Buffer device and coating equipment
By introducing a uniform gas structure into the buffer device of the coating equipment, the buffer gas flows through the uniform gas channel, the problem of gas impact on the substrate during vacuum extraction or vacuum breaking is solved, and the stability of the substrate and the coating efficiency are improved.
Patent Information
- Application Number
- CN202420461635.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-11
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-11
AI Technical Summary
In existing coating equipment, the substrate is susceptible to gas impact during the vacuum extraction or vacuum breaking process of the buffer chamber, causing the substrate to shake and damage.
A buffer device is designed, including a buffer member, a uniform structure, a valve assembly and a pumping and vent assembly. The uniform gas structure conducts the ventilation space and the buffer space through multiple uniform gas channels, and the buffer gas flows through the uniform gas structure for buffering to prevent the airflow from directly impacting the substrate.
It effectively avoids the impact of gas on the substrate, ensures the stability of the substrate, reduces the risk of substrate damage, and improves the efficiency of the coating process.
Smart Images
Figure CN222631549U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of thin film preparation, and in particular to a buffer device and a coating device. Background Art
[0002] In current coating equipment, substrates are usually coated in a vacuum environment of a process chamber. In order to buffer the substrate before it enters the process chamber or after it comes out of the process chamber, the substrate will enter the buffer chamber. Taking entering the process chamber as an example, the substrate line enters the buffer chamber, and when entering the buffer chamber, the buffer chamber is connected to the outside, that is, the atmospheric pressure in the buffer chamber is the same as that outside. After entering the buffer chamber, the buffer chamber is isolated from the outside, and then the buffer chamber is evacuated so that the buffer chamber and the process chamber maintain the same or similar vacuum degree, and then the substrate is sent into the process chamber. During the existing buffer chamber evacuation or vacuum breaking process, the gas will impact the substrate, causing the substrate to shake easily and cause damage. Utility Model Content
[0003] Based on this, it is necessary to provide a buffer device and coating equipment that can prevent the gas from impacting the substrate and causing the substrate to shake, thereby avoiding damage to the substrate, in order to address the above problems.
[0004] A buffer device, comprising:
[0005] A buffer part, comprising a buffer cavity, a feeding port and a vent;
[0006] a gas-uniform structure, disposed in the buffer cavity, and dividing the buffer cavity into a ventilation space and the buffer space, the ventilation space and the buffer space are connected through the gas-uniform structure, the gas-uniform structure can perform buffering treatment on the gas flowing therethrough, the feed port is connected to the buffer space, and the gas port is connected to the ventilation space;
[0007] A valve assembly, disposed on the buffer member, for opening or closing the feed port;
[0008] The exhaust gas component is communicated with the vent, and the exhaust gas component can evacuate and break the vacuum of the buffer chamber.
[0009] Furthermore, the air uniformity structure has a plurality of air uniformity channels, and each of the air uniformity channels is connected to the ventilation space and the buffer space.
[0010] Furthermore, the gas homogenizing structure is a porous structure.
[0011] Furthermore, the feed port includes a feed port and a discharge port, the valve assembly includes a feed valve and a discharge valve, the feed valve is arranged at the feed port, and the discharge valve is arranged at the discharge port.
[0012] Furthermore, the buffer device also includes a conveying component, which is disposed in the buffer space and can output the substrate input from the feed port from the discharge port.
[0013] Furthermore, the feed port and the discharge port are located at two opposite ends of the buffer component.
[0014] Furthermore, the vent includes an air suction port and an air discharge port, and the air suction and discharge assembly includes an air suction module and an air discharge module. The air suction module is connected to the air suction port and is used to vacuum the buffer chamber, and the air discharge module is connected to the air discharge port and is used to break the vacuum of the buffer chamber.
[0015] Furthermore, the air extraction module includes an air extraction pipeline, an air extraction valve and an air extraction mechanism, the air extraction pipeline is connected between the buffer component and the air extraction valve, the air extraction pipeline is communicated with the air extraction port, and the air extraction valve is connected to the air extraction mechanism.
[0016] Furthermore, the deflation module includes a deflation pipe and a deflation valve, the deflation pipe is connected between the buffer and the deflation valve, and the deflation pipe is communicated with the deflation port.
[0017] Furthermore, the vents include two groups, and the two groups of vents are respectively located on two opposite sides of the buffer, and the air uniforming structures include two, and each of the air uniforming structures is arranged corresponding to a group of vents.
