the crack is blocked and cut off by the gap, so that the crack does not extend to the display area AA, thereby avoiding the problem of poor display caused by the crack generated in the inorganic film layer extending to the display area AA.

[0184] For example, the surface of the isolation barrier 3 away from the substrate 1 may be provided with one or more gaps. Some embodiments of the present disclosure are described below by taking the surface of the isolation barrier 3 away from the substrate 1 as an example in which one gap is provided.

[0185] In some embodiments, Fig.12 , Fig.13 and Fig.14 As shown, the display panel 10 also includes: a filling portion 7 and a reinforcing portion 6. The filling portion 7 is located in the gap, and the filling portion 7 includes an organic material. The reinforcing portion 6 is located between the bottom of the gap and the filling portion 7, and between the side wall of the gap and the filling portion 7; the reinforcing portion 6 includes a metal material. The second sub-layer 22 of the inorganic stack 2 covers the isolation retaining wall 3 and the filling portion 7. At least one flat layer PLN of the display panel 10 is located between the first sub-layer 21 and the second sub-layer 22. The filling portion 7 is arranged on the same layer as a flat layer PLN; or, in the case where the display panel 10 includes multiple flat layers PLN, the filling portion 7 includes a plurality of sub-filling portions stacked and arranged, and each sub-filling portion is arranged on the same layer as a flat layer PLN.

[0186] By providing the filling part 7, the gap on the isolation retaining wall 3 is filled so that the gap is filled with organic material. At the same time, the filling part 7 covers the gap so that the gap is coated with organic material, thereby increasing the stress release effect of the filling part 7 made of organic material.

[0187] like Fig.12 , Fig.13 and Fig.14 As shown, the depth of the gap on the isolation retaining wall 3 is deep and the width of the gap is narrow, so the strength of the display panel 10 at the gap is low and it is easy to bend. By providing a reinforcing part 6 made of a metal material, the strength at the gap can be increased, ensuring that the strength at each position on the display panel 10 can be basically consistent, and avoiding the problem of unevenness caused by local bending of the display panel 10.

[0188] By providing a filling portion 6 made of organic material, when the cracks generated in the inorganic film layer extend into the gap, the filling portion 6 filled in the gap acts as a stress release structure, and the stress in the inorganic film layer is transferred to the gap and the filling portion 6 in the gap through the crack and released. The extension path of the crack is blocked and cut off by the gap and the filling portion 6, so that the crack will not extend to the display area AA, thereby playing a role in crack prevention and avoiding the problem of poor display caused by the cracks generated in the inorganic film layer extending to the display area AA.

[0189] For example, when the display panel 10 includes one or more flat layers PLN, the filling portion 6 may be located within one flat layer PLN. Fig.12 , Fig.13 and Fig.14 As shown, in the case where the display panel 10 includes multiple (two or more) flat layers PLN, the filling portion 6 may also include a plurality of stacked sub-protection portions (eg Fig.12 , Fig.13 and Fig.14 The first sub-guarding portion 71 and the second sub-guarding portion 72 are shown in the figure, each sub-guarding portion is located in a flat layer PLN, and two adjacent sub-guarding portions are in contact with each other.

[0190] In this way, there is no need to set up a film layer structure for preparing the flat layer PLN, which will not increase the preparation cost of the display panel 10. The filling portion 6 can be formed simultaneously with the formation of the flat layer PLN, without adding additional preparation steps of the display panel 10.

[0191] Of course, the filling portion 6 may also be located in other organic material film layers of the display panel 10 . For example, the third protection portion F3 may also be located in the pixel defining layer 54 or the spacer layer 55 .

