Memory module
By adding two main control chips and two DIMMs to the memory module and connecting them with DDR and CXL interfaces, the problem of insufficient memory capacity expansion of existing memory modules is solved, and higher memory capacity and computing performance are achieved.
CN222636632UActive Publication Date: 2025-03-18SHENZHEN LONGSYS ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202420700551.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-04-07
AI Technical Summary
Technical Problem
The memory capacity of existing memory modules is not very expanded, making it difficult to meet the growing demand for computer memory.
Method used
Design a memory module, including two main control chips and two DIMMs, connect the DIMMs through the DDR controller interface, and connect it to external devices through the CXL interface and PCIE interface to achieve expansion of memory capacity.
Benefits of technology
By increasing the number of DIMMs and using high bandwidth DDR and CXL interfaces, the memory capacity of the memory module is significantly improved, meeting higher computing needs.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of storage chips, and provides a memory module which comprises a first main control chip, a second main control chip, a first DIMM and a second DIMM, the first main control chip is connected with the first DIMM through a first DDR controller interface, and a CXL interface of the first main control chip is connected with external equipment through a first PCIE interface; the first main control chip is connected with a first DIMM through a first DDR controller interface, the second main control chip is connected with a second DIMM through a second DDR controller interface, a CXL interface of the second main control chip is connected with external equipment through a second PCIE interface, the CXL interface of the first main control chip is a CEM interface, and the CXL interface of the second main control chip is an MCIO interface. According to the memory module, the memory capacity of the memory module is improved.
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