[0018] A coating device comprises the above-mentioned buffer device.
[0019] With the above buffer device, since a uniform gas structure is provided between the ventilation space and the buffer space, the uniform gas structure can buffer the gas flowing through, thereby buffering the airflow during vacuuming and breaking the vacuum, preventing the airflow from directly impacting the substrate in the buffer space, ensuring the stability of the substrate, avoiding the substrate from shaking and being damaged, and thus ensuring the subsequent coating effect. At the same time, since the stability of the substrate is guaranteed, the conveying speed of the substrate can be increased, and the processing efficiency can be improved.
[0020] In addition, a group of vents are arranged on opposite sides of the buffer component, and two uniform air structures are arranged in the buffer cavity, so that the buffer cavity can be evacuated or broken at both sides of the buffer component at the same time, thereby increasing the gas extraction and exhaust speed, that is, increasing the speed of vacuum extraction and breaking the vacuum, and while increasing the gas extraction and exhaust speed, it can ensure smooth airflow, thereby realizing fast and smooth transmission of the substrate, reducing substrate damage, and improving the transmission rhythm. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 A schematic diagram of the structure of a buffer device provided in one embodiment of the present application;
[0023] Figure 2 for Figure 1 A schematic cross-sectional view of the buffer device shown;
[0024] Figure 3 for Figure 1 A schematic cross-sectional structural diagram of the buffer device shown in another angle;
[0025] Figure 4 This is a schematic diagram of the structure of the coating equipment provided in this application.
[0026] Explanation of reference numerals: 10, buffer device; 20, substrate; 30, process chamber; 110, buffer member; 111, buffer cavity; 111a, ventilation space; 111b, buffer space; 112, feed port; 112a, feed port; 112b, discharge port; 113, vent; 113a, exhaust port; 113b, vent; 120, gas uniforming structure; 130, valve assembly; 131, feed valve; 132, discharge valve; 140, exhaust and gas extraction assembly; 141, exhaust module; 142, vent module; 143, exhaust pipe; 144, exhaust valve; 145, vent pipe; 146, vent valve; 150, conveying assembly. DETAILED DESCRIPTION
[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0030] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0031] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0033] On the one hand, if Figures 1 to 3 As shown, an embodiment of the present application provides a buffer device 10 , including a buffer member 110 , an air uniforming structure 120 , a valve assembly 130 and an air extraction assembly 140 .
[0034] The buffer member 110 has a buffer cavity 111 and a feed port 112 and a vent 113 connected to the buffer cavity 111. The substrate 20 can be input into the buffer cavity 111 or output from the buffer cavity 111 through the feed port 112. The valve assembly 130 is arranged on the buffer member 110, and is used to open or close the feed port 112, so as to control the input and output of the substrate 20, and can be used to close the buffer cavity 111; the exhaust assembly 140 is connected to the vent 113 to evacuate or break the vacuum of the buffer cavity 111 through the vent 113.
[0035] It is understandable that the feed port 112 can also be connected to the process chamber 30 (see Figure 4 ) are connected so that the substrate 20 flows between the buffer chamber 111 and the process chamber 30 through the feeding port 112.
[0036] The gas-uniform structure 120 is disposed in the buffer cavity 111, and divides the buffer cavity 111 into a ventilation space 111a and a buffer space 111b. The ventilation space 111a and the buffer space 111b are connected through the gas-uniform structure 120, the vent 113 is connected to the ventilation space 111a, and the feed port 112 is connected to the buffer space 111b, so that the substrate 20 is fed into the buffer space 111b or output from the buffer space 111b. The gas-uniform structure 120 can buffer the gas flowing through, so as to prevent the gas flow from directly impacting the substrate 20 when the gas extraction and exhaust assembly 140 evacuates or breaks the vacuum of the buffer cavity 111 through the vent 113, thereby preventing the substrate 20 from being damaged due to shaking.
[0037] During the process of inputting the substrate 20 into the process chamber 30: the substrate 20 first enters the buffer space 111b from the feed port 112. At this time, the atmospheric pressure in the buffer cavity 111 is the same as the atmospheric pressure outside the buffer component 110. Then the valve assembly 130 closes the feed port 112, and evacuates the buffer cavity 111 through the exhaust gas assembly 140 until the vacuum degree in the buffer cavity 111 is the same or similar to the vacuum degree in the process chamber 30. Then the valve assembly 130 opens the feed port 112 connected to the process chamber 30, and the substrate 20 in the buffer space 111b enters the process chamber 30 through the feed port 112 for processing.