[0192] In some embodiments, Fig.12 , Fig.13 and Fig.14 As shown, the isolation retaining wall 3 includes a first sub-retaining wall 31 located on the side of the gap away from the opening H, and a second sub-retaining wall 32 located on the side of the gap close to the opening H. The display panel 10 also includes: a fourth cap layer M4 located on the side of the first sub-retaining wall 31 away from the substrate 1, and / or, a fifth cap layer M5 located on the side of the second sub-retaining wall 32 away from the substrate 1. One end of the fourth cap layer M4 extends to the side of the first sub-retaining wall 31 away from the opening H, forming an undercut structure with the side wall of the first sub-retaining wall 31. One end of the fifth cap layer M5 extends to the side of the second sub-retaining wall 32 close to the opening H, forming an undercut structure with the side wall of the second sub-retaining wall 32.

[0193] The undercut structure formed between the fourth cap layer M4 and the side wall of the first sub-retaining wall 31 is formed by the end of the fourth cap layer M4 on the side away from the hole H extending a certain distance toward the direction of the first sub-retaining wall 31 away from the hole H. Fig.12 , Fig.13 and Fig.14 A “house eaves” structure is formed between the fourth cap layer M4 and the side wall of the first sub-retaining wall 31 away from the hole H, and the end of the fourth cap layer M4 away from the hole H is farther away from the hole H than the first sub-retaining wall 31.

[0194] The undercut structure formed between the fifth cap layer M5 and the side wall of the second sub-retaining wall 32 is formed by the end of the fifth cap layer M5 on the side close to the opening H extending a certain distance toward the direction of the second sub-retaining wall 32 close to the opening H. Fig.12 , Fig.13 and Fig.14 A “house eaves” structure is formed between the fifth cap layer M5 and the side wall of the second sub-retaining wall 32 close to the opening H, and the end of the fifth cap layer M5 away from the opening H is closer to the opening H than the second sub-retaining wall 32.

[0195] Exemplarily, when the display panel 10 includes both the fourth cap layer M4 and the fifth cap layer M5 , there is a gap between the fourth cap layer M4 and the fifth cap layer M5 , and the filling part 7 passes through the gap and fills the gap.

[0196] By setting the fourth cap layer M4 on the side of the first sub-blocking wall 31 away from the substrate 1, the fourth cap layer M4 and the side wall of the first sub-blocking wall 31 form an undercut structure. During the preparation of the display panel 10, the light-emitting layer EL is formed by, for example, an evaporation process. In this way, when the light-emitting layer EL is formed, the light-emitting layer EL can be naturally disconnected at the undercut structure formed by the fourth cap layer M4 and the side wall of the first sub-blocking wall 31.

[0197] Correspondingly, by setting the fifth cap layer M5 on the side of the second sub-blocking wall 32 away from the substrate 1, the fifth cap layer M5 and the side wall of the second sub-blocking wall 32 form an undercut structure. During the preparation of the display panel 10, the light-emitting layer EL is formed by, for example, an evaporation process. In this way, when the light-emitting layer EL is formed, the light-emitting layer EL can be naturally disconnected at the undercut structure formed by the fifth cap layer M5 and the side wall of the second sub-blocking wall 32.

[0198] In this way, in the process of water vapor spreading from the opening H along the light-emitting layer EL to the display area AA, since the light-emitting layer EL is disconnected at the bottom cut structure formed by the fourth cap layer M4 and the side wall of the first sub-blocking wall 31, and / or the light-emitting layer EL is disconnected at the bottom cut structure formed by the fifth cap layer M5 and the side wall of the second sub-blocking wall 32, the path for the water vapor to spread is cut off. Therefore, the water vapor cannot continue to spread to the display area AA, thereby avoiding display abnormalities in the display panel 10 and improving the manufacturing yield of the display panel 10.

[0199] It can be understood that, the more locations where the light emitting layer EL is disconnected, the better the effect of preventing water vapor from spreading from the boundary of the light emitting layer EL along the light emitting layer EL to the display area AA.

[0200] In some embodiments, Fig.12 , Fig.13 and Fig.14 As shown, the display panel 10 further includes a fourth protection portion F4 and / or a fifth protection portion F5. The fourth protection portion F4 covers the side wall of the first sub-blocking wall 31 away from the hole H, and the fifth protection portion F5 covers the side wall of the second sub-blocking wall 32 close to the hole H.