[0038] During the process of outputting the substrate 20 from the process chamber 30: the substrate 20 in the process chamber 30 enters the buffer space 111b through the feed port 112. At this time, the vacuum degree of the buffer chamber 111 is the same as or close to that of the process chamber 30. Then the valve assembly 130 closes the feed port 112, and the vacuum of the buffer chamber 111 is broken through the exhaust assembly 140. Next, the valve assembly 130 opens the feed port 112, and the substrate 20 is output through the feed port 112.
[0039] Since a uniform gas structure 120 is provided between the ventilation space 111a and the buffer space 111b, the uniform gas structure 120 can buffer the gas flowing through, thereby buffering the airflow during vacuuming and breaking the vacuum, preventing the airflow from directly impacting the substrate 20 in the buffer space 111b, ensuring the stability of the substrate 20, preventing the substrate 20 from shaking and being damaged, and thus ensuring the subsequent coating effect. At the same time, since the stability of the substrate 20 is guaranteed, the conveying speed of the substrate 20 can be increased, and the processing efficiency can be improved. In addition, the buffer device 10 has a simple structure, is relatively convenient to design and manufacture, and has a low preparation cost.
[0040] In one embodiment, the feed port 112 includes a feed port 112 a and a discharge port 112 b . The feed port 112 a is used to feed the substrate 20 into the buffer space 111 b , and the discharge port 112 b is connected to the process chamber 30 to feed the substrate 20 into the process chamber 30 .
[0041] Furthermore, the buffer device 10 further includes a conveying assembly 150, which is disposed in the buffer space 111b, and the conveying assembly 150 can output the substrate 20 input from the feed port 112a from the discharge port 112b, thereby completing the conveying of the substrate 20 in the buffer space 111b. It is understood that during the process of evacuating the buffer chamber 111, the substrate 20 is located on the conveying assembly 150.
[0042] It should be noted that, in this embodiment, the conveying assembly 150 includes a plurality of mutually parallel conveying rollers, and the substrate 20 is conveyed during the rotation of the conveying rollers.
[0043] Specific to Figure 2 In the illustrated embodiment, the feed port 112 a and the discharge port 112 b are respectively located at opposite ends of the buffer 110 , thereby eliminating the need to adjust the conveying direction of the substrate 20 in the buffer space 111 b , thereby facilitating the conveying of the substrate 20 .
[0044] In other embodiments, the number of the feed port 112 may also be one, and the substrate 20 is input into the buffer space 111b or output from the buffer space 111b through the feed port 112. When the substrate 20 is input into the buffer space 111b, the feed port 112 faces the incoming direction to receive the substrate 20; and when the substrate 20 is output to the process chamber 30, the position of the buffer 110 is adjusted so that the feed port 112 faces the process chamber 30 and communicates with the process chamber 30. Of course, the present application preferably adopts the setting of the feed port 112a and the discharge port 112b, and the feed port 112a and the discharge port 112b are used as examples for explanation below.
[0045] In one embodiment, the valve assembly 130 includes a feed valve 131 and a discharge valve 132. The feed valve 131 is disposed at the feed port 112a for opening or closing the feed port 112a. The discharge valve 132 is disposed at the discharge port 112b for opening or closing the discharge port 112b.
[0046] In one embodiment, the vent 113 includes an air suction port 113a and an air release port 113b, and the air suction and exhaust component 140 can evacuate the buffer chamber 111 through the air suction port 113a, and break the vacuum of the buffer chamber 111 through the air release port 113b. In other embodiments, the air suction and exhaust component 140 can also perform air suction and air release through the same vent 113 to achieve vacuuming and breaking the vacuum of the buffer chamber 111. Of course, the present application preferably uses the air suction port 113a and the air release port 113b, and the following description takes the air suction port 113a and the air release port 113b as an example.
[0047] In one embodiment, the air extraction and exhaust assembly 140 includes an air extraction module 141 and an air exhaust module 142. The air extraction module 141 is connected to the air extraction port 113a for extracting vacuum from the buffer chamber 111, and the air exhaust module 142 is connected to the air exhaust port 113b for breaking the vacuum from the buffer chamber 111.
[0048] Furthermore, the air extraction module 141 includes an air extraction pipeline 143, an air extraction valve 144 and an air extraction mechanism. The air extraction pipeline 143 is connected between the buffer 110 and the air extraction valve 144, and the air extraction pipeline 143 is communicated with the air extraction port 113a, and the air extraction mechanism is connected to the air extraction valve 144. In this way, when vacuuming is required, the air extraction valve 144 and the air extraction mechanism can be opened.
[0049] Meanwhile, the deflation module 142 includes a deflation pipe 145 and a deflation valve 146. The deflation pipe 145 is connected between the buffer 110 and the deflation valve 146, and the deflation pipe 145 is communicated with the deflation port 113b, and the deflation valve 146 can be communicated with the outside, so that when the deflation valve 146 is opened, the buffer chamber 111 can be communicated with the outside through the deflation module 142, so that the vacuum of the buffer chamber 111 is broken.
[0050] It should be explained that when the air extraction and exhaust assembly 140 performs vacuum extraction and vacuum breaking through the same vent 113, the air extraction valve 144 can be set as a multi-way reversing valve, which is respectively connected to the air extraction pipeline 143, the air extraction mechanism and the outside.
[0051] In one embodiment, the gas uniformity structure 120 has a plurality of gas uniformity channels, each of which is connected to the ventilation space 111a and the buffer space 111b. Thus, when vacuuming or breaking the vacuum, the gas flows between the ventilation space 111a and the buffer space 111b through the gas uniformity channels, and the plurality of gas uniformity channels uniformly treat the gas, making the gas flow smoother and preventing the gas flow from impacting the substrate 20.
[0052] It should be explained that the total flow area of the multiple air-uniform channels is not less than the flow area of the vent 113, so that the gas flow rate can be guaranteed when the air flow passes through the air-uniform structure 120, the speed of vacuuming and breaking the vacuum can be ensured, and the air flow can be made smoother.
[0053] Specifically, the gas homogenizing structure 120 is a porous structure, and the pores in the porous structure form the above-mentioned multiple gas homogenizing channels. Preferably, the gas homogenizing structure 120 is a microporous structure, such as a sponge.
[0054] In one embodiment, the vents 113 include two groups, and the two groups of vents 113 are respectively located on opposite sides of the buffer 110. Correspondingly, the gas-uniform structure 120 includes two, and each gas-uniform structure 120 is arranged corresponding to a group of vents 113. The two gas-uniform structures 120 divide the buffer cavity 111 into two ventilation spaces 111a and a buffer space 111b, and the buffer space 111b is located between the two gas-uniform structures 120. In this way, during the vacuuming or vacuum-breaking process, the gas between the two gas-uniform structures 120 will pass through the two gas-uniform structures 120 respectively, which can not only increase the speed of vacuuming or vacuum-breaking, further improve the processing efficiency, but also ensure that the gas is evenly treated by the gas-uniform structure 120 when flowing through the gas-uniform structure 120, so that the gas flow is smoother and the gas flow is prevented from impacting the substrate 20.
[0055] It should be explained that, in this embodiment, each set of vents 113 includes an air suction port 113a and an air discharge port 113b. Of course, in other embodiments, each set of vents 113 can be used for the air suction and discharge assembly 140 to evacuate and break the vacuum.
[0056] By arranging a group of vents 113 on opposite sides of the buffer member 110 and two uniform air structures 120 in the buffer cavity 111, it is possible to evacuate or break the vacuum of the buffer cavity 111 on both sides of the buffer member 110 at the same time, thereby increasing the gas extraction and degassing speed, that is, increasing the speed of evacuating and breaking the vacuum, and ensuring smooth airflow while increasing the gas extraction and degassing speed, thereby achieving fast and smooth transmission of the substrate 20, reducing damage to the substrate 20, and improving the transmission rhythm.
[0057] On the other hand, see Figure 4 The present application also provides a coating device, which includes a process chamber 30 and the buffer device 10 in the above embodiment.
[0058] In order to facilitate understanding of the technical solution of this application, Figure 2 The working process of the buffer device 10 and the coating equipment in the above embodiment is described as follows:
[0059] During the process of inputting the substrate 20 into the process chamber 30 : it is assumed that all valves are in a closed state initially, and the vacuum degree in the buffer chamber 111 meets the equipment requirement.