[0201] For example, see Fig.11 , Fig.12 , Fig.13 and Fig.14 The fourth protection portion F4 may be the aforementioned third protection portion F3, and the fifth protection portion F5 may be the aforementioned first protection portion F1.

[0202] Exemplarily, when the display panel 10 includes one or more flat layers PLN, the fourth guard portion F4 and / or the fifth guard portion F5 may be located in one flat layer PLN. When the display panel 10 includes multiple (two or more) flat layers PLN, the fourth guard portion F4 and / or the fifth guard portion F5 may also include a plurality of stacked sub-guard portions, each of which is located in one flat layer PLN, and two adjacent sub-guard portions are in contact.

[0203] In this way, there is no need to set up a film layer structure for preparing the fourth protective part F4 and / or the fifth protective part F5, which will not increase the manufacturing cost of the display panel 10. The fourth protective part F4 and / or the fifth protective part F5 can be formed simultaneously with the formation of the flat layer PLN, without adding additional manufacturing steps of the display panel 10.

[0204] Of course, the fourth protection portion F4 and / or the fifth protection portion F5 may also be located in other organic material film layers of the display panel 10. For example, the third protection portion F3 may also be located in the pixel defining layer 54 or the spacer layer 55.

[0205] By providing the fourth protective part F4 and / or the fifth protective part F5, when a crack appears in the first sub-layer 21 and the crack extends toward the display area AA along the boundary of the first sub-layer 21 close to the opening H, when the crack extends to the fourth protective part F4 and / or the fifth protective part F5, the fourth protective part F4 and / or the fifth protective part F5 formed by the organic material can play the role of a stress release structure, and the stress in the first sub-layer 21 is transferred to the fourth protective part F4 and / or the fifth protective part F5 through the crack and released, and the extension path of the crack is blocked and cut off by the fourth protective part F4 and / or the fifth protective part F5, so that the crack does not extend to the display area AA, thereby playing a role in crack prevention, and avoiding the problem of poor display caused by the crack generated in the first sub-layer 21 extending to the display area AA.

[0206] like Fig.12 , Fig.13 and Fig.14 As shown, by providing the fourth protection part F4 and / or the fifth protection part F5, while playing a role in preventing cracks, the fourth protection part F4 can also support the fourth cap layer M4, and the fifth protection part F5 can also support the fifth cap layer M5.

[0207] In this way, when forming the fourth cap layer M4, one end of the fourth cap layer M4 abuts against the fourth protection part F4, which is more conducive to forming an undercut structure between the fourth cap layer M4 and the side wall of the first sub-retaining wall 31. When forming the fifth cap layer M5, one end of the fifth cap layer M5 abuts against the fifth protection part F5, which is more conducive to forming an undercut structure between the fifth cap layer M5 and the side wall of the second sub-retaining wall 32.

[0208] In summary, the display panel 10 further includes at least one source-drain conductive layer SD. At least one of the first cap layer M1, the second cap layer M2, the third cap layer M3, the fourth cap layer M4, the fifth cap layer M5 and the reinforcing portion 6 of the display panel 10 is located in one source-drain conductive layer SD; or, in the case where the display panel 10 includes multiple source-drain conductive layers SD, at least one of the first cap layer M1, the second cap layer M2, the third cap layer M3, the fourth cap layer M4, the fifth cap layer M5 and the reinforcing portion 6 of the display panel 10 includes a plurality of stacked sub-cap layers, each sub-cap layer is located in one source-drain conductive layer SD, and two adjacent sub-cap layers are in contact.

[0209] In some embodiments, Fig.12 , Fig.13 and Fig.14 As shown, the display panel 10 further includes: a first etching stopper K1 located at the bottom of the groove formed between the second portion 212 of the first sub-stack 21 of the display panel 10 and the isolation barrier 3, and / or a second etching stopper K2 located at the bottom of the gap opened by the isolation barrier 3. The material of the first etching stopper K1 is different from the material of the inorganic stack 2. The material of the second etching stopper K2 is different from the material of the inorganic stack 2.