[0060] The vent valve 146 is opened to break the vacuum of the buffer chamber 111, and then the vent valve 146 is closed and the feed valve 131 is opened, and the substrate 20 enters the buffer space 111b through the feed port 112a. Next, the feed valve 131 is closed, the exhaust valve 144 is opened, and the buffer chamber 111 is evacuated by the exhaust mechanism until its vacuum degree meets the equipment requirements. Then, the exhaust valve 144 is closed, the discharge valve 132 is opened, and the substrate 20 enters the process chamber 30 through the discharge port 112b.
[0061] During the process of taking the substrate 20 out of the process chamber 30 (at this time the feed port 112a is connected to the process chamber 30): it is assumed that initially, except for the air release valve 146, all other valves are in a closed state.
[0062] Close the vent valve 146, open the exhaust valve 144, and evacuate the buffer chamber 111 through the exhaust mechanism until the vacuum degree of the buffer chamber 111 meets the equipment requirements, then close the exhaust valve 144, open the feed valve 131, and the substrate 20 in the process chamber 30 enters the buffer space 111b through the feed port 112a. Next, close the feed valve 131, open the vent valve 146, and break the vacuum in the buffer chamber 111. After breaking the vacuum, open the discharge valve 132, and the substrate 20 can be discharged from the discharge port 112b.
[0063] In summary, it can be understood that the coating device can include two buffer devices 10, and the two buffer devices 10 are respectively arranged on both sides of the process chamber 30. In this way, the buffer device 10 can ensure that the substrate 20 is smoothly transported, thereby improving the transmission speed of the substrate 20 while ensuring stability, that is, improving the transmission beat, and improving the overall processing efficiency.
[0064] In addition, the two buffer devices 10 have the same structure and the structure of the buffer device 10 is simple, so it is convenient to design and manufacture, and the manufacturing cost is low.
[0065] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0066] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A buffer device, characterized in that: include: A buffer part, comprising a buffer cavity, a feeding port and a vent; a gas-uniform structure, disposed in the buffer cavity, and dividing the buffer cavity into a ventilation space and a buffer space, the ventilation space and the buffer space are connected through the gas-uniform structure, and the gas-uniform structure can perform buffering treatment on the gas flowing therethrough, the feed port is connected to the buffer space, and the gas-vent is connected to the ventilation space; A valve assembly, disposed on the buffer member, for opening or closing the feed port; The exhaust gas component is communicated with the vent, and the exhaust gas component can evacuate and break the vacuum of the buffer chamber.
2. The buffer device according to claim 1, characterized in that: The air uniformity structure has a plurality of air uniformity channels, and each of the air uniformity channels is connected to the ventilation space and the buffer space.
3. The buffer device according to claim 2, characterized in that: The gas homogenizing structure is a porous structure.
4. The buffer device according to claim 1, characterized in that: The feeding port includes a feed port and a discharge port, the valve assembly includes a feed valve and a discharge valve, the feed valve is arranged at the feed port, and the discharge valve is arranged at the discharge port.
5. The buffer device according to claim 4, characterized in that: The buffer device further comprises a conveying assembly, which is arranged in the buffer space and can output the substrate input from the feed port through the discharge port.
6. The buffer device according to claim 4, characterized in that: The feed port and the discharge port are located at two opposite ends of the buffer.
7. The buffer device according to any one of claims 1 to 6, characterized in that: The vent includes an air suction port and an air release port, and the air suction and exhaust assembly includes an air suction module and an air release module. The air suction module is connected to the air suction port and is used to vacuum the buffer chamber. The air release module is connected to the air release port and is used to break the vacuum of the buffer chamber.
8. The buffer device according to claim 7, characterized in that: The air extraction module includes an air extraction pipeline, an air extraction valve and an air extraction mechanism. The air extraction pipeline is connected between the buffer and the air extraction valve, and the air extraction pipeline is communicated with the air extraction port. The air extraction valve is connected to the air extraction mechanism.
9. The buffer device according to claim 7, characterized in that: The deflation module comprises a deflation pipeline and a deflation valve. The deflation pipeline is connected between the buffer and the deflation valve, and the deflation pipeline is communicated with the deflation port.
10. The buffer device according to any one of claims 1 to 6, characterized in that: The vents include two groups, and the two groups of vents are respectively located on two opposite sides of the buffer. The air uniformity structures include two, and each of the air uniformity structures is arranged corresponding to a group of vents.
11. A coating device, characterized in that: The invention comprises the buffer device according to any one of claims 1 to 10.