[0210] See also Figure 5 , Fig.12 , Fig.13 and Fig.14 During the preparation of the display panel 10, the thickness of the initial first sub-layer 21' at various positions on the display panel 10 is substantially the same. The initial first inorganic stack 21' is etched to obtain a groove formed between the second portion 212 of the first sub-layer 21 and the isolation retaining wall 3. By setting the first etching barrier layer K1, the problem of over-etching when etching to form the groove, resulting in excessive etching depth at the groove position, can be effectively avoided.

[0211] Accordingly, by providing the second etching stop layer K2, the problem of over-etching resulting in excessive etching depth at risk positions when etching to form the gaps on the isolation retaining wall 3 can be effectively avoided.

[0212] For example, see Figure 3 , Fig.12 , Fig.13 and Fig.14 The first etching stopper K1 may be located at a gate conductive layer (eg Figure 3 The second etching stopper K2 may be located in a gate conductive layer (eg, the first gate conductive layer 41 and the second gate conductive layer 42 shown in FIG. 1 ), or in the semiconductor layer B. The second etching stopper K2 may be located in a gate conductive layer (eg, Figure 3The first gate conductive layer 41 and the second gate conductive layer 42 shown in FIG. 1 may also be located in the semiconductor layer B. The first etch stop layer and the second etch stop layer may be arranged in the same layer, or one of them may be closer to the substrate 1 than the other.

[0213] In this way, there is no need to set up a film layer structure for preparing the etch stopper (the first etch stopper K1 and / or the second etch stopper K2), and the manufacturing cost of the display panel 10 will not be increased. The etch stopper can be formed simultaneously with the formation of the film layer structure of the display panel 10, and no additional manufacturing steps of the display panel 10 will be added.

[0214] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: The display panel is provided with an opening, and has a display area and a transition area, the display area surrounds the transition area, and the transition area surrounds the opening; the display panel comprises: substrate; An isolation retaining wall is located in the transition zone; the isolation retaining wall surrounds the opening and is spaced apart from the boundary of the opening; An inorganic stack, comprising a plurality of inorganic layers stacked on the substrate; the inorganic stack at least covers the display area; The inorganic stack is also located in the spacing area between the isolation retaining wall and the boundary of the opening, and the thickness of the inorganic stack located in the display area is greater than the thickness of the inorganic stack located in the spacing area; or, the inorganic stack has no overlap with the spacing area.

2. The display panel according to claim 1, characterized in that: The inorganic stack comprises: A first sub-stack includes at least one gate insulating layer and at least one interlayer dielectric layer stacked in layers; the first sub-stack at least covers the display area; The first sub-layer is also located in the spacing area, and the thickness of the first sub-layer located in the display area is greater than the thickness of the first sub-layer located in the spacing area; or, the first sub-layer has no overlap with the spacing area.

3. The display panel according to claim 1, characterized in that: The inorganic stack comprises: A second sub-stack includes a first inorganic encapsulation structure and a second inorganic encapsulation structure stacked in layers; the second sub-stack at least covers the display area; The second sub-layer is also located in the spacing area, and the thickness of the second sub-layer located in the display area is greater than the thickness of the second sub-layer located in the spacing area; or, the second sub-layer has no overlap with the spacing area.

4. The display panel according to claim 2, characterized in that: The first sub-stack includes a first portion located in the spacing area, and the isolation retaining wall forms a step difference with the first portion; The display panel further includes: a first protection portion covering the side wall of the isolation barrier forming the step difference; the first protection portion includes an organic material.

5. The display panel according to claim 4, characterized in that: One end of the first protection portion is overlapped on a side of the isolation barrier away from the substrate.

6. The display panel according to claim 4, characterized in that: The display panel further includes: The first cap layer is arranged on a side of the isolation retaining wall away from the substrate; one end of the first cap layer extends to a side of the isolation retaining wall close to the opening, forms an undercut structure with the side wall of the isolation retaining wall, and abuts against the first protective portion.

7. The display panel according to claim 2, characterized in that: The first sub-stack includes a second portion located at a side of the isolation retaining wall away from the opening, a groove is formed between the second portion and the isolation retaining wall, and the groove surrounds the opening; The display panel further includes: A second protective portion is provided on a side wall of the groove away from the opening; the second protective portion comprises an organic material; The second cap layer is arranged on a side of the second portion away from the substrate; one end of the second cap layer extends above the groove, forms an undercut structure with the side wall of the groove, and abuts against the second protective portion.

8. The display panel according to claim 2, characterized in that: The display panel further includes: A third protective portion, covering a side wall of the isolation retaining wall away from the opening; the third protective portion comprises an organic material; The third cap layer is located on the side of the isolation retaining wall away from the substrate; one end of the third cap layer extends to the side of the isolation retaining wall away from the opening, forms an undercut structure with the side wall of the isolation retaining wall, and abuts against the third protective part.

9. The display panel according to any one of claims 4 to 8, characterized in that: The display panel further comprises at least one flat layer located on a side of the first sub-layer away from the substrate; At least one of the first protective portion, the second protective portion and the third protective portion of the display panel is disposed on the same layer as the flat layer.

10. The display panel according to claim 1, characterized in that: The isolation retaining wall is provided with a gap on a surface away from the substrate, and the gap is arranged around the opening; The display panel further includes: A filling part, located in the gap; the filling part comprises an organic material; The reinforcing part is located between the bottom of the gap and the filling part, and between the side wall of the gap and the filling part; the reinforcing part includes a metal material.

11. The display panel according to claim 10, characterized in that: The isolation retaining wall comprises a first sub-retaining wall located on a side of the gap away from the opening, and a second sub-retaining wall located on a side of the gap close to the opening; The display panel further includes: a fourth cap layer, located on a side of the first sub-blocking wall away from the substrate; one end of the fourth cap layer extends to a side of the first sub-blocking wall away from the opening, and forms an undercut structure with a sidewall of the first sub-blocking wall; and / or, A fifth cap layer is located on a side of the second sub-blocking wall away from the substrate; one end of the fifth cap layer extends to a side of the second sub-blocking wall close to the opening to form an undercut structure with a side wall of the second sub-blocking wall.

12. The display panel according to claim 10, characterized in that: The first sub-layer of the inorganic stack forms the isolation retaining wall, and the second sub-layer of the inorganic stack covers the isolation retaining wall and the filling part; At least one planar layer of the display panel is located between the first sub-stack and the second sub-stack; The filling part is arranged on the same layer as the flat layer; or, In the case that the display panel includes a plurality of the planar layers, the filling portion includes a plurality of sub-filling portions that are stacked, and each of the sub-filling portions is disposed in the same layer as a layer of the planar layer.

13. The display panel according to any one of claims 6 to 8 and 10 to 12, characterized in that: The display panel further comprises at least one source-drain conductive layer; At least one of the first cap layer, the second cap layer, the third cap layer, the fourth cap layer, the fifth cap layer and the enhancement part of the display panel is located in a layer of the source-drain conductive layer; or, In the case where the display panel includes multiple layers of the source-drain conductive layer, at least one of the first cap layer, the second cap layer, the third cap layer, the fourth cap layer, the fifth cap layer and the reinforcement part of the display panel includes a plurality of sub-cap layers stacked together, each of the sub-cap layers is located within a layer of the source-drain conductive layer, and two adjacent sub-cap layers are in contact.

14. The display panel according to any one of claims 7, 10 to 12, characterized in that: The display panel further includes: a first etching stopper located at the bottom of a groove formed between the second portion of the first sub-stack of the display panel and the isolation barrier wall; the material of the first etching stopper is different from the material of the inorganic stack; and / or, The second etching stopper is located at the bottom of the gap formed by the isolation barrier wall; the material of the second etching stopper is different from that of the inorganic stack.

15. A display device, characterized in that: include: The display panel according to any one of claims 1 to 14; and, Circuit board; the display panel is connected to the circuit board.

